JP2011029207A - Film laminate, pasting method of film laminate, connection method and connection structure using film laminate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To paste at an electrode terminal part of a substrate with an extremely narrow width without generating any inconvenience to pasting conditions. <P>SOLUTION: A film laminate 1 has a peeling film 3 whose width is larger than that of an anisotropic conductive film 2, and one side along with a longitudinal direction of the peeling film 3 overlaps with one side along with the longitudinal direction of the anisotropic conductive film 2. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to a film laminate in which an anisotropic conductive film is formed on a release film, a method for attaching the film laminate, a connection method for connecting a substrate and an electronic component using the film laminate, and a connection structure. .

  2. Description of the Related Art Conventionally, mounting methods for mounting electronic components using an anisotropic conductive film on a substrate have been performed. For example, a COG (Chip on Glass) mounting method is implemented in which an IC chip that is a liquid crystal driving circuit is mounted on the periphery of a liquid crystal display panel via an anisotropic conductive film.

  In a mounting method using an anisotropic conductive film, a tape-like film laminate in which an anisotropic conductive film is laminated on a release film is generally used. However, in the film laminate, when the size of the release film and the size of the anisotropic conductive film are the same, the anisotropic conductive film is placed outside the both ends in the width direction of the release film when affixed to the substrate. It sometimes protruded. In this case, the protruding anisotropic conductive film wraps around to the side surface of the release film, causing a problem that the release film is not peeled off from the anisotropic conductive film.

  Therefore, by adjusting the sizes of the anisotropic conductive film and the release film, an attempt has been made to prevent the anisotropic conductive film from protruding from both ends in the release film width direction when being applied to the substrate by pressing. . For example, Patent Document 1 describes a film laminate in which an anisotropic conductive film having a width smaller than the width of the release film is laminated at the center in the width direction on the release film. According to the film laminate of Patent Document 1, the anisotropic conductive film does not protrude from both ends in the width direction of the release film during pressing.

  For example, Patent Document 2 describes a film laminate (laminated tape) in which an anisotropic conductive film is sandwiched between a base film and a cover film. In the film laminate described in Patent Document 2, an anisotropic conductive film having a width smaller than the width of the base film and the width of the cover film is disposed at the center in the width direction of the base film (or cover film). Thereby, the protrusion prevention effect similar to the film laminated body of patent document 1 can be acquired.

JP 2003-142176 A Japanese Patent No. 3921452

  In recent years, the width of the electrode terminal portion of the substrate tends to be extremely narrow. For this reason, when it is going to stick the film laminated body by which the anisotropic conductive film of the width | variety smaller than the width | variety of a peeling film is laminated | stacked on the width direction center part on a peeling film on the narrowed electrode terminal part of a board | substrate. In some cases, the release film interferes with the side surfaces of other members in the vicinity of the electrode terminal portion, causing problems in the pasted state.

  The present invention has been proposed in view of such a conventional situation, and is a film laminate that can be reliably attached to an electrode terminal portion of a very narrow substrate without causing a problem in the attachment state. It is an object of the present invention to provide a body, a method for attaching a film laminate, a connection method for connecting a substrate and an electronic component using the film laminate, and a connection structure.

  In order to achieve the above-described object, the film laminate of the present invention is a film laminate in which an anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film, The width is larger than the width of the anisotropic conductive film, and one side along the longitudinal direction of the release film overlaps with one side along the longitudinal direction of the anisotropic conductive film.

  In addition, in order to achieve the above-described object, the sticking method of the present invention is such that an anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film, and the width of the release film is anisotropic. An electrode terminal portion and another member are provided in a film laminate that is larger than the width of the conductive film and overlaps one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film. By pressing the film laminate by pressing the pressure head against the upper surface of the release film and the film laminate arrangement step of arranging the electrode terminal portion and the anisotropic conductive film so as to face each other on the electrode terminal portion of the substrate A film laminate pasting step for pasting the film laminate on the electrode terminal portion of the substrate. In the film laminate arranging step, one side along the longitudinal direction of the release film and the anisotropic conductive film Side of the longitudinal direction side along the overlap film laminate of arm and the side surface of the other member, characterized in that disposed to face.

  In order to achieve the above object, the connection method of the present invention is an anisotropic method in which conductive particles are dispersed in a binder in a connection method in which an electrode of a substrate and an electrode of an electronic component are anisotropically conductively connected. The conductive film is laminated on the release film, the width of the release film is larger than the width of the anisotropic conductive film, and one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film The film laminate arrangement step of arranging the film laminate that overlaps with the electrode terminal portion and the anisotropic conductive film on the electrode terminal portion of the substrate on which the electrode terminal portion and other members are provided. And a film laminate pasting step for pasting the film laminate onto the electrode terminal portion of the substrate by pressing the pressure head against the upper surface of the release film and pressing the film laminate, and peeling the release film The electronic component placement step of placing the electronic component on the anisotropic conductive film and the substrate head and the electronic component electrode through the conductive particles by pressing the pressure head against the upper surface of the electronic component and applying heat pressure A side of the film laminate in which one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap with each other in the film laminate arrangement step. It arrange | positions so that the side surface of may face.

