JP2009163975A - Organic electroluminescence device and manufacturing method thereof - Google Patents

Abstract

An organic EL device capable of bonding a first substrate and a second substrate through a predetermined gap without damaging a film formed on a first substrate, and a method for manufacturing the same.
In manufacturing an organic EL device 100, a first sealing material application step of applying an ultraviolet curable first sealing material 91a along a peripheral region 10c of a first substrate 10, and a first sealing material 91a. A second sealing material application step of applying a thermosetting second sealing material 92a in the region surrounded by the first substrate 10 and the first sealing material 91a so as to sandwich the first sealing material 91a and the second sealing material 92a. An overlapping process for overlapping the two substrates 20 and a sealing material fixing process for curing the first sealing material 91a and the second sealing material 92a are performed. The first sealing material 91 a includes a gap material 95 that is interposed between the first substrate 10 and the second substrate 20 and controls the substrate distance between the first substrate 10 and the second substrate 20.
[Selection] Figure 3

Description

  The present invention relates to an organic electroluminescence (hereinafter referred to as organic EL) device and a method for manufacturing the same.

  The organic EL device includes an organic EL element on which a positive electrode, an organic functional layer, and a cathode are stacked on a substrate. For the purpose of enhancing the electron injection effect at a low voltage, between the light emitting functional layer and the cathode, In some cases, an electron injection layer mainly composed of an alkali metal or an alkaline earth metal is disposed. Since the organic functional layer, the cathode, and the electron injection layer used in such an organic EL element are very active, they easily react with moisture present in the atmosphere and are easily altered. When such alteration occurs, the electron injection effect is impaired, and a non-light emitting portion called a dark spot is generated.

Therefore, conventionally, the side plate part of a lid-like cover made of glass or the like that blocks moisture is attached to the substrate with an adhesive to form a hollow structure, and a desiccant is placed in the hollow part to penetrate moisture from the adhesive cross section. Has been proposed for a structure that does not reach the organic EL element by being trapped with a desiccant (see Patent Document 1).
Japanese Patent Laid-Open No. 2003-2231992

  However, as disclosed in Patent Document 1, the structure in which the side plate portion of the lid-like cover is attached to the substrate with an adhesive and the desiccant is disposed in the hollow portion has significant problems in terms of strength and cost.

  Therefore, as shown in FIG. 8, the inventor of the present application includes a first electrode layer 81 as a pixel electrode (anode), an organic functional layer 82, and a second electrode layer 83 as a cathode in the first substrate 10. It is proposed to join the second substrate 20 with the sealing material layer 99 to the side on which the organic EL element 80 is formed.

  However, for example, as shown in FIG. 8, white light is emitted from the organic EL element 80, while color display is provided by providing the color filter layers 22 (R), (G), and (B) on the second substrate 20. When performing, it is necessary to narrow the gap between the first substrate 10 and the second substrate 20 from the viewpoint of realizing high definition and preventing color mixing between adjacent pixels. In the case of a structure in which the first substrate 10 and the second substrate 20 are in contact with each other, there is a problem in that the film formed on the first substrate 10 is damaged. For example, when the sealing film 60 is formed over a wider area than the pixel area 10 a with respect to the first substrate 10, the second substrate 20 is not secured unless a gap is secured between the first substrate 10 and the second substrate 20. There is a problem that the sealing film 60 is damaged by coming into contact with the sealing film 60. However, when the sealing material layer 99 is configured, a gap material is interposed between the first substrate 10 and the second substrate 20 to control the distance between the first substrate 10 and the second substrate 20. When the sealing material is used, there is a problem in that the gap material contacts the sealing film 60 and the sealing film 60 is damaged.

  The configuration shown in FIG. 8 is a reference example devised by the inventor of the present application so as to easily explain the feature points of the present invention, and is different from the prior art.

  In view of such a problem, an object of the present invention is to provide an organic EL device capable of bonding a first substrate and a second substrate through a predetermined gap without damaging a film formed on the first substrate. And a method of manufacturing the same.

  In order to solve the above problems, in the present invention, a first substrate in which a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; In the organic EL device having a second substrate overlaid on the surface side on which the organic EL element is formed, the first substrate and the second substrate are frames formed in a peripheral region surrounding the pixel region. The first sealing material layer is bonded to the first sealing material layer and the second sealing material layer formed over the entire region surrounded by the first sealing material layer, and the first sealing material layer is bonded to the first substrate and the first sealing material layer. A gap material for controlling a substrate interval between the first substrate and the second substrate is interposed between the second substrate and the second substrate.

  In the present writer, the first substrate and the second substrate include a frame-shaped first sealing material layer formed in the peripheral region and a second region formed in the entire region surrounded by the first sealing material layer. Since they are bonded together by the sealing material layer, the organic EL elements and the like formed on the first substrate can be protected from moisture entering from the outside. Moreover, since the 1st sealing material layer contains the gap material which controls the board | substrate space | interval of a 1st board | substrate and a 2nd board | substrate, the clearance gap between a 1st board | substrate and a 2nd board | substrate can be controlled. For this reason, since the first substrate and the second substrate do not contact each other, the film formed in the pixel region of the first substrate is not damaged. Further, since the gap material is included in the first sealing material layer formed in the peripheral region, the gap material does not contact the pixel region of the first substrate, so that the film formed in the pixel region of the first substrate is damaged. There is nothing to do.

  In the present invention, the second substrate and the second sealing material layer are translucent, and a color filter layer of a different color is formed on each region facing the plurality of organic EL elements on the second substrate. It is preferable. With this configuration, when configured in this way, white light and mixed light of each color can be emitted from each of the plurality of organic EL elements, and such light can be emitted through the color filter layer. An image can be displayed. Moreover, the gap between the first substrate and the second substrate is controlled by the gap material contained in the first sealing material layer, and it is possible to reliably prevent the first substrate and the second substrate from coming into contact with each other. The gap between the first substrate and the second substrate can be narrowed. Therefore, it is possible to achieve high definition when color display is performed using the color filter layer formed on the second substrate, and it is possible to prevent color mixing.

