JP2010006892A - Thermoplastic resin composition and its molded article - Google Patents
Thermoplastic resin composition and its molded article Download PDFInfo
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- JP2010006892A JP2010006892A JP2008165537A JP2008165537A JP2010006892A JP 2010006892 A JP2010006892 A JP 2010006892A JP 2008165537 A JP2008165537 A JP 2008165537A JP 2008165537 A JP2008165537 A JP 2008165537A JP 2010006892 A JP2010006892 A JP 2010006892A
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- thermoplastic resin
- resin composition
- polylactic acid
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- phosphate
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- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 36
- 239000011342 resin composition Substances 0.000 title claims abstract description 34
- 229920000747 poly(lactic acid) Polymers 0.000 claims abstract description 36
- 239000004626 polylactic acid Substances 0.000 claims abstract description 36
- 229920002678 cellulose Polymers 0.000 claims abstract description 23
- 239000001913 cellulose Substances 0.000 claims abstract description 21
- 150000001875 compounds Chemical class 0.000 claims abstract description 19
- 229910052698 phosphorus Inorganic materials 0.000 claims abstract description 19
- 239000011574 phosphorus Substances 0.000 claims abstract description 19
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims abstract description 18
- 238000000465 moulding Methods 0.000 claims abstract description 17
- JVTAAEKCZFNVCJ-UHFFFAOYSA-N lactic acid Chemical compound CC(O)C(O)=O JVTAAEKCZFNVCJ-UHFFFAOYSA-N 0.000 description 16
- 229920005989 resin Polymers 0.000 description 14
- 239000011347 resin Substances 0.000 description 14
- 238000000034 method Methods 0.000 description 13
- 239000003208 petroleum Substances 0.000 description 10
- -1 Aromatic phosphates Chemical class 0.000 description 8
- 239000004310 lactic acid Substances 0.000 description 8
- 235000014655 lactic acid Nutrition 0.000 description 8
- 230000000052 comparative effect Effects 0.000 description 7
- XZZNDPSIHUTMOC-UHFFFAOYSA-N triphenyl phosphate Chemical compound C=1C=CC=CC=1OP(OC=1C=CC=CC=1)(=O)OC1=CC=CC=C1 XZZNDPSIHUTMOC-UHFFFAOYSA-N 0.000 description 7
- 239000000126 substance Substances 0.000 description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 5
- 238000002156 mixing Methods 0.000 description 5
- GBZVNKQWXLVYNG-UHFFFAOYSA-N (3-phosphonooxyphenyl) dihydrogen phosphate Chemical compound OP(O)(=O)OC1=CC=CC(OP(O)(O)=O)=C1 GBZVNKQWXLVYNG-UHFFFAOYSA-N 0.000 description 4
- 229920001747 Cellulose diacetate Polymers 0.000 description 4
- 229910019142 PO4 Inorganic materials 0.000 description 4
- PPBRXRYQALVLMV-UHFFFAOYSA-N Styrene Chemical compound C=CC1=CC=CC=C1 PPBRXRYQALVLMV-UHFFFAOYSA-N 0.000 description 4
- APOXBWCRUPJDAC-UHFFFAOYSA-N bis(2,6-dimethylphenyl) hydrogen phosphate Chemical compound CC1=CC=CC(C)=C1OP(O)(=O)OC1=C(C)C=CC=C1C APOXBWCRUPJDAC-UHFFFAOYSA-N 0.000 description 4
- 238000011156 evaluation Methods 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 238000002844 melting Methods 0.000 description 4
- 230000008018 melting Effects 0.000 description 4
- 235000021317 phosphate Nutrition 0.000 description 4
- 238000002834 transmittance Methods 0.000 description 4
- 229920002284 Cellulose triacetate Polymers 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- YSMRWXYRXBRSND-UHFFFAOYSA-N TOTP Chemical compound CC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)C)OC1=CC=CC=C1C YSMRWXYRXBRSND-UHFFFAOYSA-N 0.000 description 3
- NNLVGZFZQQXQNW-ADJNRHBOSA-N [(2r,3r,4s,5r,6s)-4,5-diacetyloxy-3-[(2s,3r,4s,5r,6r)-3,4,5-triacetyloxy-6-(acetyloxymethyl)oxan-2-yl]oxy-6-[(2r,3r,4s,5r,6s)-4,5,6-triacetyloxy-2-(acetyloxymethyl)oxan-3-yl]oxyoxan-2-yl]methyl acetate Chemical compound O([C@@H]1O[C@@H]([C@H]([C@H](OC(C)=O)[C@H]1OC(C)=O)O[C@H]1[C@@H]([C@@H](OC(C)=O)[C@H](OC(C)=O)[C@@H](COC(C)=O)O1)OC(C)=O)COC(=O)C)[C@@H]1[C@@H](COC(C)=O)O[C@@H](OC(C)=O)[C@H](OC(C)=O)[C@H]1OC(C)=O NNLVGZFZQQXQNW-ADJNRHBOSA-N 0.000 description 3
- 229920001577 copolymer Polymers 0.000 description 3
- 239000000203 mixture Substances 0.000 description 3
- 229920000642 polymer Polymers 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- UHFOGRFLWQICFT-UHFFFAOYSA-N 2,2-bis(hydroxymethyl)-1,1-diphenylpropane-1,3-diol phosphono dihydrogen phosphate Chemical compound OP(O)(=O)OP(=O)(O)O.C1(=CC=CC=C1)C(O)(C(CO)(CO)CO)C1=CC=CC=C1 UHFOGRFLWQICFT-UHFFFAOYSA-N 0.000 description 2
- OZJPLYNZGCXSJM-UHFFFAOYSA-N 5-valerolactone Chemical compound O=C1CCCCO1 OZJPLYNZGCXSJM-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- ASMQGLCHMVWBQR-UHFFFAOYSA-N Diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(O)OC1=CC=CC=C1 ASMQGLCHMVWBQR-UHFFFAOYSA-N 0.000 description 2
