JP2016115710A - LED lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an LED lighting device capable of obtaining a uniform and uniform light emitting effect as a whole by reducing interference of light emission between a plurality of light emitting elements arranged densely. A substrate 12 provided with a frame 13 around it, a plurality of light emitting elements 16 disposed on the substrate 12 and having an upper surface electrode 16a, and the upper surface electrodes 16a of the plurality of light emitting elements 16 are electrically connected. In the LED lighting device 11 including the wire 19 to be connected to each other and the sealing resin 18 that fills the frame 13 and seals the plurality of light emitting elements 16 and the wire 19, on the substrate 12, A white resin 17 is provided between each of the plurality of light emitting elements 16, and the top portion 17 a of the white resin 17 is higher than the upper surface electrode 16 a of each light emitting element 16, and the upper surface electrodes 16 a of the light emitting elements 16 are connected to each other. It was set lower than the height position of the wire 19 to be connected. [Selection] Figure 5

Description

  The present invention relates to an LED lighting device mounted on various lighting fixtures.

  In recent years, lighting devices using a plurality of light emitting elements (LEDs) have been adopted as light sources for illumination instead of light bulbs and fluorescent lamps. The light emitting element consumes less power than a light bulb or the like, but has a narrow directivity because it is a point light source. For this reason, several tens to several hundreds of light emitting elements are used in the LED illumination device, and a light emitting surface with uniform brightness is formed by sealing these light emitting elements with a light-transmitting resin. doing.

  Patent Documents 1 and 2 disclose LED light emitting devices having a light emitting surface on which a plurality of light emitting elements are mounted. This LED light emitting device is formed by providing a circular wide mounting portion on which a plurality of light emitting elements can be mounted on a substrate, and sealing the plurality of light emitting elements mounted on the mounting portion with a translucent resin material. Has been. Patent Document 3 discloses a metal substrate obtained by processing a metal substrate into a concavo-convex shape in order to provide a recess for mounting a light emitting element. By processing the metal substrate in this manner, light emitted from the light emitting element can be efficiently emitted to the outside.

  In addition, the LED illumination device can obtain specific light emission characteristics by combining a light emitting element that can emit light of each color and a sealing resin containing a fluorescent agent that excites the light emission of the light emitting element. For example, in order to obtain white light emission, the light quantity of the blue light emitting element and the content of the fluorescent agent are adjusted in a combination of a blue light emitting element and a sealing resin containing a yellow fluorescent agent.

JP2013-21042A JP 2009-164157 A JP 2013-30812 A

  In the LED lighting device, light emitting elements are densely arranged in a high output type. Since the light emitted from each light emitting element spreads radially, when viewed through the sealing resin, a ring-shaped light emitting contour may appear around the respective light emitting elements. In particular, in order to obtain white light emission, in the combination of a blue light emitting element and a sealing resin containing a yellow fluorescent agent, a phenomenon in which a strong yellowish light emission contour appears in white light emission has become prominent. .

  When such a light emission contour appears, chromaticity and lightness are uneven, and a uniform light emission effect cannot be obtained as a whole. In order to improve this, the distribution ratio of the fluorescent agent contained in the sealing resin must be adjusted in accordance with the luminance and arrangement of the light emitting elements. In particular, it is difficult to adjust an LED lighting device composed of a large number of light emitting elements, and it is difficult to produce a product with a certain light emission quality.

  Therefore, an object of the present invention is to provide an LED lighting device that can obtain a uniform and uniform light emission effect as a whole by reducing interference of light emission between a plurality of light emitting elements arranged densely. is there.

  The LED lighting device of the present invention includes a substrate having a frame around it, a plurality of light emitting elements disposed on the substrate, wires that electrically connect upper surface electrodes of the plurality of light emitting elements, In the LED lighting device including the plurality of light emitting elements and the sealing resin that seals the wires filled in the frame, a white resin is provided between the elements of the plurality of light emitting elements on the substrate. The upper end portion of the white resin is set higher than the upper surface of each light emitting element and lower than the height position of the wire connecting the upper surface electrodes of the light emitting elements.

  According to the LED lighting apparatus according to the present invention, interference of light emission from the side surfaces of the light emitting elements can be reduced by providing the white resin between the adjacent light emitting elements. In particular, since the white resin is set higher than the light emitting element and lower than the arrangement position of the wire for electrically connecting the light emitting elements, the front side on which the plurality of light emitting elements are mounted is uneven. And can be illuminated with uniform brightness.

