JP2012028421A - Laminate sheet for circuit board integrating heat sink with fin, circuit board integrating heat sink with fin and method of manufacturing laminate sheet for circuit board integrating heat sink with fin - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a finned heat sink integrated circuit board laminate having high heat dissipation.
SOLUTION: A finned heat sink and a base material, each including a highly heat conductive filler and a crystalline polymer, and an insulating heat conductive filler and a crystalline polymer formed on the base material. And a metal layer formed on the insulating layer, the finned heat sink and the content of the high thermal conductive filler in the base material are 15 to 65 vol%, and the heat in the insulating layer A laminate for a finned heat sink integrated circuit board, wherein the conductive filler content is 15 to 65 vol%.
[Selection] Figure 3

Description

  The present invention relates to a laminate for finned heat sink integrated circuit board, a finned heat sink integrated circuit board, and a finned heat sink integrated circuit board laminate.

  As a method of manufacturing a substrate with a heat sink attached, a method in which the substrate and the heat sink are separately manufactured and fixed using an adhesive, a method in which the substrate is directly fixed with bolts, or a method in which a heat radiating sheet or a heat radiating gel is sandwiched between the methods. Are well known.

  Patent Document 1 discloses a heat sink bonding method to a printed wiring board in which a prepreg is sandwiched between the printed wiring board and the heat sink and thermocompression bonded. Patent Document 2 discloses a method of using an adhesive composite material including a pressure-sensitive adhesive layer and a thermosetting adhesive in order to adhere a printed circuit board to a heat sink.

  In these methods, since the substrate and the heat sink are individually produced, many types and many devices are required, and a process for fixing both of them must be provided separately, resulting in poor productivity. As a method for fixing the substrate and the heat sink, it is known to sandwich a heat radiating sheet or a heat radiating gel between them or to adhere them with a heat radiating adhesive in order to achieve a good contact state and efficiently transfer heat. However, such a method has a problem that not only a complicated process and equipment for performing it are necessary, but also that an air layer easily enters each contact surface and it is difficult to obtain uniform thermal conductivity. .

  Patent Documents 3 and 4 disclose finned heat sinks. Patent Document 3 discloses a heat sink made of extruded aluminum having two rows of fins. Patent document 4 is disclosing the manufacturing method of the copper integrated heat sink using the conform extrusion method.

  Patent Document 5 discloses a resin heat sink in which a carbon material and ceramic powder and / or soft magnetic powder are uniformly dispersed in a resin. Patent Document 6 discloses a heat sink material in which conductive powder, conductive fiber, and the like are uniformly dispersed in a resin host material.

  However, when the purpose is to radiate heat from the substrate, it is necessary to fix the substrate to the heat sink using the method described above, and there is a problem similar to the above.

JP 2001-68821 A JP-T-2004-506318 JP 2008-193007 A Japanese Patent No. 3953004 JP 2009-16415 A Japanese Patent Laid-Open No. 2004-349585

  A circuit board with a conventional heat sink exhibits relatively high heat dissipation, but there is a problem that uniform thermal conductivity is difficult to obtain if an air layer enters between the circuit board and the heat sink, which improves heat dissipation. There was room for.

  Further, the conventional method of manufacturing a circuit board having a heat sink has poor productivity because the board and the heat sink are separately manufactured and then both are brought into close contact with each other and fixed. Furthermore, a method of bonding a metal foil for circuit formation to an integrally molded body of a substrate and a heat sink with fins has been tried. However, since fins are formed, it is difficult to press and firmly adhere the metal foil. In addition, the heating had to be performed individually and the efficiency was poor. That is, since the conventional manufacturing method has poor productivity, a method capable of mass-producing the finned heat sink integrated circuit board at low cost has been strongly desired.

  An object of the present invention is to provide a finned heat sink integrated circuit board laminate having a high heat dissipation property and a method capable of manufacturing such a finned heat sink integrated circuit board laminate with extremely high productivity. .

