JP2009146734A - Organic electroluminescence device and manufacturing method thereof - Google Patents

Abstract

When a first substrate and a second substrate are bonded together by a first sealing material applied in a frame shape to a peripheral region and a second sealing material filled in a region surrounded by the first sealing material, To provide an organic EL device in which bubbles do not remain in a region surrounded by a first sealing material, and a manufacturing method thereof.
In manufacturing an organic EL device 100, a first sealing material application step of applying an ultraviolet curable first sealing material 91a with a discontinuous portion 91s along a peripheral region 10c of a first substrate 10; A first sealing material application step in which a thermosetting second sealing material 92a is applied in a region surrounded by the first sealing material 91a, and the first sealing material 91a and the second sealing material 92a are sandwiched therebetween. An overlapping process for overlapping the substrate 10 and the second substrate 20 and a sealing material curing process for curing the first sealing material 91a and the second sealing material 92a are performed.
[Selection] Figure 3

Description

  The present invention relates to an organic electroluminescence (hereinafter referred to as organic EL) device and a method for manufacturing the same.

  The organic EL device includes an organic EL element on which a positive electrode, an organic functional layer, and a cathode are stacked on a substrate. For the purpose of enhancing the electron injection effect at a low voltage, between the light emitting functional layer and the cathode, In some cases, an electron injection layer mainly composed of an alkali metal or an alkaline earth metal is disposed. Since the organic functional layer, the cathode, and the electron injection layer used in such an organic EL element are very active, they easily react with moisture present in the atmosphere and are easily altered. When such alteration occurs, the electron injection effect is impaired, and a non-light emitting portion called a dark spot is generated.

  Therefore, conventionally, the side plate part of a lid-like cover made of glass or the like that blocks moisture is attached to the substrate with an adhesive to form a hollow structure, and a desiccant is placed in the hollow part to penetrate moisture from the adhesive cross section. Has been proposed for a structure that does not reach the organic EL element by being trapped with a desiccant (see Patent Document 1).

In addition, after applying UV curable resin in a frame shape to the peripheral area of the sealing substrate, silicon oil is filled in the area surrounded by the UV curable resin in vacuum, and then an organic EL element is formed. There has also been proposed a technique in which a substrate and a sealing substrate are superposed in a vacuum and then the substrates are bonded together by curing a UV curable resin (see Patent Document 2).
Japanese Patent Laid-Open No. 2003-2231992 JP 2003-173868 A

  However, as disclosed in Patent Document 1, the structure in which the side plate portion of the lid-like cover is attached to the substrate with an adhesive and the desiccant is disposed in the hollow portion has significant problems in terms of strength and cost. In addition, as disclosed in Patent Document 2, in a method in which silicon oil is filled in a region surrounded by a frame-shaped UV curable resin and then the substrate is overlapped, the region surrounded by the UV curable resin In some cases, air bubbles may remain in the inside, and such air bubbles may cause the UV curable resin or a film formed in the pixel region to be pressed and damaged. In particular, even when the substrates are superposed in a vacuum to prevent the mixing of bubbles, the slightly mixed bubbles expand when returned to atmospheric pressure, causing damage to the UV curable resin and the film.

  Here, when bonding the two substrates, as shown in FIG. 9A, the inventor of the present application applied the first sealing material 91a in a frame shape to the peripheral region of the substrate, and then the first sealing material 91a. Next, as shown in FIG. 9B, the second sealing material 92a is applied between the substrates by overlapping the substrates, as shown in FIG. 9B. Then, after the first sealing material 91a and the second sealing material 92a are cured and the substrates are bonded together, it is proposed to cut the substrate shown in FIG. 9C into a predetermined size.

  However, even when such a configuration is adopted, as in the configuration disclosed in Patent Document 2, as shown in FIGS. 9B and 9C, bubbles 99 remain in the region surrounded by the first sealing material 91a. Such a bubble 99 faces a problem of pressing and damaging the first sealing material 91a and a film formed in the pixel region. In particular, as shown in FIG. 9D, the organic EL element 80 is formed by forming a sealing layer 60 on the surface of the organic EL element 80 including the first electrode layer 81, the organic functional layer 82, and the second electrode layer 83. In the case of adopting a structure that protects against moisture, the sealing layer 60 is formed over a wide area including the pixel region 10a, and thus easily contacts with the bubbles 99. Therefore, the sealing layer 60 is pressed by the bubbles 99 and is damaged. There is a high risk of doing so.

  The configuration shown in FIG. 9 is a reference example devised by the inventor of the present application so that the feature points of the present invention can be easily explained, and is different from the prior art.

  In view of such problems, an object of the present invention is to provide a first substrate by a first sealing material applied in a frame shape to a peripheral region and a second sealing material filled in a region surrounded by the first sealing material. An object of the present invention is to provide an organic EL device in which bubbles do not remain in a region surrounded by a first sealant and a method for manufacturing the same when bonding the substrate and the second substrate.

  In order to solve the above problems, in the present invention, a first substrate in which a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; An organic EL device having a second substrate overlaid on a surface side on which an organic EL element is formed, wherein the first substrate and the second substrate are formed along a peripheral region surrounding the pixel region. The frame-shaped first sealing material layer and the second sealing material layer formed over the entire region surrounded by the first sealing material layer are bonded together, and the first sealing material layer has an interrupted portion. It is formed.

  In the present invention, a plurality of organic EL elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region, and the organic EL element is formed on the first substrate. In the manufacturing method of the organic EL device having the second substrate bonded to the surface side, the one of the first substrate and the second substrate is bonded to the first substrate and the second substrate. A first sealing material application step for applying a first sealing material along a peripheral region surrounding the pixel region on the substrate, and a second seal for applying a second sealing material in the region surrounded by the first sealing material. A material applying step, an overlapping step of overlapping the first substrate and the second substrate so as to sandwich the first sealing material and the second sealing material, and a sealing material for curing the second sealing material Curing process, There, in the first sealing material application step, wherein the previously formed part broken in the first sealing member.

  In the present invention, when the two substrates are bonded, the first sealing material is applied in a frame shape to the peripheral region of the substrate, and then the second sealing material is applied to the region surrounded by the first sealing material. In addition, the second sealing material is spread between the substrates by overlapping the substrates, and in this state, the first sealing material is cured to bond the substrates together. Here, since the first sealing material has a discontinuous portion, when the second sealing material is spread between the substrates by overlapping the substrates, bubbles are mixed in the region surrounded by the first sealing material. Even so, the bubbles are discharged from the interrupted portion of the first sealing material. For this reason, in the state in which the two substrates are overlapped, no bubbles remain in the region a surrounded by the first sealing material, so the film formed on the first sealing material or the pixel region is pressed by the bubbles. The situation of being damaged can be avoided.

  In the present invention, the second substrate and the second sealing material layer are translucent, and a color filter layer of a different color is formed on each region facing the plurality of organic EL elements on the second substrate. It is preferable. If comprised in this way, while being able to radiate | emit white light and the mixed light of each color from each of several organic EL element, such light can be radiate | emitted through a color filter layer, A color image can be displayed. .

