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JP2007007770A - Polishing machine - Google Patents

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JP2007007770A
JP2007007770A JP2005191100A JP2005191100A JP2007007770A JP 2007007770 A JP2007007770 A JP 2007007770A JP 2005191100 A JP2005191100 A JP 2005191100A JP 2005191100 A JP2005191100 A JP 2005191100A JP 2007007770 A JP2007007770 A JP 2007007770A
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polished
polishing
recess
polishing pad
main body
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Japanese (ja)
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Tatsuyuki Suzuki
龍之 鈴木
Akio Mogi
昭男 茂木
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Mitsubishi Materials Techno Corp
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Mitsubishi Materials Techno Corp
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Priority to JP2005191100A priority Critical patent/JP2007007770A/en
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  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)

Abstract

【課題】 外周部が過研磨にならず、よって被研磨部材の全面を製品として使用することが可能となる研磨機の提供を目的とする。
【解決手段】 表面に設けられた研磨パット(10)上に平板状の被研磨部材wが載置される研磨定盤(1)と、この研磨定盤に対向して配置される加圧定盤(2)とを備えてなり、かつ、上記加圧定盤は、上記研磨パット対向面に凹部(S2)が形成された本体(3)と、この本体に備えられ、上記凹部に加圧流体を供給する加圧手段(35)と、この凹部の上記研磨パット側の開口を覆う可撓性を有するシール材(5)と、上記本体又はシール材に固定され、上記被研磨部材wの側部から当該被研磨部材wと上記本体との相対変位を制限するテンプレート(7)とを有し、上記凹部の側壁(37)が上記被研磨部材wに臨む位置の外方に設けられた研磨機とした。
【選択図】 図1
PROBLEM TO BE SOLVED: To provide a polishing machine in which an outer peripheral portion is not excessively polished, and thus the entire surface of a member to be polished can be used as a product.
A polishing platen (1) on which a flat member to be polished w is placed on a polishing pad (10) provided on the surface, and a pressure plate arranged opposite to the polishing platen. The press platen is provided with a main body (3) having a recess (S2) formed on the surface facing the polishing pad, and is provided in the main body and pressurizing the recess. A pressurizing means (35) for supplying a fluid, a flexible sealing material (5) covering the opening on the polishing pad side of the recess, and the main body or the sealing material, A template (7) that restricts relative displacement between the member to be polished w and the main body from the side is provided, and the side wall (37) of the recess is provided outside the position facing the member to be polished w. A polishing machine was used.
[Selection] Figure 1

Description

本発明は、フラットパネルディスプレイ用のガラスパネル等の平坦な薄板を研磨する研磨機に関する。   The present invention relates to a polishing machine for polishing a flat thin plate such as a glass panel for a flat panel display.

上記薄板を研磨する従来の研磨機としては、図2に示すように、表面に設けられた研磨パット10上に被研磨部材wが載置される研磨定盤1と、この研磨定盤1に対向して配置される加圧定盤9とからなる装置が知られている。   As a conventional polishing machine for polishing the thin plate, as shown in FIG. 2, a polishing platen 1 on which a member to be polished w is placed on a polishing pad 10 provided on the surface, and the polishing platen 1 An apparatus comprising a pressure platen 9 arranged to face each other is known.

この加圧定盤9は、ガラス基板等の被研磨部材wに対して圧縮空気を供給する加圧手段を備え、中央部に空洞S1と、下部外周部に下方に向けて突出する突出壁97と、この突出壁97により囲まれた凹部S2とが形成された円盤体99を備えている。   The pressurizing platen 9 includes pressurizing means for supplying compressed air to a member w to be polished such as a glass substrate, and has a cavity S1 at the center and a projecting wall 97 projecting downward at the lower outer periphery. And a disc body 99 in which a recess S2 surrounded by the protruding wall 97 is formed.

また、この円盤体99の研磨定盤1との対向面には、凹部S2の開口部を覆うようにして設けられた弾性体91と、この弾性体91の下面外周部に設けられ、上記被研磨部材wの周縁部に当接するように配設されたテンプレート92と、このテンプレート92の内側に一体的に設けられ、弾性体91と被研磨部材wとの直接接触を防止するバッキング材93とが備えられている。このテンプレート92は、バッキング材93と被研磨部材wとの厚さよりも薄くして設けられている。   Further, an elastic body 91 provided so as to cover the opening of the recess S2 is provided on a surface of the disk body 99 facing the polishing surface plate 1, and a lower peripheral portion of the elastic body 91 is provided on the bottom surface. A template 92 disposed so as to contact the peripheral edge of the polishing member w, and a backing material 93 provided integrally with the inside of the template 92 to prevent direct contact between the elastic body 91 and the member to be polished w Is provided. The template 92 is provided to be thinner than the thickness of the backing material 93 and the member to be polished w.

