JP2009035662A - Phenol resin composition for friction material - Google Patents
Phenol resin composition for friction material Download PDFInfo
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- JP2009035662A JP2009035662A JP2007202530A JP2007202530A JP2009035662A JP 2009035662 A JP2009035662 A JP 2009035662A JP 2007202530 A JP2007202530 A JP 2007202530A JP 2007202530 A JP2007202530 A JP 2007202530A JP 2009035662 A JP2009035662 A JP 2009035662A
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- JP
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- Prior art keywords
- phenol resin
- oil
- friction material
- resin composition
- weight
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- 239000005011 phenolic resin Substances 0.000 title claims abstract description 98
- 239000000203 mixture Substances 0.000 title claims abstract description 58
- 239000002783 friction material Substances 0.000 title claims abstract description 49
- 229920003986 novolac Polymers 0.000 claims abstract description 26
- 239000003822 epoxy resin Substances 0.000 claims abstract description 17
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 17
- 239000003921 oil Substances 0.000 claims abstract description 15
- 235000019198 oils Nutrition 0.000 claims abstract description 15
- 239000003054 catalyst Substances 0.000 claims abstract description 13
- 235000019492 Cashew oil Nutrition 0.000 claims abstract description 7
- 239000010467 cashew oil Substances 0.000 claims abstract description 7
- 229940059459 cashew oil Drugs 0.000 claims abstract description 7
- 239000000944 linseed oil Substances 0.000 claims abstract description 4
- 235000021388 linseed oil Nutrition 0.000 claims abstract description 4
- 239000003784 tall oil Substances 0.000 claims abstract description 4
- 238000012986 modification Methods 0.000 claims description 8
- 230000004048 modification Effects 0.000 claims description 8
- 229920001568 phenolic resin Polymers 0.000 claims description 4
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 claims description 3
- 239000002383 tung oil Substances 0.000 claims description 3
- 229920003987 resole Polymers 0.000 abstract description 10
- 238000007872 degassing Methods 0.000 abstract description 5
- 238000004519 manufacturing process Methods 0.000 abstract description 2
- 229920005992 thermoplastic resin Polymers 0.000 abstract description 2
- 239000011800 void material Substances 0.000 abstract 1
- 239000002023 wood Substances 0.000 abstract 1
- 150000002989 phenols Chemical class 0.000 description 13
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 12
- 229920005989 resin Polymers 0.000 description 11
- 239000011347 resin Substances 0.000 description 11
- 244000226021 Anacardium occidentale Species 0.000 description 10
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 10
- 235000020226 cashew nut Nutrition 0.000 description 10
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 9
- 150000001299 aldehydes Chemical class 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 8
- 238000000465 moulding Methods 0.000 description 8
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 8
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical class O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 7
- 230000000052 comparative effect Effects 0.000 description 7
- -1 acrylic ester Chemical class 0.000 description 6
- 239000007789 gas Substances 0.000 description 6
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 6
- 239000004312 hexamethylene tetramine Substances 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 238000002156 mixing Methods 0.000 description 6
- 239000007787 solid Substances 0.000 description 6
- 238000005452 bending Methods 0.000 description 5
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 229920001971 elastomer Polymers 0.000 description 4
- 238000003825 pressing Methods 0.000 description 4
- 238000010008 shearing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- NKTOLZVEWDHZMU-UHFFFAOYSA-N 2,5-xylenol Chemical compound CC1=CC=C(C)C(O)=C1 NKTOLZVEWDHZMU-UHFFFAOYSA-N 0.000 description 3
- IXQGCWUGDFDQMF-UHFFFAOYSA-N 2-Ethylphenol Chemical compound CCC1=CC=CC=C1O IXQGCWUGDFDQMF-UHFFFAOYSA-N 0.000 description 3
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 3
- HGINCPLSRVDWNT-UHFFFAOYSA-N Acrolein Chemical compound C=CC=O HGINCPLSRVDWNT-UHFFFAOYSA-N 0.000 description 3
- 229930040373 Paraformaldehyde Natural products 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N butyric aldehyde Natural products CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 description 3
- 229930003836 cresol Natural products 0.000 description 3
- 239000000806 elastomer Substances 0.000 description 3
- 125000003700 epoxy group Chemical group 0.000 description 3
- 238000011156 evaluation Methods 0.000 description 3
- 235000019256 formaldehyde Nutrition 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 235000006408 oxalic acid Nutrition 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 238000002360 preparation method Methods 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 238000012360 testing method Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- KJCVRFUGPWSIIH-UHFFFAOYSA-N 1-naphthol Chemical compound C1=CC=C2C(O)=CC=CC2=C1 KJCVRFUGPWSIIH-UHFFFAOYSA-N 0.000 description 2
