JP2012034944A - Method for manufacturing mold to make fine needle, and method for fabricating fine needle - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a method for producing a mold and a method for producing a fine needle for producing a fine needle having a complicated shape.
A step of fixing a needle model 100 made of silicon having a sharp tip portion 130 to a silicon substrate 140, and depositing a mold material on a surface side of the silicon substrate 140 to which the needle model 100 is fixed. And removing the silicon substrate 140 and the needle model 100.
[Selection] Figure 1

Description

  The present invention relates to a mold manufacturing method and a microneedle manufacturing method for manufacturing a fine needle, and more particularly, a mold manufacturing method and a microneedle manufacturing method for manufacturing a microneedle having a complicated shape. About.

  In blood collection from a human body, a solid metal solid needle (lancet) may be used. In blood collection, a minute amount of bleeding is caused by piercing the skin with a needle, and this is blotted with a test paper.

  The current needle is relatively thick with a diameter of approximately 300 μm or more. Therefore, blood sampling is accompanied by pain and fear because it is difficult to avoid pain points on the skin. In the medical field, a minimally invasive lancet is strongly desired.

  A technique is known in which a mold is manufactured by performing an etching process on a silicon substrate, and a fine metal part is manufactured using the mold (for example, Non-Patent Document 1). In order to obtain a finer needle, it is considered to make a fine needle using this technique. In addition, a technique for producing a fine needle in a direction perpendicular to the silicon substrate surface is known.

Hiroyuki Fujita, Satoshi Konishi, Masayoshi Esashi, Kazuo Sato, Akiaki Katsube, Ichisuke Maenaka, “EE Text Sensor Micromachine Engineering”, Ohm Co., Ltd., October 5, 2005, 1st edition, pages 76 and 77

  When a fine needle is produced using the technique described in Non-Patent Document 1, a resist material subjected to mask treatment is exposed to ultraviolet light or X-rays and developed to produce a mold. In this method, the resist is etched in a direction perpendicular to the substrate surface. Therefore, it is difficult to produce a fine needle having a complicated shape.

  When producing fine needles perpendicular to the silicon substrate, the needles are produced using dry etching or the like. Even in dry etching, it is difficult to produce a fine needle having a complicated shape.

  This invention makes it a subject to provide the manufacturing method of the casting_mold | template for manufacturing the fine needle which has a complicated shape, and the manufacturing method of a fine needle in view of such a situation.

  A method for producing a mold for producing a fine needle according to the present invention includes a step of fixing a needle model made of silicon to a silicon substrate having a sharp tip, and a surface on which the needle model of the silicon substrate is fixed Depositing a mold material on the side and removing the silicon substrate and the needle model.

  According to such a configuration, silicon is used for the needle model. The needle model is formed in a complicated shape in advance and then fixed to the silicon substrate. That is, the needle model is formed into a shape having a sharp tip and then fixed to the silicon substrate.

  A mold material is deposited on the side of the silicon substrate on which the needle model is fixed. The mold material is deposited to the extent that it covers the needle model. After the mold material is deposited, the silicon substrate and needle model are removed. The shape of the needle model is transferred to the mold material, and the mold material becomes a mold for a fine needle.

  Further, the step of depositing the mold material on the surface side of the silicon substrate with the needle model fixed includes the step of forming an electrode layer on the surface side of the silicon substrate with the needle model fixed, and using the electrode layer to form the mold material. Depositing.

  According to such a configuration, the electrode layer is formed on the surface side on which the needle model of the silicon substrate is fixed. The silicon substrate is immersed in an aqueous solution containing a metal as a mold material. By performing electrolytic plating using the electrode layer, the mold material is deposited on the surface side of the silicon substrate on which the needle model is fixed.

  In addition, the method for producing a fine needle is characterized by being produced by filling a mold produced by the above-described method for producing a mold for producing a fine needle with a needle material.

  As described above, according to the method for producing a mold and the method for producing a fine needle for producing a fine needle according to the present invention, there is an excellent effect that a fine needle having a complicated shape can be produced.

