TWI481499B - Double-layered single surface metal foil clad laminated sheet and method of fabricating thereof,and single surface print wiring board and method of fabricating thereof - Google Patents

Description

Two-synthesis single-sided metal foil laminated board, manufacturing method thereof, single-sided printed wiring board and manufacturing method thereof

The present invention relates to a two-composite single-sided metal foil laminate and a method of manufacturing the same, and a single-sided printed wiring board and a method of manufacturing the same, and more particularly to a multilayer wiring board, a semiconductor wafer mounting substrate, and a semiconductor package substrate Two synthetic single-sided metal foil laminates, and a method for producing the same, and a single-sided printed wiring board using the two synthetic single-sided metal foil laminates and a method of manufacturing the same.

In the prior art, a single-sided metal foil laminate used for a substrate such as a board on a wafer (Board On Chip, BOC) is manufactured as follows. First, a prepreg of a desired number of sheets is superposed to form a laminate. Then, the metal foil is superposed on both sides thereof to form a double-sided metal foil laminate. Then, only one side of the double-sided metal foil laminate is etched to remove the copper foil to form a single-sided metal foil laminate. In this process, there must be a problem that the amount of copper foil on one side becomes useless.

Therefore, in order to efficiently manufacture a single-sided metal foil laminated board, there has been proposed such a method in which a predetermined number of prepreg sheets and a metal foil are superposed and heated and pressed on the respective surface sides of the release material to form two The laminated single-sided metal foil laminate is then separated into two pieces (for example, refer to Patent Document 1). Further, there has been proposed a method in which a release film is used to improve the peeling property with a substrate, and it is desired to efficiently produce a single-sided metal foil laminate (for example, refer to Patent Document 2). In addition, there is also proposed a method of using two synthetic copper laminates in between The prepreg and the film which are smaller than the copper laminate and which are not in contact with the copper laminate are disposed on the inner side of the copper laminate, and are formed by heating and pressing to form a pseudo multilayer board, and are peeled off after the circuit is processed (for example, Refer to Patent Document 3).

Patent Document 1: Japanese Laid-Open Patent Publication No. Hei 7-302977 Patent Document 2: Japanese Patent Laid-Open Publication No. 2007-90581 Patent Document 3: Japanese Patent Laid-Open Publication No. 2001-308548

As shown in Patent Document 1, in the state where two synthetic single-sided metal foil laminates are not separated into two, circuit processing, solder resist coating, Ni-Au plating, and profile are performed on both surfaces. When processing such as processing, the work efficiency is excellent. However, since aluminum is used in the release material, when the two treatments are carried out in combination, the liquid used in the treatment sometimes penetrates into the two synthetic single-sided metal foils. The single panel of the laminate is placed on the mating surface of the release material (hereinafter referred to as the "composite surface"). In this case, it is conceivable to provide a process for cleaning the chemical component to be attached, but it is difficult to remove the chemical solution that has penetrated into the opposing surface by a usual cleaning method. Therefore, there is a problem that the chemical liquid remains and the chemical solution used in other treatments is contaminated. Moreover, in the circuit processing, there is also a problem that aluminum of the release material dissolves.

As described in Patent Document 2, when the release film is used for the release material, the problem of penetration of the chemical liquid and dissolution of the release material as described above can be solved. However, in the curing of the solder resist, such a high temperature forming process, There is a problem in that the facing surface is peeled off due to shrinkage of the release film.

Further, as in Patent Document 3, a film in which a prepreg sheet and a copper laminate are not bonded to each other by a two-layered copper laminate is provided on the inner side of the copper laminate layer. The processing method cannot fully perform circuit processing on the support substrate, and the efficiency is poor. Further, when the position of the film is deviated, the product cannot be satisfactorily obtained, and the probability of forming a defective product is increased.

In view of these problems, an object of the present invention is to provide such two synthetic single-sided metal foil laminates and a method of manufacturing the same, that is, the liquid used in the manufacturing process does not penetrate, and the release property of the release material It is good and does not peel off the mating surface due to shrinkage of the release film during high temperature processing. Further, it is an object of the present invention to provide a single-sided printed wiring board using the two synthetic single-sided metal foil laminates and a method of manufacturing the same.

The above problems are solved by the present invention described below. That is, the present invention is a two-synthesis single-sided metal foil laminate in which two groups are formed by superimposing a metal foil on one side of a prepreg or on one side of a plurality of prepreg laminates. The two sets of constituent bodies are formed by the release material and the respective prepreg sheets are made inside, and are superposed by heat and pressure treatment. Further, the release material is a resin material or a film composed of a composite material of the resin material and the metal material, and the release material has a thickness of 10 to 200 μm and is subjected to the temperature of the heat and pressure treatment. The heat release rate of the aforementioned release material is less than or equal to 1.5%.

Moreover, the present invention is a composite single-sided metal foil laminate The manufacturing method comprises superposing a metal foil on one side of a prepreg or on one side of a plurality of prepreg sheets to form a constituent body. Then, the two sets of the constituent bodies were superposed by a heat and pressure treatment by means of a release material and the respective prepreg sheets were formed inside. Further, the release material is a resin material or a film composed of a composite material of the resin material and the metal material, and has a thickness of 10 to 200 μm, and the aforementioned release type is applied at a temperature at which the heat and pressure treatment is applied. The material has a heat shrinkage rate of 1.5% or less.

Further, the present invention is a single-sided printed wiring board which is subjected to circuit processing, solder resist coating treatment, Ni-Au plating treatment, and profile processing on both surfaces of the above-mentioned two synthetic single-sided metal foil laminates. After the treatment, or after at least one of the above-described various treatments, the two sets of single-sided metal foil laminates are separated from the release material.

Moreover, the present invention provides a method for producing a single-sided printed wiring board, which is subjected to circuit processing, solder resist coating treatment, and Ni-Au plating treatment on both surfaces of the two synthetic single-sided metal foil laminates described above. After the shape processing, or after at least one of the above-described various treatments, the two sets of single-sided metal foil laminates are separated from the release material.

According to the present invention, it is possible to provide such two synthetic single-sided metal foil laminates and a method for producing the same, that is, the chemical liquid used in the manufacturing process does not penetrate, and the release property of the release material is good. Moreover, at the time of high temperature treatment, the mating surface is not peeled off due to shrinkage of the release film. Further, according to the present invention, it is possible to provide a single-sided printed wiring board using the two synthetic single-sided metal foil laminates and a method of manufacturing the same.

[1] Two synthetic single-sided metal foil laminates

The two synthetic single-sided metal foil laminates of the present invention are two-component structures which are overlapped with a metal foil on one side of a prepreg or on one side of a plurality of prepreg laminates. The release is performed by a heat and pressure treatment by using a release material and making each prepreg into the inner side.

Hereinafter, two synthetic single-sided metal foil laminated sheets of the present invention will be described.

(release material) The release material used in the present invention is subjected to heat and pressure treatment, and is adhered to the prepreg without peeling off during the production process of the printed wiring board, and is formed when consciously peeled off. A form in which the prepreg can be easily peeled off from two synthetic single-sided metal foil laminates by hand. Further, the release material is a film composed of a resin material or a composite material in which the resin material and the metal material are combined. If the release material is made of only a metal material, various chemical liquids are likely to be infiltrated during the manufacture of the wiring board. However, by using the above-mentioned material to form a release material, the penetration of the chemical liquid can be eliminated, and the cause of the reduction can be alleviated. Adverse effects caused by the liquid remaining on the opposing surface of the release material.

The heat shrinkage rate of the release material must be 1.5% or less, 1.0% or less, and preferably 0.01% to 0.9%, in the range of 0.01% to 0.8%, at a temperature at which heat and pressure treatment is applied. Nite Jia. If the heat shrinkage rate exceeds 1.5%, the release material tends to shrink at a high temperature (for example, 160 ° C or higher) at which the solder resist is cured, and the bonded surface peels off. That is, the heat resistance of the release material is deteriorated.

In addition, the heat shrinkage rate is a size obtained by measuring a 180° C. dryer in a three-dimensional measuring device (manufactured by Mitutoyo Corporation) before and after the treatment for one hour, and is obtained by (a difference in size before and after heat treatment/a size before heat treatment). Shrinkage.

Further, the descrasing rate of the release property of the release material after the heat and pressure treatment is preferably 50% or less before the heat and pressure treatment, more preferably 30% or less, and in the range of 1 to 20%. Very good. Since the rate of decrease is 50% or less, it is possible to prevent cracking when peeling off the release material, and to make the peelability more favorable.

In addition, the rate of decrease in the stretchability is 5 mm/min by using a precision universal testing machine (manufactured by Shimadzu Corporation) for the release material before the heat and pressure treatment and the release material after the heat and pressure treatment. The tensile speed was stretched and the length L of the sample at the time of the fracture was measured, and the elongation before the above-described heating and pressure treatment was calculated by the following formula 1 from the sample length L ₀ before the test and the sample length L at the time of the fracture. (E ₀ ) and the elongation (E) after the above heat and pressure treatment.

Elongation rate (E, E ₀ ) (%) = (L - L ₀ ) × 100 / L ₀ (Formula 1)

Next, the rate of decrease in stretchability is calculated and calculated by the following formula 2.

Rate of decrease in stretchability (%) = (E _{0 -} E) × 100 / E ₀ (Formula 2)

As the resin material constituting the release material, it may be polyphenylene sulfide, polyphenylene oxide, polyfluorene, polyether oxime, polyphenylene ether, polyetherimide, polyimine, polyamidamine. Amine, polyamine, polycarbonate, polyarylate, polyether ketone, polydiether ketone, polyacetal, cellulose acetate, poly-4-methylpentene-1, polyethylene terephthalate , polyethylene terephthalate and derivatives of these resins. Among them, polyphenylene sulfide and polyimine are preferred.

Further, in the case where the release material is composed of a composite material in which a resin material and a metal material are combined, the above-mentioned material can be used as the resin material. As the metal material, stainless steel, brass, or the like can be used. As a form of the composite material, a film made of a resin material may be used (a) a film (for example, an extremely thin metal foil) or a sheet made of a metal material, or (b), may be provided on a film made of a resin material. A layer made of a metal material is provided by vapor deposition or the like. Further, in order to adjust the adhesion, a surface roughening treatment (mat treatment) may be applied to the release material. In this case, the thickness of the metal layer is preferably less than 1 μm. If it is less than 1 μm, even if the end of the laminated board is exposed to various chemical liquids during the manufacturing process of the wiring board, the chemical liquid does not enter the inside, and the adverse effects caused by the chemical liquid can be minimized.

Further, in the case of being used as a composite material, as the resin material, a fluororesin (polyvinylidene fluoride, polytetrafluoroethylene or the like) may be used in addition to the above materials.

The thickness of the release material is 10 to 200 μm, preferably 12 to 125 μm, more preferably 40 to 125 μm. When the thickness is less than 10 μm, the strength of the release material is insufficient. When the release material is separated from the two synthetic single-sided metal foil laminates, the release material is broken or the like, and the peelability is deteriorated. Further, the operability in forming two synthetic single-sided metal foil laminates is not good. If the thickness exceeds 200 μm, it is not easy to start and the price.

Further, the release material may be used in a plurality of sheets in a range of the above thickness as needed. By overlapping a plurality of sheets, separation of the release material from the two synthetic single-sided metal foil laminates is sometimes facilitated.

(metal foil) As the metal foil, a metal foil used in a usual printed wiring board, for example, a copper foil can be used. The copper foil may be one of an electrolytic copper foil and a rolled copper foil, and the thickness is not particularly limited. Therefore, a copper foil or a peelable copper foil having a thickness of 105 μm or less which is usually used for a printed wiring board can be used.

Further, instead of the peelable copper foil, an erodible copper foil having an aluminum carrier or a nickel carrier may be used.

Further, although the copper foil used for the printed wiring board is usually subjected to a roughening treatment, the present invention is not particularly problematic except that a copper foil which is not subjected to roughening treatment can be used.

[prepreg] The prepreg is a method of impregnating, coating or adhering a substrate with a matrix resin composition.

As a material constituting the substrate, glass (E glass, D glass, S glass, T glass, quartz glass, etc.), ceramics (aluminum oxide, boron nitride, etc.), heat resistant engineering plastics can be used. (a wholly aromatic polyamine, a polyphenylene sulfide, a polyetherimide, a polyimine, a carbon electrode), and the like, and one or two or more of them may be used together. The form of the substrate may be a woven fabric such as a fiber or a chopped chop or a non-woven fabric, a continuous cell porous fluororesin film or a sheet, or the like.

As the composite resin which is a main component of the composite resin composition of the prepreg, a phenol resin, a polyester resin, an epoxy resin, a cyanic resin, a thermosetting polyimide resin, or another thermosetting resin can be used. Two of them The composition formed above and the like.

In the composite resin composition for the prepreg, the inorganic filler may be contained in order to improve the reliability. The inorganic filler is not particularly limited, and may be cerium oxide, molten cerium oxide, talc, aluminum oxide, aluminum hydroxide, barium sulfate, calcium hydroxide, aerosil, and calcium carbonate. These may be used alone or in combination of two or more. Among them, cerium oxide is preferred from the viewpoint of inductive characteristics or low thermal expansion.

For the purpose of improving dispersibility and the like, the inorganic filler may be treated with various coupling agents such as a decane coupling agent.

Further, in the composite resin composition of the prepreg, the thermoplastic resin may be contained in order to improve flexibility. As the thermoplastic resin, for example, a fluororesin, a polyphenylene ether, a denatured polyphenylene ether, a polyphenylene sulfide, a polycarbonate, a polyether imine, a polydiether ketone, a polyarylate, a polyamine, a polyamidamine can be used. An amine, a polybutadiene or the like is not limited to these resins. The thermoplastic resin may be used singly or in combination of two or more.

In the composite resin composition of the prepreg, the additive such as a coupling agent, a pigment, a leveling agent, an antifoaming agent, or an ion trap may be blended as needed.

The number of prepregs constituting the single-sided metal foil laminate is at least one, but it may be plural. On the one side of the laminated body of the laminated prepreg, the metal foil described above is provided.

[2] Method for manufacturing two-sided single-sided metal foil laminated board

The two synthetic single-sided metal foil laminates of the present invention were produced as follows (see Fig. 1). That is, first on one side of the prepreg 1 (When a plurality of prepreg sheets are laminated, on one side of the laminated body), the metal foil 2 is superposed to form a constituent body. Then, two sets of the constituent bodies are prepared, and lamination is performed by applying heat and pressure treatment by the release material 3 of the present invention and the respective prepreg sheets are formed inside. The heat and pressure treatment is performed by, for example, inserting these materials between the two panels 4. In the present invention, the release material 3 has a length (size) equal to or higher than that of the prepreg 1 and the metal foil 2. From the viewpoint of operability in manufacturing a printed wiring board, they are preferably the same.

The conditions for heating and pressurizing vary depending on the resin of the prepreg. For example, when using a glass cloth substrate epoxy prepreg, the temperature is 150 to 250 ° C, and the pressure is preferably 0.5 to 8.0 MPa.

[3] Single-sided printed wiring board and method of manufacturing the same

The single-sided printed wiring board of the present invention is subjected to circuit processing, flux coating treatment, Ni-Au plating treatment, and outer shape processing on both surfaces of the two synthetic single-sided metal foil laminates of the present invention. Or after applying at least one of the treatments, the two sets of single-sided metal foil laminates are separately separated from the release material.

Further, at the end of these series of processes, or after the single-sided metal foil laminate is separated by an arbitrary process, connection failure (AOI) inspection or the like may be performed.

(Example 1)

Two sets of copper foil (3EC-VLP-18 manufactured by Mitsui Metals Co., Ltd.) having a thickness of 18 μm were produced, and two prepregs having a thickness of 0.1 mm (using glass cloth as a substrate and impregnated in epoxy resin) were prepared. Prepreg (Hitachi) GEA-679FGB manufactured by Seiko Co., Ltd.) is a structure in which the overlap is performed in order. Each of the prepregs was placed inside by a release material (release film) having a thickness of 50 μm, and laminated by heat and pressure treatment (180 ° C, 3 MPa, 1 hour press forming treatment) to prepare two sheets. Synthetic single-sided metal foil laminate.

In addition, the release material used is a polyimine-based film (trade name: Nubileikusu-S) manufactured by Ube Industries, Ltd., and the heat shrinkage rate at 180 ° C is 0.05%, and the expansion and contraction after pressurization The rate of decline was 5%. Further, the copper foil, the glass cloth substrate epoxy prepreg, and the release material were all used in a size of 510 mm × 510 mm.

(Example 2)

In addition, the release material was a prepreg having a thickness of 25 μm (manufactured by Toray Co., Ltd., the heat shrinkage rate at 180 ° C was 0.7%, and the stretchability after pressurization was 10%, polyphenylene sulfide film). Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1.

(Example 3)

The prepreg sheet having a thickness of 75 μm (manufactured by Toray Co., Ltd., having a heat shrinkage rate at 180 ° C of 0.5%, and a stretchability after pressurization of 18%, a polyphenylene sulfide film) was used. Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1.

(Example 4)

Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1 except that the thickness of the release material was 12.5 μm.

(Example 5)

Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1 except that the thickness of the release material was 125 μm.