  In order to achieve the above-described object, the connection structure of the present invention is a connection structure in which an electrode of a substrate and an electrode of an electronic component are anisotropically conductively connected, and conductive particles are dispersed in a binder. The anisotropic conductive film is laminated on the release film, the width of the release film is larger than the width of the anisotropic conductive film, the one side along the longitudinal direction of the release film and the longitudinal direction of the anisotropic conductive film A film laminate in which one side along the side overlaps on the electrode terminal portion of the substrate provided with the electrode terminal portion and other members so that the electrode terminal portion and the anisotropic conductive film face each other A laminated body arranging step, a film laminated body attaching step for attaching the film laminated body on the electrode terminal portion of the substrate by pressing the film laminated body by pressing the pressure head against the upper surface of the peeling film, and a peeling film. An electronic component placement step of placing the electronic component on the anisotropic conductive film by peeling the film, and pressing the pressing head against the upper surface of the electronic component to thermally press the electrode and electronic component of the substrate through the conductive particles A side of the film laminate in which one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap in the film laminate arrangement step And a side surface of another member are arranged so as to face each other.

  According to the present invention, in the film laminate, the width of the release film is larger than the width of the anisotropic conductive film, and one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film; By overlapping, it is possible to reliably adhere to the electrode terminal portion of the substrate having a very narrow width without causing a problem in the attached state.

It is a figure which shows the structure of a film laminated body. It is a figure which shows the reel body formed by winding a film laminated body around a winding part. It is a figure for demonstrating the 1st example of the preparation methods of a film laminated body. It is a figure for demonstrating the 2nd example of the preparation methods of a film laminated body. It is a figure for demonstrating the 3rd example of the preparation methods of a film laminated body. It is a figure for demonstrating the 4th example of the preparation methods of a film laminated body. It is a figure which shows the liquid crystal display panel which stuck the film laminated body. It is a figure for demonstrating the method of sticking a film laminated body to an electrode terminal part. It is a figure for demonstrating the method of sticking a film laminated body to an electrode terminal part. It is a figure which shows a mode that the anisotropic conductive film was provided on the electrode terminal part of the transparent substrate. It is a figure for demonstrating the method of mounting an IC chip on an anisotropic conductive film. It is a figure which shows the structure of the connection structure formed by connecting the electrode terminal part and IC chip of the transparent substrate of a liquid crystal display panel via an anisotropic conductive film.

Hereinafter, embodiments of the present invention will be described in the following order with reference to the drawings.
1. 1. Film laminate 2. Production of film laminate 3. Method for applying film laminate 4. Connection method between substrate and electronic component Example

<1. Film laminate>
FIG. 1 is a diagram showing a configuration of a film laminate according to an embodiment of the present invention (hereinafter referred to as “this embodiment”), FIG. 1 (A) is an external view, and FIG. B) is a cross-sectional view. As shown in FIG. 1B, the film laminate 1 is formed by laminating an anisotropic conductive film 2 in which conductive particles 22 are dispersed in a binder (adhesive) 21 on a release film 3.

  For example, the film laminate 1 can be used by being attached to an electrode terminal portion provided with a plurality of electrodes on a substrate. Specifically, the film laminate 1 is pressed and attached to the electrode terminal portion of the substrate. Further, after peeling the release film 3 from the anisotropic conductive film 2, an electronic component is placed on the anisotropic conductive film 2 and thermally pressed, whereby the substrate and the electronic component are interposed via the anisotropic conductive film 2. And can be connected.

  In the film laminate 1, the width of the release film 3 is larger than the width of the anisotropic conductive film 2, and one side along the longitudinal direction of the release film 3 and one side along the longitudinal direction of the anisotropic conductive film 2 are included. They are overlapping. That is, the film laminate 1 includes a side where the release film 3 and the anisotropic conductive film 2 overlap in a cross section in the width direction, and a side where only the release film 3 is provided without the anisotropic conductive film 2. It forms an asymmetric shape.

  Of the side surfaces in the width direction of the film laminate 1, the side surface on which the release film 3 and the anisotropic conductive film 2 overlap is the opposite side surface disposed opposite to the side surface of the other member adjacent to the electrode terminal portion on the substrate. Part 4 is formed. Further, a portion of the release film 3 where the anisotropic conductive film 2 is not provided forms a holding space 5 that holds the pressurized anisotropic conductive film 2 and prevents the release film 3 from protruding. ing. Thereby, the width of the anisotropic conductive film 2 is made very narrow corresponding to this (for example, 1.2 mm or less), and even when the width of the electrode terminal portion of the substrate is very narrow, the release film is applied at the time of application. 3 and other members do not interfere with each other, and the film laminate 1 can be attached to the electrode terminal portion of the substrate without the anisotropic conductive film flowing out to the outside at both ends in the width direction of the release film. Moreover, even if it is a case where the film laminated body 1 is made into a long tape shape and is made into the winding state so that it may mention later, an anisotropic conductive film does not protrude from a peeling film width direction edge part. For this reason, even when the width | variety of the peeling film 3 is very small, a favorable winding state can be maintained, without producing malfunctions, such as a level | step difference and a clearance gap.