The schematic of the manufacturing process of the casting_mold | template for producing the fine needle | hook concerning one Embodiment of this invention is shown. 1A is a perspective view of a needle model, FIG. 1B is a perspective view of a silicon substrate on which an electrode layer is formed by fixing the needle model, and FIG. 1C is silicon on which a mold material is deposited. The perspective view of a board | substrate and FIG.1 (d) show the perspective view of the casting_mold | template material which removed the silicon substrate. The schematic of the process of fixing a needle model to the silicon substrate concerning the embodiment is shown. 2A is a side view of the silicon substrate, FIG. 2B is a side view of the silicon substrate coated with HMDS (hexamethyldisilazane), and FIG. 2C is a silicon substrate coated with a resist. A side view, FIG.2 (d) shows the side view of the silicon substrate which fixed the needle model. The schematic of the process of depositing the casting_mold | template material which concerns on the embodiment is shown. FIG. 3A is a schematic view of depositing an electrode layer by sputtering, and FIG. 3B is a side view of a silicon substrate on which a template material is deposited by electrolytic plating. The schematic of the process of removing the silicon substrate which concerns on the same embodiment is shown. An upper view of a manufactured mold concerning the embodiment is shown. The enlarged view in the needle mold part of the manufactured mold concerning the embodiment is shown. The schematic of the production process of the fine needle concerning the embodiment is shown. FIG. 7A shows a schematic view of an injection molding machine for producing a fine needle by injection molding into a mold. FIG. 7B shows a schematic view of a fine needle produced by removing the template. The enlarged view of the produced microneedle front-end | tip part which concerns on the same embodiment is shown. FIG. 8A shows an upper view of the tip portion of the fine needle, and FIG. 8B shows a side view of the tip portion of the fine needle. The dimension of the produced fine needle concerning the embodiment is shown. FIG. 9A shows dimensions in the upper view of the fine needle, and FIG. 9B shows dimensions in the side view of the fine needle. The perspective view of the other needle model concerning the embodiment is shown. The perspective view of the further another needle model concerning the embodiment is shown.

  Hereinafter, an embodiment of a method for producing a mold for producing a fine needle and a method for producing a fine needle according to the present invention will be described with reference to FIGS.

  The manufacturing method of the mold 160 and the manufacturing method of the microneedle 770 for manufacturing the microneedle 770 in this embodiment are roughly divided into a process of manufacturing the mold 160 and a process of manufacturing the microneedle 770. A method of manufacturing the mold 160 for producing the fine needle 770 includes a step of fixing the needle model 100 having a sharp tip portion 130 formed of silicon to the silicon substrate 140, and a method of fixing the needle model 100 of the silicon substrate 140. The method includes a step of forming the electrode layer 150 on the fixed surface side, a step of depositing a mold material on the surface side of the silicon substrate 140 on which the needle model 100 is fixed, and a step of removing the silicon substrate 140 and the needle model 100. The manufacturing method of the fine needle 770 includes a step of filling a needle material and a step of removing the mold 160.

  FIG. 1 shows a schematic view of a manufacturing process of a mold for producing a fine needle according to an embodiment of the present invention. 1A is a perspective view of a needle model, FIG. 1B is a perspective view of a silicon substrate on which an electrode layer is formed by fixing the needle model, and FIG. 1C is silicon on which a mold material is deposited. The perspective view of a board | substrate and FIG.1 (d) show the perspective view of the casting_mold | template material which removed the silicon substrate.

  The needle model 100 includes a holder part 110 and a needle part 120. The needle part 120 has a midway part 125 and a tip part 130. Needle model 100 is formed of silicon. The needle model 100 is sharpened using, for example, electrolytic etching. The needle model 100 is formed using silicon.

  When the tip portion of the needle model 100 is sharpened using electrolytic etching, the needle model 120 is immersed in a 10% aqueous solution of hydrogen fluoride as the anode. Another silicon is used as the cathode. The tip 130 is formed by applying a voltage between the anode and the cathode. The tip 130 is sharpened by applying a voltage of 200 V between the anode and the cathode.

  A needle model 100 made of silicon having a sharp tip is fixed to a silicon substrate 140. The silicon substrate 140 is prepared separately from the needle model 100. The needle model 100 is fixed using a wafer bonding technique. For example, the needle model 100 is fixed using an adhesive. A negative resist (manufactured by Tokyo Ohka Kogyo Co., Ltd., OMR (registered trademark)) is used as the adhesive.

  An electrode layer 150 is formed on the surface of the silicon substrate 140 on which the needle model 100 is fixed. The electrode layer 150 may be Fe—Ni (iron / nickel alloy). Further, it may be Cr—Au (gold / chromium alloy). In the present embodiment, the electrode layer 150 is described as Fe—Ni.

  A mold material is deposited on the surface of the silicon substrate 140 on which the needle model 100 is fixed. The mold material eventually becomes the mold 160. The mold material may be Ni. The template material is deposited using the electrode layer 150. For example, the template material is deposited by electrolytic plating using the electrode layer 150 as an electrode.