  In the present invention, it is preferable that a sealing film is formed on the first substrate over a region wider than the pixel region above the second electrode layer. If comprised in this way, an organic EL element can be reliably protected from a water | moisture content etc. with a sealing layer. In addition, since the sealing layer is formed over a wide region including the pixel region, if bubbles remain in the region surrounded by the first sealing material, the sealing layer may be damaged by being pressed by the bubbles. However, in the present invention, since such bubbles do not remain, the sealing layer is not damaged.

  In the present invention, it is preferable that the first sealing material layer is formed in a substantially rectangular frame shape, and the discontinuous portion is formed at least at a corner portion of the first sealing material layer. When the second sealing material is spread between the substrates by overlapping the substrates, bubbles tend to be pushed to the corners of the first sealing material and remain in the corners. If the interrupted portion is formed, the bubbles can be efficiently discharged from the region surrounded by the first sealing material, and the bubbles do not remain in the region surrounded by the first sealing material.

  In this invention, when the said 1st sealing material layer is formed in the substantially rectangular frame shape, you may employ | adopt the structure by which the said discontinuous part is formed in the edge part of the said 1st sealing material layer at least. Depending on the application pattern of the second sealing material, when the second sealing material is spread between the substrates by overlapping the substrates, bubbles may be pushed to the side portion of the first sealing material. If a discontinuous portion is formed in the side portion of one sealing material, bubbles can be efficiently discharged from the region surrounded by the first sealing material, and no bubbles remain in the region surrounded by the first sealing material.

  In the present invention, it is preferable that the first sealing material layer is made of a photocurable resin material and the second sealing material layer is made of a thermosetting resin material. That is, in the method for manufacturing an organic EL device to which the present invention is applied, it is preferable that the first sealing material is photocurable and the second sealing material is thermosetting. If comprised in this way, after apply | coating a 1st sealing material and a 2nd sealing material, only a 1st sealing material can be hardened. In the pixel region, various light-shielding films are often formed on the first substrate and the second substrate. In such a case, the second sealing material cannot be irradiated with sufficient light. For this reason, if a photocurable adhesive is used for the second sealing material, it cannot be sufficiently cured, but if the second sealing material is thermosetting, the second sealing material formed in the pixel region. Can be reliably cured.

  In the curing step, it is preferable that the first sealing material is cured before the second sealing material is cured. With this configuration, when the second sealing material is deployed between the substrates by overlapping the substrates, the first sealing material is broken through even if the second sealing material may press the first sealing material. There is nothing.

  In the present invention, the superposition process is preferably performed in a reduced pressure atmosphere. If comprised in this way, it can suppress that a bubble mixes between a 1st board | substrate and a 2nd board | substrate itself. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure, so that the second sealing material reaches every corner between the first substrate and the second substrate, and the second sealing material. The filling property of the is improved.

  In the present invention, the first sealing material preferably has a higher viscosity than the second sealing material. If comprised in this way, when the 1st sealing material is applied, it can prevent that the 1st sealing material flows out outside. Moreover, about the 2nd sealing material, it can be filled over the whole area | region enclosed with the 1st sealing material.

  In the present invention, it is preferable that a third sealing material is applied at a position overlapping at least the discontinuous portion in the inner and outer directions outside the first sealing material before the overlapping step. With this configuration, air bubbles can be prevented from remaining in the region surrounded by the first sealing material, and when the second sealing material flows out to the outside of the first sealing material, the outflow is caused by the third sealing material. Can be dammed up.

  In the present invention, it is preferable that the first sealing material and the third sealing material are made of the same material, and the third sealing material is applied in the first sealing material application step. With this configuration, the number of steps can be reduced, and thus productivity can be improved.

  In this invention, after performing the said sealing material hardening process, it is preferable to perform the material removal process which cut | disconnects said one board | substrate to predetermined size and removes the part in which the said 3rd sealing material is formed. If comprised in this way, the width dimension of the outer peripheral area | region which does not contribute directly to a display in an organic electroluminescent apparatus can be narrowed, and size reduction of an organic electroluminescent apparatus can be achieved, ensuring a wide pixel area | region.

  An organic EL device to which the present invention is applied is used as a direct-view display unit or the like in an electronic device such as a mobile phone or a mobile computer.

  Embodiments of the present invention will be described below. In the drawings to be referred to in the following description, the scales of the layers and the members are different from each other in order to make the layers and the members large enough to be recognized on the drawings. Further, in the following description, as much as possible, the same reference numerals are given to the corresponding portions so that the correspondence with the configuration described with reference to FIG. 9 can be easily understood.

[Embodiment 1]
(overall structure)
FIG. 1 is an equivalent circuit diagram showing an electrical configuration of the organic EL device according to Embodiment 1 of the present invention. In the organic EL device 100 shown in FIG. 1, on the first substrate 10, a plurality of scanning lines 3a, a plurality of data lines 6a extending in a direction intersecting the scanning lines 3a, and a scanning line 3a are arranged in parallel. And a plurality of power supply lines 3e extending. In the first substrate 10, a plurality of pixels 100a are arranged in a matrix in a rectangular pixel region 10a. A data line driving circuit 101 is connected to the data line 6a, and a scanning line driving circuit 104 is connected to the scanning line 3a. Each pixel region 10a holds a switching thin film transistor 30b to which a scanning signal is supplied to the gate electrode via the scanning line 3a, and a pixel signal supplied from the data line 6a via the switching thin film transistor 30b. The storage capacitor 70 to be driven, the driving thin film transistor 30c to which the pixel signal held by the storage capacitor 70 is supplied to the gate electrode, and the power supply line 3e when electrically connected to the power supply line 3e through the thin film transistor 30c. A first electrode 81 (anode layer) into which a drive current flows and an organic EL element 80 in which an organic functional layer is sandwiched between the first electrode 81 and the cathode layer are formed.

  According to this configuration, when the scanning line 3a is driven and the switching thin film transistor 30b is turned on, the potential of the data line 6a at that time is held in the holding capacitor 70, and according to the charge held in the holding capacitor 70, The on / off state of the driving thin film transistor 30c is determined. Then, a current flows from the power supply line 3e to the first electrode 81 through the channel of the driving thin film transistor 30c, and further a current flows to the counter electrode layer through the organic functional layer. As a result, the organic EL element 80 emits light according to the amount of current flowing therethrough.

  In the organic EL device 100 configured as described above, each of the plurality of pixels 100a corresponds to red (R), green (G), and blue (B), and red (R), green (G), and blue (B). The three pixels 100a constitute one pixel. In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B), and the pixel 100a is red (R), green (G), blue ( Which of B) corresponds is defined by a color filter layer described later.

  In the configuration shown in FIG. 1, the power supply line 3e is parallel to the scanning line 3a. However, a configuration in which the power supply line 3e is parallel to the data line 6a may be adopted. In the configuration shown in FIG. 1, the storage capacitor 70 is configured using the power supply line 3e. However, the storage capacitor 70 may be configured by forming a capacitance line separately from the power supply line 3e. Good.

