JP2012009780A - Light emitting device and lighting apparatus having the same - Google Patents

Abstract

Provided is a light emitting device capable of ensuring heat dissipation and predetermined electrical insulation from a substrate to a module support member while suppressing damage to a ceramic module substrate.
A light emitting module of a light emitting device is formed on a ceramic module substrate by providing a plurality of wiring patterns and semiconductor light emitting elements electrically connected to these patterns. The light emitting module accommodated in the concave portion 12 of the support member 11 is held in a state of being pressed against the bottom surface 12 a of the concave portion by a pressing member 70 fixed to the support member 11. A wiring pattern 26 closest to the peripheral surface 22c of the substrate is provided with a predetermined creepage distance E between the peripheral surface 22c and the peripheral surface. The module substrate so that a predetermined insulation distance F is secured between the contact portion and the wiring pattern 26 in a state where the light emitting module is moved to the maximum so that the wiring pattern 26 approaches the contact portion between the module substrate and the pressing member. And the size of the recess.
[Selection] Figure 11

Description

  Embodiments of the present invention relate to a light emitting device used as a light source device, for example, and a lighting fixture such as a road light provided with the light emitting device.

  Between a plurality of wiring patterns provided on a ceramic module substrate, a plurality of semiconductor light emitting elements, for example, chip-shaped LEDs (light emitting diodes) are arranged, and these LEDs are electrically connected to the wiring patterns with bonding wires. 2. Description of the Related Art A COB (Chip On Board) type light emitting module having a configuration in which a wiring pattern, LEDs, and the like are embedded with a sealing resin mixed with a phosphor is conventionally known.

  In order to attach this light emitting module to the module support member, a fixing hole is provided in the module substrate, and the light emitting module is attached to the module support member by screwing the screw passed through the fixing hole into the module support member. It has been.

  As the light emitting module is energized and disconnected, the temperature of each semiconductor light emitting element composed of a chip-like LED increases in the light emitting state and decreases to room temperature in the unlit state. Repeat expansion and contraction. However, in the configuration in which the ceramic module substrate is screwed as described above, the thermal expansion of the module substrate cannot be absorbed by the screwing portion, so that thermal stress concentrates on the screwing portion and the module There is a risk of the substrate breaking.

  As described above, in order to suppress the temperature rise of each semiconductor light emitting element that generates heat and suppress the decrease in the lifetime and light emission efficiency of these light emitting elements, heat is radiated to the module support member via the module substrate. Is called. Therefore, the module support member is preferably made of metal. In the configuration in which the metal member is disposed around the light emitting module as in this example, it is necessary to electrically insulate the metal member from the wiring pattern on the module substrate.

JP 2009-290244 A

  Embodiments seek to provide a light-emitting device capable of ensuring heat dissipation and predetermined electrical insulation from the substrate to the module support member while suppressing damage to the ceramic module substrate, and a lighting fixture including the same. To do.

  In order to solve the above problems, a light emitting device according to an embodiment includes a light emitting module, a metal module support member, and a plurality of metal pressing members. A light emitting module is formed on a ceramic module substrate by providing a wiring pattern and a plurality of semiconductor light emitting elements electrically connected to the pattern. The light emitting module is accommodated in the recess of the module support member, and the light emitting module is held in a state where the module substrate is pressed against the bottom surface of the recess by a plurality of pressing members fixed to the module support member. The pattern portion is provided away from the peripheral surface of the module substrate so that a predetermined creepage distance is ensured between the peripheral surface of the module substrate and the pattern portion of the wiring pattern closest to the peripheral surface. A predetermined insulation distance is ensured between the contact portion and the wiring pattern in a state where the light emitting module is moved to the maximum in the recess so that the wiring pattern approaches the contact portion between the module substrate and the holding member. The size of the module substrate and the recess is defined.

  According to the light emitting device of the embodiment, it is possible to expect an effect that heat dissipation from the substrate to the module support member and predetermined electrical insulation can be ensured while suppressing breakage of the ceramic module substrate.

It is a perspective view which shows the road light provided with the light emitting module which concerns on Example 1. FIG. It is a perspective view which expands and shows the lamp of the road light of FIG. It is a perspective view which shows the light source device with which the lamp of FIG. 2 is provided. It is a schematic front view which shows the light source device of FIG. It is a front view which shows the light emitting module with which the light source device of FIG. 3 is provided. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 1st manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 2nd manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 3rd manufacturing process. It is a front view which shows the light emitting module of FIG. 5 in the state which passed through the 4th manufacturing process. FIG. 5 is a cross-sectional view taken along line F10-F10 in FIG. It is sectional drawing equivalent to FIG. 10 which shows the state which the light emitting module with which the light source device of FIG.

  The light emitting module of Embodiment 1 is mounted on the component mounting surface by electrically connecting to the ceramic module substrate, the positive and negative wiring patterns provided on the component mounting surface of the substrate, and these patterns. A light emitting module having a plurality of semiconductor light emitting elements; a metal module supporting member having a recess for accommodating the light emitting module; and a peripheral portion of the module substrate fixed to the module supporting member and the component mounting A plurality of metal pressing members that are in contact with the surface and press the module substrate against the bottom surface of the recess, and a pattern portion of the wiring pattern closest to the peripheral surface of the module substrate is between the peripheral surface and the peripheral surface The wiring pattern is arranged so as to be close to a contact portion between the module substrate and the pressing member. The size of the module substrate and the recess is defined so that a predetermined insulation distance is ensured between the contact portion and the wiring pattern in a state where the light emitting module is moved to the maximum in the recess. It is characterized by having.

