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JP2009162540A - Magnetometric sensor and its manufacturing method - Google Patents

Magnetometric sensor and its manufacturing method Download PDF

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JP2009162540A
JP2009162540A JP2007340156A JP2007340156A JP2009162540A JP 2009162540 A JP2009162540 A JP 2009162540A JP 2007340156 A JP2007340156 A JP 2007340156A JP 2007340156 A JP2007340156 A JP 2007340156A JP 2009162540 A JP2009162540 A JP 2009162540A
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magnetoresistive effect
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Hiromitsu Sasaki
寛充 佐々木
Hirofumi Fukui
洋文 福井
Takashi Hatauchi
隆史 畑内
Toru Yoshida
徹 吉田
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Alps Alpine Co Ltd
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Abstract

<P>PROBLEM TO BE SOLVED: To provide a magnetometric sensor for equalizing each resistance change temperature coefficient (TCR) of a fixed resistance element and a magnetoresistance effect element furthermore in comparison with hitherto, and manufacturing the fixed resistance element more easily than hitherto, for example, agreement of each resistance value is not required. <P>SOLUTION: The fixed resistance elements 4, 5 have the same element part 12 as the magnetoresistance effect elements 2, 3, and a fixed magnetization direction of a fixed magnetic layer of the element part 12 is faced to an element length direction (Y-direction). An extension part having a width dimension W2 larger than an element width W1 of the element part 12, and extending from both sides of the element width of the element part 12 to the element width direction is provided at an interval on the upside of the element part 12 constituting the fixed resistance element, and an extension part having a length dimension L2 larger than an element length L1, and extending from both sides of the element length direction of the element part 12 to the element length direction is provided, and the first soft magnetic body 23 whose length dimension L2 is larger than the width dimension W2 is arranged. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、例えば地磁気センサとして使用される磁気抵抗効果素子を用いた磁気センサ及びその製造方法に関する。   The present invention relates to a magnetic sensor using a magnetoresistive effect element used as, for example, a geomagnetic sensor, and a manufacturing method thereof.

磁気センサには、磁気抵抗効果素子と固定抵抗素子とで構成されたブリッジ回路が設けられている。前記磁気抵抗効果素子は、磁化方向が一方向に固定された固定磁性層と、前記固定磁性層に非磁性層を介して形成されたフリー磁性層との積層構造を備える。   The magnetic sensor is provided with a bridge circuit composed of a magnetoresistive effect element and a fixed resistance element. The magnetoresistive element has a laminated structure of a pinned magnetic layer whose magnetization direction is fixed in one direction and a free magnetic layer formed on the pinned magnetic layer through a nonmagnetic layer.

従来、固定抵抗素子は前記磁気抵抗効果素子とは異なる抵抗材料を用いて形成されていた。これにより抵抗変化温度係数(TCR)が磁気抵抗効果素子と固定抵抗素子とで異なる問題が生じた。また磁気抵抗効果素子及び固定抵抗素子の抵抗値を測定した後、例えば前記固定抵抗素子をパターニングして中点電位を合わせ込む作業が必要になり製造工程が煩雑化する問題があった。   Conventionally, the fixed resistance element has been formed using a resistance material different from that of the magnetoresistive effect element. As a result, there arises a problem that the resistance change temperature coefficient (TCR) is different between the magnetoresistive effect element and the fixed resistance element. Further, after measuring the resistance values of the magnetoresistive effect element and the fixed resistance element, for example, it is necessary to pattern the fixed resistance element to adjust the midpoint potential, which complicates the manufacturing process.

一方、固定抵抗素子を、磁気抵抗効果素子を構成するフリー磁性層と非磁性層とを入れ替えて、固定磁性層/フリー磁性層/非磁性層の積層構造で形成し、磁気抵抗効果素子と固定抵抗素子とで構成層を一致させることで、磁気抵抗効果素子と固定抵抗素子の抵抗変化温度係数(TCR)を等しく出来ると考えられた。   On the other hand, the fixed resistance element is formed with a laminated structure of a fixed magnetic layer / free magnetic layer / nonmagnetic layer by replacing the free magnetic layer and the nonmagnetic layer constituting the magnetoresistive effect element, and fixed to the magnetoresistive effect element. It was considered that the resistance change temperature coefficient (TCR) of the magnetoresistive effect element and the fixed resistance element can be made equal by matching the constituent layers with the resistance element.

しかしながら、磁気抵抗効果素子と固定抵抗素子とを同じ製造過程で形成することが出来ず、結局、抵抗変化温度係数(TCR)を高精度に一致させることが出来ず、又は抵抗変化温度係数(TCR)のばらつきが大きくなるといった問題が生じた。しかも、磁気抵抗効果素子と固定抵抗素子との抵抗値も異なりやすく、従来と同様に中点電位合わせ込みのためのパターニング工程が必要であった。
特開2005−183614号公報
However, the magnetoresistive effect element and the fixed resistance element cannot be formed in the same manufacturing process, and eventually the resistance change temperature coefficient (TCR) cannot be matched with high accuracy, or the resistance change temperature coefficient (TCR). ) Has a large variation. Moreover, the resistance values of the magnetoresistive effect element and the fixed resistance element are also likely to be different, and a patterning step for adjusting the midpoint potential is required as in the prior art.
JP 2005-183614 A

そこで本発明は上記従来の課題を解決するためのものであり、固定抵抗素子及び磁気抵抗効果素子の抵抗変化温度係数(TCR)を従来に比べて等しくでき、また、抵抗値を合わせ込む必要ない等、前記固定抵抗素子を従来よりも簡単に製造できる磁気センサを提供することを目的とする。   Therefore, the present invention is to solve the above-described conventional problems, and the resistance change temperature coefficient (TCR) of the fixed resistance element and the magnetoresistive effect element can be made equal to that of the conventional one, and the resistance value need not be adjusted. An object of the present invention is to provide a magnetic sensor that can manufacture the fixed resistance element more easily than in the past.

本発明は、磁気抵抗効果素子と、前記磁気抵抗効果素子に出力取出し部を介して直列接続される固定抵抗素子とを備えた磁気センサであって、
前記磁気抵抗効果素子は、磁化方向が固定される固定磁性層と、前記固定磁性層に非磁性層を介して積層された外部磁場を受けて磁化方向が変動するフリー磁性層とを有する素子部を備え、
前記固定抵抗素子は、素子幅W1に比べて素子長さL1が長く形成された細長形状の素子部を備え、前記固定抵抗素子を構成する素子部は、前記固定磁性層と、前記固定磁性層に前記非磁性層を介して積層された前記フリー磁性層とを有しており、前記固定磁性層の固定磁化方向が、素子長さ方向に向けられており、
前記固定抵抗素子を構成する素子部に対して間隔を空けて、前記素子幅W1と同方向への幅寸法W2が前記素子幅W1よりも大きく前記素子部の素子幅の両側から素子幅方向に延出する延出部を備えるとともに、前記素子長さL1と同方向への長さ寸法L2が前記素子長さL1よりも大きく前記素子部の素子長さ方向の両側から素子長さ方向に延出する延出部を備え、且つ前記長さ寸法L2が前記幅寸法W2よりも大きい第1軟磁性体が積層配置されていることを特徴とするものである。
The present invention is a magnetic sensor comprising a magnetoresistive effect element and a fixed resistance element connected in series to the magnetoresistive effect element via an output extraction portion,
The magnetoresistive element includes an element part having a pinned magnetic layer whose magnetization direction is fixed, and a free magnetic layer which is laminated on the pinned magnetic layer via a nonmagnetic layer and changes the magnetization direction upon receiving an external magnetic field With
The fixed resistance element includes an elongated element portion having an element length L1 longer than an element width W1, and the element portion constituting the fixed resistance element includes the fixed magnetic layer and the fixed magnetic layer. And the free magnetic layer laminated via the nonmagnetic layer, and the pinned magnetization direction of the pinned magnetic layer is directed to the element length direction,
A width dimension W2 in the same direction as the element width W1 is larger than the element width W1 and spaced from both sides of the element width of the element section in the element width direction at a distance from the element portion constituting the fixed resistance element. An extension portion is provided, and a length dimension L2 in the same direction as the element length L1 is larger than the element length L1 and extends from both sides of the element portion in the element length direction in the element length direction. A first soft magnetic body having an extending portion that protrudes and having a length dimension L2 larger than the width dimension W2 is laminated.

上記の構成により、固定抵抗素子及び磁気抵抗効果素子の抵抗変化温度係数(TCR)を従来に比べて等しくできる。また、前記固定抵抗素子を構成する素子部の上方に前記第1軟磁性体を配置することで、前記素子部に流入する外部磁場を適切にシールドでき固定抵抗化を図ることが出来る。また、抵抗値を合わせ込む必要がない等、前記固定抵抗素子を従来よりも簡単に製造できる。   With the above configuration, the resistance change temperature coefficient (TCR) of the fixed resistance element and the magnetoresistive effect element can be made equal as compared with the prior art. In addition, by disposing the first soft magnetic body above the element portion constituting the fixed resistance element, it is possible to appropriately shield the external magnetic field flowing into the element portion, and to achieve fixed resistance. In addition, the fixed resistance element can be manufactured more easily than in the prior art because it is not necessary to match the resistance value.

本発明では、前記磁気抵抗効果素子は、素子幅に比べて素子長さが長く形成された細長形状の素子部を有しており、前記固定磁性層の固定磁化方向が素子幅方向に向けられており、前記磁気抵抗効果素子を構成する素子部の素子長さ方向と、前記固定抵抗素子を構成する素子部の素子長さ方向が直交するように各素子部が配置され、前記磁気抵抗効果素子を構成する固定磁性層の固定磁化方向と、前記固定抵抗素子を構成する固定磁性層の固定磁化方向とが同一方向に向けられていることが好ましい。これにより、より簡単に前記固定抵抗素子を製造できる。   In the present invention, the magnetoresistive effect element has an elongated element portion having an element length longer than an element width, and the fixed magnetization direction of the fixed magnetic layer is directed to the element width direction. Each element portion is arranged such that the element length direction of the element portion constituting the magnetoresistive effect element and the element length direction of the element portion constituting the fixed resistance element are orthogonal to each other, and the magnetoresistive effect It is preferable that the fixed magnetization direction of the fixed magnetic layer constituting the element and the fixed magnetization direction of the fixed magnetic layer constituting the fixed resistance element are oriented in the same direction. Thereby, the said fixed resistance element can be manufactured more easily.

本発明では、前記磁気抵抗効果素子及び前記固定抵抗素子を構成する各素子部の積層順及び膜厚が等しいことが好ましい。これにより、固定抵抗素子及び磁気抵抗効果素子の抵抗変化温度係数(TCR)が一致するように高精度に調整できる。   In the present invention, it is preferable that the order of lamination and the film thickness of each element portion constituting the magnetoresistive effect element and the fixed resistance element are equal. Thereby, it can adjust with high precision so that the resistance change temperature coefficient (TCR) of a fixed resistive element and a magnetoresistive effect element may correspond.

また本発明では、前記固定抵抗素子を構成する前記素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、
前記固定抵抗素子を構成する各素子部に対して個別に前記第1軟磁性体が配置されている構造に出来る。
Further, in the present invention, a plurality of the element portions constituting the fixed resistance element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape,
The first soft magnetic body can be individually arranged for each element portion constituting the fixed resistance element.

このとき、前記第1軟磁性体は、さらに、素子幅方向の両側に位置する前記素子部の両外側面より外側にも配置されていることが好ましい。これにより、前記磁気抵抗効果素子を構成する素子部に磁場が侵入するのをより効果的に抑制でき固定抵抗としての性能を向上できる。   At this time, it is preferable that the first soft magnetic body is further disposed outside both outer surfaces of the element portion located on both sides in the element width direction. Thereby, it can suppress more effectively that a magnetic field penetrate | invades in the element part which comprises the said magnetoresistive effect element, and can improve the performance as fixed resistance.

あるいは本発明では、前記固定抵抗素子を構成する前記素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、
一つの前記第1軟磁性体が、前記固定抵抗素子を構成する全ての前記素子部の上方を覆う大きさで形成されている構造に出来る。
Alternatively, in the present invention, a plurality of the element parts constituting the fixed resistance element are arranged at intervals in the element width direction, and the ends of each element part are connected to form a meander shape,
One said 1st soft-magnetic body can be made into the structure currently formed in the magnitude | size which covers the upper part of all the said element parts which comprise the said fixed resistance element.

本発明では、前記磁気抵抗効果素子を構成する素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、各素子部の両側方、真上、あるいは真下のいずれかに前記素子幅W1と同じ方向での幅寸法がW3、素子長さ方向と同じ方向での長さ寸法がL3の第2軟磁性体が前記素子部と非接触で形成され、
前記第2軟磁性体の前記長さ寸法L3は前記素子長さL1より長く、前記軟磁性体は、前記素子部の素子長さ方向の両側から前記素子長さ方向に延出する延出部を備えている構造に出来る。例えば本発明の磁気センサは地磁気センサとして使用されるが、上記の構成により磁気抵抗効果素子に対して感度軸と直交方向から流入する外部磁場を適切にシールドでき、地磁気センサとして有効に使用できる。
In the present invention, a plurality of element portions constituting the magnetoresistive effect element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape. The second soft magnetic body having a width dimension W3 in the same direction as the element width W1 and a length dimension L3 in the same direction as the element length direction is either on either side, directly above or directly below the portion. Formed without contact with the element,
The length L3 of the second soft magnetic body is longer than the element length L1, and the soft magnetic body extends from both sides of the element portion in the element length direction in the element length direction. It can be made a structure equipped with. For example, although the magnetic sensor of the present invention is used as a geomagnetic sensor, the above configuration can appropriately shield an external magnetic field flowing from the direction orthogonal to the sensitivity axis with respect to the magnetoresistive effect element, and can be effectively used as a geomagnetic sensor.