  In the present invention, it is preferable that a sealing film is formed on the second electrode layer in at least the pixel region of the first substrate. If comprised in this way, the organic EL element etc. which are formed in the 1st board | substrate can be reliably protected from the moisture which penetrate | invaded from the outside. In addition, since the gap between the first substrate and the second substrate is controlled by the gap material contained in the first sealing material layer, the second substrate contacts the sealing film, and the gap material is the sealing film. Therefore, even if the first substrate and the second substrate are bonded together, the sealing film is not damaged.

  In the present invention, a first substrate in which a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region, and the organic EL element is formed on the first substrate. In the manufacturing method of the organic EL device having the second substrate stacked on the surface side, the first substrate and / or the second substrate, the first region with respect to a peripheral region surrounding the pixel region on the outer peripheral side. A first sealing material application step of applying a first sealing material containing a gap material interposed between the substrate and the second substrate to control a substrate distance between the first substrate and the second substrate; A second sealing material application step of applying a second sealing material in a region surrounded by the first sealing material on the first substrate or / and the second substrate; and the first sealing material and the second sealing material. Sandwiching the first substrate and the second An overlapping step of overlapping the plate, and a sealing material solidifying step of solidifying the first sealing material to form a first sealing material layer and solidifying the second sealing material to form a second sealing material layer It is characterized by having.

  In the present invention, in the overlapping step, the substrates are overlapped so as to sandwich the first sealing material and the second sealing material, the second sealing material is developed between the substrates, and the second sealing material is used as the first sealing material. Therefore, the first substrate and the second substrate include a frame-shaped first sealing material layer formed in the peripheral region and a second region formed in the entire region surrounded by the first sealing material layer. A structure bonded with the sealing material layer can be realized, and according to such a structure, the organic EL element and the like formed on the first substrate can be protected from moisture entering from the outside. In addition, since the first sealing material and the second sealing material are continuously applied and then the first sealing material and the second sealing material are solidified, the productivity can be improved. Furthermore, since the first sealing material layer contains a gap material that controls the substrate distance between the first substrate and the second substrate, the gap between the first substrate and the second substrate can be controlled. For this reason, since the first substrate and the second substrate do not contact each other, the film formed in the pixel region of the first substrate is not damaged. Furthermore, since the gap material is included in the first sealing material layer formed in the peripheral region, the gap material does not contact the pixel region of the first substrate. There is no damage.

  In the present invention, in the overlaying step, the first substrate and the second substrate are overlapped so that one of the first substrate and the second substrate is pressed against the other in a reduced-pressure atmosphere, and the second seal Preferably, a material is spread between the first substrate and the second substrate. If comprised in this way, it can prevent that a bubble mixes between a 1st board | substrate and a 2nd board | substrate. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure, so that the second sealing material reaches every corner between the first substrate and the second substrate, and the second sealing material. The filling property of the is improved.

  In the present invention, the first sealing material preferably has a higher viscosity than the second sealing material. If comprised in this way, when the 1st sealing material is applied in the 1st sealing material application process, the outflow of the 1st sealing material can be prevented. Further, in the overlapping step, the second sealing material presses the first sealing material toward the outside, but since the viscosity of the first sealing material is high, the second sealing material does not break through the first sealing material, The outflow of the second sealing material can be prevented. Moreover, since the viscosity of the second sealing material is low, the second sealing material can be filled over the entire region surrounded by the first sealing material.

  In the present invention, it is preferable that the first sealing material is photocurable and the second sealing material is thermosetting. If comprised in this way, in a sealing material solidification process, a 1st sealing material and a 2nd sealing material can be selectively solidified in a predetermined order. In the pixel region, various light-shielding films are often formed on the first substrate and the second substrate. In such a case, the second sealing material cannot be irradiated with sufficient light. Since the sealing material is thermosetting, it can be solidified reliably.

  In the present invention, in the sealing material solidifying step, the second sealing material can be solidified after the first sealing material is solidified. If comprised in this way, since a 1st board | substrate and a 2nd board | substrate can be bonded together with a 1st sealing material before solidifying a 2nd sealing material, when solidifying a 2nd sealing material, a viscoelastic change will occur. Even in this case, no displacement occurs between the first substrate and the second substrate.

  In the present invention, in the second sealing material application step, the application amount (volume) of the second sealing material is defined as the volume of the space surrounded by the first substrate, the second substrate, and the first sealing material layer. It is preferable to set the amount corresponding to the product of the volume shrinkage rate when the second sealing material is solidified. If comprised in this way, since a 2nd sealing material will not be apply | coated excessively, in a superposition process, a 2nd sealing material does not press a 1st sealing material to an outer side with an excessive force. Therefore, the second sealing material does not break through the first sealing material, and the second sealing material can be prevented from flowing out.

  An organic EL device to which the present invention is applied is used as a direct-view display unit or the like in an electronic device such as a mobile phone or a mobile computer.

  Embodiments of the present invention will be described below. In the drawings to be referred to in the following description, the scales of the layers and the members are different from each other in order to make the layers and the members large enough to be recognized on the drawings. Further, in the following description, as much as possible, the same reference numerals are assigned to the corresponding portions so that the correspondence with the configuration described with reference to FIG. 8 can be easily understood.

(overall structure)
FIG. 1 is an equivalent circuit diagram showing an electrical configuration of an organic EL device to which the present invention is applied. In the organic EL device 100 shown in FIG. 1, on the first substrate 10, a plurality of scanning lines 3a, a plurality of data lines 6a extending in a direction intersecting the scanning lines 3a, and a scanning line 3a are arranged in parallel. And a plurality of power supply lines 3e extending. In the first substrate 10, a plurality of pixels 100a are arranged in a matrix in a rectangular pixel region 10a. A data line driving circuit 101 is connected to the data line 6a, and a scanning line driving circuit 104 is connected to the scanning line 3a. Each pixel region 10a holds a switching thin film transistor 30b to which a scanning signal is supplied to the gate electrode via the scanning line 3a, and a pixel signal supplied from the data line 6a via the switching thin film transistor 30b. The storage capacitor 70 to be driven, the driving thin film transistor 30c to which the pixel signal held by the storage capacitor 70 is supplied to the gate electrode, and the power supply line 3e when electrically connected to the power supply line 3e through the thin film transistor 30c. A first electrode layer 81 (anode layer) into which a driving current flows and an organic EL element 80 in which an organic functional layer is sandwiched between the first electrode layer 81 and the cathode layer are formed.

  According to this configuration, when the scanning line 3a is driven and the switching thin film transistor 30b is turned on, the potential of the data line 6a at that time is held in the holding capacitor 70, and according to the charge held in the holding capacitor 70, The on / off state of the driving thin film transistor 30c is determined. Then, a current flows from the power supply line 3e to the first electrode layer 81 through the channel of the driving thin film transistor 30c, and further a current flows to the counter electrode layer through the organic functional layer. As a result, the organic EL element 80 emits light according to the amount of current flowing therethrough.

  In the organic EL device 100 configured as described above, each of the plurality of pixels 100a corresponds to red (R), green (G), and blue (B), and red (R), green (G), and blue (B). The three pixels 100a constitute one pixel. In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B), and the pixel 100a is red (R), green (G), blue ( Which of B) corresponds is defined by a color filter layer described later.

  In the configuration shown in FIG. 1, the power supply line 3e is parallel to the scanning line 3a. However, a configuration in which the power supply line 3e is parallel to the data line 6a may be adopted. In the configuration shown in FIG. 1, the storage capacitor 70 is configured using the power supply line 3e. However, the storage capacitor 70 may be configured by forming a capacitance line separately from the power supply line 3e. Good.

(Specific configuration of organic EL device)
2A and 2B are a plan view of the organic EL device to which the present invention is applied as viewed from the second substrate side together with the respective components, and a JJ ′ sectional view thereof. . In addition, illustration of a color filter layer etc. is abbreviate | omitted in FIG.2 (b). 2A and 2B, in the organic EL device 100 of the present embodiment, a first substrate 10 as an element substrate and a second substrate 20 that functions as both a sealing substrate and a color filter layer substrate are provided. In the first substrate 10, the second substrate 20 is disposed so as to overlap the surface side on which the plurality of organic EL elements 80 are formed.

  Here, the first substrate 10 and the second substrate 20 are bonded together by the first sealing material layer 91 and the second sealing material layer 92. Although the detailed configuration of the first sealing material layer 91 and the second sealing material layer 92 will be described later, the first sealing material layer 91 is shown by a region where dots are densely attached in FIG. A frame is formed along a peripheral region 10c surrounding the pixel region 10a. On the other hand, the second sealing material layer 92 is formed over the entire area surrounded by the first sealing material layer 91, as shown by the area where dots are sparsely attached in FIG. Yes.

  In the first substrate 10, a terminal 102 is formed in an overhanging region from the second substrate 20. In the first substrate 10, the data line driving circuit 101 and the scanning line driving circuit 104 described with reference to FIG. 1 are used by using the peripheral region 10 c or a region sandwiched between the pixel region 10 a and the peripheral region 10 c. (Not shown) is formed.

(Configuration of organic EL element)
FIG. 3 is a cross-sectional view schematically showing a cross-sectional configuration of an organic EL device to which the present invention is applied. FIG. 3 shows only three organic EL elements corresponding to red (R), green (G), and blue (B) as organic EL elements.

  As shown in FIG. 3, the first substrate 10 includes a support substrate 10d made of a quartz substrate, a glass substrate, a ceramic substrate, a metal substrate, or the like. Insulating films 11, 12, 13, 14, and 15 are formed on the surface of the support substrate 10 d, and an organic EL element 80 is formed on the insulating film 15. In this embodiment, the insulating films 11, 12, 13, and 15 are formed of a silicon oxide film, a silicon nitride film, or the like, and the insulating film 14 is a flat film made of a thick photosensitive resin having a thickness of 1.5 to 2.0 μm. It is formed as a chemical film. The insulating film 11 is a base insulating layer, and although not shown, the thin film transistors 30b and 30c, the storage capacitor 70, and the like described with reference to FIG. 1 using the layers of the insulating films 11, 12, 13, and 14 are used. Various wirings and driving circuits are formed. In addition, the conductive films formed between different layers are electrically connected to each other by using the contact holes formed in the insulating films 12, 13, 14, and 15.

  The organic EL device 100 of the present embodiment is a top emission type, and, as indicated by an arrow L1, light is extracted from the side where the organic EL element 80 is formed as viewed from the support substrate 10d. Opaque substrates such as ceramics, stainless steel, etc. can be used. In addition, a light reflection layer 41 made of aluminum, silver, or an alloy thereof is formed between the insulating films 14 and 15, and light emitted from the organic EL element 80 toward the support substrate 10d is reflected on the light reflection layer. By reflecting at 41, light can be emitted. When the organic EL device 100 is configured as a bottom emission type, light is extracted from the support substrate 10d side, and therefore a transparent substrate such as glass is used as the support substrate 10d.

  In the first substrate 10, a first electrode layer 81 (anode / pixel electrode) made of an ITO film or the like is formed in an island shape on the insulating film 15, and a light emitting region is formed on the upper layer of the first electrode layer 81. A thick partition wall 51 made of a photosensitive resin or the like having an opening for defining is formed.

  An organic functional layer 82 and a second electrode layer 83 (cathode) are laminated on the upper layer of the first electrode layer 81, and the organic EL element is formed by the first electrode layer 81, the organic functional layer 82, and the second electrode layer 83. 80 is formed. In this embodiment, the organic functional layer 82 and the second electrode layer 83 are formed over the entire surface of the pixel region 10a including the region where the partition walls 51 are formed.

In this embodiment, the organic functional layer 82 includes a hole injection layer made of a triarylamine (ATP) multimer, a TPD (triphenyldiamine) -based hole transport layer, an styrylamine-based material containing an anthracene-based dopant or a rubrene-based dopant. A light emitting layer made of (host) and an electron injection layer made of aluminum quinolinol (Alq ₃ ) are laminated in this order, and a second electrode layer 83 made of a thin film metal such as MgAg is formed thereon. Yes. In addition, an electron injection buffer layer made of LiF may be formed between the organic functional layer 82 and the second electrode layer 83. Among these materials, each layer constituting the organic functional layer 82 and the electron injection buffer layer can be sequentially formed by a vacuum evaporation method using a heating boat (crucible). Further, the metal material constituting the second electrode layer 83 and the like can be formed by a vacuum deposition method, and the oxide material such as ITO constituting the first electrode layer 81 can be formed by an ECR plasma sputtering method or a plasma gun type ion plating. It can be formed by a high-density plasma film forming method such as a method or a magnetron sputtering method.

