JP2013110114A - Apparatus for manufacturing organic el device and angle correction mechanism - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an organic EL device which has a cluster structure and can shorten line length or has excellent space efficiency, and to provide an angle correction mechanism which corrects posture of a substrate.SOLUTION: An angle correction mechanism includes: a carry-in port into which a substrate is carried by a first comb teeth shaped hand; a carry-out port from which the substrate is carried by a second comb teeth shaped hand; a plurality of support pins which support the substrate; a support pin rotation table to which the plurality of support pins are fixed and which supports and rotates the substrate; rotation driving means which rotates the support pin rotation table in a plane parallel to the substrate; and avoiding means which avoids interference with at least one of the plurality of support pins, the first comb teeth shaped hand and the second comb teeth shaped hand.

Description

  The present invention relates to an organic EL device manufacturing apparatus and an angle correction mechanism, and more particularly to an organic EL device manufacturing apparatus suitable for manufacturing by a vapor deposition method by transporting a large substrate and an angle correction mechanism for correcting the substrate posture.

  An organic EL device has attracted attention as a display device, and there is a vacuum deposition method as an effective method for manufacturing the device. In order to manufacture organic EL devices, it is not just a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but a hole injection layer or transport layer on the anode, and an electron injection layer or transport layer on the cathode In order to form a multilayer structure in which various materials such as a thin film are formed, the organic EL device manufacturing apparatus has a configuration in which a plurality of clusters each having a plurality of processing chambers are connected. Such conventional techniques include the following.

JP 2003-027213 A

  However, in the cluster structure, since the processing units are arranged radially, and the processing units between the clusters are arranged so as not to interfere with each other, it is necessary to increase the distance between the clusters. There is a problem that the entire line becomes longer. In particular, recently, the substrate size used for the display device is also 1500 mm × 1850 mm, and the line length becomes longer. Further, the radial arrangement has a dead space between the cluster and the processing unit, and is not space efficient.

  In addition, the cluster in the present invention refers to a cluster having a plurality of substrate processing units and substrate carry-in / out units provided on at least one side in the direction of transporting a substrate.

Accordingly, a first object of the present invention is to provide an organic EL device manufacturing apparatus or an angle correction mechanism that corrects the posture of a substrate, which has a cluster structure and can shorten the line length.
A second object of the present invention is to provide an angle correction mechanism having a cluster structure and correcting the attitude of a space-efficient organic EL device manufacturing apparatus or substrate.

In order to achieve the above object, the present invention has at least the following features.
The present invention provides a carry-in port for carrying a substrate by a first comb-like hand, a carry-out port for carrying out the substrate by a second comb-like hand, a plurality of support pins for supporting the substrate, and a plurality of the above-mentioned A support pin rotating base for fixing and supporting the substrate and rotating the substrate, a rotation driving means for rotating the support pin rotating table in a plane parallel to the substrate, a plurality of the support pins, and the first A first feature is an angle correction mechanism having avoidance means for avoiding interference between the comb-like hand and at least one of the second comb-like hands.
The avoiding means may arrange the plurality of support pins in a matrix so as not to interfere with at least one of the first comb-shaped hand and the second comb-shaped hand.
Further, the avoiding means includes a vertical drive means for moving up and down the support pin turntable on which the substrate is placed, and a plurality of protrusions provided in parallel to the upper part of the support pin turntable, the protrusion The first comb-teeth hand and the second comb-teeth hand may be inserted therebetween, and a plurality of the support pins may include a substrate mounting table having a movable groove.

According to another aspect of the present invention, there is provided a vacuum processing chamber having a processing section for depositing a deposition material on a substrate, and an angle correction mechanism having the first feature, wherein the substrate is carried in or out. A second feature of the present invention is an organic EL device manufacturing apparatus comprising: a delivery chamber having a vacuum chamber including a delivery chamber having a delivery means for delivering the substrate between the delivery chamber and the plurality of processing units. .
Furthermore, the present invention provides a vacuum processing chamber having a processing unit for depositing a deposition material on a substrate, a delivery chamber for carrying in or out the substrate, and the substrate between the delivery chamber and the plurality of processing units. A plurality of clusters each having a vacuum chamber having a transporting means for transporting, and having a loading load chamber for loading the substrate and a loading load chamber for unloading the substrate separately from the delivery chamber, and the loading A third feature is that the organic EL device manufacturing apparatus is provided with an angle correction mechanism having the first feature in the transport unit constituting the transport system for transporting the substrate from the load chamber to the unloading load chamber. .

