JP2010048784A - Jig, apparatus, and method for electrical inspection - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a jig, an apparatus, and a method for electrical inspection capable of continuously electrically inspecting bodies to be inspected having diagonally extending electrodes such as leads of an IC package without causing damage to a contact sheet. <P>SOLUTION: The electrical inspection apparatus includes a printed circuit board 7 which continues to leads 71 of an electronic part on both sides of a contact sheet 5; their support bases 11 and 12; leads; the contact sheet; and an indenter 54 for superposing and pressing terminals of the printed circuit board. The support bases 11 and 12 support the printed circuit board 7 at an angle, and the extending direction of the leads are the in-plane direction of the surface of the printed circuit board. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an electric inspection jig, an electric inspection device, and an electric inspection method, and more specifically, an electric inspection jig used for electric inspection of electronic parts such as semiconductor packages, an electric inspection device incorporating the electric inspection jig, and an electric inspection method. It is about.

For semiconductor devices such as LSI, all electrical inspections are performed on the production line for quality assurance. Probe pins are arranged in an electric inspection jig that constitutes a head of an electric inspection device used for electric inspection, and wiring that communicates with the tester is connected to the probe pins. The tester can inspect whether the circuit between the predetermined electrodes is normal or abnormal while the probe pin of the inspection jig is in contact with an electrode such as a semiconductor chip. Corresponding to the electrode arrangement of the object to be inspected which tends to increase in density, the electrical inspection jig uses a pitch conversion board (printed circuit board), an anisotropic conductive sheet, a probe pin, etc. The electrical connection with the electrode is realized (Patent Document 1). The anisotropic conductive sheet has conductivity only in the thickness direction, and is supposed to undergo elastic deformation or recoverable deformation in the thickness direction with respect to pressure (Patent Document 2).
Japanese Patent Laid-Open No. 5-159821 JP 2004-265844 A

  Some semiconductor chips or IC packages have QFP (Quad Flat Package) electrodes that are not parallel to the surface of the package body. That is, the QFP lead extends obliquely downward from the side of the resin package body. The extended lead bends so that it forms an obtuse angle at the tip and approaches the body surface in parallel, but it still has an angle that intersects the body surface and does not become parallel. The anisotropic conductive sheet disposed on the pitch conversion board (printed circuit board) of the electrical inspection jig is electrically connected to the above leads. Of course, the connection between the lead extending obliquely and the anisotropic conductive sheet is pressurized from above and below. For this reason, the front-end | tip part of a lead contacts with an anisotropic conductive sheet with the component of the direction pierced ahead. Therefore, the anisotropic conductive sheet is subjected to a large concentration pressure by the tip of the lead.

As described above, in the production line for IC packages and the like, all inspections are performed before shipping, and it is not uncommon for the number of inspections to reach tens of thousands. When such an enormous number of electrical inspections are performed, tens of thousands of inspected objects are inspected while being continuously replaced. On the other hand, the contact sheet (anisotropic conductive sheet) of the inspection apparatus is subjected to a large concentration pressure repeatedly several tens of thousands of times. As a result, the contact sheet is damaged in the middle of completing all inspections. Failure of equipment on a continuous line such as electrical inspection greatly impedes the efficiency of electrical inspection and increases the cost of electrical inspection. Also, contact sheets are expensive and their breakage increases the material cost of electrical inspection. The present invention provides an electric inspection jig, an electric inspection device, and an electric inspection capable of continuously inspecting an object to be inspected having an electrode extending obliquely, such as a lead of an IC package, without damaging the contact sheet. It aims to provide a method.

  The electrical inspection jig of the present invention is used to perform electrical inspection of electronic components having leads extending in a direction intersecting the surface of the main body. This electrical inspection jig includes a printed circuit board having a terminal electrically connected to an electronic component lead across a contact sheet, a support base for supporting the printed circuit board, an electronic component lead, a contact sheet, and a printed circuit. And an indenter for pressurizing the terminals of the substrate. The support base tilts and supports the printed circuit board and aligns the extending direction of the leads with the in-plane direction of the surface of the printed circuit board.