- NXXYKOUNUYWIHA-UHFFFAOYSA-N 2,6-Dimethylphenol Chemical compound CC1=CC=CC(C)=C1O NXXYKOUNUYWIHA-UHFFFAOYSA-N 0.000 description 2
- GJYCVCVHRSWLNY-UHFFFAOYSA-N 2-butylphenol Chemical compound CCCCC1=CC=CC=C1O GJYCVCVHRSWLNY-UHFFFAOYSA-N 0.000 description 2
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 2
- YCOXTKKNXUZSKD-UHFFFAOYSA-N 3,4-xylenol Chemical compound CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 2
- TUAMRELNJMMDMT-UHFFFAOYSA-N 3,5-xylenol Chemical compound CC1=CC(C)=CC(O)=C1 TUAMRELNJMMDMT-UHFFFAOYSA-N 0.000 description 2
- HMNKTRSOROOSPP-UHFFFAOYSA-N 3-Ethylphenol Chemical compound CCC1=CC=CC(O)=C1 HMNKTRSOROOSPP-UHFFFAOYSA-N 0.000 description 2
- VPWNQTHUCYMVMZ-UHFFFAOYSA-N 4,4'-sulfonyldiphenol Chemical compound C1=CC(O)=CC=C1S(=O)(=O)C1=CC=C(O)C=C1 VPWNQTHUCYMVMZ-UHFFFAOYSA-N 0.000 description 2
- HXDOZKJGKXYMEW-UHFFFAOYSA-N 4-ethylphenol Chemical compound CCC1=CC=C(O)C=C1 HXDOZKJGKXYMEW-UHFFFAOYSA-N 0.000 description 2
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 2
- VEXZGXHMUGYJMC-UHFFFAOYSA-N Hydrochloric acid Chemical compound Cl VEXZGXHMUGYJMC-UHFFFAOYSA-N 0.000 description 2
- QIGBRXMKCJKVMJ-UHFFFAOYSA-N Hydroquinone Chemical compound OC1=CC=C(O)C=C1 QIGBRXMKCJKVMJ-UHFFFAOYSA-N 0.000 description 2
- UFWIBTONFRDIAS-UHFFFAOYSA-N Naphthalene Chemical compound C1=CC=CC2=CC=CC=C21 UFWIBTONFRDIAS-UHFFFAOYSA-N 0.000 description 2
- NBIIXXVUZAFLBC-UHFFFAOYSA-N Phosphoric acid Chemical compound OP(O)(O)=O NBIIXXVUZAFLBC-UHFFFAOYSA-N 0.000 description 2
- NBBJYMSMWIIQGU-UHFFFAOYSA-N Propionic aldehyde Chemical compound CCC=O NBBJYMSMWIIQGU-UHFFFAOYSA-N 0.000 description 2
- QAOWNCQODCNURD-UHFFFAOYSA-N Sulfuric acid Chemical compound OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 2
- 230000002378 acidificating effect Effects 0.000 description 2
- 229920006231 aramid fiber Polymers 0.000 description 2
- HUMNYLRZRPPJDN-UHFFFAOYSA-N benzaldehyde Chemical compound O=CC1=CC=CC=C1 HUMNYLRZRPPJDN-UHFFFAOYSA-N 0.000 description 2
- PXKLMJQFEQBVLD-UHFFFAOYSA-N bisphenol F Chemical compound C1=CC(O)=CC=C1CC1=CC=C(O)C=C1 PXKLMJQFEQBVLD-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- YCIMNLLNPGFGHC-UHFFFAOYSA-N catechol Chemical compound OC1=CC=CC=C1O YCIMNLLNPGFGHC-UHFFFAOYSA-N 0.000 description 2
- ZUOUZKKEUPVFJK-UHFFFAOYSA-N diphenyl Chemical compound C1=CC=CC=C1C1=CC=CC=C1 ZUOUZKKEUPVFJK-UHFFFAOYSA-N 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- HYBBIBNJHNGZAN-UHFFFAOYSA-N furfural Chemical compound O=CC1=CC=CO1 HYBBIBNJHNGZAN-UHFFFAOYSA-N 0.000 description 2
- LEQAOMBKQFMDFZ-UHFFFAOYSA-N glyoxal Chemical compound O=CC=O LEQAOMBKQFMDFZ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- JARKCYVAAOWBJS-UHFFFAOYSA-N hexanal Chemical compound CCCCCC=O JARKCYVAAOWBJS-UHFFFAOYSA-N 0.000 description 2
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 2
- 230000001771 impaired effect Effects 0.000 description 2
- RLSSMJSEOOYNOY-UHFFFAOYSA-N m-cresol Chemical compound CC1=CC=CC(O)=C1 RLSSMJSEOOYNOY-UHFFFAOYSA-N 0.000 description 2
- 239000010680 novolac-type phenolic resin Substances 0.000 description 2
- QWVGKYWNOKOFNN-UHFFFAOYSA-N o-cresol Chemical compound CC1=CC=CC=C1O QWVGKYWNOKOFNN-UHFFFAOYSA-N 0.000 description 2
- IWDCLRJOBJJRNH-UHFFFAOYSA-N p-cresol Chemical compound CC1=CC=C(O)C=C1 IWDCLRJOBJJRNH-UHFFFAOYSA-N 0.000 description 2
- 229920002866 paraformaldehyde Polymers 0.000 description 2
- DTUQWGWMVIHBKE-UHFFFAOYSA-N phenylacetaldehyde Chemical compound O=CCC1=CC=CC=C1 DTUQWGWMVIHBKE-UHFFFAOYSA-N 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- WQGWDDDVZFFDIG-UHFFFAOYSA-N pyrogallol Chemical compound OC1=CC=CC(O)=C1O WQGWDDDVZFFDIG-UHFFFAOYSA-N 0.000 description 2
- GHMLBKRAJCXXBS-UHFFFAOYSA-N resorcinol Chemical compound OC1=CC=CC(O)=C1 GHMLBKRAJCXXBS-UHFFFAOYSA-N 0.000 description 2
- SMQUZDBALVYZAC-UHFFFAOYSA-N salicylaldehyde Chemical compound OC1=CC=CC=C1C=O SMQUZDBALVYZAC-UHFFFAOYSA-N 0.000 description 2
- BGJSXRVXTHVRSN-UHFFFAOYSA-N 1,3,5-trioxane Chemical compound C1OCOCO1 BGJSXRVXTHVRSN-UHFFFAOYSA-N 0.000 description 1
- AVGPBFMPXAHVFH-UHFFFAOYSA-N 2,3-dimethylphenol;2,4-dimethylphenol Chemical compound CC1=CC=C(O)C(C)=C1.CC1=CC=CC(O)=C1C AVGPBFMPXAHVFH-UHFFFAOYSA-N 0.000 description 1
- UFBJCMHMOXMLKC-UHFFFAOYSA-N 2,4-dinitrophenol Chemical compound OC1=CC=C([N+]([O-])=O)C=C1[N+]([O-])=O UFBJCMHMOXMLKC-UHFFFAOYSA-N 0.000 description 1
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 description 1
- VADKRMSMGWJZCF-UHFFFAOYSA-N 2-bromophenol Chemical compound OC1=CC=CC=C1Br VADKRMSMGWJZCF-UHFFFAOYSA-N 0.000 description 1
- ISPYQTSUDJAMAB-UHFFFAOYSA-N 2-chlorophenol Chemical compound OC1=CC=CC=C1Cl ISPYQTSUDJAMAB-UHFFFAOYSA-N 0.000 description 1
- HFHFGHLXUCOHLN-UHFFFAOYSA-N 2-fluorophenol Chemical compound OC1=CC=CC=C1F HFHFGHLXUCOHLN-UHFFFAOYSA-N 0.000 description 1
- KQDJTBPASNJQFQ-UHFFFAOYSA-N 2-iodophenol Chemical compound OC1=CC=CC=C1I KQDJTBPASNJQFQ-UHFFFAOYSA-N 0.000 description 1
- CRBJBYGJVIBWIY-UHFFFAOYSA-N 2-isopropylphenol Chemical compound CC(C)C1=CC=CC=C1O CRBJBYGJVIBWIY-UHFFFAOYSA-N 0.000 description 1
- LXBGSDVWAMZHDD-UHFFFAOYSA-N 2-methyl-1h-imidazole Chemical compound CC1=NC=CN1 LXBGSDVWAMZHDD-UHFFFAOYSA-N 0.000 description 1