また本発明は、磁気抵抗効果素子と、前記磁気抵抗効果素子に出力取出し部を介して直列接続される固定抵抗素子とを備えた磁気センサの製造方法において、
基板上に、磁化方向が固定される固定磁性層と、前記固定磁性層に非磁性層を介して積層された外部磁場を受けて磁化方向が変動するフリー磁性層とを有する積層膜を形成し、
固定抵抗素子形成領域に位置する前記積層膜をパターニングして、素子幅W1に比べて素子長さL1が長く形成された細長形状の素子部を形成する工程、
磁気抵抗効果素子形成領域に、前記固定磁性層と、前記固定磁性層に前記非磁性層を介して積層された前記フリー磁性層とを有する素子部を形成する工程、
前記固定抵抗素子を構成する素子部の固定磁性層を素子長さ方向に固定磁化し、また、前記磁気抵抗効果素子を構成する素子部の固定磁性層を素子幅方向に固定磁化する工程、
前記素子部の素子長さ方向の両側に電極部を形成する工程、
前記素子部上に絶縁層を形成する工程、
前記固定抵抗素子を構成する素子部上に前記絶縁層を介して、前記素子幅W1と同方向への幅寸法W2が前記素子幅W1よりも大きく前記素子部の素子幅の両側から素子幅方向に延出する延出部を備えるとともに、前記素子長さL1と同方向への長さ寸法L2が前記素子長さL1よりも大きく前記素子部の素子長さ方向の両側から素子長さ方向に延出する延出部を備え、且つ前記長さ寸法L2が前記幅寸法W2よりも大きい第1軟磁性体を形成する工程、
を有することを特徴とするものである。
Further, the present invention relates to a method for manufacturing a magnetic sensor comprising a magnetoresistive effect element and a fixed resistance element connected in series to the magnetoresistive effect element via an output extraction portion.
A laminated film having a pinned magnetic layer whose magnetization direction is fixed and a free magnetic layer whose magnetization direction is changed by receiving an external magnetic field laminated on the pinned magnetic layer via a nonmagnetic layer is formed on a substrate. ,
Patterning the laminated film located in the fixed resistance element forming region to form an elongated element portion in which the element length L1 is longer than the element width W1;
Forming an element portion having the pinned magnetic layer in the magnetoresistive element forming region and the free magnetic layer laminated on the pinned magnetic layer via the nonmagnetic layer;
A step of fixedly magnetizing the fixed magnetic layer of the element portion constituting the fixed resistance element in the element length direction, and a fixed magnetization of the fixed magnetic layer of the element portion constituting the magnetoresistive effect element in the element width direction;
Forming electrode portions on both sides of the element portion in the element length direction;
Forming an insulating layer on the element portion;
A width dimension W2 in the same direction as the element width W1 is larger than the element width W1 via the insulating layer on the element portion constituting the fixed resistance element, and the element width direction from both sides of the element width of the element portion And a length dimension L2 in the same direction as the element length L1 is larger than the element length L1 from both sides of the element length direction in the element length direction. Forming a first soft magnetic body that includes an extending portion that extends and the length dimension L2 is greater than the width dimension W2.
It is characterized by having.

上記の製造方法によれば、固定磁性層、非磁性層及びフリー磁性層を備える素子部の上方に第1軟磁性体を形成することで適切且つ簡単に固定抵抗化できる。よって従来に比べて固定抵抗素子を簡単に製造できる。また磁気抵抗効果素子と固定抵抗素子の抵抗変化温度係数(TCR)を従来に比べて簡単に一致させることが出来る。   According to the above manufacturing method, the fixed resistance can be appropriately and easily formed by forming the first soft magnetic body above the element portion including the fixed magnetic layer, the nonmagnetic layer, and the free magnetic layer. Therefore, the fixed resistance element can be easily manufactured as compared with the conventional case. Also, the resistance change temperature coefficient (TCR) of the magnetoresistive effect element and the fixed resistance element can be easily matched as compared with the conventional case.

本発明では、前記磁気抵抗効果素子を構成する素子部は、磁気抵抗効果素子形成領域に位置する前記積層膜をパターニングして、素子幅に比べて素子長さが長く形成された細長形状で形成されたものであり、
前記積層膜の固定磁性層を固定磁化する工程を備え、
前記積層膜から各素子部をパターン形成する際に、前記磁気抵抗効果素子を構成する素子部の固定磁性層の固定磁化方向が素子幅方向を向き、固定抵抗素子を構成する素子部の固定磁性層の固定磁化方向が素子長さ方向を向くように、前記磁気抵抗効果素子を構成する素子部の素子長さ方向を固定磁化方向に対して直交する方向に、前記固定抵抗素子を構成する素子部の素子長さ方向を固定磁化方向に向けてパターン形成することが好ましい。
In the present invention, the element part constituting the magnetoresistive effect element is formed in an elongated shape in which the laminated film located in the magnetoresistive effect element forming region is patterned and the element length is longer than the element width. It has been
Comprising fixed magnetization of the pinned magnetic layer of the laminated film,
When patterning each element part from the laminated film, the fixed magnetization direction of the fixed magnetic layer of the element part constituting the magnetoresistive effect element faces the element width direction, and the fixed magnetism of the element part constituting the fixed resistor element The element constituting the fixed resistance element in such a direction that the element length direction of the element portion constituting the magnetoresistive effect element is orthogonal to the fixed magnetization direction so that the fixed magnetization direction of the layer faces the element length direction It is preferable to form a pattern with the element length direction of the portion directed to the fixed magnetization direction.

あるいは本発明では、前記磁気抵抗効果素子を構成する素子部は、磁気抵抗効果素子形成領域に位置する前記積層膜をパターニングして、素子幅に比べて素子長さが長く形成された細長形状で形成されたものであり、
前記磁気抵抗効果素子を構成する素子部の素子長さ方向と、前記固定抵抗素子を構成する素子部の素子長さ方向とが直交するように各素子部を前記積層膜からパターン形成し、
同じ固定磁性層の固定磁化工程にて、前記磁気抵抗効果素子を構成する素子部の固定磁性層を素子幅方向に固定磁化し、固定抵抗素子を構成する素子部の固定磁性層を素子長さ方向に固定磁化することが好ましい。
Alternatively, in the present invention, the element portion constituting the magnetoresistive effect element has an elongated shape formed by patterning the laminated film located in the magnetoresistive effect element forming region so that the element length is longer than the element width. Formed,
Each element portion is patterned from the laminated film so that the element length direction of the element portion constituting the magnetoresistive effect element and the element length direction of the element portion constituting the fixed resistance element are orthogonal to each other,
In the fixed magnetization step of the same fixed magnetic layer, the fixed magnetic layer of the element part constituting the magnetoresistive effect element is fixedly magnetized in the element width direction, and the fixed magnetic layer of the element part constituting the fixed resistance element is element length It is preferable to perform fixed magnetization in the direction.

上記により、前記積層膜から磁気抵抗効果素子を構成する素子部と、固定抵抗素子を構成する素子部とを同じ工程でパターニングできるため、抵抗値を合わせ込む工程が必要ない等、前記固定抵抗素子を従来よりも簡単に製造できる。また、磁気抵抗効果素子の固定磁性層に対する固定磁化工程と、固定抵抗素子の固定磁性層に対する固定磁化工程とを別々に行う必要がなく、より簡単かつ適切に固定抵抗素子を製造できる。   According to the above, since the element part constituting the magnetoresistive effect element and the element part constituting the fixed resistance element can be patterned in the same process from the laminated film, there is no need for a process for adjusting the resistance value. Can be manufactured more easily than before. In addition, it is not necessary to separately perform the fixed magnetization process for the fixed magnetic layer of the magnetoresistive effect element and the fixed magnetization process for the fixed magnetic layer of the fixed resistance element, and the fixed resistance element can be manufactured more easily and appropriately.

また本発明では、前記固定抵抗素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成し、
前記固定抵抗素子を構成する各素子部の上方に絶縁層を介して個別に前記第1軟磁性体を配置することが出来る。
Further, in the present invention, a plurality of the element parts constituting the fixed resistance element are arranged at intervals in the element width direction, and the ends of each element part are connected to form a meander shape,
The first soft magnetic body can be individually disposed above each element portion constituting the fixed resistance element via an insulating layer.

このとき、前記第1軟磁性体を、さらに、素子幅方向の両側に位置する前記素子部の両外側面より外側にも配置することが、固定抵抗としての性能を向上させる上で好ましい。   At this time, it is preferable to dispose the first soft magnetic body further outside the outer side surfaces of the element portion located on both sides in the element width direction in order to improve the performance as a fixed resistance.

あるいは本発明では、前記固定抵抗素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成し、
一つの前記第1軟磁性体を、前記固定抵抗素子を構成する全ての前記素子部の上方を覆う大きさで形成することが出来る。
Alternatively, in the present invention, a plurality of the element portions constituting the fixed resistance element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape,
One said 1st soft magnetic body can be formed in the magnitude | size which covers the upper direction of all the said element parts which comprise the said fixed resistance element.

また本発明では、前記磁気抵抗効果素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成しており、
前記第1軟磁性層を形成する工程と同じ工程時に、前記磁気抵抗効果素子を構成する各素子部の両側方、あるいは真上のいずれかに前記素子幅W1と同じ方向での幅寸法がW3、素子長さ方向と同じ方向での長さ寸法がL3の第2軟磁性体を絶縁層を介して形成し、
このとき、前記第2軟磁性体の前記長さ寸法L3を前記素子長さL1より長く形成し、さらに前記第2軟磁性体を、前記磁気抵抗効果素子の素子長さ方向の両側から前記素子長さ方向に延出する延出部を備えて形成すると、感度軸方向からの外部磁場にのみ適切に感度を持つ磁気センサを製造できる。
Further, in the present invention, a plurality of the element portions constituting the magnetoresistive effect element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape. ,
In the same step as the step of forming the first soft magnetic layer, the width dimension in the same direction as the element width W1 is W3 on either side of or directly above each element portion constituting the magnetoresistive element. Forming a second soft magnetic body having a length dimension L3 in the same direction as the element length direction through an insulating layer;
At this time, the length L3 of the second soft magnetic body is formed longer than the element length L1, and the second soft magnetic body is further moved from both sides of the magnetoresistive element in the element length direction. When formed with an extending portion extending in the length direction, a magnetic sensor having appropriate sensitivity only for an external magnetic field from the sensitivity axis direction can be manufactured.

また、前記第1軟磁性体を素子部の上方に形成せず、あるいは素子部の上方とともに、前記第1軟磁性体を、前記素子部の下側に絶縁層を介して形成することも可能である。   Also, the first soft magnetic body may not be formed above the element portion, or the first soft magnetic body may be formed below the element portion with an insulating layer along with the upper portion of the element portion. It is.

本発明によれば、固定抵抗素子及び磁気抵抗効果素子の抵抗変化温度係数(TCR)を従来に比べて等しくでき、また、抵抗値を合わせ込む必要ない等、前記固定抵抗素子を従来よりも簡単に製造できる磁気センサを提供できる。   According to the present invention, the resistance change temperature coefficient (TCR) of the fixed resistance element and the magnetoresistive effect element can be made equal to the conventional one, and the fixed resistance element is simpler than the conventional one, such as no need to match the resistance value. It is possible to provide a magnetic sensor that can be manufactured.

図1は第1実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す図((a)は部分平面図、(b)は、(a)のA−A線に沿って高さ方向(図示Z方向)に切断し矢印方向から見た部分断面図)、(c)は、(a)のB−B線に沿って高さ方向(図示Z方向)に切断し矢印方向から見た部分断面図)、図2は第2実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す部分平面図、図3は第3実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す部分平面図、図4は、磁気抵抗効果素子の固定磁性層の固定磁化方向及びフリー磁性層の磁化方向と、電気抵抗値との関係を説明するための図、図5は、磁気抵抗効果素子を膜厚方向から切断した際の切断面を示す断面図、図6は、本実施形態の磁気センサの回路図、である。   1A and 1B are views showing a part of a magnetoresistive effect element and a fixed resistance element of the magnetic sensor according to the first embodiment ((a) is a partial plan view, and (b) is taken along line AA in (a)). (C) is a partial cross-sectional view cut in the height direction (Z direction in the figure) and viewed from the arrow direction), (c) is cut in the height direction (Z direction in the figure) along the BB line in (a). 2 is a partial plan view showing a part of the magnetoresistive effect element and the fixed resistance element of the magnetic sensor in the second embodiment, and FIG. 3 is a magnetoresistive of the magnetic sensor in the third embodiment. FIG. 4 is a partial plan view showing portions of the effect element and the fixed resistance element, and FIG. 4 is a diagram for explaining the relationship between the fixed magnetization direction of the fixed magnetic layer and the magnetization direction of the free magnetic layer of the magnetoresistive effect element and the electric resistance value. Fig. 5 shows cutting when the magnetoresistive element is cut from the film thickness direction. Sectional view, FIG. 6 shows a shows a circuit diagram of a magnetic sensor of the present embodiment, it is.

本実施形態における磁気抵抗効果素子及び固定抵抗素子を備えた磁気センサ1は例えば携帯電話等の携帯機器に搭載される地磁気センサとして使用される。   The magnetic sensor 1 provided with the magnetoresistive effect element and the fixed resistance element in the present embodiment is used as a geomagnetic sensor mounted on a mobile device such as a mobile phone.

前記磁気センサ1は、図6に示すように、磁気抵抗効果素子2,3と固定抵抗素子4,5とがブリッジ接続されてなるセンサ部6と、前記センサ部6と電気接続された入力端子7、グランド端子8、差動増幅器9及び外部出力端子10等を備えた集積回路(IC)11とで構成される。   As shown in FIG. 6, the magnetic sensor 1 includes a sensor unit 6 in which magnetoresistive elements 2 and 3 and fixed resistor elements 4 and 5 are bridge-connected, and an input terminal electrically connected to the sensor unit 6. 7, an integrated circuit (IC) 11 having a ground terminal 8, a differential amplifier 9, an external output terminal 10, and the like.

