CN109634391B

CN109634391B - Heat dissipation device

Info

Publication number: CN109634391B
Application number: CN201811566119.XA
Authority: CN
Inventors: 刘浩
Original assignee: Vtron Group Co Ltd
Current assignee: Zhuzhou Yijie Electronic Technology Co ltd
Priority date: 2018-12-20
Filing date: 2018-12-20
Publication date: 2022-08-16
Anticipated expiration: 2038-12-20
Also published as: CN109634391A

Abstract

The application provides a heat dissipation device, which comprises a shell, a heating part, a first heat dissipation fan and a partition board, wherein the partition board separates the interior of the shell into three areas, the third area is positioned between the first area and the second area, the heating part is placed in the first area and the second area, and the first heat dissipation fan is arranged in the third area; an air inlet is formed in the side face, opposite to the partition plate, of the shell; and an air outlet is formed in the side surface of the shell corresponding to the third area. First radiator fan is at the during operation, inhale first region and second region with the outside air of casing via the air intake, and discharge through the air outlet in third region, dispel the heat with generating heat, the air of following the air outlet exhaust can not cause the influence to the setting at first region, the heat dissipation of the piece that generates heat in second region and third region, compare with the radiating mode of air-out on the lower air inlet of prior art, and the radiating efficiency is improved, the life and the operation speed of product have been promoted.

Description

Heat dissipation device

Technical Field

The application relates to the field of heat dissipation, in particular to heat dissipation equipment.

Background

With the continuous progress of electronic technology, the processor has more and more powerful functions and can simultaneously process information such as images, documents, videos and the like. However, such processors have high power consumption and large heat generation amount, and if the heat generated by the processors cannot be discharged in time, the temperature of the processors is rapidly increased, irreversible damage is caused to internal boards and chips of the processors, and the processing speed is also influenced.

At present, in order to dissipate heat of a processor, an air duct of the processor is generally designed to be a heat dissipation mode of downward air intake and upward air outtake, but the temperature of air can rise after the air flows through a lower layer area, and the heat dissipation efficiency of an upper layer area can be reduced when the air flows through an upper layer area, so that the heat dissipation efficiency of the processor is affected.

Disclosure of Invention

In order to solve the above problem, an embodiment of the present application provides a heat dissipation apparatus, where the apparatus includes a housing, a heat generating component, a first heat dissipation fan, and a partition;

the partition plates comprise a first partition plate and a second partition plate, and the first partition plate and the second partition plate are arranged in the shell at intervals to separate the interior of the shell into a first area, a second area and a third area;

the third area is positioned between the first area and the second area, wherein the heating element is arranged in the first area and the second area, and the first cooling fan is arranged in the third area;

an air inlet is formed in the side face, opposite to the partition plate, of the shell;

an air outlet is formed in the side face of the shell corresponding to the third area;

when the first heat dissipation fan works, air outside the shell is sucked into the first area and the second area through the air inlet and is exhausted through the air outlet of the third area, and therefore heat of the heating part is dissipated.

Optionally, in this embodiment, the first partition and the second partition are arranged in parallel in the casing, and the heat generating member is vertically arranged between the first area and the second area to form a ventilation channel;

when the first cooling fan works, air outside the shell is sucked into the ventilation channel through the air inlet and is exhausted through the air outlet of the third area, so that heat of the heating part is dissipated.

Optionally, in this embodiment, the heat generating members are disposed between the first partition board, the second partition board and the air inlet at equal intervals, and are perpendicular to the first partition board and the second partition board.

Optionally, in this embodiment, the first heat dissipation fan is a double-suction centrifugal fan.

Optionally, in this embodiment, the number of the double suction centrifugal fans is at least one.

Optionally, in this embodiment, the heat generating component includes a processor board card and a processing chip disposed on the board card.

Optionally, in this embodiment, the heat dissipation apparatus further includes a power module, where the power module is disposed between the air inlet of the second area and the second partition, and the power module is configured to supply power to the heat dissipation apparatus.

