JP2010010568A - Circuit device - Google Patents

Abstract

Provided is a circuit device in which peeling between a sealing member and a substrate is prevented even in a situation where a pressing force of a screw stopper acts.
A hybrid integrated circuit device 10 has a circuit board 18 in which a hybrid integrated circuit composed of a conductive pattern 22 and a semiconductor element 24 is incorporated on an upper surface thereof, and has a frame shape and abuts on the circuit board 18. The structure includes a case material 12 that forms a region where the hybrid integrated circuit is sealed, and a sealing resin 16 that fills the region surrounded by the case material 12 and seals the hybrid integrated circuit. Further, in the hybrid integrated circuit device 10, a part of the upper surface of the circuit board 18 is not covered with the sealing resin 16, and a through hole 34 that penetrates the circuit board 18 in this part is provided. Furthermore, the present invention employs a structure in which the end of the circuit board 18 and the case material 12 are fitted to prevent separation of the circuit board 18 and the case material 12 at the time of screwing.
[Selection] Figure 2

Description

  The present invention relates to a circuit device, and more particularly to a circuit device in which a hybrid integrated circuit built on an upper surface of a circuit board is sealed with a sealing member.

  With reference to FIG. 11, the configuration of a conventional hybrid integrated circuit device will be described. 11A is a cross-sectional view of the hybrid integrated circuit device 100 configured to be sealed using the case material 111, and FIG. 11B is a perspective view illustrating the hybrid integrated circuit device 100A sealed with a resin by transfer molding. FIG.

  Referring to FIG. 11A, first, a conductive pattern 103 is formed on the surface of a rectangular substrate 101 via an insulating layer 102, and circuit elements are fixed to desired portions of the conductive pattern 103. A predetermined hybrid integrated circuit is formed. Here, the semiconductor element 105 </ b> A and the chip element 105 </ b> B are connected to the conductive pattern 103 as circuit elements. The lead 104 is connected to a pad 109 made of a conductive pattern 103 formed in the peripheral portion of the substrate 101 and functions as an external terminal. The sealing resin 108 has a function of sealing an electric circuit formed on the surface of the substrate 101.

  The case material 111 has a substantially frame shape and is in contact with the side surface of the substrate 101. Furthermore, the upper end portion of the case material 111 is positioned above the upper surface of the substrate 101 in order to ensure a space for sealing on the upper surface of the substrate 101. A space surrounded by the case material 111 above the substrate 101 is filled with a sealing resin 108, and circuit elements such as semiconductor elements are sealed with the sealing resin 108. With this configuration, even if the substrate 101 is relatively large, the sealing element 108 is filled with the sealing resin 108 in the space surrounded by the case material 111 and the like, so that the circuit element or the like in which the upper surface of the substrate 101 is incorporated is sealed with resin. can do.

  The schematic configuration of the hybrid integrated circuit device 100A shown in FIG. 11B is the same as that of the hybrid integrated circuit device 100 in which the case material 111 is removed. Here, the sealing resin 108 is formed by transfer molding. Is formed. Specifically, the sealing resin 108 is formed so as to cover the upper surface and side surfaces of the substrate 101 by injection molding using a mold.

Further, the fixing portion 112 is formed by partially denting the peripheral portion of the sealing resin 108. When the lower surface of the hybrid integrated circuit device 100A is brought into contact with a heat sink or the like, the fixing portion 112 is screwed. Applied. Similarly, in the hybrid integrated circuit device 100 shown in FIG. 11A, the stepped portion provided in the peripheral portion of the case material 111 may be used for screwing.
JP 2007-036014 A

  However, in the hybrid integrated circuit device 100A having the above-described configuration, there has been a problem that screw fixing by the fixing portion 112 is insufficient. Specifically, by fixing the fixing portion 112 with screws, it is possible to temporarily bring the lower surface of the hybrid integrated circuit device 100A into contact with a heat sink or the like. However, if the insulating resin constituting the fixing portion 112 is deformed due to deterioration with time, a gap may be generated between the fixing portion 112 and the screw, and fixing by screwing may be insufficient. In such a case, the hybrid integrated circuit device 100A may be separated from the heat sink, and the heat dissipation action by the heat sink may not function.

