JP2010027642A - Electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide electronic equipment which cools an electronic component by a simple configuration. <P>SOLUTION: Electronic equipment 100 comprises: a housing 1; an electronic component housed in the housing 1; an exhaust opening 10 formed in one wall surface 6 of the housing 1 in a position higher than that of the electronic component; an air inlet 8 formed in the other wall surface 5 facing the one wall surface 6 in a position lower than that of the electronic component, and a filter 9 arranged between the air inlet 8 and the electronic component. The filter 9 forms an inclined plane 9A which descends in monotone toward the one wall surface 6 from the other wall surface 5. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electronic device, and more particularly to an electronic device having a structure for cooling an electronic component housed in a housing.

  A blade server is an electronic device that houses server blades side by side in a casing and operates the server blades that are housed. The server blade is generally a circuit board in which various circuit components are mounted on an elongated board. In the present specification, components of various types of electronic devices including such a circuit board are hereinafter referred to as electronic components.

  In a blade server, a large number of electronic components may be mounted as the mounting becomes higher. For this reason, the blade server needs a structure for cooling the heat generated during operation of the electronic component.

  Patent Document 1 describes an electronic device having a structure for cooling an electronic component to be cooled. The electronic device includes an accommodating portion that accommodates an electronic component, an exhaust port formed on the back side of the electronic component and above the accommodating portion, a cooling fan disposed near the exhaust port, and an electronic component And an intake port formed on the front side and below the housing. Further, in this electronic device, an airflow director that forms an airflow path is disposed between the air inlet and the accommodating portion. The airflow director is formed with a path for supplying the airflow to the front side, the center side, and the back side of the electronic component housed in the housing unit.

Special table 2008-501200

  In the electronic device disclosed in Patent Document 1, the outside air taken in from the intake port by the suction force of the cooling fan is dispersed through each path of the airflow director, and further passes through the front side, the center side, and the back side of the electronic component. Then, the electronic components are cooled substantially uniformly by being exhausted to the outside through the exhaust port.

  However, the airflow director has a problem that the structure is complicated because each path must be formed in consideration of the flow direction and the airflow of the airflow in order to disperse the airflow. Furthermore, it was necessary to secure a space for arranging the airflow director.

  An object of the present invention is to provide an electronic device that can cool an electronic component substantially uniformly with a simple configuration.

In order to achieve the above object, the present invention is formed in a casing, an electronic component accommodated in the casing, and one wall surface of the casing at a position above the electronic component. An exhaust port, an intake port that is the other wall surface facing the one wall surface and is formed below the electronic component, and a filter disposed between the intake port and the electronic component. ,
The said filter forms the inclined surface which descends monotonously toward said one wall surface from said other wall surface, The electronic device characterized by the above-mentioned is provided.

  According to the electronic device of the present invention, since the filter forms an inclined surface, the airflow passing through the electronic component can be dispersed, and the electronic component can be cooled substantially uniformly with a simple configuration.

  Hereinafter, exemplary embodiments of the present invention will be described in detail with reference to the drawings. FIG. 1 is a diagram illustrating a configuration of an electronic device according to an embodiment of the present invention. In the figure, the cooling structure of the electronic device is mainly shown, and other components are omitted as appropriate. The electronic device is a blade server, and the object to be cooled is an electronic component such as a server blade. FIG. 2 shows a cross section viewed from the A direction of the blade server shown in FIG. 1 and the airflow movement inside the blade server.

  The blade server 100 is an electronic device that operates by housing a plurality of electronic components inside the housing 1. The housing 1 includes a housing portion 2 that is a space for housing electronic components, an upper space 3 that is above the housing portion 2 and allows air to flow with the housing portion 2, and that is below the housing portion 2. It is divided into a part 2 and a lower space 4 in which air can flow.

  A front plate (not shown) is attached to the front surface portion 5 of the housing portion 2 to block inflow of air (outside air) outside the housing 1. Further, a back plane 7 is disposed on the back surface portion 6 of the housing portion 2 to block the inflow of outside air. Electronic parts are mounted in the accommodating part 2 in a state where they are arranged side by side in the vertical direction and are electrically connected to the backplane 7.

