JP2010013189A - Tray for semiconductor element - Google Patents

Abstract

There is provided a tray for a semiconductor element that can reduce chipping of an end portion of a semiconductor element due to vibration during operation or transportation, and can reduce adhesion of the chipped piece on the semiconductor element.
A semiconductor element storage tray is formed so as to have a tray body 31 having a pocket 33 for storing a semiconductor element 13 and a positioning projection 36, and the same opening size and arrangement as the pocket 33. It includes a frame 32 having an opening 35 and a positioning hole 37 provided at a position corresponding to the positioning protrusion 36. Thereby, the chip | tip of the semiconductor element edge part by the vibration at the time of work or conveyance can be reduced, and adhesion of the chipped piece on the semiconductor element can be reduced.
[Selection] Figure 3

Description

  The present invention relates to a semiconductor element storage tray for storing and transporting semiconductor elements.

  A semiconductor element tray is used for storing and transporting semiconductor elements (see, for example, Patent Document 1). FIG. 8A is a perspective view illustrating a conventional semiconductor element tray, and FIG. 8B is a cross-sectional view illustrating a state in which the semiconductor element is accommodated in the conventional semiconductor element tray and a cover is provided.

  As shown in the figure, the conventional tray for a semiconductor element is formed by forming a plurality of pockets 82 for accommodating semiconductor elements, which are formed of a rectangular recess, on a rectangular tray body 81 made of a resin material or the like. is there.

  The semiconductor elements 83 are individually stored in the pockets 82 and are transported and stored in a state covered with the cover 84. The vertical and horizontal dimensions of the pocket 82 are usually several hundred μm to several mm larger than the semiconductor element 83 to be accommodated. The pocket 82 is searched to prevent the semiconductor element 83 from popping out of the pocket 82 due to vibration during operation when the semiconductor element 83 is stored in the semiconductor element tray. Usually, it is several hundred μm deeper than the thickness.

JP 2001-97349 A

  In the conventional semiconductor element tray having the above-described configuration, when the semiconductor element 83 is housed and transported, the semiconductor element 83 moves in the vertical, horizontal, and height directions within the pocket 82 due to vibrations during transportation. There is a problem in that the end of the semiconductor element collides with the inner wall of 82 and the cover 84, and the chipped end of the semiconductor element is attached to the semiconductor element 83. In particular, the back end of the semiconductor element 83 is often chipped, and when a metal film such as gold is applied to the back surface of the semiconductor element, conductive dust adheres on the semiconductor element.

  The present invention has been made to solve the above-described problems, and its object is to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to apply the chipped piece to the semiconductor element. A semiconductor element tray capable of reducing adhesion can be obtained.

  A tray for a semiconductor element according to the present invention includes a tray body having a pocket for housing a semiconductor element, a positioning projection, an opening formed to have the same opening size and arrangement as the pocket, A frame having positioning protrusions and positioning holes provided at corresponding positions. Other features of the present invention will become apparent below.

  According to the present invention, chipping at the end of a semiconductor element due to vibration during operation or transportation can be reduced, and adhesion of the chipped chip on the semiconductor element can be reduced.

It is the perspective view (a) which shows the tray for semiconductor elements which concerns on Embodiment 1 of this invention, sectional drawing (b), and the expanded sectional view (c) of a pocket part. It is sectional drawing (a) which shows the tray for semiconductor elements concerning Embodiment 2 of this invention, the enlarged top view (b) of a pocket part, and the expanded sectional view (c) of a pocket part. It is the perspective view (a) which shows the tray for semiconductor elements which concerns on Embodiment 3 of this invention, and the expanded sectional view (b) of a pocket part. It is sectional drawing (a) which shows the tray for semiconductor elements which concerns on Embodiment 4 of this invention, and the expanded sectional view (b) of a pocket part. 6A and 6B are cross-sectional views (a) and (b), a cross-sectional view (c) of a modified example, and a bottom view (d) showing a semiconductor element tray according to Embodiment 5 of the present invention. It is sectional drawing (a) which shows the tray for semiconductor elements which concerns on Embodiment 6 of this invention, and sectional drawing (b) of a semiconductor element. It is sectional drawing which shows the tray for semiconductor elements which concerns on Embodiment 7 of this invention. It is the perspective view (a) which shows the conventional tray for semiconductor elements, and sectional drawing (b).