  Further, a fixing method may be considered in which a part of the substrate 101 shown in FIG. 11A is exposed without being covered with the sealing resin 108, and the exposed portion of the substrate 101 is screwed. In this way, since the substrate 101 made of metal such as aluminum is hardly deformed due to deterioration over time, a decrease in pressing force due to screwing is suppressed.

  However, if the screws are tightened, the case material 101 or the sealing resin 108 and the circuit board 101 may be peeled off due to the relationship between the warpage of the board and the flatness of the mounting board surface. This may be as long as the mounting substrate side is always stationary. However, when vibration is applied or warps due to temperature, a peeling action acts on the interface between the circuit board and the sealing resin, and such peeling occurs. Therefore, the moisture resistance of the hybrid integrated circuit device 100 decreases.

  The present invention has been made in view of such problems, and a main object of the present invention is to provide a circuit device in which peeling between a sealing member and a substrate is prevented even in a situation where a pressing force of a screw stopper acts on the circuit substrate. There is.

  The present invention relates to a circuit board, a hybrid integrated circuit comprising conductive patterns and circuit elements formed on the upper surface of the circuit board, and a seal that covers at least the upper surface of the circuit board so that the hybrid integrated circuit is sealed. In the circuit device having a stop member, the sealing member is composed of a frame-shaped case material that contacts the side of the circuit board, and a sealing resin filled in a region surrounded by the case material, The outer peripheral portion of the circuit board is fitted into a recess provided on the inner side wall of the case material.

  The present invention relates to a circuit board, a hybrid integrated circuit comprising conductive patterns and circuit elements formed on the upper surface of the circuit board, and a seal that covers at least the upper surface of the circuit board so that the hybrid integrated circuit is sealed. The sealing member is a sealing resin that covers the upper surface and the side surface of the circuit board and is molded by injection molding, and seals the outer periphery of the circuit board. It is made to fit in resin.

  The present invention includes a hybrid integrated circuit comprising a conductive pattern and circuit elements formed on an upper surface of a circuit board, and a sealing resin that covers at least the upper surface of the circuit board so that the hybrid integrated circuit is sealed. In the circuit device having, the circuit board in the region covered with the sealing resin is provided with an opening having a larger opening diameter on the lower surface than on the upper surface, and the opening is filled with the sealing resin. And

  According to the present invention, a through hole through which a fixing screw is passed is provided in the circuit board, and the peripheral portion of the circuit board is fitted with a sealing member such as a case material. By doing in this way, even if the stress that separates the case material from the circuit board acts due to the pressing force of the screw acting on the circuit board, the adhesion strength between the two is high, so the case material from the circuit board Separation is prevented.

<First Embodiment>
With reference to FIG. 1, a structure of a hybrid integrated circuit device 10 will be described as an example of a circuit device. FIG. 1A is a perspective view of the hybrid integrated circuit device 10 as viewed obliquely from above. 1B is a cross-sectional view taken along line BB ′ of FIG. 1A, and FIG. 1C is a cross-sectional view taken along line CC ′ of FIG.

  Referring to each drawing of FIG. 1, a hybrid integrated circuit device 10 includes a circuit board 18 in which a hybrid integrated circuit composed of a conductive pattern 22 and a semiconductor element 24 or the like (circuit element) is incorporated on the upper surface, and a frame shape A case material 12 that forms a region where the hybrid integrated circuit is sealed by contacting the circuit board 18 and a sealing resin 16 that fills the region surrounded by the case material 12 and seals the hybrid integrated circuit And a lead 14 fixed to the pad 13 made of the conductive pattern 22 and extending to the outside (here, perpendicular to the substrate). Further, in the hybrid integrated circuit device 10, a part of the upper surface of the circuit board 18 is not covered with the sealing resin 16, and a through hole 34 that penetrates the circuit board 18 in this part is provided.

  The circuit board 18 is a metal board whose main material is aluminum (Al), copper (Cu), or the like. The specific size of the circuit board 18 is, for example, about vertical × horizontal = 61 mm × 88 mm. The thickness of the circuit board 18 is, for example, about 1.5 mm or 2.0 mm. When a substrate made of aluminum is employed as the circuit board 18, both main surfaces of the circuit board 18 may be covered with an anodized film. Here, the circuit board 18 may be made of an insulating material such as a resin material or an inorganic material typified by ceramic.

