JP2007178950A - Optical wiring board and optical wiring module - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an optical wiring board and an optical wiring module capable of mounting optical semiconductor elements at high density with a simple configuration.
An optical waveguide member 2 constituting an optical wiring module 1 has a plurality of optical waveguides 40 for guiding light to different positions, and each optical waveguide 40 has a reflection film 14 for optical path conversion. Each reflective film 14 is provided with a distance from each other in the cross direction M and the optical path direction L with respect to the adjacent reflective film 14, so that the distance between the reflective films 14 is the distance along the cross direction M and the optical path direction L. Even in the case where a plurality of optical semiconductor elements 3 mounted on the optical wiring board 2A in order to use each reflection film 14 are arranged in the longitudinal direction X and the width direction Y, the optical path direction L Since the arrangement directions are different from each other, each optical waveguide 40 can be effectively used in the region of the surface portion on which the optical wiring board 2A can be mounted without overlapping, and the optical semiconductor elements 3 are arranged closely, Miniaturization of optical wiring board 2A Can do.
[Selection] Figure 1

Description

  The present invention relates to an optical wiring board and an optical wiring module, for example, to a technique capable of applying electrical wiring or a part thereof to optical wiring.

  The amount of information handled by companies and homes has become enormous, and it is becoming an amount that cannot be delivered by electrical signals. That is, in order to transmit and receive high-speed signals (high-frequency digital signals) electrically, pre-emphasis and equalizing techniques are required, and a circuit for this purpose must be added. This circuit increases power consumption, increases heat generation of the silicon chip, and enormously increases the cooling system. In order to solve such problems, a technique using an optical signal suitable for distributing a large amount of information has been disclosed. A technique using an optical signal for communication between devices, and a silicon chip such as a backplane and a board. Various techniques using light have been disclosed.

  In order to allow the optical signal to reach the vicinity of the silicon chip, it is necessary to guide the light guided through the optical waveguide in the substrate on which the silicon chip is mounted to the light receiving element provided in the silicon chip. Therefore, it is necessary to increase the alignment accuracy between the light emitting element or the light receiving element provided on the silicon chip and the optical waveguide in the substrate on which the silicon chip is mounted. As a technique for easily aligning with high accuracy, a technique is disclosed in which a concave portion is formed at a predetermined position of a substrate and a light emitting element or the like is mounted in the concave portion to facilitate positioning of the light emitting element ( For example, see Patent Document 1).

Japanese Patent Application Laid-Open No. 2005-265885

A technology for mounting a plurality of optical semiconductor elements on an optical wiring board and reducing the size as a whole is underway. However, in the conventional technique, a plurality of optical semiconductor elements, particularly a surface emitting semiconductor laser (Vertical
When mounting a Cavity Surface-Emitting Laser (abbreviated as VCSEL) at high density, the VCSEL emits laser light in the thickness direction of the optical wiring board. If laser light is guided in the same layer perpendicular to the direction, the optical waveguides may overlap. As a technique for preventing the overlap of optical waveguides, a technique of forming an optical wiring board with a plurality of layers and separating light guided by each layer may be considered, but the configuration of the optical wiring board becomes complicated and the manufacturing cost is high. There is a problem.

  Accordingly, an object of the present invention is to provide an optical wiring board and an optical wiring module capable of mounting optical semiconductor elements at high density with a simple configuration.

The present invention is an optical wiring board comprising a support substrate and an optical waveguide member fixed to the support substrate,
The optical waveguide member is
A cladding layer;
A core layer laminated on one surface of the clad layer, the core layer including a plurality of optical waveguides for guiding light to different positions;
Each optical waveguide has an optical path conversion unit for converting an optical path,
Each optical waveguide extends in a predetermined optical path direction along one surface portion of the cladding layer, and is provided at intervals in a crossing direction intersecting the optical path direction.
At least the optical path conversion units adjacent to each other in the intersecting direction are provided at intervals in the optical path direction.

  In the invention, it is preferable that the optical path conversion unit is a reflection unit that is formed at an end of the optical waveguide and reflects light.

  Further, the present invention is characterized in that the reflecting means has a function of reflecting light emitted from a light emitting portion provided in the optical semiconductor element.

  Furthermore, the present invention is characterized in that the reflecting means is formed in a convex curved shape that protrudes in a direction opposite to the traveling direction in which the light emitted from the light emitting portion is reflected.

  Furthermore, the present invention is characterized in that the reflecting means is formed to be inclined with respect to one surface portion of the clad layer, and the inclination angle is specified to be not less than 41 degrees and not more than 49 degrees.

Furthermore, the present invention is characterized in that the clad layer includes condensing means for condensing light incident on the light path conversion unit or light emitted from the light path conversion unit at a position where the light path conversion unit faces the clad layer.
Furthermore, the invention is characterized in that the light collecting means is formed integrally with the cladding layer.

Furthermore, the present invention is an optical wiring module having a plurality of optical semiconductor elements electrically and mechanically connected to the optical wiring board,
The light emitting section or the light receiving section provided in each optical semiconductor element is an optical wiring module characterized by being provided facing each optical path conversion section.

  Furthermore, the present invention is characterized in that the light emitting portion or the light receiving portion provided in each optical semiconductor element and the other surface portion of the cladding layer are held in a non-contact state.

  Furthermore, the invention is characterized in that a sealing member made of a non-light-transmitting resin is provided in a gap between each optical semiconductor element excluding the light emitting part and the light receiving part and the optical wiring board.

  Furthermore, the present invention is characterized in that the sealing member surrounds each optical semiconductor element along its outer periphery.

  Further, according to the present invention, the sealing member mechanically connects each optical semiconductor element and the optical wiring board.

  Furthermore, the present invention is characterized in that a light transmissive member made of a light transmissive resin is provided at least between the light emitting part or light receiving part of each of the optical semiconductor elements and the optical path changing part.

  Furthermore, the present invention is characterized in that the translucent member mechanically connects each optical semiconductor element and the optical wiring board.

  According to the present invention, the optical waveguide member has a cladding layer and a core layer. Among these, the core layer has a plurality of optical waveguides that are stacked on one surface of the cladding layer and guide light to different positions. Each optical waveguide has an optical path conversion part for optical path conversion, and is provided along one surface portion of the cladding layer in the optical path direction and spaced in the crossing direction. The optical path conversion units adjacent to each other in the cross direction are provided to be spaced from each other in the optical path direction. As a result, each optical path conversion unit is provided with an interval between the adjacent optical path conversion unit and the cross direction and the optical path direction, so that the distance between each optical path conversion unit is larger than the distance along the cross direction and the optical path direction. can do. Therefore, in a virtual plane including the optical path direction and the intersecting direction, when a plurality of optical components mounted on the optical circuit board are arranged in order to use each optical path conversion unit in a direction intersecting the optical path direction and the intersecting direction. Even in such a case, since the optical path direction and the direction in which the optical components are arranged are different, the optical waveguide can be used effectively without using the overlapping optical waveguides. Therefore, the optical components can be arranged densely, and the optical wiring board can be miniaturized.