- IQUPABOKLQSFBK-UHFFFAOYSA-N 2-nitrophenol Chemical compound OC1=CC=CC=C1[N+]([O-])=O IQUPABOKLQSFBK-UHFFFAOYSA-N 0.000 description 1
- ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 2-phenyl-1h-imidazole Chemical compound C1=CNC(C=2C=CC=CC=2)=N1 ZCUJYXPAKHMBAZ-UHFFFAOYSA-N 0.000 description 1
- FEPBITJSIHRMRT-UHFFFAOYSA-N 4-hydroxybenzenesulfonic acid Chemical compound OC1=CC=C(S(O)(=O)=O)C=C1 FEPBITJSIHRMRT-UHFFFAOYSA-N 0.000 description 1
- IGFHQQFPSIBGKE-UHFFFAOYSA-N 4-nonylphenol Chemical compound CCCCCCCCCC1=CC=C(O)C=C1 IGFHQQFPSIBGKE-UHFFFAOYSA-N 0.000 description 1
- NTDQQZYCCIDJRK-UHFFFAOYSA-N 4-octylphenol Chemical compound CCCCCCCCC1=CC=C(O)C=C1 NTDQQZYCCIDJRK-UHFFFAOYSA-N 0.000 description 1
- QHPQWRBYOIRBIT-UHFFFAOYSA-N 4-tert-butylphenol Chemical compound CC(C)(C)C1=CC=C(O)C=C1 QHPQWRBYOIRBIT-UHFFFAOYSA-N 0.000 description 1
- TYOXIFXYEIILLY-UHFFFAOYSA-N 5-methyl-2-phenyl-1h-imidazole Chemical compound N1C(C)=CN=C1C1=CC=CC=C1 TYOXIFXYEIILLY-UHFFFAOYSA-N 0.000 description 1
- 229930188104 Alkylresorcinol Natural products 0.000 description 1
- 229920003319 Araldite® Polymers 0.000 description 1
- 238000007550 Rockwell hardness test Methods 0.000 description 1
- IKHGUXGNUITLKF-XPULMUKRSA-N acetaldehyde Chemical compound [14CH]([14CH3])=O IKHGUXGNUITLKF-XPULMUKRSA-N 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 150000007513 acids Chemical class 0.000 description 1
- 150000008044 alkali metal hydroxides Chemical class 0.000 description 1
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 1
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910000147 aluminium phosphate Inorganic materials 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 239000004760 aramid Substances 0.000 description 1
- 150000004982 aromatic amines Chemical class 0.000 description 1
- 229950011260 betanaphthol Drugs 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 235000010290 biphenyl Nutrition 0.000 description 1
- 239000004305 biphenyl Substances 0.000 description 1
- YXVFYQXJAXKLAK-UHFFFAOYSA-N biphenyl-4-ol Chemical compound C1=CC(O)=CC=C1C1=CC=CC=C1 YXVFYQXJAXKLAK-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- MLUCVPSAIODCQM-NSCUHMNNSA-N crotonaldehyde Chemical compound C\C=C\C=O MLUCVPSAIODCQM-NSCUHMNNSA-N 0.000 description 1
- MLUCVPSAIODCQM-UHFFFAOYSA-N crotonaldehyde Natural products CC=CC=O MLUCVPSAIODCQM-UHFFFAOYSA-N 0.000 description 1
- 238000000354 decomposition reaction Methods 0.000 description 1
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 229940015043 glyoxal Drugs 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 238000002715 modification method Methods 0.000 description 1
- NXPPAOGUKPJVDI-UHFFFAOYSA-N naphthalene-1,2-diol Chemical compound C1=CC=CC2=C(O)C(O)=CC=C21 NXPPAOGUKPJVDI-UHFFFAOYSA-N 0.000 description 1
- 229910052757 nitrogen Inorganic materials 0.000 description 1
- BTFQKIATRPGRBS-UHFFFAOYSA-N o-tolualdehyde Chemical compound CC1=CC=CC=C1C=O BTFQKIATRPGRBS-UHFFFAOYSA-N 0.000 description 1
- 150000007524 organic acids Chemical class 0.000 description 1
- 235000005985 organic acids Nutrition 0.000 description 1
- QBDSZLJBMIMQRS-UHFFFAOYSA-N p-Cumylphenol Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=CC=C1 QBDSZLJBMIMQRS-UHFFFAOYSA-N 0.000 description 1
- NRZWYNLTFLDQQX-UHFFFAOYSA-N p-tert-Amylphenol Chemical compound CCC(C)(C)C1=CC=C(O)C=C1 NRZWYNLTFLDQQX-UHFFFAOYSA-N 0.000 description 1
- QNGNSVIICDLXHT-UHFFFAOYSA-N para-ethylbenzaldehyde Natural products CCC1=CC=C(C=O)C=C1 QNGNSVIICDLXHT-UHFFFAOYSA-N 0.000 description 1
- 229940100595 phenylacetaldehyde Drugs 0.000 description 1
- QCDYQQDYXPDABM-UHFFFAOYSA-N phloroglucinol Chemical compound OC1=CC(O)=CC(O)=C1 QCDYQQDYXPDABM-UHFFFAOYSA-N 0.000 description 1
- 229960001553 phloroglucinol Drugs 0.000 description 1
- 150000003003 phosphines Chemical class 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- OXNIZHLAWKMVMX-UHFFFAOYSA-N picric acid Chemical compound OC1=C([N+]([O-])=O)C=C([N+]([O-])=O)C=C1[N+]([O-])=O OXNIZHLAWKMVMX-UHFFFAOYSA-N 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 238000010298 pulverizing process Methods 0.000 description 1
- 229940079877 pyrogallol Drugs 0.000 description 1
- 239000011134 resol-type phenolic resin Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000005728 strengthening Methods 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 230000008719 thickening Effects 0.000 description 1
- JOXIMZWYDAKGHI-UHFFFAOYSA-N toluene-4-sulfonic acid Chemical compound CC1=CC=C(S(O)(=O)=O)C=C1 JOXIMZWYDAKGHI-UHFFFAOYSA-N 0.000 description 1
- TUQOTMZNTHZOKS-UHFFFAOYSA-N tributylphosphine Chemical compound CCCCP(CCCC)CCCC TUQOTMZNTHZOKS-UHFFFAOYSA-N 0.000 description 1
- HFFLGKNGCAIQMO-UHFFFAOYSA-N trichloroacetaldehyde Chemical compound ClC(Cl)(Cl)C=O HFFLGKNGCAIQMO-UHFFFAOYSA-N 0.000 description 1
- 229950002929 trinitrophenol Drugs 0.000 description 1
- 239000003643 water by type Substances 0.000 description 1
- 150000003739 xylenols Chemical class 0.000 description 1
Landscapes
- Phenolic Resins Or Amino Resins (AREA)
- Epoxy Resins (AREA)
Abstract
Description
本発明は、摩擦材用フェノール樹脂組成物に関する。 The present invention relates to a phenol resin composition for a friction material.