  In the film laminate 1 thus configured, when the width of the release film 3 is w (mm) and the width of the anisotropic conductive film is a (mm), a / w = 0.25 to 0.9. It is preferable that a / w = 0.5 to 0.9. If a is less than 0.25, the area occupied by the holding space 5 becomes large, and the winding state of the reel may not be maintained. On the other hand, if w is larger than 0.9, the anisotropic conductive film may flow out during sticking or may cause protrusion in the wound state.

  Although the shape of the film laminated body 1 is not specifically limited, For example, as shown in FIG. 2, it can be set as the elongate tape shape which can be wound around the winding part (reel) 8 which consists of plastics. That is, when the film laminate 1 is in the form of a long tape, the winding unit 8 includes flanges 6a and 6b made of plastic or the like at both ends in the width direction of the film laminate 1 so that the release film 3 is on the outer peripheral side. And is provided as a reel body 7. The length of the long tape-shaped film laminate 1 in the reel body 7 can be about 50 m to 1000 m.

  Usually, when a film laminated body is wound around a winding part, the pressure by winding is applied to an anisotropic conductive film. For this reason, when the conventional film laminate having the same width of the release film and the width of the anisotropic conductive film is wound around the take-up portion, the anisotropic conductive film protrudes to the outside at both ends in the release film width direction. was there. As the number of windings of the film laminate on the take-up portion increases, the pressure due to tightening increases, and this protrusion tends to occur.

Even if the film laminated body 1 is a reel body 7 having a large number of windings, the presence of the holding space 5 on the release film 3 prevents such a protrusion from occurring. Thereby, in the state in which the film laminate 1 is wound around the winding unit 8 as a long tape having a very narrow width a (mm) of the anisotropic conductive film 2, the anisotropic conductive film 2 does not protrude. Good quality can be maintained in the reel unit 7 without being generated.

  In the conventional film laminate in which the width of the release film and the width of the anisotropic conductive film are the same, even if the anisotropic conductive film protrudes to the outside of both ends in the width direction of the release film, If the film width (= anisotropic conductive film width) is not less than a certain size, it can be wound because the carrying force of the anisotropic conductive film in the release film is large. However, when the width of the peeled film in such a film laminate is reduced, this supporting force is also reduced, so that the film laminate is liable to be displaced or twisted. Due to such influences, defects such as steps and gaps are likely to occur between the film laminates, and a good winding state cannot be maintained.

  On the other hand, the film laminate 1 has a holding space 5 on the release film 3. For this reason, even if the width w of the release film is reduced, the anisotropic conductive film 2 does not protrude, so that a good winding state can be maintained without causing problems such as steps and gaps. it can.

  In addition, the film laminated body 1 is not limited to the elongate tape shape provided as such a reel body 7, A strip shape may be sufficient.

  The width a (mm) of the anisotropic conductive film 2 and the width w (mm) of the release film 3 can both be adjusted to a width that can be attached to the width of the electrode terminal portion of the substrate.

  The thickness of the anisotropic conductive film 2 is not particularly limited, but from the viewpoint of the connection structure (mounting body) type, connection reliability due to electrical characteristics and mechanical characteristics, ease of manufacture of the film laminate 1, and the like. The thickness is preferably 10 μm to 50 μm, and particularly preferably 12 μm to 30 μm.

  The thickness of the release film 3 is not particularly limited, but from the viewpoint of ease of peeling (peelability), good winding state (reelability) in the reel body 7, ease of use (handleability), and the like. It is preferably 12 μm to 100 μm, and particularly preferably 25 μm to 75 μm.

  The anisotropic conductive film 2 is anisotropic in which conductive particles 22 are dispersed in a normal binder (adhesive) 21 containing a film-forming resin, a thermosetting resin, a latent curing agent, a silane coupling agent, and the like. The conductive composition is formed on the release film 3 by applying the conductive composition on the release film 3.

  The release film 3 is formed by, for example, applying a release agent such as silicone on PET (Poly Ethylene Terephthalate), OPP (Oriented Polypropylene), PMP (Poly-4-methlpentene-1), PTFE (Polytetrafluoroethylene), etc. The shape of the conductive conductive film 2 can be maintained.

  The film forming resin contained in the binder 21 is preferably a resin having an average molecular weight of about 10,000 to 80,000. Examples of the film forming resin include various resins such as an epoxy resin, a modified epoxy resin, a urethane resin, and a phenoxy resin. Among these, phenoxy resin is particularly preferable from the viewpoint of film formation state, connection reliability, and the like.

  The thermosetting resin is not particularly limited as long as it has fluidity at room temperature, and examples thereof include commercially available epoxy resins and acrylic resins.

  The epoxy resin is not particularly limited. For example, naphthalene type epoxy resin, biphenyl type epoxy resin, phenol novolac type epoxy resin, bisphenol type epoxy resin, stilbene type epoxy resin, triphenolmethane type epoxy resin, phenol aralkyl type epoxy resin. Naphthol type epoxy resin, dicyclopentadiene type epoxy resin, triphenylmethane type epoxy resin and the like. These may be used alone or in combination of two or more.