  Further, according to the present invention, the reflection means for reflecting light is formed at the end of the optical waveguide, and an optical path conversion section that can change the optical path by the reflection means can be realized.

  Furthermore, according to this invention, the light emitted from a light emission part can be reflected by a reflection means.

  Furthermore, according to the present invention, the reflecting means is formed in a convex curved shape that protrudes in a direction opposite to the traveling direction in which the light emitted from the light emitting portion is reflected, so that the reflecting means is formed in a flat shape. Compared with this, the light condensing characteristic can be improved. Therefore, the optical path conversion can be realized without increasing the positioning accuracy of the reflecting means with respect to the light emitting unit as compared with the conventional technique. Therefore, the manufacturing of the optical wiring board can be further simplified, and the manufacturing cost can be further reduced.

  Further, according to the present invention, the reflection means can propagate light in a straight line while making the optical waveguide member thin by setting the inclination angle with respect to one surface portion of the cladding layer to be not less than 41 degrees and not more than 49 degrees. It becomes possible. In this way, the optical wiring board can be thinned. When the optical wiring board is multi-layered, the dimension in the thickness direction of the substrate can be reduced, and the versatility to the apparatus on which the optical wiring board is mounted can be improved.

  Furthermore, according to the present invention, the clad layer has a condensing unit that condenses light incident on the light path conversion unit or light emitted from the light path conversion unit at a position facing the light path conversion unit. Therefore, the light condensing characteristic can be improved, and the optical path conversion can be realized without increasing the positioning accuracy of the optical path conversion section with respect to the light emitting section or the light receiving section provided on the optical wiring board as compared with the conventional technique.

  Furthermore, according to the present invention, since the light collecting means is formed integrally with the cladding layer, the light collecting means can be manufactured more easily than when the light collecting means is provided separately. Therefore, the manufacturing of the optical wiring board can be further simplified, and the manufacturing cost can be further reduced.

  Furthermore, according to the present invention, an optical wiring module includes the optical wiring substrate and a plurality of optical semiconductor elements. The light emitting unit or the light receiving unit provided in each optical semiconductor element is provided facing each optical path conversion unit. As described above, each optical path conversion unit is provided at a distance from each other in the crossing direction and the optical path direction with the adjacent optical path conversion unit. Therefore, the distance between the optical path conversion units is determined from the distance along the crossing direction and the optical path direction. Can also be increased. Since the light emitting part or the light receiving part (hereinafter sometimes referred to as “light emitting / receiving part”) provided in the optical semiconductor element is provided facing each optical path conversion part, each optical semiconductor element is divided into an optical path direction and an intersecting direction. Even in the case where a plurality of arrangements are made in the direction intersecting the optical path direction and the intersecting direction in the virtual plane including the optical path direction and the direction in which the optical components are arranged, the optical waveguides do not overlap. Thus, it is possible to effectively use the area of the surface portion on which the optical wiring board can be mounted. Therefore, a plurality of optical semiconductor elements can be densely arranged, and the optical wiring module can be miniaturized.

  Furthermore, according to the present invention, since the light emitting part or the light receiving part and the other surface part of the cladding layer are held in a non-contact state, the light emitting part or the light receiving part and the other surface due to thermal expansion or the like It is possible to prevent the light receiving and emitting parts from being damaged by contact with the parts.

  Furthermore, according to the present invention, the gap between each optical semiconductor element and the optical wiring board is provided with a sealing member made of a non-light-transmitting resin except for the light emitting part and the light receiving part. It is possible to reliably prevent undesired incidence on the light emitting / receiving portion of the semiconductor element and to prevent occurrence of crosstalk. Thus, even if the number of optical semiconductor elements connected to the optical wiring board per unit area is increased and the distance to the adjacent optical semiconductor element is reduced, the light receiving and emitting unit of the adjacent optical semiconductor element It is possible to prevent the occurrence of crosstalk due to the incident light. Therefore, the optical semiconductor element can be mounted on the optical wiring board with high density, and the optical wiring module can be further miniaturized. Further, for example, as compared with the prior art that suppresses the occurrence of crosstalk using a plurality of mirror pieces and diffraction gratings, the manufacturing of the optical wiring module can be simplified and the manufacturing cost can be reduced.

  Further, according to the present invention, since the sealing member surrounds each optical semiconductor element along the outer periphery thereof, it is possible to further suppress the occurrence of crosstalk. Since the condition for suppressing the crosstalk is satisfied only by surrounding the sealing member along the outer periphery of the optical semiconductor element, the manufacturing process of the sealing member can be simplified.

  Further, according to the present invention, since the sealing member mechanically connects each optical semiconductor element and the optical wiring board, the relative position between each optical semiconductor element and the optical wiring board can be fixed. As a result, the relative positions of the optical semiconductor elements and the optical wiring board can be prevented from being undesirably displaced due to thermal expansion or the like.

  Furthermore, according to the present invention, since the light transmitting member made of a light transmitting resin is provided between the light emitting / receiving unit of each optical semiconductor element and the optical path changing unit, the following effects are obtained. . With a translucent member, the optical path between the light emitting / receiving unit and the optical path changing unit is secured, and the resin is filled between the other surface portions of the optical semiconductor element and the clad layer, and can be easily held in a non-contact state. It becomes possible. In addition, it is possible to reliably prevent the light emitting / receiving section from being damaged due to thermal expansion or the like.

  Furthermore, according to the present invention, since the translucent member mechanically connects each optical semiconductor element and the optical wiring board, the relative position between each optical semiconductor element and the optical wiring board can be fixed. As a result, the relative positions of the optical semiconductor elements and the optical wiring board can be prevented from being undesirably displaced due to thermal expansion or the like.

  Hereinafter, a plurality of embodiments for carrying out the present invention will be described with reference to the drawings. Portions corresponding to the matters described in the preceding forms in each embodiment are denoted by the same reference numerals, and overlapping description may be omitted. When only a part of the configuration is described, the other parts of the configuration are the same as those described in the preceding section. Not only the combination of the parts specifically described in each embodiment, but also the embodiments can be partially combined as long as the combination does not hinder.

