JP2012004214A - Flexible circuit board with waterproof member and method of manufacturing the same - Google Patents
Flexible circuit board with waterproof member and method of manufacturing the same Download PDFInfo
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- JP2012004214A JP2012004214A JP2010136057A JP2010136057A JP2012004214A JP 2012004214 A JP2012004214 A JP 2012004214A JP 2010136057 A JP2010136057 A JP 2010136057A JP 2010136057 A JP2010136057 A JP 2010136057A JP 2012004214 A JP2012004214 A JP 2012004214A
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- 238000004519 manufacturing process Methods 0.000 title claims description 34
- 229920005989 resin Polymers 0.000 claims abstract description 97
- 239000011347 resin Substances 0.000 claims abstract description 97
- 229920002050 silicone resin Polymers 0.000 claims description 73
- 238000000034 method Methods 0.000 abstract description 26
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract description 5
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 5
- 239000000853 adhesive Substances 0.000 description 19
- 230000001070 adhesive effect Effects 0.000 description 19
- 239000000463 material Substances 0.000 description 15
- 238000000465 moulding Methods 0.000 description 10
- 238000001723 curing Methods 0.000 description 6
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 6
- 238000010438 heat treatment Methods 0.000 description 4
- 229920001187 thermosetting polymer Polymers 0.000 description 4
- 238000004078 waterproofing Methods 0.000 description 4
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- -1 acryl group Chemical group 0.000 description 2
- 238000012856 packing Methods 0.000 description 2
- 230000003014 reinforcing effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- 238000003848 UV Light-Curing Methods 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 230000003078 antioxidant effect Effects 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 125000005641 methacryl group Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920005749 polyurethane resin Polymers 0.000 description 1
- 239000000565 sealant Substances 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
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Abstract
Description
本発明は、防水部材付きフレキシブル回路基板、特に、携帯電話に用いられるフレキシブル回路基板、及びその製造方法に関するものである。 The present invention relates to a flexible circuit board with a waterproof member, and more particularly to a flexible circuit board used in a mobile phone and a method for manufacturing the same.
近年の携帯電話には、高い防水性能が要求されている。 Recent mobile phones are required to have high waterproof performance.
通常、携帯電話では、第１の筐体と第２の筐体がヒンジ部で繋がっている。図１に、携帯電話のヒンジ部近傍の断面図を示す。携帯電話１では、電子部品や回路基板４ａが内部に設置されている第１の筐体２ａと、電子部品や回路基板４ｂが内部に設置されている第２の筐体２ｂがヒンジ部３で繋がっている。そして、それぞれの筐体内の電子部品又は回路基板４は、フレキシブル回路基板５により、電気的に接続されている。詳細には、該フレキシブル回路基板の両端のコネクタ６ａ、６ｂが、回路基板４ａ、４ｂと繋がっている。あるいは、該フレキシブル回路基板の両端のコネクタ６ａ、６ｂが、筐体内の電子部品に直接繋がっている。 Usually, in a mobile phone, the first housing and the second housing are connected by a hinge portion. FIG. 1 is a cross-sectional view of the vicinity of a hinge portion of a mobile phone. In the mobile phone 1, the hinge portion 3 includes a first housing 2 a in which electronic components and a circuit board 4 a are installed, and a second housing 2 b in which electronic components and a circuit board 4 b are installed. It is connected. The electronic components or the circuit board 4 in each case are electrically connected by the flexible circuit board 5. Specifically, connectors 6a and 6b at both ends of the flexible circuit board are connected to the circuit boards 4a and 4b. Alternatively, the connectors 6a and 6b at both ends of the flexible circuit board are directly connected to the electronic components in the housing.
このとき、フレキシブル回路基板５は、第１の筐体２ａ内から一旦外に出て、ヒンジ部３の内部を通り、第２の筐体２ｂ内に繋がっている。そのため、筐体２とフレキシブル回路基板５との間の防水が不十分だと、携帯電話１に水がかかったり、携帯電話１を水中に落とした場合には、筐体２内に水が浸入してしまうために、電子部品等が故障してしまう。 At this time, the flexible circuit board 5 once goes out of the first housing 2a, passes through the inside of the hinge portion 3, and is connected to the second housing 2b. For this reason, if the waterproofing between the housing 2 and the flexible circuit board 5 is insufficient, the mobile phone 1 may be splashed with water or the mobile phone 1 may be dropped into the water. As a result, an electronic component or the like breaks down.
そこで、特開２００３−１４２８３６号公報（特許文献１）では、筐体とフレキシブル回路基板との間に、パッキンを配置して、防水する防水構造が開示されている。 In view of this, Japanese Patent Application Laid-Open No. 2003-142836 (Patent Document 1) discloses a waterproof structure in which a packing is disposed between a housing and a flexible circuit board to waterproof.
また、特開２００４−２１４９２７号公報（特許文献２）には、インサート成型により、防水キャップをフレキシブル回路基板に固定し、更に、防水キャップの外周にＯリングを配置する防水構造が開示されている。 Japanese Patent Laid-Open No. 2004-214927 (Patent Document 2) discloses a waterproof structure in which a waterproof cap is fixed to a flexible circuit board by insert molding, and an O-ring is disposed on the outer periphery of the waterproof cap. .
ところが、特許文献１の防水構造では、パッキンの劣化により防水性能が低下するという問題があった。また、特許文献２の防水構造では、フレキシブル回路基板が破損し易いという問題があった。 However, the waterproof structure of Patent Document 1 has a problem that the waterproof performance is reduced due to deterioration of the packing. Further, the waterproof structure of Patent Document 2 has a problem that the flexible circuit board is easily damaged.
また、特許文献２の防水構造では、防水キャップを付設するために、フレキシブル回路基板に金型を取り付け、インサート成型するという工程が必要となり、製造工程が煩雑になるという問題があった。 Moreover, in the waterproof structure of patent document 2, in order to attach a waterproof cap, the process of attaching a metal mold | die to a flexible circuit board and insert-molding was needed, and there existed a problem that a manufacturing process became complicated.
従って、本発明の課題は、防水性能が高いフレキシブル回路基板を提供することにある。また、本発明の課題は、製造が簡便なフレキシブル回路基板を提供することにある。 Accordingly, an object of the present invention is to provide a flexible circuit board having high waterproof performance. Another object of the present invention is to provide a flexible circuit board that is easy to manufacture.
なお、携帯電話に限らず、電子部品や回路基板が内部に設置されている複数の筐体が、ヒンジ部で繋がっている構造を有する電子機器においては、上記課題は、共通の課題である。 Note that the above-described problem is a common problem in electronic devices having a structure in which a plurality of housings in which electronic components and circuit boards are installed are connected by hinges, not limited to mobile phones.
