JP2012004361A - Heat dissipation structure of subrack - Google Patents

Abstract

PROBLEM TO BE SOLVED: To improve the heat dissipation effect by preventing the heat of a subrack arranged at a lower stage from affecting the subrack arranged at an upper stage when a plurality of subrack are stacked and stored in a rack. Provide heat dissipation structure.
When a plurality of subrack are stacked and stored in a rack 10, air sucked from a front air intake port 5 is discharged to the upper surface from a plurality of upper exhaust ports 4 formed at the rear of the upper surface, and is discharged to the bottom surface of the upper subrack. Heat exhausted by the space formed by the exhaust heat induction plate 7 formed with an inclination in the upward direction can be guided to the rear rear surface, and the subrack installed in the upper stage is the heat of the subrack installed in the lower stage. It is a subrack heat dissipation structure that is not affected.
[Selection] Figure 1

Description

  The present invention relates to a heat dissipation structure for a subrack of a communication device that stores a power supply unit, an optical transmission unit, and the like, and more particularly, to a heat dissipation structure for a subrack that has a heat dissipation effect when a plurality of subracks are stacked and stored in a rack. .

[Conventional technology]
A subrack used in a conventional communication device has a structure that houses a plurality of units such as a power supply unit and an optical transmission unit.

[Conventional heat dissipation]
The heat dissipation in the conventional subrack will be described.
The conventional subrack is a natural air cooling system that draws in air from the intake port provided on the bottom surface of the subrack, flows inside the multiple units, and exhausts heat from the exhaust port provided on the upper surface of the subrack. It is like that.

[Related technologies]
Incidentally, as a prior art related to the above-described conventional technology, there is JP-A-2000-277955 “Cooling structure of electronic equipment” (Hitachi Kokusai Electric) [Patent Document 1].
Patent Document 1 describes a cooling structure for an electronic device in which a wind guide cover in which both end portions are bent in a direction away from the fin is attached to a fin tip of a heat sink.

JP 2000-277955 A

  However, in the above-described conventional subrack structure, when a plurality of subracks are stacked and stored in a rack, the subrack placed in the upper layer portion is heated to a higher temperature due to heat from below. was there.

  The present invention has been made in view of the above circumstances, and when a plurality of sub-rack is stacked and stored in a rack, the heat of the sub-rack arranged in the lower stage is not affected by the sub-rack arranged in the upper stage. It is another object of the present invention to provide a subrack heat dissipation structure capable of improving the heat dissipation effect.

  The present invention for solving the problems of the above-described conventional example is a subrack heat dissipation structure in which a plurality of subrack is stacked and stored in a rack, and a plurality of front air intakes for sucking air are provided in front of the subrack. A plurality of upper discharge ports for discharging heat to the upper surface of the subrack, and an exhaust heat induction plate is provided so that the space formed at the lower part of the bottom surface of the subrack increases toward the rear. .

  The present invention is provided with a plurality of front air inlets for sucking air on the front surface of the subrack, a plurality of upper exhaust ports for discharging heat on the upper surface of the subrack, and a space formed at the lower part of the bottom surface of the subrack Since the subrack heat dissipation structure is provided with a heat exhaust induction plate so that it becomes larger toward the front, when multiple subrack are stacked and stored in the rack, the air sucked from the front air intake port is The subrack installed in the upper stage is affected by the heat of the subrack installed in the lower stage, so that the heat exhausted in the space of the exhaust heat induction plate at the bottom of the upper subrack can be guided to the rear rear side. There is an effect that the heat dissipation effect can be improved.

It is a perspective view of a subrack concerning an embodiment of the invention. It is a front view of this subrack. It is a side view of this subrack. It is a figure which shows a waste heat route. It is the schematic which shows full mounting which concerns on this Embodiment.

Embodiments of the present invention will be described with reference to the drawings.
[Outline of the embodiment]
The subrack heat dissipation structure according to the embodiment of the present invention is provided with a plurality of front air intake ports for sucking air on the front surface of the subrack, and a plurality of upper exhaust ports for discharging heat on the upper surface of the subrack. The subrack heat dissipation structure is provided with a heat exhaust induction plate so that the space formed at the bottom bottom of the black increases toward the rear, so when multiple subracks are stacked and stored in a rack, the front intake The air sucked from the mouth is discharged from the upper outlet to the upper surface, and the heat exhausted by using the space of the exhaust heat induction plate at the bottom of the upper sub-rack can be guided to the rear rear surface. Black can prevent the influence of the heat of the subrack installed in the lower stage and improve the heat dissipation effect.

[Subrack structure: Fig. 1]
A structure of a subrack (present subrack) according to an embodiment of the present invention will be described with reference to FIG. FIG. 1 is a perspective view of a subrack according to an embodiment of the present invention.
As shown in FIG. 1, in the subrack, a power unit 2a and a plurality of communication units (light transmission units) 2b are housed in a subrack casing 1, and a front air intake port is provided at the lower front of each unit. 5, a plurality of upper discharge ports 4 are provided behind the upper surface of the housing 1, and side air intake ports 6 are also provided on the side surfaces of the housing 1.
That is, this subrack is provided with a plurality of air intakes on the front and side surfaces, instead of having air intakes on the bottom surface as in the prior art.

[Front side of subrack: Fig. 2]
Next, the front configuration of the subrack will be described with reference to FIG. FIG. 2 is a front view of the subrack.
As shown in FIG. 2, the subrack includes a power supply unit 2a and a plurality of communication units (light transmission units) 2b housed in a housing 1, and a plurality of front air inlets 5 are provided below the units. ing.

[The side of the subrack: Fig. 3]
Next, the configuration of the side surface of the subrack will be described with reference to FIG. FIG. 3 is a side view of the subrack.
As shown in FIG. 3, the subrack has two side air inlets 6 formed in the lower side of the side surface of the housing 1, and, as a characteristic part, the exhaust heat induction plate 7 constituting the bottom surface is rearward from the fulcrum P. It is formed so as to be inclined obliquely upward (to the right in FIG. 3).
The fulcrum P is the position (near) of the bottom surface in front of the position where the side air inlet 6 is formed.

[Exhaust heat induction plate 7]
The exhaust heat induction plate 7 on the bottom surface of the subrack is formed in a triangular pyramid structure in which a space (space) is formed in the lower portion and the space increases toward the rear, and heat is guided backward.
The inclination angle of the exhaust heat induction plate 7 with respect to the fulcrum P is about 1 to 5 °, and is 2 ° in FIG.
If the inclination angle is increased, the heat discharging effect is improved, but the capacity in the housing 1 is reduced, so an inclination angle of about 1 to 5 ° is an appropriate numerical value.

In FIG. 3, the fulcrum P is formed at the lower left side of the left side air inlet 6; however, the fulcrum P may be formed at the lower center of FIG.
However, when a cable is wired on the upper surface of the exhaust heat induction plate 7 and another unit is mounted, the fulcrum P is provided on the left side (front direction) from the center so that space is available, which is convenient for wiring. It is.

[Exhaust heat route: Fig. 4]
Next, the exhaust heat route of the subrack will be described with reference to FIG. FIG. 4 is a diagram showing an exhaust heat route.
FIG. 4 shows a case where the subrack is stacked in two stages on the heat exhaust route inside the housing 1 from the side surface direction of the subrack.

Air sucked from the front intake port 5 of the subrack through the route R1 flows from the lower side to the upper side of the unit through the route R2, and becomes heat and is discharged upward from the upper discharge port 4 of the housing 1 as the route R3. Is done.
Further, the heat exhausted from the upper surface of the lower subrack is exhausted by the route R4 to the back surface behind the subrack because of the formed heat exhaust guide plate 7 with an inclination.

[Full implementation: Fig. 5]
Next, a case where a plurality of the subrack are stacked and stored in a rack will be described with reference to FIG. FIG. 5 is a schematic diagram showing full mounting according to the present embodiment.
As shown in FIG. 5, a state in which a plurality of subrack housings 1 are stored in a storage rack 10 is depicted from the side surface, and four levels of subrack are stacked.

  In this way, even if multiple stages of subrack are stacked, the heat discharged from the upper surface of the subrack is discharged rearward (right side in FIG. 5) by the exhaust heat induction plate 7 on the bottom surface of the uppermost subrack. It is what is done.

[Effect of the embodiment]
According to this subrack structure, when a plurality of subrack are stacked and stored in the rack 10, the air sucked from the front intake port 5 is discharged from the upper exhaust port 4 to the upper surface and discharged from the bottom surface of the upper subrack. Since the heat exhausted by the heat induction plate 7 can be guided to the rear rear surface, the subrack installed in the upper stage is not affected by the heat of the subrack installed in the lower stage, so there is no provision for the arrangement of the subrack There is an effect that can be installed.

[Summary of embodiment]
The characteristic parts in the embodiment of the present invention are summarized below.
[Feature 1]
A subrack heat dissipation structure in which a plurality of subrack are stacked and stored in a rack, and a plurality of front exhaust ports for sucking air are provided in front of the subrack, and a plurality of upper exhausts for discharging heat to the upper surface of the subrack. An outlet is provided, and an exhaust heat induction plate is provided so that the space formed in the lower part of the bottom surface of the subrack increases toward the rear.

[Feature 2]
The subrack heat dissipation structure is characterized in that a side air inlet is provided on a side surface of the subrack.

[Feature 3]
In the heat dissipation structure of the subrack, the exhaust heat induction plate has an inclination of 1 to 5 ° with respect to the upper direction when the fulcrum is provided on the bottom surface near the front of the side air inlet. .

  In the present invention, when a plurality of sub-rack are stacked and stored in a rack, the heat of the sub-rack arranged at the lower stage is not affected by the sub-rack arranged at the upper stage, and the heat radiation effect can be improved. Suitable for black heat dissipation structure.

  DESCRIPTION OF SYMBOLS 1 ... Subrack housing, 2a ... Power supply unit, 2b ... Communication unit, 4 ... Upper exhaust port, 5 ... Front intake port, 6 ... Side intake port, 7 ... Waste heat induction plate, 10 ... Storage rack

Claims (1)

It is a subrack heat dissipation structure that stacks multiple subrack and stores them in a rack,
The front of the subrack is provided with multiple front air intakes that draw in air,
A plurality of upper discharge ports for discharging heat are provided on the upper surface of the subrack,
A heat dissipation structure for a subrack, characterized in that an exhaust heat induction plate is provided so that a space formed at a lower part of the bottom surface of the subrack increases toward the rear.

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