JP2010199112A - Method of discharging droplets - Google Patents

Abstract

The efficiency of use of a functional liquid is improved even when the density of a drawing region changes.
The substrate is moved relative to the ejection head, and functional liquid droplets are ejected to a predetermined drawing region of the substrate, and drawing is performed at a drawing rate corresponding to a pattern to be formed for each substrate. When the drawing process is sequentially performed on the plurality of substrates G1 to G10, the order in which the drawing process is performed is set based on the drawing rate of each substrate.
[Selection] Figure 13

Description

  The present invention relates to a droplet discharge method and a device manufacturing method.

  As one method for forming a device pattern, a droplet discharge method (inkjet method) in which a pattern is formed on a substrate with droplets of a functional liquid is known. Patent Document 1 discloses an example of a technique related to a droplet discharge device (inkjet device) that forms a pattern on a substrate based on a droplet discharge method.

In addition, a technique corresponding to cost reduction and time reduction by manufacturing a multilayer wiring board, for example, a low-temperature sintered ceramic multilayer wiring board using a droplet discharge method is disclosed.
That is, in Patent Document 2, an unfired green sheet is used as a substrate, and a circuit pattern is drawn using an ink in which a powder such as a metal or a resistor is dispersed in an organic dispersion medium that is easily absorbed by the green sheet. Thereafter, the electronic circuit is baked to realize an electronic circuit that solves the problem that the ink easily flows and wets easily on the substrate.

Japanese Patent Laid-Open No. 11-248926 Japanese Patent Laid-Open No. 58-50795

However, the following problems exist in the conventional technology as described above.
The green sheet is manufactured by a manufacturing method in which a plurality of sheets (a plurality of sheets) are aligned, laminated, pressure-bonded, debindered, and sintered. For example, in an electronic circuit board, a power source and a GND layer Since the density of the drawing area varies greatly with the wiring layer, it is necessary to perform a large amount of preliminary ejection (flushing) in order to stabilize the amount of ink ejected when manufacturing a layer with a low density. There is a problem that increases.
In particular, in the case of ink containing Ag, Au, or other rare metal, it becomes a factor of cost increase.

  The present invention has been made in consideration of the above points, and an object thereof is to provide a droplet discharge method and a device manufacturing method that improve the use efficiency of a functional liquid even when the density of a drawing region changes. To do.

In order to achieve the above object, the present invention employs the following configuration.
According to the droplet discharge method of the present invention, the substrate is moved relative to the discharge head, the droplets of the functional liquid are discharged to the predetermined drawing region of the substrate, and the pattern is formed on each substrate. A droplet discharge method for drawing at a drawing rate, wherein when drawing processing is sequentially performed on a plurality of the substrates, an order in which drawing processing is performed is set based on a drawing rate for each substrate. To do.
Therefore, in the liquid droplet ejection method of the present invention, the amount of functional liquid that remains in the ejection head without being ejected changes depending on the magnitude of the rendering rate, so the order of performing the rendering process is set to the rendering rate for each substrate. Accordingly, it is possible to discharge the functional liquid having a short residence time, and it is possible to reduce the preliminary discharge amount and improve the usage efficiency of the functional liquid.

Specifically, in the present invention, a procedure for performing a drawing process on a substrate having a drawing rate smaller than the drawing rate of the substrate after the substrate subjected to the drawing process can be suitably employed.
Thus, in the present invention, when performing drawing processing on the subsequent substrate, a nozzle (discharge port) that discharges the functional liquid in the drawing processing on the previous substrate can be used. It becomes possible to discharge, and it is possible to reduce the preliminary discharge amount and improve the use efficiency of the functional liquid.

Further, in the present invention, it is preferable that when the drawing process is sequentially performed on a group of substrates in which a plurality of the substrates are arranged along the relative movement direction, the arrangement order of the substrates is set based on a drawing rate for each substrate. Can be adopted.
Accordingly, in the present invention, the plurality of substrates are relatively moved (scanned) once with respect to the ejection head, thereby ejecting functional liquid droplets onto the plurality of substrates for each substrate group to form a pattern. It becomes possible and productivity can be improved. Further, in the present invention, when performing drawing processing on a plurality of substrates sequentially by relative movement, it becomes possible to discharge the functional liquid having a short residence time, and the use efficiency of the functional liquid is improved by reducing the preliminary discharge amount. be able to.

In the above configuration, when performing the drawing process sequentially on the plurality of substrate groups, a procedure for setting the order of performing the drawing process based on the average drawing rate of the plurality of substrates in each substrate group is preferably employed. it can.
As a result, in the present invention, when performing drawing processing on the subsequent substrate group, a nozzle (discharge port) that discharges the functional liquid in the drawing processing on the previous substrate group, or a nozzle in the vicinity thereof can be used. Thus, it becomes possible to discharge the functional liquid having a short residence time, and it is possible to improve the usage efficiency of the functional liquid by reducing the preliminary discharge amount.

Also in the above configuration, a procedure for performing the drawing process on a substrate having a drawing rate smaller than the drawing rate of the substrate after the substrate subjected to the drawing process can be suitably employed.
Accordingly, in the present invention, when performing drawing processing on the subsequent substrate, the nozzle (discharge port) that ejects the functional liquid in the drawing processing on the previous substrate or a nozzle in the vicinity thereof can be used. It becomes possible to discharge the functional liquid with a short time, and it is possible to reduce the preliminary discharge amount and improve the usage efficiency of the functional liquid.

In addition, the device manufacturing method of the present invention includes a step of discharging functional liquid droplets onto the substrate by the above-described droplet discharging method.
As a result, in the present invention, it becomes possible to discharge a functional liquid with a short residence time, and it is possible to improve the use efficiency of the functional liquid by reducing the preliminary discharge amount, while efficiently suppressing an increase in cost. The device can be manufactured.

It is a schematic block diagram which shows the droplet discharge apparatus which concerns on 1st Embodiment of this invention. It is a perspective view which shows a part of droplet discharge device. It is the figure which looked at the some discharge head supported by the carriage member from the lower side. It is sectional drawing for demonstrating an example of the structure of a discharge head. It is a perspective view which shows an example of a 1st moving body. It is a front view which shows an example of a 1st moving body. It is a figure which shows an example of a 2nd moving body. It is a figure for demonstrating an example of operation | movement of a 2nd moving body. It is a figure which shows an example of a 3rd moving body. It is a figure for demonstrating an example of operation | movement of a 3rd moving body. It is a figure which shows an example of a 4th moving body. It is a figure for demonstrating an example of operation | movement of a 4th moving body. It is a schematic diagram which shows the drawing rate of a some board | substrate. It is a figure for demonstrating an example of operation | movement of a droplet discharge apparatus. It is a figure for demonstrating an example of operation | movement of a droplet discharge apparatus. It is an external appearance perspective view of the 1st moving body which concerns on 2nd Embodiment. It is a schematic diagram of the board | substrate which comprises a board | substrate group according to a drawing rate.

Hereinafter, embodiments of a droplet discharge method and a device manufacturing method according to the present invention will be described with reference to FIGS.
(First embodiment)
FIG. 1 is a schematic configuration diagram of a droplet discharge device IJ used in the droplet discharge method, and FIG. 2 is a perspective view showing a part of the droplet discharge device IJ.

  The droplet discharge device IJ forms a device pattern on the substrate P by discharging droplets D of the functional liquid onto the substrate P. The droplet discharge device IJ has a discharge head 3 in a predetermined area including a discharge head 3 having a discharge surface 2 on which a discharge port 1 for discharging a droplet D of a functional liquid is formed, and a first position A1 facing the discharge surface 2. 3, a plurality of moving bodies 4, 5, 6, 7 arranged along the Y axis, and a drive for moving the plurality of moving bodies 4, 5, 6, 7 along the Y axis A device 8, a functional liquid storage device 9 that is connected to the discharge head 3 via a flow path and stores a functional liquid to be supplied to the discharge head 3, and a control device 10 that controls the overall operation of the droplet discharge device IJ. And.