このような目的は、以下の本発明（１）〜（３）により達成される。
（１）電子機器の筐体に挿通されるフレキシブル回路基板と、該フレキシブル回路基板の防水部位に付設されている防水部材と、を有し、
該防水部材は、フレキシブル回路基板側に配設されている紫外線硬化性シリコン樹脂の硬化物と筐体側に配設されている筐体側樹脂とからなり、
該紫外線硬化性シリコン樹脂の硬化物は、防水性の弾性体であること、
を特徴とする防水部材付きフレキシブル回路基板。
（２）更に、前記筐体側樹脂の外周に、硬化性シリコン樹脂の硬化物が配設されていることを特徴とする（１）記載の防水部材付きフレキシブル回路基板。
（３）筐体側樹脂の成形体と、該成形体のフレキシブル回路基板側に配設されている紫外線硬化性シリコン樹脂の硬化物と、からなる防水部材片２個を、フレキシブル回路基板を上下から挟み込むように合わせて、該フレキシブル回路基板を２個の該防水部材片で囲う第１の工程と、
該筐体側樹脂と該紫外線硬化性シリコン樹脂の硬化物とが付着し且つ該紫外線硬化性シリコン樹脂の硬化物と該フレキシブル回路基板とが付着するように、２個の該防水部材片を接着する第２の工程と、
を有することを特徴とする防水部材付きフレキシブル回路基板の製造方法。
Such an object is achieved by the following present inventions (1) to (3).
(1) having a flexible circuit board inserted into the casing of the electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is composed of a cured product of an ultraviolet curable silicone resin disposed on the flexible circuit board side and a housing side resin disposed on the housing side,
The cured product of the ultraviolet curable silicone resin is a waterproof elastic body,
A flexible circuit board with a waterproof member.
(2) The flexible circuit board with waterproof member according to (1), wherein a cured product of a curable silicone resin is further disposed on the outer periphery of the housing side resin.
(3) Two waterproof member pieces comprising a molded body of the housing side resin and a cured product of the ultraviolet curable silicone resin disposed on the flexible circuit board side of the molded body, the flexible circuit board from above and below A first step of surrounding the flexible circuit board with two pieces of the waterproofing member so as to be sandwiched,
The two waterproof member pieces are bonded so that the housing side resin and the cured product of the ultraviolet curable silicone resin adhere to each other and the cured product of the ultraviolet curable silicone resin and the flexible circuit board adhere to each other. A second step;
The manufacturing method of the flexible circuit board with a waterproof member characterized by having.
本発明によれば、防水性能が高いフレキシブル回路基板を提供することができる。また、本発明によれば、製造が簡便なフレキシブル回路基板を提供することができる。 According to the present invention, a flexible circuit board having high waterproof performance can be provided. Moreover, according to this invention, the flexible circuit board with easy manufacture can be provided.
本発明の防水部材付きフレキシブル回路基板は、電子機器の筐体に挿通されるフレキシブル回路基板と、該フレキシブル回路基板の防水部位に付設されている防水部材と、を有し、
該防水部材は、フレキシブル回路基板側に配設されている紫外線硬化性シリコン樹脂の硬化物と筐体側に配設されている筐体側樹脂とからなり、
該紫外線硬化性シリコン樹脂の硬化物は、防水性の弾性体であること、
を特徴とする防水部材付きフレキシブル回路基板である。
The flexible circuit board with a waterproof member of the present invention has a flexible circuit board inserted into a housing of an electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is composed of a cured product of an ultraviolet curable silicone resin disposed on the flexible circuit board side and a housing side resin disposed on the housing side,
The cured product of the ultraviolet curable silicone resin is a waterproof elastic body,
It is the flexible circuit board with a waterproof member characterized by these.
本発明の防水部材付きフレキシブル回路基板について、図２及び図３を参照して説明する。図２は、本発明の防水部材付きフレキシブル回路基板の形態例の模式的な平面図であり、図３は、図２中の防水部材をｘ−ｘ断面で切ったときの断面図である。 The flexible circuit board with a waterproof member of the present invention will be described with reference to FIGS. FIG. 2 is a schematic plan view of an embodiment of the flexible circuit board with waterproof member of the present invention, and FIG. 3 is a cross-sectional view of the waterproof member in FIG.
図２中、防水部材付きフレキシブル回路基板１０は、フレキシブル回路基板５と、防水部材７（７ａ、７ｂ）と、を有している。フレキシブル回路基板５の両端には、コネクタ６（６ａ、６ｂ）が付設されている。また、コネクタ６が付設されている側とは反対側のフレキシブル回路基板上には、補強板が付設されていてもよい。そして、防水部材付きフレキシブル回路基板１０は、電子部品又は回路基板が内部に設置されている２つの筐体が、ヒンジ部で取り付けられている電子機器、例えば、図１に示す携帯電話に用いられる。 In FIG. 2, the flexible circuit board 10 with a waterproof member has the flexible circuit board 5 and the waterproof member 7 (7a, 7b). Connectors 6 (6a, 6b) are attached to both ends of the flexible circuit board 5. Further, a reinforcing plate may be provided on the flexible circuit board opposite to the side on which the connector 6 is provided. And the flexible circuit board 10 with a waterproof member is used for the electronic device in which two housings in which the electronic component or the circuit board is installed are attached by a hinge part, for example, the mobile phone shown in FIG. .
図３に示すように、防水部材７は、フレキシブル回路基板５を囲むようにして、フレキシブル回路基板５に取り付けられている。防水部材７は、筐体側樹脂８（８ａ、８ｂ）と、紫外線硬化性シリコン樹脂の硬化物９（９ａ、９ｂ）とからなる。つまり、防水部材７では、フレキシブル回路基板５を囲むようにして、紫外線硬化性シリコン樹脂の硬化物９が配設され、この紫外線硬化性シリコン樹脂の硬化物９を囲むようにして、筐体側樹脂８が配設されている。なお、筐体側樹脂８同士は、接着面２２で、接着剤により接着されている。また、紫外線硬化性シリコン樹脂の硬化物９同士は、紫外線硬化性シリコン樹脂の硬化物９ａと９ｂの間から水が浸入しないように、互いに接着又は付着しているか、あるいは、紫外線硬化性シリコン樹脂の硬化物９ａと９ｂが接着剤により接着されている。 As shown in FIG. 3, the waterproof member 7 is attached to the flexible circuit board 5 so as to surround the flexible circuit board 5. The waterproof member 7 includes a housing side resin 8 (8a, 8b) and a cured product 9 (9a, 9b) of an ultraviolet curable silicone resin. That is, in the waterproof member 7, the cured product 9 of the ultraviolet curable silicone resin is disposed so as to surround the flexible circuit board 5, and the housing side resin 8 is disposed so as to surround the cured product 9 of the ultraviolet curable silicone resin. Has been. The housing side resins 8 are bonded to each other at the bonding surface 22 with an adhesive. Further, the cured products 9 of the ultraviolet curable silicone resin are adhered or adhered to each other so that water does not enter between the cured products 9a and 9b of the ultraviolet curable silicone resin, or the cured products of the ultraviolet curable silicone resin. The cured products 9a and 9b are bonded with an adhesive.
防水部材付きフレキシブル回路基板１０が用いられている電子機器では、フレキシブル回路基板の一端に付設されているコネクタ６ａは、第１の筐体内の電子部品又は回路基板に接続され、フレキシブル回路基板の他端に付設されているコネクタ６ｂは、第２の筐体内の電子部品又は回路基板に接続され、フレキシブル回路基板５のヒンジ内内設部２１は、ヒンジ部内に収められる。このとき、フレキシブル回路基板５は、第１の筐体の内部から外へ出て、ヒンジ部の内部を通って、第２の筐体の内部に入るように設置される。 In the electronic device using the flexible circuit board 10 with the waterproof member, the connector 6a attached to one end of the flexible circuit board is connected to the electronic component or the circuit board in the first casing, and the other flexible circuit board. The connector 6b attached to the end is connected to an electronic component or circuit board in the second housing, and the hinge internal part 21 of the flexible circuit board 5 is accommodated in the hinge part. At this time, the flexible circuit board 5 is installed so as to go out from the inside of the first housing, pass through the inside of the hinge portion, and enter the inside of the second housing.
防水部材７は、電子機器の筐体とフレキシブル回路基板５との間隙を埋めるようにして配置されることにより、これらの間隙を密封して防水する。詳細には、防水部材７の紫外線硬化性シリコン樹脂の硬化物９が、フレキシブル回路基板５に接着すること又は付着することにより、フレキシブル回路基板５と防水部材７との隙間からの水の浸入が防止される。また、防水部材７の筐体側樹脂８が、筐体に直接接着されるか、又は防水部材７の外周にシール材を付設して、筐体に接着されることにより、筐体と防水部材７との隙間からの水の浸入が防止される。 The waterproof member 7 is disposed so as to fill a gap between the casing of the electronic device and the flexible circuit board 5, thereby sealing and waterproofing the gap. Specifically, the UV curable silicone resin cured product 9 of the waterproof member 7 adheres to or adheres to the flexible circuit board 5, thereby allowing water to enter from the gap between the flexible circuit board 5 and the waterproof member 7. Is prevented. The casing-side resin 8 of the waterproof member 7 is directly bonded to the casing, or a sealant is attached to the outer periphery of the waterproof member 7 and bonded to the casing, whereby the casing and the waterproof member 7 are bonded. Intrusion of water from the gap is prevented.
本発明に係るフレキシブル回路基板としては、通常、ヒンジ部内を通って第１の筐体内の電子部品又は回路基板と第２の筐体内の電子部品又は回路基板とを繋ぐために用いられているフレキシブル回路基板であればよく、特に制限されない。本発明に係るフレキシブル回路基板としては、例えば、片面に回路が形成されているフレキシブル回路基板や、両面に回路が形成されているフレキシブル回路基板が挙げられ、また、一層のフレキシブル回路基板であっても、２以上のフレキシブル回路基板が重ねられている多層のフレキシブル回路基板であってもよい。 The flexible circuit board according to the present invention is usually a flexible circuit board that is used to connect the electronic component or circuit board in the first housing and the electronic component or circuit board in the second housing through the hinge portion. Any circuit board may be used and is not particularly limited. Examples of the flexible circuit board according to the present invention include a flexible circuit board in which a circuit is formed on one side and a flexible circuit board in which a circuit is formed on both sides. Alternatively, it may be a multilayer flexible circuit board in which two or more flexible circuit boards are stacked.
本発明に係るフレキシブル回路基板は、表面が樹脂材で覆われている。フレキシブル回路基板を覆っている樹脂材としては、通常のフレキシブル回路基板に用いられている材質であれば、特に制限されないが、シリコン樹脂、フッ素系樹脂、ウレタン樹脂、エラストマー樹脂等の弾性樹脂が、フレキシブル回路基板が適度な柔軟性を有する点で好ましい。 The surface of the flexible circuit board according to the present invention is covered with a resin material. The resin material covering the flexible circuit board is not particularly limited as long as it is a material used for a normal flexible circuit board, but an elastic resin such as a silicon resin, a fluorine resin, a urethane resin, an elastomer resin, The flexible circuit board is preferable in that it has appropriate flexibility.
本発明の防水部材付きフレキシブル回路基板では、フレキシブル回路基板に、防水部材が付設されている。防水部材が付設される箇所は、フレキシブル回路基板の防水部位であり、例えば、図２では、防水部材７が付設されている箇所がフレキシブル回路基板の防水部位である。そして、防水部位は、フレキシブル回路基板のうち、筐体に形成されているフレキシブル回路基板が挿入される部位（筐体の挿通部位）に位置する部位であり、例えば、図１では、符号１８で示す部分が、防水部位１８ａ、１８ｂである。 In the flexible circuit board with a waterproof member of the present invention, the waterproof member is attached to the flexible circuit board. The place where the waterproof member is attached is a waterproof part of the flexible circuit board. For example, in FIG. 2, the place where the waterproof member 7 is attached is the waterproof part of the flexible circuit board. And a waterproof part is a part located in the site | part (insertion part of a housing | casing) where the flexible circuit board currently formed in the housing | casing is inserted among flexible circuit boards, For example, in FIG. The portions shown are waterproof portions 18a and 18b.
本発明に係る防水部材は、紫外線硬化性シリコン樹脂の硬化物と、筐体側樹脂と、からなる。 The waterproof member according to the present invention includes a cured product of an ultraviolet curable silicone resin and a housing side resin.
本発明に係る紫外線硬化性シリコン樹脂の硬化物は、フレキシブル回路基板に直接接触しており、フレキシブル回路基板を囲むように配設されている。紫外線硬化性シリコン樹脂の硬化物は、紫外線硬化性シリコン樹脂の硬化物なので、防水性能を有している。また、本発明に係る紫外線硬化性シリコン樹脂の硬化物は、弾性体である。 The cured product of the ultraviolet curable silicone resin according to the present invention is in direct contact with the flexible circuit board and is disposed so as to surround the flexible circuit board. Since the cured product of the ultraviolet curable silicone resin is a cured product of the ultraviolet curable silicone resin, it has waterproof performance. Further, the cured product of the ultraviolet curable silicone resin according to the present invention is an elastic body.