  FIG. 1 is a plan view showing an optical wiring module 1 according to a first embodiment of the present invention. FIG. 2 is an enlarged perspective view showing a part of the optical wiring module 1. FIG. 3 is an enlarged sectional view showing a part of the optical wiring module 1. In FIG. 3, for easy understanding, a configuration in which one optical semiconductor element 3 constituting the optical wiring module 1 and the optical wiring substrate 2 </ b> A are related is shown. The optical wiring module 1 according to the first embodiment has a function of guiding light emitted from the optical semiconductor element 3 from one side to the other and transmitting the light to another optical semiconductor element 3 different from the optical semiconductor element 3. Have.

  The optical wiring module 1 includes an optical wiring substrate 2A and a plurality of optical semiconductor elements 3 in the present embodiment. Each optical semiconductor element 3 is mounted on one surface portion of the optical wiring board 2A in a two-dimensional matrix. The optical wiring board 2 </ b> A includes a support substrate 5 and an optical waveguide member 2 that is fixed to the support substrate 5. The optical waveguide member 2 is fixedly supported on one surface portion 5 a of the support substrate 5. The other surface portion of the support substrate 5 is mounted on, for example, a printed circuit board via a wiring layer (not shown). The support substrate 5 is formed in a rectangular parallelepiped shape from at least one of synthetic resin, alumina-based ceramic, and glass ceramic, for example. However, it is not necessarily limited to a rectangular parallelepiped shape.

  The optical waveguide member 2 includes first and second clad films 6 and 8, a core pattern 7, a plurality of electrode insertion portions 9, and a plurality of through electrodes 10, and the thickness of the optical waveguide member 2 is h1 (h1 is, for example, 50 μm or more and 100 μm or less). A second cladding film 8 is fixed to one surface portion 5 a of the support substrate 5. The core pattern 7 includes a plurality of optical waveguides 40 that are stacked and fixed on one surface of the second cladding film 8 and guide light to different positions. The plurality of electrode insertion portions 9 are fixed to one surface portion of the second cladding film 8 and are formed so as to be surrounded by the first and second cladding films 6 and 8. Each electrode insertion portion 9 is provided with a through electrode 10 along the thickness direction Z of the optical wiring board 2A. The optical waveguide member 2 is formed in a rectangular parallelepiped shape, and the entire optical wiring board 2A is formed in a rectangular parallelepiped shape.

  Hereinafter, a direction perpendicular to one surface of the optical wiring board 2A is referred to as a thickness direction Z. Of the directions perpendicular to the thickness direction Z of the optical wiring board 2A, the direction extending along the long side of the surface in the thickness direction when projected onto the projection plane perpendicular to the axis extending in the thickness direction Z is the longitudinal direction X. Called. A direction perpendicular to the thickness direction Z and the longitudinal direction X of the optical wiring board 2A is referred to as a width direction Y.

  The core pattern 7 and the electrode insertion portion 9 are made of the same material in the same process. The same material is a translucent material, and is realized by at least one of epoxy resin, acrylic resin, polysilanol resin, polysilane, and glass (including quartz), for example. The first and second cladding films 6 and 8 are translucent materials different from those of the core pattern 7 and the electrode insertion portion 9 and are made of a translucent material lower than the refractive index of the core pattern 7, for example, epoxy resin , Acrylic resin, polysilanol resin, polysilane, and glass (including quartz).

  Each optical waveguide 40 constituting the core pattern 7 is covered with the first cladding film 6 and the second cladding film 8. Each optical waveguide 40 includes an optical path conversion unit 40 that performs optical path conversion. In the present embodiment, the optical path conversion unit 14 is realized by the reflection film 14 that is a reflection unit that reflects light. The reflective film 14 has a function of reflecting light emitted from the light emitting unit 3 </ b> A provided in the optical semiconductor element 3 and a function of reflecting light so as to guide light to the light receiving unit 3 </ b> A provided in the optical semiconductor element 3. The reflective film 14 is formed by depositing a reflective material such as aluminum on the inclined portion 13 which is a precursor of the reflective film 14. The inclined portion 13 is formed to be inclined with respect to the one surface portion 6a of the first cladding film 6, and the inclination angle with respect to the one surface portion 6a of the first cladding film 6 is α (α is 41 degrees). 49 degrees or less).

  Such an inclined portion 13 is formed by pressing the core pattern 7 at a position corresponding to the optical path changing portion 40 with a tool. The tool is a tool made of a hard material such as diamond, for example, having a portion inclined so as to reduce the diameter as the pressing indenter moves toward one end. By inclining the core pattern 7 at a position corresponding to the optical path changing unit 40, an inclined part 13 that is inclined is formed.

  The indenter constituting the tool is machined so that the tip angle is 90 ° and the angle between the center line and the ridge line is 45 °. The ridge line portion of the indenter is preferably rounded. By rounding, it is possible to prevent the core pattern 7 from cracking when the indenter is press-fitted. The pressure for press-fitting the indenter varies depending on the type and state of the material, and is adjusted so as to obtain a necessary shape. The indenter can arbitrarily select the angle of the surface other than that for processing the core pattern 7, but if the angle from the center line is large, it may affect the adjacent core pattern 7. Since cracks are likely to occur, the angle from the center line is preferably 30 ° or more and 120 ° or less. The indenter is preferably diamond because it is less likely to be scratched, but metals, ceramics, cemented carbide and the like can be used.

  When the indenter is press-fitted, the core pattern 7 may be in a completely cured state or in a semi-cured state. If the indenter is pressed into the core pattern 7 in a completely cured state, cracks may occur in the core pattern 7. The occurrence of cracks varies depending on the material of the core pattern 7 to be used. For materials that generate cracks, it is better to press the indenter in a semi-cured state. The semi-cured state is a state where 25% or more and 80% or less of the resin has reacted. When press-fitting an indenter, a release agent is applied to the surface of the indenter. A known release agent can be used, and a silicon-based release agent is effective. After press-fitting the indenter, the mold release agent is removed from the inclined portion 13 by a method such as plasma cleaning before metal deposition on the inclined portion 13. When pressing the indenter, it is desirable to remove at least a part of the first cladding layer 6. If it is not removed, the first cladding layer 6 is caught in the core pattern 7 and light is scattered to increase transmission loss. The indenter may be one that can process one location at a time, or may be configured to process many locations at once.