  The droplet discharge device IJ of this embodiment is a multi-head type droplet discharge device including a plurality of discharge heads 3 and includes a carriage member 11 that supports the plurality of discharge heads 3. Further, the droplet discharge device IJ includes a controller 12 including a drive circuit that controls the drive of the discharge head 3. The controller 12 drives the ejection head 3 based on a command from the control device 10.

  In the present embodiment, the substrate P is a low temperature co-fired ceramics (LTCC) multilayer circuit as disclosed in, for example, Japanese Patent Application Laid-Open Nos. 2006-114593 and 2006-261146. It is a board | substrate for forming a board | substrate, Comprising: The LTCC board | substrate (green sheet) before baking is included. The functional liquid includes, for example, those obtained by dispersing conductive fine particles in a predetermined dispersion medium as disclosed in JP-A-2005-34837. In the present embodiment, the conductive fine particles of the functional liquid are mainly composed of silver fine particles (including organic silver compounds and silver oxide nanoparticles), and the dispersion medium is mainly composed of water. In the present embodiment, the droplet discharge device IJ discharges a droplet D of a functional liquid containing silver fine particles onto an LTCC substrate (green sheet) before firing, and the substrate (green sheet) with the droplet D A case where a wiring pattern is formed will be described as an example.

The droplet discharge device IJ has at least three moving bodies. In the present embodiment, the droplet discharge device IJ includes four moving bodies 4, 5, 6, and 7. The first moving body 4 is disposed on the most −Y side among the four moving bodies disposed along the Y axis, and the fourth moving body 7 is disposed on the most + Y side. That is, the 1st moving body 4 and the 2nd moving body 7 are arrange | positioned at both ends regarding the Y-axis direction among the four moving bodies 4, 5, 6, 7 arrange | positioned along the Y-axis. The second moving body 5 and the third moving body 6 are sequentially disposed between the first moving body 4 and the fourth moving body 7.
The second moving body 5 is disposed on the −Y side of the third moving body 6.

  The first moving body 4 is movable while holding the substrate P on which a pattern is formed with the droplets D (details of the first moving body will be described later). The second, third, and fourth moving bodies 5, 6, and 7 include a maintenance device that maintains the ejection head 3. In the present embodiment, the second moving body 5 includes a capping device 13 that covers the ejection surface 2 of the ejection head 3. The third moving body 6 includes a wiping device 14 that removes foreign matter on the ejection surface 2 of the ejection head 3. The fourth moving body 7 includes an immersion device 15 that immerses at least a part of the ejection head 3 in a liquid other than the functional liquid.

  The droplet discharge device IJ includes a base member 17 having a support surface 16 that movably supports the moving bodies 4, 5, 6, and 7. Each of the moving bodies 4, 5, 6, 7 is movable along the support surface 16. In the present embodiment, the support surface 16 is substantially parallel to the XY plane. Further, in the present embodiment, an air bearing is formed between the support surface 16 of the base member 17 and the opposing surfaces of the moving bodies 4, 5, 6, 7 that face the support surface 16. Each moving body 4, 5, 6, 7 is levitated and supported by the air bearing without contact with the support surface 16.

  In addition, the droplet discharge device IJ includes a guide member 18 that guides the movement of the plurality of moving bodies 4, 5, 6, 7 in the Y-axis direction. The guide member 18 is a rod-like member that is long in the Y-axis direction, and is disposed on the support surface 16. In the present embodiment, both ends of the guide member 18 are supported by support members 19 disposed outside the guide member 18. The support member 19 is supported on the floor surface 20. The base member 17 is supported by a support member 21 supported by the floor surface 20.

  In the present embodiment, the driving device 8 includes a linear motor and can move each of the plurality of moving bodies 4, 5, 6, 7 independently. The driving device 8 includes a linear motor stator 22 disposed on the guide member 18 and a linear motor mover disposed on each of the opposing surfaces of the movable bodies 4, 5, 6, 7 facing the guide member 18. 23, 24, 25, 26. The control device 10 can move each of the moving bodies 4, 5, 6, and 7 independently on the base member 17 using a driving device 8 including a linear motor.

  The droplet discharge device IJ is disposed at a position different from the discharge head 3 and performs at least one of the operation of loading the substrate P into the first moving body 4 and the operation of unloading the substrate P from the first moving body 4. A substrate transfer device 27 is provided. In the vicinity of the substrate transfer device 27, a substrate accommodation device 28 capable of accommodating the substrate P is disposed.

  The substrate transfer device 27 performs an operation of loading the substrate P into the first moving body 4 disposed at the second position A2 different from the first position A1 with respect to the Y-axis direction, and an operation of unloading the substrate P from the first moving body 4. Execute at least one of the following. The first position A1 and the second position A2 are separated with respect to the Y-axis direction. In the present embodiment, the first position A1 is a position on the + Y side of the second position A2. The first moving body 4 moves along the support surface 16 of the base member 17 between the first position A1 facing the ejection surface 2 of the ejection head 3 and the second position A2 in the vicinity of the substrate transport device 27. Is possible.

  The substrate transfer device 27 can carry, for example, the substrate P accommodated in the substrate accommodation device 28 into the first moving body 4 arranged at the second position A2. Further, the substrate transport device 27 can carry the substrate P out of the first moving body 4 disposed at the second position A <b> 2 and accommodate it in the substrate accommodation device 28.

  Further, in the present embodiment, the droplet discharge device IJ is provided with a heat insulating member 29 that is disposed on at least a part of the moving path of the first moving body 4 and blocks heat dissipation of the first moving body 4 to the surroundings. ing. The heat insulating member 29 is attached to a predetermined position of the base member 17 so as not to hinder the movement of the moving bodies 5, 6, 7 including the first moving body 4.

  Further, the droplet discharge device IJ includes the discharge head 3, the carriage member 11, the moving bodies 4, 5, 6, 7, the base member 17, the guide member 18, the substrate transport device 27, the substrate storage device 28, and the heat insulating member 29. , Adjusting the environment (temperature, humidity, cleanliness, etc.) of the chamber main body 30 that accommodates each device and member such as the functional liquid storage device 9, the controller 12, and the control device 10, and the space inside the chamber main body 30 A chamber device 32 having a possible air conditioner 31 is provided.

  Next, the discharge head 3 will be described with reference to FIGS. 3 and 4. FIG. 3 is a view of the plurality of ejection heads 3 supported by the carriage member 11 as viewed from below, and FIG. 4 is a cross-sectional view for explaining an example of the structure of the ejection head 3.

  The ejection head 3 according to the present embodiment supplies a predetermined drive signal to a piezo element (piezoelectric element) 33 and deforms the piezo element 33 so that the pressure in the space 34 containing the functional liquid is flexible. This is a discharge head of a so-called electromechanical conversion system that discharges the functional liquid droplet D from the discharge port 1 by using the fluctuation of the pressure via the vibration plate (film) 35. The controller 12 drives the ejection head 3 based on a command from the control device 10. The controller 12 can supply a predetermined drive signal to the piezo element 33 of the discharge head 3 and discharge the droplet D having a size corresponding to the drive signal from each of the discharge ports 1.

As shown in FIG. 3, the droplet discharge device IJ of the present embodiment has a plurality of discharge heads 3.
The plurality of ejection heads 3 are supported by the carriage member 11. The ejection head 3 has an ejection surface (nozzle formation surface) 2 on which ejection ports (ejection nozzles) 1 for ejecting functional liquid droplets D are formed. The discharge surface 2 has a shape that is long in a predetermined direction (in the present embodiment, a substantially rectangular shape). A plurality of discharge ports 1 are formed on the discharge surface 2 along a predetermined direction (longitudinal direction of the discharge surface 2). In the present embodiment, the predetermined direction in which the plurality of discharge ports 1 are arranged is a direction inclined with respect to the X-axis direction in the XY plane.

