JP2011258761A - Heat radiating structure of electronic apparatus and on-vehicle electronic apparatus - Google Patents

Abstract

An object of the present invention is to provide a heat dissipation device for an electronic device capable of improving the cooling efficiency by suppressing variations in the cooling performance of a heat sink and improving the maintainability of an exhaust fan.
SOLUTION: A housing 6 that accommodates a heat generating component 1 therein, an exhaust fan 5 provided in the vicinity of an opening 6a formed in the housing, and a heat generating component that is thermally connected to heat the heat generating component. A heat transport device 3 to be transported, and a heat sink 4 that is thermally connected to the heat transport device and disposed in the suction portion of the exhaust fan are provided.
[Selection] Figure 1

Description

  The present invention relates to a heat dissipation structure for an electronic device.

  2. Description of the Related Art Conventionally, in a heat dissipation structure for an electronic device, heat generating components that are heat sources are distributed in a housing, and a heat sink is thermally connected to the heat generating components. In addition, an air inlet is formed on the side surface or the top surface of the housing, and the heat generating components can be evenly cooled by forced air cooling using an exhaust fan for ventilation. However, with the recent increase in the amount of heat generated from the heat generating components, the size of the heat sink for widening the heat radiation area has increased, making it difficult to improve the mounting density.

  In order to solve such a problem, technologies that perform heat transport using a heat pipe and dissipate the transported heat with a heat sink provided downstream of the exhaust fan are disclosed in, for example, Patent Document 1, Patent Document 2, and Patent Document 3. Has been.

Japanese Patent Laid-Open No. 09-116285 JP 2001-217366 A JP 2006-210635 A

  However, there is a problem that the wind speed tends to vary downstream of the exhaust fan, and the heat sink cooling performance tends to vary. Due to variations in the cooling performance of the heat sink, the cooling efficiency of the heat-generating components may be reduced, and it may be necessary to increase the size of the heat sink.

  Therefore, when the size of the housing is standardized as in the case of an in-vehicle electronic device, and the high density of the electronic device is required, the variation in the cooling performance of the heat sink tends to be a problem. In addition, since the heat sink exists between the exhaust fan and the housing, there is a problem that the mounting and dismounting of the fan is troublesome.

  The present invention has been made in view of the above, and is an electronic device capable of improving the cooling efficiency by suppressing the variation in the cooling performance of the heat sink and improving the maintainability of the exhaust fan. The object is to obtain a heat dissipation device.

  In order to solve the above-described problems and achieve the object, the present invention includes a housing that houses a heat-generating component inside, and an exhaust gas that is provided near the opening formed in the housing and provided outside the housing. A fan, a heat transport device that is thermally connected to the heat generating component and transports heat of the heat generating component, and a heat sink that is thermally connected to the heat transport device and disposed in the suction portion of the exhaust fan. Features.

  According to the present invention, it is possible to improve the cooling efficiency by suppressing the variation in the cooling performance of the heat sink, and to improve the maintenance performance of the exhaust fan.

FIG. 1 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 1 of the present invention. FIG. 2 is a diagram illustrating an example of connection between the heat transport device and the heat sink. FIG. 3 is a diagram illustrating a connection example between the heat transport device and the heat sink. FIG. 4 is a diagram illustrating an example of connection between the heat transport device and the heat sink. FIG. 5 is a diagram illustrating a connection example between the heat transport device and the heat sink, and is a diagram illustrating a state in which the heat sink illustrated in FIG. 4 is transmitted. FIG. 6 is a diagram illustrating a connection example between the heat transport device and the heat sink, and a support example of the heat transport device. FIG. 7 is a diagram illustrating a connection example between the heat transport device and the heat sink and a support example of the heat transport device. FIG. 8 is a diagram illustrating a connection example between the heat transport device and the heat sink and a support example of the heat transport device. FIG. 9 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 2 of the present invention. FIG. 10 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 3 of the present invention. FIG. 11 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 4 of the present invention. FIG. 12 is a diagram showing a heat dissipation structure for an electronic device according to Embodiment 5 of the present invention, and is a partial enlarged cross-sectional view in which a heat receiving portion is enlarged. FIG. 13: is a figure which shows the heat dissipation structure of the electronic device which concerns on Embodiment 6 of this invention, Comprising: It is the elements on larger scale which expanded the heat-receiving part part. FIG. 14 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 7 of the present invention.

