JP2010025765A - Contact structure for inspection - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To stably inspect the electric characteristics of bodies to be inspected with high accuracy. <P>SOLUTION: An electronic part 23 is arranged over a wiring 22 applied to an insulating plate 21 in such a way as to bridge the wiring 22. The electronic part 23 is electrically connected to the wiring 22 to form an electronic part unit 20. The electronic part unit 20 is joined to the lower surface of a support plate 12 in the vicinity of a probe 13, and the electronic part 23 and the probe 13 are electrically connected to each other by a connecting conductor 24 via the wiring 22. <P>COPYRIGHT: (C)2010,JPO&INPIT

Description

  The present invention relates to an inspection contact structure for inspecting electrical characteristics of an object to be inspected.

  The electrical characteristics of devices such as ICs and LSIs (hereinafter referred to as “devices”) formed on a semiconductor wafer (hereinafter referred to as “wafers”) are performed using a probe card mounted on the probe apparatus. ing. FIG. 7 is a schematic diagram showing the configuration of the probe apparatus. The probe apparatus 100 is provided with a probe card 101 and a mounting table 102 on which a wafer W as an object to be inspected is mounted.

  The probe card 101 is electrically connected to the probe 110 and an inspection contact structure 112 including a support plate 111 that supports a plurality of probes 110 that contact the electrodes P of the device formed on the wafer W. Has a circuit board 113 for sending and receiving electrical signals for inspection. For the support plate 111 that supports the probe 110, an insulating material that does not affect the electrical signal, such as ceramic, is used.

  As shown in FIG. 8, the probe 110 inputs and outputs a device inspection signal to and from a power source probe 110a and a grounding probe 110b that apply an inspection electric signal to a device on the wafer W through a circuit board 113. And a signal probe 110c. The electrical characteristics of the devices on the wafer W are inspected by bringing the tips of the plurality of probes 110 into contact with the electrodes P, and using the circuit board 113 to send electrical signals for inspection to the electrodes from the power probe 110a. It is done by applying.

  By the way, in the inspection of the electrical characteristics of such a device, for example, noise generated in the power supply line is a factor that lowers the accuracy of the inspection. The power line noise can be removed by connecting a noise removing capacitor 120 in parallel between the power line 201 and the ground line 202 in the vicinity of the device under test 200 as shown in FIG.

The capacitor 120 has a higher noise removal effect as it is connected to the end of the power line 201, that is, a position closer to the device under test 200. Therefore, the capacitor 120 is preferably mounted as close as possible to the tip of the power probe 110a. Therefore, conventionally, the capacitor 120 is mounted on the lower surface of the circuit board 113, which is a place where mounting is possible and is closest to the tip of the power probe 110a (Patent Document 1).
JP 2001-50979 A

  However, when the capacitor 120 is mounted on the lower surface of the circuit board 113, the connection position between the capacitor 120 and the power probe 110 a is in the vicinity of the circuit board 113. Accordingly, a portion where noise is not removed remains between the connection position of the capacitor 120 and the tip of the power probe 110a. For this reason, it is difficult to perform a highly accurate and stable inspection.

  Even if the capacitor 120 is to be mounted on the support plate 111 that is the structure closest to the tip of the power probe 110a, the support plate 111 is an insulator, so the capacitor 120, the capacitor 120, the power probe 110a, It is not easy to mount wiring that electrically connects the two.

  The present invention has been made in view of the above points, and an electronic component such as a capacitor can be easily mounted on a support plate of a test contact structure, and the test contact structure can be used to The purpose is to perform a stable inspection with high accuracy.

  In order to achieve the above object, the present invention is an inspection contact structure for inspecting electrical characteristics of an object to be inspected, and has the following characteristics. The inspection contact structure includes a support plate, and a contactor that contacts the object to be inspected and an electronic component unit are provided on the lower surface side of the support plate. The electronic component unit includes an insulating plate, wiring formed on the insulating plate, and an electronic component provided on the wiring and electrically connected to the wiring. The contact and the wiring are electrically connected by a connecting conductor. The support plate may be an insulator.