  As shown in FIG. 4, the ejection head 3 includes a head main body 36 and a plate member (nozzle plate) 37 disposed at the lower end of the head main body 36. The discharge port 1 is formed in the plate member 37. The plate member 37 has a plurality of holes penetrating in the vertical direction. The discharge port 1 is disposed at the lower end of the hole. The discharge surface 2 is disposed on the plate member 37.

  In the present embodiment, the ejection surface 2 of the ejection head 3 (plate member 37) faces downward (−Z side). The surface of the substrate P on which the droplets D from the ejection head 3 are ejected (supplied) is directed upward (+ Z side) so as to face the ejection surface 2 of the ejection head 3. The first moving body 4 holds the substrate P so that the surface of the substrate P faces upward (+ Z side). Further, the ejection surface 2 of the ejection head 3 is substantially parallel to the XY plane. The first moving body 4 holds the substrate P so that the surface of the substrate P and the XY plane are substantially parallel. The control device 10 discharges in a state where the distance (platen gap) between the discharge surface 2 of the discharge head 3 and the surface of the substrate P held by the first moving body 4 is maintained at a predetermined value (for example, 600 μm). A droplet D is discharged from the outlet 1 onto the substrate P.

  The discharge head 3 includes a cavity (space) 34 formed above the plate member 37 (discharge port 1), a flexible plate (vibration plate) 35 disposed above the cavity 34, and a vibration plate. 35 and a piezo element 33 disposed above 35. A plurality of cavities 34 are formed so as to correspond to each of the plurality of discharge ports 1. The cavity 34 is connected to the functional liquid storage device 9 through a flow path. The cavity 34 stores the functional liquid from the functional liquid storage device 9 and supplies the functional liquid to the discharge port 1.

  The diaphragm 35 can vary the pressure (volume) of the cavity 34 by vibrating in the vertical direction. The piezo element 33 can vibrate the diaphragm 35 in the vertical direction. A plurality of piezo elements 33 are arranged so as to correspond to each of the plurality of ejection openings 1. The piezo element 33 causes the vibration plate 35 to vibrate based on the drive signal from the controller 12 and causes the pressure of the cavity 34 to fluctuate, thereby ejecting the functional liquid droplet D from the ejection port 1.

  Further, the controller 12 adjusts a drive signal (drive waveform) supplied to the piezo element 33 as disclosed in, for example, Japanese Patent Application Laid-Open No. 2001-58433, and discharges liquid from each of the discharge ports 1. The amount (size, volume) of the droplet D can be adjusted.

  As shown in FIG. 1, the droplet discharge device IJ of this embodiment includes a holding device 38 that holds a plurality of discharge heads 3 so that the positions of the plurality of discharge heads 3 do not substantially move. The holding device 38 includes a carriage member 11 and a support mechanism 39 that supports the carriage member 11. In the present embodiment, the support mechanism 39 is fixed to the ceiling surface (inner surface) of the chamber body 30. That is, in the present embodiment, the plurality of ejection heads 3 are held so as not to move substantially with respect to the ceiling surface (inner surface) of the chamber body 30 via the holding device 38 including the carriage member 11 and the support mechanism 39. ing.

  In the present embodiment, the support mechanism 39 includes an actuator that can finely move the carriage member 11. The support mechanism 39 can finely move the carriage member 11 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions.

  Next, the first moving body (moving body) 4 that moves by mounting the substrate P will be described with reference to FIGS. 5 and 6. FIG. 5 is a perspective view showing the first moving body 4, and FIG. 6 is a view of the first moving body 4 viewed from the −Y side.

  The first moving body 4 is movable while holding the substrate P on which a pattern is formed with the droplets D. The first movable body 4 includes a first movable member 40 having a mover 23 of a linear motor, and a holder member 42 having a holding mechanism 41 mounted on the first movable member 40 and holding the substrate P.

  An air bearing 43 is formed on the lower surface of the first movable member 40 facing the support surface 16 of the base member 17. The first movable member 40 is supported by the air bearing 43 without contact with the support surface 16. The holder member 42 of the first moving body 4 is configured so that the surface of the substrate P and the ejection surface 2 of the ejection head 3 face each other, and the surface of the substrate P and the XY plane are substantially parallel. Hold.

  As described above, the substrate P of the present embodiment includes a green sheet, and a hole (via) penetrating in the thickness direction is formed in the green sheet. A film made of, for example, polyethylene terephthalate (PET) is attached to the back surface of the substrate P (green sheet), and the holder member 42 of the first moving body 4 is supported by the film F. Hold. That is, in the present embodiment, the holder member 42 of the first moving body 4 holds the substrate P (green sheet) via the film.

A concave portion 44 in which the guide member 18 can be disposed is formed on the lower surface of the first movable member 40. The inner surface of the recess 44 of the first movable member 40 faces the guide member 18. As described above, the linear motor stator 22 is disposed on the guide member 18. A mover 23 of a linear motor is disposed on the inner surface of the recess 44 of the first movable member 40 facing the guide member 18.
The driving device 8 including the stator 22 and the movable element 23 can move the first movable member 40 in the Y-axis direction. As the first movable member 40 moves in the Y-axis direction, the holder member 42 (substrate P) mounted on the first movable member 40 also moves in the Y-axis direction together with the first movable member 40. Moving.

  In the present embodiment, a plurality of actuators 45 are arranged between the first movable member 40 and the holder member 42. The actuator 45 includes, for example, a piezo element. The control device 10 can move (finely move) the holder member 42 holding the substrate P on the first movable member 40 by controlling these actuators 45. In the present embodiment, the holder member 42 holding the substrate P is moved by the actuator 45 on the first movable member 40 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. It is possible to move (fine movement).

  In order to supply the droplets D ejected from the ejection head 3 to the substrate P, the control device 10 moves the first moving body 4 using the driving device 8 to face the ejection surface 2 of the ejection head 3. The board | substrate P currently hold | maintained at the 1st moving body 4 (holder member 42) is arrange | positioned in 1st position A1. In addition, the control device 10 uses the actuator 45 disposed between the first movable member 40 and the holder member 42 to cause the droplet D ejected from the ejection port 1 of the ejection surface 2 to be in a predetermined position on the substrate P. , The distance (platen gap) between the ejection surface 2 of the ejection head 3 and the surface of the substrate P held by the first moving body 4, the ejection surface 2 of the ejection head 3 and the first movement The positional relationship in the tilt direction (θX, θY direction) and the rotational relationship (θZ direction) with the surface of the substrate P held by the body 4 are adjusted. The control device 10 uses the actuator 45 to discharge the discharge head 3 so that the discharge surface 2 of the discharge head 3 and the surface of the substrate P are substantially parallel and the platen gap becomes a predetermined value. The positional relationship between the surface 2 and the surface of the substrate P held by the first moving body 4 is adjusted.

  In the present embodiment, a flushing region is provided on both sides in the Y-axis direction of the holding mechanism 41 that holds the substrate P, of the upper surface of the holder member 42 that can face the discharge surface 2 of the discharge head 3 in each holder member 42. 46 are provided. The flushing region 46 is formed on the upper surface of a porous member that can absorb the droplet D ejected from the ejection port 2 of the ejection head 3. The porous member includes, for example, a sponge-like member.

  Before supplying the droplet D from the ejection head 3 to the substrate P, the control device 10 allows the droplet D to be ejected from the ejection port 1 with the ejection port 1 of the ejection head 3 facing the flushing region 46. An operation of discharging in advance, a so-called flushing operation is performed.

