JP2012039043A - Mounting device and mounting method of electronic component - Google Patents

Abstract

An object of the present invention is to provide a mounting apparatus capable of mounting TCP on a side portion of a substrate with high accuracy and efficiency.
SOLUTION: A plurality of mounting tables 5 to 9 arranged at predetermined intervals along the longitudinal direction of a base portion 1 and one of the plurality of mounting tables are arranged so as to face the mounting table. A temporary press-bonding head that temporarily press-bonds TCP to the side portion of the mounted substrate, and a TCP temporarily press-bonded to the substrate placed and supplied to this mounting table. A plurality of suction pads 16 are provided above the plurality of mounting tables so as to be capable of being driven in the vertical direction and the longitudinal direction of the base portion, and a plurality of suction pads 16 are provided on the lower surface at the same intervals as the plurality of mounting tables. The substrate driven on the lowering direction and simultaneously lifted after the substrates placed on the plurality of placement tables are simultaneously sucked by the plurality of suction pads, and then the substrate held on each suction pad is placed on the next placement table. Driven to transfer Comprising a substrate transfer means 11 descending.
[Selection] Figure 2

Description

  The present invention relates to a mounting apparatus and a mounting method for mounting an electronic component such as a TCP (Tape Carrier Package) on a substrate such as a liquid crystal display panel via an anisotropic conductive member.

  For example, in a process of assembling a substrate such as a display panel, an electronic component such as the TCP is mounted on a side portion of the substrate via a tape-like anisotropic conductive member.

  As for the mounting apparatus which mounts the said electronic component in the side part of the said board | substrate, the loader part unit, the adhering unit, the temporary crimping | compression-bonding unit, this crimping | compression-bonding unit, and the unloader unit are arrange | positioned in order one by one. The loader unit stores a substrate on which the electronic component is not mounted, and the substrate is supplied from the loader unit to the sticking unit. In the sticking unit, a tape-like anisotropic conductive member is stuck to the side part of the substrate, and the substrate on which the anisotropic conductive member is stuck is supplied to the temporary pressure bonding unit.

  The temporary press-bonding unit temporarily press-bonds the electronic component to the side portion of the substrate on which the anisotropic conductive member is attached, and the main press-bonding unit pressurizes and heats the temporarily pressed electronic component, The anisotropic conductive member is melt-cured and the electronic component is finally pressure-bonded to the side portion of the substrate.

  Each of the loader unit, the sticking unit, the temporary pressure bonding unit, the main pressure bonding unit, and the unloader unit has a table (mounting table) on which the substrate is mounted. Each table is driven in the horizontal direction (X direction and Y direction) and the rotation direction (θ direction), and each unit controls the table to drive the substrate placed on the upper surface. Positioning is performed with respect to each unit.

JP 2003-59975 A

  By the way, if it is the structure which drives the table of each unit and positions a board | substrate with respect to each unit, the drive mechanism which drives a table to a horizontal direction and a rotation direction for every unit will be needed. If a drive mechanism is provided for each table of the unit, the number of drive mechanisms increases, which may complicate the overall configuration, and also increases the cost of the apparatus.

  Furthermore, the transfer (transfer) of the substrate from the upstream side to the downstream side of the substrate flow direction is sequentially performed by transfer means such as one or a plurality of robots. Therefore, even if positioning in the X direction and Y direction, which are horizontal directions of the tables of each unit, can be precisely performed based on, for example, preset position data, the transfer accuracy between the tables of each unit is as described above. Variations may occur depending on the driving accuracy of the delivery means.

  For this reason, the electronic component cannot be mounted on the substrate with high accuracy due to variations in the positioning accuracy of the substrate. In addition, when the delivery means such as one or a plurality of robots is driven and controlled so that the substrate is delivered between the tables of each unit, the delivery means is positioned on the table for each unit and the substrate is received. Since it must be delivered, it takes a long time to deliver the substrate as a whole, which may cause a decrease in productivity.

  SUMMARY OF THE INVENTION An object of the present invention is to provide an electronic component mounting apparatus and mounting method capable of transferring a substrate to a plurality of mounting tables quickly and accurately with a simple configuration.

This invention is an electronic component mounting apparatus that temporarily press-bonds an electronic component to a side portion of a substrate and then press-bonds the electronic component.
The device body;
A plurality of mounting tables that are arranged at predetermined intervals along the longitudinal direction of the apparatus main body and on which the substrate is supplied and mounted;
A temporary press-bonding portion that is arranged to face one mounting table among the plurality of mounting tables and temporarily press-bonds the electronic component to the side portion of the substrate placed on the mounting table;
A main pressure-bonding portion for finally pressure-bonding the electronic component, which is disposed opposite to the other table different from the one table and is temporarily pressure-bonded to the substrate supplied and mounted on the table;
A plurality of suction portions are provided above the plurality of placement tables so as to be able to be driven in the vertical direction and the longitudinal direction of the apparatus body, and a plurality of suction portions are provided on the lower surface at the same intervals as the plurality of placement tables. The substrate that is driven and placed on the plurality of placement tables is simultaneously attracted by the plurality of suction portions and then lifted, and then the substrate held on each suction portion is transferred to the next placement table. An electronic component mounting apparatus comprising: substrate transfer means that is driven and lowered from one end side in the longitudinal direction of the apparatus main body toward the other end side.

  Among the plurality of mounting tables, the mounting table provided on one end side in the longitudinal direction of the apparatus main body is driven in the horizontal direction and the rotation direction around the axis perpendicular to the horizontal direction. It is preferable to correct the position of the substrate placed and placed before being transferred by the substrate transfer means.

  It is preferable that the interval between the temporary press-bonding portion and the main press-bonding portion is set to an integral multiple of the interval between the plurality of mounting tables.