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- 230000021736 acetylation Effects 0.000 description 2
- 238000006640 acetylation reaction Methods 0.000 description 2
- 239000000654 additive Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000003118 aryl group Chemical group 0.000 description 2
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 2
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 2
- DOIRQSBPFJWKBE-UHFFFAOYSA-N dibutyl phthalate Chemical compound CCCCOC(=O)C1=CC=CC=C1C(=O)OCCCC DOIRQSBPFJWKBE-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000003607 modifier Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 125000000843 phenylene group Chemical group C1(=C(C=CC=C1)*)* 0.000 description 2
- 150000003013 phosphoric acid derivatives Chemical class 0.000 description 2
- 239000004014 plasticizer Substances 0.000 description 2
- 229920000515 polycarbonate Polymers 0.000 description 2
- 239000004417 polycarbonate Substances 0.000 description 2
- 238000006116 polymerization reaction Methods 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- UQDJGEHQDNVPGU-UHFFFAOYSA-N serine phosphoethanolamine Chemical compound [NH3+]CCOP([O-])(=O)OCC([NH3+])C([O-])=O UQDJGEHQDNVPGU-UHFFFAOYSA-N 0.000 description 2
- 229920003048 styrene butadiene rubber Polymers 0.000 description 2
- AYEKOFBPNLCAJY-UHFFFAOYSA-O thiamine pyrophosphate Chemical compound CC1=C(CCOP(O)(=O)OP(O)(O)=O)SC=[N+]1CC1=CN=C(C)N=C1N AYEKOFBPNLCAJY-UHFFFAOYSA-O 0.000 description 2
- JNUCNIFVQZYOCP-UHFFFAOYSA-N (4-methylphenyl) dihydrogen phosphate Chemical compound CC1=CC=C(OP(O)(O)=O)C=C1 JNUCNIFVQZYOCP-UHFFFAOYSA-N 0.000 description 1
- NCVFZIASVZHSOI-UHFFFAOYSA-N 2-chloroethyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCCCl)OC1=CC=CC=C1 NCVFZIASVZHSOI-UHFFFAOYSA-N 0.000 description 1
- QDLYDXLYPXBEKO-UHFFFAOYSA-N 2-ethylhexyl bis(4-methylphenyl) phosphate Chemical compound C=1C=C(C)C=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=C(C)C=C1 QDLYDXLYPXBEKO-UHFFFAOYSA-N 0.000 description 1
- ALRHLSYJTWAHJZ-UHFFFAOYSA-N 3-hydroxypropionic acid Chemical compound OCCC(O)=O ALRHLSYJTWAHJZ-UHFFFAOYSA-N 0.000 description 1
- SJZRECIVHVDYJC-UHFFFAOYSA-N 4-hydroxybutyric acid Chemical compound OCCCC(O)=O SJZRECIVHVDYJC-UHFFFAOYSA-N 0.000 description 1
- 229920002749 Bacterial cellulose Polymers 0.000 description 1
- VAAKMKLKGSYLDZ-UHFFFAOYSA-N CC(CCC(C)(C)C)COP(=O)(O)O Chemical compound CC(CCC(C)(C)C)COP(=O)(O)O VAAKMKLKGSYLDZ-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 229920008347 Cellulose acetate propionate Polymers 0.000 description 1
- SNRUBQQJIBEYMU-UHFFFAOYSA-N Dodecane Natural products CCCCCCCCCCCC SNRUBQQJIBEYMU-UHFFFAOYSA-N 0.000 description 1
- 241000196324 Embryophyta Species 0.000 description 1
- 240000000797 Hibiscus cannabinus Species 0.000 description 1
- 244000017020 Ipomoea batatas Species 0.000 description 1
- 235000002678 Ipomoea batatas Nutrition 0.000 description 1
- BVMWIXWOIGJRGE-UHFFFAOYSA-N NP(O)=O Chemical compound NP(O)=O BVMWIXWOIGJRGE-UHFFFAOYSA-N 0.000 description 1
- CGSLYBDCEGBZCG-UHFFFAOYSA-N Octicizer Chemical compound C=1C=CC=CC=1OP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 CGSLYBDCEGBZCG-UHFFFAOYSA-N 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- FYAMXEPQQLNQDM-UHFFFAOYSA-N Tris(1-aziridinyl)phosphine oxide Chemical compound C1CN1P(N1CC1)(=O)N1CC1 FYAMXEPQQLNQDM-UHFFFAOYSA-N 0.000 description 1
- 240000008042 Zea mays Species 0.000 description 1
- 235000005824 Zea mays ssp. parviglumis Nutrition 0.000 description 1
- 235000002017 Zea mays subsp mays Nutrition 0.000 description 1
- YUWBVKYVJWNVLE-UHFFFAOYSA-N [N].[P] Chemical compound [N].[P] YUWBVKYVJWNVLE-UHFFFAOYSA-N 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- XECAHXYUAAWDEL-UHFFFAOYSA-N acrylonitrile butadiene styrene Chemical compound C=CC=C.C=CC#N.C=CC1=CC=CC=C1 XECAHXYUAAWDEL-UHFFFAOYSA-N 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 239000004676 acrylonitrile butadiene styrene Substances 0.000 description 1
- 229920001893 acrylonitrile styrene Polymers 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000005016 bacterial cellulose Substances 0.000 description 1
- OFOXPUGNNSFGPE-UHFFFAOYSA-N bis(2,2-dimethylpropyl) phenyl phosphate Chemical compound CC(C)(C)COP(=O)(OCC(C)(C)C)OC1=CC=CC=C1 OFOXPUGNNSFGPE-UHFFFAOYSA-N 0.000 description 1
- XIMUORXKUCOUFY-UHFFFAOYSA-N bis(2-ethylhexyl) (4-methylphenyl) phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OC1=CC=C(C)C=C1 XIMUORXKUCOUFY-UHFFFAOYSA-N 0.000 description 1
- ZXZYMQCBRZBVIC-UHFFFAOYSA-N bis(2-ethylhexyl) phenyl phosphate Chemical compound CCCCC(CC)COP(=O)(OCC(CC)CCCC)OC1=CC=CC=C1 ZXZYMQCBRZBVIC-UHFFFAOYSA-N 0.000 description 1