前記磁気抵抗効果素子2,3は、図1に示すように、素子幅W1に比べて素子長さL1が長く形成された図示X方向に細長い形状の複数の素子部12がX方向に直交するY方向に所定の間隔を空けて並設され、各素子部12の端部間が接続電極部13により電気的に接続されてミアンダ形状となっている。ミアンダ形状に形成された両端にある素子部12の一方には入力端子7、グランド端子8、あるいは出力取出し部14に接続される電極部15が接続されている。   As shown in FIG. 1, the magnetoresistive effect elements 2 and 3 have a plurality of element portions 12 that are formed in an element length L1 longer than the element width W1 and are elongated in the X direction in the figure, and are orthogonal to the X direction. They are arranged in parallel in the Y direction with a predetermined interval, and the end portions of the respective element portions 12 are electrically connected by the connection electrode portions 13 to form a meander shape. An electrode portion 15 connected to the input terminal 7, the ground terminal 8, or the output extraction portion 14 is connected to one of the element portions 12 at both ends formed in a meander shape.

前記磁気抵抗効果素子2,3を構成する各素子部12は、全て図5に示す同じ積層構造で構成される。なお図5は、素子幅W1と平行な方向から膜厚方向に切断した切断面を示している。   All the element portions 12 constituting the magnetoresistive effect elements 2 and 3 have the same laminated structure shown in FIG. FIG. 5 shows a cut surface cut in the film thickness direction from the direction parallel to the element width W1.

前記素子部12は、反強磁性層33、固定磁性層34、非磁性層35、およびフリー磁性層36の順に積層されて成膜され、フリー磁性層36の表面が保護層37で覆われている。前記素子部12は例えばスパッタにて形成される。   The element portion 12 is formed by laminating an antiferromagnetic layer 33, a pinned magnetic layer 34, a nonmagnetic layer 35, and a free magnetic layer 36 in this order, and the surface of the free magnetic layer 36 is covered with a protective layer 37. Yes. The element unit 12 is formed by sputtering, for example.

反強磁性層33は、Ir−Mn合金(イリジウム−マンガン合金)などの反強磁性材料で形成されている。固定磁性層34はCo−Fe合金(コバルト−鉄合金)などの軟磁性材料で形成されている。非磁性層35はCu(銅)などである。フリー磁性層36は、Ni−Fe合金(ニッケル−鉄合金)などの軟磁性材料で形成されている。保護層37はTa(タンタル)の層である。上記構成では非磁性層35がCu等の非磁性導電材料で形成された巨大磁気抵抗効果素子(GMR素子)であるが、Al2O3等の絶縁材料で形成されたトンネル型磁気抵抗効果素子(TMR素子)であってもよい。   The antiferromagnetic layer 33 is made of an antiferromagnetic material such as an Ir—Mn alloy (iridium-manganese alloy). The pinned magnetic layer 34 is formed of a soft magnetic material such as a Co—Fe alloy (cobalt-iron alloy). The nonmagnetic layer 35 is made of Cu (copper) or the like. The free magnetic layer 36 is made of a soft magnetic material such as a Ni—Fe alloy (nickel-iron alloy). The protective layer 37 is a Ta (tantalum) layer. In the above configuration, the nonmagnetic layer 35 is a giant magnetoresistive effect element (GMR element) formed of a nonmagnetic conductive material such as Cu, but a tunnel type magnetoresistive effect element (TMR element) formed of an insulating material such as Al2O3. ).

素子部12では、反強磁性層33と固定磁性層34との間で生じた交換結合磁界(HeX)により、固定磁性層34の磁化方向が固定されている。図1及び図5に示すように、前記固定磁性層34の固定磁化方向(P方向)は、素子幅W1方向(Y方向)に向いている。すなわち固定磁性層34の固定磁化方向(P方向)は、素子部12の素子長さ方向(長手方向)と直交している。   In the element portion 12, the magnetization direction of the fixed magnetic layer 34 is fixed by an exchange coupling magnetic field (HeX) generated between the antiferromagnetic layer 33 and the fixed magnetic layer 34. As shown in FIGS. 1 and 5, the pinned magnetization direction (P direction) of the pinned magnetic layer 34 faces the element width W1 direction (Y direction). That is, the fixed magnetization direction (P direction) of the fixed magnetic layer 34 is orthogonal to the element length direction (longitudinal direction) of the element unit 12.

一方、前記フリー磁性層36の磁化方向(F方向)は、外部磁場の方向に向けて変動する。   On the other hand, the magnetization direction (F direction) of the free magnetic layer 36 varies toward the direction of the external magnetic field.

図4に示すように、固定磁性層34の固定磁化方向(P方向)と同一方向から外部磁場Y1が作用して前記フリー磁性層36の磁化方向(F方向)が前記外部磁場Y1方向に向くと、前記固定磁性層34の固定磁化方向(P方向)とフリー磁性層36の磁化方向(F方向)とが平行に近づき電気抵抗値が低下する。   As shown in FIG. 4, the external magnetic field Y1 acts from the same direction as the fixed magnetization direction (P direction) of the fixed magnetic layer 34, and the magnetization direction (F direction) of the free magnetic layer 36 faces the external magnetic field Y1 direction. Then, the fixed magnetization direction (P direction) of the fixed magnetic layer 34 and the magnetization direction (F direction) of the free magnetic layer 36 approach each other, and the electric resistance value decreases.

一方、図4に示すように、固定磁性層34の固定磁化方向(P方向)と反対方向から外部磁場Y2が作用して前記フリー磁性層36の磁化方向(F方向)が前記外部磁場Y2方向に向くと、前記固定磁性層34の固定磁化方向(P方向)とフリー磁性層36の磁化方向(F方向)とが反平行に近づき電気抵抗値が増大する。   On the other hand, as shown in FIG. 4, the external magnetic field Y2 acts from the direction opposite to the fixed magnetization direction (P direction) of the fixed magnetic layer 34, and the magnetization direction (F direction) of the free magnetic layer 36 changes to the external magnetic field Y2 direction. , The fixed magnetization direction (P direction) of the fixed magnetic layer 34 and the magnetization direction (F direction) of the free magnetic layer 36 approach antiparallel, and the electrical resistance value increases.

図1(b)に示すように前記磁気抵抗効果素子2,3は基板16上に形成される。前記磁気抵抗効果素子2,3上はAl2O3やSiO2等の絶縁層17に覆われる。また前記磁気抵抗効果素子2,3を構成する素子部12間も前記絶縁層17で埋められる。前記絶縁層17は例えばスパッタにて形成される。   As shown in FIG. 1B, the magnetoresistive elements 2 and 3 are formed on a substrate 16. The magnetoresistive elements 2 and 3 are covered with an insulating layer 17 such as Al2O3 or SiO2. The space between the element portions 12 constituting the magnetoresistive effect elements 2 and 3 is also filled with the insulating layer 17. The insulating layer 17 is formed by sputtering, for example.

図1(b)のように前記絶縁層17の上面は、例えばCMP技術を用いて平坦面に形成されている。ただし、前記絶縁層17の上面は、前記素子部12と前記基板16間の段差に倣った凹凸面であってもよい。   As shown in FIG. 1B, the upper surface of the insulating layer 17 is formed on a flat surface by using, for example, a CMP technique. However, the upper surface of the insulating layer 17 may be an uneven surface following the step between the element portion 12 and the substrate 16.

図1(a)(b)に示すように、磁気抵抗効果素子2,3を構成する各素子部12の真上には絶縁層17を介して、第2軟磁性体18が設けられている。前記第2軟磁性体18は例えばスパッタやメッキにて薄膜形成される。前記第2軟磁性体18は、NiFe、CoFe、CoFeSiBやCoZrNb等で形成される。前記第2軟磁性体18の幅寸法W3は前記素子部12の素子幅W1より小さい。また、前記第2軟磁性体18の長さ寸法L3は前記素子部12の素子長さL1よりも長く、図1(a)に示すように、第2軟磁性体18は、前記素子部12の素子長さ方向(X方向)の両側から前記素子長さ方向に延出する延出部18aを備える。   As shown in FIGS. 1A and 1B, a second soft magnetic body 18 is provided via an insulating layer 17 directly above each element portion 12 constituting the magnetoresistive effect elements 2 and 3. . The second soft magnetic body 18 is formed into a thin film by sputtering or plating, for example. The second soft magnetic body 18 is made of NiFe, CoFe, CoFeSiB, CoZrNb, or the like. The width dimension W3 of the second soft magnetic body 18 is smaller than the element width W1 of the element portion 12. In addition, the length dimension L3 of the second soft magnetic body 18 is longer than the element length L1 of the element section 12, and the second soft magnetic body 18 includes the element section 12 as shown in FIG. Extending portions 18a extending in the element length direction from both sides in the element length direction (X direction).

図示しないが前記第2軟磁性体18上及び前記第2軟磁性体18間は絶縁性の保護層にて覆われている。   Although not shown, the second soft magnetic body 18 and the second soft magnetic body 18 are covered with an insulating protective layer.

図1(a)に示すように出力取出し部14を介して磁気抵抗効果素子2,3と直列接続される固定抵抗素子4,5も前記磁気抵抗効果素子2,3と同じ素子部12を備える。すなわち、図5で説明した積層構造を備え、素子幅がW1で、素子長さがL1である。また前記固定抵抗素子4,5を構成する素子部12も端部どうしが接続電極部13を介して接続されミアンダ形状となっている。   As shown in FIG. 1A, the fixed resistance elements 4 and 5 connected in series to the magnetoresistive effect elements 2 and 3 via the output extraction section 14 also include the same element section 12 as the magnetoresistive effect elements 2 and 3. . In other words, the stacked structure described in FIG. 5 is provided, the element width is W1, and the element length is L1. Further, the end portions of the element portions 12 constituting the fixed resistance elements 4 and 5 are connected to each other through the connection electrode portion 13 and have a meander shape.

前記固定抵抗素子4,5のミアンダ形状は、前記磁気抵抗効果素子2,3のミアンダ形状を反時計方向に90°回転させた形状に一致している。図1(c)に示すように、固定抵抗素子4,5も磁気抵抗効果素子2,3と同様に基板16上に形成される。そして前記磁気抵抗効果素子2,3上を覆う絶縁層17にて前記固定抵抗素子4,5上も覆われ、前記固定抵抗素子4,5の上方には前記絶縁層17を介して第1軟磁性体23が配置されている。   The meander shape of the fixed resistance elements 4 and 5 matches the shape obtained by rotating the meander shape of the magnetoresistive effect elements 2 and 3 by 90 ° counterclockwise. As shown in FIG. 1C, the fixed resistance elements 4 and 5 are also formed on the substrate 16 in the same manner as the magnetoresistance effect elements 2 and 3. The fixed resistance elements 4 and 5 are also covered with an insulating layer 17 covering the magnetoresistive effect elements 2 and 3, and a first soft layer is interposed above the fixed resistance elements 4 and 5 via the insulating layer 17. A magnetic body 23 is arranged.

前記第1軟磁性体23は、前記固定抵抗素子4,5を構成する素子幅W1と同方向(X方向)に幅寸法W2で、前記素子長さL1と同方向(Y方向)に長さ寸法L2で形成される。前記幅寸法W2は素子幅W1より大きく、前記第1軟磁性体23は前記素子部12の素子幅の両側から素子幅方向に延出する延出部23aを備える。また、前記長さ寸法L2は前記素子長さL1よりも大きく、前記第1軟磁性体23は、前記素子部12の素子長さ方向(Y方向)の両側から素子長さ方向に延出する延出部23bを備える。また図1(a)に示すように前記長さ寸法L2は前記幅寸法W2より大きい。すなわち前記第1軟磁性体23は図示Y方向に細長い形状で形成されている。   The first soft magnetic body 23 has a width dimension W2 in the same direction (X direction) as the element width W1 constituting the fixed resistance elements 4 and 5, and a length in the same direction (Y direction) as the element length L1. It is formed with a dimension L2. The width dimension W2 is larger than the element width W1, and the first soft magnetic body 23 includes extending portions 23a extending in the element width direction from both sides of the element width of the element portion 12. The length dimension L2 is larger than the element length L1, and the first soft magnetic body 23 extends in the element length direction from both sides of the element portion 12 in the element length direction (Y direction). The extending part 23b is provided. As shown in FIG. 1A, the length dimension L2 is larger than the width dimension W2. That is, the first soft magnetic body 23 is formed in an elongated shape in the Y direction in the figure.

上記したように、前記磁気抵抗効果素子2,3の固定磁性層34の固定磁化方向(P方向)は、素子幅方向(Y方向)に向けられていたが、固定抵抗素子4,5の固定磁性層34の固定磁化方向(P方向)は、素子長さ方向(Y方向)に向けられている。図1の形態では、磁気抵抗効果素子2,3を構成する素子部12と、固定抵抗素子4,5を構成する素子部12が直交する関係にあるため、前記磁気抵抗効果素子2,3の固定磁性層34の固定磁化方向(P方向)と、前記固定抵抗素子4,5の固定磁性層34の固定磁化方向(P方向)とは一致している。図1の形態では共に固定磁化方向(P方向)が紙面上方向(Y方向)である。   As described above, the fixed magnetization direction (P direction) of the fixed magnetic layer 34 of the magnetoresistive effect elements 2 and 3 is oriented in the element width direction (Y direction), but the fixed resistance elements 4 and 5 are fixed. The fixed magnetization direction (P direction) of the magnetic layer 34 is oriented in the element length direction (Y direction). In the form of FIG. 1, since the element portion 12 constituting the magnetoresistive effect elements 2 and 3 and the element portion 12 constituting the fixed resistance elements 4 and 5 are orthogonal to each other, The fixed magnetization direction (P direction) of the fixed magnetic layer 34 and the fixed magnetization direction (P direction) of the fixed magnetic layer 34 of the fixed resistance elements 4 and 5 coincide with each other. In both the forms of FIG. 1, the fixed magnetization direction (P direction) is the upward direction (Y direction) of the drawing.