(Specific configuration of organic EL device)
FIGS. 2A and 2B are plan views of the planar configuration of the organic EL device according to Embodiment 1 of the present invention as viewed from the second substrate side together with the respective components, and JJ ′ thereof. It is sectional drawing. In addition, illustration of a color filter layer etc. is abbreviate | omitted in FIG.2 (b). 2A and 2B, in the organic EL device 100 of the present embodiment, a first substrate 10 as an element substrate and a second substrate 20 that functions as both a sealing substrate and a color filter layer substrate are provided. In the first substrate 10, the second substrate 20 is disposed so as to overlap the surface side on which the plurality of organic EL elements 80 are formed.

  Here, the first substrate 10 and the second substrate 20 are bonded together by the first sealing material layer 91 and the second sealing material layer 92. Although the detailed configuration of the first sealing material layer 91 and the second sealing material layer 92 will be described later, the first sealing material layer 91 is shown by a region where dots are densely attached in FIG. A frame is formed along a peripheral region 10c surrounding the pixel region 10a. On the other hand, the second sealing material layer 92 is formed over the entire area surrounded by the first sealing material layer 91, as shown by the area where dots are sparsely attached in FIG. Yes.

  In the first substrate 10, a terminal 102 is formed in an overhanging region from the second substrate 20. In the first substrate 10, the data line driving circuit 101 and the scanning line driving circuit 104 described with reference to FIG. 1 are used by using the peripheral region 10 c or a region sandwiched between the pixel region 10 a and the peripheral region 10 c. (Not shown) is formed.

(Configuration of organic EL element)
FIGS. 3A and 3B are a cross-sectional view schematically showing a cross-sectional configuration of the organic EL device according to Embodiment 1 of the present invention, and a plan view schematically showing a plane configuration of the peripheral region 10c, respectively. It is. FIG. 3 shows only three organic EL elements corresponding to red (R), green (G), and blue (B) as organic EL elements.

  As shown in FIG. 3A, the first substrate 10 includes a support substrate 10d made of a quartz substrate, a glass substrate, a ceramic substrate, a metal substrate, or the like. Insulating films 11, 12, 13, 14, and 15 are formed on the surface of the support substrate 10 d, and an organic EL element 80 is formed on the insulating film 15. In this embodiment, the insulating films 11, 12, 13, and 15 are formed of a silicon oxide film, a silicon nitride film, or the like, and the insulating film 14 is a flat film made of a thick photosensitive resin having a thickness of 1.5 to 2.0 μm. It is formed as a chemical film. The insulating film 11 is a base insulating layer, and although not shown, the thin film transistors 30b and 30c, the storage capacitor 70, and the like described with reference to FIG. 1 using the layers of the insulating films 11, 12, 13, and 14 are used. Various wirings and driving circuits are formed. In addition, the conductive films formed between different layers are electrically connected to each other by using the contact holes formed in the insulating films 12, 13, 14, and 15.

  The organic EL device 100 of the present embodiment is a top emission type, and, as indicated by an arrow L1, light is extracted from the side where the organic EL element 80 is formed as viewed from the support substrate 10d. Opaque substrates such as ceramics, stainless steel, etc. can be used. In addition, a light reflection layer 41 made of aluminum, silver, or an alloy thereof is formed between the insulating films 14 and 15, and light emitted from the organic EL element 80 toward the support substrate 10d is reflected on the light reflection layer. By reflecting at 41, light can be emitted. When the organic EL device 100 is configured as a bottom emission type, light is extracted from the support substrate 10d side, and therefore a transparent substrate such as glass is used as the support substrate 10d.

  In the first substrate 10, a first electrode layer 81 (anode / pixel electrode) made of an ITO film or the like is formed in an island shape on the insulating film 15, and a light emitting region is formed on the upper layer of the first electrode layer 81. A thick partition wall 51 made of a photosensitive resin or the like having an opening for defining is formed.

  An organic functional layer 82 and a second electrode layer 83 (cathode) are laminated on the upper layer of the first electrode layer 81, and the organic EL element is formed by the first electrode layer 81, the organic functional layer 82, and the second electrode layer 83. 80 is formed. In this embodiment, the organic functional layer 82 and the second electrode layer 83 are formed over the entire surface of the pixel region 10a including the region where the partition walls 51 are formed.

In this embodiment, the organic functional layer 82 includes a hole injection layer made of a triarylamine (ATP) multimer, a TPD (triphenyldiamine) -based hole transport layer, an styrylamine-based material containing an anthracene-based dopant or a rubrene-based dopant. A light emitting layer made of (host) and an electron injection layer made of aluminum quinolinol (Alq ₃ ) are laminated in this order, and a second electrode layer 83 made of a thin film metal such as MgAg is formed thereon. Yes. In addition, an electron injection buffer layer made of LiF may be formed between the organic functional layer 82 and the second electrode layer 83. Among these materials, each layer constituting the organic functional layer 82 and the electron injection buffer layer can be sequentially formed by a vacuum evaporation method using a heating boat (crucible). Further, the metal material constituting the second electrode layer 83 and the like can be formed by a vacuum deposition method, and the oxide material such as ITO constituting the first electrode layer 81 can be formed by an ECR plasma sputtering method or a plasma gun type ion plating. It can be formed by a high-density plasma film forming method such as a method or a magnetron sputtering method.

  In this embodiment, the organic EL element 80 emits white light or mixed color light of red (R), green (G), and blue (B). For this reason, in the organic EL device 100, the red (R), green (G), and blue (B) color filter layers 22 (R) formed on the second substrate 20 at positions facing the organic EL element 80 ( Full color display is performed by performing color conversion according to G) and (B). That is, the second substrate 20 has a transparent support substrate 20d made of a plastic substrate such as polyethylene terephthalate, acrylic resin, polycarbonate, polyolefin, or a glass substrate, and red (R), green (G), blue (B ) Color filter layer 22 (R), (G), (B), color filter layer 22 (R), (G), light shielding layer 23 (black matrix for preventing leakage of light) between (B) Layer), a light-transmitting planarizing film 24, a light-transmitting gas barrier layer 25 made of a silicon oxynitride layer, and the like are formed in this order. In this embodiment, the color filter layers 22 (R), (G), and (B), the light shielding layer 23, the planarizing film 24, and the gas barrier layer 25 are formed only in the pixel region 10 a of the second substrate 20, and the peripheral region It is not formed in 10c. For this reason, the support substrate 20d is exposed in the peripheral region 10c of the second substrate 20.

  The color filter layers 22 (R), (G), and (B) are layers in which pigments or dyes are mixed in the transparent binder layer, and red (R), green (G), and blue (B) are used. However, light blue, light cyan, white, etc. may be added depending on the purpose. The thickness of the color filter layers 22 (R), (G), and (B) is preferably as thin as possible in consideration of the light transmittance, and is formed in a range of 0.1 to 1.5 μm. It may be different depending on the corresponding color. The light shielding layer 23 is made of a resin containing a black pigment, and the thickness thereof is thicker than the color filter layers 22 (R), (G), and (B), and a film thickness of about 1 to 2 μm is preferable. The above film thickness may be sufficient. The second substrate 20 may be provided with a functional layer such as an ultraviolet blocking / absorbing layer that prevents the incidence of ultraviolet rays, a light reflection preventing layer, or a heat dissipation layer.