According to the present invention, it is possible to provide an angle correction mechanism that has a cluster structure and can shorten the line length or correct the posture of the substrate.
In addition, according to the present invention, it is possible to provide an angle correction mechanism that has a cluster structure and is space efficient or corrects the posture of the substrate.

It is a figure which shows the organic EL device manufacturing apparatus which is embodiment of this invention. It is a figure which shows the outline | summary of a structure of the conveyance chamber 2 and the processing chamber 1 which are embodiment of this invention. It is the schematic diagram and operation | movement explanatory drawing of a structure of the conveyance chamber and processing chamber which are embodiment of this invention. It is a figure explaining the necessity of an angle correction mechanism. It is a figure which shows the 1st Example of the angle correction mechanism in the 1st Embodiment of this invention. It is a figure which shows the 2nd Example of the angle correction mechanism in the 1st Embodiment of this invention. It is the figure which showed the processing flow of the processing chamber 1 which is the 1st Embodiment of this invention. It is a figure which shows an example of a shadow mask. It is a figure explaining embodiment of (3) of this invention.

  A first embodiment of the present invention will be described with reference to FIGS. Organic EL device manufacturing equipment is not simply a structure in which a light emitting material layer (EL layer) is formed and sandwiched between electrodes, but a hole injection layer or transport layer on the anode, and an electron injection layer or transport layer on the cathode. A multilayer structure in which various materials are formed as a thin film is formed, and a substrate is cleaned. FIG. 1 shows an example of the manufacturing apparatus.

  The organic EL device manufacturing apparatus 100 according to the present embodiment is roughly divided into a load cluster 3 that carries a substrate 6 to be processed (hereinafter simply referred to as a substrate), four clusters (A to D) that process the substrate 6, and each cluster. It is composed of five delivery chambers 4 installed between or between the cluster and the load cluster 3 or the next process (sealing process). Behind the next process is an unload chamber (not shown) such as a load chamber 31 which will be described later in order to carry out the substrate.

  The load cluster 3 includes a load chamber 31 having a gate valve 10 in order to maintain a vacuum in the front-rear direction and a transfer robot 5R that receives the substrate 6 from the load chamber 31 and turns to carry the substrate 6 into the delivery chamber 4a. Each load chamber 31 and each delivery chamber 4 have gate valves 10 in the front and rear, and deliver the substrate to the load cluster 3 or the next cluster while controlling the opening and closing of the gate valve 10 and maintaining a vacuum.

  In the organic EL device manufacturing apparatus 100, clusters having a rectangular or square shape instead of a radial shape are arranged in series with respect to the transport direction indicated by the arrow in FIG. Each cluster (A to D) includes a transfer chamber 2 having a single transfer robot 5 and two processing chambers 1 (first) arranged on the top and bottom of the drawing for receiving a substrate from the transfer robot 5 and performing a predetermined process. 1 subscripts a to d indicate clusters, 2nd subscripts u and d indicate upper and lower sides, and in the subscripts that are English letters, lowercase letters indicate places and uppercase letters indicate components) . Each processing chamber has two processing units arranged in parallel to the transport direction indicated by the arrow. For example, as will be described later, the processing chamber 1bu, which is a vacuum deposition chamber, includes processing units 1buL and 1buR. The same applies to other processing chambers. In FIG. 1, since the reference numerals become complicated, the subscripts L (left side) and R (right side) are attached only to the processing chambers 1bu and 1cd. A gate valve 10 is provided in each processing section of the transfer chamber 2 and the processing chamber 1.