Optionally, in this embodiment, the apparatus further includes a second heat dissipation fan, where the second heat dissipation fan is disposed between the power module and the second partition board, and is configured to dissipate heat of the power module.

Optionally, in this embodiment, the second heat dissipation fan is an axial fan.

Optionally, in this embodiment, a plurality of ventilation openings corresponding to the ventilation channels are disposed on the first partition plate and the second partition plate.

Compared with the prior art, the embodiment of the application has the following beneficial effects:

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.

Fig. 1 is a schematic cross-sectional view of a heat dissipation apparatus according to an embodiment of the present disclosure;

fig. 2 is a schematic cross-sectional view of a double-suction centrifugal fan according to an embodiment of the present disclosure;

fig. 3 is a second schematic cross-sectional view of a heat dissipation apparatus according to an embodiment of the present application;

FIG. 4 is one of the schematic views of a separator provided in accordance with an embodiment of the present application;

fig. 5 is a second schematic view of a separator according to an embodiment of the present application.

Icon: 10-a heat dissipation device; 100-a housing; 101-a heat generating member; 102-a first heat dissipation fan; 103-a separator; 1001-first area; 1002-a second region; 1003-third area; 1031-a first separator; 1032-a second separator; 1033-a vent; 104-an air inlet; 105-an air outlet; 106-a ventilation channel; 107-power module; 108-a second heat dissipation fan; 201-a first inlet; 202-a second inlet; 203-side exit.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present application without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is noted that the terms "first", "second", "third", and the like are used merely for distinguishing between descriptions and are not intended to indicate or imply relative importance.

The terms "upper", "lower", "left", "right", "inner", "outer", and the like, refer to an orientation or positional relationship based on that shown in the drawings, or that is conventionally placed during use of the product of this application, and are used only for convenience in describing and simplifying the application, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and therefore should not be construed as limiting the application.

Furthermore, the terms "vertical" and the like do not require absolute perpendicularity between the components, but may be slightly inclined. Such as "vertical" merely means that the direction is relatively more vertical and does not mean that the structure must be perfectly vertical, but may be slightly inclined.

In the description of the present application, it is also noted that the terms "disposed," "mounted," "connected," and the like are to be construed broadly unless otherwise specifically stated or limited. For example, the connection can be fixed, detachable or integrated; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

Referring to fig. 1, fig. 1 is a schematic cross-sectional view of a heat dissipation apparatus according to an embodiment of the present disclosure. In this embodiment, the heat dissipating apparatus 10 includes: a casing 100, a heat generating member 101, a first heat dissipating fan 102, and a partition 103. The heating member 101 generates a large amount of heat during operation, so that the temperature of the operating environment of the heating member 101 is increased, and the first cooling fan 102 is used for cooling the heating member 101 to ensure the normal operation of the heating member 101.

The partition plate 103 includes a first partition plate 1031 and a second partition plate 1032, and the first partition plate 1031 and the second partition plate 1032 are disposed in the housing 100 at intervals to separate the interior of the housing 100 into a first region 1001, a second region 1002, and a third region 1003.

The third region 1003 is located between the first region 1001 and the second region 1002. The first region 1001 and the second region 1002 are used for placing the heat generating element 101, and the third region 1003 is used for placing the first heat dissipation fan 102.

An air inlet 104 is arranged on the side surface of the shell 100 opposite to the partition plate 103; an air outlet 105 is arranged on the side surface of the casing 100 corresponding to the third area 1003.

When the first heat dissipation fan 102 operates, air outside the housing 100 is sucked into the first region 1001 and the second region 1002 through the air inlet 104 and is exhausted through the air outlet 105 of the third region 1003, so as to dissipate heat of the heat generating members 101 located in the first region 1001 and the second region 1002.