  There is no restriction | limiting in particular as an acrylic resin, According to the objective, an acrylic compound, liquid acrylate, etc. can be selected suitably. For example, methyl acrylate, ethyl acrylate, isopropyl acrylate, isobutyl acrylate, epoxy acrylate, ethylene glycol diacrylate, diethylene glycol diacrylate, trimethylolpropane triacrylate, dimethylol tricyclodecane diacrylate, tetramethylene glycol tetraacrylate, 2-hydroxy- 1,3-diacryloxypropane, 2,2-bis [4- (acryloxymethoxy) phenyl] propane, 2,2-bis [4- (acryloxyethoxy) phenyl] propane, dicyclopentenyl acrylate, tricyclo Examples include decanyl acrylate, tris (acryloxyethyl) isocyanurate, urethane acrylate, and epoxy acrylate. In addition, what made acrylate the methacrylate can also be used. These may be used individually by 1 type and may use 2 or more types together.

  The latent curing agent is not particularly limited, and examples thereof include various curing agents such as a heat curing type and a UV curing type. The latent curing agent does not normally react, but is activated by various triggers selected according to applications such as heat, light, and pressure, and starts the reaction. The activation method of the thermally activated latent curing agent includes a method of generating active species (cations and anions) by a dissociation reaction by heating, and the like. There are a method of dissolving and dissolving and starting a curing reaction, a method of starting a curing reaction by eluting a molecular sieve encapsulated type curing agent at a high temperature, an elution and curing method using microcapsules, and the like. Thermally active latent curing agents include imidazole series, hydrazide series, boron trifluoride-amine complexes, sulfonium salts, amine imides, polyamine salts, dicyandiamide, etc., and modified products thereof. The above mixture may be sufficient. Among these, a microcapsule type imidazole-based latent curing agent is preferable.

  Although it does not specifically limit as a silane coupling agent, For example, an epoxy type, an amino type, a mercapto sulfide type, a ureido type etc. can be mentioned. By adding the silane coupling agent, the adhesion at the interface between the organic material and the inorganic material is improved.

  Examples of the conductive particles 22 include any known conductive particles used in the anisotropic conductive film 2. Examples of the conductive particles 22 include particles of various metals and metal alloys such as nickel, iron, copper, aluminum, tin, lead, chromium, cobalt, silver, gold, metal oxide, carbon, graphite, glass, ceramic, Examples thereof include those in which the surface of particles such as plastic is coated with metal, or those in which the surface of these particles is further coated with an insulating thin film. In the case where the surface of the resin particle is coated with metal, examples of the resin particle include an epoxy resin, a phenol resin, an acrylic resin, an acrylonitrile / styrene (AS) resin, a benzoguanamine resin, a divinylbenzene resin, a styrene resin, and the like. Can be mentioned.

  In addition, the film laminated body 1 is not limited to such a structure, For example, the insulating resin layer (NCF (Non Conductive Film) which consists only of the binder 21 between the anisotropic conductive films 2 and the peeling film 3 side, for example. Layer) may be laminated.

  Moreover, the film laminated body 1 is good also as a structure which provides a peeling film also on the surface side opposite to the surface where the peeling film 3 of the anisotropic conductive film 2 was laminated | stacked.

<2. Production of film laminate>
The film laminate 1 may be produced by any method, but can be produced, for example, by the following method.

  FIG. 3 is a diagram for explaining a first example of a method for producing the film laminate 1. In the example shown in FIG. 3, a release film 3 a having a triple width is prepared with respect to the width of the release film 3 of the produced film laminate 1. And the anisotropic conductive composition in which the electroconductive particle 22 was disperse | distributed to the binder 21 is apply | coated to the whole area | region on one side of the peeling film 3a, and an organic solvent is subsequently dried. Thereby, the film laminated body 1a by which the anisotropic conductive film 2a was laminated | stacked on the peeling film 3a is obtained (FIG. 3 (A)).

3A and 3B, straight lines (solid lines) A ₁ A ₁ ′, A ₂ A ₂ ′, straight lines (dashed lines) B ₁ B ₁ ′, B ₂ B ₂ ′, B ₃ B ₃ ′ are These are all along the longitudinal direction of the film laminate 1a. The straight lines A ₁ A ₁ ′ and A ₂ A ₂ ′ are present on positions where the film laminate 1 a is equally divided into three in the width direction. 'Distance to the straight line _A 2 _{A 2'} 'distance to the straight line _B 2 _{B 2'} from the left end side of the one side along the longitudinal direction of the film laminate 1a linear _B 1 _{B 1} from the line _A 2 _{A 2} from The distance to the straight line B ₃ B ₃ ′ corresponds to the width a (mm) of the anisotropic conductive film 2 of the film laminate 1 to be produced.

