JP2009011043A - Fault detection device for chopper circuit - Google Patents
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Abstract
【課題】1つのゲート駆動回路によって駆動する半導体スイッチング素子を並列接続した素子のうち少なくとも1つの素子に故障が発生した時にこれを検出し、被害拡大を防ぐことができるチョッパ回路の故障検出装置を提供するものである。
【解決手段】電力変換装置の主回路に接続され、複数のIGBT素子11〜14を並列接続したチョッパ回路3において、素子11〜14のオン・オフを制御するゲート信号を発生するゲート制御部20と、ゲート信号を並列接続した全てのIGBT素子11〜14に与えるゲート駆動回路30と、前記素子11〜14のオン・オフ状態をゲート−エミッタ間電圧の大きさと基準電圧を比較し、ゲート−エミッタ間電圧の大きさが基準電圧より大きい時にオン状態と判別し、それ以外の時はオフ状態と判別する比較回路45と、フィードバック信号の有無により故障と判別する第1の故障判別部26とを備えたものである。
【選択図】 図1
A fault detection device for a chopper circuit capable of detecting when a fault has occurred in at least one of elements connected in parallel with semiconductor switching elements driven by one gate drive circuit and preventing the damage from spreading. It is to provide.
In a chopper circuit 3 connected to a main circuit of a power conversion device and connecting a plurality of IGBT elements 11 to 14 in parallel, a gate control unit 20 for generating a gate signal for controlling on / off of the elements 11 to 14 The gate drive circuit 30 for supplying the gate signals to all the IGBT elements 11 to 14 connected in parallel, and the on / off states of the elements 11 to 14 are compared with the magnitude of the gate-emitter voltage and the reference voltage. A comparison circuit 45 that determines an on state when the magnitude of the voltage between the emitters is larger than the reference voltage, and an off state otherwise, and a first failure determination unit 26 that determines a failure based on the presence or absence of a feedback signal It is equipped with.
[Selection] Figure 1
Description
本発明は、半導体スイッチング素子で構成されたチョッパ回路を備えた電力変換装置に係り、そのチョッパ回路の故障を検出する装置に関するものである。 The present invention relates to a power conversion device provided with a chopper circuit composed of semiconductor switching elements, and to a device for detecting a failure of the chopper circuit.
半導体スイッチング素子、例えばIGBT素子のような電圧駆動型自己消弧素子を用いて構成される電力変換装置の従来の故障検出方法としては、例えばゲート駆動回路から半導体スイッチング素子に与えるゲート信号と該素子の状態をゲート駆動回路にフィードバックするフィードバック信号を比較して、両者が一致しない時に異常と判別する不一致検出装置があった(特許文献1)。 As a conventional failure detection method of a power conversion device configured using a semiconductor-switching element, for example, a voltage-driven self-extinguishing element such as an IGBT element, for example, a gate signal applied to the semiconductor switching element from a gate drive circuit and the element There is a mismatch detection device that compares a feedback signal that feeds back this state to the gate drive circuit and discriminates an abnormality when the two do not match (Patent Document 1).
しかしながら従来の不一致検出回路を用いた故障検出装置では、IGBT素子およびゲート駆動回路が1つ、即ち1並列構成となっている場合について故障検出が可能であるが、複数のIGBT素子が主回路で並列構成となっている場合については、フィードバック信号を受けるゲート駆動回路も複数必要となり、結果的に電力変換装置が大型化してしまう問題があった。
本発明は上記の問題点を改善し、1つのゲート駆動回路によって駆動する半導体スイッチング素子を並列接続した素子のうち少なくとも1つの素子に故障が発生した時においても、素子の故障を検出し適切な保護動作を行うことによって、並列素子間の電流バランスが崩れて故障素子あるいは他の健全な素子に過大な電流が流れて、なだれ的に故障が発生し、被害が拡大するのを防止したチョッパ回路の故障検出装置を提供するものである。 The present invention improves the above-described problems, and detects a failure of an element even when a failure occurs in at least one of the elements in which semiconductor switching elements driven by one gate drive circuit are connected in parallel. By performing the protection operation, the current balance between the parallel elements is disrupted, and an excessive current flows through the faulty element or other healthy elements, preventing avalanche faults from occurring and preventing damage from spreading. A failure detection apparatus is provided.