フェノール樹脂は優れた機械特性、電気特性及び接着性などを有する材料である反面、フェノール樹脂を使用した成形物は堅くて脆いという欠点を持つ。フェノール樹脂の脆さを改良し強靱化する方法としてゴムなどのエラストマーによる変性法が有効とされ、多くの検討が行われている。例としてアクリル酸エステル含有エラストマー等によって変性されたエラストマー変性フェノール樹脂がある(例えば特許文献1参照)。しかし、エラストマーで変性することによりフェノール樹脂の耐熱性が損なわれるという欠点がある。
一方、従来の摩擦材用フェノール樹脂組成物は、ノボラック型フェノール樹脂をベースに硬化剤としてヘキサメチレンテトラミンを用いたもの、あるいはレゾール型フェノール樹脂を単独もしくはノボラック型フェノール樹脂と併用したものが一般的であった。このようなフェノール樹脂組成物を用いる場合、成形時、即ち樹脂の硬化反応において、縮合水、ヘキサメチレンテトラミンの分解で生じるアンモニアガスが発生する。これらの縮合水に起因する水蒸気、アンモニアガスは、均一な樹脂の硬化を阻害し、成形品中にボイド、亀裂等を生じさせるため成形品の外観が悪くなる、機械的強度が低下する等の問題があり、これを避けるため、成形時にガス抜き作業をする必要があり、工程が複雑かつ長時間になり効率や作業性が悪いという問題があった。このような問題を解決するため、ノボラック型フェノール樹脂、エポキシ樹脂、硬化触媒を均一に溶融混合することにより、成形時における硬化反応に起因するガスを実質的に発生させないフェノール樹脂組成物が発明され一部実用に供されている(例えば特許文献2参照)。しかし、このような摩擦材用フェノール樹脂組成物は、高い温度に曝されているときに強度が低下するという問題があった。
On the other hand, conventional phenol resin compositions for friction materials are generally based on novolak type phenol resins using hexamethylenetetramine as a curing agent, or resol type phenol resins alone or in combination with novolac type phenol resins. Met. When such a phenol resin composition is used, ammonia gas generated by decomposition of condensed water and hexamethylenetetramine is generated during molding, that is, in the curing reaction of the resin. Water vapor and ammonia gas resulting from these condensed waters inhibit uniform resin curing and cause voids, cracks, etc. in the molded product, resulting in poor appearance of the molded product, reduced mechanical strength, etc. There is a problem, and in order to avoid this, it is necessary to perform a degassing operation at the time of molding, and there is a problem that the process is complicated and takes a long time, resulting in poor efficiency and workability. In order to solve such problems, a phenolic resin composition was invented that does not substantially generate a gas caused by a curing reaction during molding by uniformly melting and mixing a novolac type phenolic resin, an epoxy resin, and a curing catalyst. Some are put to practical use (see, for example, Patent Document 2). However, such a phenol resin composition for a friction material has a problem in that strength is reduced when exposed to a high temperature.
本発明は、成形時にガス抜きを必要とせず、成形品にボイド、亀裂を生じることなく、かつ、柔軟性に優れ、耐熱性の良好な摩擦材用フェノール樹脂組成物を提供するものである。 The present invention provides a phenol resin composition for a friction material that does not require degassing during molding, does not cause voids or cracks in a molded product, has excellent flexibility, and has good heat resistance.
このような目的は、下記の本発明[1]〜[3]により達成される。
[1]不飽和油変性ノボラック型フェノール樹脂、レゾール型フェノール樹脂、エポキシ樹脂及び硬化触媒を含有してなることを特徴とする摩擦材用フェノール樹脂組成物。
[2]前記不飽和油変性ノボラック型フェノール樹脂が、カシュー油、トール油、アマニ油および桐油からなる群より選ばれた1種または2種以上である請求項1に記載の摩擦材用フェノール樹脂組成物。
[3]ノボラック型フェノール樹脂が、不飽和油の変性率5〜50重量%のものである請求項1記載の摩擦材用フェノール樹脂組成物。
[4]前記不飽和油がカシュー油である請求項1または3に記載の摩擦材用フェノール樹脂組成物。
Such an object is achieved by the following present inventions [1] to [3].
[1] A phenol resin composition for a friction material comprising an unsaturated oil-modified novolak-type phenol resin, a resol-type phenol resin, an epoxy resin, and a curing catalyst.
[2] The phenol resin for a friction material according to claim 1, wherein the unsaturated oil-modified novolak type phenol resin is one or more selected from the group consisting of cashew oil, tall oil, linseed oil and tung oil. Composition.
[3] The phenol resin composition for a friction material according to claim 1, wherein the novolac-type phenol resin has a modification rate of unsaturated oil of 5 to 50% by weight.
[4] The phenol resin composition for a friction material according to claim 1 or 3, wherein the unsaturated oil is cashew oil.
本発明によれば、成形時にガス抜きを必要とせず、成形品にボイド、亀裂を生じることなく、かつ、柔軟性に優れ、耐熱性の良好な摩擦材用フェノール樹脂組成物を提供することができる。 According to the present invention, it is possible to provide a phenol resin composition for a friction material that does not require degassing during molding, does not cause voids or cracks in a molded product, and has excellent flexibility and heat resistance. it can.
以下、本発明のフェノール樹脂組成物について説明する。
本発明の摩擦材用フェノール樹脂組成物は、不飽和油変性ノボラック型フェノール樹脂、エポキシ樹脂、レゾール型フェノール樹脂及び硬化触媒を必須成分とする。
Hereinafter, the phenol resin composition of the present invention will be described.
The phenol resin composition for a friction material of the present invention contains an unsaturated oil-modified novolac type phenol resin, an epoxy resin, a resol type phenol resin, and a curing catalyst as essential components.
本発明の摩擦材用フェノール樹脂組成物で用いられる不飽和油変性ノボラック型フェノール樹脂は、通常、フェノール類とアルデヒド類とを、酸性物質を触媒として、フェノール類(P)とアルデヒド類(F)を反応させた後、不飽和油で変性したものが好ましく用いられる。上記フェノール類と、アルデヒド類とを反応させる際の反応モル比[F/P]としては特に限定されないが、0.5〜1.0であることが好ましく、更に好ましくは0.6〜0.9である。モル比が前記下限値 未満では、樹脂の分子量が低く、固形化した樹脂を得ることができない。また、モル比が前記上限値を超えると樹脂化反応の際、樹脂の高分子化による増粘、あるいはゲル化のため、反応を適切に終結させることが不可能となる。 The unsaturated oil-modified novolak-type phenol resin used in the phenol resin composition for a friction material of the present invention is generally phenols (P) and aldehydes (F) using phenols and aldehydes as acidic catalysts. After the reaction, those modified with an unsaturated oil are preferably used. Although it does not specifically limit as reaction molar ratio [F / P] at the time of making the said phenols and aldehydes react, It is preferable that it is 0.5-1.0, More preferably, it is 0.6-0. Nine. When the molar ratio is less than the lower limit, the molecular weight of the resin is low, and a solidified resin cannot be obtained. On the other hand, if the molar ratio exceeds the above upper limit, it is impossible to terminate the reaction properly due to thickening or gelation due to polymerization of the resin during the resinification reaction.
