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JP2010118278A - Light-emitting element module, and illuminating device - Google Patents

Light-emitting element module, and illuminating device Download PDF

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Publication number
JP2010118278A
JP2010118278A JP2008291572A JP2008291572A JP2010118278A JP 2010118278 A JP2010118278 A JP 2010118278A JP 2008291572 A JP2008291572 A JP 2008291572A JP 2008291572 A JP2008291572 A JP 2008291572A JP 2010118278 A JP2010118278 A JP 2010118278A
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light emitting
emitting element
substrate
element module
connection
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Inventor
Naoki Sugishita
直樹 杉下
Homare Takai
誉 高井
Yasuhiko Ishii
靖彦 石井
Masanao Hieda
正直 稗田
Yoshitaka Hashimoto
由貴 橋本
Takafumi Oishi
崇文 大石
Hiroaki Watanabe
博明 渡邉
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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Priority to JP2008291572A priority Critical patent/JP2010118278A/en
Publication of JP2010118278A publication Critical patent/JP2010118278A/en
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Abstract

【課題】複数個の発光素子モジュールを並べて配置する際に発光素子モジュール間の配線を容易に行うことができ配線を短くできることである。
【解決手段】複数の半導体発光素子12は、四角形の平面状の基板11上にほぼ均等に分布するように配置される。基板11の1辺の両端部には接続コネクタ13が設けられ、接続コネクタ13には電源または他の基板に接続される端子14が基板の1辺に平行で外向き方向に配置されている。そして、接続コネクタ13の端子14間には複数の半導体発光素子12を直列に接続する導体15が設けられている。
【選択図】図1
When arranging a plurality of light emitting element modules side by side, wiring between the light emitting element modules can be easily performed and wiring can be shortened.
A plurality of semiconductor light-emitting elements 12 are arranged on a rectangular planar substrate 11 so as to be distributed substantially evenly. Connection connectors 13 are provided at both end portions of one side of the substrate 11, and terminals 14 connected to a power source or another substrate are arranged in parallel to one side of the substrate in the outward direction. A conductor 15 that connects the plurality of semiconductor light emitting elements 12 in series is provided between the terminals 14 of the connection connector 13.
[Selection] Figure 1

Description

本発明は、複数の半導体発光素子を光源とした発光素子モジュール及び照明装置に関する   The present invention relates to a light emitting element module and a lighting device using a plurality of semiconductor light emitting elements as a light source.

平面状の基板に複数個の半導体発光素子を配置して形成された発光素子モジュールがある(例えば、特許文献1参照)。この発光素子モジュールでは、複数個の半導体発光素子を2段に直列接続し基板に接続コネクタが設けられ、接続コネクタを介して電源や他の基板と接続される。そして、複数個の発光素子モジュールを有した照明装置では、発光素子モジュールを並べて配置するにあたり、各々の発光素子モジュールが同じ方向に向くように1列で配置している。
特開2008−244165号公報
There is a light emitting element module formed by arranging a plurality of semiconductor light emitting elements on a planar substrate (see, for example, Patent Document 1). In this light-emitting element module, a plurality of semiconductor light-emitting elements are connected in series in two stages, a connection connector is provided on the substrate, and connected to a power source or another substrate via the connection connector. And in the illuminating device having a plurality of light emitting element modules, when arranging the light emitting element modules side by side, the light emitting element modules are arranged in a line so as to face the same direction.
JP 2008-244165 A

しかし、各々の発光素子モジュールが同じ方向に向くように2列以上で配置すると、各々の発光素子モジュールの接続コネクタの位置が2列以上となり、電源ユニットから分配して配線する際に、発光素子モジュールの基板上に配線がかかるおそれがある。   However, if the light emitting element modules are arranged in two or more rows so as to face in the same direction, the positions of the connection connectors of the respective light emitting element modules become two or more rows. There is a risk of wiring on the module board.

そこで、配線を考慮して、発光素子モジュールを1列として直線的に配置することが考えられるが、そうすると照明装置が長くなり配線も長くなる。配線が長くなると、電圧低下などの影響が出易くなる。   Therefore, in consideration of wiring, it is conceivable to arrange the light emitting element modules in a straight line, but in that case, the lighting device becomes longer and the wiring becomes longer. When the wiring becomes longer, the influence of voltage drop or the like is likely to occur.