This invention is an electronic component mounting apparatus that temporarily press-bonds an electronic component to a side portion of a substrate and then press-bonds the electronic component.
A first mounting device that temporarily press-bonds an electronic component to one side of the substrate and then press-bonds the electronic component;
A second mounting device that is arranged side by side with the first mounting device and temporarily press-bonds an electronic component to the other side portion adjacent to the one side portion of the substrate;
The first mounting apparatus and the second mounting apparatus are in the electronic component mounting apparatus having the structure described in claim 1.

This invention is an electronic component mounting method in which an electronic component is temporarily crimped to a side portion of a substrate at a temporary crimping portion, and then the electronic component is finally crimped at a final crimping portion.
It has a plurality of mounting tables arranged at a predetermined interval and supplied with a substrate, and temporarily press-bonds the electronic component to the substrate supplied to the mounting table facing the temporary pressing portion among the plurality of mounting tables. And a process of
A step of finally press-bonding the electronic component when the substrate on which the electronic component is temporarily pressed in the temporary press-bonding portion is supplied to the mounting table facing the main press-bonding portion;
The substrate transfer means having a plurality of suction portions provided at the same intervals as the plurality of placement tables is driven up and down and reciprocated at the same pitch as the placement intervals of the placement tables in the arrangement direction of the plurality of placement tables. Mounting the electronic component comprising: a step of simultaneously taking out the substrates supplied and placed on the plurality of placement tables by the plurality of suction units and then simultaneously transferring them to the adjacent placement tables. Is in the way.

  According to the present invention, the substrate transfer means provided with the plurality of suction portions at the same interval as the arrangement intervals of the plurality of placement tables is driven up and down and reciprocated in the arrangement direction of the plurality of placement tables. Thus, the substrates supplied and placed on the plurality of placement tables are simultaneously transferred.

  In other words, the substrate transfer means is driven in the descending direction, and the substrates placed on the plurality of placement tables are simultaneously sucked by the plurality of suction portions and then lifted, and then placed in the arrangement direction of the plurality of placement tables. By driving, the substrate held in each suction portion was transferred to the adjacent mounting table.

  Therefore, the transfer of the substrate to a plurality of mounting tables is transferred with the same accuracy as the reciprocating drive accuracy of the substrate transfer means, so that variation in the substrate transfer accuracy for each mounting table is prevented. In addition, since a plurality of substrates can be transferred simultaneously by driving only one substrate transfer means, the configuration can be simplified and the work efficiency can be improved.

The top view of the mounting apparatus which shows one embodiment of this invention. The front view of the mounting apparatus shown in FIG. The top view which shows the mechanism until it cuts out TCP from a carrier tape and supplies it to a board | substrate. The side view of the mechanism shown in FIG. The side view which shows the part which divides | segments a long adhesive tape according to the length of TCP among the mechanisms used for FIG. (A) is a top view of the board | substrate which mounted TCP on the long side, (b) is a top view which mounted TCP on the short side adjacent to the said long side of the board | substrate with which TCP was mounted on the long side.

An embodiment of the present invention will be described below with reference to the drawings.
FIG. 1 is a plan view of a mounting apparatus showing an embodiment of the present invention, and FIG. 2 is a front view of the same. The mounting apparatus includes a base portion 1 having a rectangular planar shape as a main body of the apparatus. A first mounting device 2 is provided on one end side of the base portion 1 in the longitudinal direction, and a second mounting device 3 is provided on the other end side.

  On the one end side in the longitudinal direction of the base portion 1 and on the front end side in the front-rear direction orthogonal to the longitudinal direction, the first to fifth mountings in which the planar shape constituting the first mounting device 2 is rectangular. Tables 5 to 9 are provided at predetermined intervals.

  The first mounting table 5 and the fifth mounting table 9 have a smaller planar shape than the second to fourth mounting tables 8, and these mounting tables 5 and 9 are shown in the figure. The X, Y, and θ drive mechanisms that are not driven are driven in the X and Y directions that are horizontal, the Z direction that is the vertical direction, and the θ direction that rotates in the horizontal direction around the axis perpendicular to the horizontal plane. Yes.

  The second to fourth placement tables 6 to 8 are driven in the ± Y direction in the horizontal direction and the Z direction which is the vertical direction by a Y and Z drive mechanism (not shown). The ± X direction and ± Y direction are indicated by arrows in FIG. That is, the X direction is a direction along the longitudinal direction of the base portion 1, and the Y direction is a direction along the front-rear direction.

  On the upper surface of the first mounting table 5, a rectangular substrate W larger than the mounting table 5 is supplied and mounted from a previous process by a robot (not shown). When the substrate W is delivered from the previous process to the first placement table 5, the first placement table 5 matches the center position O with the delivery position indicated by D in FIG. In addition, the two sides along the X direction and the two sides along the Y direction are positioned and supplied so as to be parallel to the X direction and the Y direction, respectively.

  The first mounting table 5 on which the substrate W is supplied and mounted on the upper surface is positioned so that the long side parallel to the X direction of the substrate W coincides with the reference position S, as shown by the solid line in FIG. The substrate W supplied to the second to fifth placement tables 6 to 9, that is, the first placement table 5 is supplied with its center aligned with the center position O of the first placement table 5. As the substrate W placed is sequentially transferred to the second to fifth placement tables 6 to 9 as will be described later, the length of the substrate W supplied and placed on these upper surfaces is parallel to the X direction. The side is positioned so as to coincide with the reference position S and waits.

  The fifth mounting table 9 is rotated 90 degrees in the clockwise direction indicated by the arrow in the figure from the standby state in which the long side parallel to the X direction of the substrate W is aligned with the reference position S. The short side adjacent to the long side is positioned so as to coincide with the reference position S. Meanwhile, the center position of the fifth mounting table 9 is displaced from O1 to O which coincides with the delivery position D. The center positions O1 and O of the fifth placement table 9 coincide with the center position of the substrate W.