不飽和油変性ノボラック型フェノール樹脂の触媒となる酸性物質としては、例えば、シュウ酸などの有機酸や塩酸、硫酸、燐酸などの鉱物酸、パラトルエンスルホン酸、パラフェノールスルホン酸などを使用することができる。またこれらを単独または2種類以上組み合わせて使用することができる。 Examples of acidic substances that can be used as catalysts for unsaturated oil-modified novolak type phenolic resins include organic acids such as oxalic acid, mineral acids such as hydrochloric acid, sulfuric acid, and phosphoric acid, paratoluenesulfonic acid, and paraphenolsulfonic acid. Can do. Moreover, these can be used individually or in combination of 2 or more types.
不飽和油変性ノボラック型フェノール樹脂の合成に用いられる不飽和油としては特に限定されないが、例えば、カシュー油、トール油、アマニ油および桐油などを用いることができる。これらを単独または2種類以上組み合わせて使用することができる。
不飽和油による変性は、フェノール類(P)とアルデヒド類(F)を反応させた後、不飽和油を加え、シュウ酸などを触媒として反応させることにより得ることができる。
Although it does not specifically limit as unsaturated oil used for the synthesis | combination of an unsaturated oil modified novolak type phenol resin, For example, cashew oil, tall oil, linseed oil, tung oil, etc. can be used. These can be used alone or in combination of two or more.
Modification by unsaturated oil can be obtained by reacting phenols (P) and aldehydes (F), adding unsaturated oil, and reacting oxalic acid or the like as a catalyst.
不飽和油変性ノボラック型フェノール樹脂の変性量は5〜50重量%であることが好ましく、更に好ましくは10〜35重量%である。変性量が前記下限値未満であると、得られた樹脂が柔軟性に欠けるという問題を生じ、また変性量が前記上限値を超えると硬化性が損なわれるという問題を生じるため好ましくない。 The amount of modification of the unsaturated oil-modified novolak type phenol resin is preferably 5 to 50% by weight, more preferably 10 to 35% by weight. If the modification amount is less than the lower limit, there is a problem that the obtained resin lacks flexibility, and if the modification amount exceeds the upper limit, a problem that the curability is impaired is not preferable.
本発明の摩擦材用フェノール樹脂組成物で用いられるレゾール型フェノール樹脂は、通常、フェノール類とアルデヒド類とを、塩基性物質を触媒として、フェノール類(P)とアルデヒド類(F)を反応させたものが好ましく用いられる。上記フェノール類と、アルデヒド類とを反応させる際の反応モル比[F/P]としては特に限定されないが、0.7〜3.0であることが好ましく、更に好ましくは0.9〜1.8である。 The resol type phenol resin used in the phenol resin composition for a friction material of the present invention usually reacts phenols (P) and aldehydes (F) using a basic substance as a catalyst with phenols and aldehydes. Are preferably used. Although it does not specifically limit as reaction molar ratio [F / P] at the time of making the said phenols and aldehydes react, It is preferable that it is 0.7-3.0, More preferably, it is 0.9-1. 8.
レゾール型フェノール樹脂の触媒となる塩基性物質としては、例えば、アルカリ金属の水酸化物、第3級アミン、アルカリ土類金属の酸化物及び水酸化物、アルカリ性物質などを使用することができる。またこれらを単独または2種類以上組み合わせて使用することができる。 Examples of the basic substance that can be used as a catalyst for the resol type phenol resin include alkali metal hydroxides, tertiary amines, alkaline earth metal oxides and hydroxides, and alkaline substances. Moreover, these can be used individually or in combination of 2 or more types.
不飽和油変性ノボラック型フェノール樹脂又はレゾール型フェノール樹脂の原料となるフェノール類としては特に限定しないが、例えば、フェノール、o−クレゾール、m−クレゾール、p−クレゾール等のクレゾール、2,3−キシレノール、2,4−キシレノール、2,5−キシレノール、2,6−キシレノール、3,4−キシレノール、3,5−キシレノール等のキシレノール、o−エチルフェノール、m−エチルフェノール、p−エチルフェノール等のエチルフェノール、イソプロピルフェノール、ブチルフェノール、p−tert−ブチルフェノール等のブチルフェノール、p−tert−アミルフェノール、p−オクチルフェノール、p−ノニルフェノール、p−クミルフェノール等のアルキルフェノール、フルオロフェノール、クロロフェノール、ブロモフェノール、ヨードフェノール等のハロゲン化フェノール、p−フェニルフェノール、アミノフェノール、ニトロフェノール、ジニトロフェノール、トリニトロフェノール等の1価フェノール置換体、および1−ナフトール、2−ナフトール等の1価のフェノール類、レゾルシン、アルキルレゾルシン、ピロガロール、カテコール、アルキルカテコール、ハイドロキノン、アルキルハイドロキノン、フロログルシン、ビスフェノールA、ビスフェノールF、ビスフェノールS、ジヒドロキシナフタリン等の多価フェノール類などが挙げられる。これらを単独または2種類以上組み合わせて使用することができるが、通常、フェノール、クレゾールが多く用いられる。 Although it does not specifically limit as phenols used as a raw material of unsaturated oil modification novolak type phenol resin or resol type phenol resin, For example, cresol, such as phenol, o-cresol, m-cresol, p-cresol, 2,3-xylenol 2,4-xylenol, 2,5-xylenol, 2,6-xylenol, 3,4-xylenol, xylenol such as 3,5-xylenol, o-ethylphenol, m-ethylphenol, p-ethylphenol, etc. Alkylphenols such as ethylphenol, isopropylphenol, butylphenol, p-tert-butylphenol, p-tert-amylphenol, p-octylphenol, p-nonylphenol, p-cumylphenol, fluorophenol Halogenated phenols such as chlorophenol, bromophenol and iodophenol, monovalent phenol substitutes such as p-phenylphenol, aminophenol, nitrophenol, dinitrophenol and trinitrophenol, and 1 such as 1-naphthol and 2-naphthol And polyhydric phenols such as divalent phenols, resorcinol, alkylresorcinol, pyrogallol, catechol, alkylcatechol, hydroquinone, alkylhydroquinone, phloroglucin, bisphenol A, bisphenol F, bisphenol S, dihydroxynaphthalene and the like. These can be used singly or in combination of two or more, but usually phenol and cresol are often used.
次に、ノボラック型フェノール樹脂又はレゾール型フェノール樹脂の原料となるアルデヒド類としては特に限定しないが、例えば、ホルムアルデヒド、パラホルムアルデヒド、トリオキサン、アセトアルデヒド、プロピオンアルデヒド、ポリオキシメチレン、クロラール、ヘキサメチレンテトラミン、フルフラール、グリオキザール、n−ブチルアルデヒド、カプロアルデヒド、アリルアルデヒド、ベンズアルデヒド、クロトンアルデヒド、アクロレイン、テトラオキシメチレン、フェニルアセトアルデヒド、o−トルアルデヒド、サリチルアルデヒド等が挙げられる。これらを単独または2種類以上組み合わせて使用することができるが、通常、ホルムアルデヒド、パラホルムアルデヒドなどのホルムアルデヒド類が多く用いられる。 Next, the aldehydes used as a raw material for the novolac type phenol resin or the resol type phenol resin are not particularly limited. For example, formaldehyde, paraformaldehyde, trioxane, acetaldehyde, propionaldehyde, polyoxymethylene, chloral, hexamethylenetetramine, furfural , Glyoxal, n-butyraldehyde, caproaldehyde, allyl aldehyde, benzaldehyde, crotonaldehyde, acrolein, tetraoxymethylene, phenylacetaldehyde, o-tolualdehyde, salicylaldehyde and the like. These can be used alone or in combination of two or more, but usually formaldehydes such as formaldehyde and paraformaldehyde are often used.
本発明の摩擦材用フェノール樹脂組成物に用いられる不飽和油変性ノボラック型フェノール樹脂又はレゾール型フェノール樹脂の未反応フェノール類の含有量は、ノボラック型フェノール樹脂全体に対して5.0重量%以下であることが好ましく、更に好ましくは1.0重量%以下である。こうすることで、未反応フェノールに起因する樹脂加工時の臭気を低減でき、作業環境を良好なものにすることができると共に緒物性を良好に維持することができる。 The content of unreacted phenols in the unsaturated oil-modified novolak-type phenol resin or resol-type phenol resin used in the phenol resin composition for a friction material of the present invention is 5.0% by weight or less based on the entire novolak-type phenol resin. It is preferable that it is 1.0% by weight or less. By doing so, the odor at the time of resin processing due to unreacted phenol can be reduced, the working environment can be made favorable, and the original physical properties can be kept good.
本発明の摩擦材用フェノール樹脂組成物に用いられるエポキシ樹脂としては特に限定されないが、1分子中に少なくとも2個のエポキシ基を有するもので、室温で固形のものであればよく、例えばビスフェノールA型、ビスフェノールS型、フェノールノボラック型、クレゾールノボラック型、ビフェニル型、ナフタレン型、芳香族アミン型などが挙げられる。また、これらは単独または複数を組み合わせて使用することができる。本発明の組成物におけるエポキシ樹脂の配合量としては特に限定されないが、前記ノボラック型フェノール樹脂が有するフェノール性水酸基1.0当量に対し、エポキシ樹脂の有するエポキシ基が0.1〜2.5当量であることが好ましく、更に好ましくは0.2〜1.4当量である。フェノール性水酸基に対するエポキシ基の当量数が前記下限値未満であるか、前記上限値を越えると、樹脂成分の硬化が不充分となることがあり、これにより、硬化物が十分な機械的強度を得られなくなることがある。 Although it does not specifically limit as an epoxy resin used for the phenol resin composition for friction materials of this invention, It is a thing which has at least 2 epoxy group in 1 molecule and is solid at room temperature, for example, bisphenol A Type, bisphenol S type, phenol novolak type, cresol novolak type, biphenyl type, naphthalene type, aromatic amine type and the like. Moreover, these can be used individually or in combination of multiple. The compounding amount of the epoxy resin in the composition of the present invention is not particularly limited, but the epoxy group of the epoxy resin is 0.1 to 2.5 equivalents with respect to 1.0 equivalent of the phenolic hydroxyl group of the novolac type phenol resin. It is preferable that it is 0.2-1.4 equivalent. If the number of equivalents of epoxy groups relative to the phenolic hydroxyl group is less than the above lower limit value or exceeds the above upper limit value, the resin component may be insufficiently cured, whereby the cured product has sufficient mechanical strength. It may not be obtained.
本発明の摩擦材用フェノール樹脂組成物において用いられる硬化触媒としては特に限定されないが、例えばトリエチルアミン、ベンジルジメチルアミン、α−メチルベンジルジメチルアミンなどの3級アミン化合物、トリフェニルホスフィン、トリブチルホスフィンなどの有機ホスフィン化合物、2−メチルイミダゾール、2−フェニルイミダゾール、2−フェニル−4−メチルイミダゾールなどのイミダゾール化合物などが挙げられる。また、これらは単独または複数を組み合わせて使用することができる。硬化触媒の添加量としては特に限定されないが、エポキシ樹脂100重量部に対し、0.03〜2.5重量部であることが好ましく、更に好ましくは0.05〜2.0重量部である。硬化触媒の添加量が前記下限値未満では樹脂の硬化が不充分になることがあり、一方、前記上限値を超えると、樹脂の硬化が速くなり流動性が低下するようになるため、機械的強度の低下をもたらすことがある。 Although it does not specifically limit as a curing catalyst used in the phenol resin composition for friction materials of this invention, For example, tertiary amine compounds, such as triethylamine, benzyldimethylamine, (alpha) -methylbenzyldimethylamine, triphenylphosphine, tributylphosphine, etc. Examples include organic phosphine compounds, imidazole compounds such as 2-methylimidazole, 2-phenylimidazole, and 2-phenyl-4-methylimidazole. Moreover, these can be used individually or in combination of multiple. Although it does not specifically limit as addition amount of a curing catalyst, It is preferable that it is 0.03-2.5 weight part with respect to 100 weight part of epoxy resins, More preferably, it is 0.05-2.0 weight part. If the addition amount of the curing catalyst is less than the lower limit, curing of the resin may be insufficient. On the other hand, if the amount exceeds the upper limit, the curing of the resin is accelerated and the fluidity is lowered. May cause a decrease in strength.
本発明のフェノール樹脂組成物は、通常のノボラック型フェノール樹脂を用いて調製した摩擦材用フェノール樹脂組成物に対して柔軟性に優れ、樹脂成分として熱可塑性樹脂で変性したノボラック型フェノール樹脂だけを用いた組成物に対して成形時に多くのガス抜きを必要とせず、成形品にボイド、亀裂を生じることなく、かつ、エポキシ樹脂硬化型の摩擦材用フェノール樹脂組成物に対して耐熱性の良好な摩擦材用フェノール樹脂組成物を提供することができる。 The phenol resin composition of the present invention is superior in flexibility to a phenol resin composition for a friction material prepared using a normal novolac type phenol resin, and only a novolac type phenol resin modified with a thermoplastic resin as a resin component. Does not require a lot of degassing during molding of the composition used, does not cause voids or cracks in the molded product, and has good heat resistance against phenol resin composition for friction material of epoxy resin curable type A phenol resin composition for a friction material can be provided.