(Example 6)

In addition to the MAQINAS (manufactured by Nippon Metal Co., Ltd., which has a release material of 38 μm in thickness, the heat shrinkage rate at 180 ° C is 0.1%, and the elongation after extrusion is 5%, which is in the polyimide resin. Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1 except that a film of copper having a thickness of 0.3 μm was deposited on the film.

(Example 7)

In addition to the release material, the aflekkus film having a thickness of 25 μm (manufactured by Asahi Glass Co., Ltd., the heat shrinkage rate at 180 ° C is 2.0%, and the elongation after stretching is 10%, fluororesin) A film produced by depositing copper having a thickness of 0.3 μm on the surface of the film (having a heat shrinkage rate at 180 ° C of 0.5% and a stretchability reduction rate after pressurization of 10%) was produced in the same manner as in Example 1. Sheet-synthesized single-sided metal foil laminate.

(Example 8)

In addition to the release material being the one of the thickness of 50 μm of theonekus film (manufactured by Teijin Dupon Co., Ltd., the heat shrinkage rate at 180 C is 1.5%, and the elongation after extrusion is 8%, the polyethylene naphthalene film). Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1.

(Comparative Example 1)

In addition to the release material, the aflekkus film having a thickness of 25 μm (manufactured by Asahi Glass Co., Ltd., having a heat shrinkage rate at 180 ° C of 2.0%, and a stretchability after pressurization of 10%, a fluororesin), The same as in the first embodiment Two synthetic single-sided metal foil laminates were produced.

(Comparative Example 2)

In addition to the release material being a lumira film having a thickness of 4.5 μm (manufactured by Toray Co., Ltd., a heat shrinkage ratio at 180 ° C of 0.5%, a stretchability after pressurization of 60%, a polyester resin), In the same manner as in Example 1, two synthetic single-sided metal foil laminates were produced in the same manner.

(Comparative Example 3)

Two synthetic single-sided metal foil laminates were produced in the same manner as in Example 1 except that the release material was 7.5 μm thick.

(Comparative Example 4)

In addition to the fact that the release material was made of sepanium (manufactured by Sunulumia Co., Ltd., having a heat shrinkage rate of 180% at 180 ° C, a rate of decrease in elongation after pressurization of 0%, made of aluminum), Example 1 Two synthetic single-sided metal foil laminates were produced in the same manner.

In the two synthetic single-sided metal foil laminates produced in Examples 1 to 8 and Comparative Examples 1 to 4, the following treatments (1) to (3) were sequentially carried out, and the following evaluations (A) were carried out. (C). The test results are shown in Table 2 below.

(1) Circuit processing: The periphery of the two synthetic single-sided metal foil laminates obtained in each of the examples and the comparative examples was cut to have a size of 500 mm × 500 mm. Then, in this state, a dry film (H-K425 (trade name) manufactured by Hitachi Chemical Co., Ltd.) was laminated on both surfaces, and exposure, development, washing, etching, and water washing were sequentially performed. , the implementation of circuit processing.

(2) Soldering agent coating treatment: A solder resist (SR-7200G, manufactured by Hitachi Chemical Co., Ltd.) was applied by screen printing on two synthetic single-sided metal foil laminates subjected to circuit processing to complete the thickness. It was 25 μm and dried at 80 ° C for 30 minutes. Subsequently, exposure baking was performed at 500 mJ/cm ² , and development was carried out at 30 ° C for 3 minutes using a 1% aqueous sodium hydrogencarbonate solution. Then, it was washed with running water and heat-hardened at 170 ° C for 60 minutes.

(3) Ni-Au plating treatment Next, on the two synthetic single-sided metal foil laminates, various treatments a) to q) were sequentially performed in the order shown in Table 1 below.

The details of the materials used in the solutions in Table 1 are as follows.

Z-200: SA-100 manufactured by World Metal Co., Ltd.: NIPS-100 manufactured by Hitachi Chemical Co., Ltd.: Top kemialyi66 manufactured by Hitachi Chemical Co., Ltd.: Pallet, manufactured by Okuno Pharmaceutical Co., Ltd.: HGS-100, manufactured by Kojima Chemicals Co., Ltd.: HGS-2000 manufactured by Hitachi Chemical Co., Ltd.: manufactured by Hitachi Chemical Co., Ltd.

(A) Stripability evaluation After each treatment was applied, two sets of single-sided metal foil laminates were separated from the release material, and the peeling property at the time of separation was confirmed. [◎] in Table 2 indicates that the release material was peeled off without problems, [○] indicates that the release material was substantially peeled off without problems, and [x] indicates that a part of the release material was broken at the time of peeling. Further, in the case of [◎] and [○], the peeling property was good, and there was no problem in practical use.

