JP2010108984A - Method of manufacturing printed circuit board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a method of manufacturing a printed circuit board which prevents permeation of chemical to the mating surface during the process and prevents delamination even after high temperature treatment. <P>SOLUTION: The method of manufacturing the printed circuit board includes a step of stacking two sets of structure, each having a metal foil applied to one side of a laminate consisting of a predetermined number of prepregs, through a mold release material so that the laminate of prepregs is located on the inside and for hot pressing them to produce a 2-ply laminate board which is clad with metal foil on one side, a step of carrying out multilayer treatment for the metal foil surface of the 2-ply laminate board which is clad with metal foil on one side by forming a circuit, treating the inner layer and performing interlayer connection, a step of stripping the mold release material, and a step of forming a circuit on the surface of the multilayered outermost layer and the surface from which the mold release material is stripped. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to a method for manufacturing a printed wiring board.

  In recent years, with the progress of miniaturization and thinning of PKG substrates, the most advanced printed wiring board manufacturing methods, such as coreless substrates, have prepreg and build-up resin insulation on one side with a carrier-supported copper foil or substrate as a support. A method of stacking sheets to form a printed wiring board has been considered. However, since this manufacturing method often uses a thin laminated plate, the yield may be significantly reduced due to problems such as winding and cracking when the process is performed. In addition, since the structure is repeatedly stacked on one side, the structure becomes asymmetrical, and it is highly likely that the process cannot easily flow in one direction.

  The problem with the printed wiring board manufacturing method is the deterioration of handling and workability. In order to solve these problems, for example, as disclosed in Japanese Patent Application Laid-Open No. 2000-91732, a prepreg is sandwiched between release films having a small size, and a metal-clad laminate is disposed and laminated on the outside thereof, and after multilayering on both sides, By cutting the adhesive portion around the substrate, it can be peeled off and two laminated plates can be produced simultaneously. However, this method has problems such as difficulty in peeling when the position of the release film is displaced during lamination, and an increase in the number of lamination processes.

  Further, for example, there is a manufacturing method in which multiple layers are formed while forming adhesive portions on both sides of a reinforcing substrate as in the former patent as disclosed in JP-A-2007-90581. However, this method also makes it difficult to peel off when the position of the release film (in this case, using an ultra-thin copper foil with a carrier) is shifted during lamination, and because the substrate is used, Compared to film, the cost may be higher. Therefore, for example, it is conceivable to use relatively inexpensive aluminum as a mold release material instead of the reinforcing substrate as disclosed in JP-A-7-302977. However, when aluminum is used and two sheets are put together in each process, the chemical used in the process may ooze into the mating surface of the two-sheet mating single-sided plate and the release material (hereinafter referred to as the mating surface). . There is a process of cleaning the chemical components adhering to each process, but the chemical liquid that has soaked into the mating surfaces remains difficult to remove by normal cleaning, and there is a problem of contaminating the chemical liquid in other processes. In circuit processing, there is also a problem that aluminum as a release material is dissolved.

  Further, for example, when a release film is used as a release material as disclosed in JP-A-2007-90581, the above-described problems such as penetration of a chemical solution and dissolution of the release material can be solved. However, there is a problem in that the mating surface peels off or the adhesive strength decreases due to the shrinkage of the release film in a high temperature process such as a multilayer press or drying.

JP 2000-91732 A JP 2007-90581 A Japanese Patent Application Laid-Open No. 7-302977

  The present invention provides a printed wiring board manufacturing method that eliminates the problems of the above-described method, prevents the chemical solution from seeping into the mating surface during the process, and does not cause peeling even after high-temperature processing.

The present invention is as follows.
1. Two pieces of a prepreg laminate with two metal foils laminated on one side, with the prepreg laminate on the inside, stacked via a release material, and heated and pressed to form a single-sided metal foil-clad laminate A step of forming a multilayer on the metal foil surface of the two-sheet laminated single-sided metal foil-clad laminate by circuit formation, inner layer treatment, interlayer connection, a step of peeling the release material, and multilayering And a step of forming a circuit on the outermost layer surface and the surface from which the release material has been peeled off.
2. A process of producing a two-ply buildup resin insulation sheet by stacking two sets of buildup resin insulation sheets of a predetermined number via a release material and heating and pressurizing, and on one side of the two-ply buildup resin insulation sheet , Circuit forming, inner layer processing, a step of performing multilayer processing by interlayer connection, a step of peeling the release material, and a step of forming a circuit on the outermost layer surface and the surface from which the release material has been peeled. A method for manufacturing a wiring board.
3. The method for producing a printed wiring board as described above, wherein a release material having a thermal shrinkage rate of 1.5% or less in the range of 100 to 250 ° C. is used as the release material.
4). The method for producing a printed wiring board as described above, wherein a release material having a reduction rate of elongation after heating and pressing is 50% or less is used as the release material.
5). The manufacturing method of the said printed wiring board whose temperature of a heating pressurization is the range in 100-250 degreeC.
6). The method for producing a printed wiring board as described above, wherein the release material has a thickness of 10 μm or more and 200 μm or less.

  According to the present invention, in each process, there is no permeation of chemicals to the mating surfaces, and separation does not occur even at high temperatures, based on a two-layered single-sided metal foil-clad laminate or a two-layered build-up resin insulation sheet. A printed wiring board manufacturing method can be provided.

  As the metal foil used in the present invention, a metal foil used for an ordinary printed wiring board, for example, a copper foil can be used, but there is no particular limitation. The copper foil may be either an electrolytic copper foil or a rolled copper foil, and the thickness is not particularly limited. A copper foil having a thickness of 105 μm or less, which is generally used for a printed wiring board, may be used, or a peelable copper foil may be used. Instead of the peelable type, an etchable type copper foil having an aluminum carrier or a nickel carrier can also be used. Furthermore, the copper foil generally used for printed wiring boards is subjected to a roughening treatment. However, in the present invention, such a copper foil can be used and is not subjected to the roughening treatment. But it does n’t matter.

  Examples of the prepreg used in the present invention include phenolic resins, polyester resins, epoxy resins, cyanato resins, thermosetting polyimide resins, other thermosetting resins, and resin compositions for matrix such as two or more kinds thereof. Glass (E glass, D glass, S glass, T glass, quartz glass (= quartz glass), etc.), ceramics (alumina, boron nitride, etc.), wholly aromatic polyamide, polyphenylene sulfide, polyetherimide, Base materials such as fibers, woven fabrics or non-woven fabrics using chops, etc., one or two or more types of polyimide, cell carbon, other heat resistant engineering plastics, etc. It is impregnated, coated or adhered to a reinforcing substrate) Those configured using the are exemplified.

  The resin composition for matrix of the prepreg may contain an inorganic filler for improving reliability. The inorganic filler is not particularly limited, and examples thereof include silica, fused silica, talc, alumina, aluminum hydroxide, barium sulfate, calcium hydroxide, aerosil and calcium carbonate. The inorganic filler preferably contains those treated with various coupling agents such as a silane coupling agent for the purpose of improving dispersibility. These may be used alone or in combination of two or more. Silica is preferred from the viewpoint of dielectric properties and low thermal expansion.

  Further, the resin composition for a matrix of the prepreg may contain a thermoplastic resin in order to improve flexibility. Examples of the thermoplastic resin include, but are not limited to, fluororesin, polyphenylene ether, modified polyphenylene ether, polyphenylene sulfide, polycarbonate, polyether imide, polyether ether ketone, polyarylate, polyamide, polyamide imide, and polybutadiene. I don't mean. One type of thermoplastic resin may be used alone, or two or more types may be mixed and used. In the prepreg matrix resin composition, additives such as a coupling agent, a pigment, a leveling agent, an antifoaming agent, and an ion trapping agent may be blended as necessary.

  The build-up resin insulation sheet used in the present invention is for a matrix such as a phenol resin, a polyester resin, an epoxy resin, a cyanate resin, a thermosetting polyimide resin, other thermosetting resins, and two or more kinds of these compositions. An insulating film with a support can be formed by applying the resin composition to at least one side of the support and semi-curing it. Examples of the support include metal foils such as copper and aluminum, and resin carrier films such as polyester and polyimide.

  The resin composition for a matrix of the build-up resin insulation sheet may contain an inorganic filler for improving reliability. The inorganic filler is not particularly limited, and examples thereof include silica, fused silica, talc, alumina, aluminum hydroxide, barium sulfate, calcium hydroxide, aerosil and calcium carbonate. Inorganic fillers include those treated with various coupling agents such as silane coupling agents for the purpose of enhancing dispersibility. These may be used alone or in combination of two or more. Silica is preferred from the viewpoint of dielectric properties and low thermal expansion.

  The matrix resin composition may contain a thermoplastic resin in order to improve flexibility. Thermoplastic resins include fluororesin, polyphenylene ether, modified polyphenylene ether, polyphenylene sulfide, polycarbonate, polyether imide, polyether ether ketone, polyarylate, polyamide, polyamide imide, polybutadiene, carboxylic acid modified acrylonitrile butadiene rubber particles, polyvinyl acetal. Examples thereof include, but are not limited to, resins and carboxylic acid-modified polyvinyl acetal resins. One type of thermoplastic resin may be used alone, or two or more types may be mixed and used.

  Additives such as coupling agents, pigments, leveling agents, antifoaming agents, and ion trapping agents may be blended in the matrix resin composition of the build-up resin insulation sheet, if necessary.

  The release material is generally in the form of a film or a sheet. Plastic or metal that can be easily peeled off from the cured prepreg even after the prepreg and copper foil are laminated on both sides and laminated to form a cured resin. The film or sheet is preferred. Specifically, polyphenylene sulfide, polyphenylene oxide, polysulfone, polyethersulfone, polyphenylenesulfone, polyetherimide, polyimide, polyamideimide, polyamide, polycarbonate, polyarylate, polyetherketone, polyetheretherketone, polyacetal, cellulose acetate, Polypropylene, poly-4-methylpentene-1, polyethylene terephthalate, polyvinylidene fluoride, polyethylene naphthalate, polytetrafluoroethylene, and derivatives of these resins, other plastic films, metal films or sheets of stainless steel, aluminum, brass, etc. These are coated with a release agent, and these plastic films, metal films or sheets have a release property. That form the plastic layer.

  In order to adjust the adhesion, the release material may be subjected to a surface roughening treatment (matte treatment). The thickness of the release material is usually appropriately selected from 10 μm to 200 μm. When the thickness is less than 10 μm, the strength of the release material is insufficient, and the release material may be broken when the two-sheet laminated single-sided metal foil-clad laminate is separated. Moreover, the handling at the time of constructing a two-sheet single-sided metal foil-clad laminate material is also poor. Moreover, when it exceeds 200 micrometers, it is unpreferable from the surface of availability or a price.

  As the release material, it is preferable to use a release material having a heat shrinkage rate of 1.5% or less in the range of the heating temperature in the pressing step or the laminating step of the printed wiring board manufacturing method. Therefore, it is preferable to use a release material having a heat shrinkage rate of 1.5% or less in the range of 100 to 250 ° C., and a heat shrinkage rate of 0.01 to 1.2%. More preferably. In addition, the mold release material whose heat shrinkage rate in the range of 150-200 degreeC is 1.5% or less may be sufficient.

  Moreover, as a mold release material, it is preferable to use a mold release material having an elongation reduction rate of 50% or less after a heating and pressing step such as a pressing step or a lamination step, and further, an elongation reduction rate of 1 to 20 is used. % Is more preferable. In general, the heating temperature range in the pressing step or laminating step of the method for producing a printed wiring board is 100 to 250 ° C., and the pressure range is 0.0001 to 10 MPa.

An ultrathin metal layer may be provided on the surface of the film used for the release material in order to suppress the heat shrinkage rate. For example, there are a method of pressing an extremely thin metal foil and a method of depositing metal on the surface.
In addition, a plurality of films used for the release material may be used in order to facilitate separation of the produced two-layer laminated multilayer printed wiring board.

  Using the above molding material, a two-ply single-sided metal foil-clad laminate or a two-ply build-up resin insulation sheet, which is the basis of the method for producing a printed wiring board of the present invention, is produced. The manufacturing method consists of stacking two metal foils on one side of a predetermined number of prepreg laminates, placing the prepreg inside, stacking them with a release material, inserting between two end plates, and applying heat and pressure. A two-sheet single-sided metal laminate is produced. The conditions for heating and pressing differ depending on the prepreg resin. For example, when a glass cloth base epoxy resin prepreg is used, the temperature is 150 to 250 ° C. and the pressure is 0.5 to 8.0 MPa. Alternatively, two sets of build-up resin insulation sheets of a predetermined number are stacked with a build-up resin insulation sheet on the inside, stacked via a release material, and heated and pressed to produce a two-sheet build-up resin insulation sheet. The heating and pressing conditions vary depending on the resin of the build-up resin insulation sheet. For example, there are also conditions for performing heat curing at 170 ° C. for 60 minutes after vacuum lamination molding at 110 ° C. for 60 seconds.

Thereafter, the metal foil surface of the two-sided single-sided metal foil-clad laminate is subjected to multilayer processing by circuit formation, inner layer processing, and interlayer connection by a known method, and the release material is further peeled off and further multilayered. A circuit is formed on the outermost layer surface and the surface from which the release material has been peeled to form a multilayer printed wiring board.
Also, on one side of the two-ply build-up resin insulation sheet, multi-layer processing is performed by circuit formation, inner layer processing, and interlayer connection, and then the release material is peeled off, and the outermost layer surface and the release material are further peeled off. A circuit is formed on the finished surface to obtain a multilayer printed wiring board.
In the circuit formation, circuit formation by a semi-additive method or circuit formation using an adhesive layer-attached copper foil may be performed.

Example 1
A glass cloth base epoxy resin prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679FG (one using YGP-18 (trade name) manufactured by Nippon Electrolytic Co., Ltd.)) having a thickness of 18 μm. 2 pairs of stacked structures using a product name) as a release material, a 50 μm-thick release film (manufactured by Ube Industries, Ltd., Upilex-S (product name), a polyimide film) The heat shrinkage rate at 180 ° C was 0.05% and the elongation reduction rate after pressing was 5%. A laminated single-sided copper-clad laminate was produced. The copper foil, glass cloth base epoxy resin prepreg, and release film were all 510 × 510 mm in size.

(Example 2)
After a 40 μm thick build-up resin insulation sheet (manufactured by Hitachi Chemical Co., Ltd., AS-Z2 (trade name) was used) was laminated on the release film used in Example 1 at 110 ° C. for 60 seconds, 170 Heat curing at 60 ° C. for 60 minutes was performed to prepare a two-layer build-up resin insulation sheet. The build-up resin insulation sheet and the release film were both 510 × 510 mm in size.

(Example 3)
A release film (release material) is a 25 μm thick Torelina film (manufactured by Toray Industries, Inc., thermal shrinkage rate at 180 ° C., 0.8%, elongation reduction after pressing, 8%, polyphenylene sulfide film) A two-sided single-sided metal foil-clad laminate was produced in the same manner as in Example 1 except that.

Example 4
A release film (release material) is a 25 μm thick Torelina film (manufactured by Toray Industries, Inc., thermal shrinkage rate at 180 ° C., 0.8%, elongation reduction after pressing, 8%, polyphenylene sulfide film) Except that, a two-layer build-up resin insulation sheet was produced in the same manner as in Example 2.

(Example 5)
A release film (release material) is a 75 μm thick Torelina film (manufactured by Toray Industries, Inc., thermal shrinkage rate at 180 ° C., 0.5%, elongation reduction rate after pressing, 18%, polyphenylene sulfide film) A two-sided single-sided metal foil-clad laminate was produced in the same manner as in Example 1 except that.

(Example 6)
A two-sheet single-sided metal foil-clad laminate was prepared in the same manner as in Example 1 except that the thickness of the release film was 12.5 μm.

(Example 7)
A two-sheet single-sided metal foil-clad laminate was prepared in the same manner as in Example 1 except that the thickness of the release film was 125 μm.

(Comparative Example 1)
The release film (release material) was an aflex film with a thickness of 12 μm (manufactured by Asahi Glass Co., Ltd., heat shrinkage rate at 180 ° C. of 2.0%, elongation reduction rate after pressing 10%, fluororesin). Except that, a two-sheet single-sided metal foil-clad laminate was prepared in the same manner as in Example 1.

(Comparative Example 2)
After a 40 μm thick build-up resin insulation sheet (manufactured by Hitachi Chemical Co., Ltd., AS-Z2 (trade name) was used) was laminated on the release film used in Comparative Example 1 at 110 ° C. for 60 seconds, 170 Heat curing at 60 ° C. for 60 minutes was performed to prepare a two-layer build-up resin insulation sheet.

(Comparative Example 3)
The release film (release material) is a 4.5 μm thick Lumirror film (manufactured by Toray Industries, Inc., thermal shrinkage at 180 ° C., 0.5%, elongation reduction after pressing, 60%, polyester film) A two-sided single-sided metal foil-clad laminate was produced in the same manner as in Example 1 except that.

(Comparative Example 4)
A release film (release material) is a 25 μm-thick Torelina film (manufactured by Toray Industries, Inc., heat shrinkage rate at 180 ° C., 0.7%, elongation reduction after pressing, 60%, polyphenylene sulfide film) Except that, a two-layered build-up resin insulation sheet was produced in the same manner as in Comparative Example 2.

(Comparative Example 5)
A two-sided single-sided metal foil-clad laminate was prepared in the same manner as in Example 1 except that the release film had a thickness of 7.5 μm.

(Comparative Example 6)
Sepanium with a thickness of 40 μm (manufactured by Sun Aluminum Industry Co., Ltd., heat shrinkage rate 0.0% at 180 ° C., elongation reduction rate after pressing is 0%, made of aluminum) was used as a release film (release material). Except that, a two-sheet single-sided metal foil-clad laminate was prepared in the same manner as in Example 1.

(Comparative Example 7)
A glass cloth base epoxy resin prepreg (manufactured by Hitachi Chemical Co., Ltd., GEA-679FG (one using YGP-18 (trade name) manufactured by Nippon Electrolytic Co., Ltd.)) having a thickness of 18 μm. A pair of two stacked structures (product name) was used as a release material and a release film with a thickness of 50 μm (manufactured by Ube Industries, Ltd., Upilex-S (product name), a polyimide film) The heat shrinkage rate at 180 ° C was 0.05%, and the elongation reduction rate after pressing was 5%. The layers were laminated on one side and press-molded at 180 ° C and 3 MPa for 1 hour. A single-sided copper-clad laminate was prepared. The copper foil, glass cloth base epoxy resin prepreg, and release film were all 510 × 510 mm in size.

(Printed wiring board manufacturing process of two-sided single-sided metal foil-clad laminate)
Dry film (made by Hitachi Chemical Co., Ltd., using H-K425 (trade name)) is laminated on both sides of the obtained two-sided single-sided copper-clad laminate and exposed, developed, washed with water, etched, washed with water In this order, a circuit was formed.

  Next, the substrate was immersed in an aqueous solution of NaOH 40 g / L for 3 minutes and alkali degreased and washed with water, and then ammonium peroxodisulfate was immersed in an aqueous solution of 100 g / L and liquid temperature 40 ° C. The surface is soft etched and washed with water, immersed in a copper oxide treatment solution of 30 g / L sodium chlorite, 30 g / L trisodium phosphate 12 hydrate, 20 g / L NaOH, and a liquid temperature of 85 ° C. for 2 minutes. Then, the copper surface was oxidized to form a copper oxide film. Next, it was immersed and reduced in dimethylamine borane 4 g / L (pH: 12.5) as a reducing agent at a liquid temperature of 40 ° C. for 150 seconds, and the copper surface was subjected to oxidation-reduction treatment.

  Next, GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a prepreg having a thickness of 60 μm, is laminated on this substrate using a copper foil of 18 μm thickness (YGP-18 (trade name) manufactured by Nippon Electrolytic Co., Ltd.). Then, it was press-molded for 1 hour under the conditions of 185 ° C. and 3.0 MPa, and a circuit was formed by the method described above to produce multilayer printed wiring boards on both sides of the release material.

  Next, the multilayer printed wiring board produced on both surfaces of the release material was peeled into two sheets, and a copper foil with an adhesive layer having a thickness of 18 μm (PF-E-18, manufactured by Hitachi Chemical Co., Ltd.) GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a prepreg having a thickness of 60 μm, and copper foil with an adhesive layer of 18 μm thickness (manufactured by Hitachi Chemical Co., Ltd., PF). -E-18 (trade name) is laminated, press-molded for 1 hour under the conditions of 185 ° C. and 3.0 MPa, circuit formation is performed by the method described above, and two multilayer printed wiring boards are produced. .

(Printed wiring board manufacturing process of single-sided metal foil-clad laminate with release material)
In the same process as the printed wiring board manufacturing process of the two-sheet laminated single-sided metal foil-clad laminate, multilayering was performed on one side, and a multilayer printed wiring board was produced on one side of the release material. Next, the release material is peeled from the substrate, and a copper foil with an adhesive layer having a thickness of 18 μm (made by Hitachi Chemical Co., Ltd., PF-E-18 (trade name)) is used on the peeling surface of the substrate, circuit forming surface In addition, 60 μm thick prepreg GEA-679FG (trade name, manufactured by Hitachi Chemical Co., Ltd.) and 18 μm thick copper foil with adhesive layer (manufactured by Hitachi Chemical Co., Ltd., PF-E-18 (trade name)) are used. ), And press-molded for 1 hour under the conditions of 185 ° C. and 3.0 MPa, and a circuit was formed by the method described above to produce a multilayer printed wiring board.

(Printed wiring board manufacturing process for two-layer build-up resin insulation sheet)
In order to roughen the resin surface on the obtained two-ply build-up resin insulation sheet substrate, as a roughening treatment, a solvent swelling liquid heated to 70 ° C. (MLB conditioner 211: trade name, manufactured by Shipley Co., Ltd.) For 5 minutes at 80 ° C. permanganic acid roughening solution (Shipley Co., Ltd., MLB Promoter 213: trade name) for 10 minutes, hydroxylamine sulfate neutralizing solution (Shipley Co., Ltd., MLB Neutralizer 216) -2: Product name) is immersed for 5 minutes.

  Next, the substrate subjected to the roughening treatment is immersed in a conditioner (manufactured by Hitachi Chemical Co., Ltd., using CLC-601 (trade name)) at 60 ° C. for 5 minutes, washed with hot water at 60 ° C., Washed with water (normal temperature water, the same shall apply hereinafter), electroless plating catalyst solution (made by Hitachi Chemical Co., Ltd., using HS-202B (trade name)) for 10 minutes at normal temperature, with normal temperature (25 ° C) water Water washing, palladium activation treatment solution (manufactured by Hitachi Chemical Co., Ltd., using ADP-401 (trade name)) was performed at room temperature for 5 minutes, followed by water washing in this order.

  Next, it is immersed in an electroless copper plating solution (Hitachi Chemical Industry Co., Ltd., CUST201 (trade name)) for 15 minutes at room temperature, washed with water, dried at 80 ° C. for 10 minutes, and electroless plating thinned. went.

  Next, RY-3325 (trade name, manufactured by Hitachi Chemical Co., Ltd.), which is a dry film photoresist, is laminated on the surface of the electroless plating layer, and ultraviolet rays are passed through a photomask that masks the place where electrolytic copper plating is performed. Was exposed and developed to form a plating resist.

Next, using a copper sulfate bath, electrolytic copper plating was carried out for about 20 μm under conditions of a liquid temperature of 25 ° C. and a current density of 1.0 A / dm ² to form a circuit.

  Next, this substrate was subjected to an inner layer treatment (CZ treatment), and then a 40 μm thick build-up resin insulation sheet (manufactured by Hitachi Chemical Co., Ltd., AS-Z2 (trade name) was used) at 110 ° C. for 60 seconds. After laminating at 170 ° C., heat curing was performed at 170 ° C. for 60 minutes, and the above-described roughening treatment, electroless plating, electroplating, and circuit formation were carried out to produce multilayer printed wiring boards on both sides of the release material.

  Next, after applying an inner layer treatment (CZ treatment) to this substrate, a 40 μm thick build-up resin insulation sheet (made by Hitachi Chemical Co., Ltd., AS-Z2 (trade name)) was laminated by the above method. , Heat-cured and laminated.

  Next, the multilayer printed wiring board produced on both sides of the release material is peeled into two sheets, and each of the substrates is subjected to the roughening treatment, electroless plating, electroplating, and circuit formation described above, and two multilayer printed wiring boards. Was made.

  The following evaluation was performed through the above steps for the two-sheet-matched single-sided metal foil-clad laminates produced in Examples 1-7 and Comparative Examples 1-7 and the two-sheet-assembled build-up resin insulation sheet.

(Peelability evaluation)
Through the process, after the multilayer printed wiring board was formed on both sides of the release material, the peelability when peeling to two sheets was confirmed (◯: no tearing, good peelability).

(Evaluation of chemical penetration)
Through the process, after forming the multilayer printed wiring board on both sides of the release material, it was visually confirmed whether or not there was any chemical penetration on the peeled surface when peeling to two.

(Peeling evaluation)
When passing through each process, the substrate was pulled out and the presence or absence of peeling in the part of the mold release material was confirmed (◯: no peeling, x: with peeling).

(Slave evaluation)
When passing through each process, the board | substrate was extracted, the curvature amount of the board | substrate was confirmed, and the thing of 5 mm or less was evaluated as (circle), and the thing of 5 mm or more was evaluated as x.
The above evaluation results are shown in Table 1.

  The samples prepared in Examples 1 to 7 were good in peelability, chemical penetration, and heat resistance, could pass through the process without any problems, and had no problem when separated into the subsequent two sheets. On the other hand, in Comparative Examples 1 and 2, since the heat shrinkage rate of the release material was large, peeling occurred at the mating surfaces at high temperatures. In Comparative Examples 3 and 4, the elongation after pressing is greatly reduced. Therefore, when separating the two-ply single-sided metal foil-clad laminate and the two-ply build-up resin insulation sheet, the release material is torn and cannot be peeled off well. It was. In Comparative Example 5, as in Comparative Example 3, the release material was very thin and lacking strength, so the release material was torn during the separation. In Comparative Example 6, since the release material was a metal, the chemical solution was infiltrated and the release material was slightly dissolved. In Comparative Example 7, the mold release material forms a wiring board only on one side, so that the asymmetric structure becomes large and warpage increases.

  In the method for manufacturing a printed wiring board according to the present invention, in each step, there is no penetration of the chemical solution to the mating surface, separation does not occur, and the two multilayered printed wiring boards are separated after passing through the step. Obtainable.

Claims (6)

  Two pieces of a prepreg laminate with two metal foils laminated on one side, with the prepreg laminate on the inside, stacked via a release material, and heated and pressed to form a single-sided metal foil-clad laminate A step of forming a multilayer on the metal foil surface of the two-sheet laminated single-sided metal foil-clad laminate by circuit formation, inner layer treatment, interlayer connection, a step of peeling the release material, and multilayering And a step of forming a circuit on the outermost layer surface and the surface from which the release material has been peeled off.   A process of producing a two-ply buildup resin insulation sheet by stacking two sets of buildup resin insulation sheets of a predetermined number via a release material and heating and pressurizing, and on one side of the two-ply buildup resin insulation sheet , Circuit forming, inner layer processing, a step of performing multilayer processing by interlayer connection, a step of peeling the release material, and a step of forming a circuit on the outermost layer surface and the surface from which the release material has been peeled. A method for manufacturing a wiring board.   The method for producing a printed wiring board according to claim 1 or 2, wherein a release material having a heat shrinkage rate of 1.5% or less in a range of 100 to 250 ° C is used as the release material.   The method for producing a printed wiring board according to any one of claims 1 to 3, wherein a release material having a reduction rate of elongation after heating and pressing is 50% or less is used as the release material.   The method for producing a printed wiring board according to any one of claims 1 to 4, wherein the temperature of heating and pressing is in a range of 100 to 250 ° C.   The method for producing a printed wiring board according to any one of claims 1 to 5, wherein the release material has a thickness of 10 µm or more and 200 µm or less.