  FIG. 2 shows an outline of the configuration of the transfer chamber 2 and the processing chamber 1. Although the configuration of the processing chamber 1 varies depending on the content of processing, a vacuum deposition chamber 1bu that deposits a luminescent material in vacuum to form an EL layer will be described as an example. FIG. 3 is a schematic diagram and an operation explanatory diagram of the configuration of the transfer chamber 2b and the vacuum deposition chamber 1bu at that time. The transfer robot 5 in FIG. 2 has a three-link structure arm 51 that can move up and down as a whole (see arrow 53 in FIG. 3) and can turn left and right. Two hands 52 are provided in two upper and lower stages. By making the upper and lower two stages, the upper part is for carrying in and the lower part is for carrying out, and the carrying-in / out process can be performed simultaneously by one operation. Whether to use two hands or one hand depends on the processing. In the following description, a single hand is used for the sake of simplicity.

  On the other hand, the vacuum deposition chamber 1bu is broadly divided into a deposition unit 7 for evaporating a luminescent material and depositing it on the substrate 6, an alignment unit 8 for depositing on a necessary part of the substrate 6, and a transfer robot 5 and the substrate delivery. The process delivery part 9 which moves the board | substrate 6 to the vapor deposition part 7 consists of. The alignment unit 8 and the processing delivery unit 9 are provided with 8L and 9L in the left processing unit and 8R and 9R in the right processing unit. The processing delivery unit 9 can deliver the substrate 6 without interfering with the comb-like hand 52 of the transport robot 5, and has a comb-like hand 91 having means 94 for fixing the substrate 6, and the comb-like hand 91. A substrate surface control unit 92 is provided to turn the substrate 6 upright and move to the alignment unit 8 or the vapor deposition unit 7 so as to face each other. As the means for fixing, electromagnetic adsorption or clipping means is used in consideration of being in a vacuum.

  The alignment 8 includes a shadow mask 81 composed of a mask 81M and a frame 81F shown in FIG. 8, and an alignment driving unit 83 that aligns the substrate 6 and the shadow mask 81 with alignment marks 84 on the substrate. The vapor deposition unit 7 includes a vertical drive unit 72 that moves the evaporation source 71 in the vertical direction along the rail 76, and a left-right drive base 74 that moves the evaporation source 71 between the left and right alignment units along the rail 75. The evaporation source 71 has a light emitting material as an evaporation material inside, and a stable evaporation rate can be obtained by heating control (not shown) of the evaporation material. As shown in the drawing of FIG. It is the structure which injects from the some injection nozzle 73 arranged in a line. If necessary, the additive is also heated and vapor-deposited so that stable vapor deposition is obtained.

  In the embodiment described above, the transfer robot 5 is configured with three degrees of freedom in order to simplify the mechanism in vacuum as much as possible, the entire vertical movement, the rotation of the base portion, and the comb-like hand 52 extending and contracting radially. Has been. Therefore, as shown in FIG. 4, when the substrate 6 is carried into the delivery chamber 4b in parallel as shown by the broken line and the transfer robot 5b transfers the substrate 6 to the processing delivery section 9buL as it is, the substrate 6 is transferred to the processing delivery section 9buL. It is installed diagonally with a certain angle αL. In order to cope with this, (1) the angle αL described above is corrected by the transport system so that the rectangular substrate 6 overlaps in parallel with the processing delivery section 1buL as indicated by the solid line in FIG. It is necessary to increase the degree of freedom of the transfer robot 5 or (3) correct the vapor deposition unit.

  First, the present embodiment (1) will be described. Therefore, in the description of the embodiment described above, the transfer system is configured by the load chamber 31 of the load cluster 3, the transfer robot 5R, the delivery chamber 4, the transfer robot 5 of the transfer chamber 2, and the processing delivery unit of the processing chamber 1. Nine. It is necessary to correct at least somewhere. However, it is necessary to make the inside of the vacuum chamber as simple as possible, and it is desirable to correct in the load chamber 31 or the delivery chamber 4. Since the structures of the load chamber 31 and the delivery chamber 4 are basically the same, the delivery chamber 4 is taken as an example.

FIG. 5 is a view showing an angle correction mechanism in the delivery chamber 4 as a first embodiment of the angle correction mechanism. FIG. 5A is a bird's-eye view seen from above when the comb-like hand 52 of the transfer robot 5 is inserted into the delivery chamber 4, and FIG. 5B is a view showing a side view of the delivery chamber 4.
The delivery chamber 4 includes a mounting table 4D having gate valves 10I and 10E and a plurality of support pins 4P provided at both sides of the substrate loading / unloading port, and an angle correction mechanism 4H. The angle correction mechanism 4H is a mounting table. The mounting table support portion 4S that supports 4D, the rotational drive motor 4KM that rotates the mounting table support portion 4S to the left and right, and a magnetic seal 4J that seals the mounting table support portion 4S are configured.

