JP2009117509A - Sheet peeling device and peeling method - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a sheet peeling device and a peeling method. <P>SOLUTION: The sheet peeling device 10 includes a table 11 supporting an adherend W such as a semiconductor wafer on which an adhesive sheet S is stuck, a feeding means 12 of feeding a peeling tape T onto the adhesive sheet S, a guide means 13 of guiding the peeling tape T to between a bonding means 14 and the adhesive sheet S, an attitude maintaining means 16 of putting a lead-end side of the peeling tape T along the adhesive tape S, and the bonding means 14 of bonding the peeling tape T to the adhesive sheet S. The feeding means 12 is constituted including a peeling means 15 comprising a pair of rollers that can rotate in the feeding direction of the peeling tape T and in the opposite direction from the feeding direction, and peels the adhesive tape S by rotating to send out the peeling tape T and/or the adhesive sheet S in the opposite direction from the feeding direction when moving relatively to the support means 11. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a sheet peeling apparatus and a peeling method, and more particularly to a sheet peeling apparatus and a peeling method suitable for peeling a protective sheet attached to an adherend such as a semiconductor wafer.

  In the semiconductor manufacturing process, an adhesive sheet such as a protective sheet is attached to the front surface (circuit formation surface) of the wafer in order to perform various processes such as back grinding of a semiconductor wafer (hereinafter simply referred to as “wafer”). A step of peeling the adhesive sheet from the wafer after completing the predetermined processing is employed.

  As the peeling device for the adhesive sheet, for example, as disclosed in Patent Document 1, a peeling tape is welded to an end of the adhesive sheet, and a peeling head that holds the peeling tape and a table that supports the wafer are provided. A configuration is known in which the adhesive sheet is peeled from the wafer by relative movement.

Japanese Patent Laid-Open No. 11-16862

  However, in the peeling apparatus described in Patent Document 1, in a state where the peeling head holds the peeling tape, a tensile force is continuously applied to the peeling tape to peel the adhesive sheet. For this reason, there is a problem that the peeling tape may be peeled off from the adhesion point to the adhesive sheet, or the peeling sheet may be cut off in the middle, thereby causing poor peeling of the adhesive sheet.

[Object of invention]
The present invention has been devised by paying attention to such inconveniences, and its purpose is to avoid applying a tensile force to the peeling tape as much as possible, and the peeling tape is peeled off from the adhesive sheet. An object of the present invention is to provide a sheet peeling apparatus and a peeling method capable of preventing the inconvenience of being cut in the middle and avoiding the peeling failure of the adhesive sheet.

  In order to achieve the above object, the present invention provides a support means for an adherend to which an adhesive sheet is affixed, a feeding means for feeding a peeling tape onto the adhesive sheet, and an adhesive for adhering the peeling tape to the adhesive sheet. In the sheet peeling apparatus that peels the adhesive sheet through the peeling tape by relative movement between the feeding means and the supporting means, the feeding means sandwiches the peeling tape and the peeling tape. And a peeling means composed of at least a pair of rollers rotatable in a direction opposite to the feeding direction, and the roller rotates in the direction opposite to the feeding direction during the relative movement, A configuration is adopted in which a peeling tape and / or an adhesive sheet is sent out to peel off the adhesive sheet.

  In this invention, the structure containing the peeling assistance means which maintains the peeling angle at the time of peeling the said adhesive sheet constant is employable.

  The apparatus further includes a tape cutting means for cutting the peeling tape on the upstream side in the feeding direction of the peeling tape bonded to the adhesive sheet, the adhesive sheet peeled off from the adherend, and the peeling adhesive bonded to the adhesive sheet The configuration is such that the tape can be disposed of.

  In addition, the present invention is such that the peeling tape is fed out on the adhesive sheet affixed to the adherend via the feeding means, and the peeling tape is bonded to the adhesive sheet via the bonding means, and then the feeding means and the covered sheet. In the sheet peeling method in which the adhesive sheet is peeled off by moving relative to a table that supports the body, the peeling tape is attached to the adhesive sheet in a state where the feeding means sandwiches the peeling tape and feeds it to the adhesive sheet side. Then, the adhesive sheet is peeled off by moving relative to the support means while being driven in a direction opposite to the direction in which the feeding means feeds the peeling tape.

  In the sheet peeling method, the adhesive sheet can be peeled while keeping a peeling angle constant by placing a peeling auxiliary means at a position along the adhesive sheet.

  Further, when the adhesive sheet is peeled from the adherend, a method is adopted in which the upstream side in the feeding direction of the peeling tape that adheres to the adhesive sheet is cut, and the adhesive sheet and the peeling tape that adheres to the adhesive sheet are discarded. ing.