他方、円盤体99の上部には、円盤体99を回転可能に支持する回転軸94が設けられている。また、上記加圧手段として、空洞S1に圧縮空気を供給する空気供給管95と、弾性体91上に圧縮空気を供給・吸引する空気供給管96とを備えている。
上述の加圧定盤9において上記突出壁97は、その内周部が被研磨部材w上方に延在して設けられており、被研磨部材wの外周部を確実に研磨パット10に接触させるようになっている。
On the other hand, a rotating shaft 94 that rotatably supports the disc body 99 is provided on the upper portion of the disc body 99. The pressurizing means includes an air supply pipe 95 that supplies compressed air to the cavity S1 and an air supply pipe 96 that supplies and sucks compressed air onto the elastic body 91.
In the pressure platen 9 described above, the protruding wall 97 has an inner peripheral portion extending above the member to be polished w, and the outer peripheral portion of the member to be polished w is reliably brought into contact with the polishing pad 10. It is like that.

この研磨機によれば、加圧手段としての圧縮空気供給管95により空洞S1に圧縮空気を供給することによって、突出壁97の内周部が被研磨部材wを研磨パット10上に支持するとともに、圧縮空気供給管96により凹部S2に圧縮空気を供給することによって、被研磨部材wを研磨定盤1に押圧することができる。このため、研磨定盤1と加圧定盤9とを相対的に面内移動させることにより被研磨部材wを研磨パット10に接触させて研磨することができる。   According to this polishing machine, the compressed air is supplied to the cavity S1 by the compressed air supply pipe 95 as a pressurizing means, whereby the inner peripheral portion of the protruding wall 97 supports the member to be polished w on the polishing pad 10. The member to be polished w can be pressed against the polishing surface plate 1 by supplying compressed air to the concave portion S <b> 2 by the compressed air supply pipe 96. For this reason, the member to be polished w can be brought into contact with the polishing pad 10 and polished by relatively moving the polishing platen 1 and the pressure platen 9 in the plane.

しかしながら、この研磨機は、突出壁97の内周部が被研磨部材wの外周部に配設されているため、上述の突出壁97による被研磨部材wの研磨パット10上への支持力が外周部に集中し易いという問題がある。さらに、バッキング材93及び被研磨部材wは、テンプレート92よりも研磨分の厚みを備えているため、被研磨部材wの外周部が過研磨になるという問題がある。
この結果、例えばカラーフィルタ等の多面取りを行う場合には、過研磨になった被研磨部材wの外周部から製品を切り出すことができないため、1枚の被研磨部材wから得られる製品数が少なくなり、経済性に劣るという問題点があった。
なお、本出願人は、先に本発明に関連する研磨機を出願している(例えば、特許文献1)。
However, in this polishing machine, since the inner peripheral portion of the protruding wall 97 is disposed on the outer peripheral portion of the member to be polished w, the supporting force of the member to be polished w on the polishing pad 10 by the protruding wall 97 is high. There is a problem that it tends to concentrate on the outer periphery. Furthermore, since the backing material 93 and the member to be polished w have a thickness equivalent to that of the template 92, there is a problem that the outer peripheral portion of the member to be polished w is overpolished.
As a result, for example, when performing multi-chamfering such as a color filter, the product cannot be cut out from the outer peripheral portion of the over-polished member w, so that the number of products obtained from a single member to be polished w is There was a problem that it was less and inferior in economic efficiency.
Note that the applicant has previously filed a polishing machine related to the present invention (for example, Patent Document 1).

特開2004−105817号公報JP 2004-105817 A

このため本発明は、外周部が過研磨にならず、よって被研磨部材の全面を製品として使用することが可能となる研磨機の提供を目的とする。   Therefore, an object of the present invention is to provide a polishing machine in which the outer peripheral portion is not overpolished, and thus the entire surface of the member to be polished can be used as a product.

