JP2009192678A - Optical waveguide and optical apparatus - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an optical waveguide and an optical apparatus in which the optical waveguide can be arranged close to an optical element without interfering with an optical element or electric wiring thereto. <P>SOLUTION: An optical module 100 includes a substrate 1, a light emitting element 2 mounted on the substrate 1, light receiving element 3 mounted on the substrate 1 adjacently to the light emitting element 2, a submount 4 loaded near the end of the substrate 1, an optical waveguide 5 that is arranged so as to go through the upper face of the submount 4 from the light emitting face of the light emitting element 2 and the light receiving face of the light receiving element 3 and that is equipped with omission parts 54A, 54B in which a part of a region on a separate line parallel with a core line in a prescribed direction is missing from conversion faces 53a, 53b, and a plurality of bonding wires 6 that connect the light emitting and receiving elements 2, 3 with electrode pads 11A, 11B on the substrate 1 respectively. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an optical waveguide and an optical device.

  Conventionally, an optical module including an optical waveguide film in which an optical waveguide core that propagates an optical signal is formed in an optical waveguide cladding layer having a refractive index smaller than that of the optical waveguide core is known (for example, see Patent Document 1). .)

The optical module includes a substrate, an optical device mounted on the substrate, and an optical waveguide film having an oblique surface with an angle of 45 degrees, and the propagation light of the optical waveguide core in which the optical device is reflected by the oblique surface. The optical signal emitted from the optical device is reflected at an oblique surface and fixed to a position where it propagates to the optical waveguide core.
JP 2000-214351 A

  An object of the present invention is to provide an optical waveguide and an optical device that can be disposed close to an optical element without interfering with the optical element or electrical wiring to the optical element.

  One embodiment of the present invention provides the following optical waveguide and optical device in order to achieve the above object.

[1] A plate-shaped light guide plate having a core that propagates light in a predetermined direction and a clad that covers the core, and an optical path of input light from outside the light guide plate is input in the predetermined direction in the core. Or an inclined surface formed to include an optical path conversion surface that converts an optical path of light propagating in the core so as to be output to the outside of the light guide plate, and the optical path conversion surface of the light guide plate from the optical path conversion surface An optical waveguide comprising a missing portion in which a part of a region on another line parallel to a core line in a predetermined direction is missing.

[2] The light guide according to [1], wherein the inclined surface is provided at an end portion of the light guide plate, and the missing portion is formed on the inclined surface.

[3] The light guide plate includes a plurality of independent cores, and the inclined surface includes a plurality of optical path conversion surfaces provided for each of the plurality of cores and arranged in a row, and the missing portion. Is the plurality of missing portions in a part of a region on another line parallel to the core line in the predetermined direction from the plurality of optical path conversion surfaces.

[4] The light guide according to [1], wherein the inclined surface is provided at an end portion of the light guide plate, and the missing portion is formed by removing a tip portion of the inclined surface.

[5] The light guide plate includes a plurality of independent cores, and the inclined surface includes a plurality of the optical path conversion surfaces provided for each of the plurality of cores and arranged in a row. The optical waveguide according to [1], wherein the portion is formed by removing a tip portion of the inclined surface.

[6] The light guide plate includes a plurality of independent cores, and the inclined surfaces are provided for each of the cores. A plurality of the optical path conversion surfaces are provided in the light guide plate. The light guide according to [1], which is a plurality of through holes in a part of a region on another line parallel to the core line in the predetermined direction.

[7] A plate-shaped light guide plate having at least one optical element that emits or receives light, a substrate on which the optical element is mounted, a core that propagates light in a predetermined direction, and a clad that covers the core, An optical path conversion surface for converting an optical path of input light from outside the light guide plate so as to be input in the predetermined direction in the core or to output an optical path of light propagating in the core to the optical element. And an optical waveguide having a missing portion in which a part of a region on another line parallel to the core line in the predetermined direction is missing from the optical path conversion surface of the light guide plate. Light device.

[8] The optical element includes a wiring portion connected to the substrate, and a light emitting portion that emits light or a light receiving portion that receives light, and the optical waveguide has an optical path conversion surface at the light emitting portion or the light receiving portion. The optical device according to [7], wherein the optical device is arranged correspondingly and the missing portion is arranged corresponding to the wiring portion.

  According to the optical waveguide of the first aspect, the optical waveguide can be disposed close to the optical element without interfering with the optical element or the electric wiring to the optical element.

  According to the optical waveguide of the second aspect, it is possible to easily manufacture the inclined surface and the missing book as compared with the case where the present configuration is not provided.

  According to the optical waveguide of the third aspect, the optical waveguide can be disposed close to the plurality of optical elements without interfering with the plurality of optical elements or the electric wiring to the optical elements.

  According to the optical waveguide of the fourth aspect, the inclined surface and the missing portion can be easily manufactured as compared with the case where the present configuration is not provided.

  According to the optical waveguide of the fifth aspect, the optical waveguide can be disposed close to the plurality of optical elements without interfering with the plurality of optical elements or the electric wiring to the optical elements.

  According to the optical waveguide of the sixth aspect, the inclined surface and the missing part can be freely arranged as compared with the case where the present configuration is not provided.

  According to the optical device of the seventh aspect, the optical waveguide can be disposed close to the optical element without interfering with the optical element or the electric wiring to the optical element.

  According to the optical device of the eighth aspect, it is possible to use a small-sized optical element by making the missing part correspond to the wiring part of the optical element as compared with the case where this configuration is not provided.

[First Embodiment]
1 is a plan view of the optical module according to the first embodiment of the present invention, FIG. 2A is a cross-sectional view taken along line AA of FIG. 1, and FIG. 2B is a cross-sectional view of FIG. It is B line sectional drawing.

(Configuration of optical module)
The optical module 100 is mounted on the substrate 1, the light emitting device 2 mounted on the substrate 1, the light receiving device 3 mounted on the substrate 1 adjacent to the light emitting device 2, and near the end on the substrate 1. The submount 4, the optical waveguide 5 disposed so as to pass through the upper surface of the submount 4 from the light emitting surface of the light emitting element 2 and the light receiving surface of the light receiving element 3, the light emitting element 2, the light receiving element 3, and the substrate 1. A plurality of bonding wires 6 for connecting the upper electrode pads 11A and 11B to each other are provided. The light emitting element 2 and the light receiving element 3 constitute an optical element.

(Light emitting element)
FIG. 3A is a plan view illustrating an example of the light emitting element. As the light emitting element 2, a surface type optical element such as a surface type light emitting diode or a surface type laser can be used. As an example, a VCSEL (surface emitting laser) is used in the present embodiment. This VCSEL has, for example, an n-type lower reflector layer, an active layer, a current confinement layer, a p-type upper reflector layer, a p-type contact layer, a p-side electrode (on an n-type GaAs substrate having an n-side electrode on the back surface ( The n-side electrode is provided with a light emitting portion 2a having a layer structure in which the n-side electrode is provided on the opposite surface.

  The light emitting element 2 includes the above-described light emitting portion 2a on the upper surface, a p-side electrode 20 provided in an annular shape around the light emitting portion 2a, a wiring pattern 21 connected to the p-side electrode 20, and a wiring pattern 21. In addition to being connected, an electrode pad (wiring part) 22 to which the bonding wire 6 is connected is provided.

  Moreover, the light emitting element 2 has a rectangular outer shape, and, for example, one side thereof is 200 to 300 μm. The light emitting portion 2a is a circle having a diameter of 100 μm, and the electrode pad 22 is a circle having a diameter of 80 μm.

(Light receiving element)
FIG. 3B is a plan view showing an example of the light receiving element. As the light receiving element 3, for example, a surface type optical element such as a surface type photodiode can be used. As an example, in this embodiment, a GaAs PIN photodiode excellent in high-speed response is used. For example, the light receiving element 3 includes a P-layer, an I-layer, and an N-layer that are PIN-bonded on a GaAs substrate, a p-side electrode that is connected to the P layer, and an n-side electrode that is formed on the N layer. It has a layered structure.

  The light receiving element 3 is connected to the light receiving part 3a on its upper surface, the p-side electrode 30 provided so as to surround the light receiving part 3a, the wiring pattern 31 connected to the p-side electrode 30, and the wiring pattern 31. And an electrode pad (wiring part) 32 to which the bonding wire 6 is connected. In the light receiving element 3 illustrated in FIG. 3B, the n-side electrode is provided on the lower surface, but may be provided on the upper surface.

  Similarly to the light emitting element 2, the light receiving element 3 has a rectangular outer shape. For example, one side thereof is 200 to 300 μm, and the electrode pad 32 is a circle having a diameter of 100 μm.

(Submount)
The submount 4 is made of, for example, a crystal substrate such as Si or a glass substrate such as quartz glass.

(Bonding wire)
The bonding wire 6 includes a ball portion 60 formed when bonded to the electrode pads 22 and 32, and a loop portion 61 that connects the electrode pads 22 and 32 and the electrode pads 11A and 11B on the substrate 1 in an arc shape. Consists of.

(Optical waveguide)
The optical waveguide 5 has a plate-like shape, covers two cores 51A and 51B that propagate light in a predetermined direction, and covers the periphery of the cores 51A and 51B, and a clad 52 that has a smaller refractive index than the cores 51A and 51B. It consists of and.

  In the example of FIG. 2B, the cores 51A and 51B propagate light independently in the horizontal direction, and have, for example, a rectangular cross section of 50 × 50 μm. The number of cores included in the optical waveguide 5 may be one or three or more.

  The thickness of the clad 52 is, for example, 20 μm to 100 μm on the upper side and the lower side of the cores 51A and 51B in FIG.

  In the optical waveguide 5, end portions on the light emitting element 2 and light receiving element 3 side are cut at 45 °, and an inclined surface 53 is formed. A vertical end face 50 is formed at the other end of the optical waveguide 5, and an optical fiber (not shown) or the like is connected to the end face 50. The inclined surface 53 is not limited to a flat surface, and may be an arcuate curved surface.

  The inclined surface 53 is formed to include conversion surfaces 53a and 53b that convert the optical paths of light propagating through the cores 51A and 51B to the outside of the light guide plate, respectively. Also, the conversion surfaces 53a and 53b are arranged in a line on the inclined surface 53 corresponding to the positions of the cores 51A and 51B, respectively, and the optical axis center that is the center of the light emitted or received by the light emitting unit 2a and the light receiving unit 3a It is formed corresponding to O.

  In the inclined surface 53 formed in the optical waveguide 5, a plurality of core parallel regions 57A and 57B on different lines parallel to the lines of the cores 51A and 51B in a predetermined direction from the conversion surfaces 53a and 53b are missing. Missing portions 54A and 54B are formed. In the example shown in FIG. 1, when viewed from the direction in which the conversion surfaces 53a and 53b appear to overlap (the vertical direction in the plane in FIG. 1), at least some of the missing portions 54A and 54B are in contact with the conversion surfaces 53a and 53b. Missing portions 54A and 54B are formed at overlapping positions.

  Further, the missing portions 54A and 54B interfere with the bonding wires 6 connected to the electrode pads 22 and 32 of the light emitting element 2 and the light receiving element 3 on the inclined surface 53 facing the ball part 60 to the loop part 61, respectively. It is formed in a position to avoid. The shape of the missing portions 54A and 54B is not limited to the example of FIG. 1 as long as it is a concave shape that avoids interference with the bonding wire 6.

  The distance between the missing portions 54A and 54B and the bonding wire 6 is preferably 10 μm or more, for example, considering the bonding accuracy of the device for bonding the bonding wire 6.

  The optical waveguide 5 can be manufactured by a method using photolithography or RIE (reactive ion etching), for example. In particular, it can be efficiently produced by a production process using a mold described in Japanese Patent Application Laid-Open No. 2004-29507 already proposed by the present applicant. The manufacturing process will be described below.

(Optical waveguide manufacturing method)
First, a master on which convex portions corresponding to the cores 51A and 51B are formed is produced using, for example, a photolithography method. Next, a curable resin having a viscosity of, for example, about 500 to 7000 mPa · s and having light transmittance in the ultraviolet region and the visible region, for example, a methylsiloxane group in the molecule, A layer of a curable organopolysiloxane containing an ethylsiloxane group and a phenylsiloxane group is provided by coating or the like, and then cured to form a cured layer. Next, the hardened layer is peeled off from the master and a mold having a concave portion corresponding to the convex portion is produced.

  Next, on the manufactured mold, a film base for cladding made of a resin having excellent adhesion to the mold, for example, an alicyclic acrylic resin film, an alicyclic olefin resin film, a cellulose triacetate film, a fluororesin film, or the like. Adhere the material.

  Next, the concave portion of the mold is filled with, for example, an ultraviolet curable or thermosetting monomer, an oligomer or a mixture of a monomer and an oligomer, an epoxy type, a polyimide type, an acrylic type ultraviolet curable resin, or the like. . Next, the curable resin in the recess is cured to form the cores 51A and 51B, and then the mold is peeled off. As a result, the cores 51A and 51B are left on the clad film substrate.

  Next, the clad 52 is provided so as to cover the cores 51A and 51B on the surface side where the cores 51A and 51B of the film base for clad are formed. Examples of the clad 52 include a film, a layer obtained by applying and curing a clad curable resin, and a polymer film formed by applying a solvent solution of a polymer material and drying.

  Next, the surface where the cores 51A and 51B of the optical waveguide are exposed is cut by a dicer at an angle of 45 ° to form the inclined surface 53, and the other end is cut vertically to form the end surface 50.

  Then, laser processing is performed on a predetermined position of the inclined surface 53 to form the missing portions 54A and 54B. The optical waveguide 5 can be manufactured by the above method.

(Assembly method of optical module)
Next, a method for assembling the optical module 100 will be described with reference to FIGS.

  First, the submount 4 is fixed on the substrate 1 with an adhesive or the like. Next, the light emitting element 2 and the light receiving element 3 are fixed to a predetermined position on the substrate 1 with an adhesive or the like with the light receiving part 2a and the light emitting part 3a facing upward.

  Next, the electrode pads 22 and 32 and the electrode pads 11A and 11B on the substrate 1 are connected by the bonding wire 6.

  Then, the optical waveguide 5 in which the missing portions 54A and 54B are formed is prepared, and the optical waveguide 5 is positioned at a predetermined position with respect to the substrate 1 and fixed with an adhesive or the like. The predetermined position means that interference between the bonding wire 6 and the optical waveguide 5 is avoided by the missing portions 54A and 54B, and the cores 51A and 51A are placed on the optical axis centers of the light emitting portion 2a of the light emitting element 2 and the light receiving portion 3a of the light receiving element 3. The conversion surfaces 53a and 53b respectively corresponding to 51B are arranged, and the center portion of the optical waveguide 5 is placed on the submount 4. The optical module 100 can be assembled as described above.

(Operation of optical module)
Next, the operation of the optical module 100 will be described. When a predetermined current is passed between the electrode pad 11A on the substrate 1 and an n-side electrode pattern or electrode pad (not shown), the light emitting unit 2a emits a laser beam having a wavelength of 850 nm, for example. Enters the conversion surface 53 a of the optical waveguide 5, is reflected by the conversion surface 53 a in the horizontal direction on the right side of FIG. 2B, propagates in the core 51 A of the optical waveguide 5, and exits from the end surface 50. Laser light emitted from the end face 50 of the optical waveguide 5 enters an optical fiber core (not shown), propagates through the core, and is emitted to the optical fiber or the like.

  On the other hand, when the signal light enters the core 51B from the end face 50 of the optical waveguide 5 through the optical fiber, the signal light propagates in the core 51B toward the conversion surface 53b. The signal light that has reached the conversion surface 53 b is reflected downward by the conversion surface 53 b as shown in FIG. 2B and enters the light receiving portion 3 a of the light receiving element 3. The light receiving element 3 generates an output current corresponding to the amount of incident received light. A received signal is obtained by converting the output current into a voltage value.

[Second Embodiment]
4 is a plan view of an optical module according to the second embodiment of the present invention, FIG. 5A is a cross-sectional view taken along the line CC of FIG. 4, and FIG. 5B is a cross-sectional view of FIG. It is D line sectional drawing.

  The optical waveguide 5 of the first embodiment has the missing portions 54A and 54B on the inclined surface 53, whereas the optical waveguide 5 of the present embodiment cuts the tip portion of the inclined surface 53 substantially vertically. Thus, the cut surface 55 is formed, and other configurations are the same as those of the first embodiment.

  The cut surface 55 can be formed by forming the inclined surface 53 in the same manner as in the first embodiment and then vertically cutting the tip of the inclined surface 53 by laser processing, dicing processing or the like.

  The cutting surface 55 is formed at the tip of the inclined surface 53 facing the ball portion 60 to the loop portion 61, and is separated from the conversion surfaces 53a and 53b in parallel to the lines of the cores 51A and 51B in a predetermined direction. This is a missing portion in which a part of the core parallel regions 57A and 57B on the line is missing.

  According to the present embodiment, the tip portion of the inclined surface 53 facing the ball portion 60 to the loop portion 61 is removed, so that interference between the inclined surface 53 and the ball portion 60 to the loop portion 61 is avoided. Thus, the optical waveguide 5 can be disposed with respect to the light emitting element 2 and the light receiving element 3.

[Third Embodiment]
6 is a plan view of an optical module according to a third embodiment of the present invention, FIG. 7A is a cross-sectional view taken along line EE of FIG. 6, and FIG. It is F line sectional drawing.

  In the optical waveguide 5 of the first embodiment, the conversion surfaces 53a and 53b and the missing portions 54A and 54B are formed on the inclined surface 53 provided at the end portion, whereas the optical waveguide 5 of the present embodiment. Are the openings for avoiding interference between the openings 55A and 55B for the light emitting element 2 and the light receiving element 3 and the bonding wire 6 at positions corresponding to the conversion surfaces 53a and 53b and the missing parts 54A and 54B. 56A and 56B are provided. Other configurations are the same as those of the first embodiment.

  The openings 55A and 55B for the light emitting element 2 and the light receiving element 3 are through holes from the upper surface 50c to the lower surface 50d, and are formed at positions corresponding to the light emitting element 2 and the light receiving element 3 for each of the cores 51A and 51B. In addition, inclined surfaces 53A and 53B, which are cut to 45 ° as in the first embodiment by laser processing, for example, are formed on one of the side surfaces of the openings 55A and 55B.

  The interference avoidance openings 56A and 56B are through holes from the upper surface 50c to the lower surface 50d, and the core parallel regions 57A on different lines parallel to the lines of the cores 51A and 51B in a predetermined direction from the conversion surfaces 53a and 53b. , 57B.

  The positions where the openings 56A and 56B are provided are positions that avoid interference with the loop portion 61 formed when the electrode pads 22 and 32 are connected to the electrode pads 11A and 11B.

  Note that the shapes of the openings 56A and 56B are not limited to the rectangle illustrated in FIG. 6, but may be circular or not particularly limited. In the present embodiment, the openings 55A and 55B are formed with the inclined surfaces 53A and 53B as through holes, but the inclined surfaces 53A and 53B are formed at positions corresponding to the light emitting unit 2a or the light receiving unit 3a. For example, a groove may be formed, and the inclined surfaces 53A and 53B may be formed on the side surfaces of the groove. Further, the openings 55A and 55B and the openings 56A and 56B are formed as separate through holes. However, the opening 55A and the opening 56A may be connected as one opening, or the openings 55A and 55B. And four openings 56A and 56B may be connected as one opening.

[Fourth Embodiment]
FIG. 8 is a plan view of an optical module according to the fourth embodiment of the present invention. The optical module 100 of the present embodiment is different from the third embodiment in that the number of the light emitting elements 2A and 2B and the light receiving elements 3A and 3B mounted on the substrate 1 is changed to two, and the light emitting elements 2A and 2B and the light receiving elements 3A and 3B are arranged on the substrate 1 in an oblique direction with respect to the direction of the core 51, and the other configurations are the same as those of the first embodiment.

  The arrangement of the light emitting elements 2A and 2B and the light receiving elements 3A and 3B is not limited to the oblique direction, and can be arranged at an arbitrary position. For example, the light emitting elements 2A and 2B and the light receiving elements 3A and 3B May be.

[Fifth Embodiment]
FIG. 9 is a plan view of an optical module according to the fifth embodiment of the present invention. In the third embodiment, the optical module 100 according to the present embodiment is obtained by mounting the light emitting element 2 and the light receiving element 3 on the substrate 1 at an angle of 45 degrees, for example. This is the same as in the third embodiment.

  The light-emitting element 2 and the light-receiving element 3 of the third embodiment are the same as those of the first embodiment. As illustrated in FIGS. 3A and 3B, the light-emitting element 2 and the light-receiving element 3 Whereas the light emitting part 2a or the light receiving part 3a and the electrode pads 22 and 32 are formed, the light emitting element 2 and the light receiving element 3 of the present embodiment have a light emitting part 2a and a light receiving part 3a in the direction of a square. Electrode pads 22 and 32 are formed side by side.

  Therefore, although the light emitting element 2 and the light receiving element 3 are mounted to be inclined with respect to the substrate 1, the positional relationship between the light emitting part 2 a and the light receiving part 3 a with respect to the optical waveguide 5 and the electrode pads 22 and 32 is the third This is the same as the embodiment.

[Sixth Embodiment]
FIG. 10A is a cross-sectional view showing an optical transceiver according to the sixth embodiment of the present invention, and FIG. 10B is a cross-sectional view taken along the line GG of FIG. The optical transmission / reception device 200 includes a box-shaped housing 7 and an optical module 100 housed in the housing 7.

  The optical module 100 according to the present embodiment further includes a drive circuit 12 that modulates the light emitting element 2 to emit light on the substrate 1 and an amplifier circuit (not shown) that amplifies the electrical signal photoelectrically converted by the light receiving element 3. Except for this point, the other configurations are the same as those of the optical module of the first embodiment. In addition, you may comprise the optical transmission / reception apparatus 200 by the optical module of 2nd-5th embodiment.

  The housing 7 supports the substrate 1 included in the optical module 100, and has a pair of guide holes 70a for positioning when the optical waveguide 5 is incorporated and connected to other ferrules (not shown) on both sides thereof. The ferrule 70 is provided. As the ferrule 70, for example, an MT (Mechanically Transferable) ferrule can be used.

  The optical transmission / reception apparatus 200 having the above configuration is connected to an optical fiber or the like via the ferrule 70 and transmits the laser light emitted from the light emitting element 2 and receives the signal light by the light receiving element 3.

[Other embodiments]
The present invention is not limited to the above-described embodiments, and various modifications can be made without departing from the scope of the invention. For example, the combination of the components between the embodiments can be arbitrarily performed. The present invention is not limited to an optical module, and can be applied to an optical device including an optical coupling structure of an optical waveguide and a light emitting element or a light receiving element.