  It is also possible to form the reflective film 14 in a state before the first cladding layer 6 is formed on the core pattern 7. In this case, care should be taken because foreign matter may adhere to the surface of the processed core pattern 7 or may be damaged. However, depending on the characteristics of the material used, the first cladding layer 6 is applied. May need to be processed before.

  Each optical semiconductor element 3 is electrically and mechanically connected to the optical wiring substrate 2A via a plurality of bumps 24 that are conductive bonding materials. The optical semiconductor element 3 is electrically connected to the through electrode 10 formed in the electrode insertion portion 9 via the bump 24, and the thickness direction Z of the optical waveguide member 2 that is the other surface portion 6 b of the first cladding layer 6. It is mounted on the other surface portion 6b. Each optical semiconductor element 3 is provided with a plurality of dummy bumps 25 supported by dummy bumps 25 that are not provided for electrical connection to the optical wiring board 2A. Each bump 24 is made of, for example, gold (Au). Further, the dummy bumps 25 are made of, for example, Au and are spaced apart from each other in the width direction Y, and are arranged at intervals in the longitudinal direction X with respect to the bumps 24. Each optical semiconductor element 3 is mounted on the element mounting surface portion via two bumps 24 and a plurality of dummy bumps 25. By such bumps 24 and dummy bumps 25, the optical semiconductor element 3 and the other surface portion 6b of the first cladding film 6 are separated. Therefore, the light emitting part 3A or the light receiving part 3A provided in the optical semiconductor element 3 and the other surface part 6b of the first cladding film 6 are kept in a non-contact state. Hereinafter, the light emitting unit 3A and the light receiving unit 3A may be referred to as a light receiving / emitting unit 3A.

The optical semiconductor element 3 is, for example, a surface emitting semiconductor laser (Vertical Cavity Surface).
Emitting Laser: abbreviated as VCSEL), a laser beam is emitted toward the element mounting surface portion of the optical wiring board 2A in the thickness direction Z, and the emitted laser beam is applied to the reflective film 14 formed on the inclined portion 13. Has been implemented.

  The surface portion of the first connection pad 10 </ b> A of the through electrode 10 connected to the bump 24 is the other surface portion 6 b of the first cladding film 6, the other surface portion 6 b facing the optical semiconductor element 3, and the optical semiconductor element 3. It is disposed on the same plane as the thickness direction Z surface portion 9a of the electrode insertion portion 9 facing, that is, on the XY plane including the longitudinal direction X and the width direction Y. The other surface portion 6b of the first cladding film 6 other than the other surface portion 6b facing the optical semiconductor element 3 is also disposed on the same plane as the surface portion of the first connection pad 10A, that is, on the XY plane. Hereinafter, the first cladding film 6 may be referred to as the first cladding layer 6, the core pattern 7 may be referred to as the core layer 7, and the second cladding film 8 may be referred to as the second cladding layer 8. Since the second clad film 8 is laminated after interposing the reflective film 14 of the core pattern 7 and the electrode insertion portion 9 having an unevenness in the thickness direction Z, the surface of the second clad film 8 is uneven. However, the other surface portion 6b of the first clad film 6 serving as the base end of the stack is maintained to have higher flatness than the surface portion of the second clad film 8.

  The respective optical waveguides 40 constituting the core pattern 7 are provided along the one surface portion of the second cladding film 8 in a predetermined optical path direction L with an interval in an intersecting direction M intersecting the optical path direction L. It is done. The optical path direction L is a direction in which light should travel. The intersecting direction M is a direction orthogonal to the optical path direction L in the present embodiment. The optical path direction L and the intersecting direction M are directions in the XY plane, and are set so as to intersect with each other in the longitudinal direction X and the width direction Y. The reflection film 14 serving as the optical path conversion unit 14 is provided at one end of the optical waveguide 40 in the optical path direction L.

  The respective optical waveguides 40 are formed, for example, in a long shape along the optical path direction L, and are formed at a small pitch and separated by a predetermined small distance δ1 along the intersecting direction M orthogonal to the optical path direction L and the thickness direction Z. . At least the reflective films 14 adjacent to each other in the intersecting direction M are provided at a distance from each other in the optical path direction L, and are provided with a predetermined small distance δ2 apart from each other in the intersecting direction M. The dimension d1 in the intersecting direction M of each optical waveguide 40 is such that light incident on the light receiving portion 3A or light emitted from the light emitting portion 3A (hereinafter simply referred to as “light entering / exiting the light receiving / emitting portion 3A”) is optically guided. It is set so that light can be reliably guided from one end of the optical path direction L of the body 40 to the other end of the optical path direction L. The other end portion in the optical path direction L of each optical waveguide 40 is provided at one end portion in the longitudinal direction X of the optical wiring board 2A. Each optical waveguide 40 is provided so as to extend along the optical path direction L from one end portion in the longitudinal direction X of the optical wiring board 2A to a position facing each corresponding light emitting / receiving portion 3A.

  Each optical semiconductor element 3 is formed in a substantially rectangular parallelepiped shape when viewed in the thickness direction Z, and when projected onto a projection plane perpendicular to the axis extending in the thickness direction Z, one side extends in the longitudinal direction X, It is mounted on the optical wiring board 2A so that the other side orthogonal to the width direction Y extends. The dimension of each side of each optical semiconductor element 3 is the length dimension d2. Each of the optical semiconductor elements 3 is arranged in the longitudinal direction X with an interval δ5 and is arranged in the width direction Y with an interval δ6 and mounted on the optical wiring board 2A. The respective optical semiconductor elements 3 arranged in the longitudinal direction X are arranged such that the light emitting / receiving portions 3A are at the same position in the width direction Y, and the distance to the light emitting / receiving portions 3A adjacent in the longitudinal direction X is a predetermined distance δ3. Is set to be In addition, the optical semiconductor elements 3 arranged in the width direction Y are arranged such that the light emitting / receiving portions 3A are at the same position in the longitudinal direction X, and the distance to the light emitting / receiving portions 3A adjacent to the width direction Y is a predetermined distance. It is set to be δ4. Further, the distances (δ3 and δ4) between the light emitting / receiving unit 3A of each optical semiconductor element 3 and the adjacent light emitting / receiving unit 3A are set to be equal to each other, for example.

  The inclination angle β of the optical path direction L with respect to the longitudinal direction X is set based on the distances δ1 to δ6, d1 and d2, and in this embodiment, each optical waveguide 40 is located at one end of the optical wiring board 2A in the longitudinal direction X. Configured to reach. As a result, a connecting means may be provided at one end portion in the longitudinal direction X of the optical wiring module 1 in order to transmit / receive optical signals to / from other optical wiring modules, thereby simplifying the configuration.

The optical wiring module 1 configured in this way is provided with a central processing unit (Central processing unit).
Based on the electrical signal transmitted from the IC circuit such as Processing Unit (abbreviated as CPU) via the electrical wiring, the through electrode 10 and the bump 24, the laser light is emitted from the light emitting portion 3A of each optical semiconductor element 3 in the thickness direction Z. It is emitted toward. The laser light passes through the first cladding layer 6 and reaches the inclined portion 13 at the position where the light emitting portion 3A faces. The inclined portion 13 is inclined at, for example, 45 degrees with respect to the thickness direction Z as it goes in the optical path direction L, and the reflective film 14 is formed on the inclined portion 13. As a result, the laser beam is reflected toward one side in the optical path direction L and guided to one side in the optical path direction L. In this way, the optical wiring module 1 can use the emitted laser light as an optical signal based on the electrical signal transmitted from the IC circuit, convert the electrical signal into an optical signal, and transmit the optical signal.

  As described above, according to the optical wiring board 2 </ b> A of the present embodiment, the optical waveguide member 2 includes the first and second cladding films 6 and 8 and the core pattern 7. Among these, the core pattern 7 has a plurality of optical waveguides 40 that are stacked on the one surface portion 6a of the first cladding film 6 and guide light to different positions. Each optical waveguide 40 has a reflection film 14 that is an optical path conversion section 14 that performs optical path conversion, extends in the optical path direction L along the one surface portion 6 b of the first cladding film 6, and is spaced in the intersecting direction M. Opened. The reflective films 14 adjacent to each other in the cross direction M are provided in the optical path direction L with a space therebetween. As a result, each reflective film 14 is provided with a distance from each other in the cross direction M and the optical path direction L with respect to the adjacent reflective film 14, so that the distance between each reflective film 14 is along the cross direction M and the optical path direction L. It can be larger than the distance. Therefore, in order to use each reflective film 14 in the longitudinal direction X and the width direction Y, which are directions intersecting with each other in the optical path direction L and the intersecting direction M, in a virtual plane including the optical path direction L and the intersecting direction M. Even when a plurality of optical semiconductor elements 3 mounted on the substrate 2A are arranged, the optical path direction L is different from the arrangement direction, so that the optical wiring board 2A can be mounted without overlapping each optical waveguide 40. It is possible to effectively use the area of the surface portion. Therefore, the optical semiconductor elements 3 can be arranged densely, and the optical wiring board 2A can be miniaturized.

  The optical wiring module 1 includes the optical wiring substrate 2A and a plurality of optical semiconductor elements 3. The light emitting / receiving section 3A provided in each optical semiconductor element 3 is provided facing each reflective film 14. As described above, each reflective film 14 is provided with a distance from each other in the cross direction M and the optical path direction L with respect to the adjacent reflective film 14, so that the distance between the reflective films 14 is set to the cross direction M and the optical path direction L. Can be larger than the distance along. The light emitting / receiving unit 3A provided in the optical semiconductor element 3 is provided so as to face each of the reflective films 14, so that each optical semiconductor element 3 is arranged in an imaginary plane including the optical path direction L and the intersection direction M with the optical path direction L. Even in the case where a plurality of arrangements are made in the longitudinal direction X and the width direction Y, which are directions intersecting with the intersecting direction M, the optical waveguide direction L is different from the arrangement direction, so that the optical waveguides 40 do not overlap. Thus, it is possible to effectively use the area of the surface portion on which the optical wiring board 2A can be mounted. Therefore, the optical semiconductor elements 3 can be densely arranged, and the optical wiring module 1 can be miniaturized.

  In the present embodiment, the reflection film 14 that reflects light is formed at the end of the optical waveguide 40, and the optical path conversion unit 14 that can change the optical path can be realized by the reflection film 14. The reflective film 14 is formed by depositing a reflective material on the inclined portion 13 which is a precursor of the reflective film 14, and the inclined portion 13 has an inclination angle α of 41 degrees with respect to the one surface portion 6 a of the first cladding film 6. Since the angle is defined as 49 degrees or less, light can be propagated linearly in the optical path direction L while the optical waveguide member 2 is thinned. In this way, the optical wiring board 2A can be thinned. When the optical wiring board 2A is multi-layered, the dimension in the thickness direction Z can be reduced, and the versatility to a device on which the optical wiring board 2A is mounted can be improved.

  In the present embodiment, since the light emitting portion 3A or the light receiving portion provided in the optical semiconductor element 3 and the other surface portion 6b of the first cladding film 6 are held in a non-contact state, the following There is an effect. It is possible to prevent the light emitting / receiving unit 3A from being damaged by contact between the light emitting / receiving unit 3A and the other surface portion 6b of the first cladding film 6 due to thermal expansion or the like. Therefore, it is not necessary to laminate each laminate in consideration of the difference in thermal expansion coefficient as in the prior art. Thus, the production of the optical wiring module 1 can be simplified, and the production cost can be reduced.

  In the present embodiment, the reflective film 14 is formed at one end of the optical path direction L of the core pattern 7, but is not necessarily limited to only one end of the optical path direction L. In other words, the reflection film 14 only needs to be provided with at least the adjacent reflection films 14 spaced apart from each other in the optical path direction L, and is formed in a part of each optical waveguide 40 in the optical path direction L, for example, in the intermediate portion of the optical path direction L. May be.

  Although the VCSEL is used as the optical semiconductor element 3 in the present embodiment, it is not necessarily limited to the VCSEL. For example, an edge-emitting laser diode may be used as long as it can irradiate laser light. As an optical semiconductor element, a light receiving element may be disposed on the optical wiring board 2A. By disposing the light receiving element, the light guided by the light receiving element through the optical waveguide 40 is received, and the received light is converted into an electrical signal, whereby a signal can be transmitted between the two devices.

  FIG. 4 is a plan view showing an optical wiring module 1a of another example of the present embodiment. The optical wiring module 1a of this example is different in configuration from the optical waveguides 40 of the optical wiring module 1 described above. Each optical waveguide 40a of this example includes five optical semiconductor elements 3 arranged closer to one side in the width direction Y and five optical semiconductor elements 3 arranged closer to the other side in the width direction Y. The position of the light guided in the longitudinal direction X differs depending on the body 40a. The five optical semiconductor elements 3 arranged closer to one side in the width direction Y are provided with the other end in the optical path direction L of each optical waveguide 40a at one end in the longitudinal direction X of the optical wiring board 2A. The five optical semiconductor elements 3 arranged on the other side in the width direction Y are provided with the other end in the optical path direction L of each optical waveguide 40a at the other end in the longitudinal direction X of the optical wiring board 2A. Even with such a configuration, it is possible to achieve the same operations and effects as the optical wiring module 1 described above.