The insulating layer 20 is formed so as to cover the entire upper surface of the circuit board 18. The insulating layer 20 is made of an epoxy resin or the like in which a filler such as AL ₂ O ₃ is highly filled to about 60 wt% to 80 wt%, for example. Since the thermal resistance of the insulating layer 20 is reduced by mixing the filler, the heat generated from the built-in circuit element can be released to the outside through the insulating layer 20 and the circuit board 18. it can. The specific thickness of the insulating layer 20 is, for example, about 50 μm. In FIG. 1B, only the upper surface of the circuit board 18 is covered with the insulating layer 20, but the lower surface of the circuit board 18 may also be covered with the insulating layer 20. By doing in this way, even if the back surface of the circuit board 18 is exposed outside, the back surface of the circuit board 18 can be insulated from the outside. Further, although the circuit board 18 is composed of one sheet, a plurality of circuit boards 18 may be laminated via an insulating layer therebetween.

  The conductive pattern 22 is made of a metal such as copper, and is formed on the surface of the insulating layer 20 so as to form a predetermined electric circuit. Further, a pad made of a conductive pattern 22 is provided at a portion to which the lead 14 is fixed. Further, a large number of pads are formed around the semiconductor element 24, and the pads and the semiconductor element 24 are connected by a thin metal wire 38. Although a single-layer conductive pattern 22 is shown here, a multilayer conductive pattern 22 laminated via an insulating layer may be formed on the upper surface of the circuit board 18.

  As a circuit element electrically connected to the conductive pattern 22, an active element or a passive element can be generally adopted. Specifically, transistors, LSI chips, diodes, chip resistors, chip capacitors, inductances, thermistors, oscillators, and the like can be employed as circuit elements. Furthermore, a resin-sealed package or the like can be fixed to the conductive pattern 22 as a circuit element. Referring to FIG. 1B, a semiconductor element 24 and a chip element 26 are arranged on the upper surface of the circuit board 18 as circuit elements. The semiconductor element 24 is fixed to the conductive pattern 22, and the electrode on the upper surface is connected to the conductive pattern 22 via a thin metal wire 38. The chip element 26 has electrodes at both ends connected to the conductive pattern 22 via a fixing material such as solder. Here, when a power element that generates a large amount of heat is used as the semiconductor element 24, the semiconductor element 24 may be placed on the upper surface of a heat sink made of a metal piece fixed to the upper surface of the conductive pattern 22. Thus, the heat generated from the semiconductor element 24 can be efficiently released to the outside via the heat sink and the circuit board 18. Here, the point of the invention lies in the case material, and the device mounting form is not limited.

  The sealing resin 16 has a function of sealing the hybrid integrated circuit built on the circuit board 18, and specifically, circuit elements such as a conductive pattern 22 and a semiconductor element 24 formed on the upper surface of the circuit board 18. The sealing resin 16 is formed on the upper surface of the circuit board 18 so that the joint portion of the lead 14 is sealed. The sealing resin 16 is filled in a space above the circuit board 18 surrounded by the case material 12. As the material of the sealing resin 16, a thermosetting resin or a thermoplastic resin is employed. Further, for example, about 10 wt% to 20 wt% of a filler such as silicon oxide may be mixed into the sealing resin 16 for the purpose of improving thermal conductivity.

  In the present embodiment, the upper surface of the circuit board 18 is not entirely covered with the sealing resin 16, but a part of the upper surface is exposed to the outside. Referring to FIG. 1A, the region surrounded by the inner side wall portions 12E and 12F of the case material 12 is not filled with the sealing resin 16 and the upper surface of the circuit board 18 is exposed. This portion of the circuit board 18 is used as an area for screwing, and details thereof will be described in detail with reference to FIG.

  The leads 14 are provided along opposite sides of the circuit board 18 and function as input / output terminals of the hybrid integrated circuit device 10. These leads 14 are made of a metal whose main component is copper (Cu), aluminum (Al), an Fe—Ni alloy, or the like. In the drawing, each lead 14 is drawn upward, but the lead 14 may be bent at a right angle in the middle and drawn to the side.

