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JP2011025399A - Method for boring printed circuit board - Google Patents

Method for boring printed circuit board Download PDF

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Publication number
JP2011025399A
JP2011025399A JP2010100411A JP2010100411A JP2011025399A JP 2011025399 A JP2011025399 A JP 2011025399A JP 2010100411 A JP2010100411 A JP 2010100411A JP 2010100411 A JP2010100411 A JP 2010100411A JP 2011025399 A JP2011025399 A JP 2011025399A
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printed circuit
hole
circuit board
processed
workpiece
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JP2010100411A
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JP5550977B2 (en
Inventor
Yasushi Ito
靖 伊藤
Norio Michigami
典男 道上
Yutaka Kawasaki
裕 河崎
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Via Mechanics Ltd
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Hitachi Via Mechanics Ltd
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Priority to JP2010100411A priority Critical patent/JP5550977B2/en
Priority to KR1020100054283A priority patent/KR101726714B1/en
Priority to TW099120077A priority patent/TWI538587B/en
Priority to CN2010102175816A priority patent/CN101932199A/en
Priority to CN201410196030.4A priority patent/CN103987195B/en
Publication of JP2011025399A publication Critical patent/JP2011025399A/en
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Publication of JP5550977B2 publication Critical patent/JP5550977B2/en
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  • Laser Beam Processing (AREA)
  • Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method for boring a printed circuit board improving boring efficiency with high reliability in a plating layer formed in conductive plating. <P>SOLUTION: A bottomed hole 5 is bored in the printed board 1 by laser, a plurality of sheets of the printed boards 1 bored with the bottomed holes 5 are overlapped, and the plurality of overlapped printed boards 1 are made into a workpiece W. A through-hole 4 is bored in the workpiece W by using a drill 6 having a larger diameter than that of the bottomed hole 5. In this case, a through-hole 5a may be bored by laser in place of the bottomed hole 5 bored in the printed board 1. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

この発明は、プリント配線基板（以下、「プリント基板」という。）の穴明け加工方法に関する。   The present invention relates to a drilling method for a printed wiring board (hereinafter referred to as “printed board”).

絶縁物を挟み表裏両面に配置された導電層を電気的に接続する場合、表裏の導体層に接続する穴（以下、「接続穴」という。）を明け、接続穴の内部に導電性メッキを施すことにより、表裏の導電層を電気的に接続している。電子機器の小型化、高密度実装化に伴い、接続穴の穴径としては０．１５〜０．０８ｍｍが採用されている。このような接続穴は、ドリルまたはレーザで加工される。   When electrically connecting conductive layers arranged on both front and back sides with an insulator in between, open a hole (hereinafter referred to as “connection hole”) to the conductive layer on the front and back sides, and conduct conductive plating inside the connection hole. By applying, the conductive layers on the front and back are electrically connected. With the miniaturization and high-density mounting of electronic devices, 0.15-0.08 mm is adopted as the hole diameter of the connection holes. Such a connection hole is processed by a drill or a laser.

図６は、ドリルで接続穴を加工する場合のワークの説明図であり、（ａ）は平面図、（ｂ）は側面図、（ｃ）は（ｂ）のＡ部拡大図である。
図示のプリント基板１は、絶縁層１ｚを挟み、表面側に導体層１ａが、裏面側に導体層１ｂが配置されている。絶縁層１ｚは樹脂１ｊとガラス繊維１ｇとから構成されている。ドリルにより接続穴を加工する場合、加工能率を向上させるため、複数枚のプリント基板１を重ねて加工する。すなわち、ドリルで加工する場合の接続穴はスルーホール（貫通穴）である。
ドリルでスルーホールを加工する場合は、プリント基板１の予め定める位置に穴２を加工しておき、複数枚のプリント基板１を重ねてスタックピン３を挿入する。通常、穴２は断面円形であり、重ねられたプリント基板１がずれることを防止するため、１枚のプリント基板１には穴２が２個以上（図示の場合は、２個）設けられる。また、スタックピン３の外径は穴２の直径よりも僅かに大きく、スタックピン３を穴２に係合させると、複数枚のプリント基板１（図示の場合８枚）を１つのワークＷとして扱うことができる。通常、スタックピン３はワークＷを加工テーブルに位置決めするための位置決めピンとしての機能も持たせられている（特許文献1）。 FIGS. 6A and 6B are explanatory views of a workpiece when a connection hole is machined with a drill, where FIG. 6A is a plan view, FIG. 6B is a side view, and FIG. 6C is an enlarged view of a portion A in FIG.
The printed board 1 shown in the figure has an insulating layer 1z sandwiched therebetween, and a conductor layer 1a is disposed on the front surface side and a conductor layer 1b is disposed on the back surface side. The insulating layer 1z is composed of resin 1j and glass fiber 1g. When processing a connection hole with a drill, in order to improve processing efficiency, a plurality of printed circuit boards 1 are stacked and processed. That is, the connection hole when processing with a drill is a through hole (through hole).
When processing a through-hole with a drill, the hole 2 is processed in the predetermined position of the printed circuit board 1, and the stack pin 3 is inserted by stacking a plurality of printed circuit boards 1. Normally, the hole 2 has a circular cross section, and two or more holes 2 (two in the illustrated case) are provided in one printed circuit board 1 in order to prevent the stacked printed circuit boards 1 from shifting. Further, the outer diameter of the stack pin 3 is slightly larger than the diameter of the hole 2, and when the stack pin 3 is engaged with the hole 2, a plurality of printed boards 1 (eight in the case of illustration) are used as one work W. Can be handled. Usually, the stack pin 3 also has a function as a positioning pin for positioning the workpiece W on the machining table (Patent Document 1).