According to the above configuration, since the direction of the leads is parallel to the surface of the printed circuit board, the indenter applies pressure to the parallel laminated members of (lead / contact sheet / surface terminal of the printed circuit board). For this reason, a large stress is not locally generated in the contact sheet by the lead. As a result, the service life of the contact sheet or the like is not shortened. In addition, it is possible to prevent a high electrical inspection efficiency due to repeated electrical tests from being continuously deteriorated due to damage of the contact sheet. Here, the surface of the main body portion of the electronic component refers to the surface of the central portion excluding the leads, for example, the surface of the package in the case of a package, and is usually the maximum plane that forms a rectangular parallelepiped. However, in the case of a curved surface such as a curved surface, it means a tangential plane at the top. In addition, when the main body or the like has a particularly complicated shape, it should be interpreted in accordance with the spirit of the present invention.

The contact surface for pressurizing the indenter described above extends in a shape parallel to the surface of the printed circuit board or in the lead arrangement direction (a direction perpendicular to the direction in which the leads extend), and its cross section is rounded. It may be a convex shape. As a result, the parallelism between the contact members is further improved, and the possibility of generating a large stress locally can be reliably eliminated. The former shape presses and presses the lead across the surface, and the latter shape presses and presses the lead in a linear contact form.

  An electrical inspection apparatus according to the present invention includes a pressurization device and any one of the electrical inspection jigs described above, and pressurizes the pressurization device with an indenter. As a result, the electrical inspection of the semiconductor package or the like in which the lead is not parallel to the surface of the main body portion and the tip is lowered can be continuously performed for a long time without damaging the contact sheet. As a result, the electrical test cost of the IC package as described above can be reduced.

  The electrical inspection method of the present invention is a method for performing electrical inspection of an electronic component having a lead extending in a direction intersecting the surface of the main body. In this method, the printed circuit board is supported on a support base and arranged to include the direction in which the lead of the electronic component extends in the in-plane direction of the surface of the printed circuit board. Further, the method includes a step of overlapping the lead of the electronic component and the terminal of the printed circuit board with a contact sheet interposed therebetween, and applying pressure to the overlapped portion.

  According to the above method, it is possible to continuously inspect many electronic components by reducing the frequency of damage to the contact sheet. For this reason, not only the material cost of the contact sheet but also the electrical inspection efficiency can be improved, and the overall cost of the electrical inspection can be reduced.

  An indenter can be used to apply the pressure, and the contact surface of the indenter can be parallel to the surface of the printed circuit board. Further, as the indenter at the tip having a rounded convex cross section, the rounded tip may be brought into contact with the lead in a linear shape. This further ensures the parallelism between the members, prevents the generation of a large stress locally, and improves the number of times the contact sheet or the like is used repeatedly.

  With the electrical inspection jig and electrical inspection device of the present invention, it is possible to continuously inspect electronic parts having electrodes extending obliquely, such as IC package leads, many times without damage to the contact sheet. It becomes.

  FIG. 1 is a diagram showing an electrical inspection jig 10 (electrical inspection device 50) according to an embodiment of the present invention. In the electronic component to be subjected to the electrical inspection according to the embodiment of the present invention, the lead or the lead 71 protruding outward from the main body portion 70a of the electronic component extends so as not to be parallel to the surface of the main body portion 70a. . In many cases, the surface of the main body 70a is a flat surface. However, as will be described later, the surface of the main body 70a may be convexly curved outward. Thus, the surface of the main body in the case of a curved surface is a tangential plane at the top. Sure. In addition, when the main body has a complicated shape, it should be interpreted in accordance with the spirit of the present invention. The electrical inspection jig 10 according to the embodiment of the present invention is characterized in that the pitch conversion board or the printed circuit board 7 is disposed so as to be inclined along the direction in which the tip of the lead 71 extends. In order to realize the inclined arrangement of the printed circuit board 7, the inclined base 12 is further fixed to the insulating base 11, and the printed circuit board 7 is attached to the inclined base 12. The printed circuit board 7 is attached to the inclined base 12 with screws 13. A through hole 17 is formed in the printed circuit board 7, and a female screw 12 g into which the screw 12 is screwed is formed in the inclined base 12. From the above, the inclined base 12 directly supports the printed circuit board 7, but it may be considered that the inclined base 12 and the insulating base 11 support the printed circuit board 7.