- MTAZNLWOLGHBHU-UHFFFAOYSA-N butadiene-styrene rubber Chemical class C=CC=C.C=CC1=CC=CC=C1 MTAZNLWOLGHBHU-UHFFFAOYSA-N 0.000 description 1
- CDQSJQSWAWPGKG-UHFFFAOYSA-N butane-1,1-diol Chemical compound CCCC(O)O CDQSJQSWAWPGKG-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000007334 copolymerization reaction Methods 0.000 description 1
- 235000005822 corn Nutrition 0.000 description 1
- QYQADNCHXSEGJT-UHFFFAOYSA-N cyclohexane-1,1-dicarboxylate;hydron Chemical compound OC(=O)C1(C(O)=O)CCCCC1 QYQADNCHXSEGJT-UHFFFAOYSA-N 0.000 description 1
- YICSVBJRVMLQNS-UHFFFAOYSA-N dibutyl phenyl phosphate Chemical compound CCCCOP(=O)(OCCCC)OC1=CC=CC=C1 YICSVBJRVMLQNS-UHFFFAOYSA-N 0.000 description 1
- 150000001991 dicarboxylic acids Chemical class 0.000 description 1
- OHZIKCOBQFCTDM-UHFFFAOYSA-N didodecyl phenyl phosphate Chemical compound CCCCCCCCCCCCOP(=O)(OCCCCCCCCCCCC)OC1=CC=CC=C1 OHZIKCOBQFCTDM-UHFFFAOYSA-N 0.000 description 1
- 125000003438 dodecyl group Chemical group [H]C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])* 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000032050 esterification Effects 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- JSPBAVGTJNAVBJ-UHFFFAOYSA-N ethyl diphenyl phosphate Chemical compound C=1C=CC=CC=1OP(=O)(OCC)OC1=CC=CC=C1 JSPBAVGTJNAVBJ-UHFFFAOYSA-N 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000945 filler Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 125000000524 functional group Chemical group 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 150000002334 glycols Chemical class 0.000 description 1
- 229920000578 graft copolymer Polymers 0.000 description 1
- 229920001903 high density polyethylene Polymers 0.000 description 1
- 229920005669 high impact polystyrene Polymers 0.000 description 1
- 239000004700 high-density polyethylene Substances 0.000 description 1
- 239000004797 high-impact polystyrene Substances 0.000 description 1
- 229920001519 homopolymer Polymers 0.000 description 1
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 1
- JJTUDXZGHPGLLC-UHFFFAOYSA-N lactide Chemical compound CC1OC(=O)C(C)OC1=O JJTUDXZGHPGLLC-UHFFFAOYSA-N 0.000 description 1
- 150000002596 lactones Chemical class 0.000 description 1
- 239000004611 light stabiliser Substances 0.000 description 1
- 229920001684 low density polyethylene Polymers 0.000 description 1
- 239000004702 low-density polyethylene Substances 0.000 description 1
- 239000000178 monomer Substances 0.000 description 1
- JRZJOMJEPLMPRA-UHFFFAOYSA-N olefin Natural products CCCCCCCC=C JRZJOMJEPLMPRA-UHFFFAOYSA-N 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- GHHZPPRXDWBHQA-UHFFFAOYSA-N phenyl bis(3,5,5-trimethylhexyl) phosphate Chemical compound CC(C)(C)CC(C)CCOP(=O)(OCCC(C)CC(C)(C)C)OC1=CC=CC=C1 GHHZPPRXDWBHQA-UHFFFAOYSA-N 0.000 description 1
- GLQSJLXTVROKNU-UHFFFAOYSA-N phenyl phosphono hydrogen phosphate Chemical compound OP(O)(=O)OP(O)(=O)OC1=CC=CC=C1 GLQSJLXTVROKNU-UHFFFAOYSA-N 0.000 description 1
- ACVYVLVWPXVTIT-UHFFFAOYSA-N phosphinic acid Chemical compound O[PH2]=O ACVYVLVWPXVTIT-UHFFFAOYSA-N 0.000 description 1
- PTMHPRAIXMAOOB-UHFFFAOYSA-N phosphoramidic acid Chemical compound NP(O)(O)=O PTMHPRAIXMAOOB-UHFFFAOYSA-N 0.000 description 1
- 239000000049 pigment Substances 0.000 description 1
- 229920003023 plastic Polymers 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- SCUZVMOVTVSBLE-UHFFFAOYSA-N prop-2-enenitrile;styrene Chemical compound C=CC#N.C=CC1=CC=CC=C1 SCUZVMOVTVSBLE-UHFFFAOYSA-N 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 239000005060 rubber Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- KKEYFWRCBNTPAC-UHFFFAOYSA-L terephthalate(2-) Chemical compound [O-]C(=O)C1=CC=C(C([O-])=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-L 0.000 description 1
- OOZBTDPWFHJVEK-UHFFFAOYSA-N tris(2-nonylphenyl) phosphate Chemical compound CCCCCCCCCC1=CC=CC=C1OP(=O)(OC=1C(=CC=CC=1)CCCCCCCCC)OC1=CC=CC=C1CCCCCCCCC OOZBTDPWFHJVEK-UHFFFAOYSA-N 0.000 description 1
- PAPBSGBWRJIAAV-UHFFFAOYSA-N ε-Caprolactone Chemical compound O=C1CCCCCO1 PAPBSGBWRJIAAV-UHFFFAOYSA-N 0.000 description 1
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- Injection Moulding Of Plastics Or The Like (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Biological Depolymerization Polymers (AREA)
Abstract
【課題】ポリ乳酸を含有し、耐熱性及び成形性に優れる熱可塑性樹脂組成物、及びその成形体を提供する。
【解決手段】ポリ乳酸(A)、セルロース誘導体(B)及び燐含有化合物(C)を含有する熱可塑性樹脂組成物であり、好ましくは、下記条件(1)及び(2)を満足する熱可塑性樹脂組成物。及び、その熱可塑性樹脂組成物を成形して得られる成形体。
(1):(A)/(B)の質量比が、40/60〜99/1。
(2):(C)の含有量が、(A)と(B)の合計100質量部に対して1〜60質量部。
【選択図】なしA thermoplastic resin composition containing polylactic acid and excellent in heat resistance and moldability, and a molded body thereof.