ドリルでスルーホールを加工すると、穴内壁の面粗さを２μｍ以下にすることができるので、導電性めっき処理において厚さが均一なめっき層を形成することができ、導体層１ａと導体層１ｂとを電気的に確実に接続することができる。   When the through hole is processed with a drill, the surface roughness of the inner wall of the hole can be reduced to 2 μm or less, so that a plating layer having a uniform thickness can be formed in the conductive plating process, and the conductor layer 1a and the conductor layer 1b Can be electrically connected reliably.

図７は、レーザで接続穴を加工した場合のワークの説明図であり、（ａ）は平面図、（ｂ）は（ａ）のＢ部拡大図である。
レーザで接続穴を加工する場合は、導体層１ａから導体層１ｂの表面に達する底付き穴５を形成する。底付き穴を加工する場合、プリント基板１を１枚ずつ加工することになるが、１個の穴を加工するのに要する時間はドリルで加工する場合に比べて１０〜１００倍であるので、加工速度が問題になることはない（特許文献２）。しかし、図7（ｂ）に示すように、底付き穴５の穴底の直径が入り口側の穴の直径よりも小さくなる（軸方向にテーパーが発生する）ことが多い。 FIGS. 7A and 7B are explanatory views of the workpiece when the connection hole is machined with a laser, in which FIG. 7A is a plan view and FIG. 7B is an enlarged view of a portion B of FIG.
When processing the connection hole with a laser, the bottomed hole 5 reaching the surface of the conductor layer 1b from the conductor layer 1a is formed. When processing a hole with a bottom, the printed circuit board 1 will be processed one by one, but the time required to process one hole is 10 to 100 times that when processing with a drill. The processing speed does not become a problem (Patent Document 2). However, as shown in FIG. 7B, the diameter of the bottom of the bottomed hole 5 is often smaller than the diameter of the hole on the entrance side (taper is generated in the axial direction).

なお、図示のプリント基板１にはプリント基板１をテーブルに位置決めするための穴２が設けられているが、レーザで接続穴を加工する場合、穴２を設けず、他の手段（例えば、位置決めマーク等）によりプリント基板１をテーブルに位置決めをする場合がある。   The illustrated printed circuit board 1 is provided with a hole 2 for positioning the printed circuit board 1 on the table. However, when processing the connection hole with a laser, the hole 2 is not provided, and other means (for example, positioning) The printed circuit board 1 may be positioned on the table by a mark or the like.