According to the present invention, the peeling means constituting the feeding means feeds the peeling tape and rotates the peeling tape and / or the adhesive sheet to feed in the direction opposite to the feeding direction to peel the adhesive sheet from the adherend. Therefore, the peeling tape is pulled by the pair of rollers only at the initial stage of peeling, and thereafter, the adhesive sheet is pulled by the pair of rollers so as to be peeled off. In other words, since the peeling sheet is pulled only at the initial stage of peeling with a light peeling force, there is no inconvenience that the adhesive part of the peeling sheet is peeled off from the adhesive sheet or the peeling tape is cut. No longer occurs.
In addition, since the peeling angle of the adhesive sheet is maintained constant by the peeling assisting means, the peeling can be stably performed, and the peeling assisting means is positioned so as to hold down the adhesive sheet, thereby lifting the adherend. Can be prevented.
Further, in the configuration provided with the cutting means, every time the adhesive sheet attached to the adherend is peeled off, the adhesive sheet and the peeling tape adhered to the adhesive sheet can be discarded.

  Hereinafter, embodiments of the present invention will be described with reference to the drawings.

  FIG. 1 shows a schematic front view of a sheet peeling apparatus according to this embodiment, and FIG. 2 shows an enlarged front view of the main part thereof. In these drawings, a sheet peeling apparatus 10 includes a table (support means) 11 that supports a wafer W as an adherend to which an adhesive sheet S is stuck, and a feeding means 12 that feeds out a heat-sensitive adhesive tape T. The guide means 13 for guiding the peeling tape T fed from the feeding means 12, the posture maintaining means 16 for bringing the lead end side of the peeling tape T along the adhesive sheet S, and the lead end side of the peeling tape T Are attached to the adhesive sheet S, and an auxiliary roller 60 is provided as a peeling auxiliary means used when peeling the adhesive sheet S from the wafer W via the peeling tape T adhered to the adhesive sheet S. It is configured.

  The table 11 is configured to hold the wafer W in a fixed manner with the upper surface side serving as an adsorption surface, and is provided so as to be movable in the left-right direction in FIG.

  The feeding means 12 includes a support shaft 17 that supports the stripping tape T wound in a belt shape, a driving roller 18 that is rotatably provided via a motor M that can rotate forward and backward, and a driving roller 18. On the other hand, it is provided by a driving means (not shown) so as to be separated and approachable, and is constituted by a pinch roller 19 that sandwiches a peeling tape T with the driving roller 18. The support shaft 17 is rotatably supported by the plate-like frame F, while the motor M, the drive roller 18 and the pinch roller 19 are provided so as to be movable in the left-right direction in FIG. The peeling means 15 is formed by the motor M, the driving roller 18, the pinch roller 19, and the frame F1. Here, the drive roller 18 and the pinch roller 19 sandwich the peeling tape T and feed the lead end side of the peeling tape T toward the upper part of the adhesive sheet S by rotating them, while moving the left direction with respect to the table 11. When the relative movement is performed, the pair of rollers is configured to peel the adhesive sheet S from the wafer W by rotating in the direction opposite to the feeding direction of the peeling tape T.

  The guide means 13 includes a case 22 (see FIG. 3) having a suction port 21 having an opening surface in a plane inclined at a predetermined angle with respect to a horizontal plane, and belt rollers 24 and 25 disposed in the case 22 relative to each other. A plurality of belts 26 wound around the belt rollers 24, 25, a driven pulley 28 fixed to the rotating shaft 27 of the belt roller 24 outside the case 22, and the case 22. The driving pulley 29 is rotationally driven by a motor M1 that can rotate forward and backward, a belt 31 wound around the pulleys 28 and 29, and a decompression pump (not shown) that decompresses the inside of the case 22. The belt 26 is arranged so as to rotate along the inclined surface, and the peeling tape T is sucked and drawn toward the belt 26 by depressurizing the inside of the case 22, and the belt 26 is peeled off. The peeling tape T can be fed out along the belt 26 by rotating in the feeding direction. The case 22 is supported by a moving means (not shown) so as to be movable in the vertical direction.

  As shown in FIG. 2, the bonding means 14 includes a cylinder 33 fixed to the outer surface of the case 22 and a heater head 34 including a heater 35 provided so as to advance and retreat in the vertical direction by the cylinder 33. Become. The adhesive means 14 presses and heats the lead end side of the peeling tape T fed to the upper surface side of the adhesive sheet S through the guide means 13 by the heater head 34, whereby the peeling tape T is adhered to the adhesive sheet. It is comprised so that both may be connected by welding to S.

  The auxiliary roller 60 as the peeling auxiliary means is supported by a moving means (not shown) that supports the auxiliary roller 60 so as to be movable in the left-right direction and the vertical direction in FIG. The auxiliary roller 60 keeps the peeling angle constant when peeling the adhesive sheet S and regulates the lifting of the wafer W.