Embodiment 1 FIG.
1A is a perspective view of the tray for a semiconductor element according to the first embodiment of the present invention, FIG. 1B is a cross-sectional view taken along line AA ′ of FIG. An enlarged cross-sectional view of FIG.

  As shown in the figure, the tray for semiconductor element according to the present embodiment has a tray body 11 that is a rectangular plate-shaped substrate made of a resin material or the like. On the upper surface of the tray body 11, a plurality of pockets 12 for storing semiconductor elements are formed in a matrix shape. In this pocket 12, semiconductor elements 13 are individually stored. The semiconductor element 13 is transported and stored with the tray body 11 covered with the cover 14.

  A groove 15 having a depth of about 0.1 mm is formed around the bottom surface of the pocket 12, that is, at a boundary portion with the inner wall of the pocket 12. Here, if the width of the pocket 12 is a and the width of the semiconductor element 13 is b, the width w of the groove 15 is formed so as to satisfy the condition of w> (ab). That is, the width w of the groove 15 is larger than the difference between the width a of the pocket 12 and the width b of the semiconductor element 13.

  The semiconductor element tray is formed by so-called injection molding in which a heat-melted resin material is poured into a metal mold processed to have a desired pocket size. Therefore, the processing accuracy of the pockets 12 and the like is usually about 50 μm. Therefore, for example, when (a−b) is 60 μm, W is set to a size larger than 60 μm, for example, about 100 μm.

  Thereby, when the semiconductor element 13 is stored in the semiconductor element tray and transported, even if the semiconductor element 13 moves up and down and left and right within the pocket 12 due to vibration, the lower end of the semiconductor element 13 is positioned on the groove 15. Therefore, there is no contact with the bottom surface of the pocket 12.

  Therefore, according to the semiconductor element tray according to the first embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

Embodiment 2. FIG.
2A shows a cross-sectional view of the tray for a semiconductor element according to the second embodiment of the present invention, FIG. 2B shows an enlarged top view of the pocket portion, and FIG. 2 shows an enlarged cross-sectional view of the pocket portion. Shown in (c).

  In the present embodiment, the tray main body 21 is composed of a rectangular first tray constituent portion 22 made of a resin material and the like, and a second tray constituent portion 23 formed on the first tray constituent portion 22. Composed. The first tray constituent part 22 and the second tray constituent part 23 are formed separately by a processing method such as injection molding and then bonded together with an adhesive or the like.

  The second tray constituting part 23 has a pocket 24 in which square openings are formed in a matrix shape, and an eaves part 25 formed in a “U” shape covering a part of the pocket 24.

  When the semiconductor element 13 is stored in the semiconductor element tray, first, a chip is mounted on a portion of the pocket 24 not covered with the eaves portion 25. Next, the semiconductor element tray is slightly tilted, and the semiconductor element 13 is slid in the pocket 24 so as to be disposed below the eaves portion 25.

  Thus, when the semiconductor element 13 is stored in the pocket 24, a part of the semiconductor element 13 is covered by the eaves portion 25. However, the gap between the eaves portion 25 and the semiconductor element 13 is configured to be about 100 μm or less. Thereby, it is possible to suppress the semiconductor element 13 from protruding from the pocket 24 and the vibration width in the height direction due to vibration during work or transportation.

  At this time, a gap portion 27 is formed between the semiconductor element 13 and the inner wall of the pocket 24 in a portion not covered with the eaves portion 25 of the pocket 24. Therefore, a protrusion 28 extending downward is provided on the cover 28 that covers the tray body 21. The projection 29 is inserted between the semiconductor element 13 housed below the eaves 25 and the side wall of the pocket 24 when the tray body 21 is covered with the cover 28. Thereby, the lateral vibration width of the semiconductor element 13 due to vibration during operation or transportation can be reduced.

  Therefore, according to the semiconductor element tray according to the second embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

Embodiment 3 FIG.
FIG. 3A shows a perspective view of a tray for a semiconductor element according to Embodiment 3 of the present invention, and FIG. 3B shows an enlarged sectional view of a pocket portion.

