JP2012109291A - Led lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light emitting diode (LED) lighting device capable of uniformly emitting light the whole of the LED lighting device without causing unevenness in brightness and chromaticity by suppressing partial increase in excitation in a fluorescence agent included in a fluorescence agent containing resin body that seals a plurality of light emitting elements arranged on a substrate.SOLUTION: The LED lighting device includes: a plurality of light emitting elements 13; a substrate 12 on which the plurality of light emitting elements 13 are mounted; a fluorescence agent containing resin body 14 that seals the plurality of light emitting elements 13; and a transparent resin wall 17 that is provided inside the fluorescence agent containing resin body 14 and partitions a light-emitting region 15 for each of the light emitting elements 13.

Description

  The present invention relates to a multi-chip type LED illumination device used as a general illumination or a light source for a backlight.

  As shown in FIGS. 6A and 6B, a conventional multi-chip type LED lighting device 1 includes a substrate 2 on which an electrode pattern is formed, and a plurality of light emitting elements 3 mounted on the substrate 2. And a sealing resin body 4 having translucency for sealing the plurality of light emitting elements 3.

  Further, in the LED lighting device 1 having the above structure, in order to obtain a predetermined emission color, the light emitting element 3 capable of emitting each color and a fluorescent agent that is excited to a predetermined emission color by the light emission of the light emitting element 3 are contained. The sealing resin body 4 has been realized (Patent Documents 1 and 2).

  For example, in order to obtain white light emission with the LED lighting device 1, a yellow material is used as the fluorescent agent contained in the blue light emitting element 3 and the sealing resin body 4, and the content of the fluorescent agent is adjusted. Is done by that.

JP 2010-129615 A Special table 2009-506530 gazette

  However, since the light emitted from each light emitting element 3 spreads radially, when viewed through the sealing resin body 4, a ring-shaped light emission contour may appear around each light emitting element 3. As described above, in order to obtain white light emission, a blue light emitting element that emits blue light is used as the light emitting element 3, and a yellow material is used as the fluorescent agent contained in the sealing resin body 4. The phenomenon that a strong yellowish light emission contour appears in white light emission has become prominent.

  When such a light emission contour appears, chromaticity and lightness are uneven, and a uniform light emission effect cannot be obtained as a whole. In order to eliminate this phenomenon, there is a problem that the distribution ratio of the fluorescent agent contained in the sealing resin body 4 has to be adjusted in accordance with the luminance and arrangement of the light emitting element 3, and in particular, a plurality of light emitting elements 3 are arranged. The multi-chip type LED lighting device thus made is difficult to adjust, making it difficult to produce a product with a certain light emission quality.

  Therefore, an object of the present invention is to suppress the excitation of the fluorescent agent contained in the fluorescent agent-containing resin body that seals the plurality of light emitting elements arranged on the substrate from being partially increased, thereby reducing the color. It is an object of the present invention to provide an LED lighting device that can uniformly emit light without causing unevenness in brightness and brightness.

  In order to solve the above problems, an LED lighting device of the present invention includes a plurality of light emitting elements, a substrate on which the plurality of light emitting elements are mounted, a fluorescent agent-containing resin body that seals the plurality of light emitting elements, A transparent resin wall provided inside the fluorescent agent-containing resin body and partitioned for each light emitting element is provided.

  The LED lighting device manufacturing method of the present invention includes a step of mounting a plurality of light emitting elements on a substrate in a vertical and horizontal manner, and sealing the plurality of light emitting elements with a fluorescent agent-containing resin body containing a fluorescent agent. Forming a partition groove for partitioning the upper surface of the fluorescent agent-containing resin body in a lattice shape, filling the partition groove with a transparent resin to form a transparent resin wall, and the fluorescence And a step of sealing the surface of the agent-containing resin body and the resin wall with a diffusion resin body containing a light diffusing agent.

  According to the LED lighting device of the present invention, the fluorescent agent-containing resin body that seals a plurality of light emitting elements is provided with a transparent resin wall that divides the light emitting area for each light emitting element, so that between adjacent light emitting elements. Excitation of the fluorescent agent generated in the above is weakened by the resin wall, so that unevenness in chromaticity and brightness as a whole can be prevented.

  Further, by sealing the entire fluorescent agent-containing resin body partitioned by the transparent resin wall with a diffusion resin body containing a light diffusing agent, light having a predetermined emission color is transmitted through the fluorescent agent-containing resin body. It can be made uniform to make it emit light even brighter as a whole.

  According to the LED lighting device manufacturing method of the present invention, a fluorescent agent-containing resin body that seals a plurality of light emitting elements is diced into a lattice shape to form a partition groove, and the partition groove is filled with a transparent resin. By passing through the process of performing, the resin wall which partitions off each light emitting element can be formed uniformly and easily.