  When depositing the template material using electrolytic plating, the silicon substrate 140 is immersed in an aqueous sulfamic acid solution as a cathode. Ni is used as the anode. The aqueous sulfamic acid solution is heated by a heater.

  After depositing the mold material, the silicon substrate 140 and the needle model 100 are removed. For example, the silicon substrate 140 and the needle model 100 are removed by being immersed in an aqueous KOH solution. The mold 160 is completed by etching the silicon substrate 140 and the needle model 100.

  The mold 160 includes a portion to which the needle model 100 is transferred in a concave shape. The mold 160 includes a holder mold part 170 corresponding to the holder part 110 and a needle mold part 180 corresponding to the needle part 120. The needle mold part 180 includes a midway mold part 185 corresponding to the midway part 125 and a tip mold part 190 corresponding to the tip part 130.

  FIG. 2 shows a schematic view of a process of fixing the needle model to the silicon substrate according to the embodiment. 2A is a side view of the silicon substrate, FIG. 2B is a side view of the silicon substrate coated with HMDS (hexamethyldisilazane), and FIG. 2C is a silicon substrate coated with a resist. A side view, FIG.2 (d) shows the side view of the silicon substrate which fixed the needle model.

  The silicon substrate 140 has an appropriate thickness. For example, the silicon substrate 140 has a thickness of 500 μm. The silicon substrate 140 is fixed to the spin coating apparatus 210. The spin coating apparatus 210 rotates the silicon substrate 140. The HMDS layer 220 is formed by applying HMDS on the rotated silicon substrate 140. The HMDS layer 220 functions as an adhesion aid when a resist material is applied to the silicon substrate 140.

  The resist layer 230 is formed on the HMDS layer 220. The resist layer 230 is formed by applying OMR (registered trademark) on the HMDS layer 220. Table 1 shows the rotation conditions of the spin coating apparatus 210 when the HMDS layer 220 is formed and when the resist layer 230 is formed.

  The silicon substrate 140 is removed from the spin coating apparatus 210. The silicon substrate 140 is placed on the heater 240. The needle model 100 is placed on the resist layer 230. Needle model 100 is fixed using silicon substrate 140 and wafer bonding technology. For example, the heater 240 is fixed by baking the silicon substrate 140 and the needle model 100 at 145 ° C. for 5 minutes.

  FIG. 3 shows a schematic diagram of a process of depositing a mold material according to the embodiment. FIG. 3A is a schematic view of depositing an electrode layer by sputtering, and FIG. 3B is a side view of a silicon substrate on which a template material is deposited by electrolytic plating.

  The silicon substrate 140 is inserted into the sputtering apparatus 310 after the needle model 100 is fixed. The sputtering apparatus 310 forms the electrode layer 150 on the surface side of the silicon substrate 140 on which the needle model 100 is fixed. For example, the sputtering apparatus 310 deposits Fe—Ni on the needle model 100 and the silicon substrate 140 by sputtering.

  After the electrode layer 150 is formed, the silicon substrate 140 is immersed in an aqueous sulfamic acid solution. The electrode layer 150 is used as a cathode. Ni is used as an anode. The aqueous sulfamic acid solution is heated by a heater. The electrode layer 150 deposits Ni as a template material by electrolytic plating. The silicon substrate 140 is deposited with Ni as a mold material until the thickness becomes 300 μm. The mold material eventually becomes the mold 160. Note that the electrode layer 150 may be formed by MOCVD (metal organic chemical vapor deposition). Table 2 shows the sputtering conditions. In this embodiment, a case where Fe—Ni is sputtered by DC sputtering is shown.

  FIG. 4 shows a schematic view of a process of removing the silicon substrate according to the embodiment. The silicon substrate 140 on which the mold material is deposited is immersed in an aqueous KOH solution. The silicon substrate 140 and the needle model 100 are etched by being immersed in a KOH (potassium hydroxide) aqueous solution. The mold 160 is completed by etching the needle model 100 and the silicon substrate 140. For example, the silicon substrate 140 is immersed in an aqueous solution of KOH 20% 40 g and water 160 ml. The heater 410 is immersed in a KOH aqueous solution at 72 ° C. for 8 hours. For the purpose of preventing evaporation of the KOH aqueous solution, it is preferable to mix an IPA (isopropyl alcohol) solution. Table 3 shows the components of the KOH aqueous solution.