(Sealing structure)
In the organic EL device 100 configured as described above, the organic functional layer 82, the second electrode layer 83 used as the cathode, the electron injection layer, and the like are easily deteriorated by moisture, and such deterioration causes deterioration of the electron injection effect. , A non-light-emitting portion called a dark spot is generated. Therefore, in this embodiment, the configuration in which the second substrate 20 is used as a sealing substrate and the first substrate 10 are bonded together and the configuration in which the sealing film 60 described below is formed on the first substrate 10 are used in combination.

First, the sealing film 60 is formed on the first substrate 10 over the second electrode layer 83 over a region wider than the pixel region 10a. As the sealing film 60, in this embodiment, a first film 61 made of a silicon compound layer laminated on the second electrode layer 83, a second film 62 made of a resin layer laminated on the first film 61, In addition, a laminated film including a third film 63 made of a silicon compound laminated on the second film 62 is used. The first film 61 and the third film 63 are formed by a high-density plasma vapor deposition method using a high-density plasma source, for example, plasma gun type ion plating, ECR plasma sputtering, ECR plasma CVD, surface wave plasma CVD, ICP-CVD. It is composed of silicon nitride (SiN _x ), silicon oxynitride (SiO _x N _y ), etc. that are deposited using such a method, and such a thin film has a high density that reliably blocks moisture even when deposited at low temperatures. Functions as a gas barrier layer. The second layer 62 is composed of a resin layer, and serves as an organic buffer layer that flattens surface irregularities caused by the partition walls 51 and wirings and prevents cracks in the first film 61 and the second film 62. It is functioning.

  In this embodiment, the first film 61 and the third film 63 (high-density gas barrier layer) constituting the sealing film 60 are formed in the pixel region 10a, the vicinity region of the pixel region 10a, and the peripheral region 10c far from the pixel region 10a. It is formed on the entire surface of the first substrate 10 including all. On the other hand, the second layer 62 (organic buffer layer) is formed thick only in the pixel region 10a and a region near the pixel region 10a, and is not formed in the peripheral region 10c far from the pixel region 10a. The insulating films 14 and 15 are generally formed only in the pixel region 10a.

  Next, in this embodiment, as shown in FIGS. 2A and 2B and FIGS. 3A and 3B, the peripheral region 10c is formed between the first substrate 10 and the second substrate 20. A first sealing material layer 91 is formed in a rectangular frame shape, and a translucent second sealing material layer 92 is formed over the entire region surrounded by the peripheral region 10c. The substrate 20 is bonded to the first sealing material layer 91 and the second sealing material layer 92.

  Here, the 1st sealing material layer 91 is formed in the substantially rectangular frame shape, and 91s of cut parts exist in the corner | angular part and side part. The discontinuous portion 91 s of the first sealing material layer 91 is filled with the second sealing material layer 92. In this embodiment, the end portion of the first substrate 10 is a protruding region 10f that protrudes from the substrate edge of the second substrate 20, and the terminal 102 is formed in the protruding region 10f. For this reason, the interrupted portion 91 s is not formed in the first sealing material layer 91 on the side where the overhanging region 10 f is located for the purpose of preventing the terminal 102 from being covered with the second sealing material layer 92.

  In this embodiment, an epoxy adhesive that is cured by ultraviolet rays is used for the first sealing material layer 91 (first sealing material 91a), and the epoxy adhesive preferably has an epoxy group and a molecular weight of 3000 or less. Epoxy monomer / oligomer (monomer definition: molecular weight 1000 or less, oligomer definition: molecular weight 1000 to 3000) is used. More specifically, the first sealing material layer 91 includes, for example, bisphenol A type epoxy oligomer, bisphenol F type epoxy oligomer, phenol novolac type epoxy oligomer, 3,4-epoxycyclohexenylmethyl-3 ′, 4′- Epoxycyclohexenecarboxylate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarboxylate, etc. are used alone or in combination. In addition, as a curing agent that reacts with epoxy monomer / oligomer, photoreactive type that causes cationic polymerization reaction such as diazonium salt, diphenyliodonium salt, triphenylsulfonium salt, sulfonate ester, iron arene complex, silanol / aluminum complex, etc. An initiator is added, and a cationic polymerization reaction is caused mainly by ultraviolet irradiation.

  For the second sealing material layer 92 (second sealing material 92a), an epoxy adhesive that is cured by heat is used. As a raw material main component of such an epoxy-based adhesive, it is necessary to be an organic compound material that is excellent in fluidity and does not have a volatile component such as a solvent, and preferably an epoxy monooligomer having an epoxy group and a molecular weight of 3000 or less. Preferred are epoxy monomers having a molecular weight of 1000 or less. For example, the second sealing material layer 92 may be formed by using a hard bisphenol A type epoxy monomer, a bisphenol F type epoxy monomer, a novolac type phenol epoxy monomer, 3,4-epoxycyclohexenylmethyl-3 ', 4'-epoxycyclohexene carboxy. Rate, ε-caprolactone-modified 3,4-epoxycyclohexylmethyl 3 ′, 4′-epoxycyclohexanecarbochelate, etc. may be used alone or in combination. Further, as the curing agent that reacts with the epoxy monomer, an addition polymerization type that forms a tough and excellent heat-resistant cured film is good, and amines such as aromatic amine, diethylenetriamine, triethylenetetramine, and polyetherdiamine, Methyl-1,2,3,6-tetrahydrophthalic anhydride, methyl-3,6-undomethylene-1,2,3,6-tetrahydrophthalic anhydride, 1,2,4,5-benzenetetracarboxylic dianhydride Products, acid anhydride curing agents such as 3,3 ′, 4,4′-benzophenonetetracarboxylic dianhydride, dicyandiamide and the like. These are mixed with a reaction initiator such as aromatic amino alcohol, alcohol, mercaptan, tertiary amine catalyst or silane coupling agent.

(Production method)
With reference to FIG. 4 and FIG. 5, the manufacturing method of the organic electroluminescent apparatus 100 of this form is demonstrated. 4 and FIG. 5, in the manufacturing process of the organic EL device 100 of the present embodiment, after forming the organic EL element 80 and the sealing layer 60 on the first substrate 10, the first substrate 10 and the second substrate 20 are combined. It is process sectional drawing which shows a mode until just before performing the material removal process which cut | disconnects a board | substrate after a bonding, and an explanatory diagram which shows typically a mode that this process is performed in the state of a large sized substrate.

  In manufacturing the organic EL device 100 of this embodiment, in addition to the method of bonding the first substrate 10 and the second substrate 20 in a single product size state, a large number of the first substrate 10 and the second substrate 20 can be taken. In some cases, the large substrates are bonded together, and then the large substrate is cut into a single size. Regardless of which method is adopted, the basic configuration is the same. Therefore, in the following explanation, after performing the bonding process in the state of a large substrate, the substrate is cut in the material removal process to obtain a single product size. A method for obtaining the organic EL device 100 will be described.