  FIG. 2 is a diagram showing an electronic component 70 as an object to be inspected. The electronic component 70 is used as a connection component shown in FIG. In FIG. 3, the electronic component 70 connects the electrodes on two orthogonal substrates. A lead 71 on one side of the connection component 70 which is an electronic component is connected to an electrode 91 provided on one substrate 90 by a solder 78. The lead 71 on the other side of the connection component 70 is also connected to the electrode 91 on the substrate 90 arranged so as to be orthogonal to the one substrate by the solder 78. As can be seen from such a connection structure, it intersects the macroscopic surface of the main body portion 70a of the lead 71 of the electronic component 70 at an angle of approximately 45 °. Therefore, the angle formed by the leads 71 on both sides is 90 °. In the lead 71 on one side and the other side, the root portion close to the main body portion 70a forms an angle (intersection angle) of 45 ° with the surface of the main body portion. However, the tip of the lead 71 is bent in a direction approaching the surface of the main body 70a in order to reduce the crossing angle and relax. For this reason, at the time of the connection by the solder 78, the tip of the lead 71 is made to follow the surface of the electrode 91, so that the lead on the main body side and the main body 70a itself are elastically curved. The surface of the main body 70a is not a flat surface but is slightly curved, and is more easily curved with the base side of the lead by fixing the solder connection.

  FIG. 4 is a view showing two inclined bases 12 fixed to a flat insulating base 11. The two inclined bases 12 have inclined surfaces that are lowered on both sides with an interval in accordance with the size of the main body portion 70a of the connection component 70. Screws 13 a to 13 d are arranged on the inclined base 12, and the printed circuit board 7 is fixed on the inclined base 12 as will be described later. FIG. 5 shows the printed circuit board or pitch conversion board 7 attached to the tilt base 12. In FIG. 5, the back surface is shown, and the back surface terminal 7b is solder-connected to the wiring 21 to the tester. In FIG. 5, the range R of the back surface of the printed circuit board 7 is fixed so as to contact the inclined surface of the inclined base 12. The screw 13a of the inclined base 12 is inserted through the through hole 17a of the printed circuit board 7 and screwed into the female screw portion. The screw 13b passes through the through-hole 17b, the screw 13c passes through the through-hole 17c, and the screw 13d passes through the through-hole 17d and is screwed into a female screw provided on the inclined base 12, respectively. The back terminal 7 b of the printed circuit board 7 does not hit the inclined surface of the inclined base 12. For this reason, as shown in FIG. 1, the wiring 21 to the tester passes under the back surface.

  The circuit board 7 is electrically connected to the lead 71 of the electronic component with the contact sheet 5 interposed therebetween. In the contact sheet 5, the conductive portion 5 a is formed by attaching a conductive metal to the inner wall of the hole of the porous resin portion. The resin portion becomes the insulating portion 5b. Under the present circumstances, the porous structure in a conduction | electrical_connection part can be hold | maintained by controlling the adhesion amount of a conductive metal moderately. Since the conductive metal adheres along the surface of the resin portion having a porous structure, the portion of the conductive metal layer is integrated with the porous structure to form a porous structure. For this reason, the deformation | transformation ease of the conduction | electrical_connection part itself at the time of a contact can be acquired. On the other hand, this means that the conductive state of the conductive portion 5a cannot be obtained unless compressive stress of a predetermined level or higher is applied. Therefore, when the contact sheet 5 is used, it is necessary to apply a compressive stress of a predetermined level or higher.