請求項1に記載の発明は、表面に設けられた研磨パット上に平板状の被研磨部材が載置される研磨定盤と、この研磨定盤に対向して配置される加圧定盤とを備えてなり、かつ、上記加圧定盤は、上記研磨パット対向面に凹部が形成された本体と、この本体に備えられ、上記凹部に加圧流体を供給する加圧手段と、この凹部の上記研磨パット側の開口を覆う可撓性を有するシール材と、上記本体又はシール材に固定され、上記被研磨部材の側部から当該被研磨部材と上記本体との相対変位を制限するテンプレートとを有してなり、上記凹部の側壁が上記被研磨部材に臨む位置の外方に設けられており、上記加圧手段により加圧流体を上記凹部に供給して、上記シール材を介して被研磨部材を押圧するとともに、上記研磨定盤と加圧定盤とを相対的に面内移動させることにより、上記研磨パットによって上記被研磨部材を研磨することを特徴とする研磨機である。   The invention according to claim 1 is a polishing platen on which a flat plate-like member to be placed is placed on a polishing pad provided on the surface, and a pressure platen disposed opposite to the polishing platen. And the pressurizing platen includes a main body having a recess formed on the surface facing the polishing pad, a pressurizing means provided in the main body and supplying pressurized fluid to the recess, and the recess A flexible sealing material that covers the opening on the polishing pad side, and a template that is fixed to the main body or the sealing material and restricts relative displacement between the polished member and the main body from the side of the polished member. The side wall of the recess is provided outside the position facing the member to be polished, and pressurized fluid is supplied to the recess by the pressurizing means, and the While pressing the member to be polished, the polishing platen and the pressure platen The by-plane movement, a grinding machine, characterized by polishing the polishing target member by the polishing pad.

上述の請求項1に記載の発明によれば、加圧定盤の本体の研磨パット対向面に形成された凹部に、加圧手段により加圧流体を供給すると、この凹部の研磨パット側の開口に設けられたシール材が可撓性を有するため被研磨部材方向へ膨張して、被研磨部材を研磨パット上に支持することができる。この際に、上記凹部の側壁が被研磨部材に臨む位置の外方に設けられているため、凹部に供給された加圧流体が被研磨部材の全面を均等に研磨パット側に押圧することができる。
その結果、加圧定盤と被研磨定盤とを相対的に面内移動させて、被研磨部材を上記研磨パットによって研磨する際に、被研磨部材の全面を均等に研磨することができる。これにより、被研磨部材の全面を製品として使用することができ、製造歩留まりを向上させることができる。特に、カラーフィルタ等の多面取りを行う製品においては、飛躍的に歩留まりを向上させることができる。
According to the first aspect of the present invention, when the pressurized fluid is supplied to the recess formed on the polishing pad facing surface of the main body of the pressurizing surface plate by the pressurizing means, the opening on the polishing pad side of the recess is formed. Since the sealing material provided on the surface is flexible, it expands toward the member to be polished, and the member to be polished can be supported on the polishing pad. At this time, since the side wall of the recess is provided outside the position facing the member to be polished, the pressurized fluid supplied to the recess can evenly press the entire surface of the member to be polished toward the polishing pad. it can.
As a result, the entire surface of the member to be polished can be uniformly polished when the pressure platen and the surface plate to be polished are relatively moved in-plane and the member to be polished is polished by the polishing pad. Thereby, the entire surface of the member to be polished can be used as a product, and the manufacturing yield can be improved. In particular, the yield can be drastically improved in products such as color filters that perform multi-planar processing.

以下、本発明に研磨機の一実施形態を、図1を用いて説明する。   Hereinafter, an embodiment of a polishing machine according to the present invention will be described with reference to FIG.

本実施形態における研磨機は、表面に設けられた研磨パット10上に被研磨部材wが載置される研磨定盤1と、この研磨定盤1に対向して配置される加圧定盤2とから概略構成されている。ここで、被研磨部材wとして、例えば矩形状のガラス基板等、平版状のものが研磨機により研磨される。   The polishing machine according to the present embodiment includes a polishing surface plate 1 on which a member to be polished w is placed on a polishing pad 10 provided on the surface, and a pressure surface plate 2 disposed opposite to the polishing surface plate 1. It is roughly composed of Here, as the member to be polished w, a lithographic material such as a rectangular glass substrate is polished by a polishing machine.

この研磨定盤1は、表面が高い平面度に加工された肉厚の円盤状部材であり、その中心部下面には当該研磨定盤1を回転可能に支持する回転軸(図示を略す)が設けられるとともに、上面には研磨パット10が略全面に設けられている。
この研磨パット10としては、硬質発泡ウレタン、軟質発泡ウレタン、合成樹脂繊維や不織布等が用いられている。
The polishing surface plate 1 is a thick disk-shaped member whose surface is processed to a high flatness, and a rotating shaft (not shown) that rotatably supports the polishing surface plate 1 is provided on the lower surface of the center portion thereof. The polishing pad 10 is provided on the entire upper surface of the polishing pad 10.
As this polishing pad 10, hard foamed urethane, soft foamed urethane, synthetic resin fiber, nonwoven fabric, or the like is used.