It is a perspective view of the LED lighting apparatus which concerns on this invention. It is AA sectional drawing of the said LED illuminating device. It is a top view of the said LED illuminating device. It is process drawing which shows the 1st manufacturing method of the said LED illuminating device. It is process drawing which shows the 2nd manufacturing method of the said LED illuminating device. It is the top view (a) and BB sectional drawing (b) of the conventional LED lighting apparatus.

  Hereinafter, embodiments of an LED lighting device according to the present invention will be described in detail with reference to the accompanying drawings. As shown in FIGS. 1 to 3, the LED lighting device 11 according to the present embodiment includes a plurality of light emitting elements 13 and a substrate 12 having a planar size on which the plurality of light emitting elements 13 can be mounted with a predetermined interval therebetween. A fluorescent agent-containing resin body 14 that seals the plurality of light-emitting elements 13 and a resin wall 17 that partitions the fluorescent agent-containing resin body 14 for each light emitting region are configured.

  The substrate 12 is formed in a square shape with an insulating material such as a general epoxy resin or BT resin, and a pair of electrode patterns 13a and 13b of each light emitting element 13 are flip-chip mounted on the surface. (Not shown) is formed. The region where the pair of electrode patterns is formed is a light emitting region 15 by one light emitting element 13, and the electrode pattern formed in each light emitting region 15 is in series with the electrode pattern of the adjacent light emitting region. It is connected.

  The part which partitions each said light emission area | region 15 becomes the resin wall 17 by transparent resin. The resin wall 17 forms a partition groove 18 in the fluorescent material-containing resin body 14 formed on the entire top surface of the substrate 12 so as to enclose a plurality of light emitting elements 13, and the partition groove 18 is filled with a transparent resin. It is formed by doing. The partition groove 18 can be formed by dicing in a lattice shape so as to have a depth in which the upper surface of the substrate 12 is recessed from the upper surface of the fluorescent agent-containing resin body 14. By providing the partition groove 18 so as to reach the upper surface of the substrate 12, it is possible to partition between the adjacent light emitting regions 15 by the resin wall 17, so that the light emitted from below the light emitting element 13 has an excessive wavelength. The light emission phenomenon due to the conversion can be suppressed.

  The fluorescent agent-containing resin body 14 is formed by adding a predetermined amount of a fluorescent agent to a transparent resin base material, and a mold (not shown) is mounted on the outer peripheral portion of the substrate 12. It is formed by pouring resin into the inside. This fluorescent agent-containing resin body 14 is, for example, an epoxy resin or a silicon resin base material with an appropriate amount of a fluorescent agent made of yttrium, aluminum, garnet (YAG), which is a raw material for fluorescent particles, or a dye, which is a raw material for pigment particles. It can be formed by being mixed.

  The light emitting element 13 is a blue light emitting element (blue LED) made of a gallium nitride compound semiconductor in order to emit a white light emission color for general illumination. This blue LED is composed of a substrate made of sapphire glass and a diffusion layer obtained by diffusing and growing an n-type semiconductor and a p-type semiconductor on the substrate. Each of the n-type semiconductor and the p-type semiconductor includes an n-type electrode and a p-type electrode, and a solder member is provided on a pair of electrode patterns (not shown) including a cathode electrode and an anode electrode provided on the substrate 12. And blue light is emitted from the light emitting layer by passing a constant current.

  Further, on the upper surface and the side surface of the fluorescent agent-containing resin body 14 partitioned by the resin wall 17, the light emitted from the plurality of light emitting elements 13 and converted into a predetermined emission color by the fluorescent agent is diffused. It can be coated with the diffusion resin body 16. The diffusion resin body 16 is made of a diffusion resin containing a light diffusing agent such as titanium oxide in a transparent resin base material, glass mixed with metal particles, or cloudy glass. The diffusion resin body 16 can be covered easily and reliably by cutting the side surface of the fluorescent agent-containing resin body 14 exposed along the outer peripheral surface of the substrate 12 and the upper surface of the substrate 12.

  When a current is applied between power terminals (not shown) provided at one end of the substrate 12, each light emitting element 13 emits blue light, and the blue light emitted above the light emitting region 15 partitioned by the resin wall 17 and Head to the side. The blue light excites the fluorescent agent dispersed in the fluorescent agent-containing resin body 14 that fills each light emitting region 15, so that the wavelength-converted wide wavelength white light is emitted in all directions. At this time, since the fluorescent material is not contained in the resin wall 17, wavelength conversion does not occur, and light emitted from the adjacent light emitting region 15 is transmitted as it is.

  The portion partitioned by the resin wall 17 is where the excitation by the fluorescent agent is most enhanced by the adjacent light emitting elements 13, and the wavelength conversion by yellow light is weakened by dividing by the resin wall 17. As a result, no ring-like light emission traces appearing yellowish, and the light emission luminance does not decrease.

  Next, the manufacturing method of the said LED lighting apparatus is shown in FIG. First, a substrate 12 on which a pair of electrode patterns for arranging a plurality of light emitting elements is formed, and the light emitting elements 13 are flip-chip mounted on the pair of electrode patterns. After the mounting of the light emitting element 13 is completed, a mold is disposed so as to surround the substrate 12.

