JP2010056131A5 - - Google Patents

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Publication number: JP2010056131A5
Authority: JP; Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.): Granted

Application number

JP2008216616A

Other versions

JP5061065B2 (ja

JP2010056131A (ja

Filing date

2008-08-26

Publication date

2011-01-06

2008-08-26 Application filed filed Critical

2008-08-26 Priority claimed from JP2008216616A external-priority patent/JP5061065B2/ja

2008-08-26 Priority to JP2008216616A priority Critical patent/JP5061065B2/ja

2009-08-24 Priority to US12/546,149 priority patent/US9159645B2/en

2009-08-25 Priority to KR1020090078444A priority patent/KR101043543B1/ko

2009-08-26 Priority to CN200910163520.3A priority patent/CN101661914B/zh

2009-08-26 Priority to EP09168644A priority patent/EP2159839B1/en

2010-03-11 Publication of JP2010056131A publication Critical patent/JP2010056131A/ja

2011-01-06 Publication of JP2010056131A5 publication Critical patent/JP2010056131A5/ja

2012-10-31 Publication of JP5061065B2 publication Critical patent/JP5061065B2/ja

2012-10-31 Application granted granted Critical

Status Active legal-status Critical Current

2028-08-26 Anticipated expiration legal-status Critical

Links

JP2008216616A 2008-08-26 2008-08-26 液冷式冷却装置 Active JP5061065B2 (ja)

Priority Applications (5)

Application Number	Priority Date	Filing Date	Title
JP2008216616A JP5061065B2 (ja)	2008-08-26	2008-08-26	液冷式冷却装置
US12/546,149 US9159645B2 (en)	2008-08-26	2009-08-24	Liquid-cooled-type cooling device
KR1020090078444A KR101043543B1 (ko)	2008-08-26	2009-08-25	액냉식 냉각 장치
EP09168644A EP2159839B1 (en)	2008-08-26	2009-08-26	Liquid-cooled-type cooling device
CN200910163520.3A CN101661914B (zh)	2008-08-26	2009-08-26	液冷式冷却装置

Applications Claiming Priority (1)

Application Number	Priority Date	Filing Date	Title
JP2008216616A JP5061065B2 (ja)	2008-08-26	2008-08-26	液冷式冷却装置

Publications (3)

Publication Number	Publication Date
JP2010056131A JP2010056131A (ja)	2010-03-11
JP2010056131A5 true JP2010056131A5 (ja)	2011-01-06
JP5061065B2 JP5061065B2 (ja)	2012-10-31

Family

ID=41392770

Family Applications (1)

Application Number	Title	Priority Date	Filing Date
JP2008216616A Active JP5061065B2 (ja)	2008-08-26	2008-08-26	液冷式冷却装置

Country Status (5)

Country	Link
US (1)	US9159645B2 (ja)
EP (1)	EP2159839B1 (ja)
JP (1)	JP5061065B2 (ja)
KR (1)	KR101043543B1 (ja)
CN (1)	CN101661914B (ja)

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JP5343007B2 (ja) *	2007-11-26	2013-11-13	株式会社豊田自動織機	液冷式冷却装置
US8902589B2 (en)	2010-04-21	2014-12-02	Fuji Electric Co., Ltd.	Semiconductor module and cooler
JP5471891B2 (ja) *	2010-06-29	2014-04-16	株式会社デンソー	電力変換装置
DE102010061768A1 (de) *	2010-11-23	2012-05-24	Behr Gmbh & Co. Kg	Vorrichtung zur Kühlung einer Wärmequelle eines Kraftfahrzeugs
EP2704191B1 (en)	2011-04-26	2019-03-13	Fuji Electric Co., Ltd.	Cooler for semiconductor module
JP5772953B2 (ja) *	2011-06-15	2015-09-02	トヨタ自動車株式会社	半導体素子の冷却構造
KR101906645B1 (ko)	2011-10-12	2018-10-10	후지 덴키 가부시키가이샤	반도체 모듈용 냉각기 및 반도체 모듈
WO2013140704A1 (ja) *	2012-03-21	2013-09-26	富士電機株式会社	電力変換装置
DE102012207305A1 (de) *	2012-05-02	2013-11-07	Webasto Ag	Heizvorrichtung für ein Fahrzeug und Verfahren zum Betreiben der Heizvorrichtung
EP4064336A1 (en) *	2012-10-29	2022-09-28	Fuji Electric Co., Ltd.	Semiconductor device
CN105210185A (zh) *	2013-05-17	2015-12-30	富士通株式会社	半导体装置及其制造方法、以及电子设备
JP6154272B2 (ja) *	2013-09-25	2017-06-28	京セラ株式会社	冷却基板、素子収納用パッケージおよび電子装置
JP6584514B2 (ja) *	2015-09-07	2019-10-02	三菱電機株式会社	積層型ヘッダ、熱交換器、及び、空気調和装置
US10292316B2 (en) *	2017-09-08	2019-05-14	Hamilton Sundstrand Corporation	Power module with integrated liquid cooling
JP6663899B2 (ja) *	2017-11-29	2020-03-13	本田技研工業株式会社	冷却装置
CN111937141B (zh)	2018-10-03	2024-11-01	富士电机株式会社	半导体装置
CN111129645B (zh) *	2018-10-31	2021-12-24	浙江三花汽车零部件有限公司	一种换热装置
CN111121501B (zh) *	2018-10-31	2022-11-04	浙江三花汽车零部件有限公司	一种换热装置
US11129310B2 (en)	2018-11-22	2021-09-21	Fuji Electric Co., Ltd.	Semiconductor module, vehicle and manufacturing method
JP7243262B2 (ja) *	2019-02-15	2023-03-22	富士電機株式会社	半導体モジュール、車両および製造方法
WO2025042549A1 (en) *	2023-08-21	2025-02-27	Tesla, Inc.	Parallel flow heatsink

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KR100619076B1 (ko) *	2005-04-11	2006-08-31	삼성전자주식회사	전자소자 방열용 히트싱크장치
WO2006115073A1 (ja) *	2005-04-21	2006-11-02	Nippon Light Metal Company, Ltd.	液冷ジャケット
JP4608641B2 (ja)	2005-04-27	2011-01-12	株式会社豊田自動織機	パワーモジュール用ヒートシンク
US7365981B2 (en) *	2005-06-28	2008-04-29	Delphi Technologies, Inc.	Fluid-cooled electronic system
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JP5024600B2 (ja) *	2007-01-11	2012-09-12	アイシン・エィ・ダブリュ株式会社	発熱体冷却構造及びその構造を備えた駆動装置
US8371365B2 (en) *	2007-05-03	2013-02-12	Brayton Energy, Llc	Heat exchange device and method for manufacture
JP5120605B2 (ja) *	2007-05-22	2013-01-16	アイシン・エィ・ダブリュ株式会社	半導体モジュール及びインバータ装置
US9671179B2 (en)	2008-01-15	2017-06-06	Showa Denko K.K.	Liquid-cooled-type cooling device

2008
- 2008-08-26 JP JP2008216616A patent/JP5061065B2/ja active Active
2009
- 2009-08-24 US US12/546,149 patent/US9159645B2/en not_active Expired - Fee Related
- 2009-08-25 KR KR1020090078444A patent/KR101043543B1/ko not_active Expired - Fee Related
- 2009-08-26 EP EP09168644A patent/EP2159839B1/en not_active Not-in-force
- 2009-08-26 CN CN200910163520.3A patent/CN101661914B/zh not_active Expired - Fee Related

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