  The lower space 4 of the housing 1 has an intake port 8 and a dust collection filter 9. The air inlet 8 is an opening for taking in outside air, and is formed on the front surface of the housing 1 and at a position below the electronic component.

  The dust collection filter 9 is disposed between the air inlet 8 and the electronic component, and is formed of a planar or three-dimensional fine mesh filter material. As illustrated, the dust collection filter 9 forms an inclined surface 9A that monotonously descends from the front surface of the housing 1 toward the back surface. The inclined surface 9A has an inclination angle of approximately 10 ° with respect to the horizontal direction. The filter medium includes, for example, chemical fibers and the like, has a porous structure, and has a function of removing dust in the passing air.

  The upper space 3 of the housing 1 has an exhaust port 10, cooling fans (first cooling fans) 11a to 11d, and cooling fans (second cooling fans) 12a to 12d. The exhaust port 10 is an opening for discharging the airflow to the outside of the housing 1, and is formed on the back surface of the housing 1 and above the electronic component. The cooling fans 11 a to 11 d are arranged adjacent to the exhaust port 10, and suck the air in the housing 1 by the suction force accompanying the rotation of the fan and discharge it from the exhaust port 10.

  The cooling fans 12a to 12d are mounted on the mounting plate 13, and are disposed near the front surface of the housing 1 and in front of the cooling fans 11a to 11d. The mounting plate 13 includes a wall portion 13 a inclined upward from the front surface of the housing 1 toward the back surface, and a wall portion 13 b inclined downward from the top portion of the wall portion 13 a toward the back surface of the housing 1. The cooling fans 12 a to 12 d are mounted on the wall portion 13 b of the mounting plate 13.

  The cooling fans 12a to 12d are axial fans, and are mounted on the wall 13b of the mounting plate 13 so that the exhaust direction of the axial fans is inclined from the vertically upward direction to the back side. The inclination angle of the cooling fans 12a to 12d is approximately 45 °.

  The cooling fans 11a to 11d and 12a to 12d have the same exhaust capability. Moreover, since the cooling fans 11a to 11d suck not only the exhaust from the cooling fans 12a to 12d but also a part of the airflow passing through the housing portion 2, the air volume is larger than the air volume of the cooling fans 12a to 12d. Is set.

  Hereinafter, the operation of the blade server 100 when cooling the electronic component to be cooled will be described with reference to FIG. First, when the cooling fans 11 a to 11 d and 12 a to 12 d are driven, outside air is taken in from the intake port 8 due to suction force accompanying rotation of the fans, and air currents 101 a, 101 b, and 101 c are generated in the lower space 4 of the housing 1. .

  The airflows 101a, 101b, and 101c pass through the filter medium while colliding with the dust collection filter 9 in the horizontal direction and receiving resistance. At this time, dust in the airflows 101a, 101b, and 101c is removed, and the airflow direction is deflected by approximately 90 ° from the horizontal direction to become vertical airflows 102a, 102b, and 102c. The airflows 102a, 102b, and 102c flow in the accommodating portion 2 in a substantially vertical direction as illustrated.

  As shown in the figure, the airflows 101a, 101b, and 101c collide with the flat surfaces of the dust collection filter 9 that are inclined and are located on the front side, the back side, and the center side of the housing portion 2, respectively. . Airflows 101a, 101b, and 101c that collide with and pass through the dust collection filter 9 become airflows 102a, 102b, and 102c that pass through and around the electronic components housed in the housing part 2, respectively. That is, the outside air taken in from the intake port 8 passes through the dust collection filter 9 and flows into the housing portion 2 in a uniformly dispersed state.

  The inclination angle of the dust collection filter 9 is approximately 10 ° as described above. However, the inclination angle is not limited to this, and if the airflow is dispersed when passing through the dust collection filter 9, an appropriate angle is set. You may choose. As an example, the inclination angle is preferably in the range of 0 ° to 20 °.