  Further, the first moving body 4 includes a heating device 47 that heats the substrate P. The heating device 47 is provided on the holder member 42. The control device 10 can heat the substrate P held by the holder member 42 using the heating device 47 of the holder member 42.

  The heating device 47 can instantaneously vaporize the liquid component contained in the droplet D discharged from the discharge port 1 of the discharge head 3 and supplied (contacted) to the substrate P. The droplet discharge device IJ uses the heating device 47 to heat the substrate P and supplies the droplet D to the heated substrate P from the discharge port 1 of the discharge head 3 to thereby contact the substrate P with the liquid. Drops D can be dried instantly.

  Further, by supplying the droplet D to the substrate P while heating the substrate P, the pinning phenomenon can be caused. In the drying process of the droplet D after being supplied to the substrate P, when the solid content concentration at the peripheral portion of the droplet D reaches the saturation concentration, the solid content locally precipitates at the peripheral portion. Then, the peripheral portion of the droplet D is pinned by the deposited solid content, and the contraction of the droplet D (outer diameter contraction) accompanying the subsequent drying is suppressed. A pattern (pinning phenomenon in this embodiment) formed on the substrate P by causing such a phenomenon (pinning phenomenon) that the shrinkage of the droplets D caused by drying is suppressed by the solid content deposited on the peripheral portion. ) Edge (outer shape) can be well defined.

  For example, as disclosed in JP-A-2005-28276, JP-A-2005-144324, etc., adjusting the drying conditions, convection conditions, etc. of the droplets D arranged on the surface of the substrate P, You may make it produce the pinning phenomenon in the droplet D discharged (supplied) to the substrate P.

  In the following description, the process of disposing the substrate P of the first moving body 4 at the first position A1 and discharging the droplet D for forming a pattern on the substrate P from the discharge port 1 is appropriately performed as a pattern forming process. .

  Next, the 2nd mobile body 5 is demonstrated, referring FIG.7 and FIG.8. FIG. 7 is a view of the second moving body 5 as viewed from the −X side, and FIG. 8 is a view for explaining an example of the operation of the second moving body 5. The second moving body 5 includes a capping device 13 that covers the ejection surface 2 of the ejection head 3.

The capping device 13 includes a cap member 48 that covers the ejection surface 2 of the ejection head 3.
The cap member 48 includes an upper surface that can face the ejection head 3, and a cap portion 50 that is formed on the upper surface and can form a sealed space 49 between the ejection surface 2 of the ejection head 3. The cap unit 50 includes a recess (groove) formed on the upper surface of the cap member 48, and a space 49 can be formed between the cap unit 50 and the ejection surface 2 of the ejection head 3. A plurality of cap portions 50 are provided so as to correspond to the plurality of ejection heads 3.

  As shown in FIG. 8, the capping device 13 can arrange all of the ejection surface 2 of the ejection head 3 inside the cap portion (concave portion) 50. The capping device 13 forms the space 49 by bringing the upper end of the inner surface of the cap part (recessed portion) 50 into contact with the side surface of the discharge head 3 (plate member 37) outside the discharge surface 2, for example.

  The capping device 13 includes a suction port 53 that is formed on the bottom surface of the cap portion (recessed portion) 50 and can suck the fluid in the space 49, and a vacuum system 55 that is connected to the suction port 53 via the flow path 54. Have.

  The second moving body 5 has a second movable member 51 having a linear motor movable element 24, and the cap member 48 of the capping device 13 is mounted on the second movable member 51. Similar to the first movable member 40 described above, an air bearing is formed on the lower surface of the second movable member 51 that faces the support surface 16 of the base member 17, and the second movable member 51 is in contact with the support surface 16. Supported without contact. Similarly to the first movable member 40 described above, a concave portion in which the guide member 18 can be disposed is formed on the lower surface of the second movable member 51, and the mover 24 is a second movable member facing the guide member 18. It is disposed on the inner surface of the recess of the member 51. The drive device 8 including the stator 22 and the movable element 24 can move the second movable member 51 in the Y-axis direction. As the second movable member 51 moves in the Y-axis direction, the cap member 48 of the capping device 13 mounted on the second movable member 51 also moves in the Y-axis direction together with the second movable member 51. Moving.

  Further, similarly to the first moving body 4 described above, a plurality of actuators 52 are arranged between the second movable member 51 and the cap member 48. The control device 10 can move (finely move) the cap member 48 on the second movable member 51 by controlling these actuators 52. In the present embodiment, the cap member 48 is moved (finely moved) by the actuator 52 on the second movable member 51 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. Is possible.

  In order to cover the ejection surface 2 of the ejection head 3 with the cap member 48, the control device 10 moves the second moving body 5 using the driving device 8 to face the ejection surface 2 of the ejection head 3. The capping device 13 for the second moving body 5 is arranged at A1. The control device 10 uses the actuator 52 disposed between the second movable member 51 and the cap member 48 to provide a space between the ejection surface 2 of the ejection head 3 and the cap portion 50 of the cap member 48. The positional relationship between the ejection surface 2 of the ejection head 3 and the cap portion 50 of the cap member 48 is adjusted so that 49 is formed. For example, the control device 10 uses the actuator 52 to move the cap member 51 in the + Z direction. As a result, the discharge surface 2 is disposed inside the cap portion 50, the upper end of the inner surface of the cap portion 50 contacts the side surface of the discharge head 3 (plate member 37) outside the discharge surface 2, and the space 49 is formed. It is formed.

  The capping device 13 can suck the fluid in the space 49 through the suction port 53 by driving the vacuum system 55 in a state where the space 49 is formed between the discharge surface 2 of the discharge head 3 and the cap unit 50. It is. The capping device 13 can suck the fluid (mainly gas) in the space 49 from the suction port 53 to make the space 49 have a negative pressure. The capping device 13 can suck the functional liquid inside the ejection head 3 such as the cavity 34 through the ejection port 1 by setting the space 49 to a negative pressure. The capping device 13 can generate the flow of the functional liquid toward the discharge port 1 inside the discharge head 3 by sucking the fluid in the space 49.

  The capping device 13 described with reference to FIGS. 7 and 8 mainly has a suction function of sucking the functional liquid of the discharge head 3, but a function of suppressing the drying of the discharge surface 2 (discharge port 1) ( It may have a moisturizing function). For example, a wet porous member (mesh member) is disposed inside the cap unit 50, and the cap unit 50 including the wet porous member is opposed to the discharge surface 2 of the discharge head 3, thereby drying the discharge surface 2. Can be suppressed. That is, by disposing the wet porous member inside the space 49 formed by the discharge surface 2 and the cap portion 50, drying of the discharge surface 2 can be suppressed.

  In the following description, the process of placing the second moving body 5 at the first position A1, facing the discharge surface 2 and the cap portion 50, and covering the discharge surface 2 with the cap member 48 is appropriately performed as a capping process. Called.

Next, the 3rd mobile body 6 is demonstrated, referring FIG.9 and FIG.10. FIG. 9 is a diagram of the third moving body 6 as viewed from the −X side, and FIG. 10 is a diagram for explaining an example of the operation of the third moving body 6. The third moving body 6 includes a wiping device 14 that removes foreign matter on the ejection surface 2 of the ejection head 3.
The foreign matter on the ejection surface 2 of the ejection head 3 includes droplets. The droplets include at least one of the functional liquid droplet D and the liquid droplet of the immersion device 15.

  The wiping device 14 moves the wiping member 57 having a wiping surface 56 that can move relative to the ejection surface 2 and the wiping surface 56 of the wiping member 57 in a state of facing the ejection surface 2 of the ejection head 3. And a housing member 59 that houses the wiping member 57 and the drive mechanism 58.