各寸法について説明する。
前記磁気抵抗効果素子2,3を構成する素子部12の素子幅W1は、5〜8μmの範囲内である(図1(a)参照)。また固定抵抗素子4,5を構成する素子部12の素子幅W1は、磁気センサとして使用する場合、2〜6μm程度である。また前記素子部12の素子長さL1は、60〜100μmの範囲内である(図1(a)参照)。また、前記素子部12の膜厚T1は、200〜300Åの範囲内である(図1(b)参照)。また前記第2軟磁性体18の幅寸法W3は、地磁気センサとして使用する場合、W1より狭くかつ、2〜6μmの範囲内である(図1(a)参照)。前記素子部12のアスペクト比(素子長さL1/素子幅W1)は、地磁気センサとして使用する場合は10以上である。また第2軟磁性体18のアスペクト比(長さ寸法L3/幅寸法W3)は、磁気抵抗効果素子2,3を構成する素子部12のアスペクト比以上である。また前記第2軟磁性体18の長さ寸法L3は、80〜200μmの範囲内である(図1(a)参照)。また、前記第2軟磁性体18の膜厚T2は、2000〜10000Åの範囲内である(図1(b)参照)。
Each dimension will be described.
The element width W1 of the element part 12 which comprises the said magnetoresistive effect elements 2 and 3 exists in the range of 5-8 micrometers (refer Fig.1 (a)). Moreover, the element width W1 of the element part 12 which comprises the fixed resistance elements 4 and 5 is about 2-6 micrometers when using it as a magnetic sensor. The element length L1 of the element unit 12 is in the range of 60 to 100 μm (see FIG. 1A). Moreover, the film thickness T1 of the element portion 12 is in the range of 200 to 300 mm (see FIG. 1B). The width dimension W3 of the second soft magnetic body 18 is narrower than W1 and within a range of 2 to 6 μm when used as a geomagnetic sensor (see FIG. 1A). The aspect ratio (element length L1 / element width W1) of the element portion 12 is 10 or more when used as a geomagnetic sensor. The aspect ratio (length dimension L3 / width dimension W3) of the second soft magnetic body 18 is equal to or greater than the aspect ratio of the element portion 12 constituting the magnetoresistive effect elements 2 and 3. The length L3 of the second soft magnetic body 18 is in the range of 80 to 200 μm (see FIG. 1A). The film thickness T2 of the second soft magnetic body 18 is in the range of 2000 to 10,000 mm (see FIG. 1B).

各第2軟磁性体18間の距離(Y方向への距離)T3は、6〜10μmである(図1(b)参照)。また、前記第2軟磁性体18と素子部12間の高さ方向(Z方向)への距離T5は、0.1〜1μmである(図1(b)参照)。   A distance (distance in the Y direction) T3 between the second soft magnetic bodies 18 is 6 to 10 μm (see FIG. 1B). A distance T5 in the height direction (Z direction) between the second soft magnetic body 18 and the element portion 12 is 0.1 to 1 μm (see FIG. 1B).

また前記第1軟磁性体23の幅寸法W2は、6〜10μm(素子幅以上)である(図1(a)参照)。また前記第1軟磁性体23の長さ寸法L2は、80〜200μmである(図1(a)参照)。前記第1軟磁性体23のアスペクト比(長さ寸法L2/幅寸法W2)は、10以上である。また各第1軟磁性体23間の距離(X方向への距離)T4は、2μm以上である(図1(c)参照)。   The width dimension W2 of the first soft magnetic body 23 is 6 to 10 μm (element width or more) (see FIG. 1A). The length L2 of the first soft magnetic body 23 is 80 to 200 μm (see FIG. 1A). The aspect ratio (length dimension L2 / width dimension W2) of the first soft magnetic body 23 is 10 or more. The distance between the first soft magnetic bodies 23 (distance in the X direction) T4 is 2 μm or more (see FIG. 1C).

前記第1軟磁性体23の膜厚は、前記第2軟磁性体18の膜厚T2と同じであり、前記第1軟磁性体23と素子部12間の高さ方向(Z方向)への距離は、前記第2軟磁性体18と素子部12間の高さ方向(Z方向)への距離T5と同じである。   The film thickness of the first soft magnetic body 23 is the same as the film thickness T2 of the second soft magnetic body 18 and extends in the height direction (Z direction) between the first soft magnetic body 23 and the element portion 12. The distance is the same as the distance T5 in the height direction (Z direction) between the second soft magnetic body 18 and the element portion 12.

本実施形態では、磁気抵抗効果素子2,3及び固定抵抗素子4,5に同じ素子部12を用いるので、磁気抵抗効果素子2,3と固定抵抗素子4,5の抵抗変化温度係数(TCR)を等しく出来る。また抵抗値も同じであるため従来のように抵抗値を合わせ込むためのパターニング工程が必要ない。   In this embodiment, since the same element portion 12 is used for the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5, the resistance change temperature coefficient (TCR) of the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 is used. Can be made equal. Further, since the resistance value is the same, a patterning process for matching the resistance value as in the prior art is not required.

また前記固定抵抗素子4,5の上方には、前記固定抵抗素子4,5の素子部12を平面視にて完全に覆うとともに、幅寸法W2より長さ寸法L2を長く形成した細長形状の第1軟磁性体23を対向させることで、前記固定抵抗素子4,5を構成する素子部12に流入する外部磁場を適切にシールドできる。また第1軟磁性体23の透磁率は素子部12の透磁率よりも大きい。このため、前記外部磁場のほとんどが第1軟磁性体23側を流れ、素子部12に流入する外部磁場を非常に小さくでき、固定抵抗素子4,5を構成する前記素子部12での抵抗変化率(MR比)を非常に小さくできる。図1に示す磁気センサ1が地磁気センサの場合、地磁気と機器内部で発生する漏洩磁場とを合わせた外部磁場は5〜10Oe程度であり、このとき、固定抵抗素子4,5の抵抗変化率(MR比)を0.2%以下に抑えることが可能になる。   Further, above the fixed resistance elements 4 and 5, the element portion 12 of the fixed resistance elements 4 and 5 is completely covered in a plan view, and a long and narrow length L2 is formed longer than the width dimension W2. By making the 1 soft magnetic body 23 face each other, the external magnetic field flowing into the element portion 12 constituting the fixed resistance elements 4 and 5 can be appropriately shielded. Further, the magnetic permeability of the first soft magnetic body 23 is larger than the magnetic permeability of the element portion 12. For this reason, most of the external magnetic field flows on the first soft magnetic body 23 side, the external magnetic field flowing into the element part 12 can be very small, and the resistance change in the element part 12 constituting the fixed resistance elements 4 and 5 The rate (MR ratio) can be made very small. When the magnetic sensor 1 shown in FIG. 1 is a geomagnetic sensor, the external magnetic field combining the geomagnetism and the leakage magnetic field generated inside the device is about 5 to 10 Oe. At this time, the resistance change rate ( MR ratio) can be suppressed to 0.2% or less.

ここで前記固定抵抗素子4,5を構成する上で重要な点は、前記固定抵抗素子4,5を構成する素子部12の固定磁性層34の固定磁化方向(P方向)を素子長さ方向に向け、さらに上記したように、前記素子部12の上方に配置される第1軟磁性体23を、素子部12を平面視にて完全に覆う大きさで、しかも素子部12の長手方向に向けて細長形状で形成している点にある。これにより、素子部12、及び第1軟磁性体23に磁化容易軸方向が共に同じ方向の形状異方性が付与される。また、磁化容易軸方向に固定磁性層34の固定磁化方向(P方向)及びフリー磁性層の磁化方向が向けられる。このような構成により、後述する実験でも適切に固定抵抗化できることがわかっている。   Here, the important point in configuring the fixed resistance elements 4 and 5 is that the fixed magnetization direction (P direction) of the fixed magnetic layer 34 of the element portion 12 configuring the fixed resistance elements 4 and 5 is the element length direction. Further, as described above, the first soft magnetic body 23 disposed above the element portion 12 is sized to completely cover the element portion 12 in a plan view, and in the longitudinal direction of the element portion 12. It is in the point which is formed in the elongated shape. Thereby, both the element part 12 and the first soft magnetic body 23 are given shape anisotropy having the same easy axis direction. Further, the fixed magnetization direction (P direction) of the fixed magnetic layer 34 and the magnetization direction of the free magnetic layer are oriented in the easy magnetization axis direction. With such a configuration, it has been found that a fixed resistance can be appropriately achieved even in experiments to be described later.

一方、例えば、前記固定抵抗素子4,5を構成する素子部12の固定磁性層34の固定磁化方向(P方向)を磁気抵抗効果素子2,3と同じように素子幅方向に向けた場合には、前述の構造と比べて抵抗変化率(MR比)を十分に小さくできない場合があることが後述する実験によりわかっている。また、例えば正方形状の第1軟磁性体23を用いた場合でも、抵抗変化率(MR比)を小さくできない場合があることが後述する実験によりわかっている。   On the other hand, for example, when the fixed magnetization direction (P direction) of the fixed magnetic layer 34 of the element portion 12 constituting the fixed resistance elements 4 and 5 is directed in the element width direction in the same manner as the magnetoresistance effect elements 2 and 3. It has been found from experiments to be described later that the rate of change in resistance (MR ratio) may not be sufficiently small as compared with the structure described above. Further, for example, it has been found from experiments to be described later that even when the first soft magnetic body 23 having a square shape is used, the resistance change rate (MR ratio) may not be reduced.

図1に示す実施形態では磁気抵抗効果素子2,3を構成する素子部12の上方にも第2軟磁性体18が設けられている。前記第2軟磁性体18は第1軟磁性体23と同じ工程時に形成される。前記第2軟磁性体18の幅寸法W3は素子部12の素子幅W1より小さいことが好ましい。一方、前記第2軟磁性体18の長さ寸法L3は素子部12の素子長さL1より長く形成され、前記第2軟磁性体18は、前記素子部12の素子長さ方向(長手方向)の両側から素子長さ方向(長手方向)に延出する延出部18aを備える。これにより、感度軸方向(Y方向)と直交するX方向から例えば漏洩磁場が作用したときに、前記漏洩磁場を前記第2軟磁性体18にてシールドできる。一方、感度軸方向(Y方向)からの外部磁場(地磁気)に対しては磁気センサとしての感度を保つことができ、地磁気の磁界強度に基づいて電気抵抗値の大きさが変動し、Y方向からの地磁気を適切に検知することが出来る。前記第2軟磁性体18は、感度軸方向からの外部磁場については適度な磁気シールドを発揮する。これにより、見かけ上、前記磁気抵抗効果素子2,3を構成する素子部12に流入する外部磁場の磁界強度を弱めることができ(磁界強度の増幅率を100%以下に出来る)、よって磁気飽和しにくくでき、磁場の強度変化に対して磁気抵抗効果素子2,3の抵抗変化率(あるいは電気抵抗値)が変動する線形領域(感度領域)を広く出来るという効果も奏する。   In the embodiment shown in FIG. 1, the second soft magnetic body 18 is also provided above the element portion 12 constituting the magnetoresistive effect elements 2 and 3. The second soft magnetic body 18 is formed in the same process as the first soft magnetic body 23. The width dimension W3 of the second soft magnetic body 18 is preferably smaller than the element width W1 of the element portion 12. On the other hand, the length L3 of the second soft magnetic body 18 is formed longer than the element length L1 of the element portion 12, and the second soft magnetic body 18 is formed in the element length direction (longitudinal direction) of the element portion 12. An extending portion 18a extending in the element length direction (longitudinal direction) is provided from both sides. Thus, for example, when a leakage magnetic field acts from the X direction orthogonal to the sensitivity axis direction (Y direction), the leakage magnetic field can be shielded by the second soft magnetic body 18. On the other hand, the sensitivity as a magnetic sensor can be maintained with respect to an external magnetic field (geomagnetism) from the sensitivity axis direction (Y direction), and the magnitude of the electric resistance value varies based on the magnetic field strength of the geomagnetism. The geomagnetism from can be detected properly. The second soft magnetic body 18 exhibits an appropriate magnetic shield with respect to the external magnetic field from the sensitivity axis direction. As a result, the magnetic field strength of the external magnetic field flowing into the element portion 12 constituting the magnetoresistive effect elements 2 and 3 can be apparently reduced (the amplification factor of the magnetic field strength can be reduced to 100% or less), and thus the magnetic saturation. In addition, the linear region (sensitivity region) in which the rate of change in resistance (or electrical resistance value) of the magnetoresistive effect elements 2 and 3 with respect to the change in magnetic field strength can be increased.

図2に示す他の実施形態では、第1軟磁性体23を一体化している。図2に示す第1軟磁性体23は、前記固定抵抗素子4,5を構成する全ての素子部12の上方を覆う大きさで形成される。ただし図1に示したのと同様に、図2に示す第2軟磁性体23の素子幅W1方向に向く幅寸法W2は、素子長さL1方向に向く長さ寸法L2より小さくなっている。この実施形態での第1軟磁性体23における素子部12からの延出部の長さ寸法は、X方向、Y方向ともに20μm以上であることが好ましい。   In another embodiment shown in FIG. 2, the first soft magnetic body 23 is integrated. The first soft magnetic body 23 shown in FIG. 2 is formed to have a size that covers the upper part of all the element portions 12 constituting the fixed resistance elements 4 and 5. However, as shown in FIG. 1, the width dimension W2 of the second soft magnetic body 23 shown in FIG. 2 that faces in the element width W1 direction is smaller than the length dimension L2 that faces in the element length L1 direction. In this embodiment, the length dimension of the extending portion from the element portion 12 in the first soft magnetic body 23 is preferably 20 μm or more in both the X direction and the Y direction.