  In such a mechanism, as shown by the broken line in FIG. 5A, after the transfer robot 5a of the cluster A places the substrate 6 on the non-rotating mounting table 4D in a state parallel to the mounting table. Assume that the transfer robot 5b transfers the transfer robot 5b so as to overlap the processing delivery unit 1buL shown in FIG. In this case, as described above, the substrate 6 may be transported to the processing delivery unit 9buL with the substrate 6 rotated to the right by αL degrees as viewed from the transport robot 5b.

  Looking at the operation flow, first, the gate valve 10I is opened with the gate valve 10E closed, the substrate is loaded from the opening 10IK of the gate valve by the comb-like hand 52a of the transfer robot 5a, and placed on the placing table 4D. To do. After the comb-like hand 52a has left, the valve body 10IB is closed and the mounting table 4D is rotated αL degrees to the right by the angle correction mechanism 4H. Thereafter, the gate valve 10E is opened, the comb-like hand 52b of the transfer robot 5b is inserted from the opening 10EK, and the substrate 6 is lifted and carried out. The transfer robot 5b places the substrate 6 on the processing delivery unit 9buL while adjusting the link length by rotating the base in the direction of the processing delivery unit 1buL.

  In the above description, the case where the substrate 6 is carried in parallel to the delivery chamber 4 and installed on the mounting table 4D has been described. However, when the substrate 6 is installed with an angle β, the comb teeth of the substrate 6 are provided. The angle of the mounting table 4D is controlled so that the angle with respect to the shaped hand 52b becomes αL.

  In this embodiment, after the mounting table 4D corrects the angle, the thickness of the support pin 4P is increased so that the transfer robot 5b can be inserted between the mounting table 4D and the substrate 6 without interfering with the support pin 4P. Then, the interval, the number of comb teeth of the comb-like hand 52, the width, and the like are determined. In FIG. 5A, the solid line indicates the state of the substrate 6 after the angle correction and the support pin 4P at that time, and the broken line indicates the state before the angle correction.

FIG. 6 is a view showing a second embodiment of the angle correction mechanism in the delivery chamber 4.
In the first embodiment, the carry-in area of the transfer robot 5b, that is, the carry-in angle αL is limited by the size of the support pin described above. As will be described later, when the configuration of each cluster is the same and the size of the substrate to be transferred is constant, the angle αL and the like can be made constant. In such a case, the first embodiment has a simple mechanism and is excellent. However, if this is not the case, there are some restrictions in the first embodiment. Therefore, the angle correction mechanism 4H of the second embodiment has a mechanism that rotates only the substrate 6 without rotating the mounting table 4D. As a result, the shape of the carry-in route of the transfer robot 5b is not changed, and can correspond to any angle, and the width of the comb teeth of the comb-like hand 52b can be reduced to increase the substrate size that can be handled.

  In FIG. 6, the angle correction mechanism includes a support pin 4P, a support pin rotating table 4KD to which the support pin is fixed, and a rotary drive motor that rotates the support pin rotating table 4KD left and right via a rotating table support 4SJ. It is composed of 4KM and a vertical drive motor 4JM that moves up and down. Reference numeral 4V denotes a sealing bellows for the vertical movement of the turntable support 4SJ. On the other hand, the mounting table 4D is fixed, and the cross section thereof has a convex portion 4DT for supporting the substrate 6 as shown in FIG. 6 (a). Further, the mounting table 4D has a movable groove 4SK for each support pin or support pin group that allows the support pin 4P to rotate.

  In such a mechanism, first, the transfer robot 5a carries into the delivery chamber 4b and places the substrate 6 on the convex portion 4DT of the placement table 4D. At this time, the support pin 4P is at the lowest position together with the support pin turntable 4KD. Thereafter, the support pin turntable 4KD is raised, the substrate 6 is supported by the support pins 4P, the support pin turntable 4KD is rotated at a desired angle, for example, αL degree, and the support pin turntable 4KD is lowered in this state. The substrate 6 is mounted on the mounting table 4D. Next, the transfer robot 5b is carried in, and the substrate 6 is gripped and carried out from the delivery chamber 4b.