  At least a part of the wiping member 57 is exposed (projected) from an opening 60 formed on the upper surface of the housing member 59 that can face the ejection head 3, and can face the ejection surface 2 of the ejection head 3. The wiping device 14 moves the wiping surface 56 of the wiping member 57 relative to the ejection surface 2 in a state where the ejection surface 2 of the ejection head 3 and the wiping surface 56 of the wiping member 57 face each other. In 56, the foreign matter adhering to the ejection surface 2 of the ejection head 3 can be removed (removed).

  In the present embodiment, the wiping member 57 is a sheet-like member. The wiping member 57 is made of a material that can absorb liquid. The wiping member 57 includes, for example, a nonwoven fabric. The wiping member 57 may be a woven fabric such as polyester. By forming the wiping member 57 with a material capable of absorbing liquid, when the foreign matter adhering to the ejection surface 2 of the ejection head 3 is a droplet, the droplet (foreign matter) can be removed well.

  The drive mechanism 58 for moving the wiping surface 56 of the wiping member 57 has a plurality of rollers that rotate while supporting the wiping member 57. The drive mechanism 58 is disposed inside the housing member 59 and is positioned closest to the ejection surface 2 of the ejection head 3, a feeding roller 61 that feeds the sheet-like wiping member 57, a take-up roller 62 that winds the wiping member 57, and the like. And a support roller 63 that supports a surface opposite to the wiping surface 56 of the wiping member 57 facing the discharge surface 2 of the discharge head 3. Each of the feeding roller 61 and the take-up roller 62 is rotated by actuators 64 and 65 such as a rotary motor. The wiping device 14 controls the actuators 64 and 65 to move (run) the wiping surface 56 of the wiping member 57 at a predetermined speed. The drive mechanism 58 includes a guide roller that guides the movement (running) of the wiping member 57 and a tension roller that can adjust the tension of the wiping member 57.

  The third moving body 6 includes a third movable member 66 having a linear motor movable element 25, and the housing member 59 of the wiping device 14 is mounted on the third movable member 66. Similar to the first movable member 40 described above, an air bearing is formed on the lower surface of the third movable member 66 facing the support surface 16 of the base member 17, and the third movable member 66 is in contact with the support surface 16. Supported without contact. Similarly to the first movable member 40 described above, a concave portion in which the guide member 18 can be disposed is formed on the lower surface of the third movable member 66, and the movable element 25 is a third movable member facing the guide member 18. The member 66 is disposed on the inner surface of the recess. The drive device 8 including the stator 22 and the movable element 25 can move the third movable member 66 in the Y-axis direction. As the third movable member 66 moves in the Y-axis direction, the housing member 59 of the wiping device 14 mounted on the third movable member 66 also moves in the Y-axis direction together with the third movable member 66. Moving.

  Further, similarly to the first moving body 4 described above, a plurality of actuators 67 are arranged between the third movable member 66 and the housing member 59. The control device 10 can move (finely move) the housing member 59 on the third movable member 66 by controlling these actuators 67. In this embodiment, the housing member 59 is moved (finely moved) by the actuator 67 on the third movable member 66 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. Is possible. The drive mechanism 58 including the wiping member 57 and the roller of the wiping device 14 moves together with the housing member 59 on the third movable member 66 as the housing member 59 moves.

  In order to wipe off the foreign matter on the ejection surface 2 of the ejection head 3 with the wiping member 57, the control device 10 moves the third moving body 6 using the drive device 8 and faces the ejection surface 2 of the ejection head 3. The wiping device 14 of the third moving body 6 is disposed at the 1 position A1. Then, the control device 10 uses the actuator 67 disposed between the third movable member 66 and the housing member 59 so that the foreign matter on the discharge surface 2 can be removed by the wiping surface 56. The positional relationship between the discharge surface 2 and the wiping surface 56 of the portion of the wiping member 57 supported by the support roller 63 is adjusted. For example, the control device 10 uses the actuator 67 to move the housing member 59 in the Z-axis direction. As the housing member 59 moves in the Z-axis direction, the support roller 63 that supports the wiping member 57 also moves in the Z-axis direction. The control device 10 uses the actuator 67 to adjust the distance (gap) in the Z-axis direction between the ejection surface 2 of the ejection head 3 and the wiping surface 56 of the portion of the wiping member 57 supported by the support roller 63. To do. Then, the controller 10 drives the feeding roller 61 and the take-up roller 62 to move (run) the wiping surface 56 of the wiping member 57 with respect to the ejection surface 2 of the ejection head 3. As a result, the wiping device 14 can remove (remove) foreign matter adhering to the ejection surface 2 of the ejection head 3.

  In the following description, the process in which the third moving body 6 is disposed at the first position A1, the discharge surface 2 and the wiping surface 56 face each other, and foreign matter on the discharge surface 2 is removed is appropriately referred to as a wiping process.

  Next, the 4th moving body 7 is demonstrated, referring FIG.11 and FIG.12. FIG. 11 is a diagram of the fourth moving body 7 as viewed from the −X side, and FIG. 12 is a diagram for explaining an example of the operation of the fourth moving body 7. The fourth moving body 7 includes an immersion device 15 that immerses at least a part of the ejection head 3 in a liquid other than the functional liquid.

  The dipping device 15 includes a container 68 that contains a liquid. The liquid in the immersion device 15 includes at least one of a cleaning liquid for cleaning at least a part of the ejection head 3 and a cooling liquid for cooling at least a part of the ejection head 3. An opening 69 is formed in the upper part of the container 68 of the dipping device 15, and the ejection head 3 can move (can enter) into the space inside the container 68 through the opening 69. The control device 10 arranges the discharge head 3 in the space inside the container 68 of the dipping device 15 and immerses it in the liquid, thereby cleaning at least a part of the discharge head 3 such as the discharge surface 2 and the discharge port 1. Or can be cooled.

  As the liquid of the dipping device 15, for example, a dispersion medium of a functional liquid can be used. Since the dispersion medium of the present embodiment is a liquid mainly composed of water, water or a liquid mainly composed of water can be used as the liquid of the immersion device 15. Thereby, at least a part of the ejection head 3 such as the ejection surface 2 and the ejection port 1 can be cleaned or cooled.

  The fourth moving body 7 includes a fourth movable member 70 having a linear motor movable element 26, and the container 68 of the immersion device 15 is mounted on the fourth movable member 70. Similar to the first movable member 40 described above, an air bearing is formed on the lower surface of the fourth movable member 70 facing the support surface 16 of the base member 17, and the fourth movable member 70 is in contact with the support surface 16. Supported without contact. Similarly to the first movable member 40 described above, a concave portion in which the guide member 18 can be disposed is formed on the lower surface of the fourth movable member 70, and the movable element 26 is a fourth movable member facing the guide member 18. It is disposed on the inner surface of the recess of the member 70. The drive device 8 including the stator 22 and the mover 26 can move the fourth movable member 70 in the Y-axis direction. Further, as the fourth movable member 70 moves in the Y-axis direction, the container 68 of the immersion device 15 mounted on the fourth movable member 70 also moves in the Y-axis direction together with the fourth movable member 70. To do.

Further, similarly to the first moving body 4 described above, a plurality of actuators 71 are arranged between the fourth movable member 70 and the container 68. The control device 10 can move (finely move) the container 68 on the fourth movable member 70 by controlling these actuators 71. In the present embodiment, the container 68 can be moved (finely moved) by the actuator 71 on the fourth movable member 70 in directions of six degrees of freedom in the X axis, Y axis, Z axis, θX, θY, and θZ directions. It is.
Further, the surface of the liquid stored in the container 68 of the dipping device 15 moves together with the container 68 on the fourth movable member 70 as the container 68 moves.