(B) Evaluation of liquid immersion After carrying out the various treatments, the two sets of single-sided metal foil laminates were separated from the release material, and it was visually confirmed whether there was a chemical liquid on the facing surface of the release material (solution used in each treatment) Infiltration.

(C) Heat resistance evaluation When the solder resist coating treatment was performed, it was confirmed whether or not the mating surface was peeled off at the heat-hardened portion of the solder resist which reached 170 °C. [◎] in Table 2 indicates that there is no peeling on the surface to be bonded, and the heat resistance is very good. [○] indicates that there is no peeling on the surface to be bonded, and heat resistance is good, and [x] indicates peeling on the surface of the joint. Off, poor heat resistance.

According to Table 2, the samples prepared in Examples 1 to 8 were excellent in peelability, chemical liquid immersion property, and heat resistance, and various treatments were possible without any problem. Moreover, there is no problem when it is separated into two compositions at a later time.

On the other hand, in Comparative Example 1, since the heat shrinkage rate of the release material was large, peeling occurred on the surface to be joined if a high temperature was formed. In Comparative Example 2, since the stretchability after pressurization was greatly lowered, when the two synthetic single-sided metal foil laminates were separated, the release material was broken and peeling could not be performed satisfactorily. Comparative Example 3 because the release material is very thin and has no strength. Therefore, the release material may be damaged when separated. In Comparative Example 4, since the release material was a metal, the chemical solution was infiltrated on the surface to be bonded, and the release material was slightly dissolved.

1‧‧‧Prepreg

2‧‧‧metal foil

3‧‧‧ Release material

4‧‧‧ Paneling

Fig. 1 is a schematic explanatory view showing an example of a method for producing two synthetic single-sided metal foil laminated sheets of the present invention. 1 is a prepreg, 2 is a metal foil, 3 is a release material, and 4 is a panel.

1‧‧‧Prepreg

2‧‧‧metal foil

3‧‧‧ Release material

4‧‧‧ Paneling

Claims (7)

A two-synthesis single-sided metal foil laminate comprising: two groups of one surface on one side of a prepreg or on one side of a plurality of prepreg laminates, the two groups of structures are borrowed The release material is such that each of the prepreg sheets is inside and is superposed by heat and pressure treatment; the release material is a resin material or a film composed of a composite material of the resin material and the metal material, and the release material is The thickness of the release material is 10 to 200 μm, and the heat shrinkage rate of the release material subjected to the aforementioned heat and pressure treatment at a heating temperature of 180 ° C is 1.5% or less. The two synthetic single-sided metal foil laminates according to the first aspect of the invention, wherein the release property of the release material after the heat and pressure treatment is less than or equal to the heating addition. 50% before pressure treatment. The two synthetic single-sided metal foil laminates described in claim 1 or 2, which are heat-pressurized, can be easily peeled off from two synthetic single-sided metal foil laminates by hand. The degree of bonding of the aforementioned prepreg. The two synthetic single-sided metal foil laminates described in the first or second aspect of the patent application are applied to a multilayer wiring board, a semiconductor wafer mounting substrate, and a semiconductor package substrate. A method for manufacturing two synthetic single-sided metal foil laminates, comprising: one side of a prepreg or one side of a plurality of prepreg sheets The metal foil is superposed to form a constituent body; for each of the two components, the prepreg is made inner by a release material, and is superposed by heat and pressure treatment, and the release material is a resin material. Or a film composed of the composite material of the resin material and the metal material, and the release material has a thickness of 10 to 200 μm, and the above-mentioned release material is applied at a temperature of 180 ° C under the heating and pressure treatment. The heat shrinkage rate is less than or equal to 1.5%. A single-sided printed wiring board is applied on both sides of two synthetic single-sided metal foil laminated boards according to the first or second aspect of the patent application, and is subjected to circuit processing, solder resist coating treatment, Ni- After the Au plating treatment and the outer shape processing, or after at least one of the above-described respective treatments, the two sets of the single-sided metal foil laminates are separated from the release material. A method for manufacturing a single-sided printed wiring board, comprising: applying circuit processing and solder resist coating on both sides of two synthetic single-sided metal foil laminates according to claim 1 or 2; After the treatment, the Ni-Au plating treatment, and the outer shape processing, or after at least one of the above-described respective treatments, the two sets of the single-sided metal foil laminates are separated from the release material.