  According to one aspect of the present invention, a finned heat sink and a base material, which are integrally formed, including a highly heat conductive filler and a crystalline polymer, and an insulating heat conductive filler formed on the base material, An insulating layer containing a crystalline polymer; and a metal layer formed on the insulating layer, wherein the finned heat sink and the content of the high thermal conductive filler in the substrate are 15 to 65 vol%, A laminated board for a heat sink integrated circuit board with fins is provided, wherein the content of the heat conductive filler in the insulating layer is 15 to 65 vol%.

  According to another aspect of the present invention, a finned heat sink and substrate composition comprising 15 to 65 vol% high thermal conductivity filler and crystalline polymer, and 15 to 65 vol% insulating thermal conductive filler, A composition for an insulating layer containing a crystalline polymer is subjected to multilayer extrusion molding to form a molded body including an integrally formed finned heat sink and a base material and an insulating layer, on the insulating layer of the molded body There is provided a method of manufacturing a laminated board for a finned heat sink integrated circuit board, characterized by laminating a metal foil or depositing a metal layer.

  According to another aspect of the present invention, a finned heat sink comprising 15 to 65 vol% of a high thermal conductive filler and a crystalline polymer, and a finned heat sink integrally formed by multilayer extrusion of a composition for a substrate, and A base material is formed, and an insulating layer is formed by extruding a composition for an insulating layer containing 15 to 65 vol% of an insulating heat conductive filler and a crystalline polymer, and the integrally formed fin is attached. A finned heat sink integrated circuit board characterized in that a heat sink, a base material, and the insulating layer are laminated to form a molded body, and a metal foil is laminated or a metal layer is deposited on the insulating layer of the molded body. A method for manufacturing a laminated board is provided.

  According to still another aspect of the present invention, a finned heat sink comprising 15 to 65 vol% of a high thermal conductive filler and a crystalline polymer, and a finned heat sink integrally formed by multilayer extrusion of a composition for a substrate. And forming a base material, and forming an insulating layer by extruding a composition for an insulating layer containing 15 to 65 vol% of an insulating thermally conductive filler and a crystalline polymer, and forming a metal on the insulating layer. A finned heat sink integrated circuit comprising laminating a foil or depositing a metal layer, and laminating the integrally formed finned heat sink and substrate and the insulating layer and a laminate of the metal foil or metal layer. A method for manufacturing a laminate for a substrate is provided.

  According to the present invention, it is possible to provide a finned heat sink integrated circuit board laminate having high heat dissipation and a method capable of manufacturing such a finned heat sink integrated circuit board laminate with extremely high productivity.

The figure which shows an example of the manufacturing method of the laminated board for heat sink integrated circuit boards with a fin which concerns on this invention. The expanded sectional view of the principal part X of FIG. Sectional drawing of the laminated board for heat sink integrated circuit boards with a fin obtained by the manufacturing method of FIG. The figure which shows the other example of the manufacturing method of the laminated board for heat sink integrated circuit boards with a fin which concerns on this invention. The expanded sectional view of the principal part X of FIG. Sectional drawing of the laminated board for heat sink integrated circuit boards with a fin obtained by the manufacturing method of FIG.

  Hereinafter, the laminated board for heat sink integrated circuit boards with a fin which concerns on embodiment of this invention, and its manufacturing method are demonstrated in detail.

  In the present invention, a crystalline polymer is used for the finned heat sink, the base material, and the insulating layer. It is known that a crystalline polymer has a higher thermal conductivity than an amorphous polymer. Examples of the crystalline polymer include polyamide (PA), polybutylene terephthalate (PBT), polyethylene terephthalate (PET), polyacetal (POM), polyether ether ketone (PEEK), liquid crystal polymer (LCP), polyethylene naphthalate (PEN). , Polyphenylene sulfide (PPS), polyamideimide (PAI), polyethylene (PE), polypropylene (PP) and the like.