FIG. 1 is a plan view of an optical module according to the first embodiment of the present invention. 2A is a cross-sectional view taken along the line AA in FIG. 1, and FIG. 2B is a cross-sectional view taken along the line BB in FIG. FIG. 3A is a plan view showing the configuration of the light emitting element, and FIG. 3B is a plan view showing the configuration of the light receiving element. FIG. 4 is a plan view of an optical module according to the second embodiment of the present invention. 5A is a cross-sectional view taken along line CC in FIG. 4, and FIG. 5B is a cross-sectional view taken along line DD in FIG. FIG. 6 is a plan view of an optical module according to the third embodiment of the present invention. 7A is a cross-sectional view taken along line EE in FIG. 6, and FIG. 7B is a cross-sectional view taken along line FF in FIG. FIG. 8 is a plan view of an optical module according to the fourth embodiment of the present invention. FIG. 9 is a plan view of an optical module according to the fifth embodiment of the present invention. FIG. 10A is a cross-sectional view of an optical transceiver according to the sixth embodiment of the present invention, and FIG. 10B is a right side view of FIG.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 ... Board | substrate, 2A, 2B ... Light emitting element, 2a ... Light emitting part, 3, 3A, 3B ... Light receiving element, 3a ... Light receiving part, 4 ... Submount, 5 ... Optical waveguide, 6 ... Bonding wire, 7 ... Housing 11A ... electrode pad, 11A, 11B ... electrode pad, 12 ... drive circuit, 20 ... p-side electrode, 21 ... wiring pattern, 22 ... electrode pad, 30 ... p-side electrode, 31 ... wiring pattern, 32 ... electrode pad 50, 50a, 50b ... end face, 50c ... upper surface, 50d ... lower surface, 51A-51D ... core, 52 ... clad, 53, 53A-53D ... inclined surface, 53a-53d ... conversion surface, 54A, 54B ... missing part, 55 ... cut surface, 55A to 55D, 56A to 56D ... opening, 57A to 57D ... core parallel region, 60 ... ball part, 61 ... loop part, 70 ... ferrule, 70a ... guide hole, 100 ... light Joule, 200 ... optical transmitting and receiving device

Claims (8)

A plate-shaped light guide plate having a core that propagates light in a predetermined direction and a clad that covers the core;
An optical path conversion surface that converts an optical path of input light from outside the light guide plate in the predetermined direction in the core or outputs an optical path of light propagating in the core to output out of the light guide plate An inclined surface formed to include
An optical waveguide comprising: a missing portion in which a part of a region on another line parallel to the core line in the predetermined direction is missing from the optical path conversion surface of the light guide plate. The inclined surface is provided at an end of the light guide plate,
The light guide path according to claim 1, wherein the missing portion is formed on the inclined surface. The light guide plate has a plurality of independent cores,
The inclined surface has a plurality of optical path conversion surfaces provided for each of the plurality of cores and arranged in a row,
2. The light guide path according to claim 1, wherein the missing portions are a plurality of the missing portions in a part of a region on another line parallel to the core line in the predetermined direction from the plurality of optical path conversion surfaces. The inclined surface is provided at an end of the light guide plate,
The light guide path according to claim 1, wherein the missing portion is formed by removing a tip portion of the inclined surface. The light guide plate has a plurality of independent cores,
The inclined surface is provided for each of the plurality of cores, and has a plurality of the optical path conversion surfaces arranged in a row,
The light guide path according to claim 1, wherein the missing portion is formed by removing a tip portion of the inclined surface. The light guide plate has a plurality of independent cores,
A plurality of the inclined surfaces are provided for each core,
2. The light guide according to claim 1, wherein the missing portion is a plurality of through holes in a part of a region on another line parallel to the core line in the predetermined direction from the plurality of optical path conversion surfaces of the light guide plate. Light path. At least one optical element that emits or receives light;
A substrate on which the optical element is mounted;
A plate-shaped light guide plate having a core that propagates light in a predetermined direction and a clad that covers the core, so that an optical path of input light from outside the light guide plate is input in the predetermined direction in the core, or An inclined surface formed to include an optical path conversion surface that converts an optical path of light propagating in the core so as to be output to the optical element, and a core in the predetermined direction from the optical path conversion surface of the light guide plate And an optical waveguide having a missing part in which a part of a region on another line parallel to the line is missing. The optical element includes a wiring part connected to the substrate, and a light emitting part for emitting light or a light receiving part for receiving light.
The optical device according to claim 7, wherein the optical waveguide has the optical path conversion surface arranged corresponding to the light emitting part or the light receiving part, and the missing part arranged corresponding to the wiring part.

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