  The posture maintaining means 16 is composed of a pneumatic pump (not shown) and a nozzle 37 connected to the pneumatic pump. The opening of the nozzle 37 is directed in the direction of the peeling tape T sent out from the guide means 13, and the blown air blows out between the case 22 and the adhesive sheet S. Regulations are made so that it is not drawn out in an unintended direction.

  A tape holding means 38 and a tape cutting means 39 are disposed between the support shaft 17 and the peeling means 15. The tape holding means 38 includes a tape receiving plate 40, a cylinder 41 for moving the tape receiving plate 40 in the left-right direction in FIG. 1, a cylinder 42 disposed above the tape receiving plate 40, and a vertical movement by the cylinder 42. It consists of a holding block 45 that can move forward and backward.

  The tape cutting means 39 is attached to an upper / lower cylinder 47 and a slider (not shown) of the upper / lower cylinder 47 and is provided so as to be movable in the vertical direction in FIG. The cutter blade 51 is attached to the slider 50 and is movably provided in the direction orthogonal to the paper surface in FIG.

  next. The sheet peeling method in the present embodiment will be described with reference to FIGS.

  First, as shown in FIG. 4, with the cutter blade 51 retracted upward, the peeling means 15 moves from the position of the two-dot chain line to the lower side of the cutter blade 51 indicated by the solid line, and is peeled together with the tape receiving plate 40. The lead end of the tape T is inserted. Thereafter, the pressing block 45 and the tape receiving plate 40 are retracted to a position indicated by a two-dot chain line by driving the cylinders 42 and 41. Thereby, the peeling sheet T is sandwiched between the driving roller 18 and the pinch roller 19. At this time, the guide means 13 stands by at a position approaching the outer peripheral side of the adhesive sheet S.

  When the peeling means 15 moves to the left in FIG. 4, the peeling tape T is pulled out from the support shaft 17, and the peeling means 15 reaches a position close to the guide means 13 (a two-dot chain line position in FIG. 4). The movement stops.

  In this state, the driving roller 18 is driven to rotate in the direction in which the peeling tape T is fed out, whereby the feeding of the peeling tape T is started and fed to the guide means 13 side. Since the guide means 13 is formed in an inclined shape in which the suction port 21 of the case 22 gradually approaches the adhesive sheet S, the peeling tape T is sent out toward the adhesive sheet S along the inclined direction. This feeding is performed by feeding by the driving roller 18 and the pinch roller 19 and guiding by the belt 26, and the peeling tape T can be smoothly fed. Then, the peeling tape T is fed out so as to enter between the heater head 34 and the adhesive sheet S by the blowing air of the posture maintaining means 16.

As shown in FIG. 1, when a sensor (not shown) detects that the lead end side has passed immediately below the bonding heater head 34 by feeding the peeling tape T, the drive roller 18 and the belt 26 are driven. While being stopped, the tape receiving plate 40 and the pressing block 45 are advanced, and the peeling tape T is pressed between the tape receiving plate 40 and the tape receiving plate 40.
In this state, the heater head 34 of the bonding means 14 is lowered to weld the vicinity of the lead end side portion of the peeling tape T to the adhesive sheet S, and after the welding is completed, the guide means 13 moves to the raised position ( (See FIG. 5). During welding by the heater head 34, the belt 26 is rotated in a direction opposite to the direction in which the peeling tape T is fed out to be biased, thereby reliably preventing the peeling tape T from being loosened. Adhesion of the tape T to an unintended part can be avoided.

  Next, as shown in FIG. 5, the guide unit 13 is retracted upward, and the auxiliary roller 60 moves to the end of the adhesive sheet S. Thereafter, the peeling means 15 starts to move to the left side, and the table 11 starts to move to the right side. At the same time, the driving roller 18 rotates the peeling tape T in the direction opposite to the feeding direction, thereby The peeling tape T and / or the adhesive sheet S act in the opposite direction so as to be sent out, and the peeling of the adhesive sheet S is started. Accordingly, the peeling tape T is only given a tensile force only at the initial peeling stage where the peeling force is light. When the drive roller 18 and the pinch roller 19 sandwich the adhesive sheet S, the adhesive sheet S is pulled thereafter. Will be.

  As shown in FIG. 6, when the peeling proceeds according to the relative movement amount of the peeling means 15 and the table 11, and the peeling of the adhesive sheet S is completely completed as shown in FIG. While the 39 cutter blades 51 are lowered and the cutter blades 51 are moved in the direction orthogonal to the paper surface, the peeling tape T adhered to the adhesive sheet S is cut upstream in the feeding direction.

  When the peeling tape T is cut, the peeling tape T is collected in a collection box (not shown) located below, and the wafer W is transferred to another process by a transfer means (not shown).

  Then, the peeling means 15 and the guide means 13 return to the positions shown in FIG. 4 and prepare for the next feeding operation. Thereafter, the peeling tape T is fed and welded, and the adhesive sheet S is peeled by the same cycle. Is repeated.