  In the present invention, it is important that the finned heat sink and the substrate have high thermal conductivity, and electrical characteristics are not particularly required. A composite obtained by filling a crystalline polymer with a highly thermally conductive filler exhibits high heat dissipation. The highly heat-conductive filler used for the finned heat sink and the substrate is preferably selected from the group consisting of short carbon fibers, carbon nanotubes, and metal particles having a thermal conductivity of 200 W / m · k or more. The carbon short fiber means one having an average fiber length of 12 mm or less. When the fiber length exceeds 12 mm, extrusion molding becomes difficult and mass productivity is lost. Examples of the metal particles include metal particles having high thermal conductivity such as copper, silver, gold, and aluminum.

  In the present invention, the finned heat sink and the substrate may be made of the same material for the crystalline polymer and the high thermal conductive filler, or may be a material in which at least one of the crystalline polymer and the high thermal conductive filler is different.

In the present invention, since the insulating layer forms a circuit by patterning a metal layer formed thereon, the insulating layer is required to have insulating properties and desirably has high thermal conductivity. The insulating thermally conductive filler contained in the insulating layer may be selected from the group consisting of metal oxide particles and metal nitride particles having a thermal conductivity of 20 W / m · k or more. preferable. Examples of the metal oxide include Al ₂ O ₃ , ZrO ₂ , and MgO. Examples of the metal nitride include AlN, BN, and Si ₃ N ₄ .

  In this invention, the content rate of the highly heat conductive filler in a finned heat sink and a base material is 15-65 vol%, and the content rate of the heat conductive filler in an insulating layer is 15-65 vol%. The content of the filler is set in consideration of the fluidity capable of extrusion molding and the heat dissipation of the finned heat sink integrated circuit board laminate. That is, when the content of the high heat conductive filler in the finned heat sink and the base material and the content of the heat conductive filler in the insulating layer are less than 15 vol%, the obtained laminated plate for finned heat sink integrated circuit board This is not desirable because the heat dissipation is reduced. On the other hand, when the content of the heat conductive filler in the finned heat sink and the base material and the content of the heat conductive filler in the insulating layer exceeds 65 vol%, continuous extrusion is difficult and mass productivity is reduced. It can no longer be obtained.

  In the present invention, the reason for using a finned heat sink and a filler in the substrate that is higher in thermal conductivity than the filler in the insulating layer is that the finned heat sink and the base located on the opposite side of the metal layer for circuit formation are used. This is to further improve the heat dissipation of the material. When using heat sinks with fins and fillers filled with metal oxide or metal nitride, which are insulating heat conductive fillers filling the insulation layer, heat of finned heat sinks and substrates This is not desirable because of low conductivity. On the other hand, if a heat sink with fins and short carbon fibers, carbon nanotubes, or metal particles filled in the base material are used as fillers to fill the insulating layer, the thermal conductivity is excellent, but the insulating properties are poor, so fins are attached. It becomes impossible to use as a laminated board for heat sink integrated circuit boards. If the same filler is used for the finned heat sink and the base material and the insulating layer, insulation is required, and an insulating heat conductive filler must be used. This is not desirable because the thermal conductivity is low.

  In the present invention, it is desirable to use the same kind of crystalline polymer for the base material and the insulating layer because the base material and the insulating layer are not firmly adhered and peeled off. On the other hand, if different types of crystalline polymer are used for the base material and the insulating layer, the compatibility between the crystalline polymer is poor or the crystallization temperature is different and the temperature change during molding causes a large gap between the base material and the insulating layer. There is a possibility that peeling occurs when distortion occurs.

  In the present invention, the thicker the insulating layer, the greater the insulation generally. However, since the insulating layer has a lower thermal conductivity than the base material, if the insulating layer is too thick, the overall heat dissipation of the circuit board laminate will be low. Become. Therefore, in order to obtain a laminated board for a circuit board having high heat dissipation, it is desirable to make the insulating layer as thin as possible within a range that can ensure the insulation according to the demand.

