JP2010271658A

JP2010271658A - Liquid crystal module

Info

Publication number: JP2010271658A
Application number: JP2009125683A
Authority: JP
Inventors: Masashi Uchida; 雅司内田
Original assignee: Funai Electric Co Ltd
Current assignee: Funai Electric Co Ltd
Priority date: 2009-05-25
Filing date: 2009-05-25
Publication date: 2010-12-02

Abstract

<P>PROBLEM TO BE SOLVED: To provide a liquid crystal module which dispenses with a connector thereby achieving reduction in the number of components, saving of cost of components and enhancement of assembling efficiency and which solves a problem of implement deterioration of an inspection device. <P>SOLUTION: A crimping land for a power line and a crimping land for a signal line are formed in an X-PCB 10 connected to a liquid crystal panel 8 via a COF 11, a terminal 18a of an FPC 18 for power input is thermo-compression bonded to the crimping land for the power line, a terminal 19a of an FPC 19 for signal input is thermo-compression bonded to the crimping land for the signal line to form the liquid crystal module. Thereby, a connector connecting the FPCs 18 and 19 to each other is omitted. crimping lands for the COF, the power line and the signal line are arranged in a horizontal one line, so that thermo-compression bonding of the COF and the FPCs 18 and 19 can be simultaneously performed in one step and thus, assembling efficiency is enhanced. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

本発明は、テレビ、パソコンその他の電子機器に組み込まれる液晶モジュールに関し、特に、液晶パネルのＸ−配線基板に圧着ランド部を形成して電源入力用フレキシブル配線板や信号入力用フレキシブル配線板などの端子部を熱圧着することにより、コネクタなどの部品点数の削減及び組立作業効率の向上を図った液晶モジュールに関する。 The present invention relates to a liquid crystal module incorporated in a TV, personal computer or other electronic device, and in particular, a crimp land portion is formed on an X-wiring board of a liquid crystal panel, and a flexible wiring board for power input, a flexible wiring board for signal input, etc. The present invention relates to a liquid crystal module in which the number of parts such as connectors is reduced and assembly work efficiency is improved by thermocompression bonding of terminal portions.

従来の液晶モジュールの一つとして、液晶パネルにチップオンフィルムを介して接続されるＸ−配線基板に、電源ライン用コネクタと信号ライン用コネクタを設け、電源ライン用コネクタに電源入力用フレキシブル配線板の端子部を挿入して接続すると共に、信号ライン用コネクタに信号入力用フレキシブル配線板の端子部を挿入して接続したものが知られている。 As one of the conventional liquid crystal modules, a power line connector and a signal line connector are provided on an X-wiring board connected to a liquid crystal panel via a chip-on film, and a power input flexible wiring board is provided on the power line connector. The terminal portion of the signal input flexible wiring board is inserted and connected to the signal line connector.

そして、大型液晶テレビの液晶モジュールのように、Ｘ−配線基板が左側Ｘ−配線基板と右側Ｘ−配線基板に二分割されている場合は、左側と右側のＸ−配線基板に更に基板連結用コネクタを設け、双方のコネクタに基板連結用フレキシブル配線板の両端の端子部を挿入、接続することにより、左側と右側のＸ−配線基板間の電源ライン及び信号ラインの接続を行うようにしている。 If the X-wiring board is divided into a left-side X-wiring board and a right-side X-wiring board as in a liquid crystal module of a large liquid crystal television, the board is further connected to the left-side and right-side X-wiring boards. A connector is provided, and terminal portions at both ends of the flexible wiring board for board connection are inserted and connected to both connectors, thereby connecting the power line and the signal line between the left and right X-wiring boards. .

一方、ソース駆動回路部が、一枚の液晶パネルに対して、同一構成のソース駆動回路要素を複数有し、各ソース駆動回路要素が、一つのＸ−ＰＣＢと、これに接続されたソース用ＣＯＦとからなり、Ｘ−ＰＣＢがソース用伝送ＦＰＣを接続する入力コネクタを一つのみ有し、ソース用ＣＯＦが液晶パネルのソース端子部に接続される出力端子部を更に備えている液晶表示装置が提案されている（特許文献１）。 On the other hand, the source driving circuit unit has a plurality of source driving circuit elements having the same configuration for one liquid crystal panel, and each source driving circuit element is for one X-PCB and a source connected thereto. A liquid crystal display device comprising a COF, the X-PCB having only one input connector for connecting the source transmission FPC, and further comprising an output terminal portion for connecting the source COF to the source terminal portion of the liquid crystal panel Has been proposed (Patent Document 1).

また、液晶駆動回路が実装されたプリント基板に設けられた端子と、液晶表示素子に設けられた端子に、フレキシブルプリント基板の端子部を熱圧着して接続した液晶表示装置であって、フレキシブルプリント基板の端子部中央に位置合わせ用の検知手段を設けたものも提案されている（特許文献２）。 A liquid crystal display device comprising: a terminal provided on a printed circuit board on which a liquid crystal driving circuit is mounted; and a terminal provided on a liquid crystal display element, wherein a terminal portion of the flexible printed circuit board is connected by thermocompression bonding. A device in which a detection means for alignment is provided at the center of the terminal portion of the substrate has also been proposed (Patent Document 2).