  FIG. 5 shows an upper view of the manufactured mold according to the embodiment. FIG. 6 shows an enlarged view of the needle mold portion of the manufactured mold according to the embodiment.

  Corresponding to FIG. 1 (d), as shown in FIG. 5, the mold 160 includes a groove shaped like the shape of the needle model 100. The mold 160 includes a holder mold part 170 corresponding to the holder part 110 and a needle mold part 180 corresponding to the needle part 120. The needle mold part 180 includes a midway mold part 185 corresponding to the midway part 125 and a tip mold part 190 corresponding to the tip part 130.

  When the needle model 100 is fixed to the silicon substrate 140, the distal end portion 130 is fixed at a position where it does not come into contact with the silicon substrate 140 by having a sharp shape. When electrolytic plating is performed on the silicon substrate 140, the mold metal is also deposited between the tip portion 130 and the silicon substrate 140. Thereafter, when the silicon substrate 140 is removed, as shown in FIG. 6, the tip mold part 190 becomes concave in the direction toward the longitudinal direction of the midway mold part 185.

  That is, the tip mold portion 190 has a concave shape with the bottom corresponding to the tip of the tip portion 130 in the direction of the longitudinal direction of the midway mold portion 185. Further, the tip mold portion 190 has a concave shape having an inclination corresponding to the inclination from the portion connected to the midway portion 125 of the tip portion 130 to the tip of the tip portion 130. Therefore, the tip mold portion 190 has a structure having a cantilevered roof on the surface of the mold 160 where the removed silicon substrate 140 was present.

  FIG. 7 shows a schematic view of a manufacturing process of the fine needle according to the embodiment. FIG. 7A shows a schematic view of an injection molding machine for producing a fine needle by injection molding into a mold. FIG. 7B shows a schematic view of a fine needle produced by removing the template.

  The injection molding machine 700 includes an upper mold 710, a lower mold 720, a runner portion 740, and a plunger 750. The lower shape 720 includes a housing portion 730 that houses the mold 160. The upper mold 710 has a runner portion 740 serving as a through hole for filling the mold 160 with the needle material. The plunger 750 fills the mold 160 with a needle material to produce a fine needle.

  The mold 160 is accommodated in the accommodating portion 730. The mold 160 is pressed by the upper mold 710 and the lower mold 720. The runner portion 740 is filled with pellets 760 serving as a needle material. The plunger 750 pressurizes the pellet 760 filled in the runner portion 740. The plunger 750 pressurizes the pellet 760 to fill the mold 160 with the pellet 760. The pellet 760 is filled in the holder mold part 170 and the needle mold part 180 formed in the mold 160. The pellet 760 forms a fine needle 770.

  Pellets 760 can be polymeric polymers, biopolymers, proteins, and biocompatible inorganic materials. Examples of polymer polymers include, but are not limited to, polyvinyl chloride, polyethylene glycol, parylene, polyethylene, polypropylene, silicone, polyisoprene, polymethyl methacrylate, fluororesin, polyetherimide, polyethylene oxide, polyethylene terephthalate, polyethylene. Succinate, polybutylene terephthalate, polybutylene succinate, polybutylene succinate carbonate, polyphenylene oxide, polyphenylene sulfide, polyformaldehyde, polyanhydride, polyamide (6 nylon, 66 nylon), polybutadiene, polyvinyl acetate, polyvinyl alcohol , Polyvinylpyrrolidone, polyesteramide, polymethyl methacrylate, polyacrylonitrile Polysulfone, polyethersulfone, ABS resin, polycarbonate, polyurethane (polyether urethane, polyester urethane, polyether urethane urea), polyvinylidene chloride, polystyrene, polyacetal, polybutadiene, ethylene vinyl acetate copolymer, ethylene vinyl alcohol copolymer , Ethylene propylene copolymer, polyhydroxyethyl methacrylate, polyhydrobutyrate, polyorthoester, polylactic acid, polyglycol, polycaprolactone, polylactic acid copolymer, polyglycolic acid / glycol copolymer, polycapronolactone co Polymer, polydioxanone, perfluoroethylene-propylene copolymer, cyanoacrylate polymer, polybutylcyanoacrylate, polyallyl ether ketone, Carboxymethyl resins, polyester resins, polyimides, phenol resin).