  The semiconductor element tray according to the present embodiment includes a rectangular tray body 31 made of a resin material and the like, and a frame body 32 that is detachably attached to the tray body 31 as shown in the figure.

  On the upper surface of the tray body 31, a plurality of pockets 33 are formed in a matrix shape. The depth of the pocket 33 is 50 to 100 μm deeper than the thickness of the semiconductor element 13 to be accommodated. That is, the depth of the pocket 33 is made shallower than the conventional semiconductor element tray.

  The frame body 32 has an opening 35 formed to have the same size and arrangement as the pocket 33. The tray main body 31 is provided with positioning protrusions 36 for aligning the openings 35 of the frame body 32 with the pockets 33. The frame body 32 has positioning holes 37 at positions corresponding to the positioning protrusions 36. Is provided.

  When the semiconductor element 13 is stored in the semiconductor element tray or the like, the frame body 32 is attached to the tray body 31 so that the positioning protrusions 36 and the positioning holes 37 are engaged. The pocket depth is increased by the aligned pocket 33 and opening 35. Accordingly, it is possible to prevent the semiconductor element 13 from jumping out of the pocket 33 during operation.

  On the other hand, the frame 32 is removed during transportation and storage other than during work. Then, the tray body 31 is covered with a cover (not shown). Here, since the depth of the pocket 33 can be made shallower than the conventional semiconductor element tray, the vibration width of the semiconductor element 13 in the depth direction can be reduced.

  Therefore, according to the semiconductor element tray according to the third embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

  Further, when the semiconductor element 13 is picked up from the semiconductor element tray by vacuum suction, if the pocket 33 is deep, the distance between the pickup nozzle and the semiconductor element 13 becomes large, and the pickup cannot be performed. However, such a problem does not occur because the depth of the pocket 33 can be made shallower than that of the conventional semiconductor element tray by the above configuration. Specifically, when the thickness of the semiconductor element 13 is 100 μm, the depth of the pocket 33 is preferably 0.6 mm or less.

Embodiment 4 FIG.
As for the tray for a semiconductor element according to Embodiment 4 of the present invention, FIG. 4 (a) shows an overall cross-sectional view, and FIG. 4 (b) shows an enlarged cross-sectional view of the pocket portion.

  The semiconductor element tray according to the present embodiment includes a rectangular tray main body 41 made of a resin material or the like and an auxiliary plate 42 attached to the lower side of the tray main body 41 as shown in the figure.

  On the upper surface of the tray main body 41, a plurality of pockets 43 for accommodating semiconductor elements are formed in a matrix shape, which are formed of rectangular recesses. A suction hole 44 is formed so as to penetrate from the bottom surface of the pocket 43 to the lower surface of the tray main body 41.

  A space 45 is formed between the tray body 41 and the auxiliary plate 42. A vacuum evacuation hole 46 is formed in the auxiliary plate 42. The space 45 can be vented to the outside through only the suction hole 44 and the vacuuming hole 46.

  The semiconductor element 13 is accommodated in the pocket 43, the tray main body 41 is covered with a cover, and vacuuming is performed from the vacuuming hole 46, whereby the semiconductor element 13 accommodated in the pocket 43 is vacuum fixed. Thereafter, the vacuuming hole 46 is closed with a tape or the like. As a result, the semiconductor element 13 is vacuum-fixed to the tray body 41 and does not move vertically and horizontally within the pocket 43.

  Therefore, according to the tray for semiconductor elements according to the fourth embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce the adhesion of the chipped piece on the semiconductor element. it can.

  Moreover, said effect can be acquired by the simple structure which provided only the above auxiliary plates. Then, by evacuating from the evacuation hole, it is possible to collectively evacuate from the suction holes provided in each pocket.

Embodiment 5 FIG.
5A and 5B are cross-sectional views of the semiconductor element tray according to the fifth embodiment of the present invention, and FIG.

  The semiconductor element tray according to the present embodiment includes a rectangular tray body 51 made of a resin material, an elastic sheet 52 attached to the lower side of the tray body 51, and an elastic sheet 52, as shown in the figure. Has a handle 53 for pulling the tray to the lower side of the tray main body 51.