  Below, the heat dissipation structure of the electronic device which concerns on embodiment of this invention is demonstrated in detail based on drawing. Note that the present invention is not limited to the embodiments.

Embodiment 1 FIG.
FIG. 1 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 1 of the present invention. This heat dissipation structure is used, for example, as a heat dissipation device for in-vehicle electronic devices. The heat dissipation device includes a housing 6 and an exhaust fan 5. The housing 6 is formed with an exhaust port 6a and an air supply port 6b as openings.

  An exhaust fan 5 is provided in the vicinity of the exhaust port 6 a and outside the housing 6. By operating the exhaust fan 5, air is taken into the housing 6 from the air supply port 6b, and air inside the housing 6 is discharged from the exhaust port 6a. In Embodiment 1, the exhaust port 6a and the air supply port 6b are formed on the side surface of the housing 6, but these may be formed on the top surface.

  The heat generating component 1 is arranged inside the housing 6. The heat generating component 1 is a circuit component such as a semiconductor device. A heat receiving portion 2 is thermally connected to the heat generating component 1 via a heat radiating sheet or a heat radiating rubber. The heat receiving unit 2 absorbs heat generated by the heat generating component 1. The heat receiving unit 2 is thermally connected to the heat absorbing unit 3 a of the heat transport device 3. The heat transport device 3 is, for example, a heat pipe. The heat transport device 3 absorbs heat from the heat receiving unit 2 at the heat absorbing unit 3a and transmits the absorbed heat to the heat radiating unit 3b.

  A heat sink 4 is thermally connected to the heat radiating portion 3 b of the heat transport device 3. The heat sink 4 is, for example, a heat radiating fin. The heat radiating part 3 b and the heat sink 4 of the heat transport device 3 are arranged in the vicinity of the exhaust port 6 a of the housing 6 and inside the housing 6.

  With the above configuration, the heat radiating portion 3b and the heat sink 4 of the heat transport device 3 are disposed in the suction portion of the exhaust fan 5, that is, in the vicinity of the exhaust fan 5 and upstream thereof. Therefore, while maintaining the height of the wind speed of the air passing through the heat sink 4, the deviation can be suppressed, and the entire heat sink 4 can be efficiently cooled.

  Further, since the exhaust fan 5 is disposed in the vicinity of the exhaust port 6a and outside the housing 6, and the heat sink 4 is disposed on the upstream side of the exhaust fan 5, the side surface and the top surface of the housing can be removed. The exhaust fan 5 can be attached and detached without removing the heat sink 4.

  In FIG. 1, the heat generating component 1, the heat receiving unit 2, and the heat transport device 3 are arranged side by side in the vertical direction (from the back side to the front side of the paper), but are not limited thereto, and are arranged side by side in the horizontal direction. It doesn't matter.

  2-5 is a figure which shows the example of a connection of a heat transport apparatus and a heat sink. Although the heat radiating part 3b and the heat sink 4 of the heat transport device 3 are thermally bonded, the heat radiating part 3b is coupled perpendicularly to the heat sink 4 as shown in FIGS. Further, when the amount of heat generated from the heat generating component 1 is large, as shown in FIGS. 4 and 5, a plurality of heat transport devices 3 are provided, and each heat radiating portion 3 b is thermally joined to the heat sink 4. Also good.

  6-8 is a figure which shows the example of a support of the heat transport apparatus 3, while showing the connection example of the heat transport apparatus 3 and the heat sink 4. As shown in FIG.

  6 and 7 show a structure in which the heat transport device 3 is provided with at least one support structure 10. FIG. 6 shows an example in which the heat transport device 3 is supported by a rigid structure 10 a as a support structure 10 extending from the housing 6.