  For this reason, the electrical inspection apparatus is provided with a pressurizing device, and applies pressure between the electronic component which is the object to be inspected and the electrical inspection jig. FIG. 6 is a view showing an indenter 54 that applies pressure in direct contact with the lead 71. The indenter 54 is formed of a bifurcated resin portion 54a and a metal portion 54m that is inserted into and fixed to the root of the bifurcated resin portion. As the resin forming the resin portion 54a, a hard resin such as a PTFE resin, a POM resin, a PA resin, a PPS resin, or a PI resin can be used. It is desirable that the tip portion in contact with the lead 71 is rounded. Further, the front end portion 54a may be a surface parallel to the surface of the printed circuit board. One of the two branches branched into direct contact with one lead 71 and applies pressure toward the printed circuit board. The distance between both ends of the bifurcated portion is approximately equal to the distance between the two leads 71 in the connection component 70.

  In a normal electrical inspection apparatus, an indenter that applies pressure contacts the electronic component main body part 70 a and applies pressure to the contact sheet 5 sandwiched between the printed circuit board 7. However, as described above, when the lead 71 is positioned so as to extend in a direction intersecting the surface of the electronic component main body 70a, a structure in which the indenter pushes the main body 70a is not preferable. As shown in FIG. 1, the indenter 54 may directly press the lead 71 in contact with the contact sheet 5. From FIG. 1 and FIG. 6, it is desirable that the tip of the indenter 54 is pressed against the lead 71 in a linear contact.

(Points of electrical inspection jig according to the embodiment of the present invention)
The points of the electrical inspection jig are as follows.
(P1) The surfaces of the contact sheet 5 and the printed circuit board 7 are arranged along the direction in which the tip of the lead of the electronic component extends. In other words, it may be arranged that the direction in which the tip of the lead extends is included in the surfaces of the contact sheet 5 and the printed circuit board 7.
(P2) Under the conditions of (P1) above, the indenter 54 for applying pressure is brought into direct contact with the lead 71, and pressure is applied to the lead 71 and (contact sheet 5 / printed circuit board 7) from above and below. The tip 54a of the indenter 54 may be a surface along the direction in which the lead 71 extends, or may be rounded and pressed by linear contact.

By providing the above configurations (P1) and (P2), the following operational effects can be achieved.
(E1) The locally concentrated stress that protrudes from the lead 71 is not applied to the expensive contact sheet 5, and it is possible to prevent the contact sheet from being subjected to a short life test.
(E2) It is possible to prevent the high electrical inspection efficiency due to continuous and repeated performance from being lowered by interruption due to damage to the contact sheet. Further, it is possible to prevent misjudgment such as disconnection and cross-connection due to the contact sheet being damaged by concentrated stress such as the lead 71 protruding.

Next, the results of verifying the effects of the present invention will be described with reference to examples. The following two specimens (Invention Example A1 and Comparative Example B1) were placed on the shipment line of the IC package (product), and a shipment test was performed for a predetermined period. As shown in FIG. 1, Example A1 of the present invention is an electrical inspection jig in which the contact sheet is inclined according to the inclination of the inclined lead of the IC package and the pressing surface is aligned with the contact sheet surface. In the inventive example A1, the direction in which the leads extend matches the in-plane direction of the contact sheet. On the other hand, the comparative example B1 is an electrical inspection jig in which the extending direction of the lead tip of the IC package does not match the in-plane direction of the contact sheet and intersects the surface of the contact sheet. In the comparative example B1, the contact sheet is disposed horizontally (at right angles to the vertical direction), and therefore, the contact sheet is parallel to the surface of the IC body, not the lead tip.
During the predetermined period, the damaged ones were replaced, and the number of tests between the start of use and the replacement was defined as the durability number. The ratio of the number of times that a false notification that there was a disconnection even though it was a normal IC package was the disconnection NG false alarm rate. That is, the disconnection NG false alarm rate is (the number of disconnection NG false alarms / number of tests) that occurred during the predetermined period × 100%. The results are shown in Table 1.