In the anisotropic conductive film 2a, cuts are made at the positions of the straight lines B ₁ B ₁ ′, B ₂ B ₂ ′, and B ₃ B ₃ ′. Then, FIG. 3 (A), the region between the 'linear _A 1 _{A 1} and' straight line _B 1 _{B 1} in the anisotropic conductive film 2a, a straight line _A 1 _{A 1} 'and the straight line _B 2 _{B 2} The region between and the region from the straight line B ₃ B ₃ ′ to the one side on the right end side along the longitudinal direction is peeled off. Thereby, the film laminated body 1b by which the anisotropic conductive films 2b and 2c were laminated | stacked on the peeling film 3a is obtained (FIG.3 (B)). The 'position of the straight line _A 2 _{A 2'} of the film laminate 1b linear _A 1 _{A 1} was cut at a position to obtain three film laminate 1 (FIG. 3 (C)).

  FIG. 4 is a diagram for explaining a second example of the method for producing the film laminate 1. In the example shown in FIG. 4, first, an anisotropic conductive film (not shown) of the same material as that of the release film 3 having a predetermined width is formed on the same film. A film laminate (not shown) is prepared by laminating (not shown). This film laminated body is cut | judged to the width | variety of the peeling film 3 along a longitudinal direction, and the film laminated body 1c by which the anisotropic conductive film 2d was laminated | stacked on the peeling film 3 is obtained (FIG. 4 (A)).

In FIG. 4A, a straight line (dashed line) B ₄ B ₄ ′ is along the longitudinal direction of the film laminate 1c. The distance from the left end in the width direction of the film laminate 1c to the straight line B ₄ B ₄ ′ corresponds to the width a (mm) of the anisotropic conductive film 2 of the film laminate 1 to be produced.

In the film laminate 1c, a cut is made at the position of the straight line B ₄ B ₄ ′. Then, separating the regions from the linear B _{4 B} 4 _'to one side of the right end side in the longitudinal direction of the anisotropic conductive film 2d. Thereby, the film laminated body 1 by which the anisotropic conductive film 2 was laminated | stacked on the peeling film 3 is obtained (FIG.4 (B)).

FIG. 5 is a diagram for explaining a third example of the method for producing the film laminate 1. In the example shown in FIG. 5, in the film laminate 1c obtained by the same processing as in FIG. 4A (FIG. 5A), the right end portion side along the longitudinal direction from the straight line B ₄ B ₄ ′. The region up to one side is heated to remove heat shrinkage. Thereby, the film laminated body 1 is obtained (FIG.5 (B)).

  FIG. 6 is a diagram for explaining a fourth example of the method for producing the film laminate 1. In the example shown in FIG. 6, a film laminate 1d formed by laminating an anisotropic conductive film 2 having the same dimensions as the release film 3b is prepared. One side along the longitudinal direction of the film laminate 1d and one side along the longitudinal direction of the release film 3 with the anisotropic conductive film 2 and the release film 3 having a width larger than the width of the film laminate 1d facing each other The film laminate 1d is laminated on the release film 3 so as to overlap. Thereby, the anisotropic conductive film 2 is transferred onto the release film 3 (FIG. 6A). Thereafter, the release film 3b is peeled from the anisotropic conductive film 2 to obtain a film laminate 1 (FIG. 6B).

<3. Method of sticking film laminate>
Next, a method for attaching the film laminate 1 will be described with an example in which the film laminate 1 is attached to a liquid crystal display panel which is a kind of substrate.

  As shown in the perspective view of FIG. 7 and the cross-sectional view of FIG. 8, the liquid crystal display panel 30 has a liquid crystal layer 32 sandwiched between a pair of transparent substrates 31a and 31b made of glass or the like. Is sealed with a sealing material 33. Polarizers 34a and 34b are disposed on the lower surface of the transparent substrate 31a and the upper surface of the transparent substrate 31b, respectively. Thereby, the liquid crystal display part is formed. A narrow electrode terminal portion 311a having a plurality of electrodes is formed on one end of the transparent substrate 31a where the liquid crystal display portion is not provided.

When the film laminate 1 is attached to the electrode terminal portion 311a of the transparent substrate 31a, the film laminate 1 is arranged on the electrode terminal portion 311a so that the electrode terminal portion 311a of the transparent substrate 31a and the anisotropic conductive film 2 face each other. To do. In this arrangement, as shown in range R ₁ in FIG. 8, the release film 3 and the anisotropic conductive film 2 and overlap the opposite side surface portions 4 of the film laminate 1, the transparent liquid crystal layer 32 and the sealant 33 substrate 31b and places the film laminate 1 so as to face the side surface a ₁ of the liquid crystal display unit that are stacked.

  And it heats, pressing the peeling film 3 upper surface of the film laminated body 1 with the press head 35 by a slight pressure (for example, about 0.1 MPa-2 MPa) in the arrow direction. However, the heating temperature is set to a temperature at which the thermosetting resin in the anisotropic conductive film 2 is not cured (for example, about 70 to 100 ° C.).

  By heat-pressing under such temperature and pressure conditions, the film laminate 1 can be stuck on the electrode terminal portion 311a of the transparent substrate 31a (FIGS. 7 and 8).