紫外線硬化性シリコン樹脂の硬化物は、紫外線照射により硬化する紫外線硬化性のシリコン樹脂を、硬化させた硬化物である。そして、紫外線硬化性シリコン樹脂の硬化物は、紫外線硬化性シリコン樹脂の硬化物なので、防水性能を有する。 The cured product of the ultraviolet curable silicone resin is a cured product obtained by curing an ultraviolet curable silicone resin that is cured by ultraviolet irradiation. And since the hardened | cured material of an ultraviolet curable silicone resin is a hardened | cured material of an ultraviolet curable silicone resin, it has waterproof performance.
本発明に係る紫外線硬化性シリコン樹脂、すなわち、硬化前の樹脂としては、紫外線を照射することにより硬化する紫外線硬化性シリコン樹脂である。このような紫外線硬化性シリコン樹脂としては、例えば、アクリル基又はメタクリル基等の紫外線硬化性の官能基を有するオルガノポリシロキサンが挙げられる。 The ultraviolet curable silicone resin according to the present invention, that is, the resin before curing is an ultraviolet curable silicone resin that is cured by irradiation with ultraviolet rays. Examples of such an ultraviolet curable silicone resin include organopolysiloxane having an ultraviolet curable functional group such as an acryl group or a methacryl group.
本発明に係る筐体側樹脂は、フレキシブル回路基板側に配設されている硬化性シリコン樹脂の硬化物を囲み込むように配設されている。 The housing side resin according to the present invention is disposed so as to surround a cured product of the curable silicon resin disposed on the flexible circuit board side.
筐体側樹脂としては、熱硬化性樹脂、熱可塑性樹脂等が挙げられる。筐体側樹脂に係る熱硬化性樹脂としては、例えば、フェノール樹脂、エポキシ樹脂、ポリウレタン樹脂等が挙げられる。筐体側樹脂に係る熱可塑性樹脂としては、例えば、ナイロン等のポリアミド樹脂、ポリエチレン、ポリスチレン等が挙げられる。 Examples of the housing-side resin include a thermosetting resin and a thermoplastic resin. Examples of the thermosetting resin related to the housing side resin include a phenol resin, an epoxy resin, and a polyurethane resin. Examples of the thermoplastic resin related to the housing side resin include polyamide resins such as nylon, polyethylene, polystyrene, and the like.
なお、紫外線硬化性シリコン樹脂の硬化物と筐体側樹脂との間から水が浸入しないように、フレキシブル回路基板側樹脂は、筐体側樹脂に接着又は付着している。 The flexible circuit board side resin is adhered or adhered to the housing side resin so that water does not enter between the cured product of the ultraviolet curable silicone resin and the housing side resin.
紫外線硬化性シリコン樹脂の硬化物及び筐体側樹脂は、必要に応じて、硬化促進剤、充填剤、酸化防止剤等を含有することができる。 The hardened | cured material and housing | casing side resin of a ultraviolet curable silicone resin can contain a hardening accelerator, a filler, antioxidant, etc. as needed.
本発明の防水部材付きフレキシブル回路基板は、その両端に、筐体内の電子部品又は回路基板と接続するためのコネクタが付設されている。また、本発明の防水部材付きフレキシブル回路基板は、必要に応じて、表面実装が可能な電子部材、例えば、抵抗、トランジスタ、コンデンサ等が付設されている。 The waterproof circuit-equipped flexible circuit board of the present invention is provided with connectors for connecting to the electronic components in the housing or the circuit board at both ends thereof. Moreover, the flexible circuit board with a waterproof member of the present invention is provided with an electronic member that can be surface-mounted, for example, a resistor, a transistor, a capacitor, or the like, if necessary.
本発明の防水部材付きフレキシブル回路基板が用いられる電子機器としては、電子部品又は回路基板が内部に設置されている２個の筐体が、ヒンジ部で繋がっている電子機器であれば、特に制限されず、携帯電話、デジタルカメラ、デジタルムービー等が挙げられる。 The electronic device using the flexible circuit board with a waterproof member of the present invention is not particularly limited as long as it is an electronic device in which two housings in which electronic components or circuit boards are installed are connected by a hinge portion. Examples include mobile phones, digital cameras, and digital movies.
従来のインサート成形により得られる防水部材は、一層の樹脂からなり、硬い樹脂が直接フレキシブル回路基板に接着している。そのため、フレキシブル回路基板全体が動いたときに、防水部材の近傍のフレキシブル回路基板に、応力が集中してしまい、フレキシブル回路基板が破損し易い構造となっている。防水性能を高めるために、防水部材とフレキシブル回路基板の接着を強固にすれば、するほど、破損し易くなる。 A waterproof member obtained by conventional insert molding is made of a single layer of resin, and a hard resin is directly bonded to the flexible circuit board. Therefore, when the entire flexible circuit board is moved, the stress is concentrated on the flexible circuit board in the vicinity of the waterproof member, and the flexible circuit board is easily damaged. In order to enhance the waterproof performance, the stronger the adhesion between the waterproof member and the flexible circuit board, the easier it is to break.
それに対して、本発明の防水部材付きフレキシブル回路基板では、防水部材が、２種類の樹脂により構成されており、そのうちのフレキシブル回路基板側に、紫外線硬化性シリコン樹脂の硬化物が配設されている。そして、防水部材に配設されている紫外線硬化性シリコン樹脂の硬化物は、弾性体であるので、筐体側樹脂として、硬い樹脂を用いた場合でも、フレキシブル回路基板全体が動いたときに、防水部材の近傍のフレキシブル回路基板にかかる応力を、紫外線硬化性シリコン樹脂の硬化物が緩和することができる。 On the other hand, in the flexible circuit board with a waterproof member of the present invention, the waterproof member is composed of two types of resins, and a cured product of an ultraviolet curable silicone resin is disposed on the flexible circuit board side of them. Yes. And since the hardened | cured material of the ultraviolet curable silicone resin arrange | positioned at the waterproof member is an elastic body, even when a hard resin is used as a housing side resin, it is waterproof when the entire flexible circuit board moves. The cured product of the ultraviolet curable silicone resin can relieve the stress applied to the flexible circuit board in the vicinity of the member.