上記加圧定盤2は、中央部に空洞S1及び研磨パット10対向面に凹部S2が各々形成された円盤体3(本体)と、この凹部S2の開口部を覆うようにして、円盤体3の略全面に設けられた弾性体(シール材)5とが備えられている。
この円盤体3の中央上部には、当該円盤体3を上記研磨定盤1と同方向に回転可能に支持する回転軸4が設けられている。
他方、この弾性体5の下面には、矩形状の被研磨部材wの略全面に対応する位置に設けられたバッキング材6と、被研磨部材wの周縁部に隙間(1mm〜5mm)を介して配設されたテンプレート7とが一体化して設けられている。
The pressurizing surface plate 2 covers the disk body 3 (main body) in which the cavity S1 and the recess S2 are formed on the surface facing the polishing pad 10 at the center, and the opening of the recess S2 so as to cover the disk body 3 And an elastic body (seal material) 5 provided on substantially the entire surface.
A rotating shaft 4 that supports the disk body 3 so as to be rotatable in the same direction as the polishing surface plate 1 is provided at the upper center of the disk body 3.
On the other hand, on the lower surface of the elastic body 5, a backing material 6 provided at a position corresponding to substantially the entire surface of the rectangular member to be polished w and a gap (1 mm to 5 mm) between the peripheral portion of the member to be polished w. And the template 7 disposed in an integrated manner.

この円盤体3は、上記回転軸4に支持された軸円板31aと、その周端部から垂下して軸円板31aと一体的に設けられている軸壁部31bとを有する軸受体31とが備えられている。また、この軸円板31aよりも大きい外法を具備して、対向する研磨パット10に平行に配設された対向円板32aと、その周端部に立設されて対向円板32aと一体的に設けられ、上記軸壁部31bの外周側に対向して配設される対向壁部32bとを有する加圧体32が備えられている。そして、上記軸受体31と上記加圧体32とが、中央部に上記空洞S1を形成して、軸壁部31b下部と対向壁部32b上部とに両端部が埋設された弾性を有する連結部材33によって一体化されている。   The disk body 3 includes a shaft body 31a supported by the rotating shaft 4 and a shaft body 31b that is provided integrally with the shaft disk 31a so as to be suspended from the peripheral end portion thereof. And are provided. Also, the outer disk 32a has a larger outer method than the shaft disk 31a, and is disposed in parallel with the opposing polishing pad 10, and the counter disk 32a is erected at the peripheral end thereof and integrated with the counter disk 32a. There is provided a pressurizing body 32 having an opposing wall portion 32b provided oppositely and disposed opposite to the outer peripheral side of the shaft wall portion 31b. The bearing body 31 and the pressurizing body 32 form the cavity S1 in the central portion, and have a resilient connecting member in which both end portions are embedded in the lower portion of the shaft wall portion 31b and the upper portion of the opposing wall portion 32b. 33 is integrated.

上記凹部S2は、この対向円板32aの中央下部に、上記研磨パット10側に向けて開口が形成されており、当該側壁37が被研磨部材wに臨む位置の外方に配設されて、開口面積が被研磨部材wの表面積と同一又は若干大きくなるように形成されている。
また、円盤体3は、シール部材36が、この凹部S2の側部外方に、凹部S2を取り囲むようにして対向円板32aに埋設されており、当該シール部材36の下部が上記弾性体5に密着するようになっている。
The recess S2 has an opening at the center lower portion of the counter disk 32a toward the polishing pad 10, and is disposed outside the position where the side wall 37 faces the member to be polished w. The opening area is the same as or slightly larger than the surface area of the member to be polished w.
In addition, the disc body 3 has a seal member 36 embedded in the counter disk 32a outside the side of the recess S2 so as to surround the recess S2, and the lower portion of the seal member 36 is the elastic body 5. It comes to adhere to.