  In the first embodiment, the ceramic forming the module substrate is preferably white, but may have a color other than white. When white ceramics are used, any one selected from aluminum oxide (alumina), aluminum nitride, boron nitride, silicon nitride, magnesium oxide, forsterite, steatite, low-temperature sintered ceramics, or a composite material thereof is used. In particular, alumina that is inexpensive, has high light reflectance, and is easy to process can be suitably used.

  In the first embodiment, the wiring pattern can be formed of a metal having excellent conductivity such as copper, silver, and gold. When the wiring pattern is made of silver, the wiring pattern includes a wiring pattern of pure silver and a wiring pattern formed mainly of silver. It is out.

  In the first embodiment, for example, various light-emitting elements in which a compound semiconductor is provided on an element substrate can be used as the semiconductor light-emitting element, and in particular, a blue LED made of a bare chip that emits blue light is used. Although it is preferable, it is also possible to use a semiconductor light emitting element that emits ultraviolet light or green light.

  In the first embodiment, the metal forming the module support member can be preferably made of aluminum or an alloy thereof, which is a lightweight and highly heat conductive metal material, and the presser member is preferably formed of the same metal. . In the first embodiment, the recess of the module support member is formed in a shape similar to the module substrate and larger than the module substrate.

  In the first embodiment, the thermal expansion of the module substrate in a state where the light emitting module emits light can be absorbed by the elastic deformation of the holding member. Therefore, the thermal stress is concentrated on the contact portion of the module substrate with the holding member, and the ceramic substrate It is possible to prevent the module substrate from being damaged.

  At the same time, in the first embodiment, the module substrate is pressed against the bottom surface of the recess of the module support member by the pressing member, and the module substrate is held in a state of being sandwiched between the bottom surface of the recess and the pressing member. The heat of the element can be radiated to the metal module support member via the module substrate.

  Further, in the configuration in which the module substrate is held by the pressing member and supported in the recess of the module support as described above, the light emitting module may move in the recess when a strong impact is applied.

  However, in Embodiment 1, since the pattern portion of the wiring pattern closest to the peripheral surface of the module substrate is provided with a predetermined creepage distance between the peripheral surface of the module substrate, the light emitting module is displaced in the recess. Therefore, even if the peripheral surface of the module board may contact the side surface of the recess, it is necessary to electrically insulate the metal module support and the wiring pattern between the side surface of the recess and the wiring pattern on the module board. A predetermined creepage distance can be secured.

  Further, in the first embodiment, a predetermined insulation distance is provided between the contact portion and the wiring pattern in a state where the light emitting module is moved to the maximum in the recess so that the wiring pattern approaches the contact portion between the module substrate and the pressing member. Since the sizes of the module substrate and the recess are defined so that the wiring pattern is closest to the contact portion due to the movement of the light emitting module, the wiring pattern and the metal holding member In the meantime, a predetermined insulation distance necessary for electrically insulating them can be secured.

  The lighting fixture of Embodiment 2 is characterized by comprising: a light source device having the light emitting module of Embodiment 1 as a light source; and a fixture body to which the light source device is attached. This Embodiment 2 can be applied to any type of lighting fixture without being restricted by the road lamp described in Example 1 described later.

  In the second embodiment, since the light source device has the light emitting module described in the first embodiment as a light source, heat radiation from the substrate to the module support member and predetermined electric power can be suppressed while suppressing damage to the ceramic module substrate. It is possible to provide a luminaire including a light source device capable of securing a mechanical insulation.

  Hereinafter, the lighting fixture provided with the light emitting module of Example 1, for example, a road lamp, is demonstrated in detail with reference to FIGS.

  Reference numeral 1 in FIG. 1 indicates a road lamp 1 installed for road lighting. The road lamp 1 is formed by attaching a lamp 3 to the upper end of a column 2.

  The column 2 is erected on the side of the road, and its upper part is bent so as to cover the road. As shown in FIG. 2, the lamp 3 includes a fixture body connected to the column 2 as shown in FIG. 2, for example, a lamp body 4, a translucent plate 5 attached to the lamp body 4 by closing the lower surface opening of the lamp body 4 facing the road, At least one light emitting device accommodated in the lamp body 4 facing the light transmitting plate 5, in other words, a light source device 6 is formed. The lamp body 4 is formed by combining a metal, for example, a plurality of aluminum die cast products. The translucent plate 5 is made of tempered glass.

  As shown in FIGS. 3 and 4, the light source device 6 has a plurality of radiating fins 14 protruding from the back surface of the module support member 11 that forms the base of the device, and a reflector 15 and a front surface of the module support member 11. The light emitting module 21 is attached as a light source to form a unit.

  The module support member 11 is made of a metal, for example, aluminum die-cast, and is formed in a square shape. The module support member 11 has, for example, a square recess 12 (see FIGS. 4, 10, and 11) opened on the front surface thereof. The recess 12 is larger than the module substrate 22 described later. The bottom surface 12a of the recess 12 is flat, and the four side surfaces 12b to 12e (see FIG. 4) defining the recess 12 are continuous at right angles to each other. The heat radiating fins 14 are formed integrally with the module support member 11.