  The first to fifth placement tables 5 to 9 are based on one side of the substrate W supplied and placed on the first placement table 5 and the fifth placement table 9 as shown in FIG. In the state of being positioned so as to coincide with the position S, the pitch interval P is the same.

  A first substrate transfer means 11 shown in FIG. 2 is arranged above the first to fifth placement tables 5 to 9. The first substrate transfer means 11 includes a movable body 12 having a length dimension extending over four mounting portions arranged side by side. The movable body 12 is moved in the X direction and the Z direction by a first X / Z drive mechanism 13. It is designed to reciprocate in the direction.

  Four connecting members 14 are suspended from the lower surface of the movable body 12 at the same interval as the arrangement interval P of the mounting parts, and the lower ends of the connecting members 14 have substantially the same size as the substrate W. The first to fourth mounting plates 15a to 15d having a rectangular shape are connected and fixed to the center of the upper surface. A plurality of suction pads 16 constituting a suction portion are provided in a matrix on the lower surface of each mounting plate 15.

  Note that a suction pump is connected to each suction pad 16 via a suction tube (not shown), and a suction force is generated by the suction pump so that the upper surface of the substrate W can be sucked. In the middle of the suction tube, for example, an open valve (not shown) is provided. By opening the open valve, the suction force generated on the suction pad 16 can be removed and the suction holding state of the substrate W can be released. ing.

  The first substrate transfer means 11 having the above-described configuration is configured such that the movable body 12 is reciprocated in the X direction and the Z direction by the first X / Z drive mechanism 13, so that the robot in the previous process is moved to The substrate W supplied and placed on the first placement table 5 can be sequentially transferred from the first placement table 5 to the second to fifth placement tables 6 to 9.

  That is, when the movable body 12 is driven downward in the Z direction with the substrate W placed on the first placement table 5, the substrate W placed on the first placement table 5 is moved. The body 12 is sucked and held by a suction pad 16 provided on the first mounting plate 15a facing the first mounting table 5 of the body 12. If the movable body 12 rises in this state, the substrate W is taken out from the first placement table 5.

  As shown in FIG. 2, the raised movable body 12 is moved by 1 pitch P in the + X direction indicated by the arrow by the first X / Z drive mechanism 13, and the first mounting plate 15 a is moved to the second placement table 6. Opposite to.

  Next, the movable body 12 is lowered to supply the substrate W held by the suction pad 16 to the first mounting plate 15a to the upper surface of the second mounting table 6, and then the suction state of the substrate W is released. Then, the substrate W can be transferred from the first mounting table 5 to the second mounting table 6 located adjacent thereto.

  While the first substrate transfer means 11 takes out the substrate W from the first mounting table 5, transfers it to the second mounting table 6, and returns to the original position, the first mounting table 5 In the transfer position D, a new substrate W is supplied and mounted from the previous process.

  In this way, when the transfer of the substrate W of the first mounting table 5 to the second mounting table 6 is completed, the movable body 12 is lifted and then is in the direction opposite to the previous + X direction. -P pitch P drive in the -X direction. Thereby, the first mounting plate 15 a provided on the movable body 12 is positioned so as to face the upper side of the first mounting table 5.

  Next, the movable body 12 is driven in the downward direction so that the substrates W supplied and placed on the first placement table 5 and the second placement table 6 are respectively applied to the first attachment plate 15a and the second attachment plate 15b. It is sucked and held by the provided suction pad 16.

  After the suction, the movable body 12 is driven in the upward direction and then driven by 1 pitch P in the + X direction. As a result, the first mounting plate 15 a is positioned and positioned above the second mounting table 6, and the second mounting plate 15 b is positioned and positioned above the third mounting table 7.

  Next, when the movable body 12 is lowered, the substrate W sucked and held on the first mounting plate 15a is put on the second mounting table 6 and the substrate W sucked and held on the second mounting plate 15b is put on the first. 3 to the loading table 7.

  By repeating such an operation, the substrate W supplied to the first placement table 5 is sequentially transferred to the second to fifth placement tables 6 to 9. Then, with the substrate W placed on the first to fourth placement tables 5 to 8, the movable body 12 moves up and down and reciprocates in the X direction as described above, so that each placement table. The substrates W supplied and placed on 5 to 9 are transferred to the placement tables located next to each other.

  The substrate W transferred from the fourth mounting table 8 to the fifth mounting table 9 is transferred to the second mounting apparatus 3 as described later.

  The first mounting apparatus 2 includes a plurality of provisional pressure bonding portions in the back and forth direction along the Y direction of the second mounting table 6, that is, in the + Y direction shown in FIG. 1, in this embodiment. Two temporary press-bonding heads 21 are provided so as to be driven in the X and Y directions by X, Y, Z, and θ drive sources 22 (shown in FIG. 4).

  In the + Y direction further than the temporary press-bonding head 21, the first punching device 25A and the second punching device 25B for punching the TCP 24 as the electronic component from the carrier tape 23 as shown in FIGS. They are arranged symmetrically with respect to the X direction about the direction.

  The first punching device 25A and the second punching device 25B are operated alternately, and the TCP 24 punched by one punching device 25A or 25B is received by a pair of first delivery means 26A, 26B.

  That is, when the TCP 24 is punched by the first punching device 25A, the second punching device 25B stands by, and when the TCP 24 is punched from the carrier tape 23 supplied to the first punching device 25A, The second punching device 25B is operated, and a new portion of the carrier tape 23 is supplied to the first punching device 25A. Thereby, the TCP 24 punched from the carrier tape 23 is alternately supplied to the pair of first delivery means 26A and 26B.

  As shown in FIG. 4, the first and second punching devices 25A and 25B have an upper die 31 having a punch 31a on the lower surface and a through hole 32a into which the punch 31a is inserted. A mold 32 is provided. The upper mold 31 is driven by a drive source 33 in the Z direction, which is the vertical direction indicated by the arrow.