特開昭６３−３０６８４７号公報JP-A 63-306847 特開２００２−３３５０６３号公報JP 2002-335063 A

図８は、ワークＷにスルーホールを加工した場合の断面図である。
ワークＷをドリルにより加工した場合、スルーホール４の軸線がプリント基板１の表面に垂直な直線Ｌ，Ｎに対して傾いたり（図示省略）、同図に示すように、途中から曲がる場合がある。このような場合、下層のプリント基板１ではスルーホール４の穴位置精度が低下して許容値を満足できない場合が発生する。そこで、通常は、プリント基板１の重ね枚数を減らして加工する。例えば、図示の場合、スルーホール４の穴位置精度を向上させるにはプリント基板１の重ね枚数を４枚以下にすればよい。例えば、ガラス繊維入りの樹脂層を挟み、表面層と裏面層の銅箔がそれぞれ１８μｍで板厚が０．１ｍｍのプリント基板に直径が０．１ｍｍのスルーホール４を加工する場合、最下層のスルーホール４の穴位置精度を±３０μｍに収めようとすると、４枚重ねが限度である。 FIG. 8 is a cross-sectional view when a through hole is machined in the workpiece W.
When the workpiece W is machined by a drill, the axis of the through hole 4 may be inclined with respect to the straight lines L and N perpendicular to the surface of the printed circuit board 1 (not shown), or may be bent from the middle as shown in the figure. . In such a case, in the lower-layer printed circuit board 1, the hole position accuracy of the through hole 4 is lowered and the allowable value may not be satisfied. Therefore, processing is usually performed by reducing the number of stacked printed circuit boards 1. For example, in the case of illustration, in order to improve the hole position accuracy of the through hole 4, the number of the printed circuit boards 1 to be stacked may be four or less. For example, when a through-hole 4 having a diameter of 0.1 mm is processed on a printed board having a glass layer containing a resin layer and a copper foil of a front surface layer and a back surface layer each having a thickness of 18 μm and a plate thickness of 0.1 mm, If the hole position accuracy of the through hole 4 is to be kept within ± 30 μm, the stacking of four sheets is the limit.

図９は、レーザで接続穴を加工した場合の板厚方向の断面図である。
レーザで接続穴を加工した場合、１個の穴を加工するのに要する時間はドリルで加工する場合に比べて短い。しかし、レーザのエネルギ強度をガラス繊維１ｇを切断できる値にすると、樹脂１ｊが過剰に溶けてしまい、底付き穴５内壁の表面粗さが荒くなる（ガラス繊維１ｇが底付き穴５の内壁から飛び出す）。このため、導電性めっき処理において形成されるめっき層の厚さがばらつき、導体層１ａと導体層１ｂの電気的な接続の信頼性が低くなる。 FIG. 9 is a cross-sectional view in the plate thickness direction when the connection hole is processed with a laser.
When a connection hole is machined with a laser, the time required to machine one hole is shorter than when machining with a drill. However, when the energy intensity of the laser is set to a value that can cut the glass fiber 1g, the resin 1j is excessively melted, and the surface roughness of the inner wall of the bottomed hole 5 becomes rough (the glass fiber 1g is removed from the inner wall of the bottomed hole 5). Jump out). For this reason, the thickness of the plating layer formed in the conductive plating process varies, and the reliability of the electrical connection between the conductor layer 1a and the conductor layer 1b is lowered.

本発明の目的は、上記課題を解決し、導電性めっき処理において形成されるめっき層の信頼性が高く、かつ、加工能率を向上させることができるプリント基板の穴明け加工方法を提供するにある。   An object of the present invention is to provide a printed circuit board drilling method capable of solving the above-described problems and having high reliability of a plating layer formed in a conductive plating process and improving processing efficiency. .

上記課題を解決するため、本発明は、プリント基板にレーザで穴を加工し、穴が加工された前記プリント基板を複数枚重ね、前記穴の直径よりも大径のドリルを用いて複数枚重ねた前記プリント基板の前記穴をさらに加工することにより、プリント基板に所望の直径の穴を加工することを特徴とする。   In order to solve the above-mentioned problems, the present invention processes a hole on a printed circuit board with a laser, stacks a plurality of the printed circuit boards on which holes are processed, and stacks a plurality of sheets using a drill having a diameter larger than the diameter of the hole Further, the hole of a desired diameter is processed in the printed circuit board by further processing the hole of the printed circuit board.

この場合、レーザで穴を加工するのに先立ち、複数の前記プリント基板を重ねる際に前記プリント基板を位置決めをするための複数の基準穴を形成しておくと効果的である。   In this case, it is effective to form a plurality of reference holes for positioning the printed circuit board when the plurality of printed circuit boards are stacked prior to processing the holes with a laser.

また、レーザにより穴を加工した前記プリント基板と穴が加工されていない前記プリント基板とを、レーザにより穴を加工した前記プリント基板が上側になるようにして交互に重ねて加工することができる。   Further, the printed circuit board in which the holes are processed by the laser and the printed circuit board in which the holes are not processed can be alternately overlapped and processed so that the printed circuit board in which the holes are processed is on the upper side.