なお図2に示す実施形態では、磁気抵抗効果素子2、3を構成する各素子部12の素子幅W1方向における両側方に第2軟磁性体18が設けられている。素子幅W1は、2〜6μm、第2軟磁性体18の素子幅W3はW1より小さく1〜6μmである。前記第2軟磁性体18は前記素子部12間に埋められた絶縁層17上に配置される。このような形態でも、感度軸方向(Y方向)と直交するX方向から作用する漏洩磁場を前記第2軟磁性体18にてシールドでき、また、感度軸方向(Y方向)からの外部磁場(地磁気)に対しては磁気センサとしての感度を保つことができ、地磁気の磁界強度に基づいて電気抵抗値の大きさが変動し、Y方向からの地磁気を適切に検知することが出来る。また前記第2軟磁性体18は、感度軸方向からの外部磁場については適度な磁気シールドを発揮し、磁場の強度変化に対して磁気抵抗効果素子2,3の抵抗変化率(あるいは電気抵抗値)が変動する線形領域(感度領域)を広く出来るという効果も奏する。   In the embodiment shown in FIG. 2, the second soft magnetic body 18 is provided on both sides in the element width W <b> 1 direction of the element portions 12 constituting the magnetoresistive effect elements 2 and 3. The element width W1 is 2 to 6 μm, and the element width W3 of the second soft magnetic body 18 is 1 to 6 μm smaller than W1. The second soft magnetic body 18 is disposed on the insulating layer 17 buried between the element portions 12. Even in such a configuration, the leakage magnetic field acting from the X direction orthogonal to the sensitivity axis direction (Y direction) can be shielded by the second soft magnetic body 18, and the external magnetic field (Y direction) from the sensitivity axis direction (Y direction) The sensitivity as a magnetic sensor can be maintained, and the magnitude of the electric resistance value varies based on the magnetic field strength of the geomagnetism, and the geomagnetism from the Y direction can be detected appropriately. The second soft magnetic body 18 exhibits an appropriate magnetic shield with respect to the external magnetic field from the sensitivity axis direction, and the resistance change rate (or electrical resistance value) of the magnetoresistive effect elements 2 and 3 with respect to the change in magnetic field strength. ) Also has an effect of widening a linear region (sensitivity region) in which fluctuates.

また、第1軟磁性体23と第2軟磁性体18とを同じ工程で形成できなくなるが、前記第2軟磁性体18を、磁気抵抗効果素子2,3を構成する素子部12の真下に間隔を空けて配置してもよい。   In addition, the first soft magnetic body 23 and the second soft magnetic body 18 cannot be formed in the same process, but the second soft magnetic body 18 is placed directly below the element portion 12 constituting the magnetoresistive effect elements 2 and 3. You may arrange | position at intervals.

次に図3に示す実施形態での固定抵抗素子4,5は、図1に示す固定抵抗素子4,5を時計方向に90°回転させた形状と同一である。図3では、磁気抵抗効果素子2,3を構成する素子部1と、固定抵抗素子4,5を構成する素子部12とが共に図示X方向を素子長さ方向(長手方向)として配置されている。前記固定抵抗素子4,5を構成する固定磁性層34の固定磁化方向(P方向)は、素子長さ方向であるX方向である。図3に示す形態でも第1軟磁性体23のシールド効果により固定抵抗素子4,5を構成する素子部12を適切に固定抵抗化できる。   Next, the fixed resistance elements 4 and 5 in the embodiment shown in FIG. 3 have the same shape as the fixed resistance elements 4 and 5 shown in FIG. In FIG. 3, the element portion 1 constituting the magnetoresistive effect elements 2 and 3 and the element portion 12 constituting the fixed resistance elements 4 and 5 are both arranged with the X direction shown in the figure as the element length direction (longitudinal direction). Yes. The fixed magnetization direction (P direction) of the fixed magnetic layer 34 constituting the fixed resistance elements 4 and 5 is the X direction which is the element length direction. In the form shown in FIG. 3 as well, the element portion 12 constituting the fixed resistance elements 4 and 5 can be appropriately fixed resistance by the shielding effect of the first soft magnetic body 23.

ただし図3の形態では、固定抵抗素子4,5を構成する素子部12の固定磁性層34の固定磁化方向(P方向;X方向)と、磁気抵抗効果素子2,3を構成する素子部12の固定磁性層34の固定磁化方向(P方向;Y方向)とが異なるため、磁気抵抗効果素子2,3及び固定抵抗素子4,5を同じ工程で固定磁化できない。よって、磁気抵抗効果素子2,3及び固定抵抗素子4,5を同じ工程で固定磁化するには図1(a)のように、磁気抵抗効果素子2,3を構成する素子部12の素子長さ方向と固定抵抗素子4,5を構成する素子部12の素子長さ方向とを直交させることが好適である。   However, in the form of FIG. 3, the fixed magnetization direction (P direction; X direction) of the fixed magnetic layer 34 of the element portion 12 constituting the fixed resistance elements 4 and 5 and the element portion 12 constituting the magnetoresistive effect elements 2 and 3. Since the fixed magnetization direction (P direction; Y direction) of the fixed magnetic layer 34 is different, the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 cannot be fixedly magnetized in the same process. Therefore, in order to fix and magnetize the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 in the same process, the element length of the element portion 12 constituting the magnetoresistive effect elements 2 and 3 as shown in FIG. It is preferable that the vertical direction and the element length direction of the element part 12 constituting the fixed resistance elements 4 and 5 are orthogonal to each other.

磁気抵抗効果素子2,3及び固定抵抗素子4,5を構成する素子部12はぞれぞれ一つだけでもよいが、複数設けてミアンダ形状にすることで、素子抵抗を大きくでき消費電力の低減を図ることができ好適である。   Each of the element parts 12 constituting the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 may be only one, but by providing a plurality of meander shapes, the element resistance can be increased and the power consumption can be reduced. Reduction can be achieved, which is preferable.

また、磁気抵抗効果素子2,3及び固定抵抗素子4,5は一つずつでもよいが、図6のようにブリッジ回路を構成し、出力取出し部14から得られた出力を差動増幅器9にて差動出力とすることで、出力値を大きくでき高精度な磁場検知を行うことが出来る。   The magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 may be provided one by one. However, as shown in FIG. 6, a bridge circuit is formed, and the output obtained from the output extraction unit 14 is supplied to the differential amplifier 9. By using differential output, the output value can be increased and high-precision magnetic field detection can be performed.

また第2軟磁性体18の形成は必須ではない。磁気センサ1の使用用途等に合わせて前記第2軟磁性体18の形成の有無を決定できる。   The formation of the second soft magnetic body 18 is not essential. Whether or not the second soft magnetic body 18 is formed can be determined in accordance with the use application of the magnetic sensor 1 or the like.

図7に示すように、第1軟磁性体24を、さらに、固定抵抗素子4,5を構成する素子幅方向の両側に位置する素子部12の両外側面12aより外側に位置させると固定抵抗化にはより好適である。図7には素子部12間を接続する接続電極部13や電極部15を図示していない。最も外側に位置する前記第1軟磁性体24は、各素子部12の上方に位置する第1軟磁性体23と同様に絶縁層17の上に形成される。図7には、磁場のシミュレーション結果が合わせて図示されている。シミュレーションでは素子長さ方向に5Oeの外部磁場を作用させ、斜線で示す箇所が、他の領域より磁場の磁束密度Bが強い領域であり、具体的には7.75e-4(T)以上の磁束密度であった。図7に示すように、磁場の磁束密度が強い領域が最も外側に位置する素子部12に及んでいない。   As shown in FIG. 7, when the first soft magnetic body 24 is further positioned outside both outer surfaces 12a of the element portion 12 positioned on both sides in the element width direction constituting the fixed resistance elements 4 and 5, the fixed resistance It is more suitable for conversion. In FIG. 7, the connection electrode part 13 and the electrode part 15 that connect the element parts 12 are not shown. The first soft magnetic body 24 located on the outermost side is formed on the insulating layer 17 in the same manner as the first soft magnetic body 23 located above each element portion 12. FIG. 7 also shows the magnetic field simulation results. In the simulation, an external magnetic field of 5 Oe is applied in the element length direction, and the hatched portion is a region where the magnetic flux density B of the magnetic field is stronger than other regions, specifically, 7.75e-4 (T) or more. Magnetic flux density. As shown in FIG. 7, the region where the magnetic flux density of the magnetic field is strong does not reach the outermost element portion 12.

一方、図8に示すように、第1軟磁性体23を、素子部12の上方にのみ設けた形態(第1軟磁性体24を設けていない)では、斜線で示す他の領域より磁場の磁束密度Bが強い領域(具体的には7.75e-4(T)以上の磁束密度)が、素子部12の一部に及びやすいことがわかった。図8に示す実施形態でも固定抵抗素子として用いることが可能であるが、図7の実施形態のほうが、より抵抗変化率(MR比)を抑制することができる。このように、第1軟磁性体24を、さらに、固定抵抗素子4,5を構成する素子幅方向の両側に位置する素子部12の両外側面12aより外側に位置させると、より効果的に、磁場が前記素子部12に侵入しにくくなり、固定抵抗としての性能を向上させることが可能である。   On the other hand, as shown in FIG. 8, in the configuration in which the first soft magnetic body 23 is provided only above the element portion 12 (the first soft magnetic body 24 is not provided), the magnetic field of the other region indicated by the oblique lines is greater. It has been found that a region where the magnetic flux density B is strong (specifically, a magnetic flux density of 7.75e-4 (T) or more) tends to reach a part of the element portion 12. Although the embodiment shown in FIG. 8 can be used as a fixed resistance element, the embodiment shown in FIG. 7 can further suppress the resistance change rate (MR ratio). As described above, when the first soft magnetic body 24 is further positioned outside the outer side surfaces 12a of the element portion 12 positioned on both sides in the element width direction constituting the fixed resistance elements 4 and 5, it is more effective. , It becomes difficult for the magnetic field to enter the element portion 12, and the performance as a fixed resistance can be improved.

次に本実施形態における磁気センサ1の製造方法について説明する。図9は製造工程を示すフロー図である。なお図1の図面も併用する。   Next, the manufacturing method of the magnetic sensor 1 in this embodiment is demonstrated. FIG. 9 is a flowchart showing the manufacturing process. The drawing of FIG. 1 is also used.

まず図9に示す(1)の工程では、図1に示す基板16上の全面に図5に示す構造の積層膜をスパッタ成膜する。   First, in step (1) shown in FIG. 9, a laminated film having the structure shown in FIG. 5 is formed on the entire surface of the substrate 16 shown in FIG.

次に、図9に示す(2)の工程では、磁場中アニールにて、固定磁性層34と反強磁性層33との間に交換結合磁界(Hex)を生じさせ、前記固定磁性層34をY方向に固定磁化する。   Next, in step (2) shown in FIG. 9, an exchange coupling magnetic field (Hex) is generated between the pinned magnetic layer 34 and the antiferromagnetic layer 33 by annealing in a magnetic field, and the pinned magnetic layer 34 is formed. Fixed magnetization in the Y direction.

次に、図9に示す(3)の工程では、基板16上の磁気抵抗効果素子形成領域及び固定抵抗素子形成領域に位置する夫々の前記積層膜をパターニングして、素子幅W1に比べて素子長さL1が長く形成された細長形状の素子部12を形成する。前記素子部12以外の積層膜は全てエッチングにて除去する。このとき、図1(a)に示すように、磁気抵抗効果素子2,3を構成する素子部12の素子長さ方向(長手方向)がX方向を向き、固定抵抗素子4,5を構成する素子部12の素子長さ方向(長手方向)がY方向を向くように各素子部12をパターン形成する。これにより磁気抵抗効果素子2,3を構成する素子部12の固定磁性層34の固定磁化方向(P方向)は素子幅方向となり、固定抵抗素子4,5を構成する素子部12の固定磁性層34の固定磁化方向(P方向)は素子長さ方向となる。   Next, in the step (3) shown in FIG. 9, the laminated films located in the magnetoresistive element formation region and the fixed resistance element formation region on the substrate 16 are patterned, and the element is compared with the element width W1. An elongated element portion 12 having a long length L1 is formed. All the laminated films other than the element part 12 are removed by etching. At this time, as shown in FIG. 1A, the element length direction (longitudinal direction) of the element portion 12 constituting the magnetoresistive effect elements 2 and 3 faces the X direction, and the fixed resistance elements 4 and 5 are constituted. Each element portion 12 is patterned so that the element length direction (longitudinal direction) of the element portion 12 faces the Y direction. As a result, the fixed magnetization direction (P direction) of the fixed magnetic layer 34 of the element portion 12 constituting the magnetoresistive effect elements 2 and 3 becomes the element width direction, and the fixed magnetic layer of the element portion 12 constituting the fixed resistance elements 4 and 5 is formed. The fixed magnetization direction (P direction) 34 is the element length direction.

次に図9に示す(4)の工程では、図1(a)に示す接続電極部13や電極部15を形成して磁気抵抗効果素子2,3及び固定抵抗素子4,5を共にミアンダ形状に形成する。さらに出力取出し部14を形成して磁気抵抗効果素子2,3と固定抵抗素子4、5とを直列に接続する。   Next, in the step (4) shown in FIG. 9, the connection electrode portion 13 and the electrode portion 15 shown in FIG. 1A are formed, and the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 are both in a meander shape. To form. Further, an output extraction portion 14 is formed to connect the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 in series.