  In this way, by supporting the heat transport device 3 with the rigid structure 10a, for example, when the heat transport device 3 is long, it is possible to prevent vibration from being amplified by external vibration. In particular, the amplitude of the heat transport device 3 can be suppressed by using the support structure 10 as the rigid structure 10a.

  FIG. 7 shows an example in which the heat transport device 3 is supported by a vibration damping damper 10 b as a support structure 10 extending from the housing 6. The anti-vibration damper 10b effectively attenuates vibration. For example, an anti-vibration rubber is used as the anti-vibration damper 10b.

  As described above, by supporting the heat transport device 3 by the vibration isolating damper 10b, for example, when the heat transport device 3 is long, it is possible to prevent vibration from being amplified by external vibration. In particular, the vibration of the heat transport device 3 can be effectively damped by using the vibration damping damper 10b as the support structure 10.

  FIG. 8 shows an example in which the heat receiving unit 2 and the heat sink 4 are not only connected by the heat transport device 3 but also fixed by the rigid structure 12. As the rigid structure 12, for example, a metal bar or a metal sheet metal is used. Thereby, the heat receiving part 2 and the heat sink 4 can be firmly fixed, and it is possible to prevent the heat transport device from being broken by an external force to the unit, for example, damage to the heat transport device 3. .

  6 and 7, the heat transport device 3 is supported by one support structure 10. However, the present invention is not limited to this, and a plurality of support structures 10 may be provided to support the heat transport device 3. It doesn't matter.

Embodiment 2. FIG.
FIG. 9 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 2 of the present invention. The same components as those in the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the second embodiment, a connector 7 is installed on the side surface of the housing 6.

  In order to prevent interference with the connector 7, the heat transport device 3 is bent in a region inside the housing 6 from the connector 7, and the entire heat transport device 3 is provided in a region inside the housing 6 from the connector 7. ing.

Embodiment 3 FIG.
FIG. 10 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 3 of the present invention. The same components as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the third embodiment, the flow path structure 8 is provided between the heat sink 4 and the exhaust fan 5 so that the air sucked into the exhaust fan 5 passes through the heat sink 4 with as little leakage as possible. The channel structure 8 is, for example, a duct or a shroud structure.

Embodiment 4 FIG.
FIG. 11 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 4 of the present invention. The same components as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted. In the fourth embodiment, the heat sink 4 and the housing 6 are thermally connected by the heat conductor 13.

  For example, the heat conductor 13 made of a material having high heat conductivity such as metal is fastened to the heat sink 4 and the inner side surface of the housing 6 with screws. By setting it as such a structure, the housing | casing 6 can also be utilized as a heat sink and a higher heat dissipation effect can be acquired.

Embodiment 5 FIG.
FIG. 12 is a diagram showing a heat dissipation structure for an electronic device according to Embodiment 5 of the present invention, and is a partial enlarged cross-sectional view in which a heat receiving portion is enlarged. The same components as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the fifth embodiment, the heat receiving portion 23 is configured as a box surrounding the heat generating component 1. The heat receiving portion 23 is made of a material having both heat conduction performance and conductivity performance, for example, an aluminum sheet metal or a steel plate. Here, the heat generating component 1 may emit electromagnetic waves. Since electromagnetic waves emitted from the heat-generating component 1 may cause malfunction of other devices, it is preferable to shield the electromagnetic waves.

  In the fifth embodiment, since the heat generating part 1 is surrounded by the heat receiving part 23 made of a material having both heat conducting performance and conductive performance, electromagnetic waves emitted from the heat generating part 1 can be shielded by the heat receiving part 23. it can.

  Moreover, in this Embodiment 5, since the heat receiving part 23 is formed as an integral box, the cost increase by the increase in the number of parts can be suppressed.

Embodiment 6 FIG.
FIG. 13: is a figure which shows the heat dissipation structure of the electronic device which concerns on Embodiment 6 of this invention, Comprising: It is the elements on larger scale which expanded the heat-receiving part part. The same components as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In this Embodiment 6, the circumference | surroundings of the heat-emitting component 1 mounted on the heat receiving part 23 are enclosed with the cover body 24 comprised with the material which has electroconductivity. As described above, the heat generating component 1 may emit electromagnetic waves. Since electromagnetic waves emitted from the heat-generating component 1 may cause malfunction of other devices, it is preferable to shield the electromagnetic waves.