上記弾性体5は、例えばゴム等からなり、上記シール部材36により円盤体3と一体化されている。
上記バッキング材6は、発泡ポリウレタンからなり、これらの被研磨部材wの上方略全面に設けられた弾性体5及び上記バッキング材6は、可撓性及び圧縮空気の流通性を具備している。
他方、この被研磨部材wの外方に設けられる上記テンプレートは、弾性体5の下面に、上記バッキング材6と被研磨部材wとの厚さから研磨除去される分を考慮して、薄くして設けられている。
The elastic body 5 is made of, for example, rubber, and is integrated with the disk body 3 by the seal member 36.
The backing material 6 is made of polyurethane foam, and the elastic body 5 and the backing material 6 provided on substantially the entire upper surface of the member to be polished w have flexibility and compressed air flow.
On the other hand, the template provided outside the member to be polished w is thinned in consideration of the amount removed by polishing from the thickness of the backing material 6 and the member to be polished w on the lower surface of the elastic body 5. Is provided.

一方、上記凹部S2には、上流側が上記軸円板31a、空洞S1、対向円板32aを貫通した圧縮空気供給管(加圧手段)35の供給口が形成されている。他方、空洞S1には、上記軸円板31aを貫通した圧縮空気供給管34の供給口が形成されている。   On the other hand, in the recess S2, a supply port for a compressed air supply pipe (pressurizing means) 35 is formed on the upstream side through the shaft disk 31a, the cavity S1, and the counter disk 32a. On the other hand, a supply port for a compressed air supply pipe 34 penetrating the shaft disc 31a is formed in the cavity S1.

この圧縮空気供給管34は、上記空洞S1に圧縮空気を供給するようになっており、この空洞S1内に供給した圧縮空気は、弾性を有する連結部材33によって一体化されている軸受体31及び対向円板32aを外方へと押し出すことにより、弾性体5とバッキング材6とを介して被研磨部材wを研磨パット10上に押圧しつつ、被研磨部材wを円盤体3とともに回転させるようになっている。
他方、圧縮空気供給管35は、圧縮空気を凹部S2に供給して、この凹部S2に供給した圧縮空気は、被研磨部材wの面内を均等に研磨パット10に接触させるようになっている。
さらに、圧縮空気供給管35は、凹部S2内の空気を吸引することができるようになっている。
The compressed air supply pipe 34 is configured to supply compressed air to the cavity S1, and the compressed air supplied into the cavity S1 is integrated with a bearing body 31 and an elastic connecting member 33, and By pushing the opposing disk 32a outward, the member to be polished w is rotated together with the disk body 3 while pressing the member to be polished w onto the polishing pad 10 via the elastic body 5 and the backing material 6. It has become.
On the other hand, the compressed air supply pipe 35 supplies compressed air to the concave portion S2, and the compressed air supplied to the concave portion S2 makes the surface of the member to be polished w uniformly contact the polishing pad 10. .
Further, the compressed air supply pipe 35 can suck air in the recess S2.

以下、上述の研磨機の作用について説明する。
本実施形態における研磨機においては、研磨定盤1上の研磨パット10上に被研磨部材wを載置して、圧縮空気供給管34から圧縮空気を空洞S1に供給し、被研磨部材w方向に膨張した弾性体5及びバッキング材6により被研磨部材wを研磨パット10上に支持しつつ、圧縮空気供給管35から凹部S2に圧縮空気を供給して、均等に被研磨部材wの全面を研磨パット10側に押圧する。それとともに、研磨定盤1と加圧定盤2とを同方向に回転させて、被研磨部材wを加圧定盤2とともに回転させることにより、被研磨面を均一に研磨パット10に接触させる。
Hereinafter, the operation of the above-described polishing machine will be described.
In the polishing machine according to the present embodiment, the member to be polished w is placed on the polishing pad 10 on the polishing platen 1, compressed air is supplied from the compressed air supply pipe 34 to the cavity S 1, and the direction of the member to be polished w While supporting the member to be polished w on the polishing pad 10 by the elastic body 5 and the backing material 6 that have expanded in parallel, compressed air is supplied from the compressed air supply pipe 35 to the recess S2, and the entire surface of the member w to be polished is evenly distributed. Press toward the polishing pad 10 side. At the same time, the polishing surface plate 1 and the pressure surface plate 2 are rotated in the same direction, and the member to be polished w is rotated together with the pressure surface plate 2, thereby bringing the surface to be polished into contact with the polishing pad 10 uniformly. .

この際、被研磨部材wは、凹部S2の側壁が被研磨部材wに臨む位置の外方に設けられているため、対向円板32aによって直接押圧されることがなく、さらに凹部S2の圧縮空気が被研磨部材wの全面に均等に供給されるため、被研磨部材wの一部が過研磨になることを防止できる。   At this time, since the member to be polished w is provided outside the position where the side wall of the recess S2 faces the member to be polished w, it is not directly pressed by the counter disk 32a, and the compressed air in the recess S2 Is uniformly supplied to the entire surface of the member to be polished w, so that a part of the member to be polished w can be prevented from being overpolished.