  The carrier tape 23 is unwound from a supply reel 34, changed in direction by a plurality of guide rollers 35, and partially guided to run along the upper surface of the lower mold 32 and taken up on a take-up reel 36. It is supposed to be.

  A protective tape 37 that protects the carrier tape 23 is wound around the supply reel 34 so as to overlap the carrier tape 23. The protective tape 37 fed from the supply reel 34 together with the carrier tape 23 is separated from the carrier tape 23, and is wound around the take-up reel 36 together with the carrier tape 23 from which the TCP 24 is punched by the punching devices 25A and 25B. It is like that.

  The TCP 24 received by one of the first delivery means 26A is transported to the first index means 38A and is received by the holding head 39 provided in the first index means 38A.

  The TCP 24 received by the other first delivery means 26B is transported to the second index means 38B and received by the holding head 39 provided in the second index means 38B.

  The first and second index means 38A, 38B have an index table 42 that is intermittently rotated at 90 ° intervals in the circumferential direction by a first θ drive source 41 as shown in FIG. A plurality of holding heads 39 are provided on the lower surface of each index table 42 at intervals of 90 degrees in the circumferential direction.

  Thereby, the TCP 24 transported by the pair of first delivery means 26A, 26B is sucked and held by the holding heads 39 of the index means 38A, 38B. That is, the TCP 24 is delivered from the first delivery means 26A, 26B to the holding head 39 of the index means 38A, 38B.

  A receiving position at which the holding head 39 of the index means 38A, 38B receives the TCP 24 is indicated by A in FIG. The rotation direction of each index table 42 is reverse as shown by the arrows.

  The TCPs 24 punched by the first and second punching devices 25A and 25B are alternately received by the receiving tools 44 of the delivery means 26A and 26B. This receiver 44 is provided on a Y table 45 driven in the Y direction indicated by an arrow in FIG. 4, that is, along the front-rear direction of the base portion 1, so that it can be driven by the Zθ drive source 43 in the θ direction that is the Z direction and the rotation direction. It has been. The Y table 45 is movably provided on a Y guide body 46 provided along the Y direction, and can be driven along the Y guide body 46 by a linear motor (not shown).

  When receiving the TCP 24 from the first punching device 25A, the receiving tool 44 of the first delivery means 26A is driven in the front-rear direction of the base portion 1 indicated by the arrow Y in FIG. Of the four holding heads 39, one end of the TCP 24 held on the upper surface of the receiver 44 is provided on the lower surface of the index table 42 of the first index means 38A at intervals of 90 degrees in the circumferential direction. It is positioned so as to face the lower side of the holding head 39 positioned at A.

  Similarly, when receiving the TCP 24, the receiving tool 44 of the other first delivery means 26B receives four holding heads 39 provided at intervals of 90 degrees in the circumferential direction on the lower surface of the index table 42 of the second index means 38B. Of these, the holding head 39 positioned at the receiving position A is positioned to face the lower side.

  The positioned receiver 44 is driven in the upward direction by a Zθ drive source 43 shown in FIG. As a result, the TCP 24 held by the holder 44 comes into close contact with the lower surface of the holding head 39 provided on the index table 42, and in this state, the TCP 24 is transferred from the holder 44 to the holding head 39 and sucked. Retained.

  When the TCP 24 is delivered to the holding head 39 provided in the index table 42 of the first and second index means 38A, 38B, the pair of index tables 42 are indicated by arrows in FIG. 3 by the first θ drive source 41. Each of them is driven to rotate intermittently at an angle of 90 degrees in the opposite direction shown. Accordingly, the holding head 39 of each index table 42 that holds the TCP 24 by suction is positioned at the cleaning position indicated by B in FIG.

  When the holding head 39 that receives the TCP 24 from the holder 44 is rotated 90 degrees in the circumferential direction together with the index table 42 and positioned at the cleaning position B, the TCP 24 held by the holding head 39 has a terminal portion thereof. Cleaning is performed by a cleaning means (not shown). Thereby, dust adhering to the terminal portion is removed.

  When the terminal portion of the TCP 24 is cleaned, the holding head 39 holding the TCP 24 is rotated 90 degrees in the circumferential direction together with the index table 42 and positioned at the sticking position indicated by C in FIG.

  The TCP 24 positioned at the sticking position C is anisotropically cut by the first and second sticking devices 51 </ b> A and 51 </ b> B to the cleaned terminal part of the TCP 24 to a length corresponding to the terminal part. If it consists of a member, the adhesive tape 52 will be affixed so that it may mention later.

  The first and second indexing means 38A and 38B and the first and second sticking devices 51A and 51B are arranged in the X direction with the Y direction as the center, similarly to the first and second punching devices 25A and 25B. They are arranged symmetrically.

  The first and second indexing means 38A and 38B are arranged outside the first and second punching devices 25A and 25B in the X direction, and the first and second sticking devices 51A and 51B are the first, It is arranged further outward in the X direction than the second index means 38A, 38B.

  The first and second sticking devices 51A and 51B have a supply reel 54 disposed below in the Z direction as shown in FIG. The supply tape 54 is wound with the adhesive tape 52 attached to one side of the release tape 55.

  The adhesive tape 52 adhered to one side surface of the release tape 55 is drawn substantially vertically upward in the Z direction along the plate surface of the strip-like support block 53 from the supply reel 54, and the first guide roller 56, the direction of the adhesive tape 52 is changed in the horizontal direction so that the adhesive tape 52 faces upward.

  As shown in FIG. 5, in a portion where the adhesive tape 52 runs vertically facing the support block 53, a cutter 57 b having two blades is indicated by an arrow by a drive source 57 a such as a cylinder constituting the cutting means 57. By being driven in a direction approaching the adhesive tape 52 shown, two cutting lines 52a are formed on the adhesive tape 52 at predetermined intervals. The amount of cut by the cutter 57b is set so that the release tape 55 to which the adhesive tape 52 is attached is not cut by the cutter 57b.