  In the sixth embodiment, since the periphery of the heat generating component 1 placed on the heat receiving portion 3 is surrounded by the lid body 24 made of a material having conductive performance, the electromagnetic waves emitted from the heat generating component 1 are It can be shielded by the lid 24. Unlike Embodiment 5, since lid 24 is provided separately from heat receiving portion 3, thermal conductivity is not required for lid 24, and lid 24 can be made of an inexpensive conductor.

  In addition, since the heat receiving part 23 is required to radiate heat generated in the heat generating component 1 and shield the electromagnetic wave, the heat receiving part 23 is made of a material having both heat conduction performance and conductivity performance, for example, aluminum sheet metal or steel plate.

Embodiment 7 FIG.
FIG. 14 is a diagram showing a schematic configuration of a heat dissipation structure for an electronic device according to Embodiment 7 of the present invention. The same components as those in the above embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

  In the seventh embodiment, the heat transport device 3 made of a conductor and the housing 6 made of the same conductor are connected by a connection component 25 made of a conductor. With this configuration, for example, even when electrical noise such as external static electricity is applied to the heat transport device 3, the noise is easily dissipated to the housing 6 side without reaching the heat generating component 1. Become.

  In addition, the heat receiving part 2 may be comprised with a conductor, and the heat receiving part 2 and the housing | casing 6 may be connected by a connection component. In this case, even when electrical noise such as static electricity from the outside is applied to the heat receiving unit 2, the noise is easily dissipated to the housing 6 side without reaching the heat generating component 1.

  As described above, the heat dissipation structure for an electronic device according to the present invention is suitable for cooling an in-vehicle electronic device.

DESCRIPTION OF SYMBOLS 1 Heat generating component 2 Heat receiving part 3 Heat transport apparatus 3a Heat absorbing part 3b Heat radiating part 4 Heat sink 5 Exhaust fan 6 Case 6a Exhaust port (opening)
6b Air supply port 7 Connector 8 Flow path structure 10 Support structure 10a Rigid structure 10b Anti-vibration damper 12 Rigid structure 13 Thermal conductor 23 Heat receiving part 24 Lid 25 Connection parts

Claims (9)

A housing that houses heat-generating components inside,
An exhaust fan provided in the vicinity of an opening formed in the housing;
A heat transport device that is thermally connected to the heat generating component and transports heat of the heat generating component;
A heat dissipation structure for an electronic device, comprising: a heat sink thermally connected to the heat transport device and disposed in a suction portion of the exhaust fan.   The heat dissipation structure for an electronic device according to claim 1, wherein the heat sink is thermally connected to the housing.   The heat dissipation structure for an electronic device according to claim 1, further comprising an air passage structure connecting the opening of the housing and the heat sink. A connector mounted on the housing;
4. The heat dissipation structure for an electronic device according to claim 1, wherein the heat transport device is disposed in a region inside the housing inside the connector. 5.   5. The heat dissipation structure for an electronic device according to claim 1, wherein the heat transport device has a support structure for vibration isolation in a transport route. The heat generating component and the heat transport device are thermally connected via a heat receiving portion,
The heat dissipation structure for an electronic device according to any one of claims 1 to 5, further comprising a structural member that fixes the heat receiving portion and the heat sink. The heat generating component and the heat transport device are thermally connected via a heat receiving portion,
The heat dissipation structure for an electronic device according to any one of claims 1 to 6, wherein the heat receiving portion is made of a conductor and forms at least a part of an electromagnetic wave shielding structure. At least one of the heat receiving unit and the heat transport device, and the housing includes a conductor;
8. The heat dissipation structure for an electronic device according to claim 1, further comprising a connection portion that electrically connects the conductors.   An in-vehicle electronic device comprising the heat dissipation structure for an electronic device according to any one of claims 1 to 8.

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