本発明の請求項1記載のチョッパ回路の故障検出装置は、電力変換装置の主回路に接続され、複数の半導体スイッチング素子を並列接続して構成されたチョッパ回路において、前記半導体スイッチング素子のオン・オフを制御するゲート信号を発生するゲート制御手段と、前記ゲート信号を並列接続した全ての前記半導体スイッチング素子に与えるゲート駆動手段と、並列接続した全ての前記半導体スイッチング素子のオン・オフ状態を、ゲート−エミッタ間電圧の大きさと基準電圧を比較し、前記ゲート−エミッタ間電圧の大きさが基準電圧より大きいときにオン状態と判別し、それ以外の時はオフ状態と判別する比較手段と、ゲートオン信号が並列接続した前記半導体スイッチング素子全てに与えられた時、前記複数の素子が全てオン状態の時は前記比較手段よりフィードバック信号が出力されることで正常と判別し、前記複数の素子のうち少なくとも1つがオン状態でない時にはフィードバック信号が出力されないことで故障と判別する第1の故障判別手段とを備えたことを特徴とするものである。 A failure detection device for a chopper circuit according to claim 1 of the present invention is a chopper circuit that is connected to a main circuit of a power conversion device and is configured by connecting a plurality of semiconductor switching elements in parallel. Gate control means for generating a gate signal for controlling off, gate drive means for supplying all the semiconductor switching elements connected in parallel to the gate signal, and on / off states of all the semiconductor switching elements connected in parallel, A comparison means for comparing the magnitude of the gate-emitter voltage with a reference voltage, determining that the gate-emitter voltage is larger than the reference voltage, and determining the on-state; otherwise, determining the off-state. When a gate-on signal is given to all the semiconductor switching elements connected in parallel, the plurality of elements are all turned on. In the case of the first failure determination means, it is determined as normal by outputting a feedback signal from the comparison means, and a failure is determined by not outputting a feedback signal when at least one of the plurality of elements is not in an ON state. It is characterized by comprising.
本発明の請求項2記載のチョッパ回路の故障検出装置は、請求項1の発明において、更に主回路に複数の並列接続した半導体スイッチング素子のコレクタ−エミッタ間電圧を検出する電圧検出手段を設け、ゲートオフ信号が並列接続した前記半導体スイッチング素子全てに与えられた時、前記複数の素子が全てオフ状態の時は前記電圧検出回路に電位差が発生することで正常と判別し、前記複数の素子のうち少なくとも1つがオフ状態でない時には前記電圧検出回路の電位差がゼロもしくはこれに近い値を示すことで故障と判別する第2の故障判別手段とを備えたことを特徴とするものである。 According to a second aspect of the present invention, there is provided the chopper circuit failure detection device according to the first aspect, further comprising voltage detection means for detecting a collector-emitter voltage of a plurality of semiconductor switching elements connected in parallel to the main circuit, When a gate-off signal is applied to all the semiconductor switching elements connected in parallel, when all of the plurality of elements are in an off state, it is determined that a potential difference occurs in the voltage detection circuit, and the normal state is determined. When at least one of the voltage detection circuits is not in an OFF state, the voltage detection circuit includes a second failure determination means for determining a failure by indicating a potential difference of zero or a value close thereto.
本発明の請求項3記載のチョッパ回路の故障検出装置は、請求項1または2において、半導体スイッチング素子がIGBT素子またはGTO素子で形成されていることを特徴とするものである。 A failure detection device for a chopper circuit according to claim 3 of the present invention is characterized in that, in claim 1 or 2, the semiconductor switching element is formed of an IGBT element or a GTO element.
本発明に係る請求項1記載のチョッパ回路の故障検出装置によれば、直列リアクトルに蓄積された直流電流のエネルギーを保持するモードにおいて、並列構成の半導体スイッチング素子にオンゲート信号を与えた場合、1つのゲート駆動回路で駆動する並列素子のうち少なくとも1つの素子に故障が発生した時に、そのフィードバック信号を比較して素子の故障を検出し、適切な保護動作を行うことによって、並列素子間の電流バランスが崩れて故障素子あるいは他の健全な素子に過大な電流が流れてなだれ的に故障が発生し、被害が拡大するのを防止できる。 According to the chopper circuit failure detection apparatus of the first aspect of the present invention, when an on-gate signal is applied to the semiconductor switching elements having a parallel configuration in the mode in which the energy of the direct current accumulated in the series reactor is maintained, When a failure occurs in at least one of the parallel devices driven by one gate drive circuit, the feedback signal is compared to detect the failure of the device and perform an appropriate protection operation, thereby providing a current between the parallel devices. It is possible to prevent the damage from spreading due to an avalanche failure caused by an excessive current flowing through the failure element or other healthy elements due to an imbalance.
また請求項2記載のチョッパ回路の故障検出装置によれば、直列リアクトルに蓄積された直流電流のエネルギーを負荷に出力するモードにおいて、並列構成の半導体スイッチング素子にオフゲート信号を与えた場合、1つのゲート駆動回路で駆動する並列素子のうち少なくとも1つの素子に故障が発生した時に、該半導体スイッチング素子のコレクタ−エミッタ間と並列に接続された電圧検出回路の電圧値を監視して素子の故障を検出し、適切な保護動作を行うことによって、故障素子に過大な電流が流れて開放故障あるいは破損し、被害が拡大するのを防止できる。 According to the failure detection device for a chopper circuit according to claim 2, when an off-gate signal is given to a semiconductor switching element having a parallel configuration in a mode in which the energy of the DC current accumulated in the series reactor is output to the load, When a failure occurs in at least one of the parallel elements driven by the gate drive circuit, the failure of the element is monitored by monitoring the voltage value of the voltage detection circuit connected in parallel with the collector-emitter of the semiconductor switching element. By detecting and performing an appropriate protection operation, it is possible to prevent an excessive current from flowing through the failure element to cause an open failure or breakage, thereby preventing damage from spreading.