The air outside the casing 100 enters from the air inlets 104 of the first area 1001 and the second area 1002 respectively, and is directly discharged from the side surface of the third area 1003 after the heat of the heat generating member 101 is dissipated, so that the heat generating member 101 in the other area is not affected.

Referring to fig. 1, in the present embodiment, the first partition plate 1031 and the second partition plate 1032 are disposed in parallel in the housing 100, and the heat generating member 101 is vertically disposed between the first region 1001 and the second region 1002 to form the ventilation channel 106.

When the first heat dissipation fan 102 operates, air outside the housing 100 is sucked into the ventilation channel 106 through the air inlet 104 and is exhausted through the air outlet 105 of the third area 1003, so as to dissipate heat of the heat generating member 101.

Optionally, in this embodiment, the heat generating members 101 are disposed between the first partition plate 1031, the second partition plate 1032 and the air inlet 104 at equal intervals, and are perpendicular to the first partition plate 1031 and the second partition plate 1032.

It should be noted that fig. 1 illustrates the number of the first heat dissipation fans 102, in other embodiments of the present embodiment, the number of the first heat dissipation fans 102 may be other values, and the number of the first heat dissipation fans 102 is not limited herein.

Referring to fig. 2, fig. 2 is a schematic cross-sectional view of a double-suction centrifugal fan according to an embodiment of the present disclosure. Optionally, in this embodiment, the first heat dissipation fan 102 is a double-suction centrifugal fan. The double suction centrifugal fan sucks air from the first inlet 201 and the second inlet 202, respectively, and discharges the air from the side outlet 203. Therefore, in conjunction with fig. 1, the double suction centrifugal fan sucks air from the air inlet 104 and discharges the air from the air outlet 105 of the third area 1003 to dissipate heat from the heat generating member 101, thereby preventing the heat generating member 101 from having an excessively high temperature during operation.

In this embodiment, the number of the double suction centrifugal fans is at least one.

In this embodiment, the heat dissipation of the heat generating member 101 in the first region 1001 is not affected by the heat dissipation of the heat generating member 101 in the second region 1002, and therefore, compared with the heat dissipation method of the prior art in which air is blown out from the lower air inlet and the upper air outlet, the heat dissipation efficiency of this embodiment is higher than that of the heat dissipation method of the prior art in the case where the same number of heat dissipation fans are provided.

And under the same radiating efficiency, the quantity of the double-suction centrifugal fans adopted by the application is smaller than that of the radiating fans in the radiating mode of air inlet from bottom to top and air outlet in the prior art, so that the noise generated when the radiating equipment 10 works is effectively reduced.

In this embodiment, the heat generating component 101 includes a processor board card and a processing chip disposed on the board card. The processing chip is integrated on the processor board card and used for processing video, audio or image signals, and the processing chip can generate a large amount of heat in work to cause temperature rise, so that the processing chip needs to be radiated to ensure normal work of the processing chip, and meanwhile, the service life of the processing chip can be prolonged.

Referring to fig. 3, fig. 3 is a second cross-sectional schematic view of the heat dissipation apparatus according to the second embodiment of the present disclosure, the heat dissipation apparatus 10 further includes a power module 107, the power module 107 is disposed between the air inlet 104 of the second area 1002 and the second partition 1032, and the power module 107 is used for supplying power to the heat dissipation apparatus 10.

Referring to fig. 3, in the present embodiment, the heat dissipation apparatus 10 further includes a second heat dissipation fan 108, and the second heat dissipation fan 108 is disposed between the power module 107 and the second partition 1032 and is used for dissipating heat from the power module 107. The power module 107 also generates a large amount of heat when supplying power to the heat dissipation apparatus 10, and therefore, in order to normally operate the heat dissipation apparatus 10, the power module 107 needs to be further cooled. The second heat dissipation fan 108 sucks air from the air inlet 104 of the second region 1002 to dissipate heat of the power module 107, and discharges the air from the side of the housing 100.