  Referring to FIG. 1A, case material 12 having a frame shape has four side walls corresponding to the four sides of circuit board 18. Specifically, the case material 12 is mainly composed of the first side wall portion 12A, the second side wall portion 12B, the third side wall portion 12C, and the fourth side wall portion 12D. The position of each side wall on the paper surface will be described. The first side wall 12A is located on the back side, the second side wall 12B is located on the front side, the third side wall 12C is located on the left side, and the fourth side wall The part 12D is located on the right side. Further, an inner side wall portion 12F is formed on the inner side continuously from the second side wall portion 12B, and an inner side wall portion 12E is formed on the inner side continuously from the first side wall portion 12A. These inner side wall portions 12E are formed in a ring shape having the same thickness as or slightly thinner than the case material, and are integrated with the case material. Further details of the case material 12 will be described later with reference to FIG.

  Here, in the case material 12, the inner wall of each side wall is in contact with the side surface of the circuit board 18. When the case material 12 is fitted to the circuit board 18, at least the central portion of the lower surface of the case material 12 and the lower surface of the circuit board 18 are located on the same plane. The case material 12 is formed by injection molding a resin material such as an epoxy resin.

  With reference to FIG. 1C, in this embodiment, a stepped portion 30 is provided by performing step processing on the lower surface of the peripheral portion of the circuit board 18, and the side wall portion of the case material 12 is formed of the stepped portion 30. It is configured to fit in. Specifically, the step portion (notch portion) 30 is provided in the peripheral portion of the circuit board 18 by partially removing the peripheral portion of the circuit board 18 from the lower surface by punching, dicing, or etching. . And the recessed part 32 according to the shape of the level | step-difference part 30 is provided in the side wall part inner side of case material near a lower end. Therefore, by fitting the second side wall portion 12B into the stepped portion 30 of the circuit board 18, the lower surface of the second side wall portion 12B and the lower surface of the circuit board 18 are located on the same plane. The step portion 30 may be provided along two opposing side surfaces of the circuit board 18 or may be provided on all four sides. That is, the step portion 30 of the circuit board 18 is provided along the side of the circuit board 18 that contacts the first side wall portion 12A and the second side wall portion 12B of the case material 12 with reference to FIG. It may be provided on all four sides. In order to fit the circuit board 18 to the case material 12, the circuit board is made slightly larger than the case material 12 and is inserted by being pushed in using the flexibility of the case material. Further, in order to easily fit the circuit board 18 into the case material 12, the size of the inside of the case material 12 is slightly widened and only the upper end portion of the concave portion 32 is slightly thickened so that the protrusion is extended easily. Can be combined.

By fitting the side wall portion of the case material 12 to the step portion 30 provided in the peripheral portion of the circuit board 18 in this way, the step portion 30 of the circuit board 18 is brought into contact with the bottom surface of the concave portion 32 of the case material. The case material 12 is prevented from peeling from the circuit board 18. Specifically, when the heat sink is mounted on the hybrid integrated circuit device 10, the screws 42 are inserted and pressed into the through holes 34 provided in the circuit board 18 from above to fix them together. At this time, a pressing force by a screw acts on the circuit board 18, while a force acts on the case material 12 and the sealing resin 16 in a direction in which the back surface of the stepped portion 30 contacts the bottom surface of the recess 32, and in a peeling direction. It will be in the state where no power acts.
For this reason, when the hybrid integrated circuit device 10 is screwed with the screw 42, a stress is generated by which the circuit board 18 is peeled from the case material 12 due to the pressing force of the screw 42. There is a risk that. Further, the hybrid integrated circuit device 10 is curved so that the entire device is convex downward due to curing shrinkage when the sealing resin 16 is cured, so that the curved shape is flattened by the pressing force of the screw 42. If corrected to above, the stress described above becomes even greater.
In order to prevent this separation, in this embodiment, the stepped portion 30 provided in the peripheral portion of the circuit board 18 is fitted to the side wall portion of the case material, and the bottom of the recessed portion 32 and the back surface of the stepped portion 30 are brought into contact with each other. . By doing in this way, even if the screw 42 is hardened, the periphery of the case material 12 is fitted into the circuit board 18, and thus separation of both is suppressed.