以下、本発明の組成物を摩擦材に用いた実施例により詳細に説明する。
実施例における各組成物の調製及び摩擦材(ブレーキ材)の製造で用いた原料等は以下のとおりである。
(1)ノボラック型フェノール樹脂:住友ベークライト株式会社製 PR−50731
(2)レゾール型フェノール樹脂:住友ベークライト株式会社製 PR−11078
(3)エポキシ樹脂:旭チバ株式会社製 アラルダイトECN1299
(4)硫酸バリウム(平均粒子径 20μm):堺化学株式会社製 BF−1H
(5)炭酸カルシウム(平均粒子径 20μm):白石工業株式会社製 Vigot15
(6)ヘキサメチレンテトラミン:Caldic Europoprt B.V.
(7)カシューダスト(平均粒子径 250μm):東北化工株式会社製 FF−1081
(8)アラミド繊維(繊維長 2mm):東レ・デュポン株式会社製 ドライパルプ
Hereinafter, the examples using the composition of the present invention as a friction material will be described in detail.
The raw materials used in the preparation of each composition and the production of the friction material (brake material) in the examples are as follows.
(1) Novolac type phenolic resin: PR-50731 manufactured by Sumitomo Bakelite Co., Ltd.
(2) Resol type phenol resin: Sumitomo Bakelite Co., Ltd. PR-11078
(3) Epoxy resin: Araldite ECN1299 manufactured by Asahi Ciba Co., Ltd.
(4) Barium sulfate (average particle size 20 μm): BF-1H manufactured by Sakai Chemical Co., Ltd.
(5) Calcium carbonate (average particle size 20 μm): Vigot 15 manufactured by Shiroishi Kogyo Co., Ltd.
(6) Hexamethylenetetramine: Caldic Europoprt. V.
(7) Cashew dust (average particle size 250 μm): FF-1081 manufactured by Tohoku Kako Co., Ltd.
(8) Aramid fiber (fiber length 2 mm): dry pulp manufactured by Toray DuPont Co., Ltd.
(実施例1)
攪拌装置を備えたフラスコに、フェノール1000重量部、蓚酸10重量部を仕込んだ。これに604重量部の37%ホルムアルデヒド水溶液を1時間半かけて加え(F/P比=0.7)、更に1時間還流させ、反応によって生じる水の常圧除去、遊離フェノールが1%未満になるまで真空除去を行ない、380重量部のカシュー油を添加しカシュー油変性ノボラック型フェノール樹脂(1)を得た。
このカシュー油変性ノボラック型フェノール樹脂(1)を600重量部、固形レゾール型フェノール樹脂200重量部、エポキシ樹脂200重量部、トリフェニルホスフィン1重量部を混練機により加圧力、剪断力を加え軟化混合し固形の摩擦材用フェノール樹脂組成物950重量部を得た。更にこれを粉砕機で粉砕し、粉末状の摩擦材用フェノール樹脂組成物(1)を900重量部得た。
得られた摩擦材用フェノール樹脂組成物(1)80重量部、硫酸バリウム400重量部、炭酸カルシウム420重量部、カシューダスト50重量部、アラミド繊維50重量部を用い、アイリッヒミキサーで混合して混合物とした。
これを、温度150℃、圧力30MPaで9分間成形し、85×60×18mmの成形品を得た。得られた成形品をさらに200℃で5時間焼成して摩擦材(ブレーキ材)を得た。
Example 1
A flask equipped with a stirrer was charged with 1000 parts by weight of phenol and 10 parts by weight of oxalic acid. 604 parts by weight of 37% formaldehyde aqueous solution was added to this over 1 hour and a half (F / P ratio = 0.7), and the mixture was further refluxed for 1 hour to remove atmospheric pressure of water generated by the reaction, and free phenol was reduced to less than 1%. Vacuum removal was performed until 380 parts by weight of cashew oil was added to obtain a cashew oil-modified novolak phenol resin (1).
600 parts by weight of this cashew oil-modified novolak type phenolic resin (1), 200 parts by weight of solid resol type phenolic resin, 200 parts by weight of epoxy resin, and 1 part by weight of triphenylphosphine were softened and mixed by applying pressure and shearing force with a kneader. 950 parts by weight of a solid phenol resin composition for friction material was obtained. Furthermore, this was grind | pulverized with the grinder, and 900 weight part of powdery phenol resin compositions (1) for friction materials were obtained.
80 parts by weight of the obtained phenol resin composition for friction material (1), 400 parts by weight of barium sulfate, 420 parts by weight of calcium carbonate, 50 parts by weight of cashew dust, and 50 parts by weight of aramid fibers were mixed with an Eirich mixer. A mixture was obtained.
This was molded at a temperature of 150 ° C. and a pressure of 30 MPa for 9 minutes to obtain a molded product of 85 × 60 × 18 mm. The obtained molded product was further fired at 200 ° C. for 5 hours to obtain a friction material (brake material).
(比較例1)
実施例1と同様にしてカシュー油変性ノボラック型フェノール樹脂(1)を得た。
このカシュー油変性ノボラック型フェノール樹脂(1)600重量部、エポキシ樹脂400重量部、トリフェニルホスフィン2重量部を混練機により加圧力、剪断力を加え軟化混合し固形の摩擦材用フェノール樹脂組成物950重量部を得た。更にこれを粉砕機で粉砕し、粉末状の摩擦材用フェノール樹脂組成物900重量部を得た。
得られた摩擦材用フェノール樹脂組成物を用いて、表2に示す配合割合にて、実施例1と同様の操作を行い、摩擦材を得た。
(Comparative Example 1)
In the same manner as in Example 1, a cashew oil-modified novolak-type phenol resin (1) was obtained.
600 parts by weight of this cashew oil-modified novolak type phenol resin (1), 400 parts by weight of epoxy resin, and 2 parts by weight of triphenylphosphine are softened and mixed by applying pressure and shearing force with a kneader to form a solid phenol resin composition for friction material 950 parts by weight were obtained. This was further pulverized by a pulverizer to obtain 900 parts by weight of a powdery phenol resin composition for a friction material.
Using the obtained phenol resin composition for a friction material, the same operation as in Example 1 was performed at a blending ratio shown in Table 2 to obtain a friction material.
(比較例2)
ノボラック型フェノール樹脂600重量部、レゾール型フェノール樹脂200重量部、エポキシ樹脂200重量部、トリフェニルホスフィン1重量部を混練機により加圧力、剪断力を加え軟化混合し固形の摩擦材用フェノール樹脂組成物950重量部を得た。更にこれを粉砕機で粉砕し、粉末状の摩擦材用フェノール樹脂組成物900重量部を得た。
得られた摩擦材用フェノール樹脂組成物を用いて、表2に示す配合割合にて、実施例1と同様の操作を行い、摩擦材を得た。
(Comparative Example 2)
A composition of 600 parts by weight of a novolac type phenol resin, 200 parts by weight of a resol type phenol resin, 200 parts by weight of an epoxy resin, and 1 part by weight of triphenylphosphine by applying pressure and shearing force with a kneader to soften and mix the solid phenol resin composition 950 parts by weight of product was obtained. This was further pulverized by a pulverizer to obtain 900 parts by weight of a powdery phenol resin composition for a friction material.