A thermoplastic resin composition containing a polylactic acid (A), a cellulose derivative (B) and a phosphorus-containing compound (C), and preferably satisfies the following conditions (1) and (2) Resin composition. And the molded object obtained by shape | molding the thermoplastic resin composition.
(1): Mass ratio of (A) / (B) is 40/60 to 99/1.
(2): The content of (C) is 1 to 60 parts by mass with respect to a total of 100 parts by mass of (A) and (B).
[Selection figure] None
Description
本発明は、ポリ乳酸を含有し、耐熱性及び成形性に優れる熱可塑性樹脂組成物、及びその成形体に関する。 The present invention relates to a thermoplastic resin composition containing polylactic acid and excellent in heat resistance and moldability, and a molded body thereof.
樹脂材料は、自動車、家電、OA機器の部品等の各種用途に広く用いられている。近年では、環境問題に対する関心の高まりにより、石油系樹脂から非石油系樹脂への転換が求められている。しかしながら、非石油系樹脂は、石油系樹脂に比較して、性能面で劣るため、その改良が試みられている。
ポリ乳酸は、トウモロコシ、サツマイモ等の植物由来原料から製造される非石油系樹脂であり、機械的特性、成形性に優れるため、石油系樹脂の代替材料として期待されている。しかしながら、耐熱性に劣る等の課題を有する。
Resin materials are widely used in various applications such as parts for automobiles, home appliances, and OA equipment. In recent years, a shift from petroleum-based resins to non-petroleum-based resins has been demanded due to increasing interest in environmental problems. However, since non-petroleum resins are inferior in performance compared to petroleum resins, attempts have been made to improve them.
Polylactic acid is a non-petroleum resin produced from plant-derived raw materials such as corn and sweet potato, and is expected to be an alternative material for petroleum-based resins because of its excellent mechanical properties and moldability. However, it has problems such as poor heat resistance.
ポリ乳酸の耐熱性を向上させる方法として、水酸基がエステル化等により置換されたセルロース誘導体をポリ乳酸に配合する方法(特許文献1)、セルロース誘導体及びポリカーボネートをポリ乳酸に配合する方法(特許文献2)が提案されている。
しかしながら、特許文献1で提案の方法では、ポリ乳酸の耐熱性は十分には向上しなかった。
また、特許文献2で提案の方法では、ポリ乳酸の耐熱性は向上するものの、ポリカーボネートを必須成分とするため、非石油系樹脂の含有率が低く、また、不透明な成形体しか得られていない。
However, the method proposed in Patent Document 1 does not sufficiently improve the heat resistance of polylactic acid.
Moreover, in the method proposed in Patent Document 2, although the heat resistance of polylactic acid is improved, since polycarbonate is an essential component, the content of non-petroleum resin is low, and only an opaque molded body is obtained. .
本発明の目的は、ポリ乳酸を含有し、耐熱性及び成形性に優れる熱可塑性樹脂組成物、及びその成形体を提供することにある。 An object of the present invention is to provide a thermoplastic resin composition containing polylactic acid and having excellent heat resistance and moldability, and a molded product thereof.
本発明者は鋭意検討した結果、セルロース誘導体及び燐含有化合物をポリ乳酸に配合することにより、透明性を有し、耐熱性及び成形性に優れる熱可塑性樹脂組成物が得られることを見出した。 As a result of intensive studies, the present inventors have found that a thermoplastic resin composition having transparency and excellent heat resistance and moldability can be obtained by blending a cellulose derivative and a phosphorus-containing compound with polylactic acid.
即ち、本発明の熱可塑性樹脂組成物は、ポリ乳酸(A)、セルロース誘導体(B)及び燐含有化合物(C)を含有する。
本発明の熱可塑性樹脂組成物は、下記条件(1)及び(2)を満足することが好ましい。
(1):(A)/(B)の質量比が、40/60〜99/1。
(2):(C)の含有量が、(A)と(B)の合計100質量部に対して1〜60質量部。
That is, the thermoplastic resin composition of the present invention contains polylactic acid (A), cellulose derivative (B), and phosphorus-containing compound (C).
The thermoplastic resin composition of the present invention preferably satisfies the following conditions (1) and (2).
(1): Mass ratio of (A) / (B) is 40/60 to 99/1.
(2): The content of (C) is 1 to 60 parts by mass with respect to a total of 100 parts by mass of (A) and (B).
本発明の成形体は、上記の熱可塑性樹脂組成物を成形して得られる。 The molded body of the present invention is obtained by molding the thermoplastic resin composition.
本発明の熱可塑性樹脂組成物は、耐熱性に優れる成形体を、成形性よく与えることができる。
本発明の成形体は耐熱性に優れることから、従来の石油系樹脂の代替材料として、自動車、家電、OA機器の部品等に用いることができる。
The thermoplastic resin composition of the present invention can give a molded article excellent in heat resistance with good moldability.
Since the molded product of the present invention is excellent in heat resistance, it can be used as an alternative material for conventional petroleum-based resins in automobiles, home appliances, OA equipment parts, and the like.
以下、本発明について、詳細に説明する。
本発明のポリ乳酸(A)は、乳酸の単独重合体であってもよく、乳酸と共重合し得る共重合成分と乳酸との共重合体であってもよい。
共重合成分としては、例えば、エチレングリコール、プロピレングリコール、ブタンジオール等のグリコール化合物;シュウ酸、アジピン酸、シクロヘキサンジカルボン酸等のジカルボン酸;グリコール酸、ヒドロキシプロピオン酸、ヒドロキシ酪酸等のヒドロキシカルボン酸;カプロラクトン、バレロラクトン等のラクトン類が挙げられる。
共重合成分は、全単量体(100モル%)に対して0〜30モル%用いることが好ましく、0〜10モル%用いることがより好ましい。
Hereinafter, the present invention will be described in detail.
The polylactic acid (A) of the present invention may be a homopolymer of lactic acid or a copolymer of a copolymerizable component capable of copolymerizing with lactic acid and lactic acid.
Examples of the copolymer component include glycol compounds such as ethylene glycol, propylene glycol, and butanediol; dicarboxylic acids such as oxalic acid, adipic acid, and cyclohexanedicarboxylic acid; hydroxycarboxylic acids such as glycolic acid, hydroxypropionic acid, and hydroxybutyric acid; Examples include lactones such as caprolactone and valerolactone.