次に図9に示す(5)の工程では、前記素子部12上、接続電極部13上、電極部15上、出力取出し部14上及び露出する基板16上に絶縁層17を例えばスパッタにて形成する。前記絶縁層17の上面をCMP技術を用いて平坦化してもよい。   Next, in step (5) shown in FIG. 9, an insulating layer 17 is formed on the element portion 12, the connection electrode portion 13, the electrode portion 15, the output extraction portion 14 and the exposed substrate 16 by, for example, sputtering. Form. The upper surface of the insulating layer 17 may be planarized using a CMP technique.

次に図9に示す(6)の工程では、前記絶縁層17上であって、固定抵抗素子4,5を構成する素子部12と高さ方向で対向する位置に第1軟磁性体23を形成し、さらに前記絶縁層17上であって、磁気抵抗効果素子2,3を構成する素子部12と高さ方向で対向する位置に第2軟磁性体18を形成する(図1(a)参照)。前記第1軟磁性体23及び第2軟磁性体18をスパッタやメッキで形成する。まず前記絶縁層17上の全面に軟磁性体を形成した後、エッチングにて前記第1軟磁性体23及び第2軟磁性体18をパターン形成するか、あるいは、前記絶縁層17上にレジスト層にて第1軟磁性体23及び第2軟磁性体18の抜きパターンを形成し、前記抜きパターン内に軟磁性体を形成した後、前記レジスト層を除去する。   Next, in step (6) shown in FIG. 9, the first soft magnetic body 23 is placed on the insulating layer 17 at a position facing the element portion 12 constituting the fixed resistance elements 4 and 5 in the height direction. Further, a second soft magnetic body 18 is formed on the insulating layer 17 at a position facing the element portion 12 constituting the magnetoresistive effect elements 2 and 3 in the height direction (FIG. 1A). reference). The first soft magnetic body 23 and the second soft magnetic body 18 are formed by sputtering or plating. First, a soft magnetic material is formed on the entire surface of the insulating layer 17, and then the first soft magnetic material 23 and the second soft magnetic material 18 are patterned by etching, or a resist layer is formed on the insulating layer 17. After forming the extraction pattern of the first soft magnetic body 23 and the second soft magnetic body 18 and forming the soft magnetic body in the extraction pattern, the resist layer is removed.

続いて図示しない絶縁性の保護層を前記第1軟磁性体23及び第2軟磁性体18上に形成した後、図9に示す(7)の工程では、入力端子7、グランド端子8、出力端子10(図6参照)等の各パッド部を形成する。   Subsequently, after forming an insulating protective layer (not shown) on the first soft magnetic body 23 and the second soft magnetic body 18, in the step (7) shown in FIG. 9, the input terminal 7, the ground terminal 8, and the output Each pad portion such as the terminal 10 (see FIG. 6) is formed.

上記した本実施形態の磁気センサ1の製造方法では、同じ図9の(3)工程で、積層膜から磁気抵抗効果素子2,3を構成する素子部12と、固定抵抗素子4,5を構成する素子部12とをパターニングできるため、後の工程で、抵抗値を合わせ込むパターニング工程が必要無くなる。さらに、同じ図9の(6)工程で、磁気抵抗効果素子2,3側の第2軟磁性体18と固定抵抗素子4,5側の第1軟磁性体23とを形成している。よって、固定抵抗素子4、5の形成を磁気抵抗効果素子2,3の形成と並行して行うことができ、従来に比べて固定抵抗素子4,5を簡単かつ適切に製造できる。また磁気抵抗効果素子2、3と固定抵抗素子4,5の抵抗変化温度係数(TCR)を従来に比べて簡単に一致させることが出来る。   In the manufacturing method of the magnetic sensor 1 of the present embodiment described above, the element portion 12 and the fixed resistance elements 4 and 5 constituting the magnetoresistive effect elements 2 and 3 are formed from the laminated film in the same step (3) of FIG. Since the element portion 12 to be patterned can be patterned, a patterning step for adjusting the resistance value is not necessary in a later step. Further, in the same step (6) of FIG. 9, the second soft magnetic body 18 on the magnetoresistive effect elements 2 and 3 side and the first soft magnetic body 23 on the fixed resistance elements 4 and 5 side are formed. Therefore, the fixed resistance elements 4 and 5 can be formed in parallel with the formation of the magnetoresistive effect elements 2 and 3, and the fixed resistance elements 4 and 5 can be manufactured more easily and appropriately than in the past. Further, the resistance change temperature coefficient (TCR) of the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 can be easily matched as compared with the conventional one.

なお図9の(1)の工程の次に(3)工程を行い、次に図9の(8)工程に示すように、各素子部12の固定磁性層34をY方向に固定磁化するための磁場中アニールを行ってもよい。   9 is performed after step (1) in FIG. 9, and then, as shown in step (8) in FIG. 9, the fixed magnetic layer 34 of each element section 12 is fixedly magnetized in the Y direction. Annealing in the magnetic field may be performed.

いずれにしても、上記した製造方法では、磁気抵抗効果素子2,3を構成する素子部12の固定磁性層34の固定磁化方向と、固定抵抗素子4,5を構成する素子部12の固定磁性層34の固定磁化方向とが同一方向であるため、磁気抵抗効果素子2,3を構成する素子部12の固定磁性層34に対する固定磁化工程と、固定抵抗素子4,5を構成する素子部12の固定磁性層34に対する固定磁化工程とを別々に行う必要がなく、より簡単かつ適切に固定抵抗素子4,5を製造できる。   In any case, in the manufacturing method described above, the fixed magnetization direction of the fixed magnetic layer 34 of the element portion 12 that constitutes the magnetoresistive effect elements 2 and 3 and the fixed magnetism of the element portion 12 that constitutes the fixed resistance elements 4 and 5. Since the fixed magnetization direction of the layer 34 is the same direction, the fixed magnetization process for the fixed magnetic layer 34 of the element portion 12 constituting the magnetoresistive effect elements 2 and 3 and the element portion 12 constituting the fixed resistance elements 4 and 5. It is not necessary to separately perform the fixed magnetization step for the fixed magnetic layer 34, and the fixed resistance elements 4 and 5 can be manufactured more easily and appropriately.

図9の(6)の工程では、前記第1軟磁性体23は図2に示すように一体型で形成することも出来る。また、図9の(6)の工程では、前記第2軟磁性体18を磁気抵抗効果素子2,3を構成する素子部12の真上でなく図2に示すように両側方に形成することも出来る。   In the step (6) of FIG. 9, the first soft magnetic body 23 can be integrally formed as shown in FIG. In the step (6) of FIG. 9, the second soft magnetic body 18 is formed not on the element portion 12 constituting the magnetoresistive elements 2 and 3 but on both sides as shown in FIG. You can also.

上記では磁気抵抗効果素子2,3と固定抵抗素子4,5を構成する素子部12が共に同じ形状であったが、例えば固定抵抗素子4,5を構成する素子部12の素子幅W1と、磁気抵抗効果素子2,3を構成する素子部12の素子幅W1とが異なっていてもよいし、前記固定抵抗素子4,5を構成する素子部12の素子長さL1と、前記磁気抵抗効果素子2,3を構成する素子長さとが異なっていてもよい。ただし、抵抗値を簡単に合わせ込むには、磁気抵抗効果素子2,3と固定抵抗素子4,5を構成する素子部12とを同じ形状とすることが好適である。   In the above, both the magnetoresistive effect elements 2 and 3 and the element portion 12 constituting the fixed resistance elements 4 and 5 have the same shape. For example, the element width W1 of the element portion 12 constituting the fixed resistance elements 4 and 5; The element width W1 of the element portion 12 constituting the magnetoresistive effect elements 2 and 3 may be different, the element length L1 of the element portion 12 constituting the fixed resistance elements 4 and 5, and the magnetoresistive effect. The element length constituting the elements 2 and 3 may be different. However, in order to easily match the resistance values, it is preferable that the magnetoresistive effect elements 2 and 3 and the element portion 12 constituting the fixed resistance elements 4 and 5 have the same shape.

さらに、上記では、前記磁気抵抗効果素子2,3と固定抵抗素子4,5を構成する素子部12の積層順や膜厚が一致していていたが異なっていてもよい。例えば、固定抵抗素子4,5は図12の積層順であるが、磁気抵抗効果素子2,3は、下からフリー磁性層36、非磁性層35、固定磁性層34、反強磁性層33及び保護層37の順で積層されてもよい。ただし、前記磁気抵抗効果素子2,3と固定抵抗素子4,5を構成する素子部12の積層順や膜厚を同じにしたほうが、製造工程を簡単にでき、また、磁気抵抗効果素子2,3と固定抵抗素子4,5との抵抗変化温度係数(TCR)をより簡単且つ高精度に合わせることができ好適である。   Furthermore, in the above description, the stacking order and film thickness of the element portions 12 constituting the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 are the same, but they may be different. For example, the fixed resistance elements 4 and 5 are in the stacking order of FIG. 12, but the magnetoresistive effect elements 2 and 3 are the free magnetic layer 36, the nonmagnetic layer 35, the fixed magnetic layer 34, the antiferromagnetic layer 33, and the like from the bottom. The protective layers 37 may be stacked in this order. However, the manufacturing process can be simplified by making the stacking order and film thickness of the element portions 12 constituting the magnetoresistive effect elements 2 and 3 and the fixed resistance elements 4 and 5 the same. 3 and the resistance change temperature coefficient (TCR) of the fixed resistance elements 4 and 5 can be adjusted more easily and with high accuracy.

なお第1軟磁性体23は、素子部12の下方に絶縁層を介して形成されてもよい。このとき第1軟磁性体23は、素子部12の上下両方、あるいは片方に形成される。   The first soft magnetic body 23 may be formed below the element portion 12 via an insulating layer. At this time, the first soft magnetic body 23 is formed on both the upper and lower sides of the element portion 12 or on one side.

図1に示す固定抵抗素子を形成した。素子部12を6本形成し、ミアンダ形状とした。素子部12の素子幅W1を3μm、素子長さL1を60μm、膜厚T1を270Å、第1軟磁性体(CoFeSiB)の幅寸法W2を6μm、長さ寸法L2を100μm、膜厚を5000Å、第1軟磁性体23と前記磁気抵抗効果素子の素子部12間の高さ方向への間隔T5を0.3μmとした。磁場中アニールにて、固定磁性層34を長さ方向(Y方向)に固定磁化した。   The fixed resistance element shown in FIG. 1 was formed. Six element portions 12 were formed to have a meander shape. The element width 12 of the element part 12 is 3 μm, the element length L1 is 60 μm, the film thickness T1 is 270 mm, the width dimension W2 of the first soft magnetic body (CoFeSiB) is 6 μm, the length dimension L2 is 100 μm, the film thickness is 5000 mm, A distance T5 in the height direction between the first soft magnetic body 23 and the element portion 12 of the magnetoresistive effect element was set to 0.3 μm. The fixed magnetic layer 34 was fixedly magnetized in the length direction (Y direction) by annealing in a magnetic field.

なお、前記素子部12は、前記第1軟磁性体23が設けられていない形態では、±5Oeの外部磁場に対して約3%の抵抗変化率(MR比)を発揮する素子であった。   The element unit 12 is an element that exhibits a resistance change rate (MR ratio) of about 3% with respect to an external magnetic field of ± 5 Oe in the form in which the first soft magnetic body 23 is not provided.

前記固定抵抗素子に対して図1に示すX方向及びY方向の夫々から±5Oeの範囲の外部磁場を流入させ、抵抗変化率(MR比)を調べた。図10に示すようにX方向及びY方向のどちらの方向から±5Oeの範囲の外部磁場を作用させても抵抗変化率(MR比)を約0.02%以下に抑えることが出来るとわかった。   An external magnetic field in the range of ± 5 Oe from each of the X direction and Y direction shown in FIG. 1 was flowed into the fixed resistance element, and the resistance change rate (MR ratio) was examined. As shown in FIG. 10, it was found that the resistance change rate (MR ratio) can be suppressed to about 0.02% or less by applying an external magnetic field in the range of ± 5 Oe from either the X direction or the Y direction. .

次に、図11の左図に示すように、Y方向が長手方向で、固定磁性層34の固定磁化方向がY方向に向けられた素子部12と、前記素子部12の上方にY方向が長手方向の第1軟磁性体を形成した。図11の左図は図1(a)の固定抵抗素子4,5を構成する一つの素子部12と前記素子部12に対して膜厚方向に対向する第1軟磁性体23とに相当する。   Next, as shown in the left diagram of FIG. 11, the element portion 12 in which the Y direction is the longitudinal direction and the fixed magnetization direction of the fixed magnetic layer 34 is oriented in the Y direction, and the Y direction is above the element portion 12. A first soft magnetic body in the longitudinal direction was formed. The left diagram of FIG. 11 corresponds to one element portion 12 constituting the fixed resistance elements 4 and 5 of FIG. 1A and a first soft magnetic body 23 facing the element portion 12 in the film thickness direction. .

図11の右図のグラフにある横軸の例えば「5μmL20」との表記は前半が素子部12の素子幅W1を示し、後半が素子部12に対する素子長さ方向(長手方向)からの第1軟磁性体23のはみ出し量(片側)を示している。すなわち「5μmL20」とは素子部12の素子幅W1が5μmで、第1軟磁性体23のはみ出し量(片側)が20μmであることを示している。   In the graph on the right side of FIG. 11, for example, “5 μmL20” on the horizontal axis indicates the element width W1 of the element portion 12 in the first half and the first from the element length direction (longitudinal direction) with respect to the element portion 12. The amount of protrusion (one side) of the soft magnetic material 23 is shown. That is, “5 μmL20” indicates that the element width W1 of the element unit 12 is 5 μm, and the amount of protrusion (one side) of the first soft magnetic body 23 is 20 μm.