  Examples of the biopolymer include cellulose, starch, chitin / chitosan, agar, carrageenan, alginic acid, agarose, bull run, mannan, curdlan, xanthan gum, gellan gum, pectin, xyloglucan, guar gum, lignin, oligosaccharide, hyaluron. Contains acid, schizophyllan, lentinan, etc. Protein includes collagen, gelatin, keratin, fibroin, glue, sericin, vegetable protein, milk protein, orchid protein, synthetic protein, heparin, nucleic acid, sugar, candy, glucose , Maltose, sucrose and their polymer alloys can also be used.

  Furthermore, examples of the biocompatible inorganic material include ceramics, nanocomposite ceramics, Al2O3 / ZnO2 composite ceramics, Si3N4 nanocomposite materials, hydroxide apatite, calcium carbonate, carbon, graphite (nanografiber), carbon nanotubes ( CNT), fullerene composite material, hydroxyapatite-polymer composite material, cobalt chromium alloy, stainless steel and the like.

  Preferably, however, the pellets 760 of this embodiment include biodegradable polymers including, for example, polylactic acid, polyglycolic acid, polycaprolactone, collagen, starch, hyaluronic acid, alginic acid, chitin, chitosan, cellulose, gelatin, and the like, and A biodegradable material composed of these compounds is preferred.

  The mold 160 is removed from the injection molding machine 700 after the pellet 760 is filled. The mold 160 is immersed in aqua regia. The mold 160 is melted with aqua regia. The fine needle 770 is obtained by dissolving the mold 160 with aqua regia.

  The fine needle 770 includes a holder part 780 and a needle part 790. Needle portion 790 has midway portion 795 and tip portion 800. The holder part 780 has the same shape as the holder part 110. Needle portion 790 has the same shape as needle portion 120. That is, the midway part 795 has the same shape as the midway part 125. The tip portion 800 has the same shape as the tip portion 130.

  FIG. 8 shows an enlarged view of the tip of the fine needle produced according to the same embodiment. FIG. 8A shows an upper view of the tip portion of the fine needle, and FIG. 8B shows a side view of the tip portion of the fine needle. FIG. 9 shows the dimensions of the manufactured fine needle according to the same embodiment. FIG. 9A shows dimensions in the upper view of the fine needle, and FIG. 9B shows dimensions in the side view of the fine needle.

  Holder part 780 has a thickness of 150 μm. Needle portion 790 has a diameter of 150 μm and a length of 1000 μm. The distal end portion 800 is sharp with a 20 degree angle with respect to the needle portion 790. Needle portion 790 has an axially symmetric structure. Here, the axial symmetry refers to a structure in which the needle part 790 is viewed at least from the upper side and the side and both are line symmetric. For example, axial symmetry refers to a structure in which the distal end portion 800 has a conical shape. Similarly, the needle part 120 of the needle model 100 has an axially symmetric structure. That is, the needle part 790 and the needle part 120 have a complicated structure having a three-dimensional shape.

  FIG. 10 shows a perspective view of another needle model according to the embodiment. The needle model 1000 includes a holder part 1010 and a needle part 1020. Needle portion 1020 has midway portion 1025 and tip portion 1030. Needle portion 1020 has an uneven shape (a jagged shape) in the radial direction. The distal end portion 1030 is formed at a position that is biased to one side in the radial direction of the midway portion 1025.

  FIG. 11 is a perspective view of still another needle model according to the embodiment. The needle model 1100 includes a holder part 1110 and a needle part 1120. Needle portion 1120 has midway portion 1125 and tip portion 1130. Needle portion 1120 includes three needle shapes. The needle portion 1120 is arranged so as to sandwich one central needle portion having no concavo-convex shape in the radial direction and the central needle portion, and has a concavo-convex shape (a jagged shape) in the radial direction opposite to the side facing the central needle portion. And two side needle portions having The distal end portion 1130 is formed at a position that is biased to one side in the radial direction of the midway portion 1125. Even with the needle model 1000 having such a complicated shape, a fine needle can be formed by using the mold 160 of the present embodiment.

  As described above, the mold manufacturing method and the microneedle manufacturing method for manufacturing the microneedle according to this embodiment are the mold manufacturing method and the microneedle manufacturing method for manufacturing the microneedle having a complicated shape. A method can be provided. For example, even when the tip has an axisymmetric shape, it is possible to produce a fine needle. This makes it possible to produce a more invasive microneedle. That is, it is possible to produce a fine needle mold and a fine needle that are free from pain and fear for the patient.

  In addition, when a fine needle is used as a lancet, a fine needle of 1 mm or more is required, but since a mold is manufactured in the horizontal direction of the silicon substrate, it is possible to produce a mold and a fine needle of a fine needle of 1 mm or more. It becomes possible. Therefore, it is possible to produce a fine needle mold and fine needle that can be used in a wider medical range.