  In the present invention, the following methods (1) to (3) are used to manufacture a finned heat sink integrated circuit board laminate having a heat sink with fins and an integrally molded body of a base material, an insulating layer, and a metal layer. Used.

  (1) Multi-layered composition for finned heat sink and substrate containing high thermal conductive filler and crystalline polymer, and composition for insulating layer containing insulating thermal conductive filler and crystalline polymer A method of forming a molded body including an integrally formed finned heat sink and a base material and an insulating layer by extrusion molding, and laminating a metal foil or depositing a metal layer on the insulating layer of the molded body.

  (2) A finned heat sink including a highly heat conductive filler and a crystalline polymer and a composition for a substrate are multilayer extruded to form an integrally formed finned heat sink and substrate, and insulating heat conduction A composition for an insulating layer containing a conductive filler and a crystalline polymer is formed by single-layer extrusion molding to form an insulating layer, and the integrally formed finned heat sink and substrate and the insulating layer are laminated to form a molded body And laminating a metal foil or depositing a metal layer on the insulating layer of the molded body.

  (3) A finned heat sink containing a highly heat conductive filler and a crystalline polymer and a composition for a base material are multilayer-extruded to form a finned heat sink and a base material which are integrally formed, and insulating heat conduction A composition for an insulating layer containing a conductive filler and a crystalline polymer is formed by single-layer extrusion molding to form an insulating layer, and a metal foil is laminated on the insulating layer or a metal layer is deposited, and the integral molding is performed. A method of laminating a finned heat sink and a base material with the insulating layer and a laminate of metal foil or metal layer so that the base material and the insulating layer are in contact with each other.

  In any of these methods, when molding the finned heat sink and the base material, the water-soluble polymer or organic solvent-soluble polymer containing inorganic particles in the gaps between the fins of the finned heat sink is used. After filling and laminating the finned heat sink, the substrate, the insulating layer, and the metal layer, the water-soluble polymer is dissolved with water, or the organic solvent-soluble polymer is dissolved with an organic solvent.

  In the present invention, examples of the water-soluble polymer include sodium polyacrylate, a copolymer thereof, and hydroxycellulose. Examples of the organic solvent-soluble polymer include polyacetal resin, polyethylene oxide, and amorphous polyester resin. Examples of inorganic particles include talc and calcium carbonate, which are generally known as fillers.

  In the method of the present invention, the integrally formed finned heat sink and substrate and the insulating layer can be continuously formed by extrusion, and the metal layer is also laminated by laminating a metal foil or depositing a metal layer on the insulating layer. Since it can be formed continuously, a laminated board for a heat sink integrated circuit board with fins having high heat dissipation can be produced in large quantities at a low cost.

  In the present invention, a finned heat sink and a composition for a substrate containing a highly heat conductive filler and a crystalline polymer, and a composition for an insulating layer containing an insulating heat conductive filler and a crystalline polymer, After kneading in advance with a kneader or a twin-screw kneader and processing into a shape such as pellets, it may be supplied to the extruder. Or you may supply a filler and a crystalline polymer to an extruder so that it may become a predetermined | prescribed compounding ratio using the feeder and biaxial kneading extruder which can be fixed_quantity | quantitatively.

  With reference to FIG. 1, an example of the manufacturing method of the laminated board for circuit boards which concerns on this invention is demonstrated. In FIG. 1, a composition for a finned heat sink and substrate containing a highly heat conductive filler and a crystalline polymer, a composition for an insulating layer containing an insulating heat conductive filler and a crystalline polymer, The fin filling polymer is supplied to separate extruders connected to the multi-layer extrusion die 21a, and is subjected to multi-layer extrusion from the die to include a heat sink 12 with fins and an insulating layer 13 integrally formed with the substrate. A molded body is formed. In this example, since the same composition is used for the finned heat sink and the base material, the finned heat sink 12 and the base material are not distinguished, and the base material is not labeled. At this time, a gap between the fins of the finned heat sink 12 is filled with a water-soluble or organic solvent-soluble polymer for fin filling. On the other hand, the metal foil is sent out from the feed roll 22. The metal layer 15 is formed by supplying a laminate between the heating rolls (laminate rolls) 23 and 24 and supplying and laminating a metal foil on the insulating layer 12 of the compact.