次いで、圧縮空気供給管35により空気を吸引して、被研磨部材wを円盤体3に吸着させて、次工程に搬送する。
なお、本発明の研磨機は、上述の実施の形態に限られない。例えば、吸引手段が設けられていなくてもよい。
Next, air is sucked by the compressed air supply pipe 35, the member to be polished w is adsorbed to the disk body 3, and is conveyed to the next step.
The polishing machine of the present invention is not limited to the above-described embodiment. For example, the suction means may not be provided.

本発明の研磨機の一実施形態を示した従断面模式図である。It is a secondary section schematic diagram showing one embodiment of a polisher of the present invention. 従来の研磨機を示した縦断面模式図である。It is the longitudinal cross-sectional schematic diagram which showed the conventional grinder.

符号の説明Explanation of symbols

w・・・被研磨部材
S2・・・凹部
1・・・研磨定盤
2・・・加圧定盤
3・・・円盤体(本体)
5・・・弾性体(シール材)
7・・・テンプレート
10・・・研磨パット
35・・・圧縮空気供給管(加圧手段)
w: Member to be polished S2: Concave part 1 ... Polishing surface plate 2 ... Pressure surface plate 3 ... Disc body (main body)
5 ... Elastic body (sealing material)
7 ... Template 10 ... Polishing pad 35 ... Compressed air supply pipe (pressurizing means)

Claims (1)

表面に設けられた研磨パット上に平板状の被研磨部材が載置される研磨定盤と、この研磨定盤に対向して配置される加圧定盤とを備えてなり、かつ
上記加圧定盤は、上記研磨パット対向面に凹部が形成された本体と、この本体に備えられ、上記凹部に加圧流体を供給する加圧手段と、この凹部の上記研磨パット側の開口を覆う可撓性を有するシール材と、上記本体又はシール材に固定され、上記被研磨部材の側部から当該被研磨部材と上記本体との相対変位を制限するテンプレートとを有してなり、
上記凹部の側壁が上記被研磨部材に臨む位置の外方に設けられており、上記加圧手段により加圧流体を上記凹部に供給して、上記シール材を介して被研磨部材を押圧するとともに、上記研磨定盤と加圧定盤とを相対的に面内移動させることにより、上記研磨パットによって上記被研磨部材を研磨することを特徴とする研磨機。
A polishing platen on which a flat plate-shaped member is placed on a polishing pad provided on the surface, and a pressure platen disposed opposite to the polishing platen, and the pressurization The surface plate includes a main body having a recess formed on the surface facing the polishing pad, a pressurizing means provided in the main body, for supplying pressurized fluid to the recess, and an opening on the polishing pad side of the recess. A flexible sealing material, and a template that is fixed to the main body or the sealing material and restricts relative displacement between the polished member and the main body from the side of the polished member;
The side wall of the recess is provided outside the position facing the member to be polished, the pressurized fluid is supplied to the recess by the pressurizing means, and the member to be polished is pressed through the sealing material. A polishing machine for polishing the member to be polished by the polishing pad by relatively moving the polishing platen and the pressure platen in-plane.
JP2005191100A 2005-06-30 2005-06-30 Polishing machine Pending JP2007007770A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2005191100A JP2007007770A (en) 2005-06-30 2005-06-30 Polishing machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2005191100A JP2007007770A (en) 2005-06-30 2005-06-30 Polishing machine

Publications (1)

Publication Number Publication Date
JP2007007770A true JP2007007770A (en) 2007-01-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
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Country Link
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Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569310A (en) * 1991-04-23 1993-03-23 Mitsubishi Materials Corp Wafer mirror polishing device
JP2000317819A (en) * 1999-05-10 2000-11-21 Tokyo Seimitsu Co Ltd Wafer polishing device
JP2002075936A (en) * 2000-08-25 2002-03-15 Mitsubishi Materials Corp Wafer polishing head and polishing apparatus using the same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0569310A (en) * 1991-04-23 1993-03-23 Mitsubishi Materials Corp Wafer mirror polishing device
JP2000317819A (en) * 1999-05-10 2000-11-21 Tokyo Seimitsu Co Ltd Wafer polishing device
JP2002075936A (en) * 2000-08-25 2002-03-15 Mitsubishi Materials Corp Wafer polishing head and polishing apparatus using the same

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