JP2012138504A - Chip on film (cof) tape and manufacturing method of the same - Google Patents

Abstract

PROBLEM TO BE SOLVED: To suppress the occurrence of metal foreign objects when defect holes are formed and prevent wiring defects.SOLUTION: In each product 20, a conductor pattern 30 is formed on an insulative resin film tape 10, and the multiple products 20 are arranged in a longitudinal direction of the insulative resin film tape 10 in a chip on film (COF) tape 1. A defect hole 100 is formed on a semiconductor chip mount region 40 which is enclosed by inner leads 31a composing a part of the conductor pattern 30 and in which the conductor pattern 30 is not formed, in each product 20 determined to be defective in the quality determination, out of the multiple products 20.

Description

  The present invention relates to a COF tape and a method for producing a COF tape.

  The carrier tape is a COF (Chip On Film) type carrier tape (hereinafter referred to as COF) in which a plurality of products in which a conductor pattern is formed on a flexible insulating resin film tape are arranged in the longitudinal direction of the film tape. (Referred to as tape). Currently, COF tapes are used and mass-produced in applications such as liquid crystal display devices and printers.

  As one process of the above-described COF tape manufacturing process, a process for determining whether or not a product is good is performed. For example, a step of forming a defective hole at a predetermined position is further performed on the product determined to be defective in this step. As shown in FIG. 3, the predetermined position of the product 320 forming the defective hole 300 is, for example, in the direction of feeding the COF tape 3 from the center point (marked with x in the drawing) 340c with reference to the semiconductor chip mounting region 340. The position is within the conductor pattern 330 separated by a predetermined distance. In addition, the defective hole 300 is formed using a manual or automatic punching die, for example, to form the defective hole 300 having a diameter of about 5 mm. Depending on the presence / absence of the defective hole 300, it is possible to select a good product and a defective product in a later process. For example, Patent Document 1 discloses a hand-held manual punching device having an alignment mechanism for accurately forming a defective punching mark hole (defective hole) at a predetermined position of a defective piece (defective product) of a carrier tape. Has been.

JP 2005-072460 A

  However, as described above, for example, when the defective hole 300 is formed in the conductor pattern 330, the wiring or the like in the conductor pattern 330 is cut. For example, burrs may be generated at the cut portion of the wiring to form a metal foreign object or the like, and the metal foreign object may adhere to the conductor pattern 330 and cause a wiring defect or the like. Particularly, in recent years, COF tapes have been miniaturized and the influence of metallic foreign matters has become a problem.

  An object of the present invention is to provide a COF tape and a method for manufacturing a COF tape that can suppress the occurrence of metal foreign matters during formation of defective holes and suppress wiring defects.

  According to the first aspect of the present invention, a product in which a conductor pattern is formed on an insulating resin film tape is a COF tape arranged in the longitudinal direction of the insulating resin film tape, and the plurality of the products Among these, a COF tape having a defective hole in a semiconductor chip mounting region surrounded by an inner lead that forms a part of the conductor pattern for a product determined to be defective in the pass / fail determination is formed. Provided.

  According to the second aspect of the present invention, a product in which a conductor pattern is formed on an insulating resin film tape is a COF tape arranged in the longitudinal direction of the insulating resin film tape, and a plurality of the products Among these, a COF tape having a defective hole in a product peripheral region outside the conductive pattern formation region is provided for a product determined to be defective in the pass / fail determination.

  According to a third aspect of the present invention, there is provided the COF tape according to the first or second aspect, wherein the defective hole is formed by laser irradiation.

  According to a fourth aspect of the present invention, there is provided the COF tape according to any one of the first to third aspects, wherein a diameter of the defective hole is not less than 0.5 mm and not more than 2.0 mm.

  According to a fifth aspect of the present invention, there is provided a COF tape manufacturing method in which a plurality of products in which a conductor pattern is formed on an insulating resin film tape are arranged in a longitudinal direction of the insulating resin film tape, A semiconductor chip mounting that is surrounded by an inner lead that forms a part of the conductor pattern for a product that is determined to be defective in the step of determining the quality of the product and the step of performing the quality determination. And a method of manufacturing a COF tape having a step of forming defective holes in the region.

  According to a sixth aspect of the present invention, there is provided a method for producing a COF tape in which a plurality of products in which a conductor pattern is formed on an insulating resin film tape are arranged in the longitudinal direction of the insulating resin film tape, A COF tape comprising: a step of determining a quality of a product; and a step of forming a defective hole in a product peripheral region outside a region where the conductor pattern is formed for a product determined to be defective in the step of determining the quality A manufacturing method is provided.