特開２００９−２０２２８号公報JP 2009-20228 A 実開平５−７１８２５号公報Japanese Utility Model Publication No. 5-71825

しかしながら、上述した従来の液晶モジュールでは、Ｘ−配線基板に電源ライン用と信号ライン用の二つのコネクタを設けるため、コネクタ部品代が高くつくという問題があり、特に、大型液晶モジュールのようにＸ−配線基板が左側と右側のＸ−配線基板に二分割されている場合は、基板連結用の二つのコネクタを追加して設ける必要があるため、コネクタ部品代が更に増加するという問題があった。 However, the conventional liquid crystal module described above has a problem that the cost of connector parts is high because two connectors for the power supply line and the signal line are provided on the X-wiring board. -When the wiring board is divided into the left and right X-wiring boards, it is necessary to provide two additional connectors for connecting the boards. .

しかも、Ｘ−配線基板へのコネクタの実装は、Ｘ−配線基板へのチップオンフィルムの熱圧着とは別工程で行わねばならず、また、電源入力用フレキシブル配線板や信号入力用フレキシブル配線板や基板連結用フレキシブル配線板の各コネクタへの接続も別工程で行わねばならないため、組立作業効率が良くないという問題があった。 In addition, the mounting of the connector to the X-wiring board must be performed in a separate process from the thermocompression bonding of the chip-on film to the X-wiring board. Also, the flexible wiring board for power input and the flexible wiring board for signal input In addition, since the connection of the flexible wiring board for connecting the boards to each connector must be performed in a separate process, there is a problem that the assembly work efficiency is not good.

更に、液晶モジュールの動作検査時には、検査装置の治具（フレキシブル配線板）をＸ−配線基板の電源ライン用コネクタと信号ライン用コネクタに挿入、接続する操作を液晶モジュールごとに繰り返さなければならないため、検査装置の治具が早期に劣化したり損傷したりするという問題もあった。 Furthermore, when the operation of the liquid crystal module is inspected, the operation of inserting and connecting a jig (flexible wiring board) of the inspection apparatus into the power line connector and the signal line connector of the X-wiring board must be repeated for each liquid crystal module. Also, there is a problem that the jig of the inspection apparatus is deteriorated or damaged at an early stage.

一方、前記特許文献１の液晶表示装置は、Ｘ−ＰＣＢがソース用伝送ＦＰＣを接続する入力コネクタを一つだけ有するものであるが、入力コネクタを有するものである以上、上記と同様の問題があることは言うまでもない。
また、前記特許文献２の液晶表示装置は、プリント基板と液晶表示素子にフレキシブルプリント基板の端子部を熱圧着する周知技術そのものであり、上記問題を何ら解決する手段とはなり得ない。 On the other hand, the liquid crystal display device of Patent Document 1 has only one input connector for connecting the source transmission FPC to the X-PCB. However, since the X-PCB has the input connector, the same problem as described above is caused. Needless to say.
Further, the liquid crystal display device of Patent Document 2 is a well-known technique itself for thermocompression bonding of a terminal portion of a flexible printed circuit board to a printed circuit board and a liquid crystal display element, and cannot be a means for solving the above problems.

本発明の上記事情の下になされたもので、その解決しようとする課題は、コネクタを不要として部品点数の削減、部品代の節約、組立作業効率の向上を図ると共に、検査装置の治具劣化の問題も解決できるようにした液晶モジュールを提供することにある。 The present invention has been made under the above circumstances, and the problem to be solved is that it eliminates the need for a connector, reduces the number of parts, saves part costs, improves assembly work efficiency, and degrades the jig of the inspection apparatus. It is an object of the present invention to provide a liquid crystal module that can solve the above problem.

上記課題を解決するため、本発明に係る液晶モジュールは、液晶パネルにチップオンフィルムを介して接続されるＸ−配線基板に、電源ライン用圧着ランド部と信号ライン用圧着ランド部が形成され、電源ライン用圧着ランド部に電源入力用フレキシブル配線板の一端の端子部が熱圧着されると共に、信号ライン用圧着ランド部に信号入力用フレキシブル配線板の一端の端子部が熱圧着されていることを特徴とするものである。 In order to solve the above-described problems, the liquid crystal module according to the present invention has a power line crimp land portion and a signal line crimp land portion formed on an X-wiring board connected to a liquid crystal panel via a chip-on film, The terminal part at one end of the flexible wiring board for power input is thermocompression bonded to the crimping land part for power supply line, and the terminal part at one end of the flexible wiring board for signal input is thermocompression bonded to the crimping land part for signal line. It is characterized by.

本発明の液晶モジュールにおいては、上記Ｘ−配線基板に複数形成されたチップオンフィルム用圧着ランド部の間に、上記電源ライン用圧着ランド部と上記信号ライン用圧着ランド部が形成され、これらの圧着ランド部が横一列に並ぶ位置関係になっていることが望ましい。 In the liquid crystal module of the present invention, the power line crimp land and the signal line crimp land are formed between a plurality of chip-on-film crimp lands formed on the X-wiring board. It is desirable that the crimping land portions be in a positional relationship in a horizontal row.

また、上記Ｘ−配線基板が左側Ｘ−配線基板と右側Ｘ−配線基板に二分割されている場合は、左右いずれか片側のＸ−配線基板に上記電源ライン用圧着ランド部と基板連結用圧着ランド部が形成され、反対側のＸ−配線基板に上記信号ライン用圧着ランド部と基板連結用圧着ランド部が形成され、左側Ｘ−配線基板と右側Ｘ−配線基板の基板連結用圧着ランド部に基板連結用フレキシブル配線板の両端の端子部が熱圧着されていることが必要である。 When the X-wiring board is divided into a left-side X-wiring board and a right-side X-wiring board, the power line crimping land and the board connecting crimp are applied to either the left or right X-wiring board. A land portion is formed, the signal line crimp land portion and the substrate connection crimp land portion are formed on the opposite X-wiring board, and the left X-wiring substrate and the right X-wiring substrate bond land portion. It is necessary that the terminal portions at both ends of the board connecting flexible wiring board are thermocompression bonded.