The copolymerization component is preferably used in an amount of 0 to 30 mol%, more preferably 0 to 10 mol%, based on all monomers (100 mol%).
得られる熱可塑性樹脂組成物の耐熱性を考慮すると、ポリ乳酸(A)は、光学純度の高い乳酸を用いることが好ましい。例えば、全乳酸成分中、L体又はD体のいずれか一方の含有率が80質量%以上であることが好ましく、90質量%以上がより好ましく、95質量%以上がさらに好ましい。 Considering the heat resistance of the resulting thermoplastic resin composition, the polylactic acid (A) is preferably lactic acid with high optical purity. For example, in all lactic acid components, the content of either the L-form or the D-form is preferably 80% by mass or more, more preferably 90% by mass or more, and still more preferably 95% by mass or more.
ポリ乳酸(A)の融点は120℃以上が好ましく、150℃以上がより好ましい。
用いる乳酸の光学純度が高い程、得られるポリ乳酸の融点が高くなる。例えば、乳酸におけるL体又はD体のいずれか一方の含有率が90質量%以上である場合には融点120℃以上のポリ乳酸を得ることができ、95質量%以上の場合には融点150℃以上のポリ乳酸を得ることができる。
The melting point of polylactic acid (A) is preferably 120 ° C. or higher, and more preferably 150 ° C. or higher.
The higher the optical purity of the lactic acid used, the higher the melting point of the resulting polylactic acid. For example, when the content of either L-form or D-form in lactic acid is 90% by mass or more, a polylactic acid having a melting point of 120 ° C. or more can be obtained, and in the case of 95% by mass or more, a melting point of 150 ° C. The above polylactic acid can be obtained.
ポリ乳酸(A)の質量平均分子量は5万以上が好ましく、8万以上がより好ましく、10万以上がさらに好ましい。また、ポリ乳酸(A)の質量平均分子量は30万以下が好ましい。 The mass average molecular weight of the polylactic acid (A) is preferably 50,000 or more, more preferably 80,000 or more, and even more preferably 100,000 or more. The mass average molecular weight of polylactic acid (A) is preferably 300,000 or less.
ポリ乳酸(A)の製造方法としては、公知の重合方法を用いることができる。例えば、乳酸からの直接重合法、ラクチドを経由する開環重合法が挙げられる。 As a method for producing the polylactic acid (A), a known polymerization method can be used. Examples thereof include a direct polymerization method from lactic acid and a ring-opening polymerization method via lactide.
本発明のセルロース誘導体(B)は、セルロースの官能基を化学的に置換したものである。
得られる熱可塑性樹脂組成物の耐熱性及び成形性を考慮すると、セルロース誘導体(B)は、セルロースの水酸基等を全部又は部分的にエステル化したセルロースエステルが好ましい。
The cellulose derivative (B) of the present invention is obtained by chemically substituting a functional group of cellulose.
Considering the heat resistance and moldability of the resulting thermoplastic resin composition, the cellulose derivative (B) is preferably a cellulose ester obtained by esterifying all or part of the hydroxyl groups of cellulose.
セルロースエステルとしては、例えば、セルロースジアセテート、セルローストリアセテート、セルロースアセテートプロピオネート、セルロースアセテートブチレート、セルロースアセテートブチレートが挙げられる。
これらは1種を単独で用いてもよく、2種以上を併用してもよい。
これらの中では、得られる熱可塑性樹脂組成物の耐熱性を考慮すると、セルロースジアセテート、セルローストリアセテートが好ましい。
Examples of the cellulose ester include cellulose diacetate, cellulose triacetate, cellulose acetate propionate, cellulose acetate butyrate, and cellulose acetate butyrate.
These may be used alone or in combination of two or more.
Among these, cellulose diacetate and cellulose triacetate are preferable in consideration of the heat resistance of the resulting thermoplastic resin composition.
本発明の燐含有化合物(C)は、燐を含有する化合物であれば特に限定されない。
燐含有化合物(C)としては、例えば、トリフェニルホスフェート、トリクレジルホスフェート、イソプロピル化トリフェニルホスフェート、ジフェニルペンタエリトリトールジホスフェート、フェニルビス(ドデシル)ホスフェート、フェニルビス(ネオペンチル)ホスフェート、フェニルビス(3,5,5’−トリメチルヘキシル)ホスフェート、エチルジフェニルホスフェート、2−エチルヘキシルジ(p−トリル)ホスフェート、ビス(2−エチルヘキシル)p−トリルホスフェート、トリトリルホスフェート、ビス(2−エチルヘキシル)フェニルホスフェート、トリ(ノニルフェニル)ホスフェート、ビス(ドデシル)p−トリルホスフェート、ジブチルフェニルホスフェート、2−クロロエチルジフェニルホスフェート、p−トリルビス(2,5,5’−トリメチルヘキシル)ホスフェート、2−エチルヘキシルジフェニルホスフェート等の芳香族燐酸エステル類;レゾルシノール−ジ−ホスフェート、フェニレンビス(ジ−2,6−キシレニルホスフェート)、レゾルシノールテトラフェニルジホスフェート、ヒドロキノンビス(ジフェニル)ホスフェート、ビスフェノールAビス(ジフェニル)ホスフェート等の芳香族縮合燐酸エステル類;芳香族燐酸エステル類及び/又は芳香族縮合燐酸エステル類のオリゴマー又はポリマー;塩化窒化燐、燐エステルアミド、燐酸アミド、ホスホン酸アミド、ホスフィン酸アミド、トリス(アジリジニル)ホスフィンオキシド等の燐−窒素含有化合物類が挙げられる。
The phosphorus-containing compound (C) of the present invention is not particularly limited as long as it is a phosphorus-containing compound.
