JP2010500261A - 引裂開始型カバーテープを有するキャリアテープ、及びその製造方法 - Google Patents
引裂開始型カバーテープを有するキャリアテープ、及びその製造方法 Download PDFInfo
- Publication number
- JP2010500261A JP2010500261A JP2009523962A JP2009523962A JP2010500261A JP 2010500261 A JP2010500261 A JP 2010500261A JP 2009523962 A JP2009523962 A JP 2009523962A JP 2009523962 A JP2009523962 A JP 2009523962A JP 2010500261 A JP2010500261 A JP 2010500261A
- Authority
- JP
- Japan
- Prior art keywords
- cover tape
- film
- tear initiation
- tear
- features
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title 1
- 230000000977 initiatory effect Effects 0.000 claims abstract description 102
- 239000000853 adhesive Substances 0.000 claims description 79
- 230000001070 adhesive effect Effects 0.000 claims description 79
- 238000000034 method Methods 0.000 claims description 61
- 238000000576 coating method Methods 0.000 claims description 24
- 238000005520 cutting process Methods 0.000 claims description 23
- 239000010410 layer Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 22
- 239000012792 core layer Substances 0.000 claims description 20
- 239000000463 material Substances 0.000 claims description 18
- 238000004804 winding Methods 0.000 claims description 4
- 239000010408 film Substances 0.000 description 119
- 238000007789 sealing Methods 0.000 description 15
- 230000002093 peripheral effect Effects 0.000 description 8
- 230000007246 mechanism Effects 0.000 description 6
- 230000002829 reductive effect Effects 0.000 description 6
- 238000011109 contamination Methods 0.000 description 4
- 238000003860 storage Methods 0.000 description 4
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 230000015572 biosynthetic process Effects 0.000 description 3
- 239000013039 cover film Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 230000001154 acute effect Effects 0.000 description 2
- 230000005611 electricity Effects 0.000 description 2
- 239000012634 fragment Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000005339 levitation Methods 0.000 description 2
- 229920006254 polymer film Polymers 0.000 description 2
- 238000004080 punching Methods 0.000 description 2
- 230000002441 reversible effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 230000003068 static effect Effects 0.000 description 2
- 229910018487 Ni—Cr Inorganic materials 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- BLRPTPMANUNPDV-UHFFFAOYSA-N Silane Chemical compound [SiH4] BLRPTPMANUNPDV-UHFFFAOYSA-N 0.000 description 1
- 239000004809 Teflon Substances 0.000 description 1
- 229920006362 Teflon® Polymers 0.000 description 1
- 238000005299 abrasion Methods 0.000 description 1
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000003667 anti-reflective effect Effects 0.000 description 1
- 229920006378 biaxially oriented polypropylene Polymers 0.000 description 1
- 239000011127 biaxially oriented polypropylene Substances 0.000 description 1
- OJIJEKBXJYRIBZ-UHFFFAOYSA-N cadmium nickel Chemical compound [Ni].[Cd] OJIJEKBXJYRIBZ-UHFFFAOYSA-N 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 238000005266 casting Methods 0.000 description 1
- 238000003486 chemical etching Methods 0.000 description 1
- VNNRSPGTAMTISX-UHFFFAOYSA-N chromium nickel Chemical compound [Cr].[Ni] VNNRSPGTAMTISX-UHFFFAOYSA-N 0.000 description 1
- 239000012050 conventional carrier Substances 0.000 description 1
- 239000011243 crosslinked material Substances 0.000 description 1
- 230000032798 delamination Effects 0.000 description 1
- 230000001419 dependent effect Effects 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000608 laser ablation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 239000002346 layers by function Substances 0.000 description 1
- 230000000670 limiting effect Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 238000001465 metallisation Methods 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 239000005026 oriented polypropylene Substances 0.000 description 1
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 1
- 229920002239 polyacrylonitrile Polymers 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000515 polycarbonate Polymers 0.000 description 1
- 239000004417 polycarbonate Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000000717 retained effect Effects 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 229910000077 silane Inorganic materials 0.000 description 1
- 229910001220 stainless steel Inorganic materials 0.000 description 1
- 239000010935 stainless steel Substances 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 238000002604 ultrasonography Methods 0.000 description 1
Images
Classifications
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J7/00—Adhesives in the form of films or foils
- C09J7/20—Adhesives in the form of films or foils characterised by their carriers
- C09J7/22—Plastics; Metallised plastics
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/0084—Containers and magazines for components, e.g. tube-like magazines
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/16—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet by the structure of the carrier layer
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/10—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet
- C09J2301/18—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive tape or sheet characterized by perforations in the adhesive tape
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09J—ADHESIVES; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; USE OF MATERIALS AS ADHESIVES
- C09J2301/00—Additional features of adhesives in the form of films or foils
- C09J2301/20—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself
- C09J2301/204—Additional features of adhesives in the form of films or foils characterized by the structural features of the adhesive itself the adhesive coating being discontinuous
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1056—Perforating lamina
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/10—Methods of surface bonding and/or assembly therefor
- Y10T156/1052—Methods of surface bonding and/or assembly therefor with cutting, punching, tearing or severing
- Y10T156/1062—Prior to assembly
- Y10T156/1067—Continuous longitudinal slitting
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T156/00—Adhesive bonding and miscellaneous chemical manufacture
- Y10T156/11—Methods of delaminating, per se; i.e., separating at bonding face
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T428/00—Stock material or miscellaneous articles
- Y10T428/15—Sheet, web, or layer weakened to permit separation through thickness
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Packages (AREA)
- Adhesive Tapes (AREA)
- Folding Of Thin Sheet-Like Materials, Special Discharging Devices, And Others (AREA)
- Laminated Bodies (AREA)
Abstract
Description
本出願は、2006年8月9日に出願された米国仮特許出願60/821,944の優先権を主張する。
Claims (19)
- カバーテープであって、
フィルムであって、第1及び第2主表面と、前記フィルムの長手方向の長さに沿って延びている外側部と、前記外側部と隣接して配置された内側部とを有する前記フィルムと、
前記外側部と隣接する前記第1主表面に固定された接着部分と、
前記第1主表面中の脆弱線であって、前記脆弱線が、前記外側部と隣接する前記フィルムの長手方向の長さに沿って延びており、及び前記内側部を前記外側接合部から漸次分離できるように構成されている脆弱線と、
前記外側部から延びている少なくとも1つの引裂開始特徴であって、前記外側部において予め定められた引裂方向を規定することで、前記脆弱線のそれぞれに沿って引裂を開始させる引裂開始特徴と、を含む、カバーテープ。 - 前記少なくとも1つの引裂開始特徴が弓状の形をしている、請求項1に記載のカバーテープ。
- 前記少なくとも1つの引裂開始特徴が、前記フィルムの前記第2表面から前記外側部の中へ切り込まれている、請求項1に記載のカバーテープ。
- 前記少なくとも1つの引裂開始特徴が、前記接着部を前記第1主表面に固定する前に切り込まれている、請求項3に記載のカバーテープ。
- 前記少なくとも1つの引裂開始特徴が、前記第1及び第2脆弱線から位置ずれしている、請求項1に記載のカバーテープ。
- 前記フィルムが多層フィルムである、請求項1に記載のカバーテープ。
- 前記多層フィルムが、トップコート層と、コア層と、底部コーティングとを含む、請求項6に記載のカバーテープ。
- 多層カバーテープの形成方法であって、
第1及び第2主表面を有するフィルムを形成することと、
前記フィルムの前記第1及び第2主表面に複数の軌道を切り込むことと、
前記フィルムの前記第1主表面に複数の切り込み線を切り込むことと、
前記第1主表面を複数の接着剤ストリップでコーティングすることと、
前記フィルムを、複数のカバーテープ類を形成する区分に分離することであって、前記カバーテープ類がそれぞれ、前記軌道で画定された引裂開始特徴類を有することと、を含む、方法。 - 前記複数の軌道がそれぞれ切り込み特徴の列を含み、前記切り込み特徴がそれぞれ一対の引裂開始特徴類を画定する、請求項8に記載の方法。
- 前記引裂開始特徴類が弓状の形である、請求項8に記載の方法。
- 前記軌道が、前記フィルムの前記第2主表面から切り込まれている、請求項8に記載の方法。
- 前記複数の軌道の切り込みが、前記第1主表面を前記接着剤ストリップでコーティングする前に生じる、請求項8に記載の方法。
- 前記複数の軌道の切り込みが、前記フィルムを分離して前記複数のカバーテープ類を形成した後に生じ、前記複数の軌道の切り込みが、前記カバーテープのうち少なくとも1つをロールとして巻き取っている間に前記複数の軌道を切り込むことを含む、請求項8に記載の方法。
- キャリアテープの使用方法であって、
ベース部に接着したカバーテープを有する前記キャリアテープを提供することであって、前記カバーテープが引裂開始特徴と切り込み線とを包含することと、
前記カバーテープの第1部分を、剥離が前記引裂開始特徴に達するまで前記ベース部から剥離することと、
前記カバーテープの第2部分を、前記引裂開始特徴に沿って剥離することと、
前記カバーテープの第3部分を、前記引裂開始特徴の後を実質的にたどる方向に、引裂が前記切り込み線に達するまで引き裂くことと、
前記カバーテープの第4部分を、前記切り込み線の後を実質的にたどる方向に引き裂くことと、を含む、方法。 - 前記引裂開始特徴が弓状の形である、請求項14に記載の方法。
- 前記カバーテープが、複数の引裂開始特徴類を含む、請求項14に記載の方法。
- 前記引裂開始特徴が前記切り込み線と交わらない、請求項14に記載の方法。
- 前記引裂開始特徴の少なくとも一部が直線状である、請求項14に記載の方法。
- 前記引裂開始特徴が、前記カバーテープを前記ベース部に接着させる接着剤物質の適用前に切り込まれる、請求項14に記載の方法。
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US82194406P | 2006-08-09 | 2006-08-09 | |
| US60/821,944 | 2006-08-09 | ||
| PCT/US2007/075382 WO2008021833A1 (en) | 2006-08-09 | 2007-08-07 | Carrier tapes having tear-initiated cover tapes and methods of making thereof |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JP2010500261A true JP2010500261A (ja) | 2010-01-07 |
| JP2010500261A5 JP2010500261A5 (ja) | 2010-09-02 |
| JP5238699B2 JP5238699B2 (ja) | 2013-07-17 |
Family
ID=39082343
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2009523962A Expired - Fee Related JP5238699B2 (ja) | 2006-08-09 | 2007-08-07 | 引裂開始型カバーテープを有するキャリアテープ、及びその製造方法 |
Country Status (10)
| Country | Link |
|---|---|
| US (3) | US20080038501A1 (ja) |
| EP (1) | EP2049609A4 (ja) |
| JP (1) | JP5238699B2 (ja) |
| KR (1) | KR101464780B1 (ja) |
| CN (1) | CN101501155B (ja) |
| IL (1) | IL196932A0 (ja) |
| MX (1) | MX2009001430A (ja) |
| MY (1) | MY155905A (ja) |
| TW (1) | TWI422660B (ja) |
| WO (1) | WO2008021833A1 (ja) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016150784A (ja) * | 2015-02-19 | 2016-08-22 | エスアイアイ・セミコンダクタ株式会社 | 搬送包装テープ |
| JP2019210301A (ja) * | 2018-05-31 | 2019-12-12 | 古河電気工業株式会社 | 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法 |
| CN111977174A (zh) * | 2020-09-16 | 2020-11-24 | 江西若邦科技股份有限公司 | 一种易撕的盖带及制备方法 |
Families Citing this family (16)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US8247057B2 (en) * | 2005-09-16 | 2012-08-21 | 3M Innovative Properties Company | Cover tape and method for manufacture |
| JP5685420B2 (ja) * | 2010-11-16 | 2015-03-18 | ラピスセミコンダクタ株式会社 | チップ部品包装装置、チップ部品の包装方法及びカバーテープ |
| DE102011113838B4 (de) * | 2011-09-21 | 2015-11-05 | Fresenius Medical Care Deutschland Gmbh | Webverfahren zur Herstellung einer Vielzahl von Feuchtigkeitssensoren für eine Vorrichtung zur Überwachung eines Patientenzugangs |
| WO2013090062A2 (en) | 2011-12-16 | 2013-06-20 | 3M Innovative Properties Company | Carrier tape |
| US9038272B1 (en) * | 2012-06-04 | 2015-05-26 | Vulcan Spring & Mfg. Co. | Variable force spring tapes and method of manufacture |
| JP2014207276A (ja) * | 2013-04-11 | 2014-10-30 | 日東電工株式会社 | キャリアテープ接続用粘着テープ、及びキャリアテープ接続用フィルム |
| JP6007411B2 (ja) * | 2013-09-05 | 2016-10-12 | パナソニックIpマネジメント株式会社 | 部品実装装置用のリールおよび部品実装装置における部品供給方法 |
| JP5952369B2 (ja) * | 2013-10-23 | 2016-07-13 | 福岡丸本株式会社 | 粘着テープ及び粘着テープ巻回体並びにテープディスペンサー |
| CN106061723A (zh) * | 2014-03-04 | 2016-10-26 | 3M创新有限公司 | 覆盖带和组件以及制造方法 |
| CN208836469U (zh) | 2014-10-29 | 2019-05-07 | 3M创新有限公司 | 承载带以及承载带组件 |
| CN104589777B (zh) * | 2014-12-31 | 2017-07-18 | 马俊 | 料带覆膜分离装置 |
| KR101804411B1 (ko) * | 2016-04-05 | 2017-12-04 | (주) 인텍플러스 | 캐리어 테이프를 이용한 반도체 소자 포장장치 |
| US10679877B2 (en) | 2018-06-28 | 2020-06-09 | Taiwan Semiconductor Manufacturing Co., Ltd. | Carrier tape system and methods of using carrier tape system |
| CN110654714B (zh) * | 2018-06-28 | 2021-09-17 | 台湾积体电路制造股份有限公司 | 半导体元件的载带系统与从载带的口袋搬移半导体元件的方法 |
| US11319464B2 (en) | 2019-11-20 | 2022-05-03 | Gourgen AMBARTSOUMIAN | Polymeric tape with tear cuts |
| CN113828592B (zh) * | 2021-10-30 | 2022-12-02 | 东莞市起源自动化科技有限公司 | 一种自动撕标签底纸设备 |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5390472A (en) * | 1992-06-19 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Carrier tape with cover strip |
| US20070062844A1 (en) * | 2005-09-16 | 2007-03-22 | Velasquez Urey Ruben E | Cover tape and method for manufacture |
Family Cites Families (23)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US1805533A (en) * | 1929-10-22 | 1931-05-19 | Reynolds Metals Co | Means of sealing cartons |
| US3467250A (en) * | 1968-01-25 | 1969-09-16 | Anthony N D Elia | Easy tear tape with lift tab |
| US4539239A (en) * | 1977-01-11 | 1985-09-03 | Newell Companies, Inc. | Window shade, and method apparatus for manufacturing same |
| US4584220A (en) * | 1982-01-15 | 1986-04-22 | Kroy Inc. | Laminated tape |
| US4878408A (en) * | 1987-05-20 | 1989-11-07 | Keen Corporation | Apparatus for slitting elongated flexible tape |
| MY103125A (en) | 1987-07-24 | 1993-04-30 | Lintec Corp | Cover tape for sealing chip-holding parts of carrier tape |
| US5027465A (en) * | 1988-06-20 | 1991-07-02 | Mckay Nicholas D | Lint remover |
| US5006856A (en) * | 1989-08-23 | 1991-04-09 | Monarch Marking Systems, Inc. | Electronic article surveillance tag and method of deactivating tags |
| US4944979A (en) * | 1989-10-19 | 1990-07-31 | At&T Bell Laboratories | Tape conveyers for components |
| JPH04201871A (ja) | 1990-11-29 | 1992-07-22 | Mitsubishi Electric Corp | エンボステーピング用カバーテープ |
| JPH05213364A (ja) | 1992-01-27 | 1993-08-24 | Matsushita Electric Ind Co Ltd | 部品収納テープ |
| JPH05310264A (ja) | 1992-04-28 | 1993-11-22 | Matsushita Electric Ind Co Ltd | 電子部品包装テープ |
| US5325654A (en) * | 1992-06-19 | 1994-07-05 | Minnesota Mining And Manufacturing Company | Carrier tape with cover strip |
| TW310121U (en) * | 1993-12-22 | 1997-07-01 | Lintec Corp | Cover tape |
| US6030692A (en) | 1996-09-13 | 2000-02-29 | Netpco Incorporated | Cover tape for formed tape packing system and process for making same |
| US6027802A (en) * | 1997-10-23 | 2000-02-22 | Four Piliars Enterprise Co., Ltd. | Cover tape for packaging |
| JP3795750B2 (ja) * | 1997-11-14 | 2006-07-12 | スリーエム カンパニー | マスキング用ウェブロールおよび物体マスキング方法 |
| JPH11222581A (ja) | 1998-02-06 | 1999-08-17 | Nitto Denko Corp | 粘着テープ |
| SE518968C2 (sv) | 2001-04-24 | 2002-12-10 | Panorama Press Ab | Tillverkning av avrivbara ark och av block innefattande de avrivna arken |
| US20030049437A1 (en) * | 2001-08-03 | 2003-03-13 | Devaney Laura C. | Flexible carrier tape having high clarity and conductivity |
| JP3626742B2 (ja) * | 2002-05-13 | 2005-03-09 | 旗勝科技股▲分▼有限公司 | テープ型フレクシブルプリント回路の量産方法 |
| US7219708B2 (en) * | 2003-02-21 | 2007-05-22 | Mitsui Mining & Smelting Co., Ltd. | Apparatus and method for inspecting film carrier tape for mounting electronic component |
| US8247057B2 (en) * | 2005-09-16 | 2012-08-21 | 3M Innovative Properties Company | Cover tape and method for manufacture |
-
2007
- 2007-08-07 CN CN200780029690.1A patent/CN101501155B/zh not_active Expired - Fee Related
- 2007-08-07 KR KR1020097002447A patent/KR101464780B1/ko not_active Expired - Fee Related
- 2007-08-07 MY MYPI20090484A patent/MY155905A/en unknown
- 2007-08-07 EP EP07813858.3A patent/EP2049609A4/en not_active Withdrawn
- 2007-08-07 WO PCT/US2007/075382 patent/WO2008021833A1/en not_active Ceased
- 2007-08-07 JP JP2009523962A patent/JP5238699B2/ja not_active Expired - Fee Related
- 2007-08-07 US US11/835,211 patent/US20080038501A1/en not_active Abandoned
- 2007-08-07 MX MX2009001430A patent/MX2009001430A/es active IP Right Grant
- 2007-08-08 TW TW096129248A patent/TWI422660B/zh not_active IP Right Cessation
-
2009
- 2009-02-05 IL IL196932A patent/IL196932A0/en unknown
- 2009-02-10 US US12/368,457 patent/US8323442B2/en not_active Expired - Fee Related
-
2012
- 2012-10-29 US US13/662,800 patent/US20130048220A1/en not_active Abandoned
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5390472A (en) * | 1992-06-19 | 1995-02-21 | Minnesota Mining And Manufacturing Company | Carrier tape with cover strip |
| US20070062844A1 (en) * | 2005-09-16 | 2007-03-22 | Velasquez Urey Ruben E | Cover tape and method for manufacture |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2016150784A (ja) * | 2015-02-19 | 2016-08-22 | エスアイアイ・セミコンダクタ株式会社 | 搬送包装テープ |
| JP2019210301A (ja) * | 2018-05-31 | 2019-12-12 | 古河電気工業株式会社 | 電子デバイス加工用テープおよび電子デバイス加工用テープの製造方法 |
| CN111977174A (zh) * | 2020-09-16 | 2020-11-24 | 江西若邦科技股份有限公司 | 一种易撕的盖带及制备方法 |