  With reference to FIG. 2, another configuration for fitting the side wall portion of the case material to the circuit board 18 will be described. 2A and 2B are cross-sectional views showing this configuration.

  Referring to FIG. 2A, here, the peripheral portion of the circuit board 18 is not provided with the stepped portion as described above, and the back surface of the circuit board 18 is entirely flat. The second side wall portion 12B of the case material 12 is provided with a concave portion 32 having a shape corresponding to the thickness of the circuit board 18. By bringing the circuit board 18 into contact with the concave portion 32, the second side wall portion is formed. The lower end portion of 12B supports the circuit board 18 from the lower surface.

  Referring to FIG. 2B, an opening 36 is provided in the circuit board 18 in a region covered with the sealing resin 16, and the sealing resin 16 and the circuit are filled by filling the opening 36 with the sealing resin 16. The adhesion strength with the substrate 18 is improved. The opening 36 is provided through the circuit board 18 in the region where the sealing resin 16 is formed, and the opening diameter D2 on the lower surface side is larger than the opening shape D1 on the upper surface. Here, although the opening part 36 is exhibiting the column-shaped shape in which the level | step-difference part was provided in the middle, the side surface of the opening part 36 may be an inclined surface which flares from upper direction to the downward direction. Here, a plurality of openings 36 may be provided in the vicinity of the through hole 34. Furthermore, the configuration in which the case material 12 and the circuit board 18 shown in FIG. 2A or 1C are fitted and the configuration shown in FIG. 2B are used in combination. May be.

  FIG. 3 illustrates the shape of the case material 12 used in the hybrid integrated circuit device 10 of the present embodiment. Here, a perspective view when the case material 12 constituting the hybrid integrated circuit device 10 in the state shown in FIG. 1A is viewed from below is shown. Referring to this figure, case material 12 includes four side wall portions (first side wall portion 12A, second side wall portion 12B, third side wall portion 12C, and fourth side wall portion 12D). Inner side wall portions 12E and 12F are provided on the inner side from the second side wall portion 12B. A recess 32 as shown in FIG. 1C is provided on each side wall. Further, the lower ends of the inner side wall portions 12E and 12F are in contact with the upper surface of the circuit board 18 (see FIG. 1). The case material 12 having such a configuration is formed by injection molding using a mold.

  Next, a method for manufacturing the hybrid integrated circuit device 10 having the configuration shown in FIG. 1A will be described with reference to FIGS.

  Referring to FIG. 4, first, a predetermined hybrid integrated circuit is incorporated on the upper surface of circuit board 18. First, the upper surface of the circuit board 18 made of a metal such as aluminum is covered with an insulating layer 20 made of a resin mixed with a filler, and a conductive pattern 22 having a predetermined shape is formed on the upper surface of the insulating layer 20. . A semiconductor element 24 and a chip element 26 are fixed as predetermined circuit elements at predetermined locations of the conductive pattern 22. Further, a pad made of a conductive pattern 22 is formed in the peripheral portion of the circuit board 18, and the lead 14 is fixed to this pad. Further, the step portion 30 is provided by partially removing the peripheral portion of the circuit board 18 from the back surface side. As a method for forming the stepped portion 30, punching, dicing or etching can be considered.

  Next, referring to FIG. 5, the case material 12 is fitted into the circuit board 18. FIG. 5A is a cross-sectional view showing this process, and FIG. 5B is a plan view showing the configuration of the case material 12.

  With reference to FIG. 5A, the case material 12 is incorporated into the circuit board 18. Here, a stepped portion 30 is provided in the peripheral portion of the circuit board 18. The side wall portions (the first side wall portion 12 </ b> A and the second side wall portion 12 </ b> B) of the case material 12 are provided with concave portions 32 having a shape corresponding to the stepped portion 30 of the circuit board 18. Accordingly, the stepped portion 30 of the circuit board 18 is fitted into the concave portion 32 of the case material 12, so that the connection structure between the two is strong. Further, an adhesive is applied to a portion where the case material 12 and the circuit board 18 are in contact with each other.