そして、上記の場合は、上記左側Ｘ−配線基板と上記右側Ｘ−配線基板に複数ずつ形成されたチップオンフィルム用圧着ランド部の間に、上記電源ライン用圧着ランド部と上記信号ライン用圧着ランド部と上記基板連結用圧着ランド部が形成され、これらの圧着ランド部が横一列に並ぶ位置関係になっていることが望ましい。 In the above case, the power line crimp land and the signal line crimp between the plurality of chip-on-film crimp lands formed on the left X-wiring board and the right X-wiring board. It is desirable that the land portion and the above-described pressure-bonding land portion for connecting the substrate are formed, and these pressure-bonding land portions are in a positional relationship in a horizontal row.

本発明の液晶モジュールのように、Ｘ−配線基板に電源ライン用圧着ランド部と信号ライン用圧着ランド部を形成し、それぞれの圧着ランド部に電源入力用フレキシブル配線板の一端の端子部と信号入力用フレキシブル配線板の一端の端子部を熱圧着すると、従来の電源ライン用コネクタと信号ライン用コネクタが不要になり、その分だけ部品点数が削減され、部品代を節約できる。そして、従来のように、電源入力用フレキシブル配線板と信号入力用フレキシブル配線板をコネクタに挿入して接続する工程が不要となる。特に、Ｘ−配線基板に複数形成されたチップオンフィルム用圧着ランド部の間に、電源ライン用圧着ランド部と信号ライン用圧着ランド部を形成し、これらの圧着ランド部を横一列に並ぶ位置関係にしてあると、チップオンフィルムの熱圧着と、電源入力用及び信号入力用のフレキシブル配線板の熱圧着とを、同一工程で同時に行うことができるので、上記のように電源入力用及び信号入力用のフレキシブル配線板をコネクタに挿入、接続する工程が不要になることと相俟って、組立作業効率が大幅に向上するようになる。また、液晶モジュールの動作検査時には、熱圧着された電源入力用及び信号入力用のフレキシブル配線板の他端の端子部を、検査装置のコネクタに挿入、接続して検査できるので、従来の検査装置の治具（フレキシブル配線板）が不要になり、治具劣化の問題も解決することができる。 As in the liquid crystal module of the present invention, a power line crimp land portion and a signal line crimp land portion are formed on an X-wiring board, and a terminal portion and a signal at one end of the power input flexible wiring board are formed on each crimp land portion. If the terminal portion at one end of the input flexible wiring board is thermocompression bonded, the conventional power line connector and signal line connector are not required, the number of parts is reduced accordingly, and the part cost can be saved. And the process which inserts and connects the flexible wiring board for power inputs and the flexible wiring board for signal inputs to a connector like the past becomes unnecessary. In particular, a power line crimp land portion and a signal line crimp land portion are formed between a plurality of chip-on-film crimp land portions formed on the X-wiring board, and these crimp land portions are arranged in a horizontal row. In this case, the thermocompression bonding of the chip-on film and the thermocompression bonding of the flexible wiring board for power input and signal input can be performed simultaneously in the same process. Combined with the fact that the step of inserting and connecting the flexible wiring board for input into the connector becomes unnecessary, the assembly work efficiency is greatly improved. In addition, when testing the operation of a liquid crystal module, the other end of the thermocompression-bonded flexible wiring board for power input and signal input can be inspected by inserting and connecting to the connector of the inspection apparatus. No jig (flexible wiring board) is required, and the problem of jig deterioration can be solved.

更に、二分割された左右いずれか片側のＸ−配線基板に電源ライン用圧着ランド部と基板連結用圧着ランド部を形成し、反対側のＸ−配線基板に信号ライン用圧着ランド部と基板連結用圧着ランド部を形成して、双方の基板連結用圧着ランド部に基板連結用フレキシブル配線板の両端の端子部を熱圧着した液晶モジュールでは、電源ライン用と信号ライン用の二つのコネクタに加えて基板連結用の二つのコネクタを省略できるので、部品点数の一層の削減と部品代の一層の節約を図ることができ、また、電源入力用と信号入力用のフレキシブル配線板をコネクタに接続する工程に加えて、基板連結用フレキシブル配線板をコネクタに接続する工程も不要になる。そして、左側と右側のＸ−配線基板に複数ずつ形成されたチップオンフィルム用圧着ランド部の間に、電源ライン用圧着ランド部と信号ライン用圧着ランド部と基板連結用圧着ランド部を形成して、これらの圧着ランド部を横一列に並ぶ位置関係としたものは、チップオンフィルムの熱圧着と、電源入力用、信号入力用、基板連結用の各フレキシブル配線板の熱圧着とを、同一工程で同時に行うことができるので、上記のように各フレキシブル配線板をコネクタに挿入、接続する工程が不要になることと相俟って、組立作業効率が大幅に向上するようになる。 Further, a power line crimp land portion and a substrate connection crimp land portion are formed on one of the left and right X-wiring boards, and the signal line crimp land portion and the substrate connection are formed on the opposite X-wiring board. In a liquid crystal module in which crimping land parts are formed and the terminal parts at both ends of the flexible wiring board for board connection are thermocompression bonded to both board connection crimping land parts, in addition to two connectors for power supply lines and signal lines This eliminates the need for two connectors for board connection, further reducing the number of components and savings in component costs, and connecting flexible wiring boards for power input and signal input to the connectors. In addition to the process, the process of connecting the board connecting flexible wiring board to the connector becomes unnecessary. Then, between the chip-on-film crimp land portions formed on the left and right X-wiring boards, a power line crimp land portion, a signal line crimp land portion, and a substrate connecting crimp land portion are formed. In this case, the chip-on-film thermocompression bonding and the thermocompression bonding of each flexible wiring board for power input, signal input, and board connection are the same. Since the steps can be performed simultaneously, the assembly work efficiency is greatly improved in combination with the necessity of inserting and connecting each flexible wiring board to the connector as described above.

本発明の一実施形態に係る液晶モジュールの分解斜視図である。It is a disassembled perspective view of the liquid crystal module which concerns on one Embodiment of this invention. 同液晶モジュールの部分断面図である。It is a fragmentary sectional view of the liquid crystal module. 同液晶モジュールの液晶パネルの一部と、二分割された左側及び右側のＸ−配線基板と、メインの配線基板の一部を展開して示す説明図であって、チップオンフィルムとフレキシブル配線板が熱圧着される前の状態を示すものである。It is explanatory drawing which expand | deploys and shows a part of liquid crystal panel of the liquid crystal module, the X-wiring board of the left and right divided into 2 parts, and a main wiring board, Comprising: A chip on film and a flexible wiring board The state before thermocompression bonding is shown. 同液晶モジュールの液晶パネルの一部と、二分割された左側及び右側のＸ−配線基板と、メインの配線基板の一部を展開して示す説明図であって、チップオンフィルムとフレキシブル配線板が熱圧着された後の状態を示すものである。It is explanatory drawing which expand | deploys and shows a part of liquid crystal panel of the liquid crystal module, the X-wiring board of the left and right divided into 2 parts, and a main wiring board, Comprising: A chip on film and a flexible wiring board The state after thermocompression bonding is shown. 本発明の他の実施形態に係る液晶モジュールの液晶パネルの一部とＸ−配線基板とメイン配線基板の一部を展開して示す説明図であって、チップオンフィルムとフレキシブル配線板が熱圧着される前の状態を示すものである。It is explanatory drawing which expand | deploys and shows a part of liquid crystal panel of the liquid crystal module which concerns on other embodiment of this invention, a part of X-wiring board, and a main wiring board, Comprising: A chip-on film and a flexible wiring board are thermocompression-bonding It shows the state before being performed. 同液晶モジュールの液晶パネルの一部とＸ−配線基板とメイン配線基板の一部を展開して示す説明図であって、チップオンフィルムとフレキシブル配線板が熱圧着された後の状態を示すものである。It is explanatory drawing which expand | deploys and shows a part of liquid crystal panel of the same liquid crystal module, X-wiring board, and a main wiring board, Comprising: The state after a chip-on film and a flexible wiring board are thermocompression-bonded It is.

図１、図２に示す液晶モジュールは、大画面の液晶テレビに組み込まれる大型の液晶モジュールであって、板金製の浅い箱型のリアフレーム１の内部には光反射シート２が設けられている。そして、この光反射シート２の上には複数本（本実施形態では５本）のＵ字型冷陰極管３が互いに平行に配設されており、これらのＵ時型冷陰極管３は複数個（本実施形態では６個）のランプホルダー４で支持されている。 The liquid crystal module shown in FIGS. 1 and 2 is a large liquid crystal module incorporated in a large-screen liquid crystal television, and a light reflecting sheet 2 is provided inside a shallow box-shaped rear frame 1 made of sheet metal. . A plurality (five in the present embodiment) of U-shaped cold cathode tubes 3 are arranged in parallel with each other on the light reflecting sheet 2. The lamp holders 4 are supported by six (six in this embodiment) lamp holders 4.

上記ランプホルダー４は、図１に示すようにＵ字型冷陰極管３を嵌着保持する５つの保持部４ａが形成されたものであって、Ｕ字型冷陰極管３の中央部を保持する４個のランプホルダー４には、光学シート５ａ，５ｂ，５ｃを下方から支持して撓みを防止するポスト４ｂが形成されている。 As shown in FIG. 1, the lamp holder 4 is formed with five holding portions 4a for fitting and holding the U-shaped cold cathode tube 3, and holds the central portion of the U-shaped cold cathode tube 3. The four lamp holders 4 are formed with posts 4b that support the optical sheets 5a, 5b, and 5c from below to prevent bending.

Ｕ字型冷陰極管３の端部（Ｕ字状屈曲端部と反対側の端部）にはランプソケット３ａが取付けられており、これらのランプソケット３ａは、リアフレーム１の側板（左側の側板）１ａに沿ってリアフレーム１の底板１ｂにランプソケットの数だけ形成されたソケット嵌着用開口部１ｃに嵌着されている。そして、各ランプソケット３ａからＵ字型冷陰極管３のリード線（不図示）がリアフレーム１の裏側へ引き出されている。更に、Ｕ字型冷陰極管３の両端部は、リアフレーム１の左右の側板１ａ，１ｄに取付けられたセルガイド兼用のランプフレーム６，６で覆われており、それによってランプソケット３ａの陰影や明るさのバラツキが解消されている。 A lamp socket 3a is attached to the end of the U-shaped cold cathode tube 3 (the end opposite to the U-shaped bent end), and these lamp sockets 3a are connected to the side plate (on the left side of the rear frame 1). Side sockets 1a are fitted into socket fitting openings 1c formed on the bottom plate 1b of the rear frame 1 by the number of lamp sockets. A lead wire (not shown) of the U-shaped cold cathode tube 3 is drawn out from the lamp socket 3 a to the back side of the rear frame 1. Further, both end portions of the U-shaped cold cathode tube 3 are covered with lamp frames 6 and 6 which are also used as cell guides and are attached to the left and right side plates 1a and 1d of the rear frame 1, whereby the shadow of the lamp socket 3a is shaded. And brightness variations have been eliminated.

図１，図２に示すように、リアフレーム１の長辺の側板１ｅ，１ｆは逆Ｕ字状に折り曲げられた二重側板とされており、この二重側板１ｅ，１ｆの天面には、３枚の光学シート５ａ，５ｂ，５ｃの長辺沿いの端縁が載置されて、セルガイド７，７で押さえられている。そして、光学シート５ａ，５ｂ，５ｃの短辺沿いの端縁は、セルガイド兼用の前記ランプフレーム６，６の凹溝部（不図示）に挿入されている。これらの光学シート５ａ，５ｂ，５ｃは、Ｕ字型冷陰極管３から発せられる光を拡散して液晶パネル８に均一に照射するための光拡散シートであって、上２枚の光学シート５ｂ，５ｃは薄い光拡散シートであるが、下側の光学シート５ａは撓みにくい厚手のパネル状の光拡散シート（光拡散板）が使用されている。 As shown in FIGS. 1 and 2, the long side plates 1e and 1f of the rear frame 1 are double side plates bent in an inverted U shape, and the top surfaces of the double side plates 1e and 1f are The edges along the long sides of the three optical sheets 5a, 5b, 5c are placed and pressed by the cell guides 7,7. And the edge along the short side of optical sheet 5a, 5b, 5c is inserted in the concave-groove part (not shown) of the said lamp frames 6 and 6 used also as a cell guide. These optical sheets 5a, 5b, and 5c are light diffusion sheets for diffusing light emitted from the U-shaped cold cathode tube 3 and uniformly irradiating the liquid crystal panel 8, and the upper two optical sheets 5b. , 5c are thin light diffusion sheets, but the lower optical sheet 5a is a thick panel-like light diffusion sheet (light diffusion plate) that is difficult to bend.

上記のセルガイド７，７とセルガイド兼用のランプフレーム６，６の上には、液晶パネル（液晶セル）８の四周縁が載置されており、この液晶パネル８の四周縁とリアフレーム１の四周の側板を囲むように方形枠状に組まれた４本のベゼル９ａ，９ａ，９ｂ，９ｂが、ビスでリアフレーム１の二重側板１ｅ，１ｆに固定されている。 Four peripheral edges of a liquid crystal panel (liquid crystal cell) 8 are placed on the cell guides 7 and 7 and the lamp frames 6 and 6 also serving as the cell guide. The four peripheral edges of the liquid crystal panel 8 and the rear frame 1 are mounted. The four bezels 9a, 9a, 9b, 9b assembled in a square frame shape so as to surround the four side plates are fixed to the double side plates 1e, 1f of the rear frame 1 with screws.

図１，図４に示すように、上記液晶パネル８の長辺沿いの端縁には、左側と右側に二分割されたＸ−配線基板（以下、Ｘ−ＰＣＢと略記する）１０ａ，１０ｂが、ソースドライバＩＣチップ１１ａを搭載した複数のチップオンフィルム（以下、ＣＯＦと略記する）１１を介して接続されており、これらのＸ−ＰＣＢ１０ａ，１０ｂは、図２に示すように上記セルガイド７の外側面に固定されている。また、図１に示すように、液晶パネル８の短辺沿いの端縁には、ゲートドライバＩＣチップを搭載したＣＯＦ１２を介してＹ−ＰＣＢ１３が接続されており、このＹ−配線基板１３は上記ランプフレーム６の外側面に固定されている。 As shown in FIGS. 1 and 4, X-wiring boards (hereinafter abbreviated as X-PCB) 10a and 10b which are divided into a left side and a right side are provided at the edges along the long side of the liquid crystal panel 8. Are connected via a plurality of chip-on-film (hereinafter abbreviated as COF) 11 mounted with a source driver IC chip 11a. These X-PCBs 10a and 10b are connected to the cell guide 7 as shown in FIG. It is fixed to the outer surface of the. As shown in FIG. 1, a Y-PCB 13 is connected to the edge along the short side of the liquid crystal panel 8 via a COF 12 on which a gate driver IC chip is mounted. It is fixed to the outer surface of the lamp frame 6.

この液晶モジュールの特徴は、上記の二分割されたＸ−ＰＣＢ１０ａ，１０ｂにある。即ち、これらのＸ−ＰＣＢ１０ａ，１０ｂの上端縁には、図３に示すように、従来と同様のチップオンフィルム用圧着ランド部（以下、ＣＯＦ用圧着ランド部と略記する）１４が所定間隔をあけて複数ずつ形成されているが、従来の電源ライン用コネクタや信号ライン用コネクタや基板連結用コネクタは一切設けられてなく、電源ライン用コネクタに代えて電源ライン用圧着ランド部１５が左側Ｘ−ＰＣＢ１４の左端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間に形成され、信号ライン用コネクタに代えて信号ライン用圧着ランド部１６が右側Ｘ−ＰＣＢ１０ｂの右端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間に形成され、基板連結用コネクタに代えて二つの基板連結用圧着ランド部１７，１７が左側Ｘ−ＰＣＢの右端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間と右側Ｘ−ＰＣＢの左端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間に形成されている。従って、これらの圧着ランド部１４，１５，１６，１７は、二分割されたＸ−ＰＣＢ１０ａ，１０ｂの上端縁に沿って横一列に並ぶ位置関係となっている。 This liquid crystal module is characterized by the above-mentioned two-divided X-PCBs 10a and 10b. That is, as shown in FIG. 3, a chip-on-film pressure-bonding land portion (hereinafter abbreviated as a COF pressure-bonding land portion) 14 similar to the conventional one is provided at the upper edge of these X-PCBs 10a and 10b at a predetermined interval. A plurality of power supply line connectors, signal line connectors, and board connection connectors are not provided at all, but instead of the power line connector, the power line crimp land portion 15 is provided on the left side X. -Formed between the two COF crimping land portions 14, 14 near the left end of the PCB 14, and instead of the signal line connector, the signal line crimping land portion 16 has two COF crimping portions near the right end of the right side X-PCB 10b. Two board connecting crimping land parts 17 and 17 are formed between the land parts 14 and 14, instead of the board connecting connector, near the right end of the left X-PCB. One of which is formed between the two COF crimp land portions 14 of the left end between the right X-PCB of COF crimp land portions 14. Therefore, these crimping land portions 14, 15, 16, and 17 are in a positional relationship that is aligned in a horizontal line along the upper edge of the X-PCBs 10a and 10b divided in two.

図４に示すように、ソースドライバＩＣチップ１１ａを搭載した各ＣＯＦ１１の両端の端子部１１ｂ，１１ｃは、ＡＣＦ（異方性導電フィルム）を用いて、従来と同様に、Ｘ−ＰＣＢ１０ａ，１０ｂの前記ＣＯＦ用圧着ランド部１４と、液晶パネル８の端縁部に形成されたＣＯＦ用圧着ランド部８ａに熱圧着されているが、電源入力用フレキシブル配線板（以下、電源入力用ＦＰＣと略記する）１８や信号入力用フレキシブル配線板（以下、信号入力用ＦＰＣと略記する）１９や基板連結用フレキシブル配線板（以下、基板連結用ＦＰＣと略記する）２０は、従来のようにコネクタに接続されてなく、電源入力用ＦＰＣ１８の一端の端子部１８ａは右側Ｘ−ＰＣＢ１０ａの前記電源ライン用圧着ランド部１５に、信号入力用ＦＰＣ１９の一端の端子部１９ａは左側Ｘ−ＰＣＢ１０ｂの前記信号ライン用圧着ランド部１６に、基板連結用ＦＰＣ２０の両端の端子部２０ａ，２０ａは左右のＸ−ＰＣＢ１０ａ，１０ｂの前記基板連結用圧着ランド部１７，１７に、それぞれ熱圧着されている。これらのＦＰＣ１８，１９，２０の端子部の熱圧着は、前記のようにＣＯＦ用、電源ライン用、信号ライン用、基板連結用のそれぞれの圧着ランド部１４，１５，１６，１７が、Ｘ−ＰＣＢ１０ａ，１０ｂの上端縁に沿って横一列に並ぶ位置関係となっているため、圧着ランド部と端子部との間にテープ状のＡＣＦを挟んで同一の熱圧着工程で同時に行うことができる。 As shown in FIG. 4, the terminal portions 11b and 11c at both ends of each COF 11 on which the source driver IC chip 11a is mounted are made of X-PCBs 10a and 10b using an ACF (anisotropic conductive film) as in the conventional case. The COF pressure bonding land portion 14 and the COF pressure bonding land portion 8a formed at the edge of the liquid crystal panel 8 are thermocompression bonded, and are referred to as a power input flexible wiring board (hereinafter abbreviated as power supply input FPC). ) 18 and a flexible wiring board for signal input (hereinafter abbreviated as FPC for signal input) 19 and a flexible wiring board for board connection (hereinafter abbreviated as FPC for board connection) 20 are connected to the connector as in the conventional case. The terminal portion 18a at one end of the power input FPC 18 is connected to the power line crimping land portion 15 of the right X-PCB 10a at one end of the signal input FPC 19. The terminal portion 19a is connected to the signal line crimping land portion 16 of the left X-PCB 10b, and the terminal portions 20a and 20a at both ends of the board connecting FPC 20 are connected to the board connecting crimp land portions 17 and 17 of the left and right X-PCBs 10a and 10b. Each is thermocompression bonded. As described above, the thermocompression bonding of the terminal portions of these FPCs 18, 19, and 20 is performed by using the X-bonding land portions 14, 15, 16, and 17 for COF, power supply line, signal line, and board connection as described above. Since the positional relationship is arranged in a horizontal line along the upper edge of the PCBs 10a and 10b, a tape-shaped ACF is sandwiched between the crimping land part and the terminal part, and the same thermocompression process can be performed simultaneously.

電源入力用ＦＰＣ１８の他端の端子部１８ｂは、図２，図４に示すように、リアフレーム１の裏面に取付けられたメイン配線基板２０の電源用配線基板部２０ａのコネクタ２１ａに挿入して接続されており、また、信号入力用ＦＰＣ１９の他端の端子部１９ｂは、メイン配線基板２０の信号用配線基板部２０ｂのコネクタ２２ｂに挿入して接続されている。 The terminal portion 18b at the other end of the power input FPC 18 is inserted into the connector 21a of the power wiring board portion 20a of the main wiring board 20 attached to the back surface of the rear frame 1, as shown in FIGS. The terminal portion 19b at the other end of the signal input FPC 19 is inserted and connected to the connector 22b of the signal wiring board portion 20b of the main wiring board 20.

以上のような構成の液晶モジュールは、従来の電源ライン用コネクタと信号ライン用コネクタと二つの基板連結用コネクタが不要になり、その分だけ部品点数が削減され、部品代を節約できる。しかも、電源入力用、信号入力用、基板連結用のそれぞれのＦＰＣ１８，１９，２０の端子部１８ａ，１９ａ，２０ａの熱圧着とＣＯＦ１１の端子部１１ｂの熱圧着とを同一工程で同時に行うことができ、従来のように各ＦＰＣ１８，１９，２０の端子部１８ａ，１９ａ，２０ａをコネクタに挿入、接続する工程も不要になるので、組立作業効率が大幅に向上するようになる。また、液晶モジュールの動作検査時には、熱圧着された電源入力用及び信号入力用のＦＰＣ１８，１９の他端の端子部１８ｂ，１９ｂを、検査装置のコネクタに挿入、接続して検査できるので、従来の検査装置の治具（フレキシブル配線板）が不要になり、治具劣化の問題も解決することができる。 The liquid crystal module configured as described above eliminates the need for a conventional power line connector, signal line connector, and two board connection connectors, thereby reducing the number of parts and saving the part cost. In addition, the thermocompression bonding of the terminal portions 18a, 19a, and 20a of the FPCs 18, 19, and 20 for power supply input, signal input, and board connection and the thermocompression bonding of the terminal portion 11b of the COF 11 can be simultaneously performed in the same process. In addition, since there is no need to insert and connect the terminal portions 18a, 19a, and 20a of the FPCs 18, 19, and 20 to the connectors as in the prior art, the assembly work efficiency is greatly improved. In addition, when the operation of the liquid crystal module is inspected, the terminals 18b and 19b at the other end of the thermocompression-bonded power input and signal input FPCs 18 and 19 can be inserted into and connected to the connector of the inspection apparatus, so This eliminates the need for the jig (flexible wiring board) of the inspection apparatus and solves the problem of jig deterioration.

図５，図６は本発明の他の実施形態に係る液晶モジュールの液晶パネル８の一部とＸ−ＰＣＢ１０とメイン配線基板の一部（電源用配線基板部２１ａと信号用配線基板部２１ｂ）を展開して示す説明図であって、図５はＣＯＦ１１と電源入力用ＦＰＣ１８と信号入力用ＦＰＣ１９が熱圧着される前の状態を示し、図６は熱圧着された後の状態を示すものである。 5 and 6 show part of the liquid crystal panel 8 of the liquid crystal module according to another embodiment of the present invention, the X-PCB 10 and part of the main wiring board (power supply wiring board part 21a and signal wiring board part 21b). FIG. 5 shows a state before the COF 11, the power input FPC 18 and the signal input FPC 19 are thermocompression bonded, and FIG. 6 shows a state after the thermocompression bonding. is there.

この実施形態はＸ−ＰＣＢ１０が二分割されてなく、図４に示すように、Ｘ−ＰＣＢ１０の上端縁にＣＯＦ用圧着ランド部１４が所定間隔をあけて複数形成されており、電源ライン用圧着ランド部１５が左端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間に、また、信号ライン用圧着ランド部１６が右端寄りの二つのＣＯＦ用圧着ランド部１４，１４の間に形成されている。従って、これらの圧着ランド部１４，１５，１６は、Ｘ−ＰＣＢ１０の上端縁に沿って横一列に並ぶ位置関係となっている。 In this embodiment, the X-PCB 10 is not divided into two parts, and as shown in FIG. 4, a plurality of COF crimping land portions 14 are formed at the upper end edge of the X-PCB 10 at predetermined intervals. The land portion 15 is formed between the two COF crimping land portions 14 and 14 near the left end, and the signal line crimping land portion 16 is formed between the two COF crimping land portions 14 and 14 near the right end. Yes. Therefore, these crimping land portions 14, 15, and 16 are in a positional relationship in a horizontal row along the upper edge of the X-PCB 10.

そして、図６に示すように、ソースドライバＩＣチップ１１ａを搭載した各ＣＯＦ１１の両端の端子部１１ｂ，１１ｃは、Ｘ−ＰＣＢ１０の前記ＣＯＦ用圧着ランド部１４と、液晶パネル８の端縁部に形成されたＣＯＦ用圧着ランド部８ａに、また、電源入力用ＦＰＣ１８の一端の端子部１８ａはＸ−ＰＣＢ１０の前記電源ライン用圧着ランド部１５に、また、信号入力用ＦＰＣ１９の一端の端子部１９ａはＸ−ＰＣＢ１０の前記信号ライン用圧着ランド部１６に、それぞれ熱圧着されており、電源入力用ＦＰＣ１８の他端の端子部１８ｂと、信号入力用ＦＰＣ１９の他端の端子部１９ｂは、メイン配線基板２０の電源用配線基板部２１ａのコネクタ２２ａと、信号用配線基板部２０ｂのコネクタ２２ｂに挿入して接続されている。 As shown in FIG. 6, the terminal portions 11 b and 11 c at both ends of each COF 11 on which the source driver IC chip 11 a is mounted are connected to the COF pressure bonding land portion 14 of the X-PCB 10 and the edge portion of the liquid crystal panel 8. The formed COF crimp land portion 8a and the terminal portion 18a at one end of the power input FPC 18 are connected to the power line crimp land portion 15 of the X-PCB 10 and the terminal portion 19a at one end of the signal input FPC 19. Are respectively thermocompression bonded to the signal line crimp land 16 of the X-PCB 10, and the terminal 18b at the other end of the power input FPC 18 and the terminal 19b at the other end of the signal input FPC 19 are connected to the main wiring. Inserted and connected to the connector 22a of the power supply wiring board portion 21a of the board 20 and the connector 22b of the signal wiring board portion 20b.

この液晶モジュールの他の構成（全体構成）は、前述した液晶モジュールと同様であるので、説明を省略する。 Since the other configuration (overall configuration) of the liquid crystal module is the same as that of the liquid crystal module described above, description thereof is omitted.

このような液晶モジュールも、電源ライン用コネクタと信号ライン用コネクタが不要になるので、その分だけ部品点数が削減されて、部品代を節約することができ、しかも、電源入力用、信号入力用のＦＰＣ１８，１９の熱圧着とＣＯＦ１１の熱圧着とを同一工程で同時に行うことができるので、各ＦＰＣ１８，１９の端子部１８ａ，１９ａをコネクタに挿入、接続する工程が不要になることと相俟って、組立作業効率が大幅に向上するようになり、また、液晶モジュールの動作検査時には、熱圧着された電源入力用及び信号入力用のＦＰＣ１８，１９の他端の端子部１８ｂ，１９ｂを、検査装置のコネクタに挿入、接続して検査できるので、従来の検査装置の治具（フレキシブル配線板）が不要になり、治具劣化の問題を解決することもできる。 Such a liquid crystal module also eliminates the need for a power line connector and a signal line connector, so the number of parts can be reduced by that amount, saving parts costs, and for power input and signal input. The FPCs 18 and 19 can be thermocompression bonded and the COF11 thermocompression bonding can be performed simultaneously in the same process, which eliminates the need to insert and connect the terminal portions 18a and 19a of the FPCs 18 and 19 into the connectors. Thus, the assembly work efficiency is greatly improved, and at the time of the operation inspection of the liquid crystal module, the terminal portions 18b and 19b at the other ends of the FPCs 18 and 19 for thermocompression-bonded power input and signal input are provided. Since it can be inspected by inserting and connecting to the connector of the inspection device, the jig (flexible wiring board) of the conventional inspection device is no longer necessary, and the problem of jig deterioration can be solved. That.

１リアフレーム
２光反射シート
３Ｕ字型冷陰極管
５ａ，５ｂ，５ｃ光学シート
８液晶パネル
８ａチップオンフィルム用圧着ランド部
９ａ，９ｂベゼル
１０Ｘ−配線基板
１０ａ左側Ｘ−配線基板
１０ｂ右側Ｘ−配線基板
１１チップオンフィルム
１４チップオンフィルム用圧着ランド部
１５電源ライン用圧着ランド部
１６信号ライン用圧着ランド部
１７基板連結用圧着ランド部
１８電源入力用フレキシブル配線板
１８ａ電源入力用フレキシブル配線板の一端の端子部
１９信号入力用フレキシブル配線板
１９ａ信号入力用フレキシブル配線板の一端の端子部
２０基板連結用フレキシブル配線板
２０ａ基板連結用フレキシブル配線板の両端の端子部 DESCRIPTION OF SYMBOLS 1 Rear frame 2 Light reflection sheet 3 U-shaped cold-cathode tube 5a, 5b, 5c Optical sheet 8 Liquid crystal panel 8a Crimp land part for chip-on-film 9a, 9b Bezel 10 X-wiring board 10a Left side X-wiring board 10b Right side X -Wiring board 11 Chip-on-film 14 Crimp land part for chip-on film 15 Crimp land part for power line 16 Crimp land part for signal line 17 Crimp land part for substrate connection 18 Flexible wiring board for power input 18a Flexible wiring board for power input Terminal portion 19 at one end of the signal 19 Flexible wiring board for signal input 19a Terminal portion at one end of the flexible wiring board for signal input 20 Flexible wiring board for substrate connection 20a Terminal portions at both ends of the flexible wiring board for substrate connection

Claims

A power line crimp land portion and a signal line crimp land portion are formed on an X-wiring board connected to a liquid crystal panel via a chip-on film, and one end of a power input flexible wiring board is formed on the power line crimp land portion. The liquid crystal module is characterized in that the terminal part of the signal input flexible wiring board is thermocompression bonded to the signal line crimping land part.

The power supply line crimp land portion and the signal line crimp land portion are formed between a plurality of chip-on-film crimp land portions formed on the X-wiring substrate, and these crimp land portions are arranged in a horizontal row. The liquid crystal module according to claim 1, wherein the liquid crystal module is in a positional relationship.

The X-wiring board is divided into a left-side X-wiring board and a right-side X-wiring board, and the power line crimping land and the board connecting crimping land are arranged on either the left or right X-wiring board. The signal line crimp land portion and the substrate connection crimp land portion are formed on the opposite X-wiring board, and the left X-wiring substrate and the right X-wiring substrate land connection crimp land portion. The liquid crystal module according to claim 1, wherein terminal portions at both ends of the board connecting flexible wiring board are thermocompression bonded.

Between the crimp land for chip-on-film formed on each of the left X-wiring board and the right X-wiring board, the power line crimp land, the signal line land, and the board connection 4. The liquid crystal module according to claim 3, wherein a pressure-bonding land portion is formed, and the pressure-bonding land portions are arranged in a horizontal row.