In order to immerse at least a part of the ejection head 3 in the liquid of the immersion device 15, the control device 10 moves the fourth moving body 7 using the driving device 8 and opposes the ejection surface 2 of the ejection head 3. The immersion device 15 for the fourth moving body 7 is disposed at the one position A1. Then, the control device 10 uses the actuator 71 disposed between the fourth movable member 70 and the container 68 so that at least the discharge surface 2 of the discharge head 3 is immersed in the liquid in the container 68. The positional relationship between the discharge surface 2 and the container 68 (liquid surface) is adjusted. For example, the control apparatus 10 uses the actuator 71 to move the container 68 in the + Z direction. As the container 68 moves in the + Z direction, the surface of the liquid stored in the container 68 moves so as to approach the ejection head 3. Thereby, the immersion device 15 can immerse at least a part of the ejection head 3 in the liquid.
In addition, the control device 10 can separate the liquid contained in the container 68 from the ejection head 3 by moving the container 68 in the −Z direction using the actuator 71.

  In the following description, the fourth moving body 7 is disposed at the first position A1, the discharge surface 2 and the liquid surface of the container 68 are opposed to each other, and at least a part of the discharge head 3 is immersed in the liquid of the container 68. The treatment is appropriately referred to as immersion treatment.

  In the following description, a process for maintaining the ejection head 3 is appropriately referred to as a maintenance process. The maintenance process includes at least one of the above-described capping process, wiping process, and dipping process.

  As shown in FIG. 2, the heat insulating member 29 is disposed on at least a part of the moving path of each moving body 5, 6, 7 including the first moving body 4. The heat insulating member 29 blocks the diffusion of the heat of the first moving body 4 to the surroundings. As described above, the first moving body 4 (holder member 42) includes the heating device 47 that heats the substrate P. The heat insulating member 29 blocks heat radiating from the first moving body 4 including the heating device 47 to the surroundings.

The heat insulating member 29 is arranged on the moving path of the moving bodies 4, 5, 6, 7 other than the first position A <b> 1.
That is, the heat insulating member 29 is not disposed at the first position A1 where the process using the ejection head 3 is performed. Thereby, execution of various processing (pattern formation processing, maintenance processing, etc.) by the cooperation of the ejection head 3 and each moving body 4, 5, 6, 7 is not hindered.

  Further, the heat insulating member 29 is not arranged at the second position A2 where the processing by the substrate transfer device 27 is executed. That is, in this embodiment, the heat insulation member 29 is arrange | positioned at the movement path | route of the mobile bodies 4, 5, 6, and 7 other than 1st position A1 and 2nd position A2. Thereby, the carrying-in operation of the substrate P by the substrate transfer device 27 and the carrying-out operation of the substrate P from the first moving body 4 to the first moving body 4 arranged at the second position A2 are not hindered.

  In the present embodiment, the heat insulating member 29 is disposed so as to surround the moving bodies 4, 5, 6, 7 at positions away from the moving bodies 4, 5, 6, 7 on the base member 17. The heat insulating member 29 forms an internal space 72 in which each moving body 4, 5, 6, 7 can move. Specifically, the heat insulating member 29 forms an internal space 72 in which each moving body 4, 5, 6, 7 can move (can be arranged) with the support surface 16 of the base member 17. The heat insulating member 29 blocks the diffusion of the heat of the first moving body 4 disposed in the internal space 72 to the external space 73. The external space 73 is a space outside the heat insulating member 29 with respect to the internal space 72. In the present embodiment, the external space 73 includes a space between the chamber main body 30 (the inner surface of the chamber main body 30) and the heat insulating member 29 (the outer surface of the heat insulating member 29).

The air conditioner 31 of the chamber device 32 adjusts at least the temperature of the external space 73. Thereby, each apparatus and member in the chamber body 30 are arranged in a desired environment (temperature).
The heat insulating member 29 has a heat insulating property, and is formed of a material that can block the diffusion of the heat of the first moving body 4 disposed in the internal space 72 to the external space 73. In the present embodiment, the heat insulating member 29 is made of a synthetic resin having heat insulating properties such as foamed polystyrene or foamed urethane.

  The heat insulating member 29 of the present embodiment has a tunnel shape, and openings (entrances / outlets) 74 through which the movable bodies 4, 5, 6, and 7 can pass are formed on both sides of the heat insulating member 29 in the Y-axis direction. . The opening 74 is formed so as to communicate the internal space 72 formed by the heat insulating member 29 and the external space 73.

Next, an example of a procedure for manufacturing a device using the droplet discharge apparatus IJ having the above-described configuration will be described.
Here, when forming the above-mentioned low-temperature co-fired ceramic multilayer circuit board, drawing is performed by discharging droplets of functional liquid (dispersed liquid containing conductive fine particles) onto a plurality of LTCC boards (green sheets) before firing. A description will be given using an example in which processing is sequentially performed.

As schematically shown in FIG. 13 (a), this multilayer circuit board is manufactured by sequentially laminating substrates G1 to G10 before firing (generally referred to as substrate G as appropriate) from the lower layers, and pressing and sintering. It is what is done.
On each of the substrates G1 to G10, the droplets are ejected and drawn according to the pattern to be formed. It is assumed that the substrates G1 to G10 are drawn at the drawing rate shown in FIG. The drawing rate (drawing duty) in this embodiment is indicated by the ratio of the area (area) actually drawn to the drawable area (area) in each of the substrates G1 to G10. In other words, this drawing rate is indicated by the number of dots in the actually drawn area with respect to the number of dots in the drawable area drawn by discharging the droplets from the discharge head 3.

Conventionally, the drawing process is sequentially performed from the substrate G1 positioned in the lower layer. However, in the present embodiment, the drawing rate of each of the substrates G1 to G10 is determined based on the drawing rate of each of the substrates. In addition, the drawing process is performed in the order from the substrate having the higher drawing rate to the substrate having the lower drawing rate so that the drawing process is performed on the substrate having the lower drawing rate.
That is, in this embodiment, as shown in FIG. 13B, the drawing processing is performed in the order of the substrate G1, G2, G4, G7, G8, G3, G9, G6, G10, and G5.

  Specifically, first, the control device 10 controls the driving device 8 to place the first moving body 4 at the second position A2. The control apparatus 10 carries in the substrate P (for example, the substrate G1 (G)) to the first moving body 4 disposed at the second position A2 using the substrate transport device 27. The control device 10 controls the driving device 8 to move the first moving body 4 holding the substrate P to the first position A1.

  FIG. 14 is a schematic diagram illustrating a state in which the first moving body 4 holding the substrate P is disposed at the first position A1. The controller 10 preliminarily discharges the functional liquid droplets from the discharge head 3 to the flushing region 46, and then holds the substrate P at the first position A1 facing the discharge surface 2 of the discharge head 3. One moving body 4 is arranged. Then, the control device 10 controls the controller 12 and the driving device 8 to move the substrate P of the first moving body 4 in the Y-axis direction with respect to the discharge port 1 of the discharge head 3 while moving the substrate P of the discharge head 3. A droplet D is discharged (supplied) to the substrate P from the discharge port 1. Thereby, a pattern is formed on the substrate P by the droplets D. The control device 10 discharges droplets D onto the substrate P while heating the substrate P with the heating device 47.

  In the present embodiment, among the discharge ports 1 of the plurality of discharge heads 3, the distance between the most + X side discharge port 1 and the most −X side discharge port 1 and the size of the substrate P in the X-axis direction are substantially equal. As a result, the droplet discharge device IJ moves the substrate P of the first moving body 4 in the Y-axis direction with respect to the discharge port 1 of the discharge head 3 and drops droplets onto the substrate P from the discharge port 1 of the discharge head 3. When discharging (supplying) D, the droplet D can be supplied to almost the entire surface of the substrate P by only one movement of the substrate P in the Y-axis direction.