  FIG. 2 is an enlarged cross-sectional view showing a main part X of FIG. As shown in FIG. 2, a water-soluble or organic solvent-soluble fin-filling polymer 14 is filled between the fins 12a of the finned heat sink 12 formed integrally with the base material. Further, the insulating layer 13 and the metal layer 15 are formed on the surface of the heat sink 12 with fins integrally formed with the base material on the side opposite to the fins 12a (base material side).

  FIG. 3 is a cross-sectional view of the finned heat sink integrated circuit board laminate 10 produced by removing the fin-filling polymer 14 from FIG.

  With reference to FIG. 4, the other example of the manufacturing method of the laminated board for circuit boards which concerns on this invention is demonstrated. In FIG. 4, a composition for a finned heat sink and substrate including a high thermal conductive filler and a crystalline polymer, an insulating layer composition including an insulating thermal conductive filler and a crystalline polymer, The fin filling polymer is supplied to separate extruders connected to the multi-layer extrusion die 21b, and multi-layer extrusion molding is performed from the die to form the heat sink 12 with fins and the insulating layer 13 integrally formed with the substrate 11. A molded body containing is formed. In this example, different compositions are used for the finned heat sink and the substrate. At this time, the gap between the fins of the finned heat sink 12 is filled with a water-soluble or organic solvent-soluble polymer 14 for fin filling. A metal layer 15 is deposited from the vapor deposition device 25 on the insulating layer 13 of the molded body.

  FIG. 5 is an enlarged cross-sectional view of the main part X of FIG. As shown in FIG. 4, a water-soluble or organic solvent-soluble fin-filling polymer 14 is filled between the fins 12 a of the finned heat sink 12 integrally formed with the base material 11. In addition, an insulating layer 13 and a metal layer 15 are formed on the surface of the base material 11 integrally formed with the finned heat sink 12.

  6 is a cross-sectional view of the finned heat sink integrated circuit board laminate 10 produced by removing the fin-filling polymer 14 from FIG.

  In the present invention, the circuit board is obtained by patterning the metal layer of the circuit board laminate.

  Next, specific examples of the present invention will be described.

Example 1
The manufacturing method of the laminated board for heat sink integrated circuit boards with a fin concerning a present Example is demonstrated.

  As a heat sink with fins and a base material, copper powder (trade name: CuE13PB) manufactured as high thermal conductivity filler and PPS (trade name: Toray Industries, Inc., trade name: Torelina) as a crystalline polymer A900) was prepared. After supplying with a fixed quantity feeder so that copper powder might be 65 vol% and PPS might be the mixing ratio of 35 vol%, the pellet was shape | molded with the twin-screw extruder.

As the insulating layer raw material, Al ₂ O ₃ (manufactured by Showa Denko KK, trade name: AS-40) as an insulating heat conductive filler and PPS (same as above) as a crystalline polymer were prepared. Pellets were prepared by feeding with a quantitative feeder such that the mixing ratio of Al ₂ O ₃ was 65 vol% and PPS was 35 vol%, and extrusion was performed with a twin screw extruder.

  A water-soluble polymer (trade name: EXEVAL, manufactured by Kuraray Co., Ltd.) in which 40 vol% of talc was kneaded was prepared as a polymer filled in the gaps between the fins of the heat sink with fins.