  According to Table 1, regarding the number of endurance, the invention example A1 was found to have a significantly longer life than the comparative example B1 by several times (three times compared with the center value). Moreover, about the disconnection NG false alarm rate which has big influence on the reliability of factory operation and electrical inspection itself, it was an unusually large rate of 15 to 20% in Comparative Example B1. On the other hand, in the inventive example A1, a very low rate of less than 0.01% could be realized. From a different point of view, there should be no broken NG false alarms, and it is possible to realize a rate that can be said to be a normal state in electrical inspection at the time of shipment from the manufacturing plant, and it is possible to improve the reliability of electrical inspection. It was. Moreover, the possibility of causing unnecessary disruption to the operation of the manufacturing plant could be avoided.

  Although the embodiments and examples of the present invention have been described above, the embodiments and examples of the present invention disclosed above are merely examples, and the scope of the present invention is the implementation of these inventions. It is not limited to the form. The scope of the present invention is indicated by the description of the scope of claims, and further includes meanings equivalent to the description of the scope of claims and all modifications within the scope.

  The present invention can relieve concentrated stress on the contact sheet from the tip of the lead by aligning the surface of the (contact sheet / printed circuit board) in the direction in which the tip of the lead of the electronic component extends. The number of sheet durability tests can be extended. In addition, it is possible to prevent a decrease in the efficiency of electrical inspection due to interruption of continuous electrical inspection due to contact sheet damage.

It is a figure which shows the electrical test | inspection jig in embodiment of this invention. It is a figure which shows the electronic component used as the object of the electrical test | inspection shown in FIG. It is a figure which shows the usage condition of an electronic component. It is a figure which shows the inclination base which supports the printed circuit board of the electrical inspection jig of FIG. It is a figure which shows the printed circuit board of the electrical test | inspection jig shown in FIG. It is a figure which shows the indenter of the electric test | inspection jig shown in FIG.

Explanation of symbols

5 Contact sheet, 5a Conducting part, 5b Insulating part, 7 Printed circuit board (pitch conversion board), 7a Front terminal, 7b Back terminal, 10 Electrical inspection jig, 11 Insulating base, 12 Inclined base, 12g Female thread, 13 , 13a to 13d Screw, 17, 17a to 17d Printed circuit board through hole (screw hole), 21 tester wiring, 50 electrical inspection device, 54 indenter, 54m metal rod, 54a resin tip, 70 inspected object (electronic) Components, connection components), 70a electronic component main body, 71 lead, 78 solder, 90 substrate, 91 electrode.
Standardized electrodes, 77, 77a, 77b, 77c, 77d Inspected electrodes.

Claims (4)

An electrical inspection jig used for electrical inspection of an electronic component having a lead extending in a direction intersecting the surface of the main body,
A printed circuit board having a terminal on the surface, which is electrically connected to the lead of the electronic component with a contact sheet interposed therebetween,
A support for supporting the printed circuit board;
An indenter for stacking and pressurizing the leads of the electronic component, the contact sheet, and the terminals of the printed circuit board;
The electrical inspection jig, wherein the support base tilts and supports the printed circuit board, and aligns the extending direction of the leads with the in-plane direction of the surface of the printed circuit board. The contact surface for pressurizing the indenter has a shape parallel to the surface of the circuit board or a convex shape having a rounded cross section extending in the lead arrangement direction. The electrical inspection jig according to claim 1. An electrical inspection apparatus comprising the pressurization apparatus and the electrical inspection jig according to claim 1, wherein the pressurization is performed by the pressurization apparatus via the indenter. A method for conducting an electrical inspection of an electronic component having a lead extending in a direction intersecting the surface of the main body,
A step of supporting a printed circuit board and arranging the lead of the electronic component to extend in an in-plane direction of the surface of the printed circuit board;
An electrical inspection method comprising: a step of superposing leads of the electronic component and terminals of the printed circuit board with a contact sheet interposed therebetween, and applying pressure to the superposed portion.

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