  First, as shown in FIG. 4A, an organic EL element 80, a sealing layer 60, and the like are formed in a state of a first large substrate 10x on which a large number of first substrates 10 can be obtained. In FIG. 5A, the planned cutting lines for the first large substrate 10x are represented by alternate long and short dash lines L1 and L2, and the dotted line rising to the right in the region surrounded by the planned cutting lines (alternate dashed lines L1 and L2). The region indicated by is a region that is cut out as a single-sized first substrate 10. Accordingly, in FIG. 5A, the region other than the region cut out as the first substrate 10 is a material removal region 10e that is cut and removed in a material removal step described later.

  Next, in the first sealing material application step shown in FIGS. 4B and 5B, the first large substrate 10x is applied to the first large substrate 10x by a dispenser drawing, a screen printing method, an ink jet method using a micro piezo head, or the like. Then, the first sealing material 91a made of the above-described photo-curable epoxy resin material is applied to a narrow width dimension of 1 mm or less along the peripheral region 10c of the first substrate 10. At that time, the first sealing material 91a is applied so as to have an interrupted portion 91s at a predetermined position. Here, from the viewpoint of applying the first sealing material 91a to a narrow width dimension of 1 mm or less, the viscosity at the time of application of the first sealing material 91a is preferably about 20,000 to 200,000 mPa · s at room temperature. More preferred is about 100,000 mPa · s. In addition, when the first sealing material 91a contains moisture, bubbles are generated and the strength is reduced. Therefore, the moisture content is preferably dehydrated to 0.1 wt% (1000 ppm) or less.

  Further, in this embodiment, in the first sealing material application step, as with the first sealing material 91a, the first coating applied to the first large substrate 10x by a dispenser drawing, a screen printing method, an inkjet method using a micro piezo head, or the like. A photo-curable epoxy resin material similar to the first seal material 91a is applied as the third seal material 93a to the outside (the material removal region 10e) of the seal material 91a. In this embodiment, since the third sealing material 93a is applied so as to completely surround the first sealing material 91a, the third sealing material 93a is at least inward and outward with respect to the interrupted portion 91s of the first sealing material 91a. It will be applied to the overlapping position.

  Next, in the second sealing material application step shown in FIG. 4C and FIG. 5C, the first large substrate 10x is subjected to the first large-scale substrate 10x by a dispenser drawing, a screen printing method, an inkjet method using a micropiezo head, or the like. The second sealing material 92a made of the above-described thermosetting epoxy resin material is applied in the region surrounded by the one sealing material 91a. The second sealing material 92a is applied in a pattern such as a solid shape, a dot shape, or a stripe shape. In this embodiment, an example in which the second sealing material 92a is applied in a circular solid shape is shown. The viscosity at the time of application of the second sealing material 92a is preferably 500 mPa · s or less, more preferably 300 mPa · s or less, from the viewpoint of increasing the filling property with a thin film. Since the second sealing material 92a is also susceptible to curing inhibition if it contains a large amount of water, bubbles are generated when the second sealing material 92a contains water as well as the first sealing material 91a. In order to reduce the strength, the water content is preferably dehydrated to 0.1 wt% (1000 ppm) or less. In addition, if a curing accelerator that promotes ring opening of acid anhydride or a photoreactive initiator that causes a cationic polymerization reaction is added to the second sealing material 92a, curing can be performed at a low temperature in a short time. It becomes.

  Next, in the overlapping process, as shown in FIGS. 2B, 3A, 4D, and 5D, the first seal material 91a and the second seal material 92a are interposed. The first large substrate 10x and the second large substrate 20x on which a large number of second substrates 20 can be taken are overlapped so as to be sandwiched. At that time, the second large substrate 20x is pressurized toward the first large substrate 10x with a force of about 600 N, and this state is maintained for about 200 seconds. In this superposition process, first, the first sealing material 91a contacts the second large substrate 20x and the inside is sealed, and then the second sealing material 92a is interposed between the first large substrate 10x and the second large substrate 20x. expand. Such a superposition process is performed in a reduced pressure atmosphere with a degree of vacuum of about 1 Pa.

  Next, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure. Therefore, the second sealing material 92a is developed to every corner between the first large substrate 10x and the second large substrate 20x. In addition, the filling property of the second sealing material 92a is improved. In that case, the 1st sealing material 91a functions as a bank with respect to the 2nd sealing material 92a. For this reason, even if it will be in the state similar to having been pressurized by atmospheric pressure when returning from a pressure reduction state to a normal pressure, the 2nd sealing material 92a is dammed up by the 1st sealing material 91a. The first large substrate 10x and the second large substrate 20x are secured by the first seal material 91a and the second seal material 92a interposed therebetween. Further, a gap material may be added to the first sealing material 91a or the third sealing material 93a.

  In this way, when the second sealing material 92a is deployed in the region surrounded by the first sealing material 91a, the first sealing material 91a is formed with the discontinuous portion 91s. Enter the break 91s. At that time, the bubbles mixed in the region surrounded by the first sealing material 91a are discharged to the outside from the interrupted portion 91s. Further, even if the second seal material 92a flows out from the discontinuous portion 91s, the third seal material 93a is applied to the outside of the first seal material 91a. It is dammed by the material 93a and does not flow outward any more. For this reason, the second sealant 92a is not contaminated to an extra area of the first large substrate 10x, and a sufficient amount of the second sealant 92a is filled in the area surrounded by the first sealant 91a. Is done.

Next, in the curing step, the first sealing substrate 91a is irradiated with ultraviolet rays having a light amount of about 2000 mJ / cm ² at a power of about 30 mW / cm ² from the first large substrate 10x and / or the second large substrate 20x side. Then, the first sealing material 91a and the third sealing material 93a are selectively cured to form the first sealing material layer 91 and the third sealing material layer 93. Next, heating is performed at 60 to 100 ° C. in a state where the first large substrate 10x and the second large substrate 20x bonded together by the first sealing material layer 91 and the third sealing material layer 93 are arranged on a hot plate, The second sealant 92a is cured while the second sealant 92a is spread all over between the first large substrate 10x and the second large substrate 20x to form the second sealant layer 92. In this way, the first large substrate 10x and the second large substrate 20x are bonded to each other by the first sealing material layer 91, the second sealing material layer 92, and the third sealing material layer 93.

  After that, the first large substrate 10x and the second large substrate 20x are cut along the planned cutting lines indicated by the alternate long and short dash lines L1 and L2 in FIG. 5 (positions indicated by arrows C in FIG. 4D), An organic EL device 100 is obtained. In the organic EL device 100 configured as described above, since the second sealing material layer 92 is cured, convection does not occur when left at a high temperature, so that the third layer 63 of the sealing film 60 is not damaged, and the second sealing material layer 92 is not damaged. The two sealing material layers 92 function as a protective film for the third layer 63 of the sealing film 60. Here, the thickness of the second sealing material layer 92 is 1 to 5 μm, and it is preferable that the second sealing material layer 92 is thinner as the pixel becomes higher in definition. In addition, fillers such as clay minerals, silica balls, and resin balls that are contained in a large amount in general adhesives cause damage to the third layer 63 of the sealing film 60, and thus the first sealing material 91 a. It is preferable that such a filler is not blended in the second sealing material 92a. In particular, the second sealing material 92a is in contact with the sealing film 60, and considering the light transmittance, the filler is blended. Preferably not.