また請求項3記載のチョッパ回路の故障検出装置によれば、半導体スイッチング素子がIGBT素子またはGTO素子で形成されているので、信頼性を向上させることができる。 According to the chopper circuit failure detection apparatus of the third aspect, since the semiconductor switching element is formed of the IGBT element or the GTO element, the reliability can be improved.
以下本発明の実施の一形態を、図1を参照して詳細に説明する。図1は半導体スイッチング素子にIGBT素子を用い、直流電圧源に直列リアクトルを接続したチョッパ構成である。 Hereinafter, an embodiment of the present invention will be described in detail with reference to FIG. FIG. 1 shows a chopper configuration in which an IGBT element is used as a semiconductor switching element and a series reactor is connected to a DC voltage source.
図1において、1は直流電源、2は直列リアクトル、3はチョッパ回路、4はチョッパ回路3の直流出力端子間に接続された直流コンデンサ、5はチョッパ回路3の直流出力端子間に接続された直流負荷、8は直列リアクトル2と直流負荷5との間に接続されたダイオード、11〜14は直列リアクトル2に直流電流のエネルギーを蓄積するモードでは閉路スイッチとして動作し、その直列リアクトル2に蓄積された直流電流のエネルギーを出力するモードではチョッパとして動作する並列接続した半導体スイッチング素子のIGBT素子で、この素子11〜14と前記ダイオード8でチョッパ回路3が構成されている。 In FIG. 1, 1 is a DC power source, 2 is a series reactor, 3 is a chopper circuit, 4 is a DC capacitor connected between DC output terminals of the chopper circuit 3, and 5 is connected between DC output terminals of the chopper circuit 3. A DC load, 8 is a diode connected between the series reactor 2 and the DC load 5, and 11 to 14 operate as a closed switch in a mode in which the energy of the DC current is stored in the series reactor 2, and is stored in the series reactor 2. In the mode for outputting the energy of the direct current, the IGBT 11 is a semiconductor switching element connected in parallel and operates as a chopper. The elements 11 to 14 and the diode 8 constitute the chopper circuit 3.
前記IGBT素子11〜14のコレクタ−エミッタ間と並列に電圧検出回路15が接続され、更にここに第2の故障判別部18が接続されている。またIGBT素子11〜14にゲート信号を与えるゲート制御手段となるゲート制御部20と、ゲート駆動手段となるゲート駆動回路30が設けられている。 A voltage detection circuit 15 is connected in parallel with the collector-emitter of the IGBT elements 11 to 14, and a second failure determination unit 18 is further connected thereto. Further, a gate control unit 20 serving as a gate control unit that applies a gate signal to the IGBT elements 11 to 14 and a gate drive circuit 30 serving as a gate drive unit are provided.
前記ゲート制御部20は、ゲート信号生成回路25と、これに接続された発光器21と、前記ゲート信号生成回路25からのゲート信号とゲート駆動回路30からの信号を受ける受光器22との間に第1の故障判別部26が設けられている。 The gate controller 20 includes a gate signal generation circuit 25, a light emitter 21 connected thereto, and a light receiver 22 that receives a gate signal from the gate signal generation circuit 25 and a signal from the gate drive circuit 30. The first failure determination unit 26 is provided.
また前記ゲート制御部20の発光器21と、ゲート駆動回路30の受光器31との間、およびゲート駆動回路30の発光器32とゲート制御部20の受光器22との間には、信号伝達の電気的な絶縁のため光伝送ケーブル23、24で接続されている。 Further, signal transmission is performed between the light emitter 21 of the gate controller 20 and the light receiver 31 of the gate drive circuit 30 and between the light emitter 32 of the gate drive circuit 30 and the light receiver 22 of the gate controller 20. Are connected by optical transmission cables 23 and 24.
また前記ゲート駆動回路30は、受光器31にゲートパルス増幅回路33が接続され、これはゲート抵抗34〜37を介して、ゲート駆動信号出力端子GおよびEに接続されている。ここから出力されたゲート駆動信号は電気ケーブル51〜54を介してチョッパ回路3のIGBT素子11〜14のゲート端子Gおよびエミッタ端子Eに接続されている。 The gate drive circuit 30 is connected to a light receiver 31 with a gate pulse amplifier circuit 33, which is connected to gate drive signal output terminals G and E via gate resistors 34-37. The gate drive signal output from here is connