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JP6442527B2 - Electronic control unit - Google Patents

Electronic control unit Download PDF

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Publication number
JP6442527B2
JP6442527B2 JP2016561459A JP2016561459A JP6442527B2 JP 6442527 B2 JP6442527 B2 JP 6442527B2 JP 2016561459 A JP2016561459 A JP 2016561459A JP 2016561459 A JP2016561459 A JP 2016561459A JP 6442527 B2 JP6442527 B2 JP 6442527B2
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Prior art keywords
control device
electronic control
substrate
sealing resin
resin
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JPWO2016084537A1 (en
Inventor
裕二朗 金子
裕二朗 金子
浅野　雅彦
雅彦 浅野
河合　義夫
義夫 河合
勝 鴨志田
勝 鴨志田
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Hitachi Astemo Ltd
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Hitachi Automotive Systems Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H05K3/284—Applying non-metallic protective coatings for encapsulating mounted components
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70—Coupling devices
    • H01R12/71—Coupling devices for rigid printing circuits or like structures
    • H01R12/72—Coupling devices for rigid printing circuits or like structures coupling with the edge of the rigid printed circuits or like structures
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00—Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/46—Bases; Cases
    • H01R13/50—Bases; Cases formed as an integral body
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/11—Printed elements for providing electric connections to or between printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/28—Applying non-metallic protective coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09754—Connector integrally incorporated in the printed circuit board [PCB] or in housing
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/13—Moulding and encapsulation; Deposition techniques; Protective layers
    • H05K2203/1305—Moulding and encapsulation
    • H05K2203/1327—Moulding over PCB locally or completely

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Casings For Electric Apparatus (AREA)
  • Connector Housings Or Holding Contact Members (AREA)
  • Non-Metallic Protective Coatings For Printed Circuits (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)

Description

本発明は、自動車用に用いられるエンジンコントロールユニットや自動変速機コントロールユニットなどの電子制御装置に関わり、特に、電子制御装置の筐体構造に関する。     The present invention relates to an electronic control device such as an engine control unit and an automatic transmission control unit used for automobiles, and more particularly to a housing structure of the electronic control device.

環境問題、エネルギー問題を背景に自動車の電装化が加速しており、電子制御装置の搭載数が大幅に拡大している。これにより、電子制御装置の搭載場所が限られ、自動車の中でも環境が厳しいエンジンルームへの搭載が余儀なくされている。一方で、自動車の快適性向上に向けた、キャビンスペースの拡大に伴い、エンジンルームが小型化されてきている。このように、小型化されるエンジンルームに多数の電子制御装置、それらのワイヤーハーネスが配置されるため、レイアウト難、重量増加、コスト増加が問題となっている。このため、電子制御装置には、小型化、軽量化、低コスト化が求められている。加えて、ワイヤーハーネスが短縮される傾向にある。これに伴い、例えばエンジン制御装置は、よりエンジンに近い位置に搭載されることとなり、エンジンの高熱、高振動がエンジン制御装置に及ぼす影響が懸念される。よって電子制御装置の耐熱性、耐振動性を向上させる必要がある。この対応策として電子部品を実装した制御基板を樹脂封止する構造が知られている（特許文献１参照）。     With the background of environmental and energy issues, the electrification of automobiles is accelerating, and the number of electronic control devices installed has increased significantly. As a result, the installation place of the electronic control device is limited, and it is forced to be installed in an engine room where the environment is severe even in an automobile. On the other hand, the engine room has been downsized with the expansion of cabin space for improving the comfort of automobiles. As described above, since a large number of electronic control devices and their wire harnesses are arranged in the engine room to be miniaturized, layout difficulty, weight increase, and cost increase are problems. For this reason, the electronic control device is required to be reduced in size, weight, and cost. In addition, the wire harness tends to be shortened. Along with this, for example, the engine control device is mounted at a position closer to the engine, and there is a concern about the influence of high engine heat and high vibration on the engine control device. Therefore, it is necessary to improve the heat resistance and vibration resistance of the electronic control device. As a countermeasure, a structure in which a control board on which electronic components are mounted is resin-sealed is known (see Patent Document 1).

特許文献１に記載の電子制御装置は、電子部品を実装した回路基板と、電子部品を覆う樹脂封止部と、接続用金属端子を有し樹脂封止部より露出した凸型コネクタと、樹脂封止部の外周に巻きつけられたシール材とを有し、小型化、低コスト化が可能であり且つ信頼性を有する電子回路装置を提供することができる。     An electronic control device described in Patent Document 1 includes a circuit board on which electronic components are mounted, a resin sealing portion that covers the electronic components, a convex connector that has a connection metal terminal and is exposed from the resin sealing portion, and a resin. It is possible to provide an electronic circuit device that has a sealing material wound around the outer periphery of the sealing portion, can be reduced in size and cost, and has reliability.

特開2006-173402号公報JP 2006-173402 A

しかしながら特許文献１記載の構造では、樹脂封止部の外周に沿ってシール材を設けることにより、生産効率の低下、高コスト化が問題となる。また、樹脂封止部とは別体の凹型コネクタで電子制御装置を覆う構造となっており、凹型コネクタサイズが大型化してしまう。よって、低コストで生産プロセスを簡易化でき、凹型コネクタを小型化できる電子制御装置を提供することが課題である。   However, in the structure described in Patent Document 1, there is a problem in that the production efficiency is reduced and the cost is increased by providing the sealing material along the outer periphery of the resin sealing portion. Moreover, it has the structure which covers an electronic controller with the concave connector separate from the resin sealing part, and a concave connector size will enlarge. Therefore, it is a problem to provide an electronic control device that can simplify the production process at a low cost and reduce the size of the concave connector.

上記課題を解決するため、本発明の電子制御装置は、電子部品を実装した基板と、前記基板の少なくとも一端に設けられ、外部との電気的接続を行うための接続部と、前記基板を封止する封止樹脂と、を備える電子制御装置において、前記接続部は前記封止樹脂から露出しており、前記封止樹脂は、露出した前記接続部の外周を凹型に囲う凹型ハウジングを備えることを特徴とする電子制御装置。     In order to solve the above-described problems, an electronic control device according to the present invention includes a board on which electronic components are mounted, a connection portion provided at at least one end of the board, for electrical connection with the outside, and the board. In the electronic control device including the sealing resin to be stopped, the connection portion is exposed from the sealing resin, and the sealing resin includes a concave housing that surrounds the exposed outer periphery of the connection portion in a concave shape. An electronic control device.

本発明によれば、基板を封止する樹脂と、外部との接続部を囲う凹型ハウジングとが一体かつ同一材料で成型されるので、低コストと生産性を両立した高信頼性の電子制御装置を提供することができる。   According to the present invention, since the resin that seals the substrate and the concave housing that surrounds the connection portion with the outside are integrally formed of the same material, a highly reliable electronic control device that achieves both low cost and high productivity Can be provided.

電子制御装置の全体斜視図Overall perspective view of electronic control unit 図１に示す制御装置の断面図Sectional view of the control device shown in FIG. 実施例１の制御装置の製造方法Manufacturing method of control device of embodiment 1 図3（ｃ）の正面図Front view of FIG. 実施例１の制御装置のコネクタ間口例Example of connector opening of control device of embodiment 1 実施例２の制御装置の断面図Sectional drawing of the control apparatus of Example 2.

以下、本発明を適用した具体的な実施形態について、電子制御装置の構成と組立て手順を添付図面に基づいて説明する。   Hereinafter, a specific embodiment to which the present invention is applied will be described with reference to the accompanying drawings for the configuration and assembly procedure of an electronic control device.

図１は、第１の本実施形態の制御装置を示す斜視図である。図２は、図１に示す制御装置の断面図である。   FIG. 1 is a perspective view showing a control device of the first embodiment. FIG. 2 is a cross-sectional view of the control device shown in FIG.

図１、図２に示すように、本発明の制御装置はマイクロコンピュータ等の電子部品１を実装した制御基板２と、封止樹脂３から構成される。     As shown in FIGS. 1 and 2, the control device of the present invention includes a control board 2 on which an electronic component 1 such as a microcomputer is mounted, and a sealing resin 3.

制御基板２は、ガラスエポキシ樹脂等をベースとした樹脂配線板を用いるとよい。外部インターフェースである接続部は、制御基板２の一端に電極４を有し、その電極４は基板両面の表層に形成させる。接続部は、車両側コネクタなどの外部コネクタと嵌合し、外部端子と電気的に接続される。制御基板２の両面に電極４を配置させることにより、電極数を増加することができ、制御基板２の小型化が可能となる。尚、電極４は制御基板２の一端のみでなく、２辺、３辺、４辺に配置してもよい。   The control board 2 may be a resin wiring board based on glass epoxy resin or the like. The connection part, which is an external interface, has an electrode 4 at one end of the control board 2, and the electrode 4 is formed on the surface layer on both sides of the board. The connecting portion is fitted with an external connector such as a vehicle-side connector, and is electrically connected to the external terminal. By arranging the electrodes 4 on both sides of the control board 2, the number of electrodes can be increased, and the control board 2 can be downsized. The electrode 4 may be arranged not only at one end of the control board 2 but also on two sides, three sides, and four sides.

次に、図３を用いて本発明の制御装置の製造方法について説明する。まず、図３（ａ）に示す電子部品１を実装した制御基板２を、図３（ｂ）に示すように下金型７にセットする。その際、下金型７と制御基板２の位置決め機構、制御基板２の固定機構が必要となる。下金型７に位置決めピン８を設けておき、そこに基板固定部材６の凹部をあわせてセットする。基板固定部材６の凹部の反対側は凸部形状となっており、そこに制御基板２の貫通孔部が合わさるように搭載する。この基板固定部材６を複数個所に設けることで、下金型７と制御基板２の位置決めを行う。次に、制御基板２の貫通孔部１５に基板固定材６の上下を反転させ凸部を挿入する。最後に上金型９をセットし、制御基板２を基板固定部材６を介して金型で挟み込むことにより、制御基板２の固定を行う。これにより、樹脂封止時の成形圧力によるに制御基板２のばたつきを抑制できる。また、他にインサート成形する部品がある場合は、この工程にて金型にセットするとよい。   Next, the manufacturing method of the control apparatus of this invention is demonstrated using FIG. First, the control board 2 on which the electronic component 1 shown in FIG. 3A is mounted is set in the lower mold 7 as shown in FIG. At that time, a positioning mechanism for the lower mold 7 and the control board 2 and a fixing mechanism for the control board 2 are required. Positioning pins 8 are provided in the lower mold 7 and the concave portions of the substrate fixing member 6 are set together therewith. The opposite side of the concave portion of the substrate fixing member 6 has a convex shape, and is mounted so that the through hole portion of the control substrate 2 is aligned therewith. By providing the substrate fixing member 6 at a plurality of locations, the lower mold 7 and the control substrate 2 are positioned. Next, the substrate fixing material 6 is turned upside down in the through hole portion 15 of the control substrate 2 to insert a convex portion. Finally, the upper mold 9 is set, and the control board 2 is fixed by sandwiching the control board 2 with the mold via the board fixing member 6. Thereby, fluttering of the control board 2 can be suppressed due to the molding pressure during resin sealing. In addition, when there are other parts to be insert-molded, it may be set in the mold in this step.

次に、図３（ｃ）に示すように、凹型ハウジング５を形成するためのスライド金型１０をセットする。この際、（Ａ）視点の図を図４に示すが、スライド金型１０には制御基板２の外形よりも大きい開口部１１を設け、制御基板２が開口部１１を通過するようにスライド金型１０をスライドさせながら所定の位置にセットする。     Next, as shown in FIG. 3C, a slide mold 10 for forming the concave housing 5 is set. At this time, FIG. 4 shows a view of (A) viewpoint. The slide mold 10 is provided with an opening 11 larger than the outer shape of the control board 2, and the slide mold 10 is arranged so that the control board 2 passes through the opening 11. The mold 10 is set at a predetermined position while sliding.

また、制御基板２が封止樹脂３から露出する長さＬと凹型ハウジング５の深さＤの関係は、Ｌ＜Ｄとするとよい。これにより、制御基板２の電極４を保護でき、車両側コネクタを挿入し、固定する際に、十分な保持力を確保できる。     The relationship between the length L of the control substrate 2 exposed from the sealing resin 3 and the depth D of the concave housing 5 is preferably L <D. Thereby, the electrode 4 of the control board 2 can be protected, and a sufficient holding force can be secured when the vehicle-side connector is inserted and fixed.

また、凹型ハウジングの内面に、外部コネクタである車両側コネクタの挿入を容易にするガイド部を形成させるよう、スライド金型１０に溝を設けるとよい。ガイド部は、車両側コネクタの形状に合わせた形状になる。     Further, a groove may be provided in the slide mold 10 so that a guide portion that facilitates insertion of the vehicle-side connector, which is an external connector, is formed on the inner surface of the concave housing. The guide portion has a shape that matches the shape of the vehicle-side connector.

次に、図３（ｄ）に示すように、制御基板２の電極４を保護し、制御基板２とスライド金型１０の隙間を埋めるようキャップ材１２をセットする。キャップ材１２の材料としては、セットする際に制御基板２の電極４を傷つけないよう、電極材よりも柔らかく、キャップ先端を金型に押し当てた際にキャップが金型形状にならい、隙間を塞げるように、金型材、制御基板材よりも柔らかく、樹脂封止時の成形圧にも耐えられるような剛性を持ち、成形温度よりも高い耐熱性を持つ材料を選択するとよい。     Next, as shown in FIG. 3D, the cap material 12 is set so as to protect the electrode 4 of the control board 2 and fill the gap between the control board 2 and the slide mold 10. The material of the cap material 12 is softer than the electrode material so that the electrode 4 of the control board 2 is not damaged when being set. It is preferable to select a material that is softer than the mold material and the control substrate material, has rigidity that can withstand the molding pressure at the time of resin sealing, and has heat resistance higher than the molding temperature so as to be closed.

この方法により金型で制御基板２を直接挟み込む必要が無いため、制御基板２の損傷を防止できる。また、凹型ハウジング内面に金型合せ部が無いため、樹脂バリの発生を防止でき、凹型ハウジング内面とそこに挿入される車両側コネクタ部の外周の間にシール材を設置した場合でも、信頼性のある防水性を提供可能である。     Since it is not necessary to directly sandwich the control board 2 with a mold by this method, the control board 2 can be prevented from being damaged. In addition, since there is no mold matching part on the inner surface of the concave housing, it is possible to prevent the occurrence of resin burrs, and even when a sealing material is installed between the inner surface of the concave housing and the outer periphery of the vehicle side connector part inserted there It is possible to provide waterproofness.

尚、凹型ハウジング５のサイズが大きすぎるとシール性能に影響を与えるため、電子制御装置のサイズによって、凹型ハウジング５の間口数を変えるとよい。図１には２間口の例を示したが、電子制御装置サイズが小さい場合は、図５に示すように、凹型ハウジング５は１間口でもよい。     In addition, since the sealing performance is affected if the size of the concave housing 5 is too large, the number of openings of the concave housing 5 may be changed depending on the size of the electronic control device. FIG. 1 shows an example of two frontage. However, when the electronic control unit size is small, the concave housing 5 may be one frontage as shown in FIG.

次に、図３（ｅ）に示すように、液状の封止樹脂を注入する。樹脂材は熱硬化性のエポキシ、ポリエステルであるとよい。また、熱可塑性樹脂であってもよい。封止工法としては、トランスファーモールド、圧縮成形、ホットメルト、ポッティング、射出成形であるとよい。     Next, as shown in FIG. 3E, a liquid sealing resin is injected. The resin material is preferably a thermosetting epoxy or polyester. A thermoplastic resin may also be used. The sealing method may be transfer molding, compression molding, hot melt, potting, or injection molding.

最後に、樹脂硬化後に、図３（ｆ）に示すように、金型を分解し、電子制御装置を完成させる。     Finally, after the resin is cured, as shown in FIG. 3 (f), the mold is disassembled to complete the electronic control device.

実施例２の形態を実施例１と比較し説明する。実施例１では、制御基板２の外部インターフェースとの接続部を基板表面の電極４としたが、実施例２では、スルーホール電極とした場合について、電子制御装置の構成と組立て手順を図６に基づいて説明する。     The form of Example 2 will be described in comparison with Example 1. In the first embodiment, the connection portion of the control board 2 to the external interface is the electrode 4 on the board surface. However, in the second embodiment, the configuration and assembly procedure of the electronic control device are shown in FIG. This will be explained based on.

スルーホール電極の場合、車両側コネクタと接続するためには端子１６が必要となる。端子１６は必要な本数を予め端子保持板１７に挿入し、端子モジュールを製作する。次に、電子部品１を実装した制御基板２に端子１６を挿入する。制御基板２のスルーホールと端子１６間の接続は、はんだ接続、またはプレスフィット接続とするとよい。次工程の樹脂封止工程は、実施例１と同様である。     In the case of a through-hole electrode, the terminal 16 is required to connect to the vehicle side connector. A necessary number of terminals 16 are inserted in advance into the terminal holding plate 17 to manufacture a terminal module. Next, the terminal 16 is inserted into the control board 2 on which the electronic component 1 is mounted. The connection between the through hole of the control board 2 and the terminal 16 may be a solder connection or a press-fit connection. The resin sealing process of the next process is the same as that of Example 1.

以上、本発明に係る制御装置の実施形態について詳述したが、本発明は、前記の実施形態に限定されるものではなく、特許請求の範囲に記載された本発明の精神を逸脱しない範囲で、種々の設計変更を行うことができるものである。     As mentioned above, although embodiment of the control apparatus which concerns on this invention was explained in full detail, this invention is not limited to the said embodiment, In the range which does not deviate from the mind of this invention described in the claim. Various design changes can be made.

１ 電子部品
２ 制御基板
３ 封止樹脂
４ 電極
５ 凹型ハウジング
６ 基板固定部材
７ 下金型
８ 位置決めピン
９ 上金型
１０ スライド金型
１１ 開口部
１２ キャップ材
１５ 制御基板の貫通孔部
１６ 端子
１７ 端子保持板DESCRIPTION OF SYMBOLS 1 Electronic component 2 Control board 3 Sealing resin 4 Electrode 5 Recessed housing 6 Substrate fixing member 7 Lower mold 8 Positioning pin 9 Upper mold 10 Slide mold 11 Opening part 12 Cap material 15 Control board through-hole part 16 Terminal 17 Terminal holding plate

Claims (7)

電子部品を実装した基板と、
前記基板の少なくとも一端に設けられ、外部との電気的接続を行うための接続部と、
前記基板を封止する封止樹脂と、を備える電子制御装置において、
前記接続部は前記封止樹脂から露出しており、
前記封止樹脂は、露出した前記接続部の外周を凹型に囲う凹型ハウジングを備えることを特徴とする電子制御装置。 A board on which electronic components are mounted;
A connection part provided at at least one end of the substrate, for electrical connection with the outside;
In an electronic control device comprising a sealing resin for sealing the substrate,
The connecting portion is exposed from the sealing resin,
The electronic control device according to claim 1, wherein the sealing resin includes a concave housing that surrounds the exposed outer periphery of the connection portion in a concave shape. 前記基板が前記封止樹脂によって封止される際に前記封止樹脂用の金型の間で前記基板を固定するための基板固定部材をさらに備える請求項１記載の電子制御装置。The electronic control device according to claim 1, further comprising a substrate fixing member for fixing the substrate between the molds for the sealing resin when the substrate is sealed with the sealing resin. 前記基板は、前記接続部の表層に電極を有し、前記電極が前記封止樹脂から露出していることを特徴とする請求項１又は請求項２に記載の電子制御装置。 The substrate has an electrode on the surface layer of the connecting portion, the electronic control device according to claim 1 or claim 2 wherein the electrode is characterized in that is exposed from the sealing resin. 前記封止樹脂は熱硬化性樹脂であることを特徴とする請求項３に記載の電子制御装置。 The electronic control device according to claim 3 , wherein the sealing resin is a thermosetting resin. 前記基板の前記封止樹脂から露出した長さＬと、前記凹型ハウジングの深さＤの関係がＬ＜Ｄであることを特徴とする請求項４に記載の電子制御装置。 The electronic control device according to claim 4 , wherein a relationship between a length L of the substrate exposed from the sealing resin and a depth D of the concave housing is L <D. 前記凹型ハウジング内と外部コネクタとが嵌合し、前記外部コネクタの端子が前記電極に接続されることを特徴とする請求項５に記載の電子制御装置。 6. The electronic control device according to claim 5 , wherein the inside of the concave housing and an external connector are fitted, and a terminal of the external connector is connected to the electrode. 前記凹型ハウジングの内面には前記外部コネクタの形状に合わせたガイド部が形成されていることを特徴とする請求項４に記載の電子制御装置。 The electronic control device according to claim 4 , wherein a guide portion that matches the shape of the external connector is formed on an inner surface of the concave housing.
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