  FIG. 5 is a plan view showing an optical wiring module 1b of still another example of the present embodiment. The optical wiring module 1b of this example is different in configuration from the respective optical waveguides 40 of the optical wiring module 1 described above. Each optical waveguide body 40b of this example is composed of five optical semiconductor elements 3 arranged closer to one side in the width direction Y and five optical semiconductor elements 3 arranged closer to the other side in the width direction. The optical path direction L and the crossing direction M to be guided are different depending on 40b. The five optical semiconductor elements 3 arranged closer to one side in the width direction Y are provided with the other end of the optical path direction L1 of each optical waveguide 40b at one end in the longitudinal direction X of the optical wiring board 2A. The five optical semiconductor elements 3 arranged closer to the other side in the width direction Y are provided with the other end of the optical path direction L2 of each optical waveguide 40b at one end in the longitudinal direction X of the optical wiring board 2A.

  The optical path direction L1 is the same direction as the optical path direction L described above, and the optical path direction L2 is an axially symmetric direction with respect to the longitudinal direction X as an axis. The intersecting directions M1 and M2 are orthogonal to the optical path directions L1 and L2, respectively. As described above, only the reflection film 14 adjacent in the longitudinal direction X may be configured to be spaced in the optical path directions L1 and L2 and the crossing directions M1 and M2. Even with such a configuration, it is possible to achieve the same operations and effects as the optical wiring module 1 described above.

  Next, an optical wiring module 1A according to the second embodiment of the present invention will be described. FIG. 6 is an enlarged cross-sectional view showing a part of the optical wiring module 1A. In FIG. 6, in order to facilitate understanding, a configuration in which one optical semiconductor element 3 constituting the optical wiring module 1A and the optical wiring substrate 2A are related is shown. The optical wiring module 1A of the present embodiment is characterized by the configuration of the reflective film 14A. In the optical wiring module 1 according to the first embodiment described above, the inclined portion 13 that is the precursor of the reflective film 14 is formed in a flat shape that is inclined with respect to the XY plane. In the present embodiment, the inclined portion 13A is formed. Is formed in a convex curved shape that is curved with respect to the XY plane.

  Since the inclined portion 13A is formed in a convex curved surface shape, the surface of the indenter is processed into a convex surface. Even if the surface of the indenter is flat, the inclined portion 13A can be processed into a convex curved surface by the following processing method. The press-fitting process of the indenter is performed in an area where the core pattern 7 can be elastically plastically deformed. The region where elasto-plastic deformation is possible is an atmosphere at room temperature and normal pressure, with 50% to 90% of the resin undergoing a curing reaction. When an indenter is press-fitted into the core pattern 7 in such a state, the material is plastically deformed and recessed, but when the indenter is removed, a part of the resin is elastically deformed to have a convex curved surface shape. In such a method, it is not necessary to perform complicated convex processing on the indenter, so that the processing cost and processing time can be greatly reduced. This is particularly effective when a diamond indenter is used.

  The curvature of the inclined portion 13A can be arbitrarily selected by adjusting the elastic-plastic deformation characteristics. That is, if the ratio of elastic deformation is large, the convex return after the indenter press-in is large, so that the dent of the inclined portion 13A is large. Conversely, if the ratio of plastic deformation is large, the convex after the indenter press-in is large. Since the return of the shape is small, the recess of the inclined portion 13A becomes small. Even if a crack is generated at the time of press-fitting the indenter, further progress of the crack can be prevented by filling the adhesive.

  The inclined portion 13A is formed in a convex curved shape that protrudes in the direction in which light emitted from the light emitting portion 3A is reflected and in the direction in which the light emitted from the light emitting portion 3A is emitted. Thereby, it is possible to improve the light condensing characteristics as compared with the case where the inclined portion 13 is formed flat as in the first embodiment. Therefore, optical path conversion can be realized without increasing the positioning accuracy of the reflective film 14A with respect to the light emitting portion 3A than that of the conventional technique. Therefore, the manufacturing of the optical wiring board 2A can be simplified, and the manufacturing cost can be reduced.

  Next, an optical wiring module 1B according to the third embodiment of the present invention will be described. FIG. 7 is an enlarged cross-sectional view showing a part of the optical wiring module 1B. In FIG. 7, for easy understanding, one optical semiconductor element 3 constituting the optical wiring module 1B is shown. The optical wiring module 1B of the present embodiment is characterized by the configuration of the first clad film 6. The first cladding film 6 of the present embodiment collects the light guided to the light receiving unit 3A or the light emitted from the light emitting unit 3A at a position facing the light receiving / emitting unit 3A of the optical semiconductor element 3. Is provided.

  The microlens 100 is configured to be convex toward the other side in the thickness direction Z, in other words, convex toward the reflective film 14. As a result, the light emitting / receiving unit 3A can be arranged near the focal point of the microlens 100. The microlens 100 is formed integrally with the first cladding film 6.

  By providing the microlens 100 on the first clad film 6 in this way, the light collecting characteristic can be improved, and the optical path conversion can be performed without increasing the positioning accuracy of the reflective film 14 with respect to the light emitting / receiving portion 3A than that of the prior art. realizable.

  In addition, since the microlens 100 is formed integrally with the first cladding film 6, the microlens 100 can be manufactured more easily than when the microlens 100 is provided separately. Therefore, the manufacturing of the optical wiring board 2A can be further simplified, and the manufacturing cost can be further reduced.

  Next, an optical wiring module 1C according to the fourth embodiment of the present invention will be described. FIG. 8 is an enlarged cross-sectional view showing a part of the optical wiring module 1C. In FIG. 8, in order to facilitate understanding, a configuration in which one optical semiconductor element 3 constituting the optical wiring module 1C and the optical wiring substrate 2A are related is shown. The optical wiring module 1 </ b> C of the present embodiment is characterized in that it includes a sealing member 60. By providing the sealing member 60 in the gap, the light emitting / receiving portion 3A of each optical semiconductor element 3 and the other surface portion 6b of the first cladding film 6 are held in a non-contact state.

  A sealing member 60 is provided between the optical semiconductor element 3 and the optical wiring board 2A except for the light emitting / receiving section 3A. The sealing member 60 covers the outer periphery of the light emitting / receiving unit 3A, except for the light emitting / receiving unit 3A, and is densely filled. The sealing member 60 is made of non-translucent underfill resin (for example, epoxy resin), and holds the light emitting / receiving portion 3A and the other surface portion 6b of the first cladding film 6 in a non-contact state. So that it is filled. As a result, the sealing member 60 has a function of preventing incoming / outgoing light of the light emitting / receiving unit 3 </ b> A from being emitted to the outside of the optical semiconductor element 3. However, the sealing member 60 has a cylindrical hole shape (but may not be cylindrical) in the thickness direction Z so that light transmitted and received between the light emitting / receiving portion 3A and the reflective film 14 does not interfere with the underfill resin. A sealing member through-hole 61 is formed so as to penetrate therethrough.

  The non-light-transmitting underfill resin has a light transmission amount per 1 cm of resin with respect to light having a wavelength to be used (for example, 850 nm) of -30 dB or more, preferably -40 dB. The above is preferred. Further, the non-light-transmitting resin means that the amount of transmitted light per 1 cm of resin is -30 dB or more, preferably -40 dB or more with respect to the input amount, even for external light (for example, white light). If so, it is more preferable. Further, as a method for measuring the light transmission efficiency, light from a light source (for example, LED or LD) is introduced into the first optical fiber, and non-light transmissive resin is used as the light emitted from the optical fiber. It arrange | positions so that it may inject | throw-in, this transmitted light is transmitted to a 2nd optical fiber, and the light quantity of the light radiate | emitted from the 2nd optical fiber is measured with a power meter. On the other hand, the amount of light is measured by transmitting two optical fibers in the state where no resin is interposed. Then, the light transmission efficiency is calculated from the ratio of the light amounts obtained by this measurement.

  A light transmitting member 101 made of a transparent resin having a light transmitting property is injected into the through hole portion forming the sealing member through hole 61. Thereby, at least between the light emitting / receiving portion 3A of each optical semiconductor element 3 and the reflective film 14, the light transmissive member 101 made of light transmissive resin is provided. The translucent member 101 is provided so as to contact both the optical semiconductor elements 3 and the optical wiring board 2A. Therefore, each optical semiconductor element 3 and the optical wiring board 2 </ b> A are mechanically connected by the translucent member 101. In other words, the translucent member 101 is provided so as to regulate relative displacement between each optical semiconductor element 3 and the other surface portion 6 b of the first cladding film 6.

  Here, the translucent member 101 is such that the attenuation (loss) of light per 1 cm of translucent member with respect to light of the wavelength to be used (for example, 850 nm) is 6 dB or less with respect to the amount of input light. Desirably, 3 dB or less is suitably used, and 0.5 dB or less is optimal. Further, as a method for measuring the attenuation of light, light from a light source (for example, LED or LD) is introduced into the first optical fiber, and non-light-transmitting resin is used as light emitted from the optical fiber. It arrange | positions so that it may inject | throw-in, this transmitted light is transmitted to a 2nd optical fiber, and the light quantity of the light radiate | emitted from the 2nd optical fiber is measured with a power meter. On the other hand, the amount of light is measured by transmitting two optical fibers in the state where no resin is interposed. Then, the amount of light attenuation is calculated from the ratio of the light amounts obtained by this measurement.

  Any material can be used for the translucent member 101 as long as it is a translucent resin such as epoxy resin, acrylic resin, and silicon resin. Further, the resin of the translucent member 101 may be solid, liquid, or rubber. This resin is applied to the light emitting / receiving portion of the optical semiconductor element 3, the position of the corresponding substrate surface (that is, the other surface portion 6b) (denoted as 61a in FIG. 8), or both. Thereafter, the optical semiconductor element 3 is mounted. A portion other than the translucent member 101 may be coated with a normal underfill agent.

  As described above, in the optical wiring module 1 </ b> C of the present embodiment, the sealing member 60 is provided, and the sealing member 60 is made of a non-light-transmitting resin and is provided in each optical semiconductor element 3. 3A and the light emitting / receiving unit 3A of the adjacent optical semiconductor element 3 are provided. When the distance between the light receiving / emitting unit 3A and the adjacent optical semiconductor element 3 is short, the light is incident on the light receiving / emitting part 3A of the adjacent optical semiconductor element 3 undesirably, and so-called crosstalk may occur. By providing the sealing member 60 as in the present embodiment, it is possible to reliably prevent undesired incident on the light emitting / receiving portion 3A of the adjacent optical semiconductor element 3 and to prevent occurrence of crosstalk. . Thus, even when the number of optical semiconductor elements 3 connected to the optical wiring board 2A per unit area is increased and the distances (δ3 and δ4) to the adjacent optical semiconductor elements 3 are reduced, It is possible to prevent the occurrence of crosstalk due to the incoming / outgoing light of the light emitting / receiving unit 3A of the optical semiconductor element 3 to be generated. Therefore, the optical semiconductor element 3 can be mounted on the optical wiring board 2A with high density, and the optical wiring module can be miniaturized. For example, the manufacturing of the optical wiring module 1C can be simplified and the manufacturing cost can be reduced as compared with the prior art that suppresses the occurrence of crosstalk using a plurality of mirror pieces and diffraction gratings.

  Further, in the present embodiment, since the translucent member 101 made of translucent resin is provided at least between the light emitting / receiving portion 3A of the optical semiconductor element 3 and the reflective film 14, the following effects are obtained. Play. The translucent member 101 made of the translucent resin secures an optical path between the light emitting / receiving portion 3A and the reflective film 14, and then fills the resin between the optical semiconductor element 3 and the first clad film 6 so as to be non-contact. This state can be easily held. Moreover, it is possible to reliably prevent the light emitting / receiving unit 3A from being damaged due to thermal expansion or the like.

  Further, in the present embodiment, the translucent member 101 mechanically connects each optical semiconductor element 3 and the optical wiring board 2A, so that the relative position between each optical semiconductor element 3 and the optical wiring board 2A is fixed. Can do. As a result, the relative positions of the respective optical semiconductor elements 3 and the optical wiring board 2A can be prevented from being undesirably displaced due to thermal expansion or the like.

  In the present embodiment, the translucent member 101 is realized by being injected into the sealing member through-hole 61 formed in the sealing member 60, but is not limited thereto. A sealing member may be provided so as to cover the bumps 24 and 25 from outside, and the light transmissive member 101 may be provided in a space where the optical semiconductor element 3 faces the optical wiring board 2A. Accordingly, each optical semiconductor element 3 and the optical wiring board 2 </ b> A can be mechanically connected more reliably by the translucent member 101.