  In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B). For this reason, in the organic EL device 100, the red (R), green (G), and blue (B) color filter layers 22 (R) formed on the second substrate 20 at positions facing the organic EL element 80 ( Full color display is performed by performing color conversion according to G) and (B). That is, the second substrate 20 has a transparent support substrate 20d made of a plastic substrate such as polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, or a glass substrate, and red (R), green (G), blue (B ) Color filter layer 22 (R), (G), (B), color filter layer 22 (R), (G), light shielding layer 23 (black matrix for preventing leakage of light) between (B) Layer), a light-transmitting planarizing film 24, a light-transmitting gas barrier layer 25 made of a silicon oxynitride layer, and the like are formed in this order. In this embodiment, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the planarizing film 24, and the gas barrier layer 25 are formed only in the pixel region 10 a of the second substrate 20, and the peripheral region It is not formed in 10c. For this reason, the support substrate 20d is exposed in the peripheral region 10c of the second substrate 20.

  The color filter layers 22 (R), (G), and (B) are layers in which pigments or dyes are mixed in a transparent resin binder, and red (R), green (G), and blue (B) are used. However, light blue, light cyan, white, etc. may be added depending on the purpose. The thickness of the color filter layers 22 (R), (G), and (B) is preferably as thin as possible in consideration of the light transmittance, and is formed in a range of 0.1 to 1.5 μm. It may be different depending on the corresponding color. The light shielding layer 23 is made of a resin containing a black pigment, and the thickness thereof is thicker than the color filter layers 22 (R), (G), and (B), and a film thickness of about 1 to 2 μm is preferable. The above film thickness may be sufficient. The second substrate 20 may be provided with a functional layer such as an ultraviolet blocking / absorbing layer that prevents the incidence of ultraviolet rays, a light reflection preventing layer, or a heat dissipation layer.

When such a configuration is adopted, the distance d between the color filter layers 22 (R), (G), and (B) and the organic functional layer 82, the color filter layer 22 from the viewpoint of realizing high definition and preventing color mixing. The refractive index n of the material interposed between (R), (G), (B) and the organic functional layer 82 and the distance s between the adjacent color filter layers 22 (R), (G), (B). Is the following relationship (n × s) / √ (d ² + s ² ) ≧ 1
It is preferable to satisfy. That is, it is preferable that the distance d between the color filter layers 22 (R), (G), and (B) and the organic functional layer 82 is short, and therefore the gap between the first substrate 10 and the second substrate 20 is narrower. Is preferred.

(Sealing structure)
In the organic EL device 100 configured as described above, the organic functional layer 82, the second electrode layer 83 used as the cathode, the electron injection layer, and the like are easily deteriorated by moisture, and such deterioration causes deterioration of the electron injection effect. , A non-light-emitting portion called a dark spot is generated. Therefore, in this embodiment, the configuration in which the second substrate 20 is used as a sealing substrate and the first substrate 10 are bonded together and the configuration in which the sealing film 60 described below is formed on the first substrate 10 are used in combination.

First, the sealing film 60 is formed on the first substrate 10 over the second electrode layer 83 over a region wider than the pixel region 10a. As the sealing film 60, in this embodiment, a first film 61 made of a silicon compound layer laminated on the second electrode layer 83, a second film 62 made of a resin layer laminated on the first film 61, In addition, a laminated film including a third film 63 made of a silicon compound laminated on the second film 62 is used. The first film 61 and the third film 63 are formed by a high-density plasma vapor deposition method using a high-density plasma source, for example, plasma gun type ion plating, ECR plasma sputtering, ECR plasma CVD, surface wave plasma CVD, ICP-CVD. It is composed of silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), etc. that are deposited using such a method, and such a thin film has a high density that reliably blocks moisture even when deposited at low temperatures. Functions as a gas barrier layer. The second layer 62 is composed of a resin layer, and serves as an organic buffer layer that flattens surface irregularities caused by the partition walls 51 and wirings and prevents cracks in the first film 61 and the second film 62. It is functioning.

  In this embodiment, the first film 61 and the third film 63 (high-density gas barrier layer) constituting the sealing film 60 are formed in the pixel region 10a, the vicinity region of the pixel region 10a, and the peripheral region 10c far from the pixel region 10a. It is formed on the entire surface of the first substrate 10 including all. On the other hand, the second layer 62 (organic buffer layer) is formed thick only in the pixel region 10a and a region near the pixel region 10a, and is not formed in the peripheral region 10c far from the pixel region 10a. The insulating films 14 and 15 are generally formed only in the pixel region 10a.

  Next, in this embodiment, as shown in FIGS. 2A, 2 </ b> B, and 3, between the first substrate 10 and the second substrate 20, the first sealing material layer is formed along the peripheral region 10 c. 91 is formed in a rectangular frame shape, and a translucent second sealing material layer 92 is formed over the entire region surrounded by the peripheral region 10c, and the first substrate 10 and the second substrate 20 are formed of the first substrate 10 and the second substrate 20, respectively. The sealing material layer 91 and the second sealing material layer 92 are bonded together.

  In this embodiment, an epoxy adhesive that is cured by ultraviolet rays is used for the first sealing material layer 91 (first sealing material 91a), and the epoxy adhesive preferably has an epoxy group and a molecular weight of 3000 or less. Epoxy monomer / oligomer (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000) is used. More specifically, the first sealing material layer 91 includes, for example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, 3,4-epoxycyclohexenylmethyl-3 ′, 4′- Epoxycyclohexenecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarboxylate, etc. are used alone or in combination. In addition, as a curing agent that reacts with epoxy monomer / oligomer, photoreactive type that causes cationic polymerization reaction such as diazonium salt, diphenyliodonium salt, triphenylsulfonium salt, sulfonate ester, iron arene complex, silanol / aluminum complex, etc. An initiator is added, and a cationic polymerization reaction is caused mainly by ultraviolet irradiation.

  The second sealing material layer 92 (second sealing material 92a) is interposed between the first substrate 10 and the second substrate 20, and is shaped like a bead that controls the substrate distance between the first substrate 10 and the second substrate 20. The fiber-shaped gap material 95 is dispersed in the resin 96, and the gap between the first substrate 10 and the second substrate 20 is controlled by the gap material 95.

  In the second sealing material layer 92, an epoxy adhesive that is cured by heat is used for the resin 96. As a raw material main component of such an epoxy-based adhesive, it is necessary to be an organic compound material that is excellent in fluidity and does not have a volatile component such as a solvent, and preferably an epoxy monooligomer having an epoxy group and a molecular weight of 3000 or less. Preferred are epoxy monomers having a molecular weight of 1000 or less. For example, the second sealing material layer 92 may be formed by using a hard bisphenol A type epoxy monomer, a bisphenol F type epoxy monomer, a novolac type phenol epoxy monomer, 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexene carboxy. Rate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, etc. may be used alone or in combination. Further, as the curing agent that reacts with the epoxy monomer, an addition polymerization type that forms a tough and excellent heat-resistant cured film is good, and amines such as aromatic amine, diethylenetriamine, triethylenetetramine, and polyetherdiamine, Methyl-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzenetetracarboxylic dianhydride, 3,3 ', 4,4'-benzophenone tetracarboxylic dianhydride, etc. An acid anhydride type hardening | curing agent, dicyandiamide, etc. are mentioned. These are mixed with a reaction initiator such as aromatic amino alcohol, alcohol, mercaptan, tertiary amine catalyst or silane coupling agent.

(Production method)
With reference to FIG. 4 and FIG. 5, the manufacturing method of the organic electroluminescent apparatus 100 of this form is demonstrated. 4 and FIG. 5 show the first substrate 10 and the second substrate 20 after the organic EL element 80 and the sealing film 60 are formed on the first substrate 10 in the manufacturing process of the organic EL device 100 of this embodiment. It is process sectional drawing which shows the mode until just before bonding, and explanatory drawing which shows typically a mode that this process is performed in the state of a large sized substrate.

  In manufacturing the organic EL device 100 of the present embodiment, in addition to a method of bonding the first substrate 10 and the second substrate 20 in a single product size, a large size capable of taking a large number of the first substrate 10 and the second substrate 20. In some cases, the substrates are bonded together and then a large substrate is cut into a single size. Since any one of these methods is adopted, the basic configuration is the same, and therefore, with reference to FIG. 4, the manner in which the first substrate 10 and the second substrate 20 having a single product size are bonded together is mainly described. A method for bonding substrates together with a large substrate will also be described with reference to FIG.

  First, as shown in FIG. 4A, after forming the organic EL element 80 and the sealing layer 60 on the first substrate 10, in the first sealing material application step shown in FIG. The gap material 95 is dispersed in the resin 96 made of the above-described photo-curable epoxy resin material with respect to the peripheral region 10c of the first substrate 10 by a printing method, an inkjet method using a micro piezo head, or the like. The sealing material 91a is applied to a narrow width dimension of 1 mm or less. Here, from the viewpoint of applying the first sealing material 91a to a narrow width dimension of 1 mm or less, the viscosity at the time of applying the first sealing material 91a is preferably 100,000 mPa · s or more at room temperature. In addition, when the first sealing material 91a contains moisture, bubbles are generated and the strength is reduced. Therefore, the moisture content is preferably dehydrated to 0.1 wt% (1000 ppm) or less.

  When this process is performed in the state of a large substrate, as shown in FIG. 5A, along a scribe line (not shown) when cutting out the single substrate 1 of the large substrate 10x. The first sealing material 91a is applied.

  Next, in the second sealing material application step shown in FIG. 4C, the first sealing material 91a is surrounded by the first substrate 10 by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. The second sealing material 92a made of the above-described thermosetting epoxy resin material is applied in the region. The second sealing material 92a is applied in a pattern such as a solid shape, a dot shape, or a stripe shape. The viscosity at the time of application of the second sealing material 92a is preferably 2000 mPa · s or less from the viewpoint of increasing the filling property with a thin film. Since the second sealing material 92a is also susceptible to curing inhibition if it contains a large amount of water, bubbles are generated when the second sealing material 92a contains water as well as the first sealing material 91a. In order to reduce the strength, the water content is preferably dehydrated to 0.1 wt% (1000 ppm) or less. In addition, if a curing accelerator that promotes ring opening of acid anhydride or a photoreactive initiator that causes a cationic polymerization reaction is added to the second sealing material 92a, curing can be performed at a low temperature in a short time. It becomes.

  When this process is performed in the state of a large substrate, as shown in FIG. 5B, the second seal material 92a is applied in the region surrounded by the first seal material 91a in the large substrate 10x.

  When the second sealing material application step is performed, the application amount (volume) of the second sealing material 92a is determined after the sealing material solidifying step is performed as shown in FIGS. The volume is set to an amount corresponding to the product of the volume of the space surrounded by the two substrates 20 and the first sealing material 91 and the volume shrinkage rate when the second sealing material 92a is cured.

  Next, in the overlapping process, as shown in FIG. 2B and FIG. 3, the first sealing material 91a and the second sealing material 92a are sandwiched between the first sealing material 91a and the first sealing material 92a in a reduced pressure atmosphere with a degree of vacuum of about 1 Pa. The substrate 10 and the second substrate 20 are overlaid while being aligned. At that time, the second substrate 20 is pressed toward the first substrate 10 with a force of about 600 N, and this state is maintained for about 200 seconds. In the superimposing step, first, the first sealing material 91a comes into contact with the second substrate 20 to seal the inside, and then the second sealing material 92a is developed between the first substrate 10 and the second substrate 20. .

  Next, when the pressure is returned to normal pressure, it becomes the same state as when pressurized by atmospheric pressure, so the second sealing material 92a expands to every corner between the first substrate 10 and the second substrate 20, The filling property of the second sealing material 92a is improved. In that case, the 1st sealing material 91a functions as a bank with respect to the 2nd sealing material 92a. For this reason, even when the pressure is restored from the reduced pressure state to the normal pressure, the second sealing material 92a is blocked by the first sealing material 91a and flows out to the outside even if the pressure is increased by the atmospheric pressure. do not do. A predetermined gap is ensured between the first substrate 10 and the second substrate 20 by the gap material 95 contained in the first sealing material 91a.

  Next, in the sealing material solidifying step, the first sealing material 91a is solidified to form the first sealing material layer 91, and the second sealing material 92a is solidified to form the second sealing material layer 92. Here, a thermoplastic resin can be used as the first sealing material 91a and / or the second sealing material 92a. However, in the present embodiment, the first sealing material 91a is photocurable, and the second sealing material 92a is It is thermosetting.

Therefore, in this embodiment, the first sealing material 91a is irradiated with ultraviolet rays having a light amount of about 2000 mJ / cm ² at a power of about 30 mW / cm ² from the first substrate 10 or / and the second substrate 20 side. Only the first sealing material 91 a is selectively cured to form the first sealing material layer 91. Next, in a state where the first substrate 10 and the second substrate 20 bonded together by the first sealing material layer 91 are arranged on a hot plate, a temperature condition where the organic EL element 80 is not deteriorated, for example, a temperature condition of 100 ° C. or less. More specifically, heating is performed under a temperature condition of 60 to 100 ° C., and the second sealing material 92a is cured while spreading the second sealing material 92a to every corner between the first substrate 10 and the second substrate 20. The second sealing material layer 92 is formed. In this way, the first substrate 10 and the second substrate 20 are bonded to each other by the first sealing material layer 91 and the second sealing material layer 92 (bonding step).

  By performing such steps, the organic EL device 100 is obtained. When the above process is performed on a large substrate, the large substrate is cut to obtain a single-size organic EL device 100. In the organic EL device 100 configured as described above, since the second sealing material layer 92 is cured, convection does not occur when left at a high temperature, so that the third layer 63 of the sealing film 60 is not damaged, and the second sealing material layer 92 is not damaged. The two sealing material layers 92 function as a protective film for the third layer 63 of the sealing film 60. Here, the thickness of the second sealing material layer 92 is 1 to 5 μm, and it is preferable that the second sealing material layer 92 is thinner as the pixel becomes higher in definition. In addition, fillers such as clay minerals, silica balls, and resin balls that are contained in a large amount in general adhesives cause damage to the third layer 63 of the sealing film 60, and thus the first sealing material 91 a. It is preferable that such a filler is not blended in the second sealing material 92a. In particular, the second sealing material 92a is in contact with the sealing film 60, and considering the light transmittance, the filler is blended. Preferably not.

(Main effects of this form)
As described above, in the organic EL device 100 according to the present embodiment, the first substrate 10 and the second substrate 20 include the frame-shaped first sealing material layer 91 formed in the peripheral region 10c and the first sealing material. The organic EL element 80 and the like formed on the first substrate 10 are protected from moisture entering from the outside because they are bonded together by the second sealing material layer 92 formed on the entire region surrounded by the layer 91. can do.

  In addition, since the first sealing material layer 91 includes a gap material 95 that controls the distance between the first substrate 10 and the second substrate 20, the gap between the first substrate 10 and the second substrate 20 is controlled. can do. For this reason, since the first substrate 10 and the second substrate 20 do not contact each other, the film formed in the pixel region 10a of the first substrate 10 is not damaged. Further, since the gap material 95 is included in the first sealing material layer 91 formed in the peripheral region 10 c, it does not contact the pixel region 10 a of the first substrate 10. The formed film is not damaged.

  In this embodiment, a color image can be displayed using the color filter layers 22 (R), (G), and (B) formed on the second substrate 20. Moreover, the gap between the first substrate 10 and the second substrate 20 is controlled by the gap material 95 contained in the first sealing material layer 91, and the first substrate 10 and the second substrate 20 are reliably prevented from coming into contact with each other. Therefore, the gap between the first substrate 10 and the second substrate 20 can be narrowed. Accordingly, it is possible to achieve high definition and prevention of color mixing when performing color display using the color filter layers 22 (R), (G), and (B) formed on the second substrate 20. .

  Further, in the first substrate 10, since the sealing film 60 is formed on the second electrode layer 83 in the pixel region 10a, the organic EL element 80 and the like formed on the first substrate 10 are externally connected. It is possible to reliably protect from moisture that has entered from the inside. In addition, since the gap between the first substrate 10 and the second substrate 20 is controlled by the gap material 95 contained in the first sealing material layer 91, the second substrate 20 contacts the sealing film 60, and Since the gap material 95 does not contact the sealing film 60, the sealing film 60 is not damaged even if the first substrate 10 and the second substrate 20 are bonded together.

  Moreover, in the manufacturing method of the organic EL device 100 of the present embodiment, the substrates are stacked so that the first sealing material 91a and the second sealing material 92a are sandwiched in the overlapping step, and the second sealing material 92a is disposed between the substrates. The second sealing material 92a is dammed by the first sealing material 91a while being expanded. Therefore, the first substrate 10 and the second substrate 20 are formed on the entire frame-shaped first sealing material layer 91 formed in the peripheral region 10c and the region surrounded by the first sealing material layer 91. In addition, a structure bonded with the second sealing material layer 92 can be realized. Further, in realizing such a structure, the first sealing material 91a and the second sealing material 92a are continuously applied, and then the first sealing material 91a and the second sealing material 92a are solidified. Productivity can be improved.

  Moreover, since the 1st sealing material 91a has a viscosity higher than the 2nd sealing material 92a, when the 1st sealing material 91a is apply | coated, it can also prevent that the 1st sealing material 91a flows out outside. Further, in the overlapping step, the second sealing material 92a presses the first sealing material 91a outward, but the second sealing material 92a pushes the first sealing material 91a because the viscosity of the first sealing material 91a is high. The second sealing material 92a can be prevented from flowing out without breaking through. Further, since the second sealing material 92a has a low viscosity, the second sealing material 92a can be filled over the entire region surrounded by the first sealing material 91a.

  Furthermore, since the overlapping process is performed in a reduced-pressure atmosphere, it is possible to prevent bubbles from being mixed between the first substrate 10 and the second substrate 20. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure. Therefore, the second sealing material 92a reaches every corner between the first substrate 10 and the second substrate 20, and the second The filling property of the two sealing materials 92a is improved.

  Furthermore, since the first sealing material 91a is photocurable and the second sealing material 92a is thermosetting, the first sealing material 91a and the second sealing material 92a can be cured in a predetermined order, After only the first sealing material 91a is cured, the second sealing material 92a can be cured. Therefore, even if a viscoelastic change occurs when the second sealing material 92a is cured, the first substrate 10 and the second substrate 20 are bonded to each other by the first sealing material layer 91. No positional deviation occurs between the two substrates 20. In the pixel region 10a, various light-shielding films are formed on the first substrate 10 and the second substrate 20. Even in such a case, since the second sealant 92a is thermosetting, the pixel region The second sealing material 92a formed in 10a can be reliably cured.

  Furthermore, when performing the second sealing material application step, the amount of application of the second sealing material 92a is the volume of the space surrounded by the first substrate 10, the second substrate 20, and the first sealing material 91a, and the second amount. Since the amount corresponding to the product of the volumetric shrinkage rate when the sealing material 92a is cured is set, the second sealing material 92a is not applied excessively. Therefore, in the overlapping process, the second sealing material 92a does not press the first sealing material 91a outward with an excessive force. Therefore, the second sealing material 92a does not break through the first sealing material 91a, and the second sealing material 92a can be prevented from flowing out.

(Another manufacturing method)
FIG. 6 shows the manufacturing process of the organic EL device 100 to which the present invention is applied. After forming the color filter layers 22 (R), (G), (B), etc. on the second substrate 20, 5 is a process cross-sectional view showing a state until immediately before bonding with the second substrate 20; FIG. Since the basic configuration of this embodiment is the same as that of Embodiment 1, portions having common functions are denoted by the same reference numerals and description thereof is omitted. Further, in manufacturing the organic EL device 100 of the present embodiment, a bonding process or the like is performed in a state of a large substrate that can take a large number of the first substrate 10 and the second substrate 20, and then the large substrate is reduced to a single product size. As for the explanation when the cutting method is adopted, FIG. 5 is referred to as in the first embodiment. In FIG. 6, the second substrate 20 is shown upside down with respect to the state shown in FIG.

  In the method described with reference to FIG. 4, the first sealing material 91a and the second sealing material 92a are applied to the first substrate 10, but in this embodiment, as shown in FIG. After forming the color filter layers 22 (R), (G), (B) and the like on the support substrate 20 d of the substrate 20, in the first sealing material application process shown in FIG. 6B, dispenser drawing, screen printing method, A narrow width of 1 mm or less of the first sealing material 91a made of the photo-curable epoxy resin material described in the first embodiment with respect to the peripheral region 10c of the second substrate 20 by an inkjet method using a micropiezo head or the like. Apply to dimensions. When this process is performed in the state of a large substrate, as shown in FIG. 5A, along a scribe line (not shown) when cutting out the single-sized second substrate 20 out of the large substrate 20x. A second sealing material 92a is applied.

  Next, in the second sealing material application step shown in FIG. 6C, the second substrate 20 is surrounded by the first sealing material 91a by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. In the region, the second sealing material 92a made of the thermosetting epoxy resin material described above is applied in a predetermined pattern such as a solid shape, a dot shape, or a stripe shape. When this process is performed in the state of a large substrate, as shown in FIG. 5B, the second sealing material 92a is applied to the region surrounded by the first sealing material 91a in the large substrate 20x.

  As in the method described above, the subsequent steps are performed in a superposition step in a reduced pressure atmosphere with a degree of vacuum of about 1 Pa, as shown in FIG. 2B, as shown in FIG. 2B. The first substrate 10 and the second substrate 20 are overlapped with each other therebetween. At that time, the first substrate 10 is pressurized toward the second substrate 20, and this state is maintained for about 200 seconds. In the superposition process, first, the first sealing material 91a contacts the first substrate 10 to seal the inside, and then the second sealing material 92a is developed between the first substrate 10 and the second substrate 20. . Next, when the pressure is returned to normal pressure, it becomes the same state as when pressurized by atmospheric pressure, so the second sealing material 92a expands to every corner between the first substrate 10 and the second substrate 20, The filling property of the second sealing material 92a is improved. In that case, the 1st sealing material 91a functions as a bank with respect to the 2nd sealing material 92a. Next, in the sealing material solidifying step, the first sealing material 91a is selectively cured by irradiating the first sealing material 91a with ultraviolet rays from the first substrate 10 and / or the second substrate 20 side, A first sealing material layer 91 is formed. Next, heating is performed in a state where the first substrate 10 and the second substrate 20 bonded together by the first sealing material layer 91 are arranged on a hot plate, and the first substrate 10 and the second substrate 20 are heated between the first substrate 10 and the second substrate 20. The second sealing material 92a is cured while spreading the two sealing materials 92a to every corner, and the second sealing material layer 92 is formed. Thus, the 1st board | substrate 10 and the 2nd board | substrate 20 are bonded together by the 1st sealing material layer 91 and the 2nd sealing material layer 92, and the organic EL apparatus 100 is obtained.

[Other embodiments]
In the above embodiment, the case where the color filter layers 22 (R), (G), and (B) are provided on the second substrate 20 in the top emission type organic EL device 100 has been described as an example. However, the organic EL element itself However, the present invention may be applied to an organic EL device that emits light of each color. In this case, the second substrate 20 functions only as a sealing substrate.

  In the above embodiment, the organic EL device 100 for color display has been described as an example. However, when used as an optical head of a copying machine, monochrome may be used, and such a monochrome organic EL device may be used. The present invention may be applied. Also in this case, the second substrate 20 functions only as a sealing substrate.

  Furthermore, in the above embodiment, the top emission type organic EL device 100 has been described as an example. However, the present invention may be applied to a bottom emission type organic EL device. In this case, the second substrate 20 is sealed. It functions as a substrate only.