  The part separated from the other part by the two cutting lines 52 a of the adhesive tape 52, that is, the extraction part 52 b is extracted by the extraction means 59 disposed above the cutting means 57. Thereby, the adhesive tape 52 is separated into a predetermined length, that is, a length corresponding to the TCP 24.

  The extraction means 59 includes a drive source 59a, a pressing portion 59b that is driven in the direction of coming into contact with and separating from the adhesive tape 52 by the drive source 59a, and a removal tape 60 that is pressed against the extraction portion 52b by the pressing portion 59b. Have

  When a part of the removal tape 60 is pressed against the extraction part 52b of the adhesive tape 52 by the pressing part 59b, the extraction part 52b is adhered to the removal tape 60 and removed. The removal tape 60 is fed out from a supply reel (not shown) and is wound up by a predetermined length by a take-up reel (not shown).

  As shown in FIG. 4, the adhesive tape 52 divided into a predetermined length travels in the horizontal direction by the first guide roller 56 together with the release tape 55, and moves with respect to the first guide roller 56. The direction is changed downward by the second guide rollers 61 arranged at predetermined intervals.

  The portion of the release tape 55 between the first guide roller 56 and the second guide roller 61 is used to clean the TCP 24 held by the holding head 39 positioned at the sticking position C of the index table 42. It travels on the lower surface of the terminal portion.

  The release tape 55 is sandwiched by a chuck mechanism 62 that is opened and closed by a driving source (not shown) and reciprocated in the vertical direction indicated by Z in FIG. 4 and is intermittently conveyed by a predetermined length. That is, the portion of the release tape 55 to which the adhesive tape 52 cut to a predetermined length is attached is moved and positioned horizontally below the holding head 39 positioned at the attachment position C by the chuck mechanism 62. It has become so.

  The release tape 55 is intermittently conveyed by the chuck mechanism 62, and the adhesive tape 52 separated into a predetermined length is opposed to the lower part of the terminal portion of the TCP 24 held by the holding head 39 positioned at the attaching position C. Then, the adhesive tape 52 is pressure-bonded to the TCP 24 while being heated by the push-up means 63.

  The push-up means 63 has a pressurizing body 65 that is driven in the upward direction by a drive source 64 such as a cylinder or a linear motor. The pressurizing body 65 includes a heater 65a serving as a heat source. When the pressure member 65 is driven in the upward direction, the pressure member 65 holds the pressure-sensitive adhesive tape 52 separated by a predetermined length via a cushion tape and a release tape 55 (not shown) while heating the pressure-sensitive adhesive tape 52. Pressure is applied to the terminal portion of the TCP 24 held by the head 39.

  In this way, when the adhesive tape 52 is attached to the TCP 24, the release tape 55 is peeled from the adhesive tape 52 by a release roller (not shown). After peeling, the index table 42 is further rotated 90 degrees.

Thereby, the holding head 39 holding the TCP 24 to which the adhesive tape 52 is stuck is positioned at a delivery position indicated by D in FIG. At the same time, the release tape 55 is pulled and moved by the chuck mechanism 62, and a new portion of the adhesive tape 52 cut to a predetermined length is positioned opposite to the TCP 24 at the sticking position C.
The portion of the release tape 55 from which the adhesive tape 52 has been adhered and removed is stored in the collection container 66.

  The TCP 24 having the adhesive tape 52 attached and positioned at the delivery position D is delivered to the pair of second delivery means 71A and 71B shown in FIGS. 3 and 4, and from each of the second delivery means 71A and 71B. It is delivered to the pair of temporary crimping heads 21 as mounting means. The pair of second delivery means 71A and 71B is driven in the Y direction, that is, between the index table 42 and the provisional pressure bonding head 21, by a Y drive mechanism (not shown).

  The temporary press-bonding head 21 that has received the TCP 24 is driven and positioned above the long side on which the TCP 24 of the substrate W supplied and mounted on the second mounting table 6 is mounted as shown in FIG. That is, the temporary press-bonding head 21 is mounted on the substrate W on the basis of the X coordinate of the substrate W positioned by the first substrate transfer unit 11 and the Y coordinate of the substrate W positioned based on the reference position S. The temporary press-bonding head 21 is driven and positioned with respect to the X and Y directions so that the TCP 24 is positioned above.

  Thus, at the same time that the temporary press-bonding head 21 is positioned, the second mounting table 6 is driven in the + Y direction and then driven downward in the Z direction. And the board | substrate W mounted in the upper surface of the 2nd mounting table 6 is positioned so that the lower surface of the long side may be supported by the backup which is not shown in figure. That is, the substrate W is positioned at the temporary pressure bonding position.

  When the TCP 24 sucked and held by the temporary pressure bonding head 21 is positioned above the long side that is the mounting position of the substrate W, the temporary pressure bonding head 21 is driven in the downward direction. Thereby, the TCP 24 sucked and held by the temporary pressure bonding head 21 is temporarily pressure bonded to the upper surface of the end portion on the long side of the substrate W via the adhesive tape 52.

  In this way, an integral multiple of the number of TCPs 24 on which the adhesive tapes 52 are adhered to the upper surface of the side of the substrate W placed on the second placement table 6 by the two temporary crimping heads 21, For example, six TCPs 24 are mounted at predetermined intervals as shown in FIG. That is, the second mounting table 6 is in a temporary pressure bonding position where the TCP 24 is temporarily pressure bonded to the substrate W.

  As shown in FIG. 1, a main press-bonding head 72 constituting a main press-bonding portion that is driven in the vertical direction by a Z drive source (not shown) is provided in the longitudinal direction at a portion facing the rear in the Y direction of the fourth mounting table 8. Are arranged parallel to the X direction. The length dimension of the main pressure bonding head 72 is set slightly longer than the long side of the substrate W.