また、ドリルとしては、先端角を１１０度以下としたドリルを用いることができる。   As the drill, a drill having a tip angle of 110 degrees or less can be used.

穴内壁の面粗さを小さくできるので、導電性めっき処理におけるめっき層の信頼性を向上させることができる。加工工程が増加するが、ドリル加工時におけるプリント基板の重ね枚数を従来の２倍以上にすることができるので、穴明け時間の増加は僅かである。   Since the surface roughness of the inner wall of the hole can be reduced, the reliability of the plating layer in the conductive plating process can be improved. Although the number of processing steps increases, the number of stacked printed circuit boards at the time of drilling can be doubled or more compared to the conventional method, so that the drilling time increases only slightly.

図１は、本発明の加工手順を示すフローチャートである。FIG. 1 is a flowchart showing the processing procedure of the present invention. 図２は、接続穴を加工する場合のワークの説明図である。FIG. 2 is an explanatory diagram of the workpiece when the connection hole is machined. 図３は、加工時におけるワーク断面図である。FIG. 3 is a cross-sectional view of the workpiece during machining. 図４は、本発明に係るワークＷの第１の変形例を示すワークＷの断面図である。FIG. 4 is a cross-sectional view of a workpiece W showing a first modification of the workpiece W according to the present invention. 図５は、本発明に係るワークＷの第２の変形例を示すワークＷの断面図である。FIG. 5 is a cross-sectional view of a workpiece W showing a second modification of the workpiece W according to the present invention. 図６は、ドリルで接続穴を加工する場合のワークの説明図である。FIG. 6 is an explanatory diagram of a workpiece when a connection hole is machined with a drill. 図７は、レーザで接続穴を加工した場合のワークの説明図である。FIG. 7 is an explanatory diagram of the workpiece when the connection hole is machined with a laser. 図８は、ワークＷにスルーホールを加工した場合の断面図である。FIG. 8 is a cross-sectional view when a through hole is machined in the workpiece W. 図９は、レーザで接続穴を加工した場合の板厚方向の断面図である。FIG. 9 is a cross-sectional view in the plate thickness direction when the connection hole is processed with a laser. 図１０は、本発明に係るワークＷの第３の変形例を示すワークＷの断面図である。FIG. 10 is a cross-sectional view of a workpiece W showing a third modification of the workpiece W according to the present invention.

図１は、本発明の加工手順を示すフローチャートである。また、図２は、接続穴を加工する場合のワークの説明図であり、（ａ）は平面図、（ｂ）は側面図、（ｃ）は（ｂ）のＣ部拡大図である。また、図３は、ワーク断面図であり、（ａ）は加工時における断面を、（ｂ）は加工終了後の断面を、それぞれ示している。なお、図６〜８と同じものまたは同一機能のものは同一の符号を付して重複する説明を省略する。   FIG. 1 is a flowchart showing the processing procedure of the present invention. 2A and 2B are explanatory views of the workpiece when the connection hole is machined, in which FIG. 2A is a plan view, FIG. 2B is a side view, and FIG. 2C is an enlarged view of a portion C in FIG. 3A and 3B are cross-sectional views of the workpiece, where FIG. 3A shows a cross section during processing, and FIG. 3B shows a cross section after processing. 6 to 8 having the same function or the same function are denoted by the same reference numerals and redundant description is omitted.