Here, as shown in FIG. 9, a film laminate 101 in which an anisotropic conductive film 102 having a width smaller than the width of the release film 103 is laminated at the center in the width direction on the release film 103 is an electrode terminal. Consider the case of attaching to the part 311a. In this case, as shown in range R _2, an anisotropic conductive film 102 is one end portion 104 in the width direction which is not laminated release film 103, and a liquid crystal layer 32 and the sealant 33 and the transparent substrate 31b stacked It has been interfering with the side surface a ₁ of the liquid crystal display unit, which may cause trouble in the sticking state.

In contrast, in the film laminate 1, the width of the release film 3 is larger than the width of the anisotropic conductive film 2, and one side along the longitudinal direction of the release film 3 and the longitudinal direction of the anisotropic conductive film 2. One side along the line overlaps. Thus, the side surface A ₁ in the longitudinal direction along the side and the anisotropic conductive to one side along the longitudinal direction of the film 2 are overlapped film laminate 1 of the release film 3 is, the liquid crystal layer 32 and the sealant 33 clear without a substrate 31b interferes with the side surface a ₁ of the liquid crystal display unit which is laminated, the film laminate 1 can be attached to the electrode terminal 311a of the narrow width.

<4. Connection method between board and electronic components>
Next, a method for connecting a substrate and an electronic component using the film laminate 1 will be described with an example in which an IC chip is mounted as an electronic component on the electrode terminal portion 311a of the transparent substrate 31a.

  As above-mentioned, the anisotropic conductive film 2 is temporarily crimped | bonded to the electrode terminal part 311a by sticking the film laminated body 1 on the electrode terminal part 311a of the transparent substrate 31a.

  After the anisotropic conductive film 2 is temporarily pressure-bonded, the alignment state of the anisotropic conductive film 2 is confirmed, and when there is no problem such as misalignment, the release film 3 is removed from the anisotropic conductive film 2. Peel off. Thereby, as shown in FIG. 10, the anisotropic conductive film 2 is provided on the electrode terminal part 311a of the transparent substrate 31a.

  Thereafter, as shown in FIG. 11, the IC chip 36 is arranged on the anisotropic conductive film 2 so that the electrode of the electrode terminal portion 311 a of the transparent substrate 31 a and the electrode of the IC chip 36 face each other.

  Subsequently, a temperature equal to or higher than the curing temperature of the thermosetting resin in the anisotropic conductive film 2 while the upper surface of the IC chip 36 is pressed by the thermo-pressurizing head 37 with a pressure of about 3 MPa to 50 MPa, for example (thermosetting resin). Depending on the type, the heating is performed at a temperature of about 140 to 220 ° C., for example. As a result, the electrode terminal portion 311a of the liquid crystal panel 30 and the IC chip 36 are finally pressure-bonded via the anisotropic conductive film 2.

  With such a connection method, as shown in FIG. 12, a connection structure in which the electrode terminal portion 311a of the transparent substrate 31a of the liquid crystal display panel 30 and the IC chip 36 are connected via the anisotropic conductive film 2 is obtained. Manufactured. That is, the electrodes of the electrode terminal portion 311a of the liquid crystal display panel 30 and the electrodes of the IC chip 36 are connected via the conductive particles 21 in the anisotropic conductive film 2 so that conduction between the electrodes is achieved.

  In addition, after temporary pressure bonding of the anisotropic conductive film 2, the alignment state of the anisotropic conductive film 2 is confirmed, and when troubles such as misalignment occur, the film laminate 1 is peeled off and again You may make it perform the repair process (not shown) which arrange | positions the film laminated body 1. FIG.

  In addition, as a board | substrate which affixes the film laminated body 1, it is not limited to a liquid crystal display panel, What kind of thing may be sufficient as long as it is an insulating board | substrate provided with the narrow electrode terminal part. For example, a glass substrate provided with a narrow electrode terminal portion, a plastic substrate, a glass reinforced epoxy substrate, and the like can be given.

  Further, the electronic component may be another electronic component instead of the IC chip 36. For example, semiconductor chips other than IC chips such as LSI (Large Scale Integration) chips, semiconductor elements such as chip capacitors, flexible printed circuits (FPC), semiconductor mounting materials for driving liquid crystal COF (Chip On Film), etc. Can be mentioned.

  As mentioned above, although this Embodiment was described, it cannot be overemphasized that this invention is not limited to the above-mentioned embodiment, A various change is possible in the range which does not deviate from the summary of this invention.

<5. Example>
Next, specific examples of the present invention will be described.

Example 1
A release film was prepared in which the surface of a PET film having a width w of 1.5 mm and a thickness of 50 μm was subjected to a release treatment with silicone. An anisotropic conductive film (product name CP6920F3 (manufactured by Sony Chemical & Information Device Co., Ltd.)) having a width a of 1 mm and a thickness of 20 μm using an epoxy resin as a binder on the peeled surface of the release film, Lamination was performed such that one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film were superposed (a / w = 0.67). This obtained the film laminated body. The film laminate was wound around a plastic winding part (reel) to a length of 50 m, 100 m, and 200 m to form a reel body.

(Example 2)
The same treatment as in Example 1 was performed except that the width a of the anisotropic conductive film was 0.8 mm (a / w = 0.53).