  The reflector 15 is formed by combining the first reflecting plate 15a to the fourth reflecting plate 15d in a trumpet shape. The first reflecting plate 15a and the second reflecting plate 15b are flat mirrors having a flat configuration, and are provided in parallel to each other. The third reflecting plate 15c and the fourth reflecting plate 15d connected to the first reflecting plate 15a and the second reflecting plate 15b are curved mirrors having a curved configuration so that the distance between them gradually increases. Is provided.

  The light source device 6 is fixed in the lamp body 4 with the exit opening of the reflector 15 facing the translucent plate 5. In this fixed state, a part of the module support member 11, for example, a peripheral portion is connected to the inner surface of the lamp body 4 so as to be able to conduct heat. This thermal connection can be realized by bringing the peripheral portion into direct contact with the inner surface of the lamp body 4, and the peripheral portion is connected to the inner surface of the lamp body 4 through a heat conductive member such as a metal or a heat pipe having high heat dissipation. It can be realized by connecting to. As a result, the heat generated by the light source device 6 can be released to the outside using the metal lamp body 4 as a heat radiating surface.

  Next, the light emitting module 21 will be described. As shown in FIG. 5 and the like, the light emitting module 21 includes a module substrate 22, a first wiring pattern, for example, a wiring pattern 25 that forms a positive electrode, a second wiring pattern, for example, a wiring pattern 26 that forms a negative electrode, an alignment mark 35, Protective layer 37, second protective layer 38, a plurality of identity marks, for example, a first identity mark 41 to a fourth identity mark 44, a plurality of semiconductor light emitting elements 45, and bonding wires 47 to 52. A frame 55, a sealing member such as a sealing resin 57, a connector 61, a capacitor 65, and the like.

  The module substrate 22 is made of white ceramic, for example, white aluminum oxide. The module substrate 22 may be formed of only aluminum oxide, but may contain aluminum oxide as a main component and other ceramics or the like mixed therein. The content is preferably 70% or more.

  The average reflectance of the white module substrate 22 with respect to the visible light region is 80% or more, and more preferably 85% or more and 99% or less. Therefore, the module substrate 22 has similar light for blue light having a specific emission wavelength of 440 nm to 460 nm emitted by a blue LED described later and yellow light having a specific emission wavelength of 470 nm to 490 nm emitted by a phosphor described later. Exhibits reflective performance.

  As shown in FIG. 4, the module substrate 22 has a substantially rectangular shape that is similar to the recess 12 and slightly smaller than the recess 12. As shown in FIG. 5, the four corners of the module substrate 22 are rounded. The module substrate 22 is thinner than the recess 12 as shown in FIGS. Both surfaces of the module substrate 22 are flat surfaces made parallel to each other, one of which is used as a component mounting surface 22a, and the other surface is used as a heat transfer surface. 4, 10, and 11, reference numeral 22 c indicates the peripheral surface of the module substrate 22.

  The positive electrode wiring pattern 25 and the negative electrode wiring pattern 26 are provided on the component mounting surface 22a.

  Specifically, as shown in FIG. 6 and the like, the positive electrode wiring pattern 25 has a positive electrode pattern base portion 25a and a wire connection portion 25b. The wire connecting portion 25b is formed to extend straight. The positive electrode pattern base portion 25a and the wire connection portion 25b are substantially parallel to each other and are integrally continuous via an oblique pattern portion. A first positive electrode pad portion 25c and a second positive electrode pad portion 25d are integrally projected on the positive electrode pattern base portion 25a.

  The negative electrode wiring pattern 26 includes a negative electrode pattern base portion 26a, a first wire connection portion 26b, an intermediate pattern portion 26c, and a second wire connection portion 26d. This wiring pattern 26 is provided so as to surround the wiring pattern 25 for the positive electrode.

  That is, the negative electrode pattern base portion 26a is provided adjacent to the positive electrode pattern base portion 25a of the wiring pattern 25 with a predetermined insulation distance A (see FIG. 6). A first negative electrode pad portion 26e provided side by side with the first positive electrode pad portion 25c is integrally projected from the negative electrode pattern base portion 26a. The first wire connecting portion 26b is integrally continuous so as to be bent about 90 ° with respect to the negative electrode pattern base portion 26a. The first wire connection portion 26b is provided substantially parallel to the wire connection portion 25b by forming a first element disposition space S1 between the wire connection portion 25b of the wiring pattern 25. Here, “substantially parallel” includes a parallel form as shown in FIG. 6, a slightly inclined form with respect to the wire connecting portion 25 b, a slightly curved form, and the like.

  The intermediate pattern portion 26c is provided integrally and continuously so as to be bent about 90 ° with respect to the first wire connecting portion 26b. The leading end of the wire connecting portion 25b (the end opposite to the positive electrode pattern base portion 25a) is adjacent to the intermediate portion in the longitudinal direction of the intermediate pattern portion 26c. Both end portions of the intermediate pattern portion 26c are inclined in opposite directions, and the intermediate pattern portion 26c is formed in a substantially curved shape. Thereby, the intermediate portion in the longitudinal direction of the intermediate pattern portion 26c is kept away from the tip of the wire connection portion 25b.

