JP2010118271A - Anisotropic conductive sheet and method for manufacturing the same, mounted module, electronic component, and inspection device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To ensure electrical connection between an electrode of a liquid crystal panel, a printed circuit board or the like (inspected object) and an electrode of an inspection apparatus or a mounted product, and to prevent damage to the electrode of the inspected object. An anisotropic conductive sheet is provided.
SOLUTION: A sheet 1 having insulation and cushioning properties in a thickness direction, a first surface wiring pattern 3a formed on a first surface 1a which is one surface of the sheet, and a surface opposite to the first surface The second surface terminal portion 3b located on the second surface 1b, and the sheet surface conduction portion 3c for conducting the first surface wiring pattern and the second surface terminal portion.
[Selection] Figure 1

Description

  The present invention relates to an anisotropic conductive sheet, a manufacturing method thereof, a mounting module, an electronic product, and an inspection apparatus.

In the frame of the liquid crystal panel, electrodes of scanning line terminals and data line terminals corresponding to the pixels of the display are arranged with high density. In the manufacturing process of the liquid crystal panel display, an inspection process for inspecting a short circuit, disconnection, display characteristics, and the like is provided. In this inspection process, it is necessary to bring the electrodes of the inspection apparatus into contact with the electrodes of a high-density array (fine pitch) with certainty (Patent Document 1). In general, a connecting member is used between the electrodes of the liquid crystal panel frame and the electrodes of the inspection apparatus, which are arranged at high density, in order to ensure conduction of both electrodes. For example, a connecting member in which a circuit board and a flexible substrate with a lead pattern are arranged in order from the inspection apparatus, one side of the lead is connected to an electrode of the circuit board, and the other side is connected to an electrode of a liquid crystal panel is disclosed. (Patent Document 2). Bump contacts are formed on the leads in order to ensure conduction with the electrodes of the liquid crystal panel. The bump contacts protrude in a hemispherical shape, and the nickel core is gold-plated. The circuit board includes TAB (Tape Automated Bonding) in which a driver IC (mounting product) is incorporated, and is mounted on the frame of the liquid crystal panel as it is after the inspection is completed.
With the above-described connecting member, it is possible to reliably conduct electrical connection with the electrodes of the liquid crystal panel arranged at high density, and to perform a high reliability test. Also in the inspection apparatus of Patent Document 1, a connection terminal (corresponding to the lead) is formed on the flexible substrate, as in Patent Document 2, for conduction with the electrode of the liquid crystal panel frame. Conductivity can be established with the electrodes of the liquid crystal panel.
JP 2000-56285 A Japanese Patent Application Laid-Open No. 08-254677

When the lead on the flexible substrate is used, the electrode of the liquid crystal panel is damaged due to the collision with the hemispherical bump depending on the contact condition. Since the driver IC is mounted on the electrodes of the frame of the liquid crystal panel as described above, if the bump contacts are damaged, there is a possibility that a conduction failure may occur, resulting in a serious failure.
The present invention ensures that the electrodes of the liquid crystal panel, printed circuit board, etc. (inspection object) and the electrodes of the inspection apparatus or the mounted product are electrically connected, and there is no possibility of causing damage to the electrodes of the inspection object. An object is to provide an anisotropic conductive sheet, a manufacturing method thereof, an electronic product, and an inspection apparatus.

  An anisotropic conductive sheet of the present invention is an insulating sheet having cushioning properties in the thickness direction, a first surface wiring pattern formed on a first surface which is one surface of the sheet, a first surface, It has the 2nd surface terminal part located in the 2nd surface which is the surface of the other side, and the sheet surface conduction | electrical_connection part for electrically conducting a 1st surface wiring pattern and a 2nd surface terminal part is characterized by the above-mentioned.

  Said 1st surface wiring pattern is comprised from wiring, and does not have a projection-like part where pressure concentrates. For this reason, even if the electrode of the object to be inspected and the first surface wiring pattern are brought into contact with the cushioning property of the seat, the electrode of the object to be inspected is hardly damaged by an impact, and with a smaller load. Conductivity can be reliably obtained. In addition, the arrangement of the second surface terminal portions is relatively sparse according to the arrangement pattern of the electrodes of the inspection apparatus or the mounted product, and only a predetermined region on the first surface of the first surface wiring pattern is It is easy to carry out manufacturing in order to make a dense arrangement in accordance with the electrode pitch of the object to be inspected.

The sheet is formed by a double sheet fixed in a folded state, and the first surface and the second surface of the sheet correspond to one surface of the double sheet before being folded, and the second surface terminal Is formed by one end portion of the second surface wiring pattern formed on the second surface, the other end portion of the second surface wiring pattern is located at the edge of one side of the second surface, The one-surface terminal portion is formed by one end portion of the first-surface wiring pattern formed on the first surface, and the other end portion of the first-surface wiring pattern is at the edge of one side of the first surface. The sheet-surface conductive portion is located on the end surface connecting one side of the first surface and the second surface, and the other end of the second surface wiring pattern and the other of the first surface wiring pattern. The first surface wiring pattern, the sheet surface conductive portion, and the second surface wiring pattern are connected to the end portions. But it to have been formed integrally and continuously with one surface of the enlarged scale sheet. Thus, a very high cushioning property can be obtained by the multilayer structure of sheet / sheet gap / sheet, and the contact of the object to be inspected with the electrode can be softened.
Note that one end portion of the second surface wiring pattern forming the second surface terminal portion is not limited to the end, and may include most of the second surface wiring pattern including the end. The term “wiring pattern” may refer to the entire wiring pattern or to the wiring itself in the wiring pattern. Further, the continuous or conductive between two wiring patterns means that individual wirings in one wiring pattern are conductive or continuous with wirings in another wiring pattern. The contents of these terms should be construed broadly so as to be within the spirit of the invention.

  The second surface terminal portion is formed by one end portion of the second surface wiring pattern formed on the second surface, and the other end portion of the second surface wiring pattern is one side of the second surface. The other end portion of the first surface wiring pattern is located at the edge of one side of the first surface, and the inter-sheet surface conductive portion is an end surface of one side of the first surface and the second surface. Positioned above, the other end of the second surface wiring pattern and the other end of the first surface wiring pattern can be connected. As a result, the cushioning of the sheet and the flatness of the wiring pattern (no protrusions) make it difficult to damage the electrodes of the object to be inspected, and conduction can be ensured with a small load.

  Said sheet surface conduction | electrical_connection part can be made into the penetration conduction part which penetrates a sheet | seat, and a 2nd surface terminal part can be made into the edge part exposed to the 2nd surface of this conduction | electrical_connection part which penetrates. As a result, the wiring on the second surface can be made very compact. In this case, it is desirable that the conducting portion has a structure that does not hinder the cushioning property of the seat. For example, the conducting portion is constituted by electroless metal plating particles that adhere to the fibrils that constitute the wall surface in the through holes of the porous resin described later. Is desirable.

  The pitch of the second surface terminal portion can be different from the pitch of the first surface wiring pattern. Accordingly, reliable conduction can be established between the electrodes of the inspection device and the like in accordance with the narrowing of the pitch of the electrodes of the object to be inspected. For example, the arrangement of the second surface wiring pattern is relatively sparse in accordance with the arrangement pattern of the electrodes of the inspection apparatus or the mounted product, and a predetermined area on the first surface of the first surface wiring pattern is inspected. A dense arrangement can be made according to the electrode pitch of the body.

  At least the base sheet portion of the wiring of the first surface wiring pattern can protrude in a bowl shape. As a result, reliable conduction can be obtained with a smaller load.

  The sheet can be formed of a porous resin or a solid material having a compression modulus of 0.1 MPa or more and 300 MPa or less. Thereby, sufficient cushioning properties can be obtained. In the case of a solid material, if the elastic modulus is less than X1, the sheet is deformed by repeated use and the proper conduction is hindered, and if the elastic modulus exceeds X2, it becomes too hard and there is a high risk of scratching the electrode. . Examples of the solid material having a compression elastic modulus of 0.1 MPa to 300 MPa include various rubbers and olefin-based thermoplastic elastomers. In the case of a porous resin, except for a special resin, the overall elastic modulus is sufficiently low, the cushioning property is very high, and the durability is also combined, so that the elastic modulus is not limited.

  The above sheet can be formed of expanded polytetrafluoroethylene. As a result, a high-frequency signal can flow with low loss.

  A mounting module of the present invention is mounted on an electronic product, and includes any one of the above anisotropic conductive sheets and a mounted product connected to the second surface terminal portion of the anisotropic conductive sheet. . As a result, it is possible to obtain a mounting module including a driving IC and the like that can ensure reliable conduction without causing damage to electrodes of an electronic product such as a liquid crystal panel.

  An electronic product of the present invention includes the above-described mounting module. Thereby, a highly reliable electronic product can be obtained.

  An inspection apparatus according to the present invention is an inspection apparatus including any one of the above anisotropic conductive sheets, wherein the first surface wiring pattern of the anisotropic conductive sheet is connected to an electrode of an object to be inspected. And Thereby, it is possible to obtain a highly reliable inspection apparatus that does not cause any damage to the electrodes of the object to be inspected.

  The method for producing an anisotropic conductive sheet of the present invention is a process of forming a wiring pattern that extends toward one side on one surface of a double sheet that is insulating and cushioning in the thickness direction. And a step of bending the surface on which the wiring pattern is formed on the front side as a folding line in a direction intersecting the extending direction of the wiring pattern and fixing the bent state. Then, the wiring pattern on one surface in a bent and fixed state is a first surface wiring pattern, the wiring pattern on the other surface is a second surface wiring pattern, and the first surface wiring pattern and the second surface wiring A wiring portion connecting the pattern is a sheet-sheet conductive portion. Thereby, an anisotropic conductive sheet having high cushioning properties can be obtained. In addition, electrical connection between the inspection apparatus and the object to be inspected can be ensured.

  Another anisotropic conductive sheet manufacturing method of the present invention is a first-surface wiring pattern that extends toward one side on a first surface of a sheet that is insulating and cushioning in the thickness direction. Forming a second surface wiring pattern extending toward one side on the second surface of the sheet, and forming the first surface wiring pattern and the second surface on one end surface of the sheet. And a step of forming an inter-sheet conductive portion that connects the two-sided wiring pattern. Thereby, it is possible to make the electrodes of the object to be inspected less likely to be damaged. In addition, electrical connection between the inspection apparatus and the object to be inspected can be ensured.

  Another method for producing an anisotropic conductive sheet according to the present invention includes a step of forming a first surface wiring pattern on a first surface of a sheet that is insulative and cushioning in a thickness direction, and a through hole in the sheet. And forming a through conduction portion from the first surface to the second surface in the through hole, wherein the first surface wiring pattern and the through conduction portion are electrically connected. As a result, the wiring pattern on the second surface can be formed very easily.

The predetermined portion of the first surface wiring pattern and the predetermined portion of the second surface wiring pattern or the pattern of the end of the conductive portion can be formed at different pitches. Thereby, it is possible to easily cope with the narrowing of the pitch of the electrodes of the inspection object such as the liquid crystal panel.
The wiring pattern on the first surface and / or the second surface is preferably formed by a photolithography process or an ink jet method. According to these methods, a fine wiring pattern can be formed accurately.

  According to the present invention, it is possible to cause damage to the electrodes of the object to be inspected after ensuring conduction between the electrodes of the liquid crystal panel, the printed circuit board or the like (inspected object) and the electrodes of the inspection apparatus or the mounted product. An anisotropic conductive sheet or the like can be obtained.

(Embodiment 1)
FIG. 1 is a diagram showing an anisotropic conductive sheet 10 according to Embodiment 1 of the present invention. In the anisotropic conductive sheet 10, the double sheet 11 is bent in the sheet 1, and the bent state is fixed by a fixing means (adhesion, fixture, etc.) S to function as a single sheet 1. That is, as shown in FIG. 2, the anisotropic conductive sheet 10 is formed by bending the double sheet 11 so that the folding line K forms one side. Sheet 1 has three sides. The first surface 1a which is one surface, the second surface 1b which is the other surface, and the end surface 1c. It is preferable that the angle formed between the first surface 1a and the end surface 1c and the angle formed between the second surface 1b and the end surface 1c be a right angle.
A first surface wiring pattern 3a is formed on the first surface 1a, and a second surface wiring pattern is formed on the second surface 1b. On the end face 1c, a sheet-to-sheet conduction portion 3c for conducting the first-surface wiring pattern 3a and the second-surface wiring pattern is formed. These first-surface wiring pattern 3a / sheet-to-sheet conductive portion 3c / second-surface wiring pattern are formed integrally and continuously on the surface 1a, 1c, 1b of the double sheet, and each wiring pattern 3a, There is no interface between 3b and the sheet surface conduction part 3c, and it is an integrated object. The fold line K constitutes one side of the sheet 1, and the first-surface wiring pattern 3a and the second-surface wiring pattern 3b extend so as to go to this one side. As will be described in detail later, for example, the first-surface wiring pattern 3a is pressed against the electrode of the liquid crystal panel, and the second-surface wiring pattern 3b is in contact with the electrode of the inspection device, thereby providing electrical connection between the inspection device and the liquid crystal panel. Used to take. The second surface wiring pattern 3b constitutes a second surface terminal portion. In the case of inspection by such an inspection device, or when a mounted product is mounted on an electronic product or the like, the anisotropic conductive sheet 10 receives a compressive load from above and below, and the upper and lower devices sandwiching the anisotropic conductive sheet 10 or Used to exert a repulsive force (reaction force) on parts.

For the sheet 1 (11), it is preferable to use a porous resin or a solid material having a compression modulus of 0.1 MPa to 300 MPa. In the case of a porous resin, it is preferable to use a biaxial stretching or uniaxial stretching. For these porous resins, fluorine rubber, silicone rubber, urethane rubber, polytetrafluoroethylene (PTFE), olefinic thermoplastic elastomer, ultra-low density polyethylene with a density of 0.91 g / cm ² or less, syndiotactic 1,2 -Any one of terpolymers of polybutadiene, tetrafluoroethylene / hexafluoropropylene / vinylidene fluoride, or a mixture of two or more of these thermoplastic polymers may be used. it can. The pore formation is preferably performed by an extraction method or a stretching method.
Also in the case of solid materials, fluoro rubber, silicone rubber, urethane rubber, olefinic thermoplastic elastomer, ultra low density polyethylene having a density of 0.91 g / cm ² or less, syndiotactic 1, which satisfies the above elastic modulus range Use any one of 2-polybutadiene, tetrafluoroethylene / hexafluoropropylene / vinylidene fluoride terpolymer, or a mixture of two or more of these thermoplastic polymers. Can do.
The same applies to the sheet material of the anisotropic conductive sheet 10 according to the second embodiment or later described later with respect to the porous resin or the solid material of the sheet material.
The range of the thickness of the double sheet 11 is preferably in the range of 0.05 mm to 0.5 mm. Therefore, the thickness range of the sheet 1 shown in FIG. 1 is preferably set to 0.1 mm to 1 mm in consideration of the fact that the gap formed by bending is almost zero, or considering that the sheet is slightly compressed by the fixing means S. The thickness range of the single sheet without bending after the second embodiment described later is also preferably 0.1 mm to 1 mm. The thickness range of the wiring patterns 3a, 3b, 3c is preferably 0.1 mm to 1 mm, which is the same as that of the sheet 1. The gap between the wirings depends on the electrode arrangement of the electronic product or the like, but is usually less than 100 μm. Although the wiring width depends on the electrode width of the electronic product, it is often about 100 μm or less. The dimensions of the wiring in the wiring pattern are the same for the wiring of the anisotropic conductive sheet 10 according to the second embodiment or later described later.

  As described above, the sheet 1 or the double sheet 11 is originally formed of a porous resin having a high cushioning property or a solid material having a predetermined compressive elastic modulus. In other words, a higher cushioning property can be obtained. For this reason, even if the portion of the second surface wiring pattern 3b is impacted against an electrode of an electronic product such as a liquid crystal panel, the impact load is absorbed by the highly cushioning anisotropic conductive sheet 10. . Also, stress dispersion (removal of stress concentration points) due to the flatness of the first wiring pattern 3a also works effectively. As a result, there is no possibility that the electrodes such as the liquid crystal panel are damaged. In addition, there is no so-called interface between each wiring pattern 3a, 3b and the sheet surface conducting portion 3c, and it is an integrated object, and a single wiring is simply divided into regions and given names. The conduction of the wiring in the anisotropic conductive sheet 10 is reliable.

  As described above, a porous resin or a solid material having a compressive modulus of 0.1 MPa to 300 MPa is used as the material of the sheet 1 or the double sheet. In particular, by using PTFE, a high-frequency signal is used. Loss can be suppressed in the electronic device used for transmitting the current. PTFE has a relative permittivity of less than 2.1 and a dielectric loss tangent of 0.0002 with respect to high frequencies in the megahertz region, and it is much less likely to propagate high frequency signals compared to other resins. For this reason, when conducting a high frequency signal between electrodes, it does not leak into the sheet | seat 1 (11) and flow out. Therefore, in the case of an inspection device or an electronic product that conducts a high-frequency signal, it is preferable to use a PTFE sheet 1 (11).

Next, two manufacturing methods of the anisotropic conductive sheet 10 shown in FIG. 1 will be described.
(Photolithography method):
As shown in FIG. 3A, a resist film 41 is formed by applying a resist solution to a double sheet 11 formed of a porous resin or a material having a predetermined range of elastic modulus. Next, as shown in FIG. 3B, UV exposure is performed using a photomask pattern (reticle). Thereafter, through a process such as development, a resist pattern 41 having an opening 41h is obtained on the double sheet 11 as shown in FIG. The double sheet 11 with the resist pattern 41 is subjected to electroless plating such as copper or electrolytic plating to form wiring patterns 3a, 3b and 3c on the double sheet 11 corresponding to the opening 41h. In order to make use of the cushioning property of the sheet 1 and not to increase the hardness or rigidity of the wiring, it is desirable to form a wiring pattern by electroless plating. The thickness of the wiring 3a, 3b, 3c can obtain sufficiently high accuracy by controlling the immersion time in the electroless plating process. Thereafter, when the resist pattern 41 is removed, the one shown in FIG. 2 is obtained. Thereafter, bending is performed to obtain the anisotropic conductive sheet 10 shown in FIG.
(Inkjet method):
As shown in FIG. 4, an ink jet is emitted from a nozzle 45 provided in the ink container to form wiring patterns 3 a, 3 b, 3 c on the double sheet 11. The ink contains conductive particles, and the ink jet adheres to the double sheet 11 and comes into contact with each other after drying so as to have conductivity along the wiring. The material, particle diameter, content ratio, etc. of the conductive particles can be adjusted according to the line width of the wiring and the sheet material. After forming the wiring pattern, it is bent to obtain the anisotropic conductive sheet 10 shown in FIG.
The above two methods can be used for the production of anisotropic conductive sheets according to the second and subsequent embodiments. Further, the manufacturing method is not limited to the two illustrated above, and other manufacturing methods may be used.

(Embodiment 2)
FIG. 5 is a diagram showing the anisotropic conductive sheet 10 according to Embodiment 2 of the present invention. In the anisotropic conductive sheet 10, the sheet surface conductive portion 3 c is formed by wiring on the end surface 1 c. A cross-sectional view of the wiring pattern 3c on the end face 1c is shown in FIG. 6 (a) or (b). In FIG. 6A, the wiring 3c on the end surface 1c extends so as to define the ends of the wirings 3a and 3b. In FIG. 6B, the wirings 3a and 3b sandwich the end surface wiring 3c. It extends like so. Although not shown, the interfaces between the wirings 3a and 3b and the wiring 3c are inclined with respect to the sheet surfaces 1a and 1b, that is, in an intermediate mode between FIGS. 6A and 6B. The sheet surface connection part 3c may be sufficient.
As the material and dimensions of the sheet 1 and the formation method and dimensions of the wirings 3a, 3b, and 3c, those described in the first embodiment are applied. Further, the second surface wiring pattern 3b constitutes the second surface terminal portion as in the first embodiment. Regarding the function and effect, a bent sheet is not used, but a sufficiently high cushioning property is ensured, and the flatness of the first wiring pattern prevents the electrodes of electronic products such as a liquid crystal panel from being damaged.
In the anisotropic conductive sheet 10 in the present embodiment, the first surface wiring pattern 3a and the second surface wiring pattern 3b can be formed by any one of the two methods described in the first embodiment. As shown in FIG. 7, the wiring 3c on the end surface 1c or the sheet surface conductive portion is formed by stacking a plurality of sheets 1 to form a laminate, and wiring is performed on the entire end surface 1c by, for example, an ink jet method. It is good to form. By overlapping, the length of the wiring 3c on the end face increases, and it becomes easy to draw the wiring by an inkjet method or the like. Moreover, you may arrange | position the dummy used as a run when drawing wiring to the uppermost surface (top) or lowermost surface (bottom) of said laminated body. As for the dummy, when the wiring 3c is continuous and it is difficult to separate adjacent sheets, a separation dummy sheet formed of a material that can be easily separated including the wiring 3c is inserted between the adjacent sheets. May be. The wiring patterns 3a and 3b on the first surface and the second surface may be formed before (1) forming the wiring 3c on the end surface 1c, or (2) after forming the wiring 3c on the end surface 1c. You may form in. Both (1) and (2) can have the wiring structure on the end face of FIG. 6A or 6B, or an intermediate structure thereof.

(Embodiment 3)
FIG. 8 is a diagram showing the anisotropic conductive sheet 10 according to Embodiment 3 of the present invention. In the anisotropic conductive sheet 10 of FIG. 8A, the end on the second surface side of the through conduction portion 3c is the second surface terminal portion 3b. On the other hand, in FIG.8 (b), the 2nd surface wiring pattern 3b is formed continuously with the edge part of the penetration conduction | electrical_connection part 3c, and, thereby, the 2nd surface terminal part is comprised. Either case is included in the present embodiment. In any anisotropic conductive sheet 10, for example, the terminal portion 3 b (3 c) or the wiring pattern 3 b on the second surface is applied to the electrode of the inspection apparatus or the mounted product, and the first surface wiring pattern 3 a is applied to the liquid crystal panel or the like. Apply to electrode.
FIG. 9 is a perspective view showing the first wiring pattern 3a on the first surface 1a. If the anisotropic conductive sheet of FIG. 8A is used, the arrangement of the terminal portions 3b on the second surface 1b side is alternately arranged in a staggered manner, so the arrangement interval of the first surface wiring pattern 3a is changed. It can be larger than the interval. For this reason, for example, by connecting the second surface side to the inspection device and connecting the first surface side to the electronic product, it becomes easy to cope with the trend of fine pitching of the electrodes in the electronic product.
The sheet manufacturing method, material, dimensions, etc., and the dimensions and manufacturing methods of the wirings 3a, 3b, 3c apply those described in the first embodiment. In addition, about the formation method of the penetration conduction | electrical_connection part 3c, it discloses by many patent documents by the present inventors, and it can form a penetration conduction | electrical_connection part easily referring to it. As for the opening of the through hole, a femtosecond pulse laser may be used due to recent progress in laser processing technology. Based on the material and thickness of the sheet, since the sheet 1 is rich in cushioning and the first surface wiring pattern is flat, the first surface wiring pattern 3a electrode is not damaged.

(Embodiment 4)
FIG. 10 is a diagram showing an anisotropic conductive sheet 10 according to Embodiment 4 of the present invention. In this anisotropic conductive sheet 10, the pitches of the first-surface wiring pattern 3a and the second-surface wiring pattern 3b are different and narrow in the first-surface wiring pattern 3a. The wiring 3c of the sheet-to-sheet conduction portion that connects the second-surface wiring pattern 3b having a large interval and the first-surface wiring pattern 3a having a small interval is tapered from the large interval to the small interval. In this embodiment, the transition portion of the interval change is located on the end face 1c, and is shared by the wiring 3c on the end face. However, the transition portion of the interval change may be located on the first surface 1a or may be located on the second surface 1b. Further, the end surface 1c and the first surface 1a or the second surface 1b may be shared by both surfaces or three surfaces. This means that in the wirings 3a, 3b, and 3c on the double sheet 11 shown in FIG. 11, in which part the transition portion (taper forming portion) of the interval is arranged, the essence in the present embodiment. is not.

Such a conversion of the pitch of the electrodes was confirmed also in the anisotropic conductive sheet 10 of FIG. 9 in the third embodiment. However, in the present embodiment, the pitch in the pitch conversion can be freely selected. The anisotropic conductive sheet 10 is thorough. For this reason, the anisotropic conductive sheet 10 suitable for any fine pitch of the electrodes can be provided by reliably following the fine pitch of the electrodes of the electronic product such as the liquid crystal panel.
The sheet manufacturing method, material, dimensions, etc., and the dimensions and manufacturing methods of the wirings 3a, 3b, 3c apply those described in the first embodiment. Based on the material and thickness of the sheet, since the sheet 1 is rich in cushioning properties, the wiring patterns 3a and 3b do not damage the electrodes.
In addition, about the anisotropic conductive sheet in Embodiment 2, it is easy to change a pitch with a 1st surface and a 2nd surface like this Embodiment. Further, the second-surface wiring pattern 3b and the first-surface wiring pattern 3a of FIG. 8B in the third embodiment can be easily configured as the anisotropic conductive sheet of the present embodiment. . In this case, for example, the transition portion of the interval change may be positioned on the first surface. The above-described modification of the second embodiment (or the combination of the fourth embodiment and the second embodiment) and the modification of the third embodiment (or the combination of the fourth embodiment and the third embodiment) ) Is included within the scope of the present invention.

(Embodiment 5)
FIG. 12 is a diagram showing anisotropic conductive sheet 10 according to Embodiment 5 of the present invention. In the anisotropic conductive sheet 10 of the present embodiment, the sheet 1 (11) is configured by the base portion T on which the wirings 3a and 3b are placed and the thin portion B of the remaining region including the periphery thereof. There is a feature. Since the trapezoidal portion T extends along the wirings 3a and 3b, it can be said that it protrudes like a bowl. Due to the formation of the trapezoidal portion T or the thin-walled portion B in the remaining region, the portion that receives the compressive load at the time of inspection becomes the trapezoidal portion T, so that conduction can be achieved with a smaller load.

  A method for manufacturing the anisotropic conductive sheet 10 shown in FIG. 12 is shown in FIGS. 13 and 14. A sheet having wiring patterns 3a, 3b, 3c formed on a double sheet 11 is prepared, and a thin portion is formed around the wirings 3a, 3b in a region other than the wirings 3a, 3b by press compression. B is formed. The trapezoidal portion T is preferably formed so as to maintain the original sheet thickness before pressing. In other words, the base portion T is not subjected to deformation such as strain by press compression. For example, by using a porous resin, press compression limited to the thin wall portion B becomes possible. As for the press working, cold pressing at room temperature is preferable from the viewpoint of improving dimensional accuracy and reducing man-hours.

The sheet manufacturing method, material, dimensions, etc., and the dimensions and manufacturing methods of the wirings 3a, 3b, 3c apply those described in the first embodiment. Based on the material and thickness of the sheet, since the sheet 1 is rich in cushioning properties, the wiring patterns 3a and 3b do not damage the electrodes.
In addition, about the anisotropic conductive sheet in Embodiment 2, it can be easily comprised by the base part T and the thin part B like this Embodiment. Further, it is easy to configure the anisotropic conductive sheet of FIGS. 8A and 8B in Embodiment 3 like the anisotropic conductive sheet of the present embodiment. The above-described modification of the second embodiment (or the combination of the fifth embodiment and the second embodiment) and the modification of the third embodiment (or the combination of the fifth embodiment and the third embodiment) ) Is included within the scope of the present invention. In both examples of the combination, except for the fixing means S in the bent state in FIG. 12, it displays a cross-sectional view of the anisotropic conductive sheet 10 of the combination invention.

(Embodiment 6)
FIG. 15 is a cross-sectional view showing anisotropic conductive sheet 10 according to Embodiment 6 of the present invention or inspection device 70a using the same. An electronic product 50 such as a liquid crystal panel is temporarily fixed to a fixed table 75. The inspection head 73 of the inspection apparatus 70 is inserted through the alignment shaft 79 and approaches the electronic product 50 along the alignment shaft. An anisotropic conductive sheet 10 is inserted between the inspection head 73 and the electronic product 50. As the anisotropic conductive sheet 10, the anisotropic conductive sheet 10 of any one of Embodiments 1 to 5 or a combination thereof can be used. The electrode 74 of the inspection head 73 faces the second surface wiring pattern 3b of the anisotropic conductive sheet 10, and the electrode 54 of the electronic product faces the first surface wiring pattern 3a of the anisotropic conductive sheet 10. is doing. Due to the approach of the inspection head 73, the opposing electrodes 74 and 54 and the wiring patterns 3b and 3a come into contact with each other and receive pressure. The electrode 74 of the inspection head 73 of the inspection apparatus 70 is electrically connected to the electrode 54 of the electronic product 50 with the anisotropic conductive sheet 10 interposed therebetween, and collects necessary voltage and current data. These data are analyzed by the control / analysis unit 71.

  In FIG. 15, the anisotropic conductive sheet 10 is attached to the inspection apparatus 70 and can be regarded as an inspection apparatus 70 a with an anisotropic conductive sheet. Such an inspection apparatus 70a with an anisotropic conductive sheet includes the sheet 1 having a high cushioning property and the flat first surface wiring pattern 3a, so that the impact is reduced and the scratch is prevented at the time of the contact. . For this reason, reliable conduction can be obtained without damaging the electrode 54 of the electronic product 50. Since the anisotropic conductive sheet 10 can also change the pitch between the first-surface wiring pattern 3a and the second-surface wiring pattern 3b, the electrode arrangement changes depending on the model of the electronic product 50. In this case, there is a possibility that this can be accommodated without changing the arrangement of the electrodes 74 of the inspection head 73 of the inspection apparatus 70.

(Embodiment 7)
FIG. 16 is a front view showing anisotropic conductive sheet 10 according to Embodiment 7 of the present invention, mounting module 20a using the same, or electronic product 50a including the mounting module. The mounted product 20 includes a semiconductor chip such as a driving IC and a TAB on which the chip is mounted. The electronic product 50 such as a liquid crystal panel is the same as the electronic product shown in FIG. An anisotropic conductive sheet 10 is interposed between the mounted product 20 and the electronic product 50. As the anisotropic conductive sheet 10, the anisotropic conductive sheet 10 of any one of Embodiments 1 to 5 or a combination thereof can be used. The mounted product 20 is brought closer to the electronic product 50 by the urging force, and the anisotropic conductive sheet 10 is compressed. As a result, the contact between the electrode 24 of the mounted product / the second surface wiring pattern 3b of the anisotropic conductive sheet and the contact of the first surface wiring pattern 3a of the anisotropic conductive sheet / the electrode 24 of the electronic product are Get up together. At the time of this contact, the impact is reduced due to the high cushioning property of the seat 1 and the flat first surface wiring pattern 3a.

  In FIG. 16, the mounted product 20 can be regarded as a mounted product 20a with an anisotropic conductive sheet. Further, the electronic product 50 can be regarded as an electronic product 50a including the mounting product 20a with an anisotropic conductive sheet. By providing the anisotropic conductive sheet 10, (1) relaxation of the impact and, as a result, prevention of electrode damage can be obtained. (2) Furthermore, the arrangement change of the electrodes 24 of the electronic component 20 or an electronic product can be obtained. When the arrangement change of the 50 electrodes 54 occurs, there is a possibility that the change can be absorbed by the change of the wiring pattern on the first surface and / or the second surface by using the anisotropic conductive sheet 10. is there. As a result, there may be a case where it is not necessary to cause a large change in the arrangement of the electrodes 24 of the mounted product 20.

  Although the embodiments of the present invention have been described above, the embodiments of the present invention disclosed above are merely examples, and the scope of the present invention is not limited to these embodiments. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  According to the present invention, it is possible to cause damage to the electrodes of the object to be inspected after ensuring conduction between the electrodes of the liquid crystal panel, the printed circuit board or the like (inspected object) and the electrodes of the inspection apparatus or the mounted product. An anisotropic conductive sheet or the like can be obtained, which can contribute to the fields of inspection and mounting.

It is a perspective view which shows the anisotropic conductive sheet in Embodiment 1 of this invention. It is a figure which shows the state which formed the wiring pattern in the double-sized sheet | seat in order to manufacture the anisotropic conductive sheet of FIG. 2 shows a method of manufacturing a wiring pattern by a photolithography method of an anisotropic conductive sheet in Embodiment 1, wherein (a) shows a state where a resist is applied, (b) shows a state of UV exposure, (c) shows development, etc. It is a figure which shows the state in which the resist pattern was formed by. 3 is a diagram illustrating a method for manufacturing a wiring pattern by an inkjet method of an anisotropic conductive sheet in Embodiment 1. FIG. It is a perspective view which shows the anisotropic conductive sheet in Embodiment 2 of this invention. FIG. 6 is a cross-sectional view of the end face of the anisotropic conductive sheet of FIG. 5, (a) when the wiring on the end face defines a wiring pattern on the first surface and the second surface, (b) It is a figure which shows when the wiring pattern of a 2nd surface pinches | interposes the wiring on an end surface. It is a figure for demonstrating the method of forming the wiring on the end surface of the anisotropic conductive sheet of this Embodiment. It is sectional drawing which shows the anisotropic conductive sheet in Embodiment 3 of this invention, (a) makes a 2nd surface terminal part the edge part of a penetration conduction part, (b) shows a 2nd surface terminal part. The case where the second surface wiring pattern is used is shown. It is the perspective view which looked at the 1st surface of the anisotropic conductive sheet of FIG. It is a perspective view which shows the anisotropic conductive sheet in Embodiment 4 of this invention. It is a figure which shows the state which formed the wiring pattern in the double-sized sheet | seat in order to manufacture the anisotropic conductive sheet of FIG. It is sectional drawing which shows the anisotropic conductive sheet in Embodiment 5 of this invention. In manufacture of the anisotropic conductive sheet of FIG. 12, it is a figure which shows the state pressed using a metal mold | die to a double sized sheet. It is a figure which shows the double sheet | seat which received the press work with the metal mold | die in FIG. It is sectional drawing which shows the anisotropic conductive sheet and inspection apparatus in Embodiment 6 of this invention. It is a figure which shows the anisotropic conductive sheet in Embodiment 7 of this invention, a mounting module provided with the same, an electronic product, etc. FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 sheet | seat, 1a sheet | seat 1st surface, 1b sheet | seat 2nd surface, 1c sheet | seat end surface, 3a wiring pattern of 1st surface, 3b wiring pattern of 2nd surface, 3c sheet surface conduction | electrical_connection part (wiring pattern on a surface or through conduction) Part), 10 anisotropic conductive sheet, 11-fold sheet, 20 mounted product, 20a mounting module, 24 electrodes, 41 resist film or resist pattern, 41h opening, 45 inkjet nozzle, 50 electronic product, 50a mounted product , 54 electrode, 70 inspection device, 70a inspection device with anisotropic conductive sheet, 71 control / analysis unit, 73 inspection head, 74 electrode, 79 alignment axis, B thin part, K fold line, S fixing means (adhesive etc.), T trapezoidal part.

Claims (15)

An insulating sheet having cushioning properties in the thickness direction;
A first surface wiring pattern formed on a first surface which is one surface of the sheet;
A second surface terminal portion located on a second surface which is a surface opposite to the first surface;
An anisotropic conductive sheet comprising an inter-sheet conductive portion for conducting the first surface wiring pattern and the second surface terminal portion.   The sheet is formed by a double-size sheet fixed in a folded state, and the first surface and the second surface of the sheet correspond to one surface of the double-size sheet before being bent, and the second surface A surface terminal portion is formed by one end portion of the second surface wiring pattern formed on the second surface, and the other end portion of the second surface wiring pattern is at an edge of one side of the second surface. The first surface terminal portion is formed by one end portion of the first surface wiring pattern formed on the first surface, and the other end portion of the first surface wiring pattern is formed on the first surface. The sheet-surface conductive portion is located on an end surface that connects one side of the first surface and the second surface, and the other end portion of the second-surface wiring pattern. And the other end of the first surface wiring pattern, and the first surface wiring The turn, the sheet-surface conductive portion, and the second-surface wiring pattern are integrally and continuously formed on the one surface of the double-sized sheet. An anisotropic conductive sheet.   The second surface terminal portion is formed by one end portion of the second surface wiring pattern formed on the second surface, and the other end portion of the second surface wiring pattern is one side of the second surface. The other end of the first surface wiring pattern is located at the edge of one side of the first surface, and the sheet-sheet conductive portion is formed between the first surface and the second surface. 2. The device according to claim 1, wherein the second end portion of the second surface wiring pattern is connected to the second end portion of the first surface wiring pattern, the second end portion being located on an end surface of one side. An anisotropic conductive sheet.   The inter-sheet-surface conductive portion is a through-conductive portion that penetrates the sheet, and the second surface terminal portion is an end exposed on the second surface of the through-conductive portion, or a second continuous with the end. The anisotropic conductive sheet according to claim 1, wherein the anisotropic conductive sheet is an end portion of the planar wiring pattern.   The anisotropic conductive sheet according to claim 1, wherein a pitch of the second surface terminal portions and a pitch of the first surface wiring pattern are different.   The anisotropic conductive sheet according to claim 1, wherein at least a base sheet portion of the wiring of the first-surface wiring pattern protrudes in a hook shape.   The anisotropy according to any one of claims 1 to 6, wherein the sheet is made of a porous resin or a solid material having a compression modulus of 0.1 MPa to 300 MPa. Conductive sheet.   The anisotropic conductive sheet according to claim 1, wherein the sheet is formed of expanded polytetrafluoroethylene.   It is a module mounted in an electronic product, Comprising: The anisotropic conductive sheet of any one of Claims 1-8, and the mounted product connected to the said 2nd surface terminal part of the said anisotropic conductive sheet And a mounting module.   An electronic product comprising the mounting module according to claim 9.   An inspection apparatus comprising the anisotropic conductive sheet according to any one of claims 1 to 8, or the mounting module according to claim 9, wherein the first surface wiring pattern of the anisotropic conductive sheet is An inspection apparatus connected to an electrode of an object to be inspected. A process of forming a wiring pattern that extends toward one side on one surface of the double sheet that is insulating and cushioning in the thickness direction;
With the surface on which the wiring pattern is formed being the front side, folding the direction intersecting the extending direction of the wiring pattern as a fold line, and fixing the bent state,
The wiring pattern on one surface in the bent and fixed state is a first surface wiring pattern, the wiring pattern on the other surface is a second surface wiring pattern, and the first surface wiring pattern and the second surface wiring pattern. A method for producing an anisotropic conductive sheet, characterized in that a wiring portion connecting the two is used as an inter-sheet conductive portion. Forming a first surface wiring pattern that extends toward one side on the first surface of the insulating and cushioning sheet in the thickness direction;
Forming a second surface wiring pattern extending toward the one side on the second surface of the sheet;
Forming an inter-sheet-surface conductive portion that connects the first-surface wiring pattern and the second-surface wiring pattern on an end surface of one side of the sheet. Production method. Forming a first surface wiring pattern on a first surface of a sheet that is insulating and cushioning in the thickness direction;
Forming a through-hole in the sheet, and forming a through-conductive portion extending from the first surface to the second surface in the through-hole, or a wiring pattern continuing to the end of the through-conductive portion, and
The method for producing an anisotropic conductive sheet, wherein the first surface wiring pattern and the through conduction portion are conducted. 15. The end side portion of the first surface wiring pattern and the end side portion of the second surface wiring pattern or the end pattern of the conductive portion are formed at different pitches. The manufacturing method of the anisotropic conductive sheet of any one of these.

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