  On the upper surface of the tray main body 51, a plurality of pockets 54 for accommodating semiconductor elements are formed in a matrix shape, which are formed of rectangular concave portions. A suction hole 55 is formed so as to penetrate from the bottom surface of the pocket 54 to the lower surface of the tray main body 51.

  The elastic sheet 52 covers the lower surface of the tray body 51 and is attached to the outer peripheral portion of the lower surface of the tray body 51 with an adhesive or the like. A handle 53 is rotatably attached to the central portion of the elastic sheet 52. And the frame part 57 which protruded below is provided in the outer surface rather than the part which the lower surface of this tray main body 51 and the elastic sheet 52 were affixed.

  A method of using the semiconductor element tray having the above configuration will be described. First, in the state of FIG. 5A in which the handle 53 is not pulled, the semiconductor element 13 is accommodated in all the pockets 54 of the semiconductor element tray. In this state, the elastic sheet 52 is in close contact with the entire lower surface of the tray body 51.

  Next, in a state where the handle 53 is pulled downward, the handle 53 is rotated from the dotted line position of FIG. 5C to the solid line position, and as shown in FIG. Hook. Thereby, the handle 53 can be fixed in the state pulled downward. In this state, the elastic sheet 52 and the lower surface of the tray main body 51 are separated from each other except for the outer peripheral portion.

  As a result, the pressure inside the suction hole 55 on the lower side of the semiconductor element 13 and the pressure inside the elastic sheet 52 are reduced compared to the outside, and the semiconductor element 13 is fixed to the tray body 51 and can move up, down, left and right within the pocket 43. Absent.

  Therefore, according to the semiconductor element tray according to the fifth embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

  FIG. 5D shows a cross-sectional view of a variation of the semiconductor element tray according to the fifth embodiment. In this semiconductor element tray, the elastic sheet 52 covers the lower surface of the tray main body 51 and is stuck around each suction hole 55 with an adhesive or the like.

  And the connection board 56 is affixed on the elastic sheet 52 with the adhesive agent etc. in the lower part of each hole 55 for adsorption | suction. A handle 53 is rotatably attached to the central portion of the connection plate 56.

  When the connection plate 56 is pulled downward using the handle 53, the elastic sheet 52 is also pulled downward, and one space is formed between the tray body 51 and the elastic sheet 52 for each suction hole 55.

  For this reason, even when the semiconductor element 13 is not accommodated in all the pockets 54, the pressure inside the suction hole 55 on the lower side of the pocket 54 in which the semiconductor element 13 is accommodated and the elastic sheet 52 are reduced compared to the outside. The semiconductor element 13 is fixed to the suction hole 55. Therefore, even when the semiconductor element 13 is not accommodated in all the pockets 54, the same effects as described above are obtained.

  The specific suction force is as follows. In the case of FIGS. 5A to 5C, the semiconductor element is 3 mm square, the thickness is 0.1 mm, the number of pockets is 100, the suction hole diameter is 0.3 mm, the hole depth is 2 mm, and the elastic sheet is pulled. Assuming that the shape at the time is a square pyramid shape, the volume of the space formed on the lower surface of the tray body by pulling the elastic sheet is about 6 times the volume of the suction hole. Accordingly, the internal pressure is reduced to about 1/6, and the suction force generated by the difference from the atmospheric pressure is about 100 times the weight of the semiconductor element of about 5 mg. In the case of FIG. 5D, if it is assumed that the elastic sheet is pulled half of the previous example, the suction force is about 70 times the weight of the semiconductor element. Therefore, in both cases, the semiconductor element can be sufficiently held.

Embodiment 6 FIG.
FIG. 6A shows a cross-sectional view of a semiconductor element tray according to Embodiment 6 of the present invention, and FIG. 6B shows a cross-sectional view of the semiconductor element.

  As shown in the figure, the tray for a semiconductor element according to the present embodiment has a rectangular tray body 61 made of a resin material and the like, and a plate shape that is detachably attached to the lower side of the tray body 61 with tape or the like. The magnet 62 is provided. On the upper surface of the tray main body 61, a plurality of pockets 63 for accommodating semiconductor elements are formed in a matrix shape, which are formed of rectangular concave portions.