It is the perspective view (a) and sectional drawing (b) which show the element mounting process of the LED lighting apparatus of 1st Embodiment. It is the perspective view (a) and sectional drawing (b) which show the white resin formation process of the LED lighting apparatus of 1st Embodiment. It is the perspective view (a) and sectional drawing (b) which show the wiring process of the LED lighting apparatus of 1st Embodiment. It is the perspective view (a) and sectional drawing (b) which show the sealing wall part formation process of the LED lighting apparatus of 1st Embodiment. It is the perspective view (a) after completion of the LED lighting apparatus of 1st Embodiment, and sectional drawing (b). It is the perspective view (a) and sectional drawing (b) which show the element mounting process of the LED lighting apparatus of 2nd Embodiment of this invention. It is the perspective view (a) and sectional drawing (b) which show the white resin formation process of the LED lighting apparatus of 2nd Embodiment. It is the perspective view (a) and sectional drawing (b) which show the wiring process of the LED lighting apparatus of 2nd Embodiment. It is the perspective view (a) and sectional drawing (b) which show the sealing wall part formation process of the LED lighting apparatus of 2nd Embodiment. It is the perspective view (a) and sectional drawing (b) after completion of the LED lighting apparatus of 2nd Embodiment.

  Hereinafter, a first embodiment of an LED lighting device according to the present invention will be described with reference to FIGS. Here, FIGS. 1 to 4 show an assembly process of the LED lighting device 11, and FIG. 5 shows a form after the LED lighting device 11 is completed.

  As shown in FIGS. 1 to 4, the LED lighting device 11 according to the first embodiment of the present invention is a frame having a substrate 12 and a circular opening 14 disposed on the substrate 12 and in the center. 13, a plurality of light emitting elements 16 arranged on the substrate 12 exposed through the opening 14, a white resin 17 arranged so as to surround the plurality of light emitting elements 16, and FIG. As shown, the sealing resin 18 filling the opening 14 is formed.

  The substrate 12 is made of an insulating material such as a general epoxy resin or BT resin, or a metal material having heat dissipation. A central portion of the substrate 12 is a circular mounting portion 15 which is substantially the same as the opening portion 14 of the frame 13, and a plurality of light emitting elements are arranged in the mounting portion 15. In an actual LED lighting device, a substrate 12 having a size of several tens of millimeters to several tens of millimeters is used depending on the amount of emitted light.

  The frame 13 is formed with a pair of electrode bands 14a and 14b along the edge of the opening 14, and the electrode bands 14a and 14b are connected to a pair of electrode terminals 20a and 20b for electrical connection to the outside. It extends. One of the pair of electrode strips 14a and 14b is an anode and the other is a cathode.

  Each light emitting element 16 uses a blue light emitting element of the same type and the same size made of a gallium nitride compound semiconductor in order to emit a white emission color for general illumination. This blue light-emitting element includes a substrate made of sapphire glass and a diffusion layer obtained by diffusing and growing an n-type semiconductor and a p-type semiconductor on the substrate. Each of the n-type semiconductor and the p-type semiconductor includes an n-type electrode and a p-type electrode on the upper surface, and the upper surface electrode 16 a is electrically connected to each other through a wire 19. In the present embodiment, the plurality of light emitting elements 16 are formed by a plurality of array groups connected in series, and the light emitting elements 16 positioned at both ends of each array group are disposed on either of the electrode bands 14a and 14b. A predetermined current is applied to each array group via the pair of electrode terminals 20a and 20b.

  The white resin 17 is made of a white resin material having a light shielding property, for example, a silicone resin containing titanium oxide, and covers the entire mounting surface 15 so as to surround each light emitting element 16. As shown in FIG. 3, the white resin 17 is formed such that the top portion 17 a is higher than the upper surface electrode 16 a of each light emitting element 16 and lower than the installation position of the wire 19, and each side surface has each light emitting element. The light emitting elements 16 are arranged and formed on the substrate 12 so as to surround the respective light emitting elements 16 with a narrow and substantially uniform gap 22 that does not contact the side surfaces of the light emitting elements 16. In addition, the white resin 17 has a top portion 17a located in the middle portion between the adjacent light emitting elements 16 formed in a curved shape having no corners. For this reason, the light emitted from the side surface side of each light emitting element 16 is shielded, but the light emitted from the upper surface electrode 16a side extends upward at a predetermined angle along the curved surface of the top portion 17a of the white resin 17. Can illuminate. As a result, interference of light emission on the side surface side between the adjacent light emitting elements 16 can be suppressed, while light spreading at a predetermined angle can be emitted from the upper side of the light emitting elements 16, so that the overall light emission amount is reduced. Without generating a yellow light emission contour (yellow ring) due to interference between the adjacent light emitting elements 16.

  The sealing resin 18 is formed by containing a predetermined amount of a fluorescent agent in a transparent resin base material, and the upper surface of the electrode bands 14a and 14b of the frame 13 has a height equal to or higher than the white resin 17. A sealing wall portion 21 is formed by raising an insulating resin material to be formed, and the sealing wall portion 21 is filled with a sealing resin material. In this sealing resin 18, for example, an epoxy resin or a silicone resin base material is mixed with an appropriate amount of a fluorescent agent made of yttrium, aluminum, garnet (YAG), which is a raw material for fluorescent particles, or a dye, which is a raw material for pigment particles. Can be formed.