  With reference to FIG. 5 (B), the recessed part 32 fitted with the level | step-difference part 30 of the circuit board 18 is four side wall parts (1st side wall part 12A, 2nd side wall part 12B, and 3rd side wall part 12C) of the case material 12. FIG. And the fourth side wall portion 12D). Furthermore, the recessed part 32 may be provided only in two opposing side wall parts (the first side wall part 12A and the second side wall part or the third side wall part 12C and the fourth side wall part 12D). In this step, the lower portions of the inner side wall portions 12E and 12F provided in the case material 12 are in contact with the upper surface of the circuit board 18, and the region surrounded by the inner side wall portion is formed by the sealing resin in the next step. Not.

  Next, referring to FIG. 6, the space surrounded by the case material 12 is filled with a sealing resin 16, and the hybrid integrated circuit formed on the upper surface of the circuit board 18 is resin-sealed. 6A and 6B are cross-sectional views showing this step.

  With reference to FIG. 6A, in this step, liquid or semi-solid sealing resin 16 is supplied to a region surrounded by case material 12. The sealing resin 16 is supplied from the tip of the nozzle 40 to the upper surface of the circuit board 18. The sealing resin 16 covers the conductive pattern 22, the semiconductor element 24, the chip element, the fine metal wire, and the connection portion of the lead 14 formed on the upper surface of the circuit board 18. The sealing resin 16 is made of a thermosetting resin or a thermoplastic resin mixed with a particulate filler. After the filling of the sealing resin 16 is completed, heat curing is performed as necessary.

  With reference to FIG. 6 (B), the portion of the circuit board in which the through hole 34 for screwing is provided is surrounded by the inner side wall portion 12 </ b> F of the case material 12. Therefore, even if the liquid sealing resin 16 is supplied to the upper surface of the circuit board 18, the upper surface of the circuit board 18 around the through hole 34 surrounded by the inner sidewall portion 12 </ b> F is not covered with the sealing resin 16.

  Next, referring to FIG. 7, the back surface of the hybrid integrated circuit device 10 is brought into contact with the heat sink 44. FIG. 7A is a cross-sectional view showing this step, and FIG. 7B is an enlarged cross-sectional view.

  Referring to FIGS. 7A and 7B, in this step, the hybrid integrated circuit is formed by screwing the through hole 34 of the hybrid integrated circuit device 10 and the hole 46 of the heat sink 44 through screws 42. The rear surface of the apparatus 10 is in contact with the upper surface of the heat sink 44.

  The heat sink 44 is made of a metal such as copper or aluminum. Therefore, when the back surface of the hybrid integrated circuit device 10 from which the circuit board 18 is exposed is brought into contact with the upper surface of the heat sink 44, the heat generated from the circuit elements incorporated in the hybrid integrated circuit device passes through the circuit board 18 and the heat sink 44. And can be released to the outside satisfactorily.

  Here, the hybrid integrated circuit device 10 has a curved shape so as to protrude downward as a whole. The reason why the hybrid integrated circuit device 10 bends in this manner is that it shrinks when the sealing resin 16 covering the upper surface of the circuit board 18 is cured. Accordingly, the back surface of the hybrid integrated circuit device 10 and the heat sink 44 are corrected by pressing the circuit board 18 with the screws 42 provided near both ends of the hybrid integrated circuit device 10 and correcting the shape of the hybrid integrated circuit device 10 to be flat. It is in close contact with the top surface of.

  Referring to FIG. 7B, when the curvature of the circuit board 18 is corrected to be flat by the pressing force of the screw 42 as described above, the sealing resin 16 and the case material 12 and the circuit board 18 in a curved state are separated. The stress to act acts. In the present embodiment, in order to prevent the separation between the two, a stepped portion 30 is provided in the peripheral portion of the circuit board 18, and the stepped portion 30 is fitted to the second side wall portion 12B. By doing so, even if a large pressing force by the screw 42 acts on the circuit board 18, the circuit board 18 is prevented from being separated from the case material 12 due to the pressing force.