  In addition, the droplet discharge device IJ moves the substrate P of the first moving body 4 in the Y axis direction with respect to the discharge port 1 of the discharge head 3 and applies the droplet D to the substrate P from the discharge port 1 of the discharge head 3. The operation of discharging (supplying) may be repeated a plurality of times. For example, the operation of discharging the droplet D while moving the substrate P in the + Y direction and the operation of discharging the droplet D while moving the substrate P in the −Y direction may be repeated a plurality of times. Further, as disclosed in, for example, Japanese Patent Application Laid-Open No. 2004-146996, the position of the substrate P in the X-axis direction is moved by a small distance (for example, one pixel) every time the substrate P moves in the Y-axis direction. You may change only.

As described above, the substrate P of the present embodiment is an LTCC substrate (green sheet) before sintering, and is supported by the film F. The droplet discharge device IJ discharges the droplet D onto the substrate P (green sheet) supported by the film F.
After the operation of ejecting the droplets D on the substrate P is completed, the control device 10 controls the driving device 8 to carry the substrate P out of the first moving body 4 to move the first moving body 4 to the second position. Move to A2. In the present embodiment, the driving device 8 moves the plurality of moving bodies 4, 5, 6, and 7 together in the −Y direction (the direction from the first position A1 toward the second position A2).
Since the heat insulating member 29 is arranged in the moving path of the first moving body 4 between the first position A1 and the second position A2, the first moving between the first position A1 and the second position A2. It can suppress that the heat of the mobile body 4 is dissipated to the external space 73.

  FIG. 15 is a schematic diagram illustrating a state in which the first moving body 4 holding the substrate P is disposed at the second position A2. In the present embodiment, the first moving body 4 capable of holding the substrate P is arranged on the most −Y side (second position A2 side) among the plurality (four) of moving bodies 4, 5, 6, and 7. It is a moving body. As shown in FIG. 15, when the first moving body 4 is arranged at the second position A2, among the plurality (four) moving bodies 4, 5, 6, and 7, the + Y side (first position) The size and number of each moving body 4, 5, 6, 7 and the first position A1 and the second position so that the fourth moving body 7 disposed on the A1 side) is disposed at the first position A1. The distance from A2 is set. Accordingly, as shown in FIG. 15, when the first moving body 4 is disposed at the second position A2, the fourth moving body 7 is disposed at the first position A1.

  The control device 10 uses the substrate transfer device 27 to carry out the substrate P (for example, the substrate G1) from the first moving body 4 arranged at the second position A2, and to add a new substrate to the first moving body 4. While carrying P (for example, substrate G2), the maintenance process of the ejection head 3 is executed using the fourth moving body 7 arranged at the first position A1.

  The dipping device 15 of the fourth moving body 7 performs a maintenance process (immersion process) in cooperation with the ejection head 3. As described with reference to FIG. 12 and the like, the control device 10 immerses the discharge head 3 in the liquid of the immersion device 15 and cleans the discharge head 3. Further, as described above, the ejection head 3 (plate member 37) discharges the droplet D while facing the substrate P of the first moving body 4, so that the ejection head 3 (plate member 37) includes the heating device 47. There is a possibility of being heated by heat. If the plate member 37 of the discharge head 3 is heated and left in that state, for example, the plate member 37 is thermally deformed, and the distance (nozzle pitch) between the discharge ports 1 formed in the plate member 37 varies. there is a possibility. When the nozzle pitch varies, the droplet D cannot be supplied to a desired position on the substrate P, and the performance of the manufactured device deteriorates. In the present embodiment, by immersing the ejection head 3 in the liquid of the immersion device 15, the heated ejection head 3 (plate member 37) is cooled, and the ejection head 3 (plate member 37) is returned to an optimum temperature ( Adjust). Therefore, it is possible to suppress the occurrence of problems such as fluctuation of the nozzle pitch.

  Further, in the present embodiment, the control device 10 uses the maintenance process for the ejection head 3 by the fourth moving body 7 disposed at the first position A1 and the first moving body 4 disposed at the second position A2. It is possible to execute in parallel with at least a part of the processing (unloading and loading processing of the substrate P). Thereby, the processing efficiency of the droplet discharge device IJ can be improved.

  After the processing (immersion processing) using the fourth moving body 7 is completed, the control device 10 controls the driving device 8 to move the plurality of moving bodies 4, 5, 6, and 7 in the + Y direction (second position A2). To the first position A1), and the third moving body 6 is arranged at the first position A1. The control device 10 performs a maintenance process for the ejection head 3 using the third moving body 6 disposed at the first position A1. The wiping device 14 of the third moving body 6 performs maintenance processing (wiping processing) in cooperation with the ejection head 3. As described with reference to FIG. 10 and the like, the control device 10 uses the wiping member 57 of the wiping device 14 to remove the foreign matter adhering to the ejection surface 2 of the ejection head 3. In this embodiment, before the wiping process by the wiping device 14, the immersion process by the immersion apparatus 15 is performed. There is a possibility that liquid droplets of the immersion device 15 remain on the ejection surface 2 of the ejection head 3. The control device 10 uses the wiping device 14 to remove (remove) the liquid droplets of the immersion device 15 remaining on the ejection surface 2 of the ejection head 3.

After the wiping process for the ejection head 3 by the third moving body 6 is completed, the control device 10 controls the driving device 8 to move the plurality of moving bodies 4, 5, 6, and 7 in the + Y direction (from the second position A2). Move in the first direction A1) and place the second moving body 5 at the first position A1.
The control device 10 performs a maintenance process for the ejection head 3 using the second moving body 5 disposed at the first position A1. The capping device 13 of the second moving body 5 performs maintenance processing (capping processing) in cooperation with the ejection head 3. As described with reference to FIG. 8 and the like, the control device 10 uses the capping device 13 to suck the discharge port 1 of the discharge head 3.

After the capping process is completed, the second moving body 6 can be arranged at the first position A1 and the wiping process can be executed. Even when foreign matter (including droplets) is attached to the ejection surface 2 after the capping process is completed, the foreign matter can be removed by the wiping process.
After the capping process on the ejection head 3 by the second moving body 5 is completed, the control device 10 controls the driving device 8 to move the plurality of moving bodies 4, 5, 6, and 7 in the + Y direction (from the second position A2). The first moving body 4 is arranged at the first position A1 by moving together in the direction toward the first position A1. The control device 10 starts a process (pattern formation process) for ejecting the droplets D from the ejection head 3 on the substrate P held by the first moving body 4 arranged at the first position A1. The first moving body 4 cooperates with the ejection head 3 to execute a process for forming a pattern on the substrate P with the droplets D (pattern formation process).

  Thus, in the present embodiment, the control device 10 sequentially arranges the plurality of moving bodies 4, 5, 6, and 7 at the first position A1, and the moving body 4 disposed at the first position A1, Processing by cooperation of 5, 6, 7 and the ejection head 3 is executed. In the present embodiment, the plurality of moving bodies 4, 5, 6, 7 cooperate with the ejection head 3 in the order in which predetermined processing is performed, from the first position A 1 (+ Y side) to the second position A 2 ( -Y side). That is, as described above, the control device 10 sequentially arranges the fourth moving body 7, the third moving body 6, the second moving body 5, and the first moving body 4 at the first position A1, An immersion process using the moving body 7, a wiping process using the third moving body 6, a capping process using the second moving body 5, and a pattern forming process using the first moving body 4 are sequentially executed. In the present embodiment, the fourth moving body 7, the third moving body 6, the second moving body 5, and the first moving body 4 are arranged in this order from the first position A1 toward the second position A2. .