  The flow direction of the airflow 102a is a direction that passes through the front surface side of the electronic component by the suction force of the cooling fans 12a to 12d that are arranged in the vicinity of the front surface portion 5 of the housing portion 2. Moreover, the flow direction of the airflow 102b is a direction that passes through the back side of the electronic component by the suction force of the cooling fans 11a to 11d arranged in the vicinity of the exhaust port 10 formed on the back side of the housing 1. The flow direction of the air flow 102c passes through the center side of the electronic component by the suction force of both the cooling fans 11a to 11d and 12a to 12d, and then passes to the cooling fans 11a to 11d and 12a to 12d inside the housing portion 2. It becomes the direction which branches respectively toward.

  The airflows of the airflows 102a, 102b and 102c are obtained by dispersing the outside air taken in from the intake port 8 by the dust collecting filter 9 and accommodating the suction force of the cooling fans 12a to 12d as well as the cooling fans 11a to 11d. Due to the fact that it is generated in the section 2, it is substantially equal.

  The airflow 102 a and a part of the airflow 102 c are sucked by the cooling fans 12 a to 12 d while taking away the heat generated in the area near the front surface of the electronic component, and discharged as the exhaust 103 toward the cooling fans 11 a to 11 d. . Further, the airflow 102b and a part of the airflow 102c are sucked by the cooling fans 11a to 11d while taking heat generated in a region near the back surface of the electronic component, and are exhausted from the exhaust port 10 as the exhaust 104 to the outside of the housing 1. Is discharged. The exhaust 104 includes not only a part of the airflow 102b and the airflow 102c but also the exhaust 103 from the cooling fans 12a to 12d.

  As described above, the region close to the front surface portion 5 of the housing portion 2 is cooled by a part of the airflow 102a and the airflow 102c, and the region close to the back surface portion 6 of the housing portion 2 is part of the airflow 102b and the airflow 102c. It is cooled by. For this reason, the electronic component accommodated in the accommodating part 2 is cooled substantially uniformly.

  FIG. 3 is a diagram illustrating a configuration of a blade server as a comparative example. The blade server 100A has a dust collection filter 9B installed in a substantially horizontal direction, and the cooling fans 12a to 12d are not arranged in the upper space 3 of the housing 1, so that the blade according to the embodiment is used. Different from the server 100. The same members as those of the blade server 100 are denoted by the same reference numerals, and description thereof is omitted as appropriate.

  In the blade server 100A, as shown in the figure, the dust collection filter 9B is arranged in a substantially horizontal direction, and the cooling fans are only the cooling fans 11a to 11d arranged in the vicinity of the exhaust port 10. Airflow concentrates on the back side, and airflow sufficient to cool the electronic component is hardly generated on the front side of the housing portion 2.

  Specifically, the airflow 201a, 201b, 201c taken in from the intake port 8 by the suction force of the cooling fans 11a to 11d is substantially flat on the plane of the dust collection filter 9B in a state where the airflow 201a, 201b, 201c is biased toward the back side of the housing portion 2. pass. Therefore, the airflows of the airflows 202a, 202b, and 202c that flow into the housing part 2 through the dust collection filter 9B are reduced from the back side to the front side of the housing part 2, and sufficiently cool the front side of the electronic component. It becomes difficult. The airflows 202 a, 202 b, and 202 c that have passed through the housing portion 2 become the airflow 203 in the upper space 3 of the housing 1, are sucked by the cooling fans 11 a to 11 d, and are discharged as exhaust 204 from the exhaust port 10.

  On the other hand, in the blade server 100 according to the present embodiment, as described above, the dust collection filter 9 is inclined and disposed in the lower space 4 of the housing 1 to disperse the airflow flowing into the storage unit 2. it can. Further, the cooling fans 12 a to 12 d are arranged in an inclined manner in the upper space 3 of the casing 1, thereby allowing a substantially uniform air flow to pass through the housing portion 2 and cooling fans 11 a to 11 d arranged in the vicinity of the exhaust port 10. Can be discharged from. Therefore, according to the blade server 100, the electronic components housed in the housing portion 2 can be cooled substantially uniformly with a simple configuration.