  The mold is filled with a fluorescent resin containing a fluorescent agent and solidified to a height at which the light emitting element 13 is completely enclosed (step a). Then, half dicing is performed along the light emitting region 15 so that the upper surface of the substrate 12 is recessed from the upper surface of the solidified fluorescent agent-containing resin body 14, thereby forming a lattice-shaped partition groove 18 (step b).

  Next, a resin wall 17 is formed by filling the partition groove 18 with a transparent resin up to the height of the fluorescent agent-containing resin body 14 and curing it (step c). Then, the end surfaces of the fluorescent agent-containing resin body 14 and the resin wall 17 along the outer periphery of the substrate 12 are cut by the same thickness as the resin wall 17 (step d). This cutting is performed such that the upper surface of the outer peripheral portion of the substrate 12 is recessed.

  Finally, the upper surface and side surfaces of the fluorescent agent-containing resin body 14 are sealed with a diffusion resin containing a light diffusing agent to complete (step e).

  In the manufacturing method described above, the fluorescent agent-containing resin body 14 is diced into a lattice shape to form the resin wall 17, but the fluorescent agent-containing resin body previously separated for each light emitting region is formed by a mold or the like, and each light emission A method can be used by filling a transparent resin in the space of the region. The process by this method is shown in FIG.

  First, the light-emitting element 13 is flip-chip mounted on the substrate at a predetermined interval, and a lattice-shaped mold for partitioning each light-emitting region at a predetermined height is mounted thereon. Then, the mold is filled with a fluorescent resin containing a fluorescent agent (step a). And after the said fluorescent resin hardens | cures, a metal mold | die is removed and this space is filled with transparent resin (process b). After the transparent resin is cured, the fluorescent agent-containing resin body and the end face of the resin wall along the outer periphery of the substrate are cut by the same thickness as the resin wall (step c). At this time, it cuts so that the upper surface along the outer peripheral part of the board | substrate 12 may be recessed. Finally, the upper surface and side surfaces of the fluorescent agent-containing resin body 14 are sealed with a diffusion resin containing a light diffusing agent to complete (step d).

  As described above, in the LED lighting device of the present invention, the transparent agent-containing resin body that seals a plurality of light-emitting elements is transparently divided into a plurality of light-emitting regions centered on each light-emitting element. The structure was partitioned by a resin wall. By providing such a transparent resin wall that does not contain a fluorescent agent, it is possible to prevent the occurrence of a ring-shaped light emission contour that occurs on the boundary where adjacent light emitting regions overlap. As a result, it has become possible to obtain an LED lighting device that has no unevenness in chromaticity and lightness and that emits light with a predetermined emission color as a whole.

  In the above embodiment, the light emitting elements are arranged 4 × 4 on the substrate, but the present invention can be applied to all LED lighting devices including two or more light emitting elements. Moreover, it is not limited to a thing of white light emission, It can respond to the LED illuminating device of all the luminescent colors produced by the combination of the luminescent color of a light emitting element, and a fluorescent agent.

DESCRIPTION OF SYMBOLS 1 LED lighting apparatus 2 Board | substrate 3 Light emitting element 4 Sealing resin body 11 LED lighting apparatus 12 Board | substrate 13 Light emitting element 14 Fluorescent agent containing resin body 15 Light emission area | region 16 Diffusion resin body 17 Resin wall 18 Partition groove

Claims (7)

A plurality of light emitting elements;
A substrate on which the plurality of light emitting elements are mounted;
A fluorescent agent-containing resin body for sealing the plurality of light emitting elements;
An LED illumination device comprising: a transparent resin wall provided inside the fluorescent agent-containing resin body and partitioned for each light emitting element.   The LED lighting device according to claim 1, wherein the resin wall is formed of a transparent resin filled in a partition groove provided for partitioning the fluorescent agent-containing resin body for each light emitting element.   The LED lighting device according to claim 2, wherein the partition groove is formed in a lattice shape on an upper surface of the fluorescent agent-containing resin body.   The LED lighting device according to claim 1, wherein the light emitting element is a blue light emitting element that emits blue light.   The LED lighting device according to claim 1, wherein the fluorescent agent-containing resin body is formed by containing a yellow fluorescent agent in a transparent resin base material.   The LED lighting device according to claim 1, wherein an upper surface of the fluorescent agent-containing resin body is sealed with a diffusion resin body containing a light diffusing agent. Mounting a plurality of light emitting elements on a substrate in a vertical and horizontal manner; and
Sealing the plurality of light emitting elements with a fluorescent agent-containing resin body containing a fluorescent agent;
Forming a partition groove for partitioning the upper surface of the fluorescent agent-containing resin body in a lattice pattern by dicing;
Filling the partition groove with a transparent resin to form a transparent resin wall;
And a step of sealing the surface of the fluorescent agent-containing resin body and the resin wall with a diffusion resin body containing a light diffusing agent.

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