  As described above, in the present embodiment, the conveyance robot 5b can always use the carry-out route between the convex portions 4DT of the mounting table 4D regardless of the angle. In the present embodiment, the substrate 6 is placed with the elongated protrusions 4DT, but it may be placed with support pins arranged in a straight line.

As described above, according to this embodiment, by providing the delivery chamber with the angle correction mechanism that changes the substrate transport angle, the cluster structure having the rectangular processing chambers can be connected in series, and the entire line An organic EL device manufacturing apparatus capable of shortening the length can be provided.
In addition, according to the present embodiment, a line configuration having the above-described cluster structure can be realized, and a space-efficient organic EL device manufacturing apparatus or manufacturing method can be provided.

In the above description, for example, the description has been made without considering the relationship between αR and αL.
Accordingly, if an angle correction mechanism is provided in each delivery unit 4, it is possible to cope with the size or substrate size of each cluster or each processing chamber.

In a series of processing, the processing chambers in FIG. 1 or a plurality of processing units in one processing chamber can have the same shape and the same arrangement as shown in FIG.
For example, in the embodiment of FIG. 1, the clusters A to D have the same shape and the same arrangement, and two processing chambers arranged above and below each cluster are also line symmetric with respect to the transfer direction, and one process is performed. The two processing units in the chamber are also line symmetric with respect to the vertical line in the transport direction. The transfer robot 5 is arranged at the center of the transfer chamber, more specifically, the cluster.
As a result, αR and αL in FIG. 4 are αR = −αL = α, and the processing chamber 1bd has a cross relationship with the processing chamber 1bu. Take the value of -α.

Therefore, first, the angle correction mechanism of the delivery chamber 4 does not need to take a continuous value as long as it processes substrates of the same size, and may take a binary value of a constant angle ± α. In this case, the first example of the first embodiment is effective.
In this case, when the substrate 6 is transported to the processing delivery section having α to −α or −α to α in the same cluster, it is necessary to correct the angle in the delivery chamber 4 in contact with the cluster.

  In the embodiment shown in FIG. 1, the processing of two processing units in the same processing chamber is the same as will be described later. Therefore, in the same cluster, it is transported to a processing delivery unit having α to α or −α to −α. Further, if the correction angle of each cluster is the same as ± α, one substrate is all corrected angle α, and the next substrate is all corrected angle −α from the carry-in port to the carry-out port of the organic EL device manufacturing apparatus 100. Processed and transported. In this case, it is sufficient to correct the angle once on the upstream side as much as possible. If the precondition does not change, the angle correction on the downstream side is unnecessary. Of course, it is necessary to provide an angle correction mechanism where the precondition is changed.

  Candidates in this embodiment are the load chamber 31 and the delivery chamber 4a. The load chamber 31 may be provided with a mechanism similar to that of the delivery chamber. However, when the substrate 6 is loaded into the load chamber 31, the load chamber 31 may be loaded while waiting for an angle of ± α in advance. In addition, if the load chamber 31 is not loaded for each substrate but is loaded in units of cassettes that are stored in plural, the upper load chamber 31 has a cassette having an angle α, and the lower load chamber. A cassette having an angle of −α may be arranged at 31.

  According to the present embodiment, since two identical lines can be provided in parallel, the overall production line may be apparently long, but the unit length with respect to the production amount can be shortened compared to the conventional case. .

  Next, an embodiment of the method (2) for increasing the degree of freedom of the transfer robot will be described. A degree of freedom for rotating the comb-like hand 52 of the transfer robot 5 shown in FIG. For example, the degree of freedom is provided in the connecting portion 52J with the link of the comb-like hand 52. Although it is not preferable to newly provide a mechanism for moving into the vacuum chamber, the same effects as in the first embodiment can be obtained.