  The second wire connecting portion 26d is provided integrally and continuously so as to be bent by approximately 90 ° with respect to the intermediate pattern portion 26c. Thereby, the second wire connecting portion 26d is provided substantially parallel to the wire connecting portion 25b by forming the second element disposition space S2 between the wire connecting portion 25b of the wiring pattern 25 and the second element connecting space 25b. Here, “substantially parallel” includes a parallel form as shown in FIG. 6, a slightly inclined form with respect to the wire connecting portion 25b, a slightly curved form, and the like.

  Therefore, the negative electrode wiring pattern 26 is provided so as to surround the positive electrode wiring pattern 25 from three directions. The first wire connecting portion 26b and the second wire of the negative wiring pattern 26 are bordered by the wire connecting portion 25b of the wiring pattern 25 disposed in the center of the region surrounded by the negative wiring pattern 26. The connecting portions 26d are arranged symmetrically.

  A second negative electrode pad portion 26f is provided corresponding to the second positive electrode pad portion 25d continuously and integrally at the tip of the second wire connection portion 26d. The second negative electrode pad portion 26f is separated from the second positive electrode pad portion 25d, and an intermediate pad 27 is formed between the second negative electrode pad portion 25d and the component mounting surface 22a.

  The wiring pattern 25 may be used for the negative electrode and the wiring pattern 26 may be used for the positive electrode. In this case, “positive electrode” or “positive electrode” in the above description is read as “for negative electrode” or “negative electrode” and “negative electrode” “For” or “negative electrode” may be read as “for positive electrode” or “positive electrode”.

  Of the wiring patterns 25 and 26, the portion closest to the peripheral surface 22 c of the module substrate 22 is the intermediate pattern portion 26 c of the wiring pattern 26. The intermediate pattern portion 26c has a circumferential surface closest to the intermediate pattern portion 26c so that a predetermined creepage distance E (see FIGS. 6, 10, and 11) is ensured between the intermediate pattern portion 26c and the peripheral surface 22c closest thereto. It is provided apart from the surface 22c. Further, portions of the wiring patterns 25, 26 other than the intermediate pattern portion 26 c are provided between the peripheral surface 22 c of the module substrate 22 with a creepage distance exceeding the creepage distance E. ing.

  Further, lighting inspection pads 28 and 29 for lighting confirmation test, temperature inspection pad 31 for temperature measurement, and mounting pad 33 for component fixing are provided on the component mounting surface 22a.

  That is, the lighting inspection pad 28 is connected to the wiring pattern 25 for the positive electrode. Specifically, the lighting inspection pad 28 is provided through a pattern portion 28a branched from the positive electrode pattern base portion 25a and integrally protruding. Similarly, the lighting inspection pad 29 is connected to the negative wiring pattern 26. Specifically, a lighting inspection pad 29 is provided through a pattern portion 29a that branches from the negative electrode pattern base portion 26a and protrudes integrally.

  The temperature inspection pad 31 is provided in the vicinity of the lighting inspection pad 29 and the negative electrode wiring pattern 26 independently without having an electrical connection relationship therewith. A thermocouple is connected to the temperature inspection pad 31 so that the temperature of the light emitting module 21 can be measured.

  A pair of mounting pads 33 are formed, and these mounting pads 33 are provided between the lighting inspection pads 28 and 29.

  The alignment mark 35 includes a wire connecting portion 25b, a first element disposing space S1 and a second element disposing space S2 on both sides thereof, a first wire connecting portion 26b adjacent to the first element disposing space S1, and a second A plurality of second wire connecting portions 26d adjacent to the element arrangement space S2 are provided on both sides of the second wire connecting portion 26d. Therefore, a part of the alignment mark 35 is provided in a line along the longitudinal direction of the first wire connection part 26b at a predetermined interval, and the other alignment marks 35 are similarly connected to the second wire at a predetermined interval. It is provided in a line along the longitudinal direction of the portion 26d.

  The wiring patterns 25 and 26, the intermediate pads 27, the lighting inspection pads 28 and 29, the mounting pads 33, and the alignment marks 35 are all formed of silver, for example, silver as a main component, and these are printed by, for example, screen printing. It is provided on the mounting surface 22a (first manufacturing process). In addition, it can replace with printing and can also provide by plating.

  The first protective layer 37 and the second protective layer 38 are made of an electrically insulating material, and are printed on the component mounting surface 22a by screen printing, and the sealing resin 57 described later in the silver printed matter. In order to prevent the deterioration of the part that is not sealed by this, this part is mainly covered (second manufacturing process).

  That is, as shown in FIG. 7, the first protective layer 37 is applied to the positive electrode pattern base 25a except for the first positive electrode pad portion 25c and the second positive electrode pad portion 25d, and the first negative electrode Except for the pad portion 26e, the negative electrode pattern base portion 26a is attached. Further, the first protective layer 37 is also applied to a gap portion that secures an insulation distance A between the positive electrode pattern base portion 25a and the negative electrode pattern base portion 26a, and is also applied to the pattern portions 28a and 29a. ing. In addition, the first protective layer 37 is attached to the end of the second wire connecting portion 26d on the second negative electrode pad portion 26f side except for the second negative electrode pad portion 26f, and the intermediate layer The pad 27 is also attached to the intermediate pad 27 except for both ends of the pad 27. The second protective layer 38 is attached to substantially the entire intermediate pattern portion 26c.