  According to the present invention, since the electronic component is arranged on the wiring provided on the insulating plate and unitized as an electronic component unit, the electronic component such as a capacitor, for example, a required part, for example, a contactor Can be provided on the lower surface of the support plate, which is the closest location. As a result, noise can be removed up to the vicinity of the tip of the contact, and the electrical characteristics of the object to be inspected can be inspected stably with high accuracy. In addition, the electronic component unit can be easily mounted regardless of the material of the support plate, and a general-purpose connection conductor such as solder or conductive adhesive is used for electrical connection between the electronic component unit and the contact. it can. Accordingly, it is possible to provide an inspection contact structure that is inexpensive and can perform highly accurate and stable inspection.

  The electrical connection between the contact and the wiring is performed by bringing a protrusion extending from a support portion provided to support the contact on the lower surface of the support plate into contact with the wiring. May be.

  The electronic component unit may be mounted in a recess formed on the lower surface of the support plate. As a result, even when the installation density of the contacts is high and it is difficult to secure a place for arranging the electronic components, the electronic components can be mounted on the lower surface of the support plate.

  The electronic component of the electronic component unit may be a noise removing capacitor or a termination resistor for impedance matching of the contact. Further, it may be a diode, IC, LSI or the like.

  The insulating plate of the electronic component unit may be polyimide, a glass substrate, or a ceramic substrate.

  ADVANTAGE OF THE INVENTION According to this invention, the test | inspection of the electrical property of a to-be-inspected object can be performed stably with high precision.

  Embodiments of the present invention will be described below. FIG. 1 is an explanatory side view illustrating an outline of a configuration of a probe device 1 having an inspection contact structure according to an embodiment. The probe device 1 is provided with a probe card 2 and a mounting table 3 on which a wafer W as an object to be inspected is mounted. The mounting table 3 is configured to be movable left and right and up and down, and the mounted wafer W can be moved three-dimensionally.

  The entire probe card 2 is formed in a disk shape, for example. The probe card 2 is a circuit board 10 that sends an electrical signal for inspection to a device formed on the wafer W, and an electrical connection between the circuit board 10 and the wafer W in contact with the electrode P of the device. The contact structure 11 is used.

  The circuit board 10 is formed in a disk shape, for example, and is electrically connected to a tester (not shown). On the circuit board 10, an electronic circuit (not shown) for transmitting an electrical signal for inspection with the inspection contact structure 11 is mounted. An electrical signal for inspection from the tester is transmitted to and received from the inspection contact structure 11 via the electronic circuit of the circuit board 10. As shown in FIG. 2, connection terminals 10 a are arranged on the lower surface of the circuit board 10, and the connection terminals 10 a are formed as part of the electronic circuit of the circuit board 10.

  The inspection contact structure 11 has a support plate 12 as shown in FIG. The support plate 12 is formed in a square shape, for example, and is disposed on the lower surface side of the circuit board 10 so as to face the mounting table 3 and to be parallel to the circuit board 10. For the support plate 12, an insulator such as ceramic or glass is used. A connection terminal 12 a is provided on the upper surface of the support plate 12 and is electrically connected to the connection terminal 10 a of the circuit board 10. A probe 13 is provided on the lower surface side of the support plate 12. An electronic component unit 20 is disposed on the lower surface of the support plate 12 and in the vicinity of the probe 13.

  The probe 13 is formed of a conductive material having excellent mechanical characteristics such as nickel and cobalt, for example, and as shown in FIG. 3, a power probe 13a for applying power and a ground for use in grounding the power It has a probe 13b and a signal probe 13c that inputs and outputs an electrical signal for inspection. As shown in FIG. 2, the probe 13 has a support portion 31 that protrudes from the lower surface of the support plate 12 and is held by the support plate 12. The support portion 31 penetrates the support plate 12 in the thickness direction, and the upper end of the support portion 31 is electrically connected to the connection terminal 12a provided on the upper surface of the support plate 12, thereby ensuring electrical connection with the tester. Yes. A beam portion 32 is provided at the lower end of the support portion 31, and the beam portion 32 is cantilevered by the support portion 31. At the free end portion of the beam portion 32, a contact 33 that is disposed at a position extending downward in the perpendicular direction of the beam portion 32 and is in contact with the electrode P of the device is provided.