Examples of the phosphorus-containing compound (C) include triphenyl phosphate, tricresyl phosphate, isopropylated triphenyl phosphate, diphenylpentaerythritol diphosphate, phenyl bis (dodecyl) phosphate, phenyl bis (neopentyl) phosphate, phenyl bis (3 , 5,5′-trimethylhexyl) phosphate, ethyl diphenyl phosphate, 2-ethylhexyl di (p-tolyl) phosphate, bis (2-ethylhexyl) p-tolyl phosphate, tolyl phosphate, bis (2-ethylhexyl) phenyl phosphate, Tri (nonylphenyl) phosphate, bis (dodecyl) p-tolylphosphate, dibutylphenyl phosphate, 2-chloroethyldiphenylphosphate, p-to Aromatic phosphates such as rilbis (2,5,5′-trimethylhexyl) phosphate, 2-ethylhexyldiphenylphosphate; resorcinol-di-phosphate, phenylenebis (di-2,6-xylenylphosphate), resorcinol tetra Aromatic condensed phosphates such as phenyl diphosphate, hydroquinone bis (diphenyl) phosphate, bisphenol A bis (diphenyl) phosphate; oligomers or polymers of aromatic phosphates and / or aromatic condensed phosphates; Examples include phosphorus-nitrogen-containing compounds such as phosphorus ester amide, phosphoric acid amide, phosphonic acid amide, phosphinic acid amide, and tris (aziridinyl) phosphine oxide.
これらの中では、得られる熱可塑性樹脂組成物の耐熱性、成形性、透明性及び成形外観を考慮すると、トリフェニルホスフェート、トリクレジルホスフェート、イソプロピル化トリフェニルホスフェート、ジフェニルペンタエリトリトールジホスフェート、レゾルシノール−ジ−ホスフェート、フェニレンビス(ジ−2,6−キシレニルホスフェート)が好ましく、トリフェニルホスフェート、レゾルシノール−ジ−ホスフェート、フェニレンビス(ジ−2,6−キシレニルホスフェート)がより好ましい。 Among these, considering the heat resistance, moldability, transparency and molding appearance of the obtained thermoplastic resin composition, triphenyl phosphate, tricresyl phosphate, isopropylated triphenyl phosphate, diphenylpentaerythritol diphosphate, resorcinol -Di-phosphate and phenylene bis (di-2,6-xylenyl phosphate) are preferable, and triphenyl phosphate, resorcinol-di-phosphate, and phenylene bis (di-2,6-xylenyl phosphate) are more preferable.
燐含有化合物(C)の市販品としては、例えば、商品名「TPP」(トリフェニルホスフェート)、「CR−733S」(レゾルシノール−ジ−ホスフェート)、「PX−200」(1,3−フェニレンビス(ジ−2,6−キシレニルホスフェート))(以上、大八化学工業(株)製)が挙げられる。
これらは1種を単独で用いてもよく、2種以上を併用してもよい。
Examples of commercially available phosphorus-containing compounds (C) include trade names “TPP” (triphenyl phosphate), “CR-733S” (resorcinol-di-phosphate), “PX-200” (1,3-phenylenebis). (Di-2,6-xylenyl phosphate) (above, manufactured by Daihachi Chemical Industry Co., Ltd.).
These may be used alone or in combination of two or more.
本発明の熱可塑性樹脂組成物における各成分の比率は、下記条件(1)及び(2)を満足することが好ましい。
(1):ポリ乳酸(A)/セルロース誘導体(B)の質量比が、40/60〜99/1。
(2):燐含有化合物(C)の含有量が、ポリ乳酸(A)とセルロース誘導体(B)の合計100質量部に対して1〜60質量部。
The ratio of each component in the thermoplastic resin composition of the present invention preferably satisfies the following conditions (1) and (2).
(1): The mass ratio of polylactic acid (A) / cellulose derivative (B) is 40/60 to 99/1.
(2): The content of the phosphorus-containing compound (C) is 1 to 60 parts by mass with respect to 100 parts by mass in total of the polylactic acid (A) and the cellulose derivative (B).
得られる熱可塑性樹脂組成物の耐熱性及び成形性を考慮すると、ポリ乳酸(A)/セルロース誘導体(B)の質量比が、50/50〜90/10がより好ましく、60/40〜80/20がさらに好ましい。
また、得られる成形体の透明性及び成形外観を考慮すると、燐含有化合物(C)の含有量が、ポリ乳酸(A)とセルロース誘導体(B)の合計100質量部に対して3〜40質量部がより好ましく、5〜15質量部がさらに好ましい。
Considering the heat resistance and moldability of the resulting thermoplastic resin composition, the mass ratio of polylactic acid (A) / cellulose derivative (B) is more preferably 50/50 to 90/10, and 60/40 to 80 / 20 is more preferable.
Moreover, when the transparency and molding appearance of the obtained molded product are taken into consideration, the content of the phosphorus-containing compound (C) is 3 to 40 masses with respect to a total of 100 mass parts of the polylactic acid (A) and the cellulose derivative (B). Part is more preferable, and 5 to 15 parts by mass is further preferable.
本発明の熱可塑性樹脂組成物は、必要に応じて、その他の熱可塑性樹脂を配合することができる。
その他の熱可塑性樹脂としては、例えば、ポリスチレン、高衝撃性ポリスチレン、アクリロニトリル−スチレン樹脂、アクリロニトリル−ブタジエン−スチレン樹脂、スチレン−ブタジエン共重合体、水素添加スチレン−ブタジエン共重合体等のスチレン系樹脂;ポリプロピレン、低密度ポリエチレン、高密度ポリエチレン、エチレン−プロピレン共重合体、環状オレフィン含有重合体等のオレフィン系樹脂;ポリエチレンテレフタレート、ポリトリメチレングリコールテレフタレート、ポリブチレンテレフタレート等のポリエステル系樹脂;ポリカーボネート系樹脂が挙げられる。
The thermoplastic resin composition of this invention can mix | blend other thermoplastic resins as needed.
As other thermoplastic resins, for example, styrene resins such as polystyrene, high impact polystyrene, acrylonitrile-styrene resin, acrylonitrile-butadiene-styrene resin, styrene-butadiene copolymer, hydrogenated styrene-butadiene copolymer; Olefin resins such as polypropylene, low density polyethylene, high density polyethylene, ethylene-propylene copolymer, cyclic olefin-containing polymer; polyester resins such as polyethylene terephthalate, polytrimethylene glycol terephthalate, polybutylene terephthalate; polycarbonate resins Can be mentioned.
本発明の熱可塑性樹脂組成物に配合されるその他の熱可塑性樹脂(石油系樹脂)の量は極力少ないことが好ましく、本発明の熱可塑性樹脂組成物における全成分(100質量%)中、0〜30質量%が好ましく、0〜20質量%がより好ましく、0〜10質量%がさらに好ましい。 The amount of the other thermoplastic resin (petroleum resin) blended in the thermoplastic resin composition of the present invention is preferably as small as possible, and is 0 in the total components (100% by mass) in the thermoplastic resin composition of the present invention. -30 mass% is preferable, 0-20 mass% is more preferable, and 0-10 mass% is further more preferable.
本発明の熱可塑性樹脂組成物は、必要に応じて、酸化防止剤、光安定剤、難燃剤、可塑剤等の公知の添加剤;ガラス繊維、炭素繊維、タルク、炭酸カルシウム、ケナフ、バクテリアセルロース等のフィラー;染顔料;ゴム含有グラフト共重合体等の耐衝撃性改質剤;アクリル及び/又はスチレン系重合体等の成形加工性改質剤等を配合することができる。 The thermoplastic resin composition of the present invention comprises, as necessary, known additives such as antioxidants, light stabilizers, flame retardants, plasticizers; glass fibers, carbon fibers, talc, calcium carbonate, kenaf, bacterial cellulose Fillers such as pigments; impact resistance modifiers such as rubber-containing graft copolymers; and molding processability modifiers such as acrylic and / or styrene-based polymers.
本発明の熱可塑性樹脂組成物は、ポリ乳酸(A)、セルロース誘導体(B)、燐含有化合物(C)、必要に応じて各種添加剤類を、公知の方法でブレンドすることにより得られる。
ブレンド方法としては、例えば、バッチ式のニーダー、単軸又は多軸の押出機等によるブレンド法を挙げることができる。
The thermoplastic resin composition of the present invention can be obtained by blending polylactic acid (A), cellulose derivative (B), phosphorus-containing compound (C), and various additives as required by a known method.
Examples of the blending method include a blending method using a batch kneader, a single-screw or multi-screw extruder, and the like.
本発明の熱可塑性樹脂組成物は、押出成形、射出成形、プレス成形、インフレーション成形、カレンダ成形等の公知の成形方法を適用して、各種成形体の製造に用いることができる。
本発明の成形体は、自動車、家電、OA機器の部品等の各種用途に用いることができる。
The thermoplastic resin composition of the present invention can be used for production of various molded products by applying known molding methods such as extrusion molding, injection molding, press molding, inflation molding, calendar molding and the like.
The molded body of the present invention can be used for various applications such as parts for automobiles, home appliances, and OA equipment.
以下、実施例により、本発明を具体的に説明する。尚、「部」及び「%」はそれぞれ「質量部」、「質量%」を示す。また、評価は以下の方法で実施した。 Hereinafter, the present invention will be described specifically by way of examples. “Part” and “%” represent “part by mass” and “% by mass”, respectively. Moreover, evaluation was implemented with the following method.
(1)耐熱性
得られた成形体のビカット軟化温度を、ASTM−D1525に準拠し、荷重10Nで測定した。
(1) Heat resistance The Vicat softening temperature of the obtained molded body was measured with a load of 10 N in accordance with ASTM-D1525.
(2)成形性
得られた熱可塑性樹脂組成物を、卓上射出成形機を用いて成形した際の成形条件(卓上射出成形機のバレル温度)を、次の基準で評価した。
○:バレル温度220℃で成形できた。
△:バレル温度220℃で成形できず、バレル温度260℃で成形できたが、得られた成形体は着色が酷かった。
×:バレル温度260℃で成形できなかった。
(2) Moldability The molding conditions (barrel temperature of the desktop injection molding machine) when the obtained thermoplastic resin composition was molded using a desktop injection molding machine were evaluated according to the following criteria.
○: Molding was possible at a barrel temperature of 220 ° C.
Δ: Molding was not possible at a barrel temperature of 220 ° C. and molding was possible at a barrel temperature of 260 ° C., but the resulting molded product was severely colored.
×: Could not be molded at a barrel temperature of 260 ° C.
(3)透明性
得られた成形体の全光線透過率を、JIS−K3261に準拠し、試験片厚みを2mm、光が透過する開口部を直径6mmとして測定し、次の基準で評価した。
○:全光線透過率60%以上
△:全光線透過率30%以上、60%未満
×:全光線透過率30%未満
(3) Transparency The total light transmittance of the obtained molded product was measured in accordance with JIS-K3261, with a test piece thickness of 2 mm and an opening through which light was transmitted as a diameter of 6 mm, and was evaluated according to the following criteria.
○: Total light transmittance of 60% or more Δ: Total light transmittance of 30% or more and less than 60% ×: Total light transmittance of less than 30%
(4)成形外観
得られた成形体を目視により観察し、次の基準で評価した。
○:良好
△:一部にフィブリル等の存在がみられた。
×:繊維状の亀裂がみられた。
(4) Molding appearance The obtained molding was observed visually and evaluated according to the following criteria.
○: Good △: Presence of fibrils and the like was observed in part.
X: Fibrous cracks were observed.
[実施例1〜3]
ポリ乳酸(商品名「レイシアH−100」、三井化学(株)製)、セルロースジアセテート(商品名「L−40」、ダイセル化学工業(株)製、アセチル化度55%)、セルローストリアセテート(商品名「LT−35」、ダイセル化学工業(株)製、アセチル化度61%)、トリフェニルホスフェート(商品名「TPP」、大八化学工業(株)製)を、表1に示す組成で、ニーダー(商品名「プラスチコーダー」、ブラベンダー社製、内容積50cm3)用いて、バレル温度220℃で溶融ブレンドし、熱可塑性樹脂組成物(イ)〜(ハ)を得た。
[Examples 1 to 3]
Polylactic acid (trade name “Lacia H-100”, manufactured by Mitsui Chemicals, Inc.), cellulose diacetate (trade name “L-40”, manufactured by Daicel Chemical Industries, Ltd., acetylation degree 55%), cellulose triacetate ( The trade name “LT-35”, manufactured by Daicel Chemical Industries, Ltd. (degree of acetylation 61%), triphenyl phosphate (trade name “TPP”, manufactured by Daihachi Chemical Industry Co., Ltd.) are shown in Table 1. Using a kneader (trade name “Plastic Coder”, manufactured by Brabender, internal volume 50 cm 3 ), melt blending was performed at a barrel temperature of 220 ° C. to obtain thermoplastic resin compositions (I) to (C).