  According to a seventh aspect of the present invention, there is provided the COF tape manufacturing method according to the fifth or sixth aspect, wherein the defective hole is formed by laser irradiation in the step of forming the defective hole.

  According to an eighth aspect of the present invention, in the step of determining acceptability, the COF according to any one of the fifth to seventh aspects in which at least one of an electrical characteristic inspection, an optical inspection, and a visual inspection is performed. A method for manufacturing a tape is provided.

  According to the present invention, it is possible to obtain a COF tape capable of suppressing the occurrence of metal foreign matters when forming defective holes and suppressing wiring defects.

It is a figure which shows the COF tape which concerns on 1st Embodiment of this invention, Comprising: (a) is a top view showing a part of COF tape, (b) is especially about the AA cross section of (a). It is sectional drawing showing the part of the product in which the defective hole was formed. It is a top view showing a part of COF tape concerning a 2nd embodiment of the present invention. It is a top view showing a part of COF tape concerning a prior art.

<First Embodiment>
Below, the manufacturing method of the COF tape and COF tape which concern on 1st Embodiment of this invention is demonstrated.

(1) Structure of COF Tape First, the structure of the COF tape according to the first embodiment of the present invention will be described with reference to FIG. FIG. 1 is a view showing a COF tape 1 according to the present embodiment, wherein (a) is a plan view showing a part of the COF tape 1 and (b) is a cross-sectional view taken along the line AA of (a). FIG. 3 is a cross-sectional view showing a part of the product 20 in which a defective hole 100 is formed.

As shown in FIG. 1A, the COF tape 1 has a configuration in which, for example, a plurality of products 20 in which a conductor pattern 30 is formed on an insulating resin film tape 10 are arranged in the longitudinal direction of the film tape 10. . The product 20 includes, for example, a semiconductor chip mounting region 40 and a product peripheral region 50 that are respectively formed on the film tape 10. Of the plurality of products 20, a semiconductor chip mounting region in which the product 20 determined to be defective by the quality determination described later is surrounded by an inner lead 31 a forming a part of the conductor pattern 30 and the conductor pattern 30 is not formed. 40 has a defective hole 100. In FIG. 1A, among the three products 20 shown in the figure, the product 20 positioned at the top on the paper corresponds to the product 20 determined to be defective.

  The insulating resin film tape 10 included in the COF tape 1 is made of a flexible organic resin material such as polyimide (PI), and is formed in a long shape.

  An insulating protective film 21 made of a solder resist, a coverlay or the like is formed on the main part of the product 20 on which the conductor pattern 30 or the like is formed. Thereby, the conductor pattern 30 etc. are protected. The products 20 are each configured to be punched in the subsequent process along the outer shape indicated by a one-dot chain line in FIG.

  The conductor pattern 30 includes a wiring 31 made of a conductor such as copper (Cu), an electrode pad (not shown), and the like. One end of the wiring (lead) 31 is disposed in the semiconductor chip mounting region 40 and constitutes an inner lead 31a. The vicinity of the other end of the wiring 31 constitutes an outer lead 31b.

  The semiconductor chip mounting area 40 is an area where a semiconductor chip is mounted including, for example, the inner leads 31a. Electrodes provided in the semiconductor chip (not shown) are joined to the inner leads 31 a formed in the semiconductor chip mounting region 40, and the semiconductor chip is mounted on the COF tape 1.

In addition, at the predetermined position in the semiconductor chip mounting area 40 of the product 20 determined to be defective, the above-described defective hole 100 is formed through the film tape 10 as shown in FIG. . The defective hole 100 is, for example, a predetermined area in a region surrounded by the inner leads 31a, specifically, in a substantially rectangular region in which the inner leads 31a face each other and the width D1 is about ₁ mm to 2 mm and the length is about 20 mm. the position, for example, the diameter _{D 2} is formed in a circular 0.5mm or 2.0mm or less. By having such a defective hole 100, the presence or absence of the defective hole 100 is identified by optical means or visual inspection in a later process, so that it is possible to select a good product and a defective product. Yes. In this case, as the predetermined position defect hole 100 is formed, for example, a line passing through the width D ₁ direction of the center of the substantially rectangular region of the (center line), preferably, the substantially rectangular region of the It can be the center in the length direction.

  The product peripheral area 50 is an area outside the formation area of the conductor pattern 30 mainly on the peripheral edge of the product 20, and is an area in the vicinity of a sprocket hole 60 described later, for example, as shown by a dotted line in FIG. .

  Sprocket holes 60 are arranged in the longitudinal direction near both ends of the film tape 10 in the width direction. In the manufacturing process of the COF tape 1 to be described later, the film tape 10 is transported and positioned using the sprocket holes 60.