(Example 3)
The same treatment as in Example 1 was performed except that the width a of the anisotropic conductive film was 0.4 mm (a / w = 0.27).

Example 4
The same treatment as in Example 1 was performed except that the width w of the release film was 1 mm and the width a of the anisotropic conductive film was 0.6 mm (a / w = 0.60).

(Example 5)
The same treatment as in Example 1 was performed except that the width w of the release film was 0.8 mm and the width a of the anisotropic conductive film was 0.4 mm (a / w = 0.50).

(Example 6)
Except for using the anisotropic conductive film of 20 μm thickness (product name CP1720ISV (manufactured by Sony Chemical & Information Device Co., Ltd.)) using acrylic resin as a binder instead of the anisotropic conductive film of Example 1 The same treatment as in Example 1 was performed.

(Comparative Example 1)
The same treatment as in Example 1 was performed except that the width a of the anisotropic conductive film was 1.5 mm (a / w = 1.00).

(Comparative Example 2)
Except for the width w of the release film being 1 mm (a / w = 1.00), the same treatment as in Example 1 was performed.

(Comparative Example 3)
The same treatment as in Example 1 was performed except that the width w of the release film was 0.8 mm and the width a of the anisotropic conductive film was 0.8 mm (a / w = 1.00).

(Comparative Example 4)
The same treatment as in Example 1 was performed except that the width w of the release film was 0.6 mm and the width a of the anisotropic conductive film was 0.6 mm (a / w = 1.00).

(Comparative Example 5)
A film laminate was produced in the same manner as in Example 1 except that an anisotropic conductive film was laminated and formed at the center in the width direction on the release film.

<Evaluation of winding state of film laminate>
In the film laminates of Examples 1 to 6 and Comparative Examples 1 to 5, those that are uniformly in a good winding state without any step or gap caused by the protrusion of the anisotropic conductive film are Although there are discontinuous parts in part of the state, the winding state is markedly inferior due to Δ, steps, gaps, etc. that can be implemented, and × Evaluation was performed. The evaluation results are shown in [Table 1]. Here, the “discontinuous portion” is a portion where the film laminates are not in close contact with each other, which is caused by air entering between the film laminates during winding.

<Evaluation of film laminate interference>
The test which affixes the film laminated body of Examples 1-6 and Comparative Examples 1-5 on the electrode terminal part (width 1.2mm) of the transparent substrate of a liquid crystal display panel was done. In this test, the electrode terminal portion of the transparent substrate and the anisotropic conductive film are opposed to each other, and the side surface of the film laminate in which the release film and the anisotropic conductive film overlap is used as the side surface of the liquid crystal display portion of the liquid crystal display panel. Attempts were made to attach the film laminate so as to oppose (see FIG. 8, etc.). In this sticking, the upper surface of the release film of the film laminate was heated at 80 ° C. while being pressed with a pressing head at 1.0 MPa. The one that the film laminate did not interfere well with the side of the liquid crystal display part of the liquid crystal display panel, and that the film laminate did not interfere well with the side of the liquid crystal display part of the liquid crystal display panel Evaluation of coherence was performed with x. The evaluation results are shown in [Table 1].

<Comprehensive evaluation>
About the film laminated body of Examples 1-6 and Comparative Examples 1-5, let the film laminated body ((circle)) which can implement the film laminated body whose above all evaluation results are (circle) be (triangle | delta) or x in the above evaluated result. Was evaluated as a film laminate (x) unsuitable for implementation. The overall evaluation results are shown in [Table 1].

  As shown in [Table 1], in the film laminates of Examples 1 to 5 using an epoxy resin as a binder, a good winding state was maintained up to a length of 200 m. Moreover, in the film laminated body of Examples 1-5, there was no interference with the peeling film and the side surface of the liquid crystal display part of a liquid crystal display panel at the time of sticking, and it was able to stick well on the electrode terminal part of a transparent substrate. . Moreover, the film laminated body of Examples 1-5 was able to maintain the favorable winding state. Similarly good results could be obtained in the film laminate of Example 6 using an acrylic resin as the binder.

  In the film laminates of Examples 1 to 6, the one side along the longitudinal direction of the release film and the one side along the longitudinal direction of the anisotropic conductive film overlap each other, whereby the release film and the liquid crystal display of the liquid crystal display panel It is thought that it was able to be stuck on the electrode terminal part of a transparent substrate, without interfering with the side surface of a part. Moreover, in the film laminated body of Examples 1-6, since the width w of a peeling film is larger than the width | variety a of an anisotropic conductive film, a holding space exists on a peeling film. In addition, even when the width w of the release film is reduced, the anisotropic conductive film does not protrude outside both ends in the width direction of the release film in the wound state. It is thought that the winding state could be maintained.