図１を参照しながら、本発明の加工手順を説明する。
（１）先ず、プリント基板１の予め定める位置に穴２を加工する（手順Ｓ１０）。
（２）レーザ加工機により、導体層１ａから導体層１ｂの表面に達する底付き穴５を形成する（手順Ｓ２０）。
この場合、底付き穴５の直径は、指定された接続穴径よりも２０〜３０μｍ小径にするのが実用的である。また、プリント基板１をレーザ加工機のテーブルに位置決めする際、あるいは加工の際、穴２を基準にして加工することができる。
（３）図２（ａ）、（ｂ）に示すように、複数枚のプリント基板１を重ねてスタックピン３を挿入する（手順Ｓ３０）。
なお、レーザ加工の場合、加工した穴の位置決め精度は±１０μｍ程度であるので、図２（ｃ）に示すように、積層されたプリント基板１の底付き穴５の軸線は積層方向にほぼ一直線になる。スタックピン３により一体になった複数枚のプリント基板１がドリル加工時におけるワークＷである。
（４）呼び径が指定された接続穴径に等しいドリルにより、ワークＷにスルーホール４を加工する（手順Ｓ４０）。
この結果、図３に示すように、ドリル６はプリント基板１に加工されている底付き穴５に倣って切り込まれるので、最下層のプリント基板１を加工した時点でも、ドリル６の曲がりはほとんど発生しない。 The processing procedure of the present invention will be described with reference to FIG.
(1) First, the hole 2 is processed at a predetermined position on the printed circuit board 1 (step S10).
(2) The bottomed hole 5 reaching the surface of the conductor layer 1b from the conductor layer 1a is formed by a laser processing machine (procedure S20).
In this case, the diameter of the bottomed hole 5 is practically 20 to 30 μm smaller than the designated connection hole diameter. Further, when positioning the printed circuit board 1 on the table of the laser processing machine or during processing, the printed circuit board 1 can be processed with reference to the hole 2.
(3) As shown in FIGS. 2A and 2B, a plurality of printed circuit boards 1 are stacked and the stack pin 3 is inserted (step S30).
In the case of laser processing, since the positioning accuracy of the processed hole is about ± 10 μm, the axis of the bottomed hole 5 of the stacked printed circuit board 1 is substantially straight in the stacking direction as shown in FIG. become. A plurality of printed circuit boards 1 integrated by the stack pins 3 are workpieces W during drilling.
(4) The through-hole 4 is machined into the workpiece W with a drill whose nominal diameter is equal to the designated connection hole diameter (step S40).
As a result, as shown in FIG. 3, the drill 6 is cut following the bottomed hole 5 processed in the printed circuit board 1, so that the drill 6 can be bent even when the lowermost printed circuit board 1 is processed. It hardly occurs.

なお、底付き穴５の位置のばらつきおよびドリル６の軸線の位置決めのばらつき（±１０μｍ程度）により、スルーホール４の軸線と底付き穴５の軸線が同軸にならない場合が発生するが、スルーホール４の軸線と底付き穴５の軸線とのずれが大きく（例えば、水平方向の断面が達磨形になった場合）、底付き穴５の内壁の一部が加工されずに残った場合であっても、面粗さが小さいスルーホール４の内壁が形成されているので、導電性めっき処理において信頼性の高いめっき層を形成することができる。   Note that due to variations in the position of the bottom hole 5 and the positioning of the axis of the drill 6 (about ± 10 μm), the axis of the through hole 4 and the axis of the bottom hole 5 may not be coaxial. This is a case where the deviation between the axis 4 and the axis of the bottomed hole 5 is large (for example, when the horizontal cross-section has a polished shape), and a part of the inner wall of the bottomed hole 5 remains unprocessed. However, since the inner wall of the through hole 4 having a small surface roughness is formed, a highly reliable plating layer can be formed in the conductive plating process.

図４は、本発明に係るワークＷの第１の変形例を示すワークＷの断面図である。
同図に示すように、ワークＷとして、底付き穴５を加工したプリント基板１と底付き穴５が加工されていないプリント基板１とを、底付き穴５を加工したプリント基板１が上になるようにして積層してもよい。この場合、底付き穴５の加工時間を１／２にできるので、さらに加工能率を向上させることができる。 FIG. 4 is a cross-sectional view of a workpiece W showing a first modification of the workpiece W according to the present invention.
As shown in the figure, as a work W, a printed circuit board 1 in which the bottomed hole 5 is processed and a printed circuit board 1 in which the bottomed hole 5 is not processed are placed on the printed circuit board 1 in which the bottomed hole 5 is processed. The layers may be laminated in such a manner. In this case, since the machining time of the bottomed hole 5 can be halved, the machining efficiency can be further improved.

図５は、本発明に係るワークＷの第２の変形例を示すワークＷの断面図である。
同図に示すように、ワークＷとして、底付き穴５に代えてレーザにより貫通穴５ａを加工したプリント基板１を積層すると、積層枚数をさらに増加することができ、ドリルによる加工能率を向上させることができる。 FIG. 5 is a cross-sectional view of a workpiece W showing a second modification of the workpiece W according to the present invention.
As shown in the figure, when the printed circuit board 1 in which the through holes 5a are processed by laser instead of the bottomed holes 5 is stacked as the workpiece W, the number of stacked layers can be further increased, and the processing efficiency by the drill is improved. be able to.