Referring to fig. 4, fig. 4 is a schematic view of the partition plate 103 according to an embodiment of the present disclosure, in the embodiment, a plurality of ventilation openings 1033 corresponding to the ventilation channels 106 are disposed on the first partition plate 1031 and the second partition plate 1032.

The ventilation port 1033 is used for communicating the ventilation channels 106 in the first region 1001 and the second region 1002, so that the air in the air inlet 104 can be smoothly sucked by the double suction centrifugal fan to dissipate heat of the heat generating member 101.

Referring to fig. 5, fig. 5 is a second schematic view of the partition plate 103 provided in the present embodiment, in other embodiments of the present embodiment, the ventilation openings 1033 on the first partition plate 1031 and the second partition plate 1032 may be configured as circular holes to communicate with the ventilation channels 106 in the first region 1001 and the second region 1002.

It should be understood that fig. 4 and 5 only show two embodiments of the partition 103, in other embodiments of this embodiment, the partition 103 may adopt other shapes of the ventilation holes 1033 to achieve the function of communicating the first region 1001 and the second region 1002, and the embodiments of the partition 103 are not limited herein.

In summary, the present application provides a heat dissipation apparatus, which includes a housing, a heat generating member, a first heat dissipation fan, and a partition plate, wherein the partition plate separates the interior of the housing into three regions, and a third region is located between the first region and the second region, the heat generating member is placed in the first region and the second region, and the first heat dissipation fan is disposed in the third region; an air inlet is formed in the side face, opposite to the partition plate, of the shell; and an air outlet is formed in the side surface of the shell corresponding to the third area. First radiator fan is at the during operation, inhale first region and second region with the outside air of casing via the air intake, and discharge through the air outlet in third region, dispel the heat with generating heat, the air of following the air outlet exhaust can not cause the influence to the setting at first region, the heat dissipation of the piece that generates heat in second region and third region, compare with the radiating mode of air-out on the lower air inlet of prior art, and the radiating efficiency is improved, the life and the operation speed of product have been promoted.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

It will be evident to those skilled in the art that the present application is not limited to the details of the foregoing illustrative embodiments, and that the present application may be embodied in other specific forms without departing from the spirit or essential attributes thereof. The present embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. Any reference sign in a claim should not be construed as limiting the claim concerned.

Claims

1. A heat dissipation device is characterized by comprising a shell, a heating part, a first heat dissipation fan and a partition plate;

an air inlet is formed in the side face, opposite to the partition plate, of the shell, and an air outlet is formed in the side face, corresponding to the third area, of the shell;

2. The apparatus according to claim 1, wherein the first partition and the second partition are arranged in parallel in the housing, and the heat generating member is vertically arranged between the first area and the second area to form a ventilation channel;

when the first heat dissipation fan works, air outside the shell is sucked into the ventilation channel through the air inlet and is exhausted through the air outlet of the third area, so that heat of the heating part is dissipated.

3. The apparatus according to claim 2, wherein the heat generating members are disposed between the first partition and the air inlet of the first region, and between the second partition and the air inlet of the second region at equal intervals, and are perpendicular to the first partition and the second partition.

4. The apparatus of claim 3, wherein the first heat dissipation fan is a double suction centrifugal fan.

5. The apparatus of claim 4, wherein the number of double suction centrifugal fans is at least one.

6. The apparatus of claim 5, wherein the heat generating component comprises a processor board card and a processing chip disposed on the board card.

7. The apparatus of claim 6, wherein the heat sink further comprises a power module disposed between the air inlet of the second region and the second partition, the power module configured to supply power to the heat sink.

8. The apparatus of claim 7, further comprising a second heat dissipation fan disposed between the power module and the second partition for dissipating heat from the power module.

9. The apparatus of claim 8, wherein the second heat sink fan is an axial fan.

10. The apparatus of claim 9, wherein the first and second partitions have a plurality of ventilation openings formed therein corresponding to the ventilation channels.