また、従来のインサート成形により得られる防水部材は、一層の樹脂からなるため、防水部材を形成する材質として、インサート成形ができ且つフレキシブル回路基板の表面の材質との間で、防水性能を発揮できるように強固且つ密に接着できるような材質を使用しなければならない。そのため、防水部材として使用できる材質が制限されてしまい、その結果、筐体と防水部材とを直接接触させる場合に、筐体側樹脂の材質として、筐体との間で高い防水性能を発揮するような樹脂を選択できないために、防水性能が不十分になるおそれがあった。 Moreover, since the waterproof member obtained by conventional insert molding is made of a single layer of resin, it can be insert-molded as a material for forming the waterproof member, and can exhibit waterproof performance with the surface material of the flexible circuit board. A material that can be firmly and closely bonded must be used. Therefore, the material that can be used as the waterproof member is limited, and as a result, when the housing and the waterproof member are brought into direct contact with each other, the housing side resin material exhibits high waterproof performance with the housing. Since a suitable resin cannot be selected, there is a possibility that the waterproof performance may be insufficient.
それに対して、本発明の防水部材付きフレキシブル回路基板では、フレキシブル回路基板側の樹脂として、フレキシブル回路基板との間で防水性能を発揮できる紫外線硬化性のシリコン樹脂の硬化物を用いているので、筐体側樹脂の材質としては、フレキシブル回路基板との相性を考慮する必要がない。そのため、筐体との間で防水性を高めるような樹脂を、筐体側樹脂として選択することが可能となる。 On the other hand, in the flexible circuit board with a waterproof member of the present invention, as the resin on the flexible circuit board side, a cured product of an ultraviolet curable silicone resin that can exhibit waterproof performance with the flexible circuit board is used. As the material of the housing side resin, it is not necessary to consider compatibility with the flexible circuit board. Therefore, it is possible to select a resin that enhances waterproofness with the housing as the housing-side resin.
本発明の防水部材付きフレキシブル回路基板を製造する方法は、特に制限されず、例えば、フレキシブル回路基板の防水部位に紫外線硬化性シリコン樹脂の硬化物の成形体を接着し、次いで、接着した紫外線硬化性シリコン樹脂の硬化物の外側に筐体側樹脂の成形体を接着する方法等の２段階の工程でフレキシブル回路基板に防水部材を取り付ける方法であっても、次に示すように、１段階の工程でフレキシブル回路基板に防水部材を取り付ける方法であってもよい。 The method for producing the flexible circuit board with waterproof member of the present invention is not particularly limited. For example, a cured product of an ultraviolet curable silicone resin is bonded to a waterproof part of the flexible circuit board, and then the bonded ultraviolet curing is performed. Even if the waterproof member is attached to the flexible circuit board in a two-step process such as a method of adhering the molded body of the casing side resin to the outside of the cured silicone resin, a one-step process as shown below The method of attaching a waterproof member to a flexible circuit board may be used.
本発明の防水部材付きフレキシブル回路基板の製造方法は、筐体側樹脂の成形体と、該成形体のフレキシブル回路基板側に配設されている紫外線硬化性シリコン樹脂の硬化物と、からなる防水部材片２個を、フレキシブル回路基板を上下から挟み込むように合わせて、該フレキシブル回路基板を２個の該防水部材片で囲う第１の工程と、
該筐体側樹脂と該紫外線硬化性シリコン樹脂の硬化物とが付着し且つ該紫外線硬化性シリコン樹脂の硬化物と該フレキシブル回路基板とが付着するように、２個の該防水部材片を接着する第２の工程と、
を有することを特徴とする防水部材付きフレキシブル回路基板の製造方法である。
The method for producing a flexible circuit board with a waterproof member according to the present invention comprises a molded body of a housing side resin, and a cured product of an ultraviolet curable silicone resin disposed on the flexible circuit board side of the molded body. A first step in which two pieces are aligned so as to sandwich the flexible circuit board from above and below, and the flexible circuit board is surrounded by the two waterproof member pieces;
The two waterproof member pieces are bonded so that the housing side resin and the cured product of the ultraviolet curable silicone resin adhere to each other and the cured product of the ultraviolet curable silicone resin and the flexible circuit board adhere to each other. A second step;
A method for producing a flexible circuit board with a waterproof member, comprising:
本発明の防水部材付きフレキシブル回路基板の製造方法について、図４及び図５を参照して説明する。図４及び図５は、本発明の防水部材付きフレキシブル回路基板の製造方法を示す模式的な断面図である。 The manufacturing method of the flexible circuit board with a waterproof member of this invention is demonstrated with reference to FIG.4 and FIG.5. FIG.4 and FIG.5 is typical sectional drawing which shows the manufacturing method of the flexible circuit board with a waterproof member of this invention.
図４に示すように、先ず、筐体側樹脂の成形体２０（２０ａ、２０ｂ）と、その内側に配設されている紫外線硬化性シリコン樹脂の硬化物１９（１９ａ、１９ｂ）と、からなる防水部材片２３（２３ａ、２３ｂ）を２個用意する。次いで、図４及び図５に示すように、これら２個の防水部材片２３で、フレキシブル回路基板５の防水部位を上下から挟み込むようにして、２個の防水部材片２３ａと２３ｂとを合わせる。このとき、防水部材片２３ａと２３ｂとが合わさる面が、２個の部材を接着するための接着面２２なので、この接着面２２に、接着剤１１を塗布してから、２個の防水部材片２３を合わせる。 As shown in FIG. 4, first, a waterproof body comprising a molded body 20 (20a, 20b) of a housing side resin and a cured product 19 (19a, 19b) of an ultraviolet curable silicone resin disposed on the inside thereof. Two member pieces 23 (23a, 23b) are prepared. Next, as shown in FIGS. 4 and 5, the two waterproof member pieces 23 a and 23 b are combined with each other such that the waterproof portion of the flexible circuit board 5 is sandwiched from above and below by these two waterproof member pieces 23. At this time, the surface where the waterproof member pieces 23a and 23b are joined is the adhesive surface 22 for bonding the two members, so that the two waterproof member pieces are applied after the adhesive 11 is applied to the adhesive surface 22. 23.
次いで、２個の防水部材片２３を合わせた状態で、加熱することにより接着剤１１を熱硬化させて、防水部材片２３ａと２３ｂとを接着する。 Next, in a state where the two waterproof member pieces 23 are combined, the adhesive 11 is thermally cured by heating to bond the waterproof member pieces 23a and 23b.