  The finned heat sink and substrate pellets are supplied to the first extruder connected to the multi-layer extrusion die 21a, and the insulating layer pellets are supplied to the second extruder connected to the multi-layer extrusion die 21a to fill the fins. The polymer for was fed to a third extruder connected to the multilayer extrusion die 21a. Through a die 21a capable of forming a finned heat sink integrated base material, laminating an insulating layer, and filling a gap between the fins with a polymer, the opposite side of the fin of the finned heat sink 12 (base material) An insulating layer 13 was laminated on the side), and a plate-like molded body in which the polymer gap 14 was filled in the fin gaps of the finned heat sink 12 was continuously extruded. Next, a metal foil 15 was formed by laminating a copper foil heated to a melting point of the crystalline polymer within the range of ± 20 ° C. on the insulating layer 13 of the molded body to obtain a molded body.

  Next, the water-soluble polymer 14 was melted and flowed from the molded body with water spray to obtain a laminated board 10 for finned heat sink integrated circuit board.

(Example 2)
The manufacturing method of the laminated board for heat sink integrated circuit boards with a fin concerning this Example 2 is demonstrated.

  As a raw material for the heat sink with fins, aluminum powder (manufactured by High Purity Chemical Co., Ltd., trade name: ALE16PB) was prepared as a highly heat conductive filler, and PET (manufactured by Unitika Ltd., SA-1346P) was prepared as a crystalline polymer. . After feeding with a quantitative feeder so that the aluminum powder was 40 vol% and PET was 60 vol%, pellets were formed with a twin screw extruder.

  Copper powder (trade name: CuE13PB, manufactured by High Purity Chemical Co., Ltd.) and PET (Unitika Co., Ltd., SA-1346P) as a crystalline polymer were prepared as raw materials for the base material as high thermal conductive fillers. After supplying with a fixed amount feeder so that a copper powder might be 50 vol% and PET might be a mixing ratio of 50 vol%, the pellet was shape | molded with the twin-screw extruder.

  As the insulating layer material, AlN (manufactured by Toyo Aluminum Co., Ltd., trade name: FLZ-1) as an insulating thermal conductive filler, PET (manufactured by Unitika Ltd., trade name: SA-1206) as a crystalline polymer Prepared. After feeding with a quantitative feeder so that the blending ratio of AlN was 50 vol% and PET was 50 vol%, pellets were molded with a twin screw extruder.

  A polyacetal resin soluble in an organic solvent in which 40% by volume of talc was kneaded (trade name: S-LEC B, manufactured by Sekisui Chemical Co., Ltd.) was prepared as a polymer filled in the gaps between the fins of the finned heat sink.

  Insulating pellets for insulation layers are fed to the first extruder connected to the die 21b for multilayer extrusion, and pellets for the insulating layer are fed to the second extruder connected to the die 21b for multilayer extrusion. The polymer for fin filling was supplied to the fourth extruder of the multilayer extruder 21 to the third extruder connected to the extrusion die 21b. The substrate 11 and the finned heat sink 12 are integrally formed through a die 21b capable of forming a finned heat sink integrated substrate, laminating an insulating layer, and filling a gap between the fins, and insulating the substrate 11 on the substrate 11. The layer 13 was laminated, and a plate-like molded body in which the polymer 14 was filled in the fin gap of the finned heat sink 12 was continuously extruded. Next, a metal foil 15 was formed by laminating a copper foil heated to a melting point of the crystalline polymer within the range of ± 20 ° C. on the insulating layer 13 of the molded body to obtain a molded body.

  Subsequently, the laminate 10 for a heat sink integrated circuit board with fins was obtained by dissolving and flowing the organic solvent-soluble polymer 14 from the molded body with an organic solvent spray.

(Example 3)
The manufacturing method of the laminated board for heat sink integrated circuit boards with a fin concerning a present Example is demonstrated.

  For finned heat sink and base material, carbon fiber (made by Teijin Ltd., trade name: Lahima R-A201) as a high thermal conductive filler, and PEN (made by Teijin Chemicals Ltd., trade name) as a crystalline polymer : Teonex TN8065S). It supplied to the 1st extruder connected to the die | dye 21a for multilayer extrusion using the fixed feeder so that it might become a compounding ratio of 15 vol% of carbon fibers, and PEN 85 vol%.