(Main effects of this form)
As described above, in the organic EL device 100 and the manufacturing method thereof according to the present embodiment, the organic EL device 80 is formed over a region wider than the pixel region 10a on the second electrode layer 83 for the purpose of protecting the organic EL element 80 from moisture and the like. The sealing film 60 is formed, and the first substrate 10 and the second substrate 20 are bonded together in this state.

  In adopting such a bonding structure, in the overlapping step, the second sealing material 92a is developed between the substrates while the uncured second sealing material 92a is dammed by the uncured first sealing material 91a. Here, since the discontinuous portion 91s is formed in the first seal material 91a, the bubbles mixed in the region surrounded by the first seal material 91a are discharged to the outside from the discontinuous portion 91s. Therefore, since no bubbles remain in the region surrounded by the first sealing material 91a (first sealing material layer 91), the film formed on the first sealing material 91a (first sealing material layer 91) or the pixel region 10a. It is possible to avoid a situation in which the bubbles are pressed and damaged by the bubbles.

  Further, in this embodiment, since the discontinuous portions 91s are formed in both the corner portion and the side portion of the first sealing material 91a formed in a substantially rectangular frame shape, when the second sealing material 92a is developed between the substrates. For example, even when bubbles are pushed to the corners of the first sealing material 91a, the bubbles can be efficiently discharged, and no bubbles remain in the region surrounded by the first sealing material 91a.

  Furthermore, in this embodiment, since the sealing film 60 is formed over a region wider than the pixel region 10a, the organic EL element 80 can be reliably protected from moisture and the like. Further, since the sealing layer 60 is formed over a wide region including the pixel region 10a, if bubbles remain in the region surrounded by the first sealing material 90a, the sealing layer 60 is pressed by the bubbles and the sealing layer 60 is formed. Although there is a possibility of damage, in the present embodiment, since the bubbles do not remain, the sealing layer 60 is not damaged. Therefore, the reliability of the organic EL device 100 can be improved.

  Further, since the first sealing material 91a and the third sealing material 93a have higher viscosity than the second sealing material 92a, the first sealing material 91a and the third sealing material 93a are not cured even if they are in an uncured state. It is also possible to prevent the one sealing material 91a from flowing out. Further, the second sealing material 92a can be filled over the entire region surrounded by the first sealing material 91a.

  Furthermore, since the first sealing material 91a is photocurable and the second sealing material 92a is thermosetting, the first sealing material 91a and the second sealing material 92a can be cured in a predetermined order, After only the first sealing material 91a is cured, the second sealing material 92a can be cured. Therefore, even when the second sealing material 92a presses the first sealing material layer 91 outward when the second sealing material 92a is cured, the first sealing material 91a is already cured. Therefore, the second sealing material 92a does not break through the first sealing material layer 91. In the pixel region 10a, various light-shielding films are formed on the first substrate 10 and the second substrate 20. Even in such a case, since the second sealant 92a is thermosetting, the pixel region The second sealing material 92a formed in 10a can be reliably cured.

  Furthermore, since the superposition process is performed in a reduced-pressure atmosphere, it is possible to suppress the bubbles themselves from being mixed between the first substrate 10 and the second substrate 20. Further, when the pressure is returned to the normal pressure, the state is the same as when the pressure is increased by the atmospheric pressure. Therefore, the second sealing material 92a reaches every corner between the first substrate 10 and the second substrate 20, and the second The filling property of the two sealing materials 92a is improved.

[Embodiment 2]
With reference to FIG. 6, the manufacturing method of the organic electroluminescent apparatus 100 which concerns on Embodiment 2 of this invention is demonstrated. FIG. 6 shows the manufacturing process of the organic EL device 100 according to the present embodiment. After forming the color filters 22 (R), (G), (B), etc. on the second substrate 20, the first substrate 10 and the second substrate are formed. 20 is a process cross-sectional view showing a state up to just before performing a material removal step of bonding 20 and then cutting the substrate. Note that the basic configuration of this embodiment is as described in Embodiment 1 with reference to FIG. 3 and the like, and therefore, parts having common functions are denoted by the same reference numerals and illustrated. Description is omitted. Further, in manufacturing the organic EL device 100 of the present embodiment, a bonding process or the like is performed in a state of a large substrate that can take a large number of the first substrate 10 and the second substrate 20, and then the large substrate is reduced to a single product size. The manner of cutting will be described with reference to FIG. In FIG. 6, the second substrate 20 and the like are shown upside down with respect to the state shown in FIG.

  In the first embodiment, the sealing material is applied to the first substrate 10 (first large substrate 10x) side. In this embodiment, the sealing material is applied to the second substrate 20 (second large substrate 20x). .

  That is, as shown in FIG. 6A, after the color filter layers 22 (R), (G), (B) and the like are formed on the second large substrate 20x on which a large number of second substrates 20 can be obtained, FIG. In the first sealing material application step shown in b), the second large substrate 20x is aligned with the peripheral region 10c of the second substrate 20 by a dispenser drawing method, a screen printing method, an ink jet method using a micro piezo head, or the like. First, the first sealing material 91a made of the photo-curable epoxy resin material described in the first embodiment is applied to a narrow width dimension of 1 mm or less. At that time, as shown in FIGS. 1 (a), 3 (a), 3 (b), and 6 (a), an interrupted portion 91s is formed in the first sealing material 91a. Furthermore, in this embodiment, in the first sealing material application step, the first coating material applied to the second large substrate 20x by the dispenser drawing, the screen printing method, the ink jet method using the micro piezo head, etc. as in the first sealing material 91a. A photo-curable epoxy resin material similar to the first seal material 91a is applied as the third seal material 93a to the outside (the material removal region 10e) of the seal material 91a. Such a situation is as shown in FIG.

  Next, in the second sealing material application step shown in FIG. 6C, the second large substrate 20x is surrounded by the first sealing material 91a by a dispenser drawing method, a screen printing method, an ink jet method using a micro piezo head, or the like. In the region, the second sealing material 92a made of the thermosetting epoxy resin material described in the first embodiment is applied in a predetermined pattern such as a solid shape, a dot shape, or a stripe shape. Such a situation is as shown in FIG.

  Next, in the overlapping step, as shown in FIG. 6C, the first large substrate 10x and the second large substrate 20x are overlapped so as to sandwich the first seal material 91a and the second seal material 92a. . At that time, as in the first embodiment, the first large substrate 10x is pressurized toward the second large substrate 20x, and this state is maintained for about 200 seconds. In the superimposing step, first, the first sealing material 91a comes into contact with the first large substrate 10x to seal the inside, and then the second sealing material 92a between the first large substrate 10x and the second large substrate 20x. Expands. Such a situation is as shown in FIG.

  In this way, when the second sealing material 92a is deployed in the region surrounded by the first sealing material 91a, the first sealing material 91a is formed with the discontinuous portion 91s. Enter the break 91s. At that time, the bubbles mixed in the region surrounded by the first sealing material 91a are discharged to the outside from the interrupted portion 91s. Further, even if the second seal material 92a flows out from the discontinuous portion 91s, the third seal material 93a is applied to the outside of the first seal material 91a. It is dammed by the material 93a and does not flow outward any more. For this reason, the second sealing material 92a is not contaminated to an extra region of the second large substrate 20x, and a sufficient amount of the second sealing material 92a is filled in the region surrounded by the first sealing material 91a. Is done.