  The first identity mark 41 to the fourth identity mark 44 are provided on the component mounting surface 22a in a color different from that of the module substrate 22 by, for example, screen printing (third manufacturing process). Further, by this printing, polarity indications such as “+” and “−” are also provided on the component mounting surface 22a. The first identity mark 41 to the fourth identity mark 44 and the like are preferably printed and provided simultaneously with the first protective layer 37 and the second protective layer 38. The first identity mark 41 is a company name indicating the manufacturer, the second identity mark 42 is a product name, the third identity mark 43 is a product number, and the fourth identity mark 44 is It is a two-dimensional barcode (QR code) showing information about the light emitting module 21.

  For each of the plurality of semiconductor light emitting elements 45, a light emitting element that generates heat in a light emitting state, for example, a chip-like blue LED that emits blue light is used. These semiconductor light emitting elements 45 are preferably formed of a bare chip having a configuration in which a semiconductor light emitting layer is provided on a light-transmitting element substrate made of sapphire glass and a pair of element electrodes is provided on the light emitting layer.

  Since light emission of an LED is realized by passing a forward current through a pn junction of a semiconductor, the LED is a solid element that directly converts electric energy into light. A semiconductor light emitting element that emits light based on such a light emission principle has an energy saving effect as compared with an incandescent bulb that inclines a filament to a high temperature by energization and emits visible light by its thermal radiation.

  Half of the semiconductor light emitting elements 45 are directly mounted on the module substrate 22 in the first element disposition space S1. This mounting is realized by bonding the element substrate to the component mounting surface 22a using a transparent die bond material, and the plurality of semiconductor light emitting elements 45 mounted in the first element disposition space S1 are aligned vertically and horizontally. Arranged in a matrix. Similarly, the remaining semiconductor light emitting elements 45 are mounted directly on the module substrate 22 in the second element arrangement space S2. This mounting is also realized by adhering the element substrate to the component mounting surface 22a using a transparent die bond material, and the plurality of semiconductor light emitting elements 45 mounted in the second element arrangement space S2 are also aligned vertically and horizontally. Arranged in a matrix.

  The plurality of semiconductor light emitting elements 45 disposed in the first element disposition space S1 and the plurality of semiconductor light emitting elements 45 disposed in the second element disposition space S2 are provided symmetrically with respect to the wire connection portion 25b. It has been.

  The semiconductor light emitting elements 45 arranged in a line in the direction in which the wire connection part 25 b of the wiring pattern 25 and the first wire connection part 26 b of the wiring pattern 26 are arranged are connected in series by a bonding wire 47. The semiconductor light emitting elements 45 arranged at one end of the element rows connected in series in this way are connected to the wire connecting portion 25b by the bonding wires 48. At the same time, the semiconductor light emitting element 45 disposed at the other end of the element row is connected to the first wire connecting portion 26b by a bonding wire 49.

  Similarly, the semiconductor light emitting elements 45 arranged in a row in the direction in which the wire connection portion 25 b of the wiring pattern 25 and the second wire connection portion 26 d of the wiring pattern 26 are arranged are connected in series by a bonding wire 50. . The semiconductor light emitting element 45 arranged at one end of the element rows thus connected in series is connected to the wire connecting portion 25b by the bonding wire 51. At the same time, the semiconductor light emitting element 45 disposed at the other end of the element row is connected to the second wire connecting portion 26d by the bonding wire 52 (fourth manufacturing process).

  For the bonding wires 47 to 52, a metal thin wire such as a gold wire, an aluminum wire, a copper wire, and a platinum wire can be used. In particular, moisture resistance, environment resistance, adhesion, electrical conductivity, heat It is preferable to use a gold wire having good conductivity and elongation as a bonding wire.

  By electrically connecting a plurality of semiconductor light emitting elements 45 mounted on the module substrate 22 as described above, a COB (Chip On Board) type light emitting module 21 is configured. Due to the electrical connection, the plurality of semiconductor light emitting elements 45 provided in the element disposition spaces S1 and S2 are electrically connected to, for example, 12 element rows formed by connecting 7 semiconductor light emitting elements 45 in series. Is an array connected in parallel.

  The alignment marks 35 are respectively disposed on the extended lines of the element rows in series. Then, with reference to the left and right (in the drawing) alignment marks 35 positioned on the extension line, the semiconductor light emitting element 45 is mounted by a mounting machine on a straight line passing therethrough.

  As shown in FIG. 9, the frame 55 has, for example, a square ring shape, and each of the wire connecting portions 25b, 26b, and 26d, the plurality of semiconductor light emitting elements 45, and the bonding wires 47 to 52 are housed inside the frame. Mounted on the surface 22a. The frame 55 is preferably made of a white synthetic resin. The frame 55 is attached to part of the first protective layer 37 and part of the second protective layer 38.

  The sealing resin 57 is filled in the frame 55 and seals the wire connecting portions 25b, 26b, and 26d, the plurality of semiconductor light emitting elements 45, and the bonding wires 47 to 52 in an embedded state. Are provided on the module substrate 22 (fifth manufacturing step). The sealing resin 57 is made of a transparent resin or the like mixed with a phosphor (not shown), and is translucent and gas permeable.

