JP2010278421A - Manufacturing method of electronic parts - Google Patents

Abstract

An object of the present invention is to provide an electronic component manufacturing method capable of effectively suppressing residual voids in a shield layer while forming a shield layer using a resin paste.
The manufacturing method includes a laminated body forming step (A1 to A4), an applied body forming step (A5), a B-stage forming step (A6), an attaching step (A7), and a shield layer forming step (A8). ). A laminated body formation process (A1-A4) forms a laminated body. The laminate has a configuration in which the element mounting surface of the substrate 1 is sealed with the sealing layer 4. In the applied body forming step (A5), the applied body 10 is formed. The application body 10 has a configuration in which a resin paste 12 is applied to a film sheet 11, and the resin paste has conductivity. In the B-stage forming step (A6), the coated body is heated to form a B-stage. A sticking process (A7) makes the application body 10 stick with the resin paste 12 with respect to the sealing layer 4 of a laminated body. In the shield layer forming step (A8), the resin paste 12 is fully cured.
[Selection] Figure 1

Description

  The present invention relates to a method for manufacturing an electronic component in which an insulating sealing layer is provided on an element mounting substrate.

  As a package structure of an electronic component, a configuration in which an element such as a semiconductor bare chip mounted on an element mounting substrate is sealed with an insulating sealing layer (see, for example, Patent Documents 1 to 4).

  The package structure disclosed in Patent Document 1 is provided with a conductive deformation film that covers a circuit element, and the deformation film is electrically connected to a ground electrode of the substrate by suction from a hole provided in the substrate. In that state, the sealing layer is laminated on the deformable film.

  In the above configuration, the electromagnetic wave shielding function can be exhibited by providing the deformable film, but the bonding strength between the element mounting substrate and the deformable film is insufficient, and sufficient package strength may not be ensured. In addition, there is a problem that the substrate size increases by the amount of holes.

Therefore, the package structures disclosed in Patent Documents 2 to 4 employ a configuration in which a sealing layer is directly laminated on the element mounting substrate in order to ensure sufficient package strength.
The package structure disclosed in Patent Document 2 is formed by laminating a laminated sheet including a resin film and a conductive film on an element mounting substrate. In the package structure disclosed in Patent Document 3, a shield layer is formed using a metal case on an element mounting substrate on which a sealing layer is laminated. The package structure disclosed in Patent Document 4 is manufactured by vacuum-packing an element mounting substrate on which a sealing layer is laminated and applying hydrostatic pressure.

Japanese Patent Laid-Open No. 2001-176955 JP 2000-223647 A JP 2004-172176 A Republished patent WO2005 / 071731

  When a composite sheet or a metal case is used to form the shield layer, the manufacturing cost tends to remain high. Therefore, after providing the sealing layer on the element mounting substrate, it is conceivable that the shield layer is laminated by applying a conductive resin paste on the surface of the sealing layer, thereby reducing the manufacturing cost compared to the conventional method. .

  However, when the shield layer is formed by applying a resin paste, if the surface shape of the sealing layer is complicated, it is difficult to apply the resin paste itself. Further, when the resin paste is cured, if the solvent component contained in the resin paste is volatilized and voids are formed, the quality of the shield layer is lowered and the electromagnetic wave shielding function is lowered, resulting in a problem.

  Therefore, the object of the present invention is to form a shield layer using a resin paste, while suppressing the remaining of voids in the shield layer, and to make the resin paste into a sheet in-house without outsourcing, An object of the present invention is to provide an electronic component manufacturing method capable of suppressing the manufacturing cost.

  The method of manufacturing the electronic component of the present invention includes a laminated body forming process, an applied body forming process, a B-stage forming process, an attaching process, and a shield layer forming process. A laminated body formation process forms a laminated body. The laminate has a configuration in which the element mounting surface of the element mounting substrate is sealed with a sealing layer. In the applied body forming step, a resin paste is applied to the sheet to form an applied body. At least one of the sheet and the resin paste has conductivity. In the B-stage forming process, the resin paste of the coated body is converted into a B-stage. A sticking process sticks the resin paste which made B stage with respect to the sealing layer of a laminated body. In the shield layer forming step, the shield paste is formed by subjecting the resin paste adhered to the laminate to pressure flow and main curing.

  In the above-described configuration, since the resin paste is applied onto the sheet in the application body forming step, the resin paste film can be made to have a uniform film thickness. Furthermore, since it is attached to the sealing layer after the B stage, even if the surface shape of the sealing layer is complex, the film of the resin paste is sealed in a state where the film thickness is maintained as compared to the liquid state immediately after coating. Can be attached to the layer. Furthermore, by making the resin paste into a B-stage, it is possible to easily handle the applied body in the subsequent steps and to prevent contamination of the surrounding environment due to the adhesion of the resin paste. On the other hand, if the resin paste is B-staged (and main-cured) after the application body is attached to the laminate, the resin paste is covered with the sheet. Volatilization of the solvent component will be hindered. However, as in the present invention, after the B-stage is applied, the applied body is adhered to the laminate, so that the solvent component is volatilized from the exposed resin paste without being inhibited by the sheet in advance. It can be made to progress, and the residual voids in the shield layer can be effectively suppressed.

  In the B-staging process of the present invention, the B-staging of the resin paste is advanced under a reduced pressure environment. Thereby, volatilization of the solvent component from the resin paste can be further effectively advanced.

  In the application body forming step of the present invention, it is preferable to apply a resin paste to a sheet covered with a mask having a predetermined thickness provided with openings. Thereby, the film | membrane of the resin paste can be affixed on the sealing layer with the application amount controlled accurately irrespective of the surface shape of the sealing layer by a simple method.

  In the laminated body forming step of the present invention, it is preferable to provide a half cut groove at a depth from the sealing layer to the element mounting substrate at a position where a plurality of electronic components of the laminated body are partitioned. Thus, even if the laminated body has a surface shape provided with a half-cut groove, the resin paste film on which the applied body is formed can be adhered to the laminated body. Also, a shield layer can be provided on the side surface of the package to provide an electromagnetic wave shielding function on the package side surface.

  In the laminated body forming process of the present invention, it is preferable to stand up from the element mounting substrate or a component mounted on the element mounting substrate, and form a post electrode that is electrically connected to the ground electrode and exposed from the surface of the sealing layer. . Thereby, the shield layer can be grounded via the post electrode. In addition, by providing the post electrode in this manner, the surface shape of the sealing layer may not be flat, but the resin paste film on which the coated body is formed can be attached to the laminate.

  The sheet of this invention may be conductive. Thereby, it becomes possible to manufacture an electronic component without removing the sheet and reduce the number of steps. Further, the amount of the resin paste used can be reduced as compared with the case where the shield layer is formed only by applying an expensive conductive resin paste. Therefore, cost reduction of the manufacturing process can be realized.

  The resin paste of the present invention may be an anisotropic conductive resin paste in which conductive particles that are conducted by pressing in the thickness direction are dispersed. Thereby, even if the shield layer is extremely thin, a sufficient electromagnetic wave shielding function can be obtained.

  In the shield layer forming step of the present invention, it is preferable that the laminate is put in a pack having gas barrier properties and sealed under reduced pressure, and the resin paste is fully cured after applying pressure to the pack. For pressurization of the pack, for example, a pressurizing apparatus that can pressurize a plurality of packs at a time, such as a hydrostatic apparatus, can be used. Thereby, joining to the laminated body of a shield layer can be strengthened, and apparatus cost can be reduced rather than the case where a press etc. are used.

  In the shield layer forming step of the present invention, when the laminate is put in a pack and sealed under reduced pressure, the pressure is preferably reduced while heating. As a result, the solvent component and the like can be volatilized from the shield layer, and the shield layer such as voidless can be improved in quality. Therefore, the shield layer and the post electrode can be more reliably connected.

According to the present invention, since the resin paste is B-staged in a state where the resin paste is applied to the sheet and then adhered to the laminate, the amount of application accurately controlled even if the surface shape of the sealing layer is complicated Thus, the resin paste film can be adhered to the sealing layer. For this reason, the shield layer can be formed by adopting the step of applying the resin paste, and the manufacturing cost can be suppressed as compared with the conventional method.
In addition, it is easy to handle the coated body in the process after the B-stage process, and contamination of the surrounding environment due to adhesion of the resin paste can be prevented.
Furthermore, volatilization of the solvent component from the resin paste that is exposed without being inhibited by the sheet can be promoted, and voids remaining in the shield layer can be effectively suppressed.

It is a state figure in each process of the manufacturing method of the electronic component which concerns on the 1st Embodiment of this invention. It is a state figure in each process of the manufacturing method of the electronic component which concerns on the 2nd Embodiment of this invention. It is a state figure in each process of the manufacturing method of the electronic component which concerns on the 3rd Embodiment of this invention. It is a state figure in each process of the manufacturing method of the electronic component which concerns on the 4th Embodiment of this invention.

<< First Embodiment >>
A method for manufacturing an electronic component according to the first embodiment of the present invention will be described below.
FIG. 1 is a cross-sectional view showing a state in each step of the electronic component manufacturing method according to the present embodiment.

  FIG. 1A1 is a state diagram in an element mounting process. The substrate 1 is a ceramic substrate such as alumina or a resin substrate such as glass epoxy, and includes a ground electrode 1A. The ground electrode 1A is formed of a top electrode, an internal electrode, and a bottom electrode. In this process, first, the substrate 1 is prepared, and the elements 2A and 2B are mounted on the plurality of top surface electrodes of the substrate 1 by a solder paste or a metal nanoparticle paste in a face-down manner. In the present embodiment, a plurality of elements 2A and 2B are mounted on the substrate 1 in order to manufacture a plurality of electronic components at a time. When this step is finished, the process proceeds to the next sealing layer coating step.

  FIG. 1A2 is a state diagram in the sealing layer application step. In this step, the sealing layer 4 is formed by applying a semi-liquid resin paste having thermosetting properties. This resin paste is an insulating material that does not contain a metal filler. The sealing layer 4 is formed with a layer thickness that embeds the entire elements 2A and 2B, and seals the elements 2A and 2B to the substrate 1. When this step is finished, the process proceeds to the next sealing layer forming step.

  FIG. 1 (A3) is a state diagram in the sealing layer forming step. In this step, the sealing layer 4 is heated under a predetermined curing condition, and then the top surface of the sealing layer 4 is ground by a dicer or a grinding roller 4A to flatten the top surface of the sealing layer 4. In this step, by heating the sealing layer 4, the solvent component contained in the sealing layer 4 is volatilized and the crosslinking between the resin particles progresses, and the curing and shape shrinkage of the sealing layer 4 progress. When this process is finished, the process proceeds to the next half-cut process.

  FIG. 1A4 is a state diagram in the half-cut process. In this step, half-cut grooves 5 are formed using a dicer at positions where a plurality of electronic components are partitioned. The half cut groove 5 is formed with a depth from the surface of the sealing layer 4 to the substrate 1. In the present embodiment, the half-cut groove 5 is cut to the extent that the cut surface of the internal electrode that is the ground electrode 1 </ b> A is exposed on the side surface of the half-cut groove 5.

  The “laminated body forming step” of the present invention includes the above-described element mounting step, sealing layer application forming step, sealing layer forming step, and half-cut step. Then, by this “laminated body forming step”, a laminated body including the substrate 1, the elements 2 </ b> A and 2 </ b> B, and the sealing layer 4 and having the half cut groove 5 is formed.

  FIG. 1 (A5) is a state diagram in the applied body forming step. In this step, a mask 13 having a predetermined thickness provided with an opening having a predetermined shape is placed on a PET film sheet 11, and a semi-liquid resin paste 12 having thermosetting properties is placed on the film sheet 11 through the mask 13. Apply on top with squeegee 14. Here, the resin paste 12 is a conductive resin paste in which a metal filler having a spherical shape, a scale shape, a needle shape, or the like is dispersed in a resin at a predetermined ratio. By setting the mask thickness and the squeegee pressure, the coating amount of the resin paste 12 can be accurately controlled, so that the film of the resin paste 12 can be formed on the film sheet 11 with a uniform film thickness. An application body 10 composed of the paste 12 can be formed. When this process is finished, the process proceeds to the next B-stage process. In addition, as a method for applying the resin paste 12 having a predetermined thickness on the film sheet 11, methods such as spin coating, lip coating, and ink jet can be used in addition to the method using the mask 13 shown in the above embodiment.

  FIG. 1 (A6) is a state diagram in the B-stage process. In this step, the application body 10 excluding the mask is placed on a plate 15 in a vacuum oven (not shown), and the application body 10 is heated in a reduced pressure environment. By this heating, the solvent component of the resin paste 12 is volatilized and the crosslinking between the resin particles progresses, so that the resin paste 12 becomes a semi-cured B stage. The heating conditions at this time are lower heating temperature and shorter heating time than the conditions under which the resin paste is completely cured. As described above, the resin paste 12 in the application body 10 is B-staged, so that the application body can be easily handled in a later process and contamination of the surrounding environment due to the adhesion of the resin paste 12 can be prevented. When this step is finished, the process proceeds to the next sticking step.

  FIG. 1 (A7) is a state diagram in the sticking step. In this step, the laminate is placed with the sealing layer 4 facing the resin paste 12 of the application body 10. Therefore, the film of the resin paste 12 can be adhered to the sealing layer 4 in a state where the application amount of the resin paste is accurately controlled regardless of the surface shape of the sealing layer 4. In addition, in this embodiment, although the laminated body was mounted on the application body 10, you may make it mount the application body 10 on a laminated body. When this step is finished, the process proceeds to the next shield layer forming step.

  FIG. 1 (A8) is a state diagram in the shield layer forming step. In this step, the application body 10 on which the laminated body is mounted is mounted on the press device 21, and the laminated body and the application body are heated and pressurized in a vacuum in some cases. Thereby, the resin paste 12 of the application body 10 is pressed against the sealing layer 4 and the film sheet 11 and flows, and flows into the half-cut groove 5. In this state, the heat curing of the resin paste 12 proceeds and the shield layer 6 is formed. At this time, the shield layer 6 covers the position where the cut surface of the internal electrode which is the ground electrode 1A is exposed, and the shield layer 6 is electrically connected to the ground electrode 1A. When this process is completed, the process proceeds to the next individualization process.

  FIG. 1 (A9) is a state diagram in the individualization process. In this step, after peeling off the film sheet 11, a plurality of electronic components are divided using a dicer or breaker along the center line of the position where the half-cut groove 5 was formed.

  The manufacturing method of the electronic component of this embodiment has the above series of steps. Accordingly, the shield layer 6 can be formed by applying the resin paste 12 to the film sheet 11 and sticking it to the laminate, thereby reducing the manufacturing cost. In addition, since the resin paste 12 is B-staged before the application body is adhered to the laminate 10, the remaining of the voids in the shield layer 6 can be effectively suppressed by volatilization of the solvent component at that time.

  Note that the B-stage process may be performed using a simpler and less expensive apparatus (simple hot plate or oven) without using a vacuum oven.

<< Second Embodiment >>
Next explained is a method for manufacturing an electronic component according to the second embodiment of the invention.
FIG. 2 is a cross-sectional view showing a state in each step of the electronic component manufacturing method according to the present embodiment.

  FIG. 2 (B1-1) is a state diagram in the primary process of the element mounting process. In this primary process, first, a substrate 1 is prepared, and elements 2A and 2B are mounted on a plurality of top surface electrodes of the substrate 1 using a solder paste or a metal nanoparticle paste.

  FIG. 2 (B1-2) is a state diagram in the secondary process of the element mounting process. In this secondary process, the post electrode 3 is formed on the terminal electrode of the element 2B conducted to the ground electrode 1A by an ink jet method in which a liquid conductive paste is discharged from the head 3A. The post electrode 3 is electrically connected to the ground electrode 1A, and the tip is located on the top surface side of the elements 2A and 2B. In addition to the terminal electrode of the element 2B shown in the above embodiment, the position where the post electrode 3 is formed can be selected on the substrate electrode provided on the substrate 1 and conducting to the ground electrode 1A. When this step is finished, the process proceeds to the next sealing layer forming step.

  FIG. 2 (B2) is a state diagram in the sealing layer coating step. In this step, the sealing layer 4 is formed by applying a semi-liquid resin paste having thermosetting and insulating properties. The sealing layer 4 is formed with a layer thickness that embeds the entire elements 2 A and 2 B and the post electrode 3, and seals the elements 2 A and 2 B and the post electrode 3 to the substrate 1. When this step is finished, the process proceeds to the next sealing layer forming step.

  FIG. 2 (B3) is a state diagram in the sealing layer forming step. In this step, after heating the sealing layer 4 under predetermined curing conditions, the top surface of the sealing layer 4 is ground with a dicer or a grinding roller 4A, and the post electrode 3 is formed from the flattened surface of the sealing layer 4. To expose. In this step, by heating the sealing layer 4, the solvent component contained in the sealing layer 4 is volatilized and the crosslinking between the resin particles progresses, and the curing and shape shrinkage of the sealing layer 4 progress. In addition, when the heating is performed again after grinding so that the shape shrinkage of the sealing layer 4 progresses again, the post electrode 3 protrudes from the surface of the sealing layer 4. Can be ensured. When this process is finished, the process proceeds to the next half-cut process.

  FIG. 2 (B4) is a state diagram in the half-cut process. In this step, half-cut grooves 5 are formed using a dicer at positions where a plurality of electronic components are partitioned. The half cut groove 5 is formed with a depth from the surface of the sealing layer 4 to the substrate 1. As shown in FIG. 1A4, the half-cut groove 5 may be cut to such an extent that the cut surface of the internal electrode that is the ground electrode 1A is exposed.

  The “laminate forming step” of the present invention includes the above-described element mounting step, post electrode forming step, sealing layer application forming step, sealing layer forming step, and half-cut step. Then, by this “laminated body forming step”, a laminated body including the substrate 1, the elements 2 </ b> A and 2 </ b> B, the post electrode 3, and the sealing layer 4 and provided with the half cut groove 5 is formed.

  After that, the manufacturing method of the electronic component of the present embodiment includes a series of steps for performing the same applied body forming step, B-stage forming step, sticking step, shield layer forming step, and individualizing step as in the first embodiment. Have. In the present embodiment, since the post electrode 3 is provided exposed from the surface of the sealing layer 4, the shield layer 6 can be grounded by the post electrode 3, so that it is difficult to reliably expose the ground electrode 1A because the substrate is thin. Even in this case, the product can be reduced in height without any problem. Even if the post electrode 3 is protruded from the surface of the sealing layer 4, the resin paste 12 is applied to the film sheet 11 and adhered to the laminate, so that the post electrode 3 does not depend on the surface shape of the sealing layer 4. A film of the resin paste 12 formed with a precisely controlled coating amount can be attached to the laminate.

<< Third Embodiment >>
Next explained is a method for manufacturing an electronic component according to the third embodiment of the invention.

FIG. 3 is a cross-sectional view showing a state in each step of the electronic component manufacturing method according to the present embodiment.
This embodiment has the same “laminated body forming step” as that of the second embodiment. When the “laminated body forming process” is completed, the process proceeds to the applied body forming process.

  FIG. 3 (C5) is a state diagram in the applied body forming step. In this step, a mask 13 having a predetermined thickness provided with an opening of a predetermined shape is placed on the metal foil 11A, and a semi-liquid resin paste 12 having thermosetting property and conductivity is passed through the mask 13 through the metal foil. Apply the squeegee 14 on 11A. Thereby, the coating film of the resin paste 12 can be formed on the metal foil 11A with a uniform film thickness, and the applied body 10A composed of the metal foil 11A and the resin paste 12 can be formed by accurately controlling the coating amount. When this process is finished, the process proceeds to the next B-stage process.

  FIG. 3 (C6) is a state diagram in the B-stage process. In this step, the coated body 10A excluding the mask is placed on a plate 15 in a vacuum oven (not shown), and the coated body 10A is heated. By this heating, the solvent component of the resin paste 12 is volatilized and the crosslinking between the resin particles progresses, so that the resin paste 12 becomes a semi-cured B stage. This heating condition is a lower heating temperature or shorter heating time than a condition in which the resin paste is completely cured. As described above, the resin paste 12 in the application body 10A is B-staged, so that the application body can be easily handled in a later process and contamination of the surrounding environment due to the adhesion of the resin paste 12 can be prevented. When this step is finished, the process proceeds to the next sticking step.

  FIG. 3 (C7) is a state diagram in the sticking step. In this step, the laminated body is placed with the sealing layer 4 facing the resin paste 12 of the coated body. Therefore, the film of the resin paste 12 can be adhered to the sealing layer 4 in a state where the application amount of the resin paste 12 is accurately controlled regardless of the surface shape of the sealing layer 4. As in the case of the first embodiment, the application body 10A may be placed on the stacked body. When this step is finished, the process proceeds to the next shield layer forming step.

  FIG. 3 (C8) is a state diagram in the shield layer forming step. In this step, the application body 10A on which the laminated body is placed is mounted on the press device 21, and the laminated body and the application body 10A are heated and pressurized in a vacuum in some cases. Thereby, the resin paste 12 of the application body 10 </ b> A is pressed against the sealing layer 4 and the metal foil 11 </ b> A to flow and flows into the half cut groove 5. In this state, the heat curing of the resin paste 12 proceeds and the shield layer 6 is formed. At this time, the metal foil 11A is brought into contact with the post electrode 3 and the shield layer 6 is grounded. When this process is completed, the process proceeds to the next individualization process.

  FIG. 3 (C9) is a state diagram in the individualization process. In this step, a plurality of electronic components are formed using a dicer or breaker along the center line of the position where the half-cut groove 5 was formed.

  The manufacturing method of the electronic component of this embodiment has the above series of steps. In this embodiment, since the resin paste is applied to the metal foil, the step of peeling off the sheet can be omitted, and the manufacturing process can be simplified. Moreover, an expensive resin paste can be reduced by the amount of the metal foil, and the manufacturing cost can be suppressed.

  In the present embodiment, a conductive material is used as the resin paste 12, but an insulating material can be used as the resin paste 12 as long as the metal foil 11 </ b> A reliably contacts the post electrode 3. In any case, after the resin paste 12 is applied to the metal foil 11A, the remaining Boid in the shield layer 6 can be effectively suppressed by applying the resin paste 12 to the laminated body and then attaching it to the laminate. It becomes possible.

  Moreover, you may use the anisotropic conductive resin paste which metal fillers contact in the thickness direction by pressurization in the thickness direction, and expresses electroconductivity as the resin paste 12. In that case, a sufficient electromagnetic wave shielding function can be obtained while reducing the amount of metal used for the shield layer 6, and the post electrode 3 and the metal foil 11A can be reliably connected.

<< Fourth Embodiment >>
Next explained is a method for manufacturing an electronic component according to the fourth embodiment of the invention.
FIG. 4 is a cross-sectional view showing a state in each step of the electronic component manufacturing method according to the present embodiment.
This embodiment has the same “laminated body forming process”, applied body forming process, B-stage forming process, sticking process, and individualizing process as in the second embodiment.

  FIG. 4 (D8-1) is a state diagram in the primary process of the shield layer forming process. In this primary process, the laminated body to which the application body is adhered is put in the pack 30. As the pack 30, a laminate pack having flexibility and gas barrier properties and having a sealant layer as an inner layer is used. When this first process is completed, the process proceeds to the second process of this process.

  FIG. 4 (D8-2) is a state diagram in the second process of the shield layer forming process. In this second process, the pack 30 containing the substrate is set on a heating stage 51 in a vacuum chamber (not shown), the inside of the pack is depressurized to a predetermined degree of vacuum (about 50 to 150 Pa), and the curing temperature of the resin paste is set. Heating under a predetermined heating condition of less than As a result, the solvent component in the resin paste is easily volatilized, and voids remaining in the shield layer can be effectively suppressed. When this second process is finished, the process proceeds to the third process.

  FIG. 4 (D8-3) is a state diagram in the third step of the shield layer forming step. In this third process, the pack 30 is sealed and sealed using the seal heater 52 and the sealing plate 53, and then the vacuum chamber is opened and returned to atmospheric pressure. When this third process is finished, the process proceeds to the fourth process of this process.

  FIG. 4 (D8-4) is a state diagram in the fourth step of the shield layer forming step. Since the inside of the pack 30 is depressurized, pressure is applied to the pack 30 due to the difference from the atmospheric pressure of the outside air, the resin paste flows in the pack 30 and the resin paste flows into the half cut grooves. In addition, when a pressurizing device such as a hydrostatic pressure device is used, the flow of the resin paste to the half cut groove becomes easier.

  According to this embodiment, the remaining of voids due to the solvent component or the like in the shield layer can be more efficiently suppressed. Moreover, a shield layer can be formed without using a press, and the shield layer forming step can be performed at low cost.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 1A ... Ground electrode 2A, 2B ... Element 3 ... Post electrode 4 ... Sealing layer 5 ... Half cut groove 6 ... Shield layer 10, 10A ... Application body 11 ... Film sheet 11A ... Metal foil 12 ... Resin paste 13 ... mask

Claims (9)

A laminated body forming step of forming a laminated body in which the element mounting surface of the element mounting substrate is sealed with a sealing layer;
An application body forming step of applying an application body by applying the resin paste to the sheet using a sheet having at least one conductivity and a resin paste,
A B-stage process for converting the resin paste of the coated body into a B-stage;
An adhering step of adhering the application body with the resin paste B-staged facing the sealing layer of the laminate; and
A method of manufacturing an electronic component, comprising: a shield layer forming step of pressurizing and main-curing the resin paste of the application body adhered to the laminate.   2. The method of manufacturing an electronic component according to claim 1, wherein in the B-staging step, B-staging of the resin paste is advanced under a reduced pressure environment.   3. The method of manufacturing an electronic component according to claim 1, wherein, in the applying body forming step, the resin paste is applied to the sheet covered with a mask having a predetermined thickness provided with an opening.   The said laminated body formation process provides a half cut groove | channel by the depth from the said sealing layer to the said element mounting substrate in the position which divides the some electronic component of the said laminated body. The manufacturing method of the electronic component of description.   The laminated body forming step includes standing up from the element mounting substrate or a component mounted on the element mounting substrate, and forming a post electrode that is electrically connected to a ground electrode and exposed from a surface of the sealing layer. Item 5. A method for producing an electronic component according to any one of Items 1 to 4.   The method for manufacturing an electronic component according to claim 1, wherein the sheet is conductive.   The method of manufacturing an electronic component according to claim 6, wherein the resin paste is an anisotropic conductive resin paste in which conductive particles that are conductive when pressed in a thickness direction are dispersed in a resin.   In the shield layer forming step, the laminated body obtained by attaching the application body to a pack having gas barrier properties is sealed under reduced pressure, pressure is applied to the pack, and then the resin paste is added to the main body. The manufacturing method of the electronic component in any one of Claims 1-7 made to harden | cure.   The said shield layer formation process is a manufacturing method of the electronic component in any one of Claims 1-8 which heats the said laminated body and the said application body enclosed with the said pack.

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