Before explaining the correction method in the vapor deposition section of (3), the processing chamber 1 shown in FIGS. 1 to 3 uses the delivery chamber 4 or the substrate 6 whose angle is corrected upstream thereof with reference to FIG. A processing flow will be described from carrying into the delivery unit 9 to vacuum deposition and carrying out. After this flow process, as described above, the same vapor deposition process is performed by transporting to the processing unit on the diagonal of the same cluster.
The basic idea of the vacuum deposition process in this embodiment is that the substrate 6 transported from the upper surface is vertically set, transported to the alignment unit 8, and deposited. If the lower surface of the substrate 6 is a vapor deposition surface at the time of conveyance, it is necessary to invert it.

Next, the vacuum deposition process flow in this embodiment will be described in detail with reference to FIG. In FIG. 3, the place where the substrate 6 exists is indicated by a solid line.
First, in the R line, the substrate 6R is carried in, the substrate 6R is set up vertically and moved to the alignment unit 8R, and alignment between the substrate 6 and the shadow mask 81 is performed (Step R1 to Step R3). At this time, since the substrate is transported on the upper surface with the vapor deposition surface up, alignment can be performed immediately without inversion. For the alignment, as shown in the drawing of FIG. 3, the shadow mask 81R is imaged by the CCD camera 86 so that the alignment mark 84 provided on the substrate 6 is at the center of the window 85 provided on the mask 81M. Control is performed by the alignment driving unit 83. If the main vapor deposition is a material that emits red (R), as shown in FIG. 8, there is a window in a portion corresponding to R of the mask 81M, and this portion is vapor deposited. The size of the window varies depending on the color, but on average is about 50 μm in width and about 150 μm in height. The thickness of the mask 81M is 40 μm and tends to be thinner in the future.

  When the alignment is completed, the evaporation source 71 is moved to the R line side (Step L0), and then the line-shaped evaporation source 71 is moved up or down to deposit (Step R4). During the R line deposition, the processing from StepL1 to StepL3 is performed in the L line as in the R line. That is, another substrate 6L is carried in, the substrate 6L is set up vertically, moved to the alignment unit 8L, and aligned with the shadow mask 81L. When the deposition of the substrate 6R on the R line is completed, the evaporation source 71 moves to the L line (Step R5) and deposits the substrate 6L on the L line (Step L4). At this time, if the substrate 6R is separated from the alignment portion 8R before the evaporation source 71 completely exits the deposition area of the R line, there is a possibility that deposition may be unnecessarily performed. The carrying-out operation from the chamber 1 is started, and then preparation for a new substrate 6R is started. In order to avoid the unnecessary deposition, a partition plate 11 is provided between the lines. FIG. 3 shows the states of StepR4 and StepL1. That is, vapor deposition is started on the R line, and the substrate is loaded into the vacuum vapor deposition chamber 1bu on the L line.

  Thereafter, by continuously performing the above-described flow, it is possible to perform vapor deposition without wastefully using the vapor deposition material except for the moving time of the evaporation unit 7. The time required for vapor deposition and other processing time are approximately 1 minute. If the moving time of the evaporation source 71 is 5 seconds, the wasteful vapor deposition time of 1 minute can be reduced to 5 seconds in the present embodiment. According to the present embodiment, as shown in FIG. 6, the processing cycle of one processing substrate in the vacuum deposition chamber 1bu is substantially the deposition time + the movement time of the evaporation source 71, and productivity can be improved. If the processing time is evaluated under the above-mentioned conditions, it will be 1 minute 5 seconds in the present invention compared to the conventional 2 minutes, and the productivity per chamber can be improved about twice.

  In all the above embodiments (1) and (2), the case where the substrate is erected so that the vapor deposition surface of the substrate 6 is conveyed and vapor deposition can be performed with a standing shadow mask has been described. As another deposition method, there is a method in which both the substrate and the shadow mask are horizontal. In many cases, as shown in FIG. 9, the deposition surface is down, and the deposition process is performed from below. In such a case, (3) the method of correcting by the vapor deposition section of the embodiment is also effective.

  In such an embodiment, in order to transport the substrate processing surface to the lower surface, the substrate 6 is placed in a dedicated case and gripped at both ends of the substrate. The method shown in the above embodiment can be applied to the angle adjusting mechanism.