As described above, in the present embodiment, the defective hole 100 is formed in a region of the semiconductor chip mounting region 40 where the conductor pattern 30 is not formed. Thereby, when forming the defective hole 100, it can suppress that a metal foreign material etc. generate | occur | produce from the copper etc. which comprise the conductor pattern 30. FIG. Therefore, it is possible to suppress the occurrence of a wiring defect or the like due to adhesion of a metal foreign object or the like to, for example, the wiring 31 that is not covered with the insulating protective film 21 of the conductor pattern 30.

  In addition, for example, by providing the defective hole 100 in a region where the conductor pattern 30 of the semiconductor chip mounting region 40 is not formed, particularly in the central portion of the rectangular region, the visibility of the defective hole 100 in a later process is improved. be able to. In particular, in a semiconductor chip mounting apparatus or the like, the presence / absence of the defective hole 100 is detected based on, for example, the positions of the four corners of the semiconductor chip mounting region 40. Therefore, it becomes easy to detect the defective hole 100 in such an apparatus, and the distinguishability is improved.

(2) COF Tape Manufacturing Method Next, a COF tape 1 manufacturing method according to the first embodiment of the present invention will be described with reference to FIG. The method for manufacturing the COF tape 1 according to the present embodiment includes a product pass / fail judgment step and a defective hole formation step described below. These processes are performed on the COF tape at the final stage of the manufacturing process of the COF tape 1, for example.

  The COF tape on which each of the above steps is carried out forms, for example, a copper foil on a film tape 10 made of PI or the like provided with a sprocket hole 60, and forms a conductive pattern 30 by patterning by a photolithography method or the like. The insulating protective film 21 is applied or pasted on the main part of the conductive pattern 30 forming region or the like, and the product 20 including the conductive pattern 30, the semiconductor chip mounting region 40, and the product peripheral region 50 is placed in the longitudinal direction of the film tape 10. A plurality are formed.

  In the product pass / fail determination process according to the present embodiment, an electrical characteristic test such as an open / short test is performed on each product 20 of the COF tape. In the defective hole forming step, the defective hole 200 is formed by laser irradiation. The electrical property inspection is performed using, for example, a tester including a probe. The tester may include a laser irradiator that forms the defective hole 100 in the subsequent defective hole forming step, a microscope for observing the appearance of the product 20, a monitor that displays a microscope image, and the like. May be provided (both not shown).

(Product pass / fail judgment process)
In the product quality determination step, the quality of the product 20 is determined. Specifically, first, the COF tape that has reached the final stage of the manufacturing process is transported into the tester. Then, the product 20 is sequentially delivered to the probe position in the tester, and the probe pins of the probe provided in the tester are pressed against the inner lead 31a and the outer lead 31b that form a part of the conductor pattern 30 of the product 20 to obtain electrical characteristic data. get. The obtained electrical characteristic data is collated with the electrical characteristic information of the product 20 stored in advance in the tester, and it is determined whether or not there is a characteristic abnormality such as disconnection or short circuit of the conductor pattern 30 or, in some cases, conduction resistance fluctuation. . The product 20 in which the characteristic abnormality is detected is determined to be defective, and determination data such as the position in the COF tape and the type of characteristic abnormality are stored in the tester. At this time, a microscope image of the product 20 may be displayed on a monitor provided in the tester, and a visual inspection by an operator may be performed in parallel.

(Defective hole forming process)
Next, a defective hole forming step is subsequently performed in the tester. In the defective hole forming step, the semiconductor chip mounting region in which the conductor pattern 30 is not formed by being surrounded by the inner lead 31a forming a part of the conductor pattern 30 with respect to the product 20 determined to be defective in the above-described product quality determining step. A defective hole 100 is formed in 40.

Specifically, first, based on the determination data stored in the tester, the products 20 determined to be defective are sequentially sent out to the irradiation position of the laser irradiator included in the tester. At this time, the current position of the product 20 may be confirmed via a monitor provided in the tester, and the irradiation position may be finely adjusted by the operator. Then, a predetermined position in the semiconductor chip mounting region 40 of the product 20 determined to be defective is irradiated with a laser, and the film tape 10 is penetrated to form a defective hole 100 in a circular shape having a diameter of 0.5 mm to 2.0 mm, for example. Form.

  As described above, the COF tape 1 in which the defective hole 100 is formed in the product 20 determined to be defective is manufactured. Thereafter, the COF tape 1 is shipped to a user, for example. The user identifies the presence or absence of the defective hole 100 by optical means or visual observation, and mounts the semiconductor chip on the product 20 determined to be a non-defective product. Thereafter, the product 20 is punched into pieces by a press machine or the like to obtain individual products.