  The semiconductor element 64 accommodated in the semiconductor element tray has a magnetic body 65 attached to the lower surface, and an Au plating layer 66 is formed so as to cover the magnetic body 65. Here, the magnetic body 65 is formed, for example, by plating Ni on the lower surface of the semiconductor element 64. By forming the Au plating layer 66, it is possible to prevent oxidation of a magnetic material such as Ni, and to ensure solderability in a subsequent process.

  When the semiconductor element 64 is stored in the semiconductor element tray, the magnetic body 65 formed on the semiconductor element 64 is attracted to the magnetic force of the magnet 62. As a result, the semiconductor element 64 is fixed to the tray body 61 and does not move vertically and horizontally within the pocket 63.

  Therefore, according to the semiconductor element tray according to the sixth embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

Embodiment 7 FIG.
FIG. 7 shows a sectional view of a semiconductor element tray according to Embodiment 7 of the present invention. A plurality of pockets 72 for accommodating semiconductor elements are formed in a matrix shape on the upper surface of a rectangular tray body 71 made of a resin material or the like. Then, the pocket 72 is filled with an inert liquid 73. As the inert liquid 73, for example, Fluorinert (fluorine inert liquid) manufactured by 3M Corporation of the United States can be used. And it has the packing 74 which prevents that the inert liquid 73 leaks during conveyance etc., and the cover 75 which covers the tray main body 71. FIG.

  In this way, by filling the pocket 72 with the inert liquid 73, the moving speed of the semiconductor element 13 accommodated in the pocket 72 is reduced.

  Therefore, according to the tray for a semiconductor element according to the seventh embodiment, it is possible to reduce chipping at the end of the semiconductor element due to vibration during operation or transportation, and to reduce adhesion of the chipped piece on the semiconductor element. it can.

11, 21, 31, 41, 51, 61, 71 Tray body 12, 24, 33, 43, 54, 63, 72 Pockets 13, 64 Semiconductor elements 14, 28, 75 Cover 15 Groove 22 First tray component 23 Second tray constituting portion 25 Eave portion 27 Gap portion 29 Projection portion 32 Frame body 35 Opening portion 36 Positioning projection 37 Positioning hole 42 Auxiliary plate 44, 55 Suction hole 45 Space 46 Vacuum suction hole 52 Elastic sheet 53 Handle 56 Connecting plate 57 Frame 62 Magnet 65 Magnetic body 66 Plating layer 73 Inactive liquid 74 Packing 81 Tray body 82 Pocket 83 Semiconductor element 84 Cover

Claims (6)

A tray body having a pocket for storing a semiconductor element, and a positioning projection;
A semiconductor element storage comprising: a frame having an opening formed to have the same opening size and arrangement as the pocket; and a positioning hole provided at a position corresponding to the positioning protrusion. Tray. A tray body having a pocket for storing semiconductor elements;
A suction hole penetrating from the bottom surface of the pocket to the bottom surface of the tray body;
An auxiliary plate that forms a space between the lower surface of the tray body, and
A semiconductor element storage tray, comprising: a vacuum evacuation hole provided in the auxiliary plate. A tray body having a pocket for storing semiconductor elements;
A suction hole penetrating from the bottom surface of the pocket to the bottom surface of the tray body;
An elastic sheet that covers the lower surface of the tray body and is attached to the outer peripheral portion of the lower surface of the tray body;
A semiconductor element storage tray having a handle for pulling the elastic sheet. A tray body having a plurality of pockets for housing semiconductor elements;
A plurality of suction holes penetrating from the bottom surface of each pocket to the bottom surface of the tray body;
An elastic sheet covering the lower surface of the tray body and attached to the periphery of each suction hole;
A connection plate affixed to the elastic sheet at the lower part of each suction hole;
A semiconductor element storage tray having a handle for pulling the connection plate. A semiconductor element storage tray for storing a semiconductor element having a magnetic body attached to a lower surface,
A tray body having a pocket for housing the semiconductor element;
A semiconductor element storage tray, comprising: a magnet provided on a lower surface of the tray body. A pocket for storing semiconductor elements;
An inert liquid filled in the pocket;
A tray for housing a semiconductor element, comprising a packing for preventing the inert liquid from leaking.

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