| CN111977174B (zh) * | 2020-09-16 | 2021-12-21 | 江西若邦科技股份有限公司 | 一种易撕的盖带及制备方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| MY155905A (en) | 2015-12-15 |
| US8323442B2 (en) | 2012-12-04 |
| CN101501155A (zh) | 2009-08-05 |
| KR20090037453A (ko) | 2009-04-15 |
| TWI422660B (zh) | 2014-01-11 |
| KR101464780B1 (ko) | 2014-11-24 |
| EP2049609A1 (en) | 2009-04-22 |
| US20080038501A1 (en) | 2008-02-14 |
| JP5238699B2 (ja) | 2013-07-17 |
| EP2049609A4 (en) | 2014-07-09 |
| US20130048220A1 (en) | 2013-02-28 |
| IL196932A0 (en) | 2009-11-18 |
| TW200829672A (en) | 2008-07-16 |
| WO2008021833A1 (en) | 2008-02-21 |
| US20090145543A1 (en) | 2009-06-11 |
| MX2009001430A (es) | 2009-02-17 |
| CN101501155B (zh) | 2014-06-25 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP5238699B2 (ja) | 引裂開始型カバーテープを有するキャリアテープ、及びその製造方法 | |
| JP2888845B2 (ja) | 剥離補助構造及びその使用法 | |
| US20120273461A1 (en) | Cover tape and method for manufacture | |
| JP2014015263A (ja) | カバーテープおよび製造方法 | |
| JP4401439B2 (ja) | 平らな粘着性の薬効成分貼付剤 | |
| CN114822254A (zh) | 模组及模组的制作方法 | |
| US20070062166A1 (en) | Apparatus for manufacture of cover tape | |
| JP3134213U (ja) | 表面保護フィルム積層体 | |
| JP2023104087A (ja) | 積層体および積層体作製方法 | |
| TW522130B (en) | Blade for removing adhesive tape | |
| JP4780934B2 (ja) | 感圧性接着テープ | |
| KR20250006775A (ko) | 표면실장용 캐리어 테이프 및 그에 적용된 이형부재 | |
| JP2006088480A (ja) | フィルム貼着装置 | |
| JP2005288583A (ja) | ふっ素樹脂被覆刃物 | |
| JPH0716683Y2 (ja) | 横裂式粘着テープ |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20100713 |
|
| A621 | Written request for application examination |
Free format text: JAPANESE INTERMEDIATE CODE: A621 Effective date: 20100713 |
|
| A131 | Notification of reasons for refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A131 Effective date: 20120117 |
|
| A601 | Written request for extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A601 Effective date: 20120416 |
|
| A602 | Written permission of extension of time |
Free format text: JAPANESE INTERMEDIATE CODE: A602 Effective date: 20120423 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20120509 |
|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 20120918 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20130118 |
|
| A911 | Transfer to examiner for re-examination before appeal (zenchi) |
Free format text: JAPANESE INTERMEDIATE CODE: A911 Effective date: 20130129 |
|
| TRDD | Decision of grant or rejection written | ||
| A01 | Written decision to grant a patent or to grant a registration (utility model) |
Free format text: JAPANESE INTERMEDIATE CODE: A01 Effective date: 20130305 |
|
| A61 | First payment of annual fees (during grant procedure) |
Free format text: JAPANESE INTERMEDIATE CODE: A61 Effective date: 20130401 |
|
| R150 | Certificate of patent or registration of utility model |
Free format text: JAPANESE INTERMEDIATE CODE: R150 |
|
| FPAY | Renewal fee payment (event date is renewal date of database) |
Free format text: PAYMENT UNTIL: 20160405 Year of fee payment: 3 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| R250 | Receipt of annual fees |
Free format text: JAPANESE INTERMEDIATE CODE: R250 |
|
| LAPS | Cancellation because of no payment of annual fees |