  The film is removed from the substrate P after the pattern is formed with the droplets D. A predetermined pattern is formed on each of the substrates G1 to G10 by repeating the droplet discharge processing (drawing processing) in the order of the substrates G1, G2, G4, G7, G8, G3, G9, G6, G10, and G5. It is formed. And the some board | substrate P (G1-G10) which has each pattern is laminated | stacked, and the laminated body of the board | substrate P is formed. Thereafter, the laminated body of the substrates P is heat-treated. Thereby, the droplets D on the substrate P are dried and fired, and the substrate P (green sheet) is also fired. Thereby, an LTCC substrate (LTCC multilayer circuit substrate) having a predetermined wiring pattern is formed.

  As described above, in the present embodiment, functional liquid droplets are ejected in order of decreasing drawing ratio based on the drawing ratio for each of the substrates G1 to G10. Since the discharge port 1 that has been used or the discharge port 1 in the vicinity thereof can be used, the drawing process can be performed using a functional liquid with a short residence time. Therefore, in the present embodiment, it is possible to use a minimum amount of preliminary ejection performed before the drawing process, and the use efficiency of the functional liquid can be improved even when the density of the drawing area changes. Cost can be suppressed.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to FIGS.
In this figure, the same reference numerals are given to the same elements as those of the first embodiment shown in FIGS. 1 to 15, and the description thereof is omitted.

As shown in FIG. 16, in the present embodiment, the first movable member 40 in the first moving body 4 includes a holding mechanism (holding unit) 41 that holds the substrate P (appropriately indicated by the symbols PA and PB). A plurality (two in this case) of holder members 42 (represented by reference numerals 42A and 42B as appropriate) are provided along the Y direction, which is a relative movement direction with respect to the ejection head 3, and the holder member 42 is spaced from the + Y side. And a flushing area FA in which functional liquid droplets are preliminarily ejected from the ejection head 3. The flushing area FA is formed of the same material as the flushing area 46. In the present embodiment, a flushing region 46 is provided on one side (−Y side) in the Y-axis direction of the holding mechanism 41 that holds the substrate P on the upper surface of the holder member 42.
Other configurations are the same as those of the first embodiment.

  In the droplet discharge device IJ configured as described above, the control device 10 controls the controller 12 and the drive device 8 to move the first moving body 4 relative to the discharge head 3 in the + Y direction, while moving from the discharge head 3. By discharging droplets of the functional liquid, it is possible to sequentially perform drawing processing on the substrate P (PA) held by the holder member 42A and the substrate P (PB) held by the holder member 42B.

  In the present embodiment, as shown in FIG. 17, a pair of substrates (substrate group) that is held by the holder members 42 </ b> A and 42 </ b> B and is continuously subjected to the drawing process is set based on the drawing ratios of the substrates G <b> 1 to G <b> 10. is doing. More specifically, the substrate group KG1 is formed by the substrates G1 and G2, the substrate group KG2 is formed by the substrates G4 and G7, and the substrates G8 and G3 are formed so that the average drawing ratio of the two substrates is sequentially reduced. A group KG3 is formed, a substrate group KG4 is formed by the substrates G9 and G6, and a substrate group KG5 is formed by the substrates G10 and G5. And the order which performs a drawing process with respect to the board | substrate groups KG1-KG5 is the drawing process with respect to the board | substrate group which has an average drawing rate smaller than the average drawing rate of the said board | substrate group after the board | substrate group which performed the drawing process. As in the case of KG1, KG2, KG3, KG4, and KG5. Similarly, in each of the substrate groups KG1 to KG5, the drawing process is performed in the order of decreasing the drawing rate (for example, in the substrate group KG5, the order of the substrate G10 → the substrate G5).

As described above, in the present embodiment, even when the droplet discharge device IJ capable of performing continuous drawing processing on a plurality of substrates is used, it is possible to discharge a functional liquid having a short residence time. It is possible to improve the use efficiency of the functional liquid by reducing the amount, and it is possible to perform a droplet discharge process on a plurality of substrates P in one scan, thereby improving productivity. . In particular, in the present embodiment, it is possible to easily cope with small-quantity, multi-product manufacturing by discharging droplets with different discharge patterns to the substrates PA, PB of the holder members 42A, 42B.
Note that when the continuous drawing process is performed on the substrates PA and PB of the holder members 42A and 42B as in the present embodiment, there is no significant difference in the drawing rate because the movement time between the substrates is short. In such a case, it is not always necessary to perform drawing in the order of decreasing drawing ratio (for example, drawing is performed in the order of the substrates G6 → G9 in the substrate group KG4).

  As described above, the preferred embodiments according to the present invention have been described with reference to the accompanying drawings, but the present invention is not limited to the examples. Various shapes, combinations, and the like of the constituent members shown in the above-described examples are examples, and various modifications can be made based on design requirements and the like without departing from the gist of the present invention.

  For example, in the above-described embodiment, an example in which ten substrates are stacked has been described. However, the present invention is not limited to this, and the present invention can be widely applied when drawing processing is performed on a plurality of substrates. Moreover, in the said embodiment, although the structure using two holder members was illustrated, the structure provided 3 or more may be sufficient. In this case, it goes without saying that three or more types of patterns may be discharged onto the substrate.

In the above embodiment, the substrate P is an LTCC substrate (green sheet) and a wiring pattern (circuit pattern) is formed on the substrate P as an example. However, the substrate P is not limited to a green sheet. It can be appropriately selected according to the device to be manufactured, such as a glass substrate or a semiconductor wafer, and can also be applied to the case of using a plurality of different types of substrates.
Further, the conductive fine particles of the functional liquid used are not only silver but also metal fine particles such as gold, copper, palladium, and nickel as disclosed in, for example, JP-A-2005-34837. It may be a conductive polymer. Moreover, the dispersion medium used can also be suitably selected according to electroconductive fine particles.
In addition to the wiring pattern, at least a part of a thin film transistor (TFT) can be formed.

  A device that can be manufactured using the droplet discharge device IJ is not limited to a circuit board, and can form at least a part of a liquid crystal device such as a color filter, an alignment film, or the like, or at least an organic EL device. A part can also be formed.

  IJ: Droplet discharge device, D: Droplet, FA: Flushing region, G1 to G10, P, PA, PB ... Substrate, 3 ... Discharge head, 4 ... First moving body (moving body), 10 ... Control device ( Discharge control device), 41 ... Holding mechanism (holding unit), 42 ... Holder member (table), 46, 46A, 46B ... Flushing region

Claims (7)

A droplet discharge method for drawing at a drawing rate corresponding to a pattern to be formed for each substrate by moving the substrate relative to the discharge head, discharging droplets of the functional liquid to a predetermined drawing region of the substrate Because
A droplet discharge method characterized in that, when performing drawing processing on a plurality of the substrates in sequence, an order in which drawing processing is performed is set based on a drawing rate for each substrate. The droplet discharge method according to claim 1.
A droplet discharge method comprising: performing a drawing process on a substrate having a drawing rate smaller than a drawing rate of the substrate after the substrate subjected to the drawing process. The droplet discharge method according to claim 1.
A droplet discharge method characterized in that, when performing a drawing process sequentially on a group of substrates in which a plurality of the substrates are arranged along the relative movement direction, the arrangement order of the substrates is set based on a drawing rate for each substrate. . The droplet discharge method according to claim 3.
A droplet discharge method, wherein when performing a drawing process sequentially on a plurality of the substrate groups, an order of performing the drawing processes is set based on an average drawing rate of the plurality of substrates in each substrate group. The droplet discharge method according to claim 4.
A droplet discharge method, comprising: performing a drawing process on a substrate group having an average drawing rate smaller than an average drawing rate of the substrate group after the substrate group on which the drawing process has been performed. In the droplet discharge method according to any one of claims 3 to 5,
A droplet discharge method comprising: performing drawing processing on a substrate having a drawing rate smaller than a drawing rate of the substrate after the substrate subjected to drawing processing on a plurality of substrates in the substrate group .   A device manufacturing method comprising a step of discharging functional liquid droplets onto a substrate by the droplet discharging method according to claim 1.

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