  Therefore, according to such an embodiment, the driving roller 18 and the pinch roller 19 constituting the feeding unit 12 function as the peeling unit 15 when the adhesive sheet S is peeled, and when the adhesive sheet S moves relative to the table 11, Since the peeling tape T and / or the adhesive sheet S is sent out by rotating in the direction opposite to the feeding direction of the tape T, the peeling sheet T is pulled only at the initial peeling stage where the peeling force is light. Therefore, the adhesive portion of the peeling tape T is not peeled off from the adhesive sheet S or the peeling tape T is not cut, and the adhesive sheet S can be peeled without causing a peeling failure.

As described above, the best configuration, method, and the like for carrying out the present invention have been disclosed in the above description, but the present invention is not limited to this.
In other words, the present invention has been illustrated and described mainly with respect to specific embodiments, but without departing from the scope of the technical idea and object of the present invention, the shape, position, or With respect to the arrangement and the like, those skilled in the art can make various changes as necessary.

  For example, although the heat-sensitive adhesive tape is used as the peeling tape T, a pressure-sensitive adhesive tape may be used. In this case, the adhesive means 14 does not need to be provided with the heater 35, and may be any one that presses the adhesive tape against the adhesive sheet S.

  In the above-described embodiment, the peeling unit 15 includes the drive roller 18 and the pinch roller 19 constituting a pair of rollers. However, the number of pairs of rollers can be further increased.

  In addition to the auxiliary roller 60, the peeling assisting unit may use a plate-like or piece-like blade.

  Furthermore, the adherend is not limited to the semiconductor wafer W, and other adherends such as a glass plate, a steel plate, or a resin plate can also be targeted. The semiconductor wafer can be a silicon wafer or a compound wafer. It may be.

The schematic front view which shows the whole structure of the sheet peeling apparatus which concerns on this embodiment. The principal part enlarged front view of FIG. The enlarged bottom view of a guide means. The schematic front view which shows the initial stage which draw | feeds out the tape for peeling. The schematic front view which shows the state immediately before peeling of an adhesive sheet is started. The schematic front view which shows the middle of peeling of an adhesive sheet. The schematic front view which shows the state by which peeling of an adhesive sheet is completed and the tape for peeling is cut | disconnected.

Explanation of symbols

10 Sheet peeling device 11 Table (support means)
12 Feeding means 14 Adhesive means 15 Peeling means 39 Tape cutting means 60 Auxiliary roller (peeling aid means)
S Adhesive sheet T Stripping tape W Semiconductor wafer (Substrate)

Claims (6)

A support means for the adherend to which the adhesive sheet is affixed; a feeding means for feeding the peeling tape onto the adhesive sheet; and an adhesive means for bonding the peeling tape to the adhesive sheet, the feeding means and the supporting means. In a sheet peeling apparatus that peels the adhesive sheet through the peeling tape by relative movement with
The feeding means includes a peeling means that includes at least a pair of rollers that sandwich the peeling tape and that can be rotated in a feeding direction for feeding the peeling tape and a direction opposite to the feeding direction. Sometimes, the roller is rotated in a direction opposite to the feeding direction, so that the peeling tape and / or the adhesive sheet is sent out and the adhesive sheet is peeled off.   The sheet peeling apparatus according to claim 1, further comprising a peeling assisting means for maintaining a peeling angle when peeling the adhesive sheet constant.   It further includes a tape cutting means for cutting the peeling tape on the upstream side in the feeding direction of the peeling tape bonded to the adhesive sheet, and an adhesive sheet peeled from the adherend and a peeling tape adhered to the adhesive sheet The sheet peeling apparatus according to claim 1 or 2, wherein the sheet peeling apparatus is disposed so as to be disposable. A table for feeding the peeling tape onto the adhesive sheet affixed to the adherend via the feeding means, and adhering the peeling tape to the adhesive sheet via the bonding means, and then supporting the feeding means and the adherend In the sheet peeling method of peeling the adhesive sheet by relatively moving and,
In a state where the feeding means sandwiches the peeling tape and feeds it to the adhesive sheet side, the peeling tape is bonded to the adhesive sheet, and then the feeding means is driven in a direction opposite to the direction in which the peeling tape is fed. A sheet peeling method, wherein the adhesive sheet is peeled by moving relative to a support means.   The sheet peeling method according to claim 4, wherein a peeling assisting means is positioned at a position along the adhesive sheet to peel the adhesive sheet while keeping a peeling angle constant.   When the adhesive sheet is peeled from the adherend, the upstream side in the feeding direction of the peeling tape that adheres to the adhesive sheet is cut, and the adhesive sheet and the peeling tape that adheres thereto are discarded. The sheet peeling method according to claim 4 or 5.

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