そして、本発明の防水部材付きフレキシブル回路基板の製造方法では、防水部材片２３ａと２３ｂとを合わせる際に、紫外線硬化性シリコン樹脂の硬化物１９ａ、１９ｂは、筐体側樹脂の成形体２０ａ、２０ｂにより、フレキシブル回路基板５の防水部位に押しつけられ、その状態で、防水部材片２３ａと２３ｂとが接着されるので、紫外線硬化性シリコン樹脂の硬化物１９ａ、１９ｂは、フレキシブル回路基板５及び筐体側樹脂の成形体２０ａ、２０ｂの両方に付着する。このことにより、フレキシブル回路基板５と紫外線硬化性シリコン樹脂の硬化物１９との間が防水され、且つ、紫外線硬化性シリコン樹脂の硬化物１９と筐体側樹脂２０との間が防水される。 And in the manufacturing method of the flexible circuit board with a waterproof member of this invention, when match | combining the waterproof member pieces 23a and 23b, the hardened | cured material 19a, 19b of a ultraviolet curable silicone resin is the molding 20a, 20b of housing | casing side resin. Is pressed against the waterproof portion of the flexible circuit board 5, and the waterproof member pieces 23a and 23b are bonded in this state. Therefore, the cured products 19a and 19b of the ultraviolet curable silicone resin are attached to the flexible circuit board 5 and the housing side. It adheres to both resin molded bodies 20a and 20b. Accordingly, the space between the flexible circuit board 5 and the cured product 19 of the ultraviolet curable silicone resin is waterproofed, and the space between the cured product 19 of the ultraviolet curable silicone resin and the housing side resin 20 is waterproofed.
本発明の防水部材付きフレキシブル回路基板の製造方法に係る第１工程は、本発明の防水部材付きフレキシブル回路基板の製造方法に係る防水部材片２個を、フレキシブル回路基板を上下から挟み込むように合わせて、フレキシブル回路基板を２個の防水部材片で囲う工程である。 In the first step according to the method for manufacturing a flexible circuit board with waterproof member of the present invention, two waterproof member pieces according to the method for manufacturing a flexible circuit board with waterproof member of the present invention are aligned so as to sandwich the flexible circuit board from above and below. In this step, the flexible circuit board is surrounded by two waterproof member pieces.
本発明の防水部材付きフレキシブル回路基板の製造方法に係る防水部材片は、筐体側樹脂の成形体と、その成形体のフレキシブル回路基板側、つまり、筐体側樹脂の成形体の内側に配設されている紫外線硬化性シリコン樹脂の硬化物と、からなる。 A waterproof member piece according to the method for producing a flexible circuit board with a waterproof member of the present invention is disposed on a housing-side resin molded body, and on the flexible circuit board side of the molded body, that is, on the inside of the housing-side resin molded body. And a cured product of an ultraviolet curable silicone resin.
本発明の防水部材付きフレキシブル回路基板の製造方法に係る筐体側樹脂及び紫外線硬化性シリコン樹脂の硬化物は、本発明の防水部材付きフレキシブル回路基板に係る筐体側樹脂及び紫外線硬化性シリコン樹脂の硬化物と同様である。 The cured product of the housing side resin and the ultraviolet curable silicone resin according to the method for manufacturing the flexible circuit board with waterproof member of the present invention is cured of the housing side resin and the ultraviolet curable silicon resin according to the flexible circuit substrate with the waterproof member of the present invention. It is the same as a thing.
本発明の防水部材付きフレキシブル回路基板の製造方法では、筐体側樹脂の種類は、第２工程での２個の防水部材片を接着するときの硬化温度や硬化時間（接着剤が熱硬化性樹脂の場合）、加熱温度や冷却温度（接着剤が熱可塑性樹脂の場合）等の製造条件や、筐体と直接接触させて防水する場合には、筐体との相互作用で防水性能を発揮できるように等、他の樹脂との防水性能における相性や、密着性、耐久性等を考慮して、適宜選択される。 In the method for manufacturing a flexible circuit board with a waterproof member of the present invention, the type of the resin on the housing side is the curing temperature and the curing time when the two waterproof member pieces are bonded in the second step (the adhesive is a thermosetting resin). ), Manufacturing conditions such as heating temperature and cooling temperature (when the adhesive is a thermoplastic resin), and when waterproofing by direct contact with the housing, waterproof performance can be demonstrated by interaction with the housing In consideration of compatibility with other resins, waterproofness, durability, and the like, it is appropriately selected.
本発明の防水部材付きフレキシブル回路基板の製造方法では、第２の工程後の筐体側樹脂と紫外線硬化性シリコン樹脂の硬化物とにより、防水部材付きフレキシブル回路基板の防水部材が形成されるので、第２工程後の防水部材の形状により、筐体側樹脂の成形体の形状及びその内側に配設される紫外線硬化性シリコン樹脂の硬化物の形状を適宜選択する。つまり、本発明の防水部材付きフレキシブル回路基板の製造方法では、第２工程後に、フレキシブル回路基板の防水部位が、紫外線硬化性シリコン樹脂の硬化物で囲まれるように、且つ、紫外線硬化性シリコン樹脂の硬化物が、筐体側樹脂で囲まれるように、筐体側樹脂の成形体の形状及び紫外線硬化性シリコン樹脂の硬化物の形状を選択する。 In the method for producing a flexible circuit board with a waterproof member of the present invention, the waterproof member of the flexible circuit board with the waterproof member is formed by the housing side resin and the cured product of the ultraviolet curable silicone resin after the second step. Depending on the shape of the waterproof member after the second step, the shape of the molded body of the housing side resin and the shape of the cured product of the ultraviolet curable silicone resin disposed inside thereof are appropriately selected. That is, in the method for producing a flexible circuit board with a waterproof member of the present invention, the waterproof part of the flexible circuit board is surrounded by a cured product of the ultraviolet curable silicone resin after the second step, and the ultraviolet curable silicone resin is used. The shape of the molded body of the housing side resin and the shape of the cured product of the ultraviolet curable silicone resin are selected so that the cured product is surrounded by the housing side resin.
本発明の防水部材付きフレキシブル回路基板の製造方法において、筐体側樹脂の成形方法は、特に制限されず、射出成形、圧縮成形、トランスファー成形等により、筐体側樹脂を成形して、筐体側樹脂の成形体を得ることができる。また、本発明の防水部材付きフレキシブル回路基板の製造方法において、筐体側樹脂の成形体の内側に、紫外線硬化性シリコン樹脂の硬化物を配設する方法としては、特に制限されず、例えば、筐体側樹脂の成形体の内側に、紫外線硬化性シリコン樹脂を塗布し、次いで、硬化させる方法が挙げられる。 In the method for manufacturing a flexible circuit board with a waterproof member of the present invention, the method for molding the housing side resin is not particularly limited, and the housing side resin is molded by injection molding, compression molding, transfer molding, or the like. A molded body can be obtained. Further, in the method for producing a flexible circuit board with a waterproof member of the present invention, the method of disposing the cured product of the ultraviolet curable silicone resin inside the molded body of the housing side resin is not particularly limited. An example is a method in which an ultraviolet curable silicone resin is applied to the inside of the body-side resin molding and then cured.