  Next, in the curing step, the first sealing material 91a and the third sealing material 93a are selectively irradiated by irradiating the first sealing material 91a with ultraviolet rays from the first large substrate 10x and / or the second large substrate 20x side. The first sealing material layer 91 and the third sealing material layer 93 are formed by curing. Next, the first large substrate 10x and the second large substrate 20x bonded together by the first sealing material layer 91 and the third sealing material layer 93 are heated on a hot plate, and the first large substrate 10x and the second large substrate are heated. The second sealing material 92a is cured while spreading the second sealing material 92a to every corner between 20x and the second sealing material layer 92 is formed. In this way, the first large substrate 10x and the second large substrate 20x are bonded to each other by the first sealing material layer 91, the second sealing material layer 92, and the third sealing material layer 93.

  Thereafter, the first large substrate 10x and the second large substrate 20x are cut along the position indicated by the arrow C in FIG. 6D (scheduled cutting lines indicated by the dashed lines L1 and L2 in FIG. 5). An organic EL device 100 is obtained.

  Even when such a configuration is adopted, as in the first embodiment, in the overlapping process, the second seal material 92a is dammed while the uncured second seal material 92a is dammed by the uncured first seal material 91a. Deploy between boards. Here, since the discontinuous portion 91s is formed in the first seal material 91a, the bubbles mixed in the region surrounded by the first seal material 91a are discharged to the outside from the discontinuous portion 91s. Therefore, since no bubbles remain in the region surrounded by the first sealing material 91a (first sealing material layer 91), it is formed in the first sealing material (first sealing material layer 91) or the pixel region 10a. The same effects as in the first embodiment can be achieved, such as avoiding a situation in which a film is pressed and damaged by bubbles.

[Modifications of Embodiments 1 and 2]
In the first and second embodiments, the third sealing material 93a is formed for each region cut out as the first substrate 10 or the second substrate 20 in the large substrate. However, as shown in FIG. The third sealing material 93a may be formed in a single line between the regions 10 or the second substrate 20 cut out. Moreover, as shown in FIG.7 (b), you may form the 3rd sealing material 93a so that it may have the discontinuous part 93s in the part in which the 2nd sealing material 92a does not flow out in the 3rd sealing material 93a. Furthermore, as shown in FIG.7 (c), you may employ | adopt the structure which does not form the 3rd sealing material 93a at all.

  In the first and second embodiments, as shown in FIG. 7A, the discontinuous portions 91s are formed in the corner portions and the side portions of the first sealing material 91a formed in a substantially rectangular frame shape. As shown in b), when the second sealing material 92a is applied in a rhombus shape so as to be separated from the corner portion, the bubbles are pushed to the corner portion of the first sealing material 91a. An interrupted portion 91s may be formed only at the corner portion. As shown in FIG. 7C, when the second sealing material 92a is applied in an X shape so as to be separated from the side portion, the bubbles are pushed to the side portion of the first sealing material 91a. You may form the discontinuous part 91s only in the side part of 1 sealing material 91a. In any case, it is preferable to form the discontinuous portion 91s at the position where the bubbles are pushed.

  In the first and second embodiments, the second sealing material 92a is applied in a solid shape. However, as shown in FIG. 7A, the second sealing material 92a may be formed in a dot shape. In this case, the shape of the region where the second sealing material 92a is formed in a dot shape may be a rhombus shape, an X shape, or the like, as shown in FIGS. Further, although not shown, the second sealing material 92a may be formed in a number of lines.

  In the first and second embodiments, the large substrate is cut along the outer peripheral edge of the first sealing material layer 91. However, the first seal is configured to cut the large substrate along the inner peripheral edge of the first sealing material layer 91. A configuration in which the large substrate is cut through the center of the material layer 91 in the width direction, a configuration in which the large substrate is cut between the first sealing material layer 91 and the third sealing material layer 93, and a third sealing material layer A configuration in which the large substrate is cut along the inner peripheral edge of 93, a configuration in which the large substrate is cut through the vicinity of the center in the width direction of the third sealing material layer 93, or along the outer peripheral edge of the third sealing material layer 93 You may employ | adopt the structure which cut | disconnects a large sized board | substrate.

  In the first and second embodiments, after the first sealing material 91a, the third sealing material 93a, and the second sealing material 92a are applied, these sealing materials are sequentially cured in the curing process. When the viscosity of 91a and the third sealing material 93a is high and the curing speed is slow, after applying the first sealing material 91a and the third sealing material 93a, before applying the second sealing material 92a, the first The sealing material 91a and the third sealing material 93a may be cured. In addition, after applying the first sealing material 91a, the third sealing material 93a, and the second sealing material 92a, the first sealing material 91a and the third sealing material 93a may be cured to perform the overlapping process.

[Other embodiments]
In the above embodiment, the case where the color filter layers 22 (R), (G), and (B) are provided on the second substrate 20 in the top emission type organic EL device 100 has been described as an example. However, the organic EL element itself However, the present invention may be applied to an organic EL device that emits light of each color. In this case, the second substrate 20 functions only as a sealing substrate.

  In the above embodiment, the organic EL device 100 for color display has been described as an example. However, when used as an optical head of a copying machine, monochrome may be used, and such a monochrome organic EL device may be used. The present invention may be applied. Also in this case, the second substrate 20 functions only as a sealing substrate.

  Furthermore, in the above embodiment, the top emission type organic EL device 100 has been described as an example. However, the present invention may be applied to a bottom emission type organic EL device. In this case, the second substrate 20 is sealed. It functions as a substrate only.

  In the above embodiment, the example in which the organic functional layer 82 is formed on the entire surface of the pixel region 10a has been described. However, after the organic functional layer is selectively applied to the region surrounded by the partition wall 51 by an inkjet method or the like, the fixing is performed. As a result, an upper layer of the first electrode layer 81 was formed with a hole injection layer made of 3,4-polyethylenediosithiophene / polystyrene sulfonic acid (PEDOT / PSS) or the like, and an organic functional layer made of a light emitting layer. The invention may be applied to an organic EL device. In this case, the light emitting layer is made of, for example, a polyfluorene derivative, a polyphenylene derivative, a polyvinyl carbazole, a polythiophene derivative, or a polymer material thereof, a perylene dye, a coumarin dye, a rhodamine dye, for example, rubrene, perylene, 9,10. -It is composed of a material doped with diphenylanthracene, tetraphenylbutadiene, Nile red, coumarin 6, quinacridone and the like. Further, as the light emitting layer, a π-conjugated polymer material in which double-bonded π electrons are non-polarized on the polymer chain is also a conductive polymer, so that it is excellent in light emitting performance, and thus is preferably used. . In particular, a compound having a fluorene skeleton in the molecule, that is, a polyfluorene compound is more preferably used. In addition to such materials, it is also possible to use a composition comprising a conjugated polymer organic compound precursor and at least one fluorescent dye for changing light emission characteristics.