Using the obtained phenol resin composition for a friction material, the same operation as in Example 1 was performed at a blending ratio shown in Table 2 to obtain a friction material.
(比較例3)
実施例1と同様にしてカシュー油変性ノボラック型フェノール樹脂(1)を得た。
このカシュー油変性ノボラック型フェノール樹脂(1)600重量部、ノボラック型フェノール樹脂400重量部、ヘキサメチレンテトラミン100重量部を混練機により加圧力、剪断力を加え軟化混合し固形の摩擦材用フェノール樹脂組成物1050重量部を得た。更にこれを粉砕機で粉砕し、粉末状の摩擦材用フェノール樹脂組成物1000重量部を得た。
得られた摩擦材用フェノール樹脂組成物を用いて、表2に示す配合割合にて、実施例1と同様の操作を行い、摩擦材を得た。
(Comparative Example 3)
In the same manner as in Example 1, a cashew oil-modified novolak-type phenol resin (1) was obtained.
600 parts by weight of this cashew oil-modified novolak type phenol resin (1), 400 parts by weight of novolak type phenol resin, and 100 parts by weight of hexamethylenetetramine are softened and mixed by applying pressure and shearing force with a kneader to form a solid phenol resin for friction material. 1050 parts by weight of the composition was obtained. Further, this was pulverized with a pulverizer to obtain 1000 parts by weight of a powdery phenol resin composition for a friction material.
Using the obtained phenol resin composition for a friction material, the same operation as in Example 1 was performed at a blending ratio shown in Table 2 to obtain a friction material.
表1に、摩擦材(ブレーキ材)の調製に用いた摩擦材用フェノール樹脂組成物の配合を示す。また表2に摩擦材の調製に於ける各材料の配合を示す。単位は全て重量部を表す。 Table 1 shows the composition of the phenol resin composition for a friction material used for the preparation of the friction material (brake material). Table 2 shows the composition of each material in the preparation of the friction material. All units represent parts by weight.
上記実施例及び比較例により作製したブレーキ材を評価用試料として以下の評価を行った。結果を表3に示す。 The following evaluations were performed using the brake materials produced in the above examples and comparative examples as samples for evaluation. The results are shown in Table 3.
評価方法
(1)ガス発生量:180℃に設定したオイルバス中にガラス製テストチューブを浸漬し、温度が安定するまで放置した。その後、精秤した約3gの組成物を円筒形にしたアルミホイルに入れ、チューブ内に挿入した。発生するガスを簡易型ガスボリューム計にて控除された体積分だけ液面を下げながら、常に圧力を一定に保ち、10分間に発生するガスの体積を測定した。
Evaluation Method (1) Gas generation amount: A glass test tube was immersed in an oil bath set at 180 ° C. and left until the temperature was stabilized. Thereafter, about 3 g of the precisely weighed composition was placed in a cylindrical aluminum foil and inserted into a tube. While lowering the liquid level by the volume obtained by subtracting the generated gas with a simple gas volume meter, the volume of the gas generated during 10 minutes was measured while keeping the pressure constant.
(2)成形性:表1に示す配合割合で仕込み混合して得られる摩擦材用混合物160gを圧力30MPaで成形を行った際、成形に必要な時間を測定した。成形温度は175℃、225℃について評価を行った。 (2) Moldability: When 160 g of the friction material mixture obtained by charging and mixing at the blending ratio shown in Table 1 was molded at a pressure of 30 MPa, the time required for molding was measured. The molding temperature was evaluated at 175 ° C and 225 ° C.
(2)ロックウェル硬度:JIS K 7202「プラスチックのロックウェル硬さ試験方法」に準拠して測定した。 (2) Rockwell hardness: Measured according to JIS K 7202 “Plastic Rockwell hardness test method”.
(3)曲げ強度:JIS K 7203「硬質プラスチックの曲げ試験方法」に準拠して測定した。状態曲げ強度は室温で、熱処理後の曲げ強度は350℃で4時間熱処理をしてから室温で測定した。熱間の曲げ強度は200℃で1時間保持した試験片を300℃にて曲げ強度測定を行なった。 (3) Bending strength: Measured according to JIS K 7203 “Bending test method of hard plastic”. The state bending strength was measured at room temperature, and the bending strength after heat treatment was measured at room temperature after heat treatment at 350 ° C. for 4 hours. The bending strength was measured at 300 ° C. for a test piece held at 200 ° C. for 1 hour.
(4)動的粘弾性試験:動的粘弾性測定装置を用い、窒素気流下(300mL/min)、昇温速度3℃/minにて測定した。 (4) Dynamic viscoelasticity test: Measured using a dynamic viscoelasticity measuring apparatus under a nitrogen stream (300 mL / min) at a temperature rising rate of 3 ° C./min.
実施例1は、カシュー油変性ノボラック型フェノール樹脂を用いて、レゾール型フェノール樹脂、エポキシ樹脂と共に粉砕して得られた摩擦材用フェノール樹脂組成物である。
比較例1は実施例1に対してレゾール型フェノール樹脂を含まない分エポキシ樹脂の割合が高く、常態に対する熱時の機械的特性の減少が大きい。
比較例2はカシュー油変性ノボラック型フェノール樹脂を含まない摩擦材用フェノール樹脂組成物であるが、他の例に比べて柔軟性に乏しいデータが得られた。
また比較例3はレゾール型フェノール樹脂とエポキシ樹脂を用いず、ヘキサメチレンテトラミンを用いて硬化する、摩擦材用フェノール樹脂組成物であるが、ガス発生量が多く、225℃では膨れや亀裂を生じ、成形不能であった。
Example 1 is a phenol resin composition for a friction material obtained by pulverizing together with a resol type phenol resin and an epoxy resin using a cashew oil-modified novolak type phenol resin.
Comparative Example 1 has a higher proportion of epoxy resin than Example 1 because it does not contain a resol-type phenol resin, and has a large decrease in mechanical properties when heated relative to the normal state.
Comparative Example 2 is a phenol resin composition for a friction material that does not contain a cashew oil-modified novolak type phenol resin, but data with poor flexibility was obtained compared to other examples.
Comparative Example 3 is a phenol resin composition for a friction material that is cured using hexamethylenetetramine without using a resol-type phenol resin and an epoxy resin, but has a large amount of gas generation and causes blistering and cracking at 225 ° C. It was impossible to mold.
Claims (4)
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