  The substrate W supplied and mounted on the second mounting table 6 and having a plurality of TCPs 24 temporarily bonded to one side in the longitudinal direction is transferred to the fourth mounting table 8 through the third mounting table 7. When the fourth mounting table 8 is mounted, the one side of the fourth mounting table 8 faces the lower side of the main pressure bonding head 72 from the state where one side of the substrate W in the longitudinal direction is positioned at the reference position S. , Driven in the + Y direction for positioning.

  In this state, the fourth mounting table 8 is driven downward in the Z direction, so that the lower surface of the long side of the substrate W is supported by a backup tool (not shown), and then the main pressure bonding head 72 is moved downward. The plurality of TCPs 24 that are driven and temporarily bonded to the substrate W are pressurized. The main pressure bonding head 72 and the backup tool are provided with a heater (not shown) along the longitudinal direction. Thereby, the TCP 24 is simultaneously pressurized and heated.

  When a plurality of TCPs 24 are pressurized and heated by the main press-bonding head 72, the adhesive tape 52 that temporarily press-bonds the TCPs 24 to the substrate W is melted and cured. As a result, the plurality of TCPs 24 are permanently crimped, that is, mounted on the upper surface of the long side of the substrate W. That is, the fourth mounting table 8 is in the main pressure bonding position.

  In this way, when the TCP 24 is finally pressure-bonded to the long side portion of the substrate W supplied and placed on the fourth placement table 8, the substrate W becomes the first substrate transfer means 11. This is attracted to the suction pad 16 of the fourth mounting plate 15 d provided on the movable body 12 and transferred to the fifth mounting table 9.

  When the substrate W is transferred to the fifth placement table 9, the fifth placement table 9 is rotated 90 degrees clockwise as indicated by an arrow in FIG. 1 so that the long side of the substrate W is in the Y direction. Are driven and positioned in the X and Y directions so that the rotation center O1 is O which coincides with the delivery position D.

  Thus, the substrate W positioned by the fifth mounting table 9 is transferred to the second mounting apparatus 3. As shown in FIG. 1, the second mounting apparatus 3 includes sixth to ninth mounting tables 73 to 73 arranged at equal intervals on the base portion 1 at a predetermined pitch P along the X direction. 76. The arrangement pitch P of the sixth to ninth placement tables 73 to 76 is set to be the same as the arrangement pitch P of the first to fifth placement tables 5 to 9.

  The sixth to eighth placement tables 73 to 75 are driven in the Y direction in the horizontal direction and the Z direction which is the vertical direction by a Y and Z drive mechanism (not shown). The sixth to eighth placement tables 73 to 75 are positioned and stand by so that the short sides parallel to the X direction of the substrate W supplied and placed on these upper surfaces coincide with the reference position S. .

  The ninth mounting table 76 is fixedly arranged without being driven in the Y direction and the Z direction like the other mounting tables 73 to 75. The substrate W transferred from the eighth placement table 75 to the ninth placement table 76 as will be described later has a short side parallel to the X direction coincident with the reference position S and the substrate W. , That is, the centers of the sixth to ninth mounting tables 73 to 76 coincide with the delivery position D.

  As shown in FIG. 2, a second substrate transfer means 78 is provided above the sixth to ninth placement tables 73 to 76. Similar to the first substrate transfer means 11, the second substrate transfer means 78 has a movable body 81 driven in the X and Z directions by the second X / Z drive mechanism 79. Four connecting members 82 are provided on the lower surface of the body 81 at intervals of the pitch P.

  First to fourth mounting plates 83a to 83d are horizontally provided at the lower end of each connecting member 82, and a plurality of suction pads 84 as suction portions are provided in a matrix on the lower surface of each mounting plate 83a to 83d. ing. The suction pad 84 is connected to a suction pump (not shown) through a suction tube (not shown). Accordingly, a suction force is generated in the suction pad 84, and the substrate W can be sucked and held by the suction force.

  The suction force generated in the suction pad 84 can be removed by an appropriate means such as an open valve. Thereby, the holding state of the substrate W sucked and held by the suction pad 84 can be released.

  The movable body 12 of the first substrate transfer means 11 of the first mounting device 2 and the movable body 81 of the second substrate transfer means 78 of the second mounting device 3 are synchronously driven and positioned. Is done.

  That is, when the first to fourth mounting plates 15a to 15d of the first substrate transfer means 11 are positioned in the X direction so as to face the first to fourth mounting tables 5 to 8, The first to fourth mounting plates 83a to 83d of the second substrate transfer means 78 are positioned in the X direction so as to face each other above the fifth to eighth mounting tables 9, 73 to 75.

  The fifth mounting table 9 is indicated by a chain line in FIGS. 1 and 2, and the fifth mounting table 9 at this time has its center position changed from O1 to O as shown in FIG. And the θ direction.

  On the upper surface of the fifth mounting table 9, a substrate W having a TCP 24 permanently bonded to its long side is mounted as shown in FIG. 6A, and the substrate W is indicated by a chain line in FIG. The short side is positioned so as to coincide with the reference position S.

  In such a state, when the movable body 81 of the second substrate transfer means 78 is driven in the downward direction, the substrate W on the fifth placement table 9 is provided on the first mounting plate 83a. It is sucked by the suction pad 84.

  Next, the movable body 81 of the second substrate transfer means 78 is raised and driven by 1 pitch P in the + X direction, and the first mounting plate 83a that sucks and holds the substrate W is located above the sixth placement table 73. Is positioned. Next, the movable body 81 is driven in the downward direction. As a result, the substrate W placed on the fifth placement table 9 is transferred to the sixth placement table 73.

  Thereafter, the movable body 81 of the second substrate transfer means 78 is raised and then driven by 1 pitch P in the −X direction opposite to the previous direction, and the first mounting plate 83a is moved to the fifth placement table 9. Is positioned above.