  Further, in this process, since the pressing force of the screw 42 is applied to the circuit board 18 which is a metal material, the circuit board 18 is hardly deformed even after a long time has passed, and the pressing force by the screw 42 is reduced. It does not change. Accordingly, the lower surface of the circuit board 18 can be maintained in contact with the upper surface of the heat sink 44 for a long period of time.

<Second Embodiment>
In the present embodiment, the structure of a hybrid integrated circuit device 10A in which a sealing resin 16 formed by injection molding as a sealing member is employed will be described with reference to FIGS. Other configurations of the hybrid integrated circuit device 10A of the present embodiment are basically the same as those of the hybrid integrated circuit device 10 described above, and the configuration of the sealing member is different.

  8A is a perspective view of the hybrid integrated circuit device 10A, and FIG. 8B is a cross-sectional view taken along line X-X ′ of FIG. 8A. Referring to these drawings, the upper surface and side surfaces of circuit board 18 are covered with sealing resin 16, and a large number of leads 14 are led out from the side surfaces of sealing resin 16.

  Referring to FIG. 8B, a through hole 34 for screwing is formed in the circuit board 18, and the upper surface of the circuit board 18 around the through hole 34 is covered with the sealing resin 16. Without being exposed to the outside, an exposed region 48 is formed. Here, through holes 34 are formed in the vicinity of both ends in the longitudinal direction of the circuit board 18. A step portion 30 is formed in the peripheral portion of the circuit board 18, and the step portion 30 is also covered with the sealing resin 16. By forming the sealing resin 16 so as to wrap around the stepped portion 30, the adhesion strength between the circuit board 18 and the sealing resin 16 is strengthened, and separation between the circuit board 18 and the sealing resin 16 is suppressed. .

  With reference to FIG. 9, another structure for fitting the sealing resin 16 and the circuit board 18 will be described.

  Referring to FIG. 9A, the side surface of the circuit board 18 is composed of two side surfaces protruding outward. In this way, the inclined surface of the circuit board 18 is fitted with the sealing resin 16, so that the adhesion strength between the two is improved. Further, since the side surface of the circuit board 18 is a rough surface formed by grinding by dicing, the sealing resin 16 is brought into close contact with the inclined surface which is the rough surface, thereby preventing the separation of both.

  Referring to FIG. 9B, an opening 36 is provided through the circuit board 18 in a region covered with the sealing resin 16, and the opening 36 is filled with the sealing resin 16. The details of the opening 36 are as described above in the first embodiment, and the opening diameter of the upper portion of the opening 36 is narrower than that of the lower portion. By doing in this way, the anchor effect generate | occur | produces between the sealing resin 16 with which the opening part 36 was filled, and the circuit board 18, and both adhesive strength is improved. Furthermore, the configuration of the opening 36 shown in FIG. 9B may be combined with other configurations shown in FIG. 8 and FIG.

  With reference to FIG. 9C, the back surface of the circuit board 18 is entirely flat, and a part of the sealing resin 16 wraps around the back surface of the circuit board 18. Also with such a configuration, the adhesion strength between the sealing resin 16 and the circuit board 18 is improved, and separation of both is prevented.

  A method for resin-sealing the hybrid integrated circuit device 10 having the above-described configuration will be described with reference to the cross-sectional view of FIG.

  In the present embodiment, the sealing resin is formed by performing injection molding or transfer molding by injection molding using a mold. Here, the circuit board 18 is sealed by transfer molding using a mold 52 including an upper mold 54 and a lower mold 56. Specifically, after placing the circuit board 18 on the lower mold 56, the upper mold 54 and the lower mold 56 are brought into contact with each other, whereby the circuit board 18 is accommodated in the cavity of the mold. Next, sealing resin is injected from the gate provided in the mold 52 to seal the upper surface and side surfaces of the circuit board 18 with resin. Further, in this step, a contact portion 58 is provided so that the upper surface (exposed region 48 shown in FIG. 8) of the circuit board 18 around the through hole 34 is exposed without being covered with the sealing resin. Yes. The abutting portion 58 is a portion in which the inner wall of the upper mold 54 is partially protruded downward, and the lower surface is in contact with the upper surface of the circuit board 18 in the peripheral portion of the through hole 34. In this way, the lower surface of the contact portion 58 is in contact with the upper surface of the circuit board 18, so that the resin sealing in this step is performed in a state where the upper surface of the circuit board 18 around the through hole 34 is exposed. Further, in this step, a structure is realized in which the sealing resin wraps around the stepped portion 30 provided in the peripheral portion of the circuit board 18 and the sealing resin is fitted in the peripheral portion of the circuit board 18.