図１０は、本発明に係るワークＷの第３の変形例を示すワークＷの断面図である。
同図に示すように、ワークＷとして、コアとなるプリント基板（コア層）１１の両側に片側が絶縁層のプリント基板（ビルドアップ層）１２を重ねた積層基板を用いてもドリルによる加工能率を向上させることができる。 FIG. 10 is a cross-sectional view of a workpiece W showing a third modification of the workpiece W according to the present invention.
As shown in the figure, even if a laminated substrate in which a printed circuit board (core layer) 11 serving as a core is laminated on both sides of a printed circuit board (build-up layer) 12 on one side is used as a workpiece W, the processing efficiency by a drill is increased. Can be improved.

なお、ドリル加工時におけるドリルの先端角を例えば、１１０度程度にすると、穴位置精度をさらに向上させることができる。   If the tip angle of the drill at the time of drilling is, for example, about 110 degrees, the hole position accuracy can be further improved.

１ プリント基板
４ スルーホール（貫通穴）
５ 底付き穴
５ａ 貫通穴
Ｗ ワーク 1 Printed circuit board 4 Through hole (through hole)
5 Bottom hole 5a Through hole W Workpiece

Claims (4)

プリント基板にレーザで穴を加工し、
穴が加工された前記プリント基板を複数枚重ね、
前記穴の直径よりも大径のドリルを用いて複数枚重ねた前記プリント基板の前記穴をさらに加工することにより、プリント基板に所望の直径の穴を加工する
ことを特徴とするプリント基板の穴明け加工方法。 Process holes in the printed circuit board with a laser,
A plurality of the printed circuit boards in which holes are processed are stacked,
A hole in a printed circuit board, wherein a hole having a desired diameter is processed in the printed circuit board by further processing the holes in the printed circuit board stacked by using a drill having a diameter larger than the diameter of the hole. Dawn processing method. レーザで穴を加工するのに先立ち、複数の前記プリント基板を重ねる際に前記プリント基板を位置決めをするための複数の基準穴を形成しておく
ことを特徴とする請求項１に記載のプリント基板の穴明け加工方法。 2. The printed circuit board according to claim 1, wherein a plurality of reference holes for positioning the printed circuit board are formed when the plurality of printed circuit boards are stacked prior to processing the holes with a laser. Drilling method. レーザにより穴を加工した前記プリント基板と穴が加工されていない前記プリント基板とを、レーザにより穴を加工した前記プリント基板が上側になるようにして交互に重ねる
ことを特徴とする請求項１に記載のプリント基板の穴明け加工方法。 2. The printed circuit board in which holes are processed by a laser and the printed circuit board in which holes are not processed are alternately overlapped so that the printed circuit board in which holes are processed by a laser is on an upper side. The printed circuit board drilling method described. 前記ドリルの先端角を１１０度以下とする
ことを特徴とする請求項１に記載のプリント基板の穴明け加工方法。 The drilling method for a printed circuit board according to claim 1, wherein a tip angle of the drill is 110 degrees or less.
JP2010100411A 2009-06-23 2010-04-23 Method for drilling printed circuit boards Expired - Fee Related JP5550977B2 (en)

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JP2010100411A JP5550977B2 (en) 2009-06-23 2010-04-23 Method for drilling printed circuit boards
KR1020100054283A KR101726714B1 (en) 2009-06-23 2010-06-09 Boring method for printed substrate
TW099120077A TWI538587B (en) 2009-06-23 2010-06-21 Printed substrate processing method
CN2010102175816A CN101932199A (en) 2009-06-23 2010-06-22 Method for processing hole on printed substrate
CN201410196030.4A CN103987195B (en) 2009-06-23 2010-06-22 Boring method for printed substrate

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CN112893922A (en) * 2021-01-26 2021-06-04 西安交通大学 Device and method for measuring critical layering axial force of multilayer material
CN116940001A (en) * 2022-03-31 2023-10-24 深圳市慧儒电子科技有限公司 Manufacturing method of flexible circuit board and LED lamp strip, flexible circuit board and LED lamp strip

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CN107567193A (en) * 2017-11-02 2018-01-09 惠州市特创电子科技有限公司 Folded drill method
CN113873765A (en) * 2021-09-29 2021-12-31 景旺电子科技(珠海)有限公司 Circuit board manufacturing method and circuit board

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CN116940001A (en) * 2022-03-31 2023-10-24 深圳市慧儒电子科技有限公司 Manufacturing method of flexible circuit board and LED lamp strip, flexible circuit board and LED lamp strip

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JP5550977B2 (en) 2014-07-16

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