  In the above embodiment, four cooling fans 11 a to 11 d and four cooling fans 11 a to 12 d are arranged side by side. However, the present invention is not limited to this, and an appropriate number may be arranged according to the size of the casing 1 of the blade server 100. .

  Further, the inclination angle of the cooling fans 12a to 12d is set to about 45 °, but is not limited to this. In consideration of the fact that the direction in which the suction force acts or the exhaust direction affects the cooling efficiency, 30 ° to You may select the range of 60 degrees suitably.

  In addition, since the airflow can be dispersed by the dust collecting filter 9 disposed at an inclination, the cooling fan 11a to 11d is generated only by the suction force without providing the cooling fans 12a to 12d unless cooling efficiency is taken into consideration. The electronic component may be cooled by the airflow. In this way, the electronic component can be cooled with a simpler configuration.

  Moreover, although the cooling fans 11a-11d were arrange | positioned in the vicinity of the exhaust port 10, it is not restricted to this, A duct may be connected to the housing | casing 1 and you may arrange | position in this duct. Thereby, even when the cooling fans 11a to 11d are arranged away from the exhaust port 10, the airflow that has passed through and around the electronic component can be discharged.

  In the electronic device of the above embodiment, one wall surface is the back surface of the housing, and the other wall surface is the front surface of the housing. In this case, the filter forms an inclined surface that descends monotonously from the front surface to the back surface of the housing, and the outside air taken in from the intake port collides with the entire surface of the filter and is dispersed.

  A first cooling fan is disposed adjacent to the exhaust port. Thereby, the airflow after cooling an electronic component can be exhausted from an exhaust port.

  A second cooling fan is further provided above the electronic device and in front of the first cooling fan. In this case, a sufficient airflow can be passed through the front side of the electronic component by the suction force of the second cooling fan.

  The second cooling fan is an axial fan, and the exhaust direction of the axial fan is inclined from the vertical direction to the back side. Thereby, the airflow passing through the front side of the electronic component can be sufficiently sucked and exhausted toward the first cooling fan, so that the cooling efficiency is increased.

  Although the present invention has been described based on the preferred embodiment, the electronic device of the present invention is not limited to the configuration of the above embodiment, and various modifications and changes can be made from the configuration of the above embodiment. Those applied are also included in the scope of the present invention.

1 is a diagram showing a configuration of an electronic device according to an embodiment of the present invention. The figure which shows the motion of the cross section of the electronic device shown in FIG. The figure which shows the structure of the electronic device as a comparative example.

Explanation of symbols

1: Housing 2: Housing part 3: Upper space 4: Lower space 5: Front part 6: Back part 7: Back plane 8: Intake port 9: Dust collection filter 9A: Inclined surface 10: Exhaust ports 11a to 11d: Cooling Fan (first cooling fan)
12a to 12d: cooling fan (second cooling fan)
13: Mounting plates 13a, 13b: Wall 100: Blade servers 101a-101c, 102a-102c: Airflow 103, 104: Exhaust

Claims (5)

A housing, an electronic component housed in the housing, an exhaust port formed on one wall surface of the housing at a position higher than the electronic component, and the other facing the one wall surface A suction port formed at a lower position than the electronic component, and a filter disposed between the suction port and the electronic component,
The electronic device according to claim 1, wherein the filter forms an inclined surface that monotonously descends from the other wall surface toward the one wall surface.   The electronic apparatus according to claim 1, wherein the one wall surface is a back surface of the housing and the other wall surface is a front surface of the housing.   The electronic device according to claim 1, wherein a first cooling fan is disposed adjacent to the exhaust port.   The electronic apparatus according to claim 3, further comprising a second cooling fan above the electronic apparatus and in front of the first cooling fan.   The electronic device according to claim 4, wherein the second cooling fan is an axial fan, and an exhaust direction of the axial fan is inclined from a vertical direction to a back side.

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