It is a figure which shows the circuit apparatus of this invention, (A) is a perspective view, (B) is sectional drawing, (C) is sectional drawing. It is a figure which shows the circuit apparatus of this invention, (A) and (B) are sectional drawings. It is a figure which shows the circuit apparatus of this invention, and is a perspective view which shows the structure of a case material. It is sectional drawing which shows the manufacturing method of the circuit apparatus of this invention. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) is sectional drawing, (B) is a top view. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) And (B) is sectional drawing. It is a figure which shows the manufacturing method of the circuit apparatus of this invention, (A) And (B) is sectional drawing. It is a figure which shows the circuit apparatus of this invention, (A) is a perspective view, (B) is sectional drawing. It is a figure which shows the circuit apparatus of this invention, and (A)-(C) is sectional drawing. It is sectional drawing which shows the manufacturing method of the circuit apparatus of this invention. It is a figure which shows the conventional hybrid integrated circuit device, (A) is sectional drawing, (B) is a perspective view.

Explanation of symbols

10, 10A Hybrid integrated circuit device 12 Case material 12A First side wall portion 12B Second side wall portion 12C Third side wall portion 12D Fourth side wall portion 12E Internal side wall portion 12F Internal side wall portion 14 Lead 16 Sealing resin 18 Circuit board 20 Insulating layer 22 Conductive pattern 24 Semiconductor element 26 Chip element 28 Metal thin wire 30 Stepped portion 32 Recessed portion 34 Through hole 36 Opening portion 38 Metal thin wire 40 Nozzle 42 Screw 44 Heat sink 46 Hole portion 48 Exposed region 50 Covered region 52 Mold 54 Upper die 56 Lower Mold 58 contact part

Claims (8)

A circuit board;
A hybrid integrated circuit comprising a conductive pattern and circuit elements formed on the upper surface of the circuit board;
In a circuit device having a sealing member that covers at least an upper surface of the circuit board so that the hybrid integrated circuit is sealed,
The sealing member is composed of a frame-shaped case material that contacts the side of the circuit board, and a sealing resin filled in a region surrounded by the case material,
A circuit device, wherein an outer peripheral portion of the circuit board is fitted into a recess provided in an inner side wall of the case material. Provide a stepped portion recessed from the lower surface in the periphery of the circuit board,
The circuit device according to claim 1, wherein a back surface of the stepped portion is fitted into a concave portion of the case material.   3. The circuit device according to claim 1, wherein the concave portion of the case material is brought into contact with a lower surface of the circuit board which is a flat surface. A circuit board;
A hybrid integrated circuit comprising a conductive pattern and circuit elements formed on the upper surface of the circuit board;
In a circuit device having a sealing member that covers at least an upper surface of the circuit board so that the hybrid integrated circuit is sealed,
The sealing member is a sealing resin formed by injection molding while covering the upper surface and the side surface of the circuit board.
A circuit device, wherein an outer peripheral portion of the circuit board is fitted into the sealing resin. Provide a stepped portion recessed from the lower surface in the periphery of the circuit board,
The circuit device according to claim 4, wherein the sealing resin is fitted into the stepped portion.   The circuit device according to claim 4, wherein a part of the sealing resin is brought into contact with a lower surface of the circuit board which is a flat surface. The circuit board in the region covered with the sealing resin is provided with an opening having a larger opening diameter on the lower surface than on the upper surface,
The circuit device according to claim 1, wherein the opening resin is filled with the sealing resin. A hybrid integrated circuit comprising a conductive pattern and circuit elements formed on an upper surface of a circuit board;
In a circuit device having a sealing resin that covers at least an upper surface of the circuit board so that the hybrid integrated circuit is sealed,
The circuit board in the region covered with the sealing resin is provided with an opening having a larger opening diameter on the lower surface than on the upper surface,
A circuit device, wherein the opening is filled with the sealing resin.

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