また、素子部12の膜厚T1を270Å、第1軟磁性体(CoFeSiB)の幅寸法W2を6μm、長さ寸法L2を100μm、膜厚を5000Å、第1軟磁性体23と前記磁気抵抗効果素子の素子部12間の高さ方向への間隔T5を0.3μmとした。   Further, the film thickness T1 of the element portion 12 is 270 mm, the width dimension W2 of the first soft magnetic body (CoFeSiB) is 6 μm, the length dimension L2 is 100 μm, the film thickness is 5000 mm, and the first soft magnetic body 23 and the magnetoresistive effect. An interval T5 in the height direction between the element portions 12 of the element was set to 0.3 μm.

図11の横軸に示すように、前記素子幅W1及び第1軟磁性体23のはみ出し量(片側)を変化させ、この際、X方向及びY方向から夫々±5Oeの外部磁場を作用させて抵抗変化率(MR比)を求めた。図11に示すように、抵抗変化率(MR比)を0.2%以下に抑えることが出来るとわかった。   As shown on the horizontal axis of FIG. 11, the element width W1 and the amount of protrusion (one side) of the first soft magnetic body 23 are changed, and at this time, an external magnetic field of ± 5 Oe is applied from the X direction and the Y direction, respectively. The resistance change rate (MR ratio) was determined. As shown in FIG. 11, it was found that the resistance change rate (MR ratio) can be suppressed to 0.2% or less.

次に図12の左図に示すように、X方向が長手方向で、固定磁性層34の固定磁化方向がY方向に向けられた素子部12と、前記素子部12の上方にX方向が長手方向の第1軟磁性体を形成した。   Next, as shown in the left diagram of FIG. 12, the element portion 12 in which the X direction is the longitudinal direction and the fixed magnetization direction of the pinned magnetic layer 34 is oriented in the Y direction, and the X direction is the longitudinal direction above the element portion 12. A first soft magnetic body in the direction was formed.

素子部12の膜厚T1を270Å、第1軟磁性体(CoFeSiB)の幅寸法W2を6μm、長さ寸法L2を100μm、膜厚を5000Å、第1軟磁性体23と前記磁気抵抗効果素子の素子部12間の高さ方向への間隔T5を0.3μmとした。   The film thickness T1 of the element portion 12 is 270 mm, the width dimension W2 of the first soft magnetic body (CoFeSiB) is 6 μm, the length dimension L2 is 100 μm, the film thickness is 5000 mm, and the first soft magnetic body 23 and the magnetoresistive element An interval T5 in the height direction between the element portions 12 was set to 0.3 μm.

図12の横軸に示すように、素子幅W1及び第1軟磁性体23のはみ出し量(片側)を変化させ、この際、X方向及びY方向から夫々±5Oeの外部磁場を作用させて抵抗変化率(MR比)を求めた。図12に示すように、抵抗変化率(MR比)は図11のときよりも大きくなり、固定抵抗素子として使用できないことがわかった。   As shown in the horizontal axis of FIG. 12, the element width W1 and the amount of protrusion (one side) of the first soft magnetic body 23 are changed, and at this time, an external magnetic field of ± 5 Oe is applied from the X direction and the Y direction, respectively. The rate of change (MR ratio) was determined. As shown in FIG. 12, the rate of change in resistance (MR ratio) was larger than that in FIG. 11, indicating that it cannot be used as a fixed resistance element.

次に図13に示す左図の固定抵抗素子を形成した。図11の左図と類似するが、図13では第1軟磁性体23の幅寸法を2μmとして前記素子部12の素子幅W1より小さくした。その他の条件は図11と同じとした。図13のグラフに示すように抵抗変化率(MR比)は図11のときよりも大きくなった。特にY方向からの外部磁場に対して抵抗変化率(MR比)が大きくなった。よって、図13の形態では、固定抵抗素子として使用できないことがわかった。   Next, the fixed resistance element shown in the left figure of FIG. 13 was formed. Although similar to the left diagram of FIG. 11, in FIG. 13, the width of the first soft magnetic body 23 is set to 2 μm, which is smaller than the element width W <b> 1 of the element section 12. The other conditions were the same as in FIG. As shown in the graph of FIG. 13, the resistance change rate (MR ratio) was larger than that in FIG. In particular, the resistance change rate (MR ratio) increased with respect to the external magnetic field from the Y direction. Therefore, in the form of FIG. 13, it turned out that it cannot be used as a fixed resistance element.

次に、図14に示す左図の固定抵抗素子を形成した。素子部12の構成は図11と同じであり、6本の素子部12をミアンダ形状とした。また150μm×150μmの大きさの第1軟磁性体23を形成した。   Next, the fixed resistance element shown in the left figure of FIG. 14 was formed. The configuration of the element portion 12 is the same as that in FIG. 11, and the six element portions 12 have a meander shape. A first soft magnetic body 23 having a size of 150 μm × 150 μm was formed.

図14のグラフに示すように抵抗変化率(MR比)は図11のときよりも大きくなった。よって、図14の形態では、固定抵抗素子として使用できないことがわかった。   As shown in the graph of FIG. 14, the rate of change in resistance (MR ratio) was larger than that in FIG. Therefore, it was found that the configuration of FIG. 14 cannot be used as a fixed resistance element.

第1実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す図((a)は部分平面図、(b)は、(a)のA−A線に沿って高さ方向(図示Z方向)に切断し矢印方向から見た部分断面図)、(c)は、(a)のB−B線に沿って高さ方向(図示Z方向)に切断し矢印方向から見た部分断面図)、The figure which shows the part of the magnetoresistive effect element and fixed resistance element especially of the magnetic sensor in 1st Embodiment ((a) is a partial top view, (b) is a height direction along the AA line of (a). (Partial cross-sectional view cut in the Z direction shown in the figure and viewed from the arrow direction), (c) is cut in the height direction (Z direction shown in the figure) along the line BB in (a) and viewed from the arrow direction. (Partial sectional view), 第2実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す部分平面図、The partial top view which shows the part of the magnetoresistive effect element and fixed resistance element of the magnetic sensor in 2nd Embodiment, 第3実施形態における磁気センサの特に磁気抵抗効果素子及び固定抵抗素子の部分を示す部分平面図、The partial top view which shows the part of the magnetoresistive effect element especially fixed resistance element of the magnetic sensor in 3rd Embodiment, 磁気抵抗効果素子の固定磁性層の固定磁化方向及びフリー磁性層の磁化方向と、電気抵抗値との関係を説明するための図、The figure for demonstrating the relationship between the fixed magnetization direction of the fixed magnetic layer of a magnetoresistive effect element, the magnetization direction of a free magnetic layer, and an electrical resistance value, 磁気抵抗効果素子を膜厚方向から切断した際の切断面を示す断面図、Sectional drawing which shows the cut surface at the time of cut | disconnecting a magnetoresistive effect element from a film thickness direction, 本実施形態の磁気センサの回路図、A circuit diagram of the magnetic sensor of the present embodiment, 他の好ましい実施形態の固定抵抗素子の構成を示す部分平面図と磁場のシミュレーション結果、Partial plan view showing the configuration of the fixed resistance element of another preferred embodiment and the simulation result of the magnetic field, 図7とは異なる本実施形態の固定抵抗素子の構成を示す部分平面図と磁場のシミュレーション結果、FIG. 7 is a partial plan view showing the configuration of the fixed resistance element of this embodiment different from FIG. 本実施形態の磁気センサの製造工程を示すフロー図、The flowchart which shows the manufacturing process of the magnetic sensor of this embodiment, 本実施例の固定抵抗素子に、X方向及びY方向の方向から±5Oeの範囲の外部磁場を作用させたときの抵抗変化率(MR比)を示すグラフ、A graph showing a rate of change in resistance (MR ratio) when an external magnetic field in a range of ± 5 Oe from the direction of the X direction and the Y direction is applied to the fixed resistance element of this example; 左図の固定抵抗素子(実施例)に対してX方向及びY方向から±5Oeの外部磁場が作用したときの抵抗変化率(MR比)を示すグラフ、A graph showing a rate of change in resistance (MR ratio) when an external magnetic field of ± 5 Oe from the X direction and the Y direction acts on the fixed resistance element (example) in the left diagram; 左図の固定抵抗素子(比較例)に対してX方向及びY方向から±5Oeの外部磁場が作用したときの抵抗変化率(MR比)を示すグラフ、A graph showing a rate of change in resistance (MR ratio) when an external magnetic field of ± 5 Oe acts from the X direction and the Y direction on the fixed resistance element (comparative example) in the left figure; 左図の固定抵抗素子(比較例)に対してX方向及びY方向から±5Oeの外部磁場が作用したときの抵抗変化率(MR比)を示すグラフ、A graph showing a rate of change in resistance (MR ratio) when an external magnetic field of ± 5 Oe acts from the X direction and the Y direction on the fixed resistance element (comparative example) in the left figure; 左図の固定抵抗素子(比較例)に対してX方向及びY方向から±5Oeの外部磁場が作用したときの抵抗変化率(MR比)を示すグラフ、A graph showing a rate of change in resistance (MR ratio) when an external magnetic field of ± 5 Oe acts from the X direction and the Y direction on the fixed resistance element (comparative example) in the left figure;

符号の説明Explanation of symbols

1 磁気センサ
2、3 磁気抵抗効果素子
4、5 固定抵抗素子
6 ブリッジ回路
7 入力端子
8 グランド端子
9 差動増幅器
10 外部出力端子
11 集積回路
12 素子部
13 接続電極部
14 出力取出し部
16 基板
17 絶縁層
18 第2軟磁性体
23 第1軟磁性体
33 反強磁性層
34 固定磁性層
36 フリー磁性層
L1 素子長さ
L2 (第1軟磁性体の)長さ寸法
L3 (第2軟磁性体の)長さ寸法
W1 素子幅
W2 (第1軟磁性体の)幅寸法
W3 (第2軟磁性体の)幅寸法
DESCRIPTION OF SYMBOLS 1 Magnetic sensor 2, 3 Magnetoresistance effect element 4, 5 Fixed resistance element 6 Bridge circuit 7 Input terminal 8 Ground terminal 9 Differential amplifier 10 External output terminal 11 Integrated circuit 12 Element part 13 Connection electrode part 14 Output extraction part 16 Substrate 17 Insulating layer 18 Second soft magnetic material 23 First soft magnetic material 33 Antiferromagnetic layer 34 Fixed magnetic layer 36 Free magnetic layer L1 Element length L2 (of the first soft magnetic material) Length dimension L3 (Second soft magnetic material) Length dimension W1 element width W2 (first soft magnetic body) width dimension W3 (second soft magnetic body) width dimension

Claims (15)