  As shown in FIG. 3, the electronic component unit 20 includes an insulating plate 21, a wiring 22 formed on the insulating plate 21, and an electronic component 23 provided on the wiring 22. In this embodiment, the insulating plate 21 is made of, for example, polyimide, and the electronic component 23 is, for example, a capacitor for removing noise. The wiring 22 has a power wiring 22a connected to the power probe 13a and a ground wiring 22b connected to the ground probe 13b. The wirings 22a and 22b are extended to the end of the insulating plate 21, and an electronic component 23 is provided on the wirings 22a and 22b so as to bridge the wirings 22a and 22b. The electronic component 23 is electrically connected to the wirings 22a and 22b.

  As shown in FIGS. 2 and 3, the electronic component unit 20 is mounted on the lower surface of the support plate 12 and in the vicinity of the probe 13. The insulating plate 21 and the support plate 12 of the electronic component unit 20 are joined by, for example, an adhesive. The ends of the wirings 22a and 22b on the electronic component unit 20 are electrically connected to the power supply probe 13a and the grounding probe 13b by connecting conductors 24, respectively. For the connection conductor 24, for example, a general-purpose conductive adhesive, solder, or wire bond is used.

  In the example shown in the figure, a set of three probes 13a, 13b, and 13c and the electronic component unit 20 are mounted on the support plate 12, but this is for ease of understanding. Needless to say, the number of probes 13 and electronic component units 20 corresponding to the number of devices to be inspected at one time are actually mounted on the support plate 12.

  When inspecting the electrical characteristics of the device on the wafer W using the probe apparatus 1 configured as described above, first, the mounting table 3 on which the wafer W is mounted moves, The probe 13 is brought close to the probe 13 and brought into contact with the electrode P on the device. An electrical signal for inspection from the tester is applied to the device via the circuit board 10, the support plate 12, and the probe 13. At this time, electric signal noise is removed by the electronic component 23. In this way, the electrical characteristics of the device are inspected.

  According to the above embodiment, since the electronic component 23 is mounted on the insulating plate 21 and formed as the electronic component unit 20, the electronic component 23 is arranged on the lower surface of the support plate 12 with the insulating plate 21. For example, it can be performed by bonding to the support plate 12 using an adhesive. And since the electronic component 23 is electrically connected with the wiring 22 extended to the edge part of the insulating board 21, in the connection with the probe 13, it connects with the wiring 22 using the general purpose connection conductor 24. do it. As a result, the electronic component 23 can be mounted in the vicinity of the probe 13, and noise in the power supply line can be removed up to the vicinity of the tip of the probe, so that a highly accurate and stable inspection can be performed.

  Further, since the insulating plate 21 and the support plate 12 can be bonded using an adhesive or the like, the electronic component unit 20 can be easily disposed on the lower surface of the support plate 12 regardless of the material of the support plate 12.

  Further, when the electronic component 23 needs to be replaced, the electronic component 23 is removed together with the electronic component unit 20 and another electronic component unit 20 is arranged. Then, the wiring 22 and the probe 13 are connected to the connecting conductor. 24 may be electrically connected. For this reason, the time and cost required for repairing the contact structure 11 for inspection can be reduced.

  In the above embodiment, the electronic component 23 is disposed so as to be the lower surface of the insulating plate 21, but as shown in FIG. 4, the electronic component 23 is insulated in the recess 40 formed on the lower surface of the support plate 12. You may arrange | position so that it may become the upper surface of the board 21. FIG. The wiring 22 formed on the upper surface (the electronic component 23 side) of the insulating plate 21 passes through the through hole 21 a formed in the insulating plate 21 and is also formed on the lower surface of the insulating plate 21. The wiring 22 formed on the lower surface of the insulating plate 21 and the probe 13 are electrically connected by the connection conductor 24. In such a case, since the electronic component 23 can be prevented from projecting to the lower surface side of the support plate 12, for example, the electronic component 23 can be mounted without interfering with the probe 13 even at a location where the probe 13 is highly integrated. Therefore, it is possible to provide the inspection contact structure 11 that increases the degree of integration of the probes 13 and simultaneously measures a larger number of devices.