  BN (made by Mizushima Alloy Iron Co., Ltd., trade name: HP-40P) as an insulating heat conductive filler, and PEN (made by Teijin Kasei Co., Ltd., trade name: Teonex TN8065S) as a crystalline polymer. ) Was prepared. It supplied to the 2nd extruder connected to the die | dye 21a for multilayer extrusion using the fixed quantity feeder so that it might become a compounding ratio of BN 40vol% and PEN 60vol%.

  As a polymer to be filled in the gaps between the fins of the heat sink with fins, a water-soluble polymer (product name: EXEVAL, manufactured by Kuraray Co., Ltd.) kneaded with 40 vol% of talc is prepared and connected to the die 21a for multilayer extrusion. Feeded to the extruder.

  Through a die 21a capable of forming a finned heat sink integrated base material, laminating an insulating layer, and filling a gap between the fins with a polymer, the opposite side of the fin of the finned heat sink 12 (base material) An insulating layer 13 was laminated on the side), and a plate-like molded body in which the polymer gap 14 was filled in the fin gaps of the finned heat sink 12 was continuously extruded.

  Next, an Ag thin film was deposited from the vapor deposition device 25 on the insulating layer 12 side of the plate-shaped molded body to continuously form the metal layer 15 to obtain a molded body.

  Next, the water-soluble polymer 14 was melted and flowed from the molded body with water spray to obtain a laminated board 10 for finned heat sink integrated circuit board.

  Table 1 shows the results of examining the moldability of the substrate and the fin shape of the laminated board for heat sink integrated circuit substrate with fins according to Examples 1 to 3. Table 2 shows the results of examining the thermal conductivity of each member of the laminated board for heat sink integrated circuit substrate with fins according to Examples 1 to 3.

As shown in Tables 1 and 2, it was confirmed that any of the laminated boards for heat sink integrated circuit boards of Examples 1 to 3 had good moldability and good heat dissipation.

  The finned heat sink integrated circuit board laminate according to the present invention includes a finned heat sink and a base material integrally formed of a composite composed of a high thermal conductive filler and a crystalline polymer, and between the base material and a metal layer for circuit formation. A crystalline polymer with a high thermal conductivity as a matrix (base material) for the composite heat sink and base material and the insulating layer. Therefore, high thermal conductivity is exhibited, and heat generated in a circuit formed by patterning the metal layer can be radiated well from the base material and the finned heat sink.

  Further, according to the method for manufacturing a laminated board for a heat sink integrated circuit board with fins according to the present invention, a plate-shaped molding is performed by laminating a heat sink with fins and a base material and an insulating layer by multilayer extrusion or single layer extrusion respectively. The body can be formed continuously, and the metal layer can also be formed continuously by laminating metal foils or depositing metal layers, so it is possible to manufacture laminated boards for finned heat sink integrated circuit boards with high productivity can do.

  Note that the present invention is not limited to the above-described embodiment as it is, and can be embodied by modifying the constituent elements without departing from the scope of the invention in the implementation stage. Further, various inventions can be formed by appropriately combining a plurality of constituent elements disclosed in the embodiment. For example, some components may be deleted from all the components shown in the embodiment. Furthermore, you may combine suitably the component covering different embodiment.

  Specifically, the finned heat sink, the type of crystalline polymer and filler forming the base material and the insulating layer, the filler content, the water-soluble polymer, the organic solvent-soluble polymer, or the metal layer material are the same as those in the above embodiment. It is not limited to what has been described. Further, in the above embodiment, a method of laminating a metal body on the laminated body after forming a laminated body by simultaneously extruding an integrally formed body of a finned heat sink and a base material and an insulating layer, or a heat sink with fins Although the method of depositing a metal layer on the laminate after forming a laminate by multilayer extrusion of the integrally formed body with the substrate and the insulating layer at one time is not limited thereto.