これらの熱可塑性樹脂組成物を、卓上射出成形機(商品名「CS−183」、Custom Scientific Instruments社製)を用いて、バレル温度220℃又は260℃で溶融させて、金型内に射出した。
金型を室温まで冷却した後、金型から成形体(長さ20mm×幅10mm×厚み2mm)を取り出した。
得られた試験片を用いて、成形性、成形外観、耐熱性、透明性を評価した。評価結果を表1に示す。
These thermoplastic resin compositions were melted at a barrel temperature of 220 ° C. or 260 ° C. using a desktop injection molding machine (trade name “CS-183”, manufactured by Custom Scientific Instruments) and injected into the mold. .
After cooling the mold to room temperature, a molded body (length 20 mm × width 10 mm × thickness 2 mm) was taken out from the mold.
Using the obtained test piece, moldability, molding appearance, heat resistance, and transparency were evaluated. The evaluation results are shown in Table 1.
表1
Table 1
[比較例1]
原料にポリ乳酸(商品名「レイシアH−100」、三井化学(株)製)を用い、実施例1と同様にして成形体を得た。評価結果を表1に示す。
[Comparative Example 1]
A molded body was obtained in the same manner as in Example 1, using polylactic acid (trade name “Lacia H-100”, manufactured by Mitsui Chemicals, Inc.) as a raw material. The evaluation results are shown in Table 1.
[比較例2〜5]
原料組成を表1に示すように変更したこと以外は、実施例1と同様にして、熱可塑性樹脂組成物(ニ)〜(ト)を得た。これらの熱可塑性樹脂組成物を用い、実施例1と同様にして成形体を得た。評価結果を表1に示す。
[Comparative Examples 2 to 5]
The thermoplastic resin compositions (d) to (g) were obtained in the same manner as in Example 1 except that the raw material composition was changed as shown in Table 1. Using these thermoplastic resin compositions, molded articles were obtained in the same manner as in Example 1. The evaluation results are shown in Table 1.
表1から明らかなように、ポリ乳酸(A)、セルロース誘導体(B)、燐含有化合物(C)を含有する成形体(実施例1〜3)は、耐熱性及び成形性に優れていた。また、燐含有化合物の含有量を調整することにより、透明性及び成形外観を改良できることが確認された。
セルロース誘導体(B)としては、セルロースジアセテートを用いた場合、得られる成形体の成形性及び透明性は特に優れていた。
As is clear from Table 1, the molded bodies (Examples 1 to 3) containing polylactic acid (A), cellulose derivative (B), and phosphorus-containing compound (C) were excellent in heat resistance and moldability. Moreover, it was confirmed that the transparency and the molded appearance can be improved by adjusting the content of the phosphorus-containing compound.
When cellulose diacetate was used as the cellulose derivative (B), the moldability and transparency of the obtained molded product were particularly excellent.
ポリ乳酸(A)単独の成形体(比較例1)は、耐熱性に劣っていた。また、セルロース誘導体(B)を含まず、ポリ乳酸(A)及び燐含有化合物(C)を含有する成形体(比較例3)も、同様に耐熱性に劣っていた。 The molded product of polylactic acid (A) alone (Comparative Example 1) was inferior in heat resistance. Moreover, the molded object (Comparative Example 3) which does not contain a cellulose derivative (B) and contains a polylactic acid (A) and a phosphorus-containing compound (C) was similarly inferior in heat resistance.
燐含有化合物(C)を含まず、ポリ乳酸(A)及びセルロース誘導体(B)を含有する成形体(比較例2)は、成形性に劣っていた。また、燐含有化合物(C)の代わりに、可塑剤としてフタル酸ジブチルを用いた成形体(比較例5)も、同様に成形性に劣っていた。
ポリ乳酸(A)を含まず、セルロース誘導体(B)及び燐含有化合物(C)を含有する成形体(比較例4)は、成形性に劣っていた。
The molded article (Comparative Example 2) containing the polylactic acid (A) and the cellulose derivative (B) without the phosphorus-containing compound (C) was inferior in moldability. Moreover, the molded object (Comparative Example 5) using dibutyl phthalate as a plasticizer instead of the phosphorus-containing compound (C) was similarly inferior in moldability.
The molded product (Comparative Example 4) which does not contain polylactic acid (A) and contains the cellulose derivative (B) and the phosphorus-containing compound (C) was inferior in moldability.
以上の結果から、本発明の熱可塑性樹脂組成物は、ポリ乳酸(A)、セルロース誘導体(B)、燐含有化合物(C)を含有することにより、ポリ乳酸を含有しているにもかかわらず、耐熱性及び成形性に優れることが明らかである。 From the above results, the thermoplastic resin composition of the present invention contains polylactic acid by containing polylactic acid (A), cellulose derivative (B), and phosphorus-containing compound (C). It is clear that it is excellent in heat resistance and moldability.
本発明の熱可塑性樹脂組成物は、耐熱性に優れる成形体を、成形性よく与えることができることから、従来の石油系樹脂の代替材料として、自動車、家電、OA機器の部品等に用いることができる。 Since the thermoplastic resin composition of the present invention can give a molded article having excellent heat resistance with good moldability, it can be used as an alternative material for conventional petroleum-based resins in parts of automobiles, home appliances, OA equipment, and the like. it can.
Claims (3)
(1):(A)/(B)の質量比が、40/60〜99/1。
(2):(C)の含有量が、(A)と(B)の合計100質量部に対して1〜60質量部。 The thermoplastic resin composition according to claim 1, which satisfies the following conditions (1) and (2).
(1): Mass ratio of (A) / (B) is 40/60 to 99/1.
(2): The content of (C) is 1 to 60 parts by mass with respect to a total of 100 parts by mass of (A) and (B).
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