(3) Effects according to the first embodiment According to the present embodiment, one or a plurality of effects described below can be obtained.

(A) According to the present embodiment, among the plurality of products 20, the product 20 determined to be defective in the pass / fail determination is surrounded by the inner leads 31 a forming part of the conductor pattern 30, and the conductor pattern 30 is The defective hole 100 is provided in the semiconductor chip mounting region 40 that is not formed. That is, the defective hole 100 is formed without cutting the wiring 31. As a result, the occurrence of burrs and metal foreign matter on the wiring 31 can be suppressed, and adhesion of metal foreign matter to the tester and the COF tape 1 can be suppressed. Therefore, it is possible to suppress the adhesion of the metal foreign matter to the conductor pattern 30 of the product 20 determined as a non-defective product, and to reduce wiring defects.

(B) Further, according to the present embodiment, the defective hole 100 is provided in the central portion of the region of the semiconductor chip mounting region 40 where the conductor pattern 30 is not formed, particularly the rectangular region surrounded by the inner lead 31a. . Thereby, the visibility of the defective hole 100 in the subsequent process and the discriminability by the apparatus are improved.

(C) Moreover, according to this embodiment, the defective hole 100 is formed by laser irradiation. Moreover, the diameter of the defective hole 100 is 0.5 mm or more and 2.0 mm or less. Thus, since the defective hole 100 having a small diameter is formed using laser irradiation, the defective hole 100 can be more reliably formed in the semiconductor chip mounting region 40 without cutting the wiring 31, and the generation of metal foreign matter is generated. Can be suppressed.

  In recent years, the COF tape has been miniaturized, and the portion where wiring is not formed has been limited to a very narrow region. Therefore, in the case of a defective hole that is formed of, for example, a mold and has a diameter of 5 mm as in a conventional COF tape, it is difficult to reliably avoid the wiring and form the defective hole.

  However, in the present embodiment, the diameter of the defective hole 100 is reduced to a small diameter of 0.5 mm or more and 2.0 mm or less by laser irradiation. Therefore, even if the region where the wiring 31 is not formed is very narrow, the wiring 31 Thus, the defective hole 100 can be formed more reliably.

(D) Also, by forming the defective hole 100 by laser irradiation, unlike when using a press machine or the like, for example, the chance of a metal member such as a mold directly touching the COF tape 1 can be reduced, Metals constituting the mold and the wiring 31 rub against each other to generate metal foreign matter, or generation of foreign matters such as metal adhering to the mold and resin derived from the film tape 10 can be suppressed.

(E) Moreover, the position accuracy of the formation position of the defective hole 100 can be improved by forming the defective hole 100 by laser irradiation. In particular, by using together with the visual alignment of the operator, the conductor pattern 30 can be avoided more reliably and the defective hole 100 can be formed in the semiconductor chip mounting region 40.

Second Embodiment
(1) Structure of COF Tape The structure of the COF tape according to the second embodiment of the present invention will be described below with reference to FIG. The COF tape 2 of the present embodiment is different from the above-described embodiment in that the defective hole 200 is formed in the product peripheral region 50 of the product 20 determined to be defective. In FIG. 2, the same code | symbol is attached | subjected to the structure similar to the above-mentioned embodiment, and the description is abbreviate | omitted below.

  As shown in FIG. 2, the COF tape 2 according to the present embodiment has a product periphery outside the formation region of the conductor pattern 30 with respect to a product 20 that is determined to be defective in the quality determination described later among a plurality of products 20. The region 50 has a defective hole 200.

  For example, as shown in FIG. 2, the product peripheral region 50 is a region indicated by a dotted line near the sprocket hole 60. However, the product peripheral region is not limited to the region 50 illustrated by the dotted line in the drawing, and may be a region other than the region where the conductor pattern 30 is formed and the semiconductor chip mounting region 40 within the product 20. Good.

  In addition, a defective hole 200 is formed in the product peripheral region 50 of the product 20 determined to be defective, in which the conductor pattern 30 is not formed, through the film tape 10, for example. At this time, it is preferable that the defective hole 200 is formed at a position and a size that do not affect the conveyance using the sprocket hole 60 or the like.

  Thus, in the present embodiment, the defective hole 200 is formed in the product peripheral region 50 where the conductor pattern 30 is not formed. As a result, when forming the defective hole 200, it is possible to suppress the occurrence of metallic foreign matters from copper or the like constituting the conductor pattern 30, and to suppress wiring defects.