  For the sealing resin 57, a light-transmitting resin material such as an epoxy resin, a urea resin, or a silicone resin can be used, and a silicone resin is particularly preferable. The phosphor mixed in the sealing resin 57 is excited by light emitted from the semiconductor light emitting element 45 and emits light of a color different from this light. The color of the emitted light and the semiconductor For example, in order to obtain white illumination light under the condition that a blue LED is used for the semiconductor light emitting element 45, the light of a color necessary for illumination is formed by a combination with the emission color of the light emitting element 45. A yellow phosphor may be used, and red, blue, and yellow phosphors may be used to obtain white illumination light under the condition of using an LED that emits ultraviolet light to the semiconductor light emitting element 45.

  White light is formed by mixing the blue light and yellow light having a complementary color to the blue light, and the white light is emitted from the surface of the sealing resin 57 in the light use direction. Therefore, the light emitting surface 57 a of the light emitting module 21 is formed by the surface of the sealing resin 57, that is, the light emitting surface. The size of the light emitting surface 57 a is defined by the frame 55.

  When the area of the silver portion covered with the sealing resin 57 is C and the area of the light emitting surface 57a is D, the occupation ratio of the area C to the area D is set to 5% or more and 40% or less. . The portions covered with the sealing resin 57 of the wiring patterns 25 and 26 are the wire connection portions 25b, 26b, and 26d.

  Alternatively, the sealing resin 57 may be provided by providing a mold member corresponding to the frame 55 and providing the sealing resin 57 therein, and then removing the mold member from the module substrate 22. In this case, the portion of the wiring patterns 25 and 26 that protrudes from the sealing resin 57 is preferably previously deposited with the first protective layer 37 or the second protective layer 38.

  As shown in FIG. 5, one connector 61 and two capacitors 65 made of surface-mounted components are mounted on the component mounting surface 22a (sixth manufacturing process).

  That is, the connector 61 has a two-pin type configuration having a first terminal pin 61a and a second terminal pin 61b protruding from one side surface thereof. The connector 61 is soldered to the mounting pad 33, thereby being disposed between the lighting inspection pads 28 and 29. At the same time, the first terminal pin 61a is attached to the first positive electrode pad portion 25c, and the second terminal pin 61b is attached to the first negative electrode pad portion 26e. The connector 61 is connected with an insulation coated electric wire for direct current power supply connected to a power supply device (not shown). As a result, power can be supplied to the light emitting module 21 via the connector 61.

  One of the two capacitors 65 is soldered to one end portion of the second positive electrode pad portion 25d and the intermediate pad 27 of the wiring pattern 25, and is disposed over these. Similarly, the other of the two capacitors 65 is soldered to the second negative electrode pad portion 26 f of the wiring pattern 26 and the other end portion of the intermediate pad 27, and is disposed over these. In a normal lighting state in which direct current is supplied to each semiconductor light emitting element 45, no current flows through the capacitor 65. However, in the event that alternating current flows due to noise such as surge voltage superimposed, current flows through the capacitor 65 and the wiring patterns 25 and 26 are short-circuited, whereby alternating current is supplied to each semiconductor light emitting element 45. Is prevented.

  As shown in FIGS. 10 and 11, the light emitting module 21 having the above-described configuration is made of metal by bringing the back surface of the module substrate 22, that is, the surface opposite to the component mounting surface 22 a into close contact with the bottom surface 12 a of the recess 12. It is supported by the module support member 11. Thereby, the light emitting module 21 is supported by the module support member 11 so that heat can be radiated from the module substrate 22 to the recess 12. In a state where the light emitting module 21 supported in this manner is attached to the lamp body 4, the light emitting surface 57 a faces the light transmitting plate 5.

  In order to support the module, a plurality of, for example, two, metal holding members 70 that elastically press the periphery of the module substrate 22 are provided on the module supporting member 11 as shown in FIGS. 4, 10, and 11. It is fixed. These presser members 70 are formed by a presser member base 71 and a spring 72 forming a clamping portion. The pressing member base 71 is, for example, plate-shaped and formed in a rigid shape, and is screwed to the module support member 11. The front end portions of these pressing member bases 71 are peripheral portions of the module substrate 22 and face the component mounting surface 22a. The metal spring 72 is attached to the distal end portion of the pressing member base 71. These springs 72 are sandwiched between the peripheral portion of the module substrate 22 and the pressing member base 71, and the state in which the back surface of the module substrate 22 is in close contact with the bottom surface 12a is maintained by the spring force.

  The spring 72 may be a coil spring or a leaf spring. The pressing member 70 can also be formed of a single metal spring plate having a holding portion that contacts the module substrate 22 and capable of elastic deformation. Furthermore, the holding member 70 can be formed by using a holding portion that is in contact with the joule substrate 22 as a rigid and making the holding member base 71 fixed or integrally formed of metal capable of elastic deformation. .

  Further, the size of the concave portion 12 and the module substrate 22 of the light emitting module 21 is such that the light emitting module 21 is moved to the maximum in the concave portion 12 so that the wiring pattern 26 closest to the peripheral surface 22c approaches the spring 72 as described above. In this state, a predetermined insulation distance F (see FIG. 11) is defined between the spring 72 and the wiring pattern 26.

  When power is supplied to the road light 1 having the above-described configuration, the plurality of semiconductor light emitting elements 45 included in the light emitting module 21 emit light at the same time, so that white light emitted from the light emitting surface 57a is transmitted through the light transmitting plate 5. Directly transmitted or reflected by the inner surface of the reflector 15 and then transmitted through the light-transmitting plate 5 to illuminate a road having illumination symmetry. With this illumination, the light reflected by the first reflecting plate 15a and the second reflecting plate 15b made of a plane mirror is irradiated mainly in the longitudinal direction of the road without substantially spreading. At the same time, the light reflected by the third reflecting plate 15c and the fourth reflecting plate 15d made of a curved mirror is mainly irradiated in the width direction of the road with the irradiation angle with respect to the width direction of the road being controlled.