  In the above embodiment, the electronic component 23 arranged in the electronic component unit 20 is a noise removing capacitor, but it may be a terminal resistor for impedance matching of the probe 13. Also in this case, since the resistor can be connected at a position close to the tip of the probe 13, the impedance of each probe 13 can be matched with higher accuracy than when the resistor is mounted on the circuit board 10. In the electronic component unit 20, a plurality of capacitors and resistors may be arranged as the electronic component 23. Further, the electronic component 23 may be a diode, IC, LSI or the like. In particular, by installing a diode, reverse current existing between the electronic component and the device can be prevented. Therefore, a stable inspection with less noise can be performed.

  In the above embodiment, polyimide is used as the insulating plate 21 of the electronic component unit 20, but a glass substrate, a ceramic substrate, or the like may be selected according to the material of the support plate 12 or the like.

  In the above embodiment, the connection conductor 24 used for electrical connection between the probe 13 and the wiring 22 is a general-purpose conductive adhesive, solder, or wire bond. 6, the protrusion 13 may extend to the fixed end side of the beam portion 32 supported by the support plate 12 of the probe 13, that is, to the opposite side of the device electrode P. In this case, the electronic component 23 and the probe 13 can be electrically connected by bringing the protrusion 34 into contact with the wiring 22 on the electronic component unit 20.

  The preferred embodiments of the present invention have been described above with reference to the accompanying drawings, but the present invention is not limited to such examples. It is obvious for those skilled in the art that various modifications or modifications can be conceived within the scope of the idea described in the claims, and these naturally belong to the technical scope of the present invention. It is understood. The present invention is not limited to this example and can take various forms. The present invention can also be applied to a case where the substrate is another substrate such as an FPD (flat panel display) other than a semiconductor or a mask reticle for a photomask.

  The present invention is useful when inspecting the electrical characteristics of an object to be inspected, such as a semiconductor wafer.

It is a side view which shows the probe apparatus which has the contact structure for a test | inspection concerning this Embodiment. It is a side view which shows the outline of a structure of the contact structure for a test | inspection concerning this Embodiment. It is a perspective view which shows the state in which the electronic component unit concerning this Embodiment and the probe were electrically connected. It is a side view equivalent to FIG. 2 which shows the state by which the electronic component unit concerning other embodiment is arrange | positioned at the hollow part of the support plate. It is a side view of the contact structure for a test | inspection concerning other embodiment. It is a side view of the contact structure for a test | inspection concerning other embodiment. It is a front view of the conventional probe apparatus. It is a front view of the conventional probe apparatus. It is a schematic diagram which shows the connection position of the capacitor for noise removal.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Probe apparatus 2 Probe card 3 Mounting base 10 Circuit board 10a Connection terminal 11 Inspection contact structure 12 Support plate 12a Connection terminal 13 Probe 13a Power supply probe 13b Ground probe 13c Signal probe 20 Electronic component unit 21 Insulating plate 22 Wiring 22a Power supply wiring 22b Grounding wiring 23 Electronic component 24 Connection conductor 31 Support part 32 Beam part 33 Contact 34 Projection part 50 Insulating member 51 Groove 52 Wiring W Wafer P electrode

Claims (9)

An inspection contact structure for inspecting electrical characteristics of an object to be inspected,
A support plate, a contact provided on the lower surface side of the support plate and in contact with the object to be inspected, and an electronic component unit provided on the lower surface of the support plate,
The electronic component unit includes an insulating plate, a wiring formed on the insulating plate, and an electronic component provided on the wiring and electrically connected to the wiring.
The contact structure for inspection, wherein the contact and the wiring are electrically connected by a connecting conductor. The contact structure for inspection according to claim 1, wherein the support plate is an insulator. A support portion for supporting the contact is provided on the lower surface of the support plate,
The contact structure for inspection according to claim 1, wherein the connection conductor is a protrusion extending from the support portion. A recess is formed on the lower surface of the support plate,
The said electronic component is arrange | positioned at the said hollow part, The contact structure for a test | inspection in any one of Claims 1-3 characterized by the above-mentioned. The inspection contact structure according to claim 1, wherein the electronic component is a capacitor for removing noise from an inspection signal. The contact structure for inspection according to claim 1, wherein the electronic component is a terminal resistor for impedance matching of the contact. The contact structure for inspection according to claim 1, wherein the insulating plate is made of polyimide. The contact structure for inspection according to claim 1, wherein the insulating plate is made of glass. The contact structure for inspection according to claim 1, wherein the insulating plate is made of ceramic.

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