  Also in the present embodiment, as in the above-described embodiment, for example, a product pass / fail determination process and a defective hole forming process are performed on the COF tape at the final stage of the manufacturing process. Thereby, the COF tape 2 is manufactured.

(2) Effects according to the second embodiment Also in the present embodiment, there are the same effects as in the above-described embodiment.

(A) Moreover, according to this embodiment, it has the defect hole 200 in the product peripheral region 50 of the product 20 determined to be defective by the quality determination among the plurality of products 20. Thereby, generation | occurrence | production of the burr | flash of a wiring 31 and a metal foreign material can be suppressed, and wiring defect can be suppressed.

(B) Further, according to the present embodiment, the defective hole 200 is formed at a position / size of the product peripheral region 50 that does not affect the conveyance or the like. As a result, even after the defective hole 200 is formed, various processes by various apparatuses can be performed without any trouble.

<Other embodiments>
As mentioned above, although embodiment of this invention was described concretely, this invention is not limited to the above-mentioned embodiment, It can change variously in the range which does not deviate from the summary.

For example, in the above-described embodiment, the defective hole 100 is circular, but the shape of the defective hole is not limited to this, and may be a rectangle or other shapes.

  In the above-described embodiment, in the product quality determination process, the electrical property inspection and the visual inspection through the microscope are performed, but the quality determination items and methods are not limited thereto. For example, an appearance inspection using an optical means may be performed using an optical inspection apparatus equipped with an image pickup device or the like while collating the appearance information of the product stored in the device with the image pickup data. As for visual inspection, direct visual inspection or the like by the naked eye may be performed without using a microscope. Moreover, you may perform quality determination by combining a some test | inspection suitably.

  In the above-described embodiment, the laser irradiator for forming the defective hole 100 is built in the tester. However, the laser irradiator may be separated from an inspection device such as a tester. The apparatus and method for forming defective holes are not limited to this, and it is also possible to use a press working machine using a mold, a manual punching apparatus by manual work, or an etching technique such as wet / dry. .

  Moreover, although the film tape 10 in the above-mentioned embodiment shall be comprised from PI, in addition to PI, polyethylene terephthalate (PET), polyethylene naphthalate (PEN), polyphenylene sulfide (PPS), polyamideimide (PAI) ), A transparent or opaque material containing an organic resin such as liquid crystal polymer (LCP), aramid, glass epoxy resin or the like as a component can be used.

1, 2 COF tape 10 Insulating resin film tape 20 Product 30 Conductor pattern 31 Wiring 31a Inner lead 31b Outer lead 40 Semiconductor chip mounting region 50 Product peripheral region 100, 200 Defective hole

Claims (8)

A product in which a conductor pattern is formed on an insulating resin film tape is a COF tape in which a plurality of products are arranged in the longitudinal direction of the insulating resin film tape,
Among the plurality of products, a product determined to be defective in the pass / fail determination is surrounded by an inner lead forming a part of the conductor pattern, and a defective hole is formed in a semiconductor chip mounting region where the conductor pattern is not formed. COF tape characterized by having. A product in which a conductor pattern is formed on an insulating resin film tape is a COF tape in which a plurality of products are arranged in the longitudinal direction of the insulating resin film tape,
A COF tape having a defective hole in a product peripheral region outside the conductive pattern formation region for a product determined to be defective in the quality determination among the plurality of products. The COF tape according to claim 1, wherein the defective hole is formed by laser irradiation. The COF tape according to any one of claims 1 to 3, wherein a diameter of the defective hole is 0.5 mm or more and 2.0 mm or less. A product in which a conductor pattern is formed on an insulating resin film tape is a COF tape manufacturing method in which a plurality of products are arranged in the longitudinal direction of the insulating resin film tape,
A step of determining pass / fail of the product;
A step of forming a defective hole in a semiconductor chip mounting region surrounded by an inner lead that forms a part of the conductor pattern for a product that is determined to be defective in the step of performing the pass / fail determination, and the conductor pattern is not formed A method for producing a COF tape, comprising: A product in which a conductor pattern is formed on an insulating resin film tape is a COF tape manufacturing method in which a plurality of products are arranged in the longitudinal direction of the insulating resin film tape,
A step of determining pass / fail of the product;
And a step of forming a defective hole in a product peripheral region outside the conductive pattern formation region for a product determined to be defective in the quality determination step. The method for producing a COF tape according to claim 5 or 6, wherein, in the step of forming the defective hole, the defective hole is formed by laser irradiation. In the step of performing the pass / fail determination,
The method for producing a COF tape according to any one of claims 5 to 7, wherein at least one of electrical property inspection, optical inspection, and visual inspection is performed.

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