  6 to 10 show the LED illumination device 31 of the second embodiment. In addition, about the member which is common in LED lighting apparatus 11 of 1st Embodiment, it demonstrates using the same code | symbol. As shown in FIG. 6, the LED lighting device 31 is mounted on the mounting portion 15 of the substrate 12 at a predetermined position, and then, on the inside of the opening portion 14 of the frame 13, as shown in FIG. 7. A white resin 17 is provided along. In the present embodiment, the luminance at the center portion is increased by mainly suppressing the light traveling toward the outside of the opening portion 14.

  As shown in FIG. 8, the white resin 17 is provided along the inner surface of the opening 14 so as to surround the plurality of light emitting elements 16 arranged outside the mounting portion 15. Similar to the first embodiment, the white resin 17 is formed such that the top portion 17a is higher than the upper surface electrode 16a of each light emitting element 16 and lower than the installation position of the wire 19, and is formed outside the mounting portion 15. A gap 22 is provided so as not to contact each light emitting element 16 arranged. The white resin 17 has a top portion 17a formed in a curved shape. For this reason, the light emitted from the side surface of the light emitting element 16 is shielded, but the light emitted from the upper surface electrode 16a side extends upward at a predetermined angle along the curved surface of the top portion 17a of the white resin 17. Can illuminate. As a result, light spreading at a predetermined angle can be emitted from the upper side of the light emitting element 16, so that the entire amount of light emission does not decrease, and the light emitting element 16 disposed on the outer peripheral surface of the mounting portion 15 does not decrease. Occurrence of a yellow light emission contour (yellow ring) toward the outside can be suppressed.

  Thereafter, an insulating resin material having a height equal to or higher than the white resin 17 is formed on the upper surfaces of the electrode bands 14 a and 14 b of the frame 13 to form a sealing wall portion 21. It is formed by filling a sealing resin material.

  As shown in FIGS. 9 and 10, a pair of arc-shaped electrode bands 14 a and 14 b are formed on the substrate 12, and a circular region surrounded by the electrode bands 14 a and 14 b is used as the mounting portion 15. A plurality of light emitting elements 16 are mounted on the mounting portion 15, and the light emitting elements 16 are electrically connected by wires 19. As in the first embodiment, the plurality of light emitting elements 16 are composed of an assembly of a plurality of array groups connected in series, and the light emitting elements 16 positioned at both ends of each array group are the electrode bands 14a and 14b. A predetermined current is applied to each array group through a pair of electrode terminals 20a and 20b.

  In this embodiment, since it is possible to prevent light from diffusing in the outer peripheral portion of the opening 14 that exposes the mounting portion 15 on which the plurality of light emitting elements 16 are mounted, the front side with the opening 14 as a light emitting surface is used. Can concentrate light emission. Thereby, a spot-like illumination effect can be obtained.

DESCRIPTION OF SYMBOLS 11 LED illuminating device 12 Board | substrate 13 Frame 14 Opening part 14a, 14b Electrode band 15 Mounting part 16 Light emitting element 16a Top surface electrode 17 White resin 17a Top part 18 Sealing resin 19 Wire 20a, 20b Electrode terminal 21 Sealing wall part 22 Gap

Claims (6)

A substrate having a frame around it, a plurality of light emitting elements disposed on the substrate and having a top surface electrode, wires for electrically connecting the top surface electrodes of the plurality of light emitting elements, and the frame In the LED lighting device comprising the sealing resin that is filled and seals the plurality of light emitting elements and wires,
A white resin is provided between the elements of the plurality of light emitting elements on the substrate, and the top of the white resin is higher than the upper surface electrodes of the light emitting elements, and connects the upper surface electrodes of the light emitting elements. An LED lighting device, wherein the LED lighting device is set lower than a height position of the wire. A substrate having a frame around it, a plurality of light emitting elements disposed on the substrate and having a top surface electrode, wires for electrically connecting the top surface electrodes of the plurality of light emitting elements, and the frame In the LED lighting device comprising the sealing resin that is filled and seals the plurality of light emitting elements and wires,
On the substrate, a white resin is provided along the inner peripheral surface of the frame body so as to surround the outer periphery of the plurality of light emitting elements arranged on the substrate, and the top of the white resin is provided on each light emitting element. An LED lighting device, wherein the LED lighting device is set to be higher than an upper surface electrode and lower than a height position of a wire extending from the upper surface electrode of the light emitting element toward the frame body.   The LED lighting device according to claim 1, wherein the white resin is formed of a white resin material.   The LED lighting device according to claim 1, wherein the white resin is formed with a curved surface toward the top.   The LED lighting device according to claim 1, wherein the light emitting element is a blue light emitting element that emits blue light.   The LED lighting device according to claim 1, wherein the sealing resin is formed by containing a yellow fluorescent agent in a transparent resin base material.

Images