また、本発明の防水部材付きフレキシブル回路基板の製造方法において、第１の工程で、２個の防水部材片を合わせる前に、防水部材片の接着面には、接着剤を塗布しておく。また、本発明の防水部材付きフレキシブル回路基板の製造方法においては、必要に応じて、第１の工程で、２個の防水部材片を合わせる前に、防水部材片の接着面に加え、紫外線硬化性シリコン樹脂の硬化物同士が接する面にも、接着剤を塗布しておく。２個の防水部材片の接着するための接着剤は、第２の工程で加熱されることにより、２個の防水部材片を接着することができるものであれば、特に制限されず、エポキシ系接着剤、アクリル系接着剤等の熱硬化性の接着剤等が挙げられる。また、２個の防水部材片を接着するための接着剤は、接着剤自身が防水性能を有する必要がある。 In the method for manufacturing a flexible circuit board with a waterproof member of the present invention, an adhesive is applied to the adhesive surface of the waterproof member piece before the two waterproof member pieces are combined in the first step. Further, in the method for manufacturing a flexible circuit board with a waterproof member of the present invention, if necessary, in addition to the adhesive surface of the waterproof member piece, UV curing is performed before the two waterproof member pieces are combined in the first step. An adhesive is also applied to the surface where the cured products of the conductive silicone resin contact each other. The adhesive for adhering the two waterproof member pieces is not particularly limited as long as it can adhere the two waterproof member pieces by being heated in the second step. Examples thereof include thermosetting adhesives such as adhesives and acrylic adhesives. Moreover, the adhesive for bonding the two waterproof member pieces needs to have waterproof performance.
本発明の防水部材付きフレキシブル回路基板の製造方法では、第１工程に次いで、本発明の防水部材付きフレキシブル回路基板の製造方法に係る第２工程を行う。第２工程は、筐体側樹脂と紫外線硬化性シリコン樹脂の硬化物とが付着し且つ紫外線硬化性シリコン樹脂の硬化物とフレキシブル回路基板とが付着するように、２個の防水部材片を接着する工程である。 In the manufacturing method of the flexible circuit board with waterproof member of the present invention, the second step according to the manufacturing method of the flexible circuit board with waterproof member of the present invention is performed after the first step. In the second step, the two waterproof member pieces are bonded so that the case side resin and the cured product of the ultraviolet curable silicone resin adhere to each other and the cured product of the ultraviolet curable silicone resin and the flexible circuit board adhere to each other. It is a process.
第２工程では、２個の防水部材片の接着面を合わせた状態で、必要に応じて、２個の防水部材片同士を押しつけた状態で、２個の防水部材片を加熱して接着する。 In the second step, the two waterproof member pieces are heated and bonded together in a state where the two waterproof member pieces are pressed against each other with the bonding surfaces of the two waterproof member pieces being combined. .
このようにして、本発明の防水部材付きフレキシブル回路基板の製造方法では、第２工程を行うことにより、本発明の防水部材付きフレキシブル回路基板が得られる。 Thus, in the manufacturing method of the flexible circuit board with a waterproof member of the present invention, the flexible circuit board with the waterproof member of the present invention is obtained by performing the second step.
本発明の防水部材付きフレキシブル回路基板の製造方法では、防水部材片でフレキシブル回路基板を挟み込み、次いで、これらを加熱することにより、防水部材をフレキシブル回路基板に固定できるので、フレキシブル回路基板に付設される他の部材、例えば、図２中のコネクタ６、フレキシブル回路基板のコネクタ６の裏側に相当する位置に取り付けられる補強板、両面テープ等を、フレキシブル回路基板にマウント後、加熱して固定する工程と共に、本発明の防水部材付きフレキシブル回路基板の製造方法を行うことができる。そのため、簡便な方法で、防水性能が高いフレキシブル回路基板を製造することができる。 In the method for producing a flexible circuit board with a waterproof member of the present invention, the waterproof circuit board can be fixed to the flexible circuit board by sandwiching the flexible circuit board between the waterproof member pieces and then heating them, so that the waterproof circuit board is attached to the flexible circuit board. 2, for example, a connector 6 in FIG. 2, a reinforcing plate attached at a position corresponding to the back side of the connector 6 of the flexible circuit board, a double-sided tape, etc., mounted on the flexible circuit board and then fixed by heating. And the manufacturing method of the flexible circuit board with a waterproof member of this invention can be performed. Therefore, a flexible circuit board having high waterproof performance can be manufactured by a simple method.
一方、インサート成形では、金型をフレキシブル回路基板に固定して成形することにより、防水部材をフレキシブル回路基板上に形成させなければならないので、コネクタ６等の部材のフレキシブル回路基板への固定工程とは別に、インサート成形工程が必要となる。そのため、本発明の防水部材付きフレキシブル回路基板の製造方法は、インサート成形で防水部材を形成させる場合に比べ、製造工程を少なくすることができる。 On the other hand, in the insert molding, since the waterproof member must be formed on the flexible circuit board by fixing the mold to the flexible circuit board, the step of fixing the member such as the connector 6 to the flexible circuit board; Separately, an insert molding process is required. Therefore, the manufacturing method of the flexible circuit board with a waterproof member of the present invention can reduce the number of manufacturing steps as compared with the case where the waterproof member is formed by insert molding.
本発明の防水部材付きフレキシブル回路基板は、更に、筐体側樹脂の外周に、紫外線硬化性シリコン樹脂の硬化物が配設されていてもよい。そして、本発明の防水部材付きフレキシブル回路基板が、更に、筐体側樹脂の外周に、紫外線硬化性シリコン樹脂の硬化物を有することにより、筐体側樹脂と筐体との間の防水性能を更に高めることができる。なお、筐体側樹脂の外周とは、筐体側樹脂のうち、筐体と対向する部位を指す。 In the flexible circuit board with a waterproof member of the present invention, a cured product of an ultraviolet curable silicone resin may be further disposed on the outer periphery of the housing side resin. And the flexible circuit board with a waterproof member of this invention further improves the waterproof performance between housing | casing side resin and a housing | casing by having the hardened | cured material of ultraviolet curable silicone resin in the outer periphery of housing | casing side resin. be able to. In addition, the outer periphery of housing side resin refers to the site | part facing a housing | casing among housing side resin.
筐体側樹脂の外周に配設される紫外線硬化性シリコン樹脂の硬化物は、本発明の防水部材付きフレキシブル回路基板に係る紫外線硬化性シリコン樹脂の硬化物と同様である。 The cured product of the ultraviolet curable silicone resin disposed on the outer periphery of the housing side resin is the same as the cured product of the ultraviolet curable silicone resin according to the flexible circuit board with a waterproof member of the present invention.