  By repeating such an operation, the substrate W having the TCP 24 bonded to the long side and transferred to the fifth mounting table 9 is sequentially transferred to the sixth to ninth mounting tables 76. Will be posted. At this time, the short side located on the + Y direction side of the substrate W is positioned at the reference position S and transferred to the sixth to ninth placement tables 76.

  In the + Y direction behind the sixth placement table 73, a pair of temporary pressure bonding heads 86 for temporarily pressure bonding the TCP 24 to the short side of the substrate W are provided. The provisional pressure bonding head 86 is driven in the X, Y, and Z directions.

  The TCP 24 is delivered to the temporary pressure bonding head 86. Since the mechanism for delivering the TCP 24 to the provisional pressure bonding head 86 is performed by the same mechanism as that of the first mounting apparatus 2, description thereof is omitted. In FIG. 1, the same symbols are attached to the same parts as the mechanism of the first mounting apparatus 2.

  In the + Y direction behind the eighth placement table 75, a main pressure bonding head 87 is provided for final pressure bonding the TCP 24 temporarily bonded to the short side of the substrate W. The mechanism for finally press-bonding the TCP 24 temporarily bonded to the substrate W by the main press-bonding head 87 is also the same as that of the first mounting apparatus 2, so the same portions are denoted by the same reference numerals and description thereof is omitted.

  Then, the substrate W on which the TCP 24 is finally pressure-bonded on the short side and transferred to the ninth mounting table 76 is taken out by a robot (not shown) and transferred to the next process.

  The operations in the X direction and the Y direction of the second substrate transfer means 78 of the second mounting apparatus 3 are synchronized with the operations in the X direction and the Y direction of the first substrate transfer means 11 of the first mounting apparatus 2. Driven. Accordingly, the substrate W on which the TCP 24 is mounted on the long side by the first mounting apparatus 2 and transferred to the fifth mounting table 9 is transferred to the second substrate transfer means 78 of the second mounting apparatus 3. It is sucked by the suction pad 84 provided on the first mounting plate 83 a, taken out from the fifth mounting table 9, and transferred to the sixth mounting table 73 of the second mounting apparatus 3.

  As described above, according to the first and second mounting apparatuses 2 and 3 for temporarily press-bonding the TCP 24 to the substrate W and then performing the main-bonding, the plurality of mounting plates 15 a to 15 d and 83 a to 83 d are provided, respectively. The movable bodies 12, 81 of the first and second substrate transfer means 11, 78 are reciprocated in the X direction and the Z direction, so that the first is provided by the suction pads 16, 84 provided on each mounting plate. The substrate W supplied to the first to fifth mounting tables 5 to 9 of the mounting apparatus 2 and the substrate W supplied to the fifth to eighth mounting tables 73 to 75 of the second mounting apparatus 3. Are simultaneously adsorbed and taken out, and then transferred to a placement table located on the + X direction side of the first to fifth placement tables 5 to 9 and the fifth to eighth placement tables 73 to 75. be able to.

  Therefore, in the first mounting apparatus 2, the substrate W supplied and placed on the first placement table 5 is sequentially transferred to the second to fifth placement tables 6 to 9 with the same accuracy. Can do. Similarly, in the second mounting apparatus 3, the substrate W transferred to the fifth mounting table 9 of the first mounting apparatus 2 is transferred to the sixth to ninth mounting tables 73 to 76. It can be transferred sequentially with the same accuracy.

  Therefore, in the first mounting device 2 and the second mounting device 3, the transfer accuracy varies as compared with the case where the transfer of the substrate W between the plurality of mounting tables is performed by separate transfer means. Therefore, the TCP 24 can be temporarily bonded (mounted) to each substrate W with high accuracy.

  In addition, each mounting device 2 and 3 performs the temporary pressure bonding and the main pressure bonding of the TCP 24 to the substrate W only by reciprocating only the movable bodies 12 and 81 of the respective substrate transfer means 11 and 78 in the X direction and the Z direction. Can be done. That is, if a plurality of substrates W are simultaneously taken out from the mounting tables 5 to 8 and 9, 73 to 75 opposed to the mounting plates 15a to 15d and 83a to 83d provided on the movable bodies 12 and 81, the substrates W are removed. It can be transferred to a placement table located adjacent to the + X direction side of the removed placement table.

  Therefore, as compared with the case where the substrates W are transferred to a plurality of mounting tables by separate mechanisms, the overall configuration is simplified by reducing the number of driving sources and mechanisms driven by the driving sources. be able to. In addition, since a plurality of substrates can be transferred at the same time, the transfer can be accurately performed in a short time. Thus, if the transfer accuracy of the substrate W can be improved, the mounting accuracy of the TCP 24 mounted on the substrate W can also be improved.

  Further, the first mounting device 2 and the second mounting device 3 are arranged in a line, and the fifth mounting table 9 of the first mounting device 2 is rotated not only in the horizontal directions X and Y but also in the rotation direction. It can be driven in the θ direction.

Therefore, the first mounting device 2 can rotate the substrate W on which the TCP 24 is mounted on one side of the long side by 90 degrees and deliver it to the second mounting device 3, so that the TCP 24 is mounted on the long side of the substrate W. The TCP 24 can be mounted on the short side adjacent to the long side of the substrate W by the second mounting apparatus 3 continuously to the first mounting apparatus 2.
That is, the TCP 24 can be efficiently mounted on the two sides of the substrate W by arranging the first mounting device 2 and the second mounting device 3 in parallel.

  In the above embodiment, the second to fourth mounting tables of the first mounting apparatus 2 and the sixth to eighth mounting tables of the second mounting apparatus 3 are driven in the Y direction and the Z direction. Although the configuration is adopted, the third mounting table 7 and the seventh mounting table 74 that are not related to the temporary pressure bonding and the main pressure bonding of the TCP may be fixedly provided without being configured to be driven.