  In the above embodiment, the example in which the organic functional layer 82 is formed on the entire surface of the pixel region 10a has been described. However, after the organic functional layer is selectively applied to the region surrounded by the partition wall 51 by an inkjet method or the like, the fixing is performed. As a result, an upper layer of the first electrode layer 81 was formed with a hole injection layer made of 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like, and an organic functional layer made of a light emitting layer. The invention may be applied to an organic EL device. In this case, the light emitting layer is made of, for example, a polyfluorene derivative, a polyphenylene derivative, a polyvinyl carbazole, a polythiophene derivative, or a polymer material thereof, a perylene dye, a coumarin dye, a rhodamine dye, for example, rubrene, perylene, 9,10. -It is composed of a material doped with diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. Further, as the light emitting layer, a π-conjugated polymer material in which double-bonded π electrons are non-polarized on the polymer chain is also a conductive polymer, so that it is excellent in light emitting performance, and thus is preferably used. . In particular, a compound having a fluorene skeleton in the molecule, that is, a polyfluorene compound is more preferably used. In addition to such materials, it is also possible to use a composition comprising a conjugated polymer organic compound precursor and at least one fluorescent dye for changing light emission characteristics.

[Example of mounting on electronic equipment]
With reference to FIG. 7, an electronic apparatus in which the organic EL device 100 according to the above-described embodiment is mounted will be described. FIG. 7 is an explanatory diagram of an electronic apparatus using the organic EL device according to the present invention.

  FIG. 7A shows the configuration of a mobile personal computer provided with the organic EL device 100. The personal computer 2000 includes an organic EL device 100 as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 7B shows a configuration of a mobile phone provided with the organic EL device 100. The cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the organic EL device 100 as a display unit. By operating the scroll button 3002, the screen displayed on the organic EL device 100 is scrolled. FIG. 7C shows the configuration of a personal digital assistant (PDA) to which the organic EL device 100 is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the organic EL device 100 as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the organic EL device 100. Electronic devices to which the organic EL device 100 is applied include those shown in FIGS. 7A to 7C, a digital still camera, a liquid crystal television, a viewfinder type, a monitor direct view type video tape recorder, a car navigation system. Examples thereof include a device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel. And the organic electroluminescent apparatus 100 mentioned above is applicable as a display part of these various electronic devices.

1 is an equivalent circuit diagram showing an electrical configuration of an organic EL device to which the present invention is applied. (A), (b) is the top view which looked at the planar structure of the organic electroluminescent apparatus to which this invention was applied from the 2nd board | substrate side with each component, respectively, and its JJ 'sectional drawing. It is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus to which this invention is applied. Process sectional drawing which shows a mode until it just before bonding a 1st board | substrate and a 2nd board | substrate after forming an organic EL element and a sealing film in a 1st board | substrate among the manufacturing processes of the organic EL apparatus to which this invention is applied. It is. It is explanatory drawing which shows typically a mode that a bonding process is performed in the state of a large sized board | substrate among the manufacturing processes of the organic electroluminescent apparatus to which this invention is applied. It is process sectional drawing which shows a mode until just before bonding a 1st board | substrate and a 2nd board | substrate after forming a color filter layer etc. in a 2nd board | substrate among the manufacturing processes of the organic electroluminescent apparatus to which this invention is applied. It is explanatory drawing of the electronic device using the organic EL apparatus which concerns on this invention. It is explanatory drawing which shows the problem of the organic electroluminescent apparatus which concerns on the reference example of this invention.

Explanation of symbols

10..First substrate, 10a..Pixel region, 10c..Peripheral region, 20..Second substrate, 22 (R), (G), (B) .. Color filter layer, 80..Organic EL element 81 .. First electrode layer, 82 .. Organic functional layer, 83 .. Second electrode layer, 91 .. First sealing material layer, 91a ... First sealing material, 92 ... Second sealing material layer, 92a ... Second seal material, 95 ... Gap material, 96 ... Resin, 100 ... Organic EL device, 100a ... Pixel

Claims (9)

A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate An organic electroluminescence device having a second substrate overlaid on
The first substrate and the second substrate are formed in a frame-shaped first sealing material layer formed in a peripheral region surrounding the pixel region and the entire region surrounded by the first sealing material layer. Bonded with the second sealing material layer,
The first sealing material layer includes a gap material that is interposed between the first substrate and the second substrate and controls a distance between the first substrate and the second substrate. Organic electroluminescence device. The second substrate and the second sealing material layer are translucent,
2. The organic electroluminescence device according to claim 1, wherein a color filter layer of a different color is formed in each region facing the plurality of organic electroluminescence elements on the second substrate.   3. The organic electroluminescence device according to claim 1, wherein a sealing film is formed in an upper layer of the second electrode layer in at least the pixel region of the first substrate. A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate In the manufacturing method of the organic electroluminescence device having the second substrate stacked on
The first substrate and the second substrate are interposed between the first substrate and the second substrate with respect to a peripheral region surrounding the pixel region on the outer peripheral side in the first substrate and / or the second substrate. A first sealing material application step of applying a first sealing material containing a gap material for controlling the distance between the substrate and the substrate;
A second sealing material application step of applying a second sealing material in a region surrounded by the first sealing material in the first substrate or / and the second substrate;
An overlapping step of overlapping the first substrate and the second substrate with the first sealing material and the second sealing material interposed therebetween;
A sealing material solidifying step of solidifying the first sealing material to form a first sealing material layer and solidifying the second sealing material to form a second sealing material layer;
The manufacturing method of the organic electroluminescent apparatus characterized by having.   In the overlapping step, the first substrate and the second substrate are overlapped so that one of the first substrate and the second substrate is pressed against the other in a reduced-pressure atmosphere, and the second sealing material is attached to the first sealing material. 5. The method of manufacturing an organic electroluminescence device according to claim 4, wherein the organic electroluminescence device is developed between one substrate and the second substrate.   The method of manufacturing an organic electroluminescence device according to claim 4, wherein the first sealing material has a higher viscosity than the second sealing material.   The method of manufacturing an organic electroluminescence device according to claim 4, wherein the first sealing material is photocurable and the second sealing material is thermosetting.   8. The method of manufacturing an organic electroluminescence device according to claim 7, wherein, in the sealing material solidifying step, the second sealing material is solidified after the first sealing material is solidified.   In the second sealing material application step, the amount of the second sealing material applied is a space surrounded by the first substrate, the second substrate, and the first sealing material layer after the sealing material solidification step. The organic electroluminescence device according to any one of claims 4 to 8, wherein the organic electroluminescence device is set to an amount corresponding to a product of a volume of the second volume and a volume contraction rate when the second sealing material is solidified. Manufacturing method.

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