  DESCRIPTION OF SYMBOLS 10 ... Laminated board for heat sink integrated circuit board with fin, 11 ... Base material, 12 ... Heat sink with fin, 12a ... Fin, 13 ... Insulating layer, 14 ... Filling polymer, 15 ... Metal layer, 21a, 21b ... Die for multilayer extrusion 22 ... Delivery roll, 23, 24 ... Heating roll (lamination roll), 25 ... Vapor deposition apparatus.

Claims (9)

A finned heat sink and substrate integrally formed with a high thermal conductivity filler and a crystalline polymer;
An insulating layer formed on the substrate and comprising an insulating thermally conductive filler and a crystalline polymer;
A metal layer formed on the insulating layer,
The finned heat sink and the content of the high thermal conductive filler in the base material are 15 to 65 vol%, and the content of the thermal conductive filler in the insulating layer is 15 to 65 vol% Laminated plate for heat sink integrated circuit board.   2. The laminated board for a finned heat sink integrated circuit board according to claim 1, wherein the highly heat-conductive filler contained in the finned heat sink and the base material comprises at least one of short carbon fibers, carbon nanotubes, and metal. .   The laminated heat sink-integrated circuit board with fins according to claim 1, wherein the insulating thermally conductive filler contained in the insulating layer is made of at least one of metal oxide and metal nitride particles. Board.   4. The finned heat sink integrated circuit board according to claim 1, wherein the crystalline polymer contained in the base material and the crystalline polymer contained in the insulating layer are of the same type. 5. Laminated board.   The heat sink integrated circuit board with fin obtained by patterning the metal layer of the laminated board for heat sink integrated circuit boards with a fin of any one of Claim 1 thru | or 4. Composition for finned heat sink and substrate comprising 15 to 65 vol% high thermal conductive filler and crystalline polymer, and for insulating layer comprising 15 to 65 vol% insulating thermal conductive filler and crystalline polymer A multilayer extrusion molding of the composition to form a molded body comprising an integrally formed finned heat sink and a substrate and an insulating layer;
A method for producing a laminated board for a heat sink integrated circuit board with fins, comprising laminating a metal foil or depositing a metal layer on an insulating layer of the molded body. A finned heat sink and substrate composition comprising 15 to 65 vol% of a high thermal conductive filler and a crystalline polymer are multilayer extruded to form an integrally formed finned heat sink and substrate;
A composition for an insulating layer containing 15 to 65 vol% of an insulating heat conductive filler and a crystalline polymer is formed by single-layer extrusion molding to form an insulating layer,
Laminating the integrally formed finned heat sink and substrate and the insulating layer to form a molded body,
A method for producing a laminated board for a heat sink integrated circuit board with fins, comprising laminating a metal foil or depositing a metal layer on an insulating layer of the molded body. A finned heat sink and substrate composition comprising 15 to 65 vol% of a high thermal conductive filler and a crystalline polymer are multilayer extruded to form an integrally formed finned heat sink and substrate;
A composition for an insulating layer containing 15 to 65 vol% of an insulating heat conductive filler and a crystalline polymer is extruded as a single layer to form an insulating layer, and a metal foil is laminated on the insulating layer or a metal Deposit layers,
A method of manufacturing a laminated board for a finned heat sink integrated circuit board, comprising laminating the integrally formed heat sink and substrate with fins and a laminate of the insulating layer and metal foil or metal layer.   The gap between the fins of the heat sink with fins is filled with a water-soluble polymer or inorganic solvent-soluble polymer containing inorganic particles, and after laminating the finned heat sink, the base material, the insulating layer, and the metal layer, The manufacturing method of the laminated board for heat sink integrated circuit boards with a fin of any one of Claim 6 thru | or 8 which melt | dissolves a property polymer with water, or melt | dissolves an organic solvent soluble polymer with an organic solvent. Method.

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