  Next, an optical wiring module 1D according to the fifth embodiment of the present invention will be described. FIG. 9 is an enlarged cross-sectional view showing a part of the optical wiring module 1D. In FIG. 9, in order to facilitate understanding, a configuration in which one optical semiconductor element 3 constituting the optical wiring module 1D and the optical wiring substrate 2A are related is shown. In the optical wiring module 1D of the present embodiment, the sealing member 60 is provided not only in the gap between the optical semiconductor element 3 and the optical wiring substrate 2A but also in the optical semiconductor element 3 along the outer periphery thereof, It is characterized in that it surrounds the semiconductor element 3.

  The sealing member 60 is made of a colored non-light transmissive resin. The sealing member 60 surrounds not only the gap between the optical semiconductor element 3 and the optical wiring board 2A but also the optical semiconductor element 3 along its outer periphery. The sealing member 60 is attached to the outer periphery of the optical semiconductor element 3 and is provided so as to integrally cover the optical semiconductor element 3 and the other surface portion 6b of the first cladding film 6 in the vicinity thereof. The sealing member 60 also has a sealing member through-hole 63 that is cylindrical and penetrates in the thickness direction Z so that light transmitted and received between the light emitting / receiving portion 3A and the reflective film 14 does not interfere with the sealing member 60. Is formed.

  As described above, since the sealing member 60 made of a non-light-transmitting resin is provided in the gap between the optical semiconductor element 3 and the optical wiring board 2A except for the light emitting part 3A and the light receiving part 3A, crosstalk is prevented. Occurrence can be easily suppressed. For example, compared to the prior art that suppresses the occurrence of crosstalk using a plurality of mirror pieces and diffraction gratings, the manufacturing of the optical wiring module can be simplified and the manufacturing cost can be reduced. Since the sealing member 60 surrounds the optical semiconductor element 3 along the outer periphery thereof, it is possible to further suppress the occurrence of crosstalk. Since the sealing member 60 is surrounded along the outer periphery of the optical semiconductor element 3 and the condition for suppressing crosstalk is satisfied only by filling the gap, the manufacturing process of the sealing member can be simplified. Further, since the sealing member 60 is colored, crosstalk can be effectively suppressed.

  Further, in the present embodiment, the sealing member 60 may be provided so as to contact the adjacent optical semiconductor element 3. In other words, the sealing member 60 may be provided so as to fill a gap between the optical semiconductor element 3 and the adjacent optical semiconductor element 3. As a result, even if the distance to the adjacent optical semiconductor elements 3 is very small, light can be reliably shielded between the adjacent optical semiconductor elements 3.

  In each of the above-described embodiments, only the light emitted from the light emitting portion 3A of the optical semiconductor element 3 has been described with reference to the drawings. However, the present invention is not limited to this, and the optical semiconductor element that enters the light receiving portion 3A. Even if it is 3, it has the same effect | action and effect by the same structure.

1 is a plan view showing an optical wiring module 1 according to a first embodiment of the present invention. 2 is an enlarged perspective view showing a part of the optical wiring module 1. FIG. FIG. 2 is an enlarged cross-sectional view showing a part of the optical wiring module 1. It is a top view which shows the optical wiring module 1a of the other example of this Embodiment. It is a top view which shows the optical wiring module 1b of the further another example of this Embodiment. It is sectional drawing which expands and shows a part of optical wiring module 1A. It is sectional drawing which expands and shows a part of optical wiring module 1B. It is sectional drawing which expands and shows a part of optical wiring module 1C. It is sectional drawing which expands and shows a part of optical wiring module 1D.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Optical wiring module 2 Optical waveguide member 2A Optical wiring board 3 Optical semiconductor element 3A Light receiving / emitting part 5 Support substrate 6 1st clad film 7 Core pattern 14 Reflective film 40 Optical waveguide body 60, 62 Sealing member 100 Microlens 101 Through Optical member

Claims (14)

An optical wiring board including a support substrate and an optical waveguide member fixed to the support substrate,
The optical waveguide member is
A cladding layer;
A core layer laminated on one surface of the clad layer, the core layer including a plurality of optical waveguides for guiding light to different positions;
Each optical waveguide has an optical path conversion unit for converting an optical path,
Each optical waveguide extends in a predetermined optical path direction along one surface portion of the cladding layer, and is provided at intervals in a crossing direction intersecting the optical path direction.
An optical wiring board characterized in that at least the respective optical path conversion units adjacent in the crossing direction are provided at intervals in the optical path direction.   2. The optical wiring board according to claim 1, wherein the optical path changing part is a reflecting means formed at the end of the optical waveguide to reflect light.   The optical wiring board according to claim 2, wherein the reflecting means has a function of reflecting light emitted from a light emitting portion provided in the optical semiconductor element.   4. The optical wiring board according to claim 3, wherein the reflecting means is formed in a convex curved shape protruding in a direction opposite to a traveling direction in which the light emitted from the light emitting part is reflected.   3. The optical wiring board according to claim 2, wherein the reflecting means is formed so as to be inclined with respect to one surface portion of the clad layer, and the inclination angle is regulated to 41 degrees or more and 49 degrees or less.   The clad layer includes condensing means for condensing light incident on the optical path conversion unit or light emitted from the optical path conversion unit at a position where the optical path conversion unit faces the clad layer. The optical wiring board according to any one of the above.   7. The optical wiring board according to claim 6, wherein the condensing means is formed integrally with the cladding layer. An optical wiring module having a plurality of optical semiconductor elements electrically and mechanically connected to the optical wiring board according to any one of claims 1 to 7,
An optical wiring module, wherein a light emitting part or a light receiving part provided in each optical semiconductor element is provided facing each optical path conversion part.   9. The optical wiring module according to claim 8, wherein a light emitting portion or a light receiving portion provided in each optical semiconductor element and the other surface portion of the cladding layer are held in a non-contact state.   10. The light according to claim 8, wherein a sealing member made of a non-light-transmitting resin is provided in a gap between each optical semiconductor element excluding the light emitting part and the light receiving part and the optical wiring board. Wiring module.   The optical wiring module according to claim 10, wherein the sealing member surrounds each optical semiconductor element along an outer periphery thereof.   The optical wiring module according to claim 10 or 11, wherein the sealing member mechanically connects each optical semiconductor element and the optical wiring substrate.   13. A light transmissive member made of a light transmissive resin is provided at least between a light emitting part or a light receiving part of each optical semiconductor element and the optical path changing part. The optical wiring module as described in any one.   14. The optical wiring module according to claim 13, wherein the translucent member mechanically connects each optical semiconductor element and the optical wiring board.

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