In addition, the first mounting device 2 and the second mounting device 3 are arranged in a line, but when TCP is mounted on only one of the four sides of the board, only one of the mounting devices is provided. It's okay. For example, when the TCP is mounted on the substrate only by the first mounting apparatus 2, the fifth mounting table 9
The substrate on which TCP is mounted on one side may be transferred to the next process without rotating in the θ direction.

  In the above-described embodiment, an example in which the TCP 24 is mounted on one long side and one short side of the two long sides and two short sides of the substrate W has been described. You may make it mount in a long side and two short sides. In that case, the sixth mounting table 73 and the eighth mounting table 75 of the second mounting apparatus 3 can be driven in the rotational direction by the θ drive source.

  If the TCP 24 is temporarily crimped to one short side of the substrate W placed on the sixth placement table 73, the sixth placement table 73 is rotated 180 degrees to the other short side. TCP24 is temporarily pressure-bonded.

  If the substrate W on which the TCP 24 is temporarily bonded to the two short sides is transferred from the sixth mounting table 73 to the eighth mounting table 75, the TCP 24 that is temporarily bonded to the other short side of the substrate W. Then, the eighth mounting table 75 is rotated 180 degrees, and the TCP 24 temporarily bonded to one short side of the substrate W may be finally bonded.

  The TCP 24 is bonded to the two short sides of the substrate W so that the tact time required for mounting in the second mounting apparatus 3 becomes longer than the tact time required for mounting in the first mounting apparatus 2. There is a waiting time for transferring the substrate W from the first mounting apparatus 2 to the second mounting apparatus 3.

  In order to solve this problem, another main pressure bonding head 87 is provided at a pitch P interval on the downstream side of the eighth mounting table 75 or the downstream side of the ninth mounting table 76. Then, since the tact time required for mounting the TCP 24 in the first mounting apparatus 2 and the second mounting apparatus 3 can be made substantially the same, the substrate W from the first mounting apparatus 2 to the second mounting apparatus 3 can be made. Can be transferred without waiting time.

  DESCRIPTION OF SYMBOLS 1 ... Base part (apparatus main body), 2 ... 1st mounting apparatus, 3 ... 2nd mounting apparatus, 5-9 ... 1st thru | or 5th mounting table, 11 ... 1st board | substrate transfer means, 12 ... movable body, 13, 79 ... X / Z drive mechanism, 16, 84 ... suction pad (suction part), 21 ... temporary pressure head, 24 ... TCP (electronic component), 73-76 ... sixth to ninth mountings Place table, 78 ... second substrate transfer means, 78 ... second substrate transfer means.

Claims (5)

An electronic component mounting apparatus that temporarily press-bonds an electronic component to a side portion of a substrate and then performs final press-bonding,
The device body;
A plurality of mounting tables that are arranged at predetermined intervals along the longitudinal direction of the apparatus main body and on which the substrate is supplied and mounted;
A temporary press-bonding portion that is arranged to face one mounting table among the plurality of mounting tables and temporarily press-bonds the electronic component to the side portion of the substrate placed on the mounting table;
A main pressure-bonding portion for finally pressure-bonding the electronic component, which is disposed opposite to the other table different from the one table and is temporarily pressure-bonded to the substrate supplied and mounted on the table;
A plurality of suction portions are provided above the plurality of placement tables so as to be able to be driven in the vertical direction and the longitudinal direction of the apparatus body, and a plurality of suction portions are provided on the lower surface at the same intervals as the plurality of placement tables. The substrate that is driven and placed on the plurality of placement tables is simultaneously attracted by the plurality of suction portions and then lifted, and then the substrate held on each suction portion is transferred to the next placement table. An electronic component mounting apparatus comprising: substrate transfer means that is driven and lowered from one longitudinal end of the apparatus main body toward the other end.   Among the plurality of mounting tables, the mounting table provided on one end side in the longitudinal direction of the apparatus main body is driven in the horizontal direction and the rotation direction around the axis perpendicular to the horizontal direction. 2. The electronic component mounting apparatus according to claim 1, wherein the position correction of the substrate placed and mounted is performed before being transferred by the substrate transfer means.   3. The electronic component mounting apparatus according to claim 1, wherein an interval between the temporary press-bonding portion and the main press-bonding portion is set to an integral multiple of a plurality of mounting table intervals. An electronic component mounting apparatus that temporarily press-bonds an electronic component to a side portion of a substrate and then performs final press-bonding,
A first mounting device that temporarily press-bonds an electronic component to one side of the substrate and then press-bonds the electronic component;
A second mounting device that is arranged side by side with the first mounting device and temporarily press-bonds an electronic component to the other side portion adjacent to the one side portion of the substrate;
2. The electronic component mounting apparatus according to claim 1, wherein the first mounting apparatus and the second mounting apparatus have the configuration according to claim 1. An electronic component mounting method in which an electronic component is temporarily crimped to a side portion of a substrate at a temporary crimping portion, and then the electronic component is finally crimped at a final crimping portion,
It has a plurality of mounting tables arranged at a predetermined interval and supplied with a substrate, and temporarily press-bonds the electronic component to the substrate supplied to the mounting table facing the temporary pressing portion among the plurality of mounting tables. And a process of
A step of finally press-bonding the electronic component when the substrate on which the electronic component is temporarily pressed in the temporary press-bonding portion is supplied to the mounting table facing the main press-bonding portion;
The substrate transfer means having a plurality of suction portions provided at the same intervals as the plurality of placement tables is driven up and down and reciprocated at the same pitch as the placement intervals of the placement tables in the arrangement direction of the plurality of placement tables. Mounting the electronic component comprising: a step of simultaneously taking out the substrates supplied and placed on the plurality of placement tables by the plurality of suction units and then simultaneously transferring them to the adjacent placement tables. Method.

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