  In such illumination, light emitted from the light emitting surface 57a is light that has directly transmitted through the sealing resin 57 from the semiconductor light emitting element 45, or light that has been emitted from the phosphor in the sealing resin 57 and directly transmitted through the sealing resin 57. In addition, the light is incident on the component mounting surface 22a through the element substrate and the die bonding material of the semiconductor light emitting device 45, reflected by the component mounting surface 22a, and transmitted through the sealing resin 57, and emitted from the phosphor. Light that is incident on the component mounting surface 22a through the sealing resin 57, reflected by the component mounting surface 22a, and transmitted through the sealing resin 57 again is included.

  As described above, the light emitting module 21 has the module mounting surface 22a having the component mounting surface 22a made of white ceramics and has an average reflectance of 80% or more. Therefore, the light incident on the component mounting surface 22a, that is, The blue light emitted from the blue LED forming the semiconductor light emitting device 45 and the yellow light emitted from the phosphor having the emission wavelength of 470 nm to 490 nm are efficiently emitted in the road direction, in other words, the light extraction direction. Can be reflected. In particular, when the average reflectance of the component mounting surface 22a of the module substrate 22 is 85% or more and 99% or less, the light incident on the component mounting surface 22a is more efficiently reflected in the light extraction direction. Can do.

  Since the module substrate 22 having the component mounting surface 22a that reflects light is made of white ceramics and uses the ground surface as the component mounting surface 22a, the light reflection performance on the module substrate 22 is as follows. Is kept constant regardless of the elapsed time from the start of use of the light emitting module 21.

  Further, the reflection of light on the module substrate 22 side is not limited to the component mounting surface 22a, but the wire connection portion 25b of the silver wiring pattern 25 sealed with the sealing resin 57 and the first of the silver wiring pattern 26. The wire connection portion 26b and the second wire connection portion 26d are also performed. However, the wire connection portions 25b, 26b, and 26d become darker as the elapsed time from when the road light 1 is installed becomes longer. The light reflection performance gradually decreases.

  However, in the light emitting module 21 configured as described above, the area occupation ratio of the silver wire connection portions 25b, 26b, and 26d with respect to the area of the light emitting surface 57a is defined to be 40% or less. In other words, the reflection area on the component mounting surface 22a is ensured to exceed 60% of the area of the light emitting surface 57a. In this case, the positive electrode pattern base 25a of the silver wiring pattern 25 and the intermediate pattern portion 26c of the silver wiring pattern 26 are not sealed with the sealing resin 57 and are outside the light emitting surface 57a. It is preferable for making the area occupancy 40% or less.

  By defining the area occupancy rate, it is possible to limit the influence of the decrease in the light reflection performance accompanying the progress of the blackening of the wire connection portions 25b, 26b, and 26d on the light reflection performance of the entire light emitting module 21. Therefore, according to the light emitting module of Example 1, it is possible to moderate the decrease in the luminous flux maintenance factor of the light emitting module 21. In other words, the deterioration of the light reflection performance in the reflection region covered with the light emitting surface 57a is slow. As a result, the light extraction efficiency is maintained at a high level, so that the energy saving effect can be promoted.

  As the decrease in the luminous flux maintenance factor is slow as described above, it is possible to provide the road lamp 1 that takes a long time for the light emitting module 21 as the light source to reach a specified life, for example, the luminous flux maintenance factor reaches 70%. Is possible. In other words, when the area occupancy of the sealed silver portion with respect to the light emitting surface 57a is 40% or less, even when the road lamp (lighting fixture) 1 is used beyond the recommended life, Regardless of the blackening of the portion, the luminous flux maintenance factor of the light emitting module 21 can be maintained at 70% or more. Note that the recommended life as a guide for replacement of the road lamp 1 is defined when the luminous flux maintenance factor reaches 70%.

  In addition, when the area occupation ratio with respect to the light emitting surface 57a of the sealed silver portion exceeds 40%, the influence on the light reflecting performance of the entire light emitting module 21 due to the progress of blackening of the silver portion becomes too large. Accordingly, the decrease in the luminous flux maintenance factor of the light emitting module 21 is accelerated, and the time required for the luminous flux maintenance factor to reach 70% is shortened. Therefore, the problem of the present embodiment cannot be solved, which is inappropriate.

  Further, the area occupation ratio of the wire connection portions 25b, 26b, and 26d of the wiring patterns 25 and 26 sealed with the sealing resin 57 to the light emitting surface 57a is 5% or more. Thereby, the width of the wire connecting portions 25b, 26b, and 26d can be formed to be wide to some extent so as not to hinder the wire bonding of the bonding wires 48, 49, 51, and 52 to these portions. Accordingly, it is possible to prevent manufacturing problems.