紫外線硬化性シリコン樹脂の硬化物が配設される位置は、筐体側樹脂の外周であり、筐体樹脂の外側を囲むように配設される。言い換えると、紫外線硬化性シリコン樹脂の硬化物は、筐体側樹脂と筐体との隙間を埋めることができるような位置の筐体側樹脂の外周に配設される。 The position where the cured product of the ultraviolet curable silicone resin is disposed is the outer periphery of the housing side resin, and is disposed so as to surround the outside of the housing resin. In other words, the cured product of the ultraviolet curable silicone resin is disposed on the outer periphery of the housing side resin at a position where the gap between the housing side resin and the housing can be filled.
紫外線硬化性シリコン樹脂の硬化物を筐体側樹脂の外周に配設する方法としては、特に制限されず、例えば、筐体側樹脂の外側にリング状に成形した紫外線硬化性シリコン樹脂の硬化物を被せる方法や、筐体側樹脂の外側を囲むように紫外線硬化性シリコン樹脂を塗布し、次いで塗布した樹脂を硬化させる方法等が挙げられる。 The method of disposing the cured product of the ultraviolet curable silicone resin on the outer periphery of the housing side resin is not particularly limited. For example, the cured product of the ultraviolet curable silicone resin formed in a ring shape is put on the outside of the housing side resin. Examples thereof include a method, a method of applying an ultraviolet curable silicone resin so as to surround the outside of the housing side resin, and then curing the applied resin.
また、紫外線硬化性シリコン樹脂の硬化物は、筐体側樹脂の奥行方向（図２中、ｙ方向であり、筐体側樹脂の周方向と直行する方向である。）の全体を覆うようにして筐体側樹脂の外側を囲むように配設されていてもよいし、筐体側樹脂の奥行方向については、筐体と対向する部分だけが覆われるようにして筐体側樹脂の外側を囲むように配設されていてもよい。筐体と対向する部分だけが覆われるようにして筐体側樹脂の外側を囲むように、紫外線硬化性シリコン樹脂の硬化物を配設する方法としては、例えば、筐体側樹脂の筐体との対向部分に、筐体側樹脂の外側を囲むように溝を形成し、その溝に沿って紫外線硬化性シリコン樹脂の硬化物を配設する方法が挙げられる。 The cured product of the ultraviolet curable silicone resin covers the entire depth direction of the housing side resin (in FIG. 2, the y direction is a direction perpendicular to the circumferential direction of the housing side resin). It may be arranged so as to surround the outside of the body-side resin, and in the depth direction of the housing-side resin, only the portion facing the housing is covered so as to surround the outside of the housing-side resin. May be. As a method of disposing the cured product of the ultraviolet curable silicone resin so that only the portion facing the housing is covered and surrounding the outside of the housing side resin, for example, facing the housing of the housing side resin There is a method in which a groove is formed in the portion so as to surround the outside of the housing side resin, and a cured product of the ultraviolet curable silicone resin is disposed along the groove.
本発明によれば、防水性に優れるフレキシブル回路基板を、簡便な方法で製造することができる。 ADVANTAGE OF THE INVENTION According to this invention, the flexible circuit board excellent in waterproofness can be manufactured by a simple method.
１ 携帯電話
２ａ 第１の筐体
２ｂ 第２の筐体
３ ヒンジ部
４ａ、４ｂ 回路基板
５ フレキシブル回路基板
６、６ａ、６ｂ コネクタ
７、７ａ、７ｂ 防水部材
８、８ａ、８ｂ 筐体側樹脂
９、９ａ、９ｂ フレキシブル回路基板側樹脂
１０ 防水部材付きフレキシブル回路基板
１１ 接着剤
１８、１８ａ、１８ｂ 防水部位
１９、１９ａ、１９ｂ フレキシブル回路基板側樹脂
２０、２０ａ、２０ｂ 筐体側樹脂の成形体
２１ ヒンジ内内設部
２２ 接着面
２３、２３ａ、２３ｂ 防水部材片
DESCRIPTION OF SYMBOLS 1 Mobile phone 2a 1st housing | casing 2b 2nd housing | casing 3 Hinge part 4a, 4b Circuit board 5 Flexible circuit board 6, 6a, 6b Connector 7, 7a, 7b Waterproof member 8, 8a, 8b Housing side resin 9, 9a, 9b Flexible circuit board side resin 10 Flexible circuit board with waterproof member 11 Adhesives 18, 18a, 18b Waterproof parts 19, 19a, 19b Flexible circuit board side resin 20, 20a, 20b Molded body 21 of housing side resin Inside hinge Installation part 22 Adhesive surface 23, 23a, 23b Waterproof member piece
Claims (3)
該防水部材は、フレキシブル回路基板側に配設されている紫外線硬化性シリコン樹脂の硬化物と筐体側に配設されている筐体側樹脂とからなり、
該紫外線硬化性シリコン樹脂の硬化物は、防水性の弾性体であること、
を特徴とする防水部材付きフレキシブル回路基板。 A flexible circuit board inserted into the housing of the electronic device, and a waterproof member attached to a waterproof part of the flexible circuit board,
The waterproof member is composed of a cured product of an ultraviolet curable silicone resin disposed on the flexible circuit board side and a housing side resin disposed on the housing side,
The cured product of the ultraviolet curable silicone resin is a waterproof elastic body,
A flexible circuit board with a waterproof member.
該筐体側樹脂と該紫外線硬化性シリコン樹脂の硬化物とが付着し且つ該紫外線硬化性シリコン樹脂の硬化物と該フレキシブル回路基板とが付着するように、２個の該防水部材片を接着する第２の工程と、
を有することを特徴とする防水部材付きフレキシブル回路基板の製造方法。 Two waterproof member pieces comprising a molded body of the housing side resin and a cured product of the ultraviolet curable silicone resin disposed on the flexible circuit board side of the molded body are sandwiched from above and below the flexible circuit board. In addition, a first step of surrounding the flexible circuit board with the two waterproof member pieces,
The two waterproof member pieces are bonded so that the housing side resin and the cured product of the ultraviolet curable silicone resin adhere to each other and the cured product of the ultraviolet curable silicone resin and the flexible circuit board adhere to each other. A second step;
The manufacturing method of the flexible circuit board with a waterproof member characterized by having.
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| CN103428318A (en) * | 2013-08-29 | 2013-12-04 | 周正德 | Silica gel communication tool with protection function and manufacturing method thereof |
| JP2019012710A (en) * | 2018-10-30 | 2019-01-24 | 株式会社小糸製作所 | Vehicle lighting |
| US12264827B2 (en) | 2020-02-26 | 2025-04-01 | Mitsubishi Electric Corporation | Outdoor unit of air-conditioning apparatus |
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