  In addition, when vapor deposition is performed with the substrate vertical, it is difficult to rotate the processing delivery section 9 in the processing chamber 1 in a complicated manner with a shadow mask alignment mechanism and the like, but the substrate processing surface is horizontal. 5, if the mechanism shown in FIG. 5 is provided in the processing delivery unit 9 or if the correction angle is constant, the alignment unit 7 is provided according to the angle as shown in FIG. 9 and the evaporation source 71 is adjusted to the angle. It is also possible to substantially correct the angle by scanning.

Also in this embodiment, the same effect as the previous embodiment can be obtained.
Therefore, the present invention can be applied regardless of the posture of the shadow mask with different deposition surface postures.

  In the above description, the organic EL device has been described as an example. However, the present invention can also be applied to a film forming apparatus and a film forming method that perform vapor deposition processing in the same background as the organic EL device.

1: Processing chamber 1bu: Vacuum deposition chamber 2: Transfer chamber 3: Load cluster 4: Delivery chamber 4H: Angle correction mechanism 4D: Placement table of delivery chamber 4P: Substrate support pin of delivery chamber 5: Transfer robot 6: Substrate 7: Deposition unit 8: Alignment unit 9: Processing delivery unit 10: Gate valve 11: Partition plate 31: Load chamber 81: Shadow mask 71: Evaporation source 100: Organic EL device manufacturing apparatus AD: Cluster.

Claims (8)

A carry-in port for carrying in the substrate by the first comb-like hand;
A carry-out port for carrying out the substrate by a second comb-like hand;
A plurality of support pins for supporting the substrate;
A plurality of support pins, a support pin turntable for supporting and rotating the substrate;
Rotation drive means for rotating the support pin turntable in a plane parallel to the substrate;
Avoidance means for avoiding interference between the plurality of support pins, at least one of the first comb-shaped hand and the second comb-shaped hand;
An angle correction mechanism having. The angle correction mechanism according to claim 1,
The avoiding means is that a plurality of the support pins are arranged in a matrix so as not to interfere with at least one of the first comb-shaped hand and the second comb-shaped hand.
An angle correction mechanism characterized by that. The angle correction mechanism according to claim 1,
The avoiding means includes vertical drive means for moving up and down the support pin rotating table on which the substrate is placed,
It is provided in parallel with the upper part of the support pin turntable, has a plurality of convex portions, and the first comb-shaped hand and the second comb-shaped hand can be inserted between the convex portions. The support pin has a substrate mounting table with a movable groove,
An angle correction mechanism characterized by that. The angle correction mechanism according to any one of claims 1 to 3,
The rotation drive means includes a turntable support portion provided perpendicular to the support pin turntable, a rotation drive motor for rotating the turntable support portion, and a sealing means for vacuum-sealing the turntable support portion. ,
An angle correction mechanism characterized by that. The angle correction mechanism according to claim 3,
The rotation drive means includes a turntable support portion provided perpendicularly to the support pin turntable, a rotation drive motor that rotates the turntable support portion, and a sealing means that vacuum seals the turntable support portion. And
The vertical drive means includes a vertical drive motor that moves the rotary table support part up and down, and a sealing bellows that is provided on the seal means and enables the rotary table support part to move up and down.
An angle correction mechanism characterized by that. The angle correction mechanism according to any one of claims 1 to 3,
A gate valve is provided at each of the carry-in port and the carry-out port,
An angle correction mechanism characterized by that. A vacuum processing chamber having a processing unit for depositing a deposition material on a substrate;
A delivery chamber having the angle correction mechanism according to any one of claims 1 to 6;
A vacuum chamber comprising transport means for transporting the substrate between the delivery chamber and the plurality of processing units;
An organic EL device manufacturing apparatus comprising: A vacuum processing chamber having a processing unit for depositing a deposition material on the substrate; a delivery chamber for carrying in or out of the substrate; and transport means for transporting the substrate between the delivery chamber and the plurality of processing units. A plurality of clusters having a vacuum chamber comprising
Separately from the delivery chamber, a loading load chamber for loading the substrate and a loading load chamber for unloading the substrate, and
In the conveyance part which comprises the conveyance system which conveys the said board | substrate from the said loading load chamber to the said unloading load chamber, the angle correction mechanism in any one of Claims 1 thru | or 6 was provided,
An organic EL device manufacturing apparatus.

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