  In the illumination, each semiconductor light emitting element 45 of the light emitting module 21 generates heat. By the way, the module substrate 22 is pressed and held in close contact with the bottom surface 12a of the recess 12 formed in the metal module support member 11 by the force of the plurality of springs 72. Therefore, most of the heat generated by each semiconductor light emitting element 45 is released to the module support member 11 via the module substrate 22 with the bottom surface 12a of the recess 12 as the heat receiving surface, and further transmitted to the lamp body 4 and into the atmosphere. Released. With such heat dissipation, as the temperature rise of each semiconductor light emitting element 45 is suppressed, the lifetime of the semiconductor light emitting element 45 made of a chip-like LED and a decrease in light emission efficiency are suppressed.

  Further, as the light emitting module 21 is energized and disconnected, the temperature of each semiconductor light emitting element 45 made of a chip-like LED increases in the light emitting state and decreases to room temperature in the unlit state. The substrate 22 repeats expansion and contraction.

  However, the light emitting module 21 housed in the concave portion 12 of the module support member 11 is a module having a spring 72 sandwiched between a plurality of pressing members 70 fixed to the module support member 11 and the peripheral portion of the module substrate 22. The substrate 22 is held in a state where it is elastically pressed against the bottom surface 12 a of the recess 12. Therefore, the thermal expansion of the module substrate 22 in a state where the light emitting module 21 is caused to emit light is absorbed by the elastic deformation of the spring 72, so that the thermal stress can be prevented from concentrating on the contact portion with the spring 72 of the module substrate 22. Therefore, although the module substrate 22 is made of ceramics, it is possible to suppress the module substrate 22 from cracking due to its thermal expansion.

  By the way, in the configuration in which the light emitting module 21 is supported in the recess 12 of the module support member 11 by pressing the module substrate 22 with the spring 72 as described above, the light emitting module 21 has the module as shown in FIGS. The peripheral surface 22c of the board | substrate 22 is accommodated by forming the clearance gap G between the side surfaces 12b-12e of the recessed part 12, respectively. The presence of such a gap G may cause the light emitting module 21 that is not fixed to move along the bottom surface 12 a in the recess 12 when a strong impact is applied to the light emitting module 21. The shifting movement is stopped when the peripheral surface 22c of the module substrate 22 contacts one surface or the second surface of the side surfaces 12b to 12e of the recess 12.

  However, the intermediate pattern portion 26c is formed on the module substrate 22 so that a predetermined creepage distance E is ensured between the peripheral surface 22c of the module substrate 22 and the intermediate pattern portion 26c of the wiring pattern 26 closest to the peripheral surface 22c. It is provided apart from the peripheral surface 22c. Therefore, even if the light emitting module 21 moves so that the peripheral surface 22c of the module substrate 22 contacts the side surface 12c of the recess 12 as illustrated in FIG. 11 from the state of FIG. A predetermined creepage distance E for electrical insulation between the wiring pattern 26 and the wiring pattern 26 can be ensured between the wiring pattern 26 and the side surface 12 c of the recess 12 in contact with the peripheral surface 22 c of the module substrate 22. Thereby, even if the light emitting module 21 shifts in the recess 12, there is no problem in electrical insulation between the wiring pattern 26 and the surrounding metal member.

  Furthermore, the light emitting module 21 may be moved to the maximum in the recess 12 so that the wiring pattern 26 comes close to the metal spring 72 responsible for the contact of the pressing member 70 to the module substrate 22 due to the displacement movement. However, in this state, the sizes of the module substrate 22 and the recess 12 are defined so that a predetermined insulation distance F is secured between the spring 72 and the wiring pattern 26 as illustrated in FIG. For this reason, even if the wiring pattern 26 comes closest to the spring 72 due to the movement of the light emitting module 21, the wiring pattern 26 and the metal spring 72 are electrically insulated from each other. The insulation distance F can be secured. In this respect as well, there is no problem in electrical insulation between the wiring pattern 26 and the surrounding metal member.

  DESCRIPTION OF SYMBOLS 1 ... Road light (lighting fixture), 4 ... Lamp body (equipment main body), 6 ... Light source device (light-emitting device), 11 ... Module support member, 12 ... Recessed part, 12a ... Bottom face of a recessed part, 12b-12e ... Side surface of a recessed part , 21 ... Light emitting module, 22 ... Module substrate, 22a ... Component mounting surface, 22c ... Peripheral surface of the module substrate, 25 ... Wiring pattern, 26 ... Wiring pattern, 26c ... Intermediate pattern portion (pattern portion), 45 ... Semiconductor light emitting device , 47 to 52: bonding wire, 70: pressing member, E: creepage distance, F: insulation distance

Claims (2)

A module board made of ceramic, a wiring pattern on the positive electrode side and the negative electrode side provided on the component mounting surface of the substrate, and a plurality of semiconductor light emitting elements that are electrically connected to these patterns and mounted on the component mounting surface A light emitting module;
A metal module support member having a recess for accommodating the light emitting module;
A plurality of metal pressing members which are fixed to the module support member and press the module substrate against the bottom surface of the recess in contact with the peripheral surface of the module substrate and the component mounting surface;
Comprising
The pattern portion of the wiring pattern closest to the peripheral surface of the module substrate is provided with a predetermined creepage distance between the peripheral surface and the wiring portion at the contact portion of the module substrate and the pressing member. In a state where the light emitting module is moved to the maximum in the recess so that the pattern approaches, a predetermined insulation distance is secured between the contact portion and the wiring pattern. A light-emitting device having a specified size. A light source device formed by the light emitting device according to claim 1;
An instrument body to which the light source device is attached;
The lighting fixture characterized by comprising.

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