  The film laminates of Comparative Examples 2 to 4 did not cause interference at the time of sticking. However, in Comparative Example 1, since the width w of the release film and the width a of the anisotropic conductive film were both 1.5 mm, interference with the side surface of the liquid crystal display portion of the liquid crystal display panel occurred. In Comparative Example 2, since the width w of the release film and the width a of the anisotropic conductive film were both 1.0 mm, there was no interference with the side surface of the liquid crystal display portion of the liquid crystal display panel, but the length was 200 m. A discontinuous portion was observed in a part of the wound state of the long tape. In addition, as shown in the results of Comparative Examples 3 and 4, when the width w of the release film is further reduced, even when the number of turns is small, the film laminate is misaligned or twisted due to the protrusion of the anisotropic conductive film. A defect such as a gap has occurred.

  Moreover, in the film laminated body of the comparative example 5, although it was able to wind well to length 200m, since an anisotropic conductive film exists in the center part of a peeling film, the liquid crystal display part of a liquid crystal display panel Interference with the side of the.

DESCRIPTION OF SYMBOLS 1 Film laminated body, 2 Anisotropic conductive film, 3 Release film, 5 Holding space, 6a, 6b Flange, 7 Reel body, 8 Winding part, 30 Liquid crystal display panel, 31a, 31b Transparent substrate, 32 Liquid crystal layer, 33 Sealing material, 34a, 34b Polarizing plate, 35 pressure head, 36 IC chip, 37 heat pressure head

Claims (12)

A film laminate in which an anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film,
The width of the release film is larger than the width of the anisotropic conductive film, and one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap. A film laminate.   The film laminate according to claim 1, wherein a / w = 0.25 to 0.9 when the width of the release film is w and the width of the anisotropic conductive film is a.   The film laminate according to claim 1, wherein the binder contains an epoxy resin or an acrylic resin. An anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film, and the width of the release film is larger than the width of the anisotropic conductive film, along the longitudinal direction of the release film. A film laminate in which one side along the longitudinal direction of the anisotropic conductive film overlaps the electrode terminal portion on the electrode terminal portion of the substrate provided with the electrode terminal portion and another member; A film laminate arrangement step of arranging so that the anisotropic conductive film faces,
A film laminate pasting step of pasting the film laminate on the electrode terminal portion of the substrate by pressing a pressure head against the upper surface of the release film and pressing the film laminate;
In the film laminate arrangement step, a side surface of the film laminate and a side surface of the other member in which one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap. A sticking method characterized by being arranged so as to face each other.   The sticking method according to claim 4, wherein a / w = 0.25 to 0.9 when the width of the release film is w and the width of the anisotropic conductive film is a.   The sticking method according to claim 4 or 5, wherein the binder contains an epoxy resin or an acrylic resin. In the connection method for anisotropic conductive connection between the electrode of the substrate and the electrode of the electronic component,
An anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film, and the width of the release film is larger than the width of the anisotropic conductive film, along the longitudinal direction of the release film. A film laminate in which one side along the longitudinal direction of the anisotropic conductive film overlaps the electrode terminal portion on the electrode terminal portion of the substrate provided with the electrode terminal portion and another member; A film laminate arrangement step of arranging so that the anisotropic conductive film faces,
A film laminate pasting step of pasting the film laminate on the electrode terminal portion of the substrate by pressing a pressure head against the top surface of the release film and pressing the film laminate;
An electronic component placement step of peeling the release film and placing the electronic component on the anisotropic conductive film;
A step of connecting the electrode of the substrate and the electrode of the electronic component via the conductive particles by pressing a pressing head against the upper surface of the electronic component and applying heat,
In the film laminate arrangement step, a side surface of the film laminate and a side surface of the other member in which one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap. A connection method characterized by being arranged to face each other.   The connection method according to claim 7, wherein a / w = 0.25 to 0.9 when the width of the release film is w and the width of the anisotropic conductive film is a.   The connection method according to claim 7 or 8, wherein the binder contains an epoxy resin or an acrylic resin. In the connection structure formed by anisotropic conductive connection between the electrode of the substrate and the electrode of the electronic component,
An anisotropic conductive film in which conductive particles are dispersed in a binder is laminated on a release film, and the width of the release film is larger than the width of the anisotropic conductive film, along the longitudinal direction of the release film. A film laminate in which one side along the longitudinal direction of the anisotropic conductive film overlaps the electrode terminal portion on the electrode terminal portion of the substrate provided with the electrode terminal portion and another member; A film laminate arrangement step of arranging so that the anisotropic conductive film faces,
A film laminate pasting step of pasting the film laminate on the electrode terminal portion of the substrate by pressing a pressure head against the top surface of the release film and pressing the film laminate;
An electronic component placement step of peeling the release film and placing the electronic component on the anisotropic conductive film;
A step of connecting the electrode of the substrate and the electrode of the electronic component via the conductive particles by pressing a pressing head against the upper surface of the electronic component and applying heat,
In the film laminate arrangement step, a side surface of the film laminate and a side surface of the other member in which one side along the longitudinal direction of the release film and one side along the longitudinal direction of the anisotropic conductive film overlap. A connection structure connected by a connection method, wherein the connection structures are arranged so as to face each other.   The connection structure according to claim 10, wherein a / w = 0.25 to 0.9, where w is a width of the release film and a is a width of the anisotropic conductive film.   The connection structure according to claim 10 or 11, wherein the binder contains an epoxy resin or an acrylic resin.

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