[Example of mounting on electronic equipment]
With reference to FIG. 8, an electronic apparatus in which the organic EL device 100 according to the above-described embodiment is mounted will be described. FIG. 8 is an explanatory diagram of an electronic apparatus using the organic EL device according to the present invention.

  FIG. 8A shows the configuration of a mobile personal computer provided with the organic EL device 100. The personal computer 2000 includes an organic EL device 100 as a display unit and a main body 2010. The main body 2010 is provided with a power switch 2001 and a keyboard 2002. FIG. 8B shows the configuration of a mobile phone provided with the organic EL device 100. The cellular phone 3000 includes a plurality of operation buttons 3001, scroll buttons 3002, and the organic EL device 100 as a display unit. By operating the scroll button 3002, the screen displayed on the organic EL device 100 is scrolled. FIG. 8C shows the configuration of a personal digital assistant (PDA) to which the organic EL device 100 is applied. The information portable terminal 4000 includes a plurality of operation buttons 4001, a power switch 4002, and the organic EL device 100 as a display unit. When the power switch 4002 is operated, various types of information such as an address book and a schedule book are displayed on the organic EL device 100. Electronic devices to which the organic EL device 100 is applied include those shown in FIGS. 8A to 8C, digital still cameras, liquid crystal televisions, viewfinder type, monitor direct view type video tape recorders, car navigation systems. Examples thereof include a device, a pager, an electronic notebook, a calculator, a word processor, a workstation, a videophone, a POS terminal, and a device equipped with a touch panel. And the organic electroluminescent apparatus 100 mentioned above is applicable as a display part of these various electronic devices.

1 is an equivalent circuit diagram showing an electrical configuration of an organic EL device according to Embodiment 1 of the present invention. (A), (b) is the top view which looked at the planar structure of the organic electroluminescent apparatus which concerns on Embodiment 1 of this invention from the opposing substrate side with each component, respectively, and its JJ 'sectional drawing It is. (A), (b) is sectional drawing which shows typically the cross-sectional structure of the organic electroluminescent apparatus which concerns on Embodiment 1 of this invention, and the top view which shows typically the planar structure of the peripheral region, respectively. In the manufacturing process of the organic EL device according to Embodiment 1 of the present invention, after forming the organic EL element and the sealing layer on the first substrate, the first substrate and the second substrate are bonded together, and then the substrate is attached. It is process sectional drawing which shows a mode until just before performing the material removal process to cut | disconnect. It is explanatory drawing which shows typically a mode that the process shown in FIG. 4 is performed in the state of a large sized substrate. In the manufacturing process of the organic EL device according to Embodiment 2 of the present invention, after the color filter layer and the like are formed on the second substrate, the first substrate and the second substrate are bonded together, and then the substrate is cut. It is process sectional drawing which shows a mode until just before performing a material process. It is explanatory drawing which shows the manufacturing method of the organic EL apparatus which concerns on the modification of Embodiment 1, 2 of this invention. It is explanatory drawing of the electronic device using the organic EL apparatus which concerns on this invention. It is explanatory drawing which shows the problem in the manufacturing method of the organic electroluminescent apparatus based on the reference example of this invention.

Explanation of symbols

10..First substrate, 10a..Pixel region, 10c..Peripheral region, 20..Second substrate, 22 (R), (G), (B) .. Color filter layer, 80..Organic EL element 81..First electrode layer 82..Organic functional layer 83..Second electrode layer 91..First seal material layer 91a..First seal material 91s..First seal material break Part 92 ·· second sealing material layer 92a ·· second sealing material 93 ·· third sealing material layer 93a ·· third sealing material 100 ·· organic EL device 100a ·· pixel

Claims (15)

A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate An organic electroluminescence device having a second substrate overlaid on
The first substrate and the second substrate include a frame-shaped first sealing material layer formed along a peripheral region surrounding the pixel region, and an entire region surrounded by the first sealing material layer. Bonded with the formed second sealing material layer,
An organic electroluminescence device, wherein a discontinuous portion is formed in the first sealing material layer. The second substrate and the second sealing material layer are translucent,
2. The organic electroluminescence device according to claim 1, wherein a color filter layer of a different color is formed in each region facing the plurality of organic electroluminescence elements on the second substrate.   3. The organic electroluminescence device according to claim 1, wherein a sealing film is formed on the first substrate over a region wider than the pixel region above the second electrode layer. 4. The first sealing material layer is formed in a substantially rectangular frame shape,
The organic electroluminescence device according to any one of claims 1 to 3, wherein the discontinuous portion is formed at least at a corner portion of the first sealing material layer. The first sealing material layer is formed in a substantially rectangular frame shape,
The organic electroluminescence device according to any one of claims 1 to 4, wherein the discontinuous portion is formed at least in a side portion of the first sealing material layer. The first sealing material layer is made of a photocurable resin material,
The organic electroluminescent device according to claim 1, wherein the second sealing material layer is made of a thermosetting resin material. A first substrate on which a plurality of organic electroluminescent elements each including a first electrode layer, an organic functional layer, and a second electrode layer are arranged in a pixel region; and a surface side on which the organic electroluminescent elements are formed on the first substrate In the manufacturing method of the organic electroluminescence device having the second substrate bonded to
In laminating the first substrate and the second substrate,
A first sealing material application step of applying a first sealing material along a peripheral region surrounding the pixel region in one of the first substrate and the second substrate;
A second sealing material application step of applying a second sealing material in a region surrounded by the first sealing material;
An overlapping step of overlapping the first substrate and the second substrate so as to sandwich the first sealing material and the second sealing material;
A sealing material curing step of curing the second sealing material;
Do
In the first sealing material application step, an interrupted portion is formed in the first sealing material, and the method for manufacturing an organic electroluminescence device is characterized. The second substrate and the second sealing material are translucent,
8. The method of manufacturing an organic electroluminescence device according to claim 7, wherein a color filter layer of a different color is formed on each region facing the plurality of organic electroluminescence elements on the second substrate. 9.   9. The method for manufacturing an organic electroluminescence device according to claim 7, wherein the superimposing step is performed in a reduced-pressure atmosphere.   10. The method of manufacturing an organic electroluminescence device according to claim 7, wherein the first sealing material has a viscosity higher than that of the second sealing material. 11.   11. The method of manufacturing an organic electroluminescence device according to claim 7, wherein the first sealing material is photocurable, and the second sealing material is thermosetting.   12. The method of manufacturing an organic electroluminescence device according to claim 7, wherein, in the curing step, the first sealing material is cured before the second sealing material is cured. .   The third sealing material is applied to the outer side of the first sealing material at a position overlapping at least the discontinuous portion in the inner and outer directions before the overlapping step. A method for producing an organic electroluminescence device according to claim 1. The first sealing material and the third sealing material are made of the same material,
The method of manufacturing an organic electroluminescence device according to claim 13, wherein the third sealing material is applied in the first sealing material application step.   15. The material removal step of removing the portion where the third sealing material is formed by cutting the one substrate into a predetermined size after performing the sealing material curing step. The manufacturing method of the organic electroluminescent apparatus as described in any one of.

Images