磁気抵抗効果素子と、前記磁気抵抗効果素子に出力取出し部を介して直列接続される固定抵抗素子とを備えた磁気センサであって、
前記磁気抵抗効果素子は、磁化方向が固定される固定磁性層と、前記固定磁性層に非磁性層を介して積層された外部磁場を受けて磁化方向が変動するフリー磁性層とを有する素子部を備え、
前記固定抵抗素子は、素子幅W1に比べて素子長さL1が長く形成された細長形状の素子部を備え、前記固定抵抗素子を構成する素子部は、前記固定磁性層と、前記固定磁性層に前記非磁性層を介して積層された前記フリー磁性層とを有しており、前記固定磁性層の固定磁化方向が、素子長さ方向に向けられており、
前記固定抵抗素子を構成する素子部に対して間隔を空けて、前記素子幅W1と同方向への幅寸法W2が前記素子幅W1よりも大きく前記素子部の素子幅の両側から素子幅方向に延出する延出部を備えるとともに、前記素子長さL1と同方向への長さ寸法L2が前記素子長さL1よりも大きく前記素子部の素子長さ方向の両側から素子長さ方向に延出する延出部を備え、且つ前記長さ寸法L2が前記幅寸法W2よりも大きい第1軟磁性体が積層配置されていることを特徴とする磁気センサ。
A magnetic sensor comprising a magnetoresistive effect element and a fixed resistance element connected in series to the magnetoresistive effect element via an output extraction portion,
The magnetoresistive element includes an element part having a pinned magnetic layer whose magnetization direction is fixed, and a free magnetic layer which is laminated on the pinned magnetic layer via a nonmagnetic layer and changes the magnetization direction upon receiving an external magnetic field With
The fixed resistance element includes an elongated element portion having an element length L1 longer than an element width W1, and the element portion constituting the fixed resistance element includes the fixed magnetic layer and the fixed magnetic layer. And the free magnetic layer laminated via the nonmagnetic layer, and the pinned magnetization direction of the pinned magnetic layer is directed to the element length direction,
A width dimension W2 in the same direction as the element width W1 is larger than the element width W1 and spaced from both sides of the element width of the element section in the element width direction at a distance from the element portion constituting the fixed resistance element. An extension portion is provided, and a length dimension L2 in the same direction as the element length L1 is larger than the element length L1 and extends from both sides of the element portion in the element length direction in the element length direction. A magnetic sensor comprising a first soft magnetic body that includes an extending portion that protrudes and has a length dimension L2 larger than the width dimension W2.
前記磁気抵抗効果素子は、素子幅に比べて素子長さが長く形成された細長形状の素子部を有しており、前記固定磁性層の固定磁化方向が素子幅方向に向けられており、前記磁気抵抗効果素子を構成する素子部の素子長さ方向と、前記固定抵抗素子を構成する素子部の素子長さ方向が直交するように各素子部が配置され、前記磁気抵抗効果素子を構成する固定磁性層の固定磁化方向と、前記固定抵抗素子を構成する固定磁性層の固定磁化方向とが同一方向に向けられている請求項1記載の磁気センサ。   The magnetoresistive effect element has an elongated element portion formed with an element length longer than an element width, and a fixed magnetization direction of the fixed magnetic layer is directed in an element width direction, Each element portion is arranged so that the element length direction of the element portion constituting the magnetoresistive effect element and the element length direction of the element portion constituting the fixed resistance element are orthogonal to each other to constitute the magnetoresistive effect element The magnetic sensor according to claim 1, wherein a fixed magnetization direction of the fixed magnetic layer and a fixed magnetization direction of the fixed magnetic layer constituting the fixed resistance element are directed in the same direction. 前記磁気抵抗効果素子及び前記固定抵抗素子を構成する各素子部の積層順及び膜厚が等しい請求項1または2記載の磁気センサ。   3. The magnetic sensor according to claim 1, wherein the stacking order and film thicknesses of the element portions constituting the magnetoresistive effect element and the fixed resistance element are equal. 前記固定抵抗素子を構成する前記素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、
前記固定抵抗素子を構成する各素子部に対して個別に前記第1軟磁性体が配置されている請求項1ないし3のいずれかに記載の磁気センサ。
A plurality of the element portions constituting the fixed resistance element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape,
4. The magnetic sensor according to claim 1, wherein the first soft magnetic body is individually arranged for each element portion constituting the fixed resistance element. 5.
前記第1軟磁性体は、さらに、素子幅方向の両側に位置する前記素子部の両外側面より外側にも配置されている請求項4記載の磁気センサ。   5. The magnetic sensor according to claim 4, wherein the first soft magnetic body is further disposed outside both outer surfaces of the element portion located on both sides in the element width direction. 前記固定抵抗素子を構成する前記素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、
一つの前記第1軟磁性体が、前記固定抵抗素子を構成する全ての前記素子部を覆う大きさで形成されている請求項1ないし3のいずれかに記載の磁気センサ。
A plurality of the element portions constituting the fixed resistance element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape,
4. The magnetic sensor according to claim 1, wherein one of the first soft magnetic bodies is formed to have a size that covers all of the element portions constituting the fixed resistance element. 5.
前記磁気抵抗効果素子を構成する前記素子部は、複数個、素子幅方向に間隔を空けて配置され、各素子部の端部間が接続されてミアンダ形状にされており、各素子部の両側方、真上、あるいは真下のいずれかに前記各素子の幅寸法と同じ方向での幅寸法がW3、素子長さ方向と同じ方向での長さ寸法がL3の第2軟磁性体が前記各素子部と非接触で形成され、
前記第2軟磁性体の前記長さ寸法L3は前記各素子の長さより長く、前記軟磁性体は、前記素子部の素子長さ方向の両側から前記素子長さ方向に延出する延出部を備えている請求項1ないし6のいずれかに記載の磁気センサ。
A plurality of the element portions constituting the magnetoresistive effect element are arranged at intervals in the element width direction, and the end portions of each element portion are connected to form a meander shape. On the other hand, the second soft magnetic body having a width dimension W3 in the same direction as the width dimension of each element and a length dimension L3 in the same direction as the element length direction is either above, directly below, or directly below. Formed without contact with the element,
The length dimension L3 of the second soft magnetic body is longer than the length of each element, and the soft magnetic body extends from both sides of the element length direction of the element section in the element length direction. A magnetic sensor according to claim 1, comprising:
磁気抵抗効果素子と、前記磁気抵抗効果素子に出力取出し部を介して直列接続される固定抵抗素子とを備えた磁気センサの製造方法において、
基板上に、磁化方向が固定される固定磁性層と、前記固定磁性層に非磁性層を介して積層された外部磁場を受けて磁化方向が変動するフリー磁性層とを有する積層膜を形成し、
固定抵抗素子形成領域に位置する前記積層膜をパターニングして、素子幅W1に比べて素子長さL1が長く形成された細長形状の素子部を形成する工程、
磁気抵抗効果素子形成領域に、前記固定磁性層と、前記固定磁性層に前記非磁性層を介して積層された前記フリー磁性層とを有する素子部を形成する工程、
前記固定抵抗素子を構成する素子部の固定磁性層を素子長さ方向に固定磁化し、また、前記磁気抵抗効果素子を構成する素子部の固定磁性層を素子幅方向に固定磁化する工程、
前記素子部の素子長さ方向の両側に電極部を形成する工程、
前記素子部上に絶縁層を形成する工程、
前記固定抵抗素子を構成する素子部上に前記絶縁層を介して、前記素子幅W1と同方向への幅寸法W2が前記素子幅W1よりも大きく前記素子部の素子幅の両側から素子幅方向に延出する延出部を備えるとともに、前記素子長さL1と同方向への長さ寸法L2が前記素子長さL1よりも大きく前記素子部の素子長さ方向の両側から素子長さ方向に延出する延出部を備え、且つ前記長さ寸法L2が前記幅寸法W2よりも大きい第1軟磁性体を形成する工程、
を有することを特徴とする磁気センサの製造方法。
In a method of manufacturing a magnetic sensor comprising a magnetoresistive effect element and a fixed resistance element connected in series to the magnetoresistive effect element via an output extraction portion,
A laminated film having a pinned magnetic layer whose magnetization direction is fixed and a free magnetic layer whose magnetization direction is changed by receiving an external magnetic field laminated on the pinned magnetic layer via a nonmagnetic layer is formed on a substrate. ,
Patterning the laminated film located in the fixed resistance element forming region to form an elongated element portion in which the element length L1 is longer than the element width W1;
Forming an element portion having the pinned magnetic layer in the magnetoresistive element forming region and the free magnetic layer laminated on the pinned magnetic layer via the nonmagnetic layer;
A step of fixedly magnetizing the fixed magnetic layer of the element portion constituting the fixed resistance element in the element length direction, and a fixed magnetization of the fixed magnetic layer of the element portion constituting the magnetoresistive effect element in the element width direction;
Forming electrode portions on both sides of the element portion in the element length direction;
Forming an insulating layer on the element portion;
A width dimension W2 in the same direction as the element width W1 is larger than the element width W1 via the insulating layer on the element portion constituting the fixed resistance element, and the element width direction from both sides of the element width of the element portion And a length dimension L2 in the same direction as the element length L1 is larger than the element length L1 from both sides of the element length direction in the element length direction. Forming a first soft magnetic body that includes an extending portion that extends and the length dimension L2 is greater than the width dimension W2.
A method of manufacturing a magnetic sensor, comprising:
前記磁気抵抗効果素子を構成する素子部は、磁気抵抗効果素子形成領域に位置する前記積層膜をパターニングして、素子幅に比べて素子長さが長く形成された細長形状で形成されたものであり、
前記積層膜の固定磁性層を固定磁化する工程を備え、
前記積層膜から各素子部をパターン形成する際に、前記磁気抵抗効果素子を構成する素子部の固定磁性層の固定磁化方向が素子幅方向を向き、固定抵抗素子を構成する素子部の固定磁性層の固定磁化方向が素子長さ方向を向くように、前記磁気抵抗効果素子を構成する素子部の素子長さ方向を固定磁化方向に対して直交する方向に、前記固定抵抗素子を構成する素子部の素子長さ方向を固定磁化方向に向けてパターン形成する請求項8記載の磁気センサの製造方法。
The element part constituting the magnetoresistive effect element is formed in an elongated shape in which the laminated film located in the magnetoresistive effect element forming region is patterned and the element length is longer than the element width. Yes,
Comprising fixed magnetization of the pinned magnetic layer of the laminated film,
When patterning each element part from the laminated film, the fixed magnetization direction of the fixed magnetic layer of the element part constituting the magnetoresistive effect element faces the element width direction, and the fixed magnetism of the element part constituting the fixed resistor element The element constituting the fixed resistance element in such a direction that the element length direction of the element portion constituting the magnetoresistive effect element is orthogonal to the fixed magnetization direction so that the fixed magnetization direction of the layer faces the element length direction The method of manufacturing a magnetic sensor according to claim 8, wherein the pattern is formed with the element length direction of the portion directed toward the fixed magnetization direction.
前記磁気抵抗効果素子を構成する素子部は、磁気抵抗効果素子形成領域に位置する前記積層膜をパターニングして、素子幅に比べて素子長さが長く形成された細長形状で形成されたものであり、
前記磁気抵抗効果素子を構成する素子部の素子長さ方向と、前記固定抵抗素子を構成する素子部の素子長さ方向とが直交するように各素子部を前記積層膜からパターン形成し、
同じ固定磁性層の固定磁化工程にて、前記磁気抵抗効果素子を構成する素子部の固定磁性層を素子幅方向に固定磁化し、固定抵抗素子を構成する素子部の固定磁性層を素子長さ方向に固定磁化する請求項8記載の磁気センサの製造方法。
The element part constituting the magnetoresistive effect element is formed in an elongated shape in which the laminated film located in the magnetoresistive effect element forming region is patterned and the element length is longer than the element width. Yes,
Each element portion is patterned from the laminated film so that the element length direction of the element portion constituting the magnetoresistive effect element and the element length direction of the element portion constituting the fixed resistance element are orthogonal to each other,
In the fixed magnetization step of the same fixed magnetic layer, the fixed magnetic layer of the element part constituting the magnetoresistive effect element is fixedly magnetized in the element width direction, and the fixed magnetic layer of the element part constituting the fixed resistance element is element length The method of manufacturing a magnetic sensor according to claim 8, wherein the magnetization is fixed in the direction.
前記固定抵抗素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成し、
前記固定抵抗素子を構成する各素子部の上方に絶縁層を介して個別に前記第1軟磁性体を配置する請求項8ないし10のいずれかに記載の磁気センサの製造方法。
A plurality of the element parts constituting the fixed resistance element are arranged at intervals in the element width direction, and the ends of each element part are connected to form a meander shape,
11. The method of manufacturing a magnetic sensor according to claim 8, wherein the first soft magnetic body is individually disposed above each element portion constituting the fixed resistance element via an insulating layer.
前記第1軟磁性体を、さらに、素子幅方向の両側に位置する前記素子部の両外側面より外側にも配置する請求項11記載の磁気センサの製造方法。   The method of manufacturing a magnetic sensor according to claim 11, wherein the first soft magnetic body is further disposed outside both outer surfaces of the element portion located on both sides in the element width direction. 前記固定抵抗素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成し、
一つの前記第1軟磁性体を、前記固定抵抗素子を構成する全ての前記素子部の上方を覆う大きさで形成する請求項8ないし10のいずれかに記載の磁気センサの製造方法。
A plurality of the element parts constituting the fixed resistance element are arranged at intervals in the element width direction, and the ends of each element part are connected to form a meander shape,
11. The method of manufacturing a magnetic sensor according to claim 8, wherein one of the first soft magnetic bodies is formed to have a size that covers the upper part of all the element portions constituting the fixed resistance element.
前記磁気抵抗効果素子を構成する前記素子部を、複数個、素子幅方向に間隔を空けて配置し、各素子部の端部間を接続してミアンダ形状に形成しており、
前記第1軟磁性層を形成する工程と同じ工程時に、前記磁気抵抗効果素子を構成する各素子部の両側方、あるいは真上のいずれかに前記素子幅W1と同じ方向での幅寸法がW3、素子長さ方向と同じ方向での長さ寸法がL3の第2軟磁性体を絶縁層を介して形成し、
このとき、前記第2軟磁性体の前記長さ寸法L3を前記素子長さL1より長く形成し、さらに前記第2軟磁性体を、前記磁気抵抗効果素子の素子長さ方向の両側から前記素子長さ方向に延出する延出部を備えて形成する請求項8ないし13のいずれかに記載の磁気センサの製造方法。
A plurality of the element portions constituting the magnetoresistive effect element are arranged at intervals in the element width direction, and the end portions of each element portion are connected and formed in a meander shape,
In the same step as the step of forming the first soft magnetic layer, the width dimension in the same direction as the element width W1 is W3 on either side of or directly above each element portion constituting the magnetoresistive element. Forming a second soft magnetic body having a length dimension L3 in the same direction as the element length direction through an insulating layer;
At this time, the length L3 of the second soft magnetic body is formed longer than the element length L1, and the second soft magnetic body is further moved from both sides of the magnetoresistive element in the element length direction. The method for manufacturing a magnetic sensor according to claim 8, wherein the magnetic sensor is formed by including an extending portion extending in a length direction.
前記第1軟磁性体を素子部の上方に形成せず、あるいは素子部の上方とともに、前記第1軟磁性体を、前記素子部の下側に絶縁層を介して形成する請求項8ないし14のいずれかに記載の磁気センサの製造方法。   15. The first soft magnetic body is not formed above the element portion, or the first soft magnetic body is formed below the element portion via an insulating layer together with the upper portion of the element portion. The manufacturing method of the magnetic sensor in any one of.
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Cited By (10)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2011180080A (en) * 2010-03-03 2011-09-15 Tdk Corp Magnetometric sensor
JP2014508286A (en) * 2011-01-17 2014-04-03 ジャンス マルチディメンショナル テクノロジー シーオー., エルティーディー Single package bridge type magnetic field sensor
JP2013044641A (en) * 2011-08-24 2013-03-04 Murata Mfg Co Ltd Magnetic sensor
JP2015500992A (en) * 2011-12-05 2015-01-08 アドバンスド マイクロセンサーズ コーポレーション Magnetic field detection apparatus and method
KR101625319B1 (en) 2012-02-07 2016-05-27 아사히 가세이 일렉트로닉스 가부시끼가이샤 Magnetic sensor and magnetic detection method thereof
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JP2016524142A (en) * 2013-05-28 2016-08-12 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Single-chip bridge type magnetic field sensor
JP2017516987A (en) * 2014-04-17 2017-06-22 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Monolithic three-axis linear magnetic sensor and manufacturing method thereof
JP2018517128A (en) * 2015-04-16 2018-06-28 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Single package high field magnetoresistive angle sensor
JP2018526900A (en) * 2015-08-12 2018-09-13 江▲蘇▼多▲維▼科技有限公司Multidimension Technology Co., Ltd. Magnetoresistive relay

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