  In addition, since it is possible to create a complicated shape both in the radial direction and in the longitudinal direction of the fine needle, it is possible to produce a mold and a fine needle of various shapes according to the application. For example, when a fine needle with a sharper tip and a concavo-convex shape in the radial direction is required, a model of a fine needle with a sharper needle and concavo-convex shape in the radial direction can be prepared. The necessary fine needle mold and fine needle can be obtained. Therefore, it is possible to produce a fine needle mold and fine needle that can be used in a wider medical range.

  In addition, since a fine needle having biocompatibility can be obtained, it is possible to prevent thrombus and the like from occurring even when the fine needle is broken and remains in the body when blood is collected. Therefore, a fine needle that is gentle to the body can be produced.

  The method for producing a mold and the method for producing a fine needle for producing the fine needle according to the present invention are not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the present invention. Of course, can be added. Moreover, it is needless to say that configurations, methods, and the like according to various modifications described below may be arbitrarily selected and employed in the configurations, methods, and the like according to the above-described embodiments.

  For example, the needle model 100 according to the above embodiment may be formed of a material that can be removed separately from the mold material other than silicon. For example, the needle model 100 may be formed of a monopolymer. Accordingly, the mold 160 can be manufactured using many needle models 100, and an optimum material for forming the shape of the fine needle 100 can be used.

  The needle model 100 in the above embodiment includes polycyclic aromatic hydrocarbons such as pentacene, anthracene, and rubrene, low molecular compounds such as tetracyanoquinodimethane (TCNQ), polyacetylene, and poly-3-hexylthiophene. It may be formed of a polymer such as (P3HT) or polyparaphenylene vinylene (PPV).

  The needle model 100 in the above embodiment may be fixed to the silicon substrate 140 using anodic bonding, eutectic bonding, fusion bonding, SOI (silicon-on-insulator), thermocompression bonding, or the like. good. Further, as an adhesive, epoxy, dry film, BCB (bisbenzocyclobutene), polyimide, UV curable resin, or the like may be used.

  The template material in the above embodiment is preferably a conductive material that can be deposited on the silicon substrate 140 by electrolytic etching. In addition, a material that is not etched simultaneously with the silicon substrate 140 is preferable. Depending on the solution for etching the silicon substrate 140, metals such as Cu, Al, Ag, or Au can be used. Further, as the electrode layer 150, a metal such as Cu, Al, Ag, or Au can be used.

  Further, the needle model 100 in the above-described embodiment has a structure including the holder portion 110. When the injection molding machine 700 can directly fill the needle mold part 180 with pellets, the needle model 100 may not include the holder part 110. Since the needle model 100 does not include the holder part 110, the mold 160 may not include the holder mold part 170. Thereby, the cost of producing the needle model 100 can be reduced. In addition, since many needle models 100 can be fixed on the silicon substrate 140, the manufacturing cost of the fine needles 770 can be reduced.

100 Needle model 110 Holder portion 120 Needle portion 125 Midway portion 130 Tip portion 140 Silicon substrate 150 Electrode layer 160 Mold 170 Holder mold portion 180 Needle mold portion 185 Midway mold portion 190 Tip mold portion 210 Spin coating apparatus 220 HMDS layer 230 Resist layer 240 Heater 310 Sputtering device 410 Heater 700 Injection molding machine 710 Upper mold 720 Lower mold 730 Storage section 740 Runner section 750 Plunger 760 Pellet 770 Fine needle 780 Holder section 790 Needle section 795 Midway section 800 Tip section 1000 Needle model 1010 Holder section 1020 Needle section 1025 Midway part 1030 Tip part 1100 Needle model 1120 Needle part 1125 Midway part 1130 Tip part

Claims (3)

Fixing a needle model made of silicon having a sharp tip to a silicon substrate;
Depositing a mold material on the side of the silicon substrate on which the needle model is fixed;
And a step of removing the silicon substrate and the needle model. A method for producing a mold for producing a fine needle. The step of depositing a mold material on the side of the silicon substrate on which the needle model is fixed is as follows:
Forming an electrode layer on the side of the silicon substrate on which the needle model is fixed;
The method for producing a mold for producing a fine needle according to claim 1, further comprising the step of depositing the mold material using the electrode layer.   A method for producing a microneedle, wherein a microneedle is produced by filling a mold produced by the method for producing a mold for producing a microneedle according to claim 1 or 2 with a needle material.