本発明の目的は、複数個の発光素子モジュールを並べて配置する際に発光素子モジュール間の配線を容易に行うことができ、配線を短くできる発光素子モジュール及び照明装置を提供することである。   An object of the present invention is to provide a light-emitting element module and an illumination device that can easily perform wiring between light-emitting element modules when arranging a plurality of light-emitting element modules side by side, and can shorten the wiring.

請求項1の発明に係わる発光素子モジュールは、四角形の平面状の基板と;前記基板上に配置された複数の半導体発光素子と;前記基板の1辺の両端部に設けられ、電源または他の基板に接続される端子が前記基板の1辺に平行で外向き方向に配置された接続コネクタと;前記接続コネクタの端子間の前記基板に形成され前記複数の半導体発光素子に直列に電源を供給する導体と;を備えたことを特徴とする。   A light-emitting element module according to a first aspect of the present invention includes a rectangular planar substrate; a plurality of semiconductor light-emitting elements disposed on the substrate; provided at both ends of one side of the substrate; A connection connector in which a terminal connected to the substrate is arranged in an outward direction parallel to one side of the substrate; power is supplied in series to the plurality of semiconductor light emitting elements formed on the substrate between the terminals of the connection connector; And a conductor to be provided.

四角形とは正方形及び長方形を含む。正方形であることが好ましいが、それに限られない。   A quadrangle includes a square and a rectangle. It is preferably a square, but is not limited thereto.

基板上に配置される半導体発光素子は、例えば基板上にほぼ均等に分布するように配置してもよい。ほぼ均等に分布するとは、複数の半導体発光素子が基板上で分布する際の面密度がほぼ均一に配置されることをいう。半導体発光素子には、発光ダイオード(Light-emitting diode、LED)、有機発光ダイオード(Organic light-emitting diode、OLED)、発光ポリマー(Light Emitting Polymer、LEP)を含む。「基板の1辺に平行で外向き方向」とは、基板の1辺に平行方向で基板から見て遠ざかる方向をいう。このように配置された端子は接続コネクタに接続される電源線、接続線、短絡線等が1辺に平行で基板の外側から接続される。   The semiconductor light emitting elements arranged on the substrate may be arranged so as to be distributed almost evenly on the substrate, for example. “Distributing substantially evenly” means that the surface density when a plurality of semiconductor light emitting elements are distributed on the substrate is arranged substantially uniformly. The semiconductor light emitting device includes a light emitting diode (LED), an organic light emitting diode (OLED), and a light emitting polymer (LEP). “An outward direction parallel to one side of the substrate” refers to a direction away from the substrate in a direction parallel to one side of the substrate. The terminals arranged in this way are connected from the outside of the substrate with power supply lines, connection lines, short-circuit lines and the like connected to the connection connectors parallel to one side.

請求項2の発明に係わる照明装置は、請求項1の発光素子モジュールを前記接続コネクタが対面するように、2列で1行または複数行に配置したことを特徴とする。   A lighting device according to a second aspect of the present invention is characterized in that the light emitting element modules according to the first aspect are arranged in one or more rows in two columns so that the connection connectors face each other.

「接続コネクタが対面する」とは、接続コネクタが向き合って隣同士の位置関係になることをいう。例えば、隣接する1組の発光素子モジュールにおいて1辺同士が対向し接続コネクタが対面するように配置されている場合、隣接する1組の発光素子モジュールにおいて端子の向きが互いに対向するように接続コネクタが対面するように配置されている場合、これら1組の発光素子モジュールが組合せられて接続コネクタがそれぞれ対面するように配置されている場合等がある。   “Connecting connectors face each other” means that the connecting connectors face each other and become adjacent to each other. For example, when one pair of adjacent light emitting element modules is arranged so that the sides face each other and the connection connectors face each other, the connection connectors are arranged so that the terminals of the adjacent light emitting element modules face each other. May be arranged such that the one pair of light emitting element modules is combined so that the connection connectors face each other.

請求項1の発明によれば、基板の1辺の両端部に接続コネクタを設け、電源または他の基板に接続される端子が基板の1辺に平行で外向き方向に配置されているので、複数の発光素子モジュールを列方向に直線的に配置する場合には、接続コネクタの端子を互いに接続するだけである。従って、配線が短くて済みしかも接続が極めて容易に行える。   According to the first aspect of the present invention, the connection connectors are provided at both ends of one side of the board, and the terminals connected to the power source or the other board are arranged in the outward direction in parallel with one side of the board. When arranging a plurality of light emitting element modules linearly in the column direction, the terminals of the connector are simply connected to each other. Therefore, the wiring is short and the connection can be made very easily.

請求項2の発明によれば、発光素子モジュールを接続コネクタが対面するように2列で1行または複数行に配置するので、電源ユニットから分配して配線する際に短い配線で接続可能となる。   According to the invention of claim 2, since the light emitting element modules are arranged in one row or a plurality of rows in two columns so that the connection connectors face each other, it is possible to connect with a short wiring when distributing and wiring from the power supply unit. .

図1は本発明の実施の形態に係わる発光素子モジュール10の構成図である。発光素子モジュール10の基板11は四角形の平面状に形成されている。図1では正方形に形成された場合を示している。この基板11上に複数の半導体発光素子12がほぼ均等に分布するように配置される。図1では縦方向に4個及び横方向に4個の合計16個の半導体発光素子12が配置されている。   FIG. 1 is a configuration diagram of a light emitting element module 10 according to an embodiment of the present invention. The substrate 11 of the light emitting element module 10 is formed in a rectangular planar shape. In FIG. 1, the case where it forms in the square is shown. A plurality of semiconductor light emitting elements 12 are arranged on the substrate 11 so as to be almost evenly distributed. In FIG. 1, a total of 16 semiconductor light emitting elements 12 are arranged, 4 in the vertical direction and 4 in the horizontal direction.

そして、基板11のいずれか1辺、図1では右辺の両端部にそれぞれ接続コネクタ13a1、13a2が設けられている。接続コネクタ13a1、13a2はそれぞれ端子14a1、14a2を有し、端子14a1、14a2は電源または他の基板の端子に接続される。また、端子14a1、14a2は基板11の1辺(右辺)の外向き方向(右辺に平行方向で基板11から遠ざかる方向)に配置されている。これにより、電源または他の基板の端子との接続を容易に行えるようにしている。   Then, connection connectors 13a1 and 13a2 are provided on either one side of the substrate 11, and on both ends of the right side in FIG. The connection connectors 13a1 and 13a2 have terminals 14a1 and 14a2, respectively, and the terminals 14a1 and 14a2 are connected to a power source or a terminal of another board. Further, the terminals 14a1 and 14a2 are arranged in an outward direction of one side (right side) of the substrate 11 (a direction parallel to the right side and away from the substrate 11). This facilitates connection with a power source or a terminal of another substrate.

また、接続コネクタ13a1の端子14a1と接続コネクタ13a2の端子14a2との間には、導体15、16が接続されている。導体15は、基板11に取り付けられた複数の半導体発光素子11を直列に接続する導体であり、導線16は接続コネクタ13a1の端子14a1と接続コネクタ13a2の端子14a2とを直接的に接続する導体である。   Conductors 15 and 16 are connected between the terminal 14a1 of the connection connector 13a1 and the terminal 14a2 of the connection connector 13a2. The conductor 15 is a conductor that connects a plurality of semiconductor light emitting elements 11 attached to the substrate 11 in series, and the conductive wire 16 is a conductor that directly connects the terminal 14a1 of the connection connector 13a1 and the terminal 14a2 of the connection connector 13a2. is there.

いま、接続コネクタ13a2の端子14a2を短絡し、接続コネクタ13a1の端子14a1間に電源が接続されたとすると、電源からの電流は導体15を通って直列接続された各々の半導体発光素子11を流れ、接続コネクタ13a2の端子14a2の短絡部を経由し導体16を通って電源に戻る。   Now, assuming that the terminal 14a2 of the connection connector 13a2 is short-circuited and a power source is connected between the terminals 14a1 of the connection connector 13a1, the current from the power source flows through each semiconductor light emitting element 11 connected in series through the conductor 15, The power returns to the power source through the conductor 16 via the short-circuit portion of the terminal 14a2 of the connection connector 13a2.

このように、発光素子モジュール10は、基板11の1辺の両端部に接続コネクタ13a1、13a2を設け、電源または他の基板に接続される端子が基板11の1辺に平行で外向き方向に配置しているので、複数の発光素子モジュール10を列方向に直線的に配置する場合には、接続コネクタの端子13a1、13a2を互いに接続するだけよい。また、端子同士が近接して配置されるため端子間を接続するための配線が短くて済み、しかも接続が極めて容易に行える。配線が短くなることから配線の電圧低下を防止でき照度の低下も防止できる。   As described above, the light emitting element module 10 is provided with the connection connectors 13a1 and 13a2 at both ends of one side of the substrate 11, and the terminals connected to the power source or another substrate are parallel to one side of the substrate 11 in the outward direction. Therefore, when the plurality of light emitting element modules 10 are linearly arranged in the column direction, the terminals 13a1 and 13a2 of the connection connector need only be connected to each other. Further, since the terminals are arranged close to each other, the wiring for connecting the terminals is short, and the connection can be made very easily. Since the wiring is shortened, the voltage drop of the wiring can be prevented and the illuminance can also be prevented from decreasing.

図2は本発明の実施の形態に係わる照明装置の構成図である。照明装置は、図1に示した複数個の発光素子モジュール10を配列して構成される。図2では4個の発光素子モジュール10a〜10dを2列2行で配列して構成された場合を示している。発光素子モジュール10a、10cは1列目を形成し、発光素子モジュール10b、10dは2列目を形成しており、1列目の発光素子モジュール10a、10cは、2列目の発光素子モジュール10b、10dに対して、1辺同士が対向し接続コネクタ13が対面するように配列されている。すなわち、1行目の発光素子モジュール10aの接続コネクタ13a1、13a2は、発光素子モジュール10bの接続コネクタ13b1、13b2と対面し、2行目の発光素子モジュール10cの接続コネクタ13c1、13c2は、発光素子モジュール10dの接続コネクタ13d1、13d2と対面している。   FIG. 2 is a configuration diagram of the illumination device according to the embodiment of the present invention. The lighting device is configured by arranging a plurality of light emitting element modules 10 shown in FIG. FIG. 2 shows a case where four light emitting element modules 10a to 10d are arranged in two columns and two rows. The light emitting element modules 10a and 10c form the first row, the light emitting element modules 10b and 10d form the second row, and the first row light emitting element modules 10a and 10c are the second row light emitting element module 10b. 10d are arranged so that one side faces each other and the connection connector 13 faces. That is, the connection connectors 13a1 and 13a2 of the light emitting element module 10a in the first row face the connection connectors 13b1 and 13b2 of the light emitting element module 10b, and the connection connectors 13c1 and 13c2 of the light emitting element module 10c in the second row are light emitting elements. It faces the connection connectors 13d1, 13d2 of the module 10d.

ここで、図1に示した発光素子モジュール10の接続コネクタ13を対面させて配置するには、図1に示した発光素子モジュール10を180度回転させると、図2に示した発光素子モジュール10b、10dとなる。   Here, in order to face and arrange the connection connector 13 of the light emitting element module 10 shown in FIG. 1, when the light emitting element module 10 shown in FIG. 1 is rotated 180 degrees, the light emitting element module 10b shown in FIG. 10d.

次に、1列目の発光素子モジュール10aの接続コネクタ13a2の端子14a2と、発光素子モジュール10cの接続コネクタ13c1の端子14c1とを接続するとともに、発光素子モジュール10cの接続コネクタ13c2の端子14c2を短絡する。その後に、発光素子モジュール10aの接続コネクタ13a1の端子14a1間に電源を接続する。これにより、1列目の発光素子モジュール10a、10cの各々の半導体発光素子12は直列接続され、電源から電力が供給される。   Next, the terminal 14a2 of the connection connector 13a2 of the light emitting element module 10a in the first row is connected to the terminal 14c1 of the connection connector 13c1 of the light emitting element module 10c, and the terminal 14c2 of the connection connector 13c2 of the light emitting element module 10c is short-circuited. To do. Thereafter, a power source is connected between the terminals 14a1 of the connection connector 13a1 of the light emitting element module 10a. Accordingly, the semiconductor light emitting elements 12 of the light emitting element modules 10a and 10c in the first column are connected in series, and power is supplied from the power source.

同様に、2列目の発光素子モジュール10bの接続コネクタ13b2の端子14b2と、発光素子モジュール10dの接続コネクタ13d1の端子14d1とを接続するとともに、発光素子モジュール10dの接続コネクタ13d2の端子14c2を短絡する。その後に、発光素子モジュール10bの接続コネクタ13b1の端子14b1間に電源を接続する。これにより、2列目の発光素子モジュール10b、10dの各々の半導体発光素子12は直列接続され、電源から電力が供給される。   Similarly, the terminal 14b2 of the connection connector 13b2 of the light emitting element module 10b in the second row is connected to the terminal 14d1 of the connection connector 13d1 of the light emitting element module 10d, and the terminal 14c2 of the connection connector 13d2 of the light emitting element module 10d is short-circuited. To do. Thereafter, a power source is connected between the terminals 14b1 of the connection connector 13b1 of the light emitting element module 10b. Thereby, the semiconductor light emitting elements 12 of the light emitting element modules 10b and 10d in the second row are connected in series, and power is supplied from the power source.

このように、発光素子モジュール10を2列の1行または複数行に配置し、接続用コネクタ13を互いに対面するように配置するので、配線箇所が複数の発光素子モジュール10の中央部に位置することになり、電源線の接続位置が近接し電源への配線がし易くなる。また、発光素子モジュール10間の配線も容易に行え配線長も短くすることができる。従って、電圧低下などの影響が出にくくなる。   Thus, the light emitting element modules 10 are arranged in one row or a plurality of rows in two columns, and the connection connectors 13 are arranged so as to face each other, so that the wiring location is located at the center of the plurality of light emitting element modules 10. As a result, the connection positions of the power supply lines are close to each other, and wiring to the power supply becomes easy. Further, wiring between the light emitting element modules 10 can be easily performed, and the wiring length can be shortened. Therefore, the influence of voltage drop or the like is less likely to occur.

本発明の実施の形態に係わる発光素子モジュールの構成図。The block diagram of the light emitting element module concerning embodiment of this invention. 本発明の実施の形態に係わる照明装置の構成図。The block diagram of the illuminating device concerning embodiment of this invention.

符号の説明Explanation of symbols

10…発光素子モジュール、11…基板、12…半導体発光素子、13…接続コネクタ、14…端子、15…導体、16…導体 DESCRIPTION OF SYMBOLS 10 ... Light emitting element module, 11 ... Board | substrate, 12 ... Semiconductor light emitting element, 13 ... Connection connector, 14 ... Terminal, 15 ... Conductor, 16 ... Conductor

Claims (2)

四角形の平面状の基板と;
前記基板上に配置された複数の半導体発光素子と;
前記基板の1辺の両端部に設けられ、電源または他の基板に接続される端子が前記基板の1辺に平行で外向き方向に配置された接続コネクタと;
前記接続コネクタの端子間の前記基板に形成され前記複数の半導体発光素子に直列に電源を供給する導体と;
を備えたことを特徴とする発光素子モジュール。
A rectangular planar substrate;
A plurality of semiconductor light emitting devices disposed on the substrate;
A connection connector provided at both ends of one side of the substrate, and a terminal connected to a power source or another substrate is arranged in an outward direction parallel to the one side of the substrate;
A conductor formed on the substrate between the terminals of the connection connector and supplying power in series to the plurality of semiconductor light emitting elements;
A light emitting element module comprising:
請求項1の発光素子モジュールを前記接続コネクタが対面するように、2列で1行または複数行に配置したことを特徴とする照明装置。   2. A lighting device according to claim 1, wherein the light emitting element modules according to claim 1 are arranged in one row or a plurality of rows in two columns so that the connection connectors face each other.
JP2008291572A 2008-11-13 2008-11-13 Light-emitting element module, and illuminating device Pending JP2010118278A (en)

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Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008007492A1 (en) * 2006-07-11 2008-01-17 Koha Co., Ltd. Light source module, surface area light-emitting unit, and surface area light-emitting device
JP2008053062A (en) * 2006-08-24 2008-03-06 Sony Corp Backlight device and liquid crystal display device

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2008007492A1 (en) * 2006-07-11 2008-01-17 Koha Co., Ltd. Light source module, surface area light-emitting unit, and surface area light-emitting device
JP2008053062A (en) * 2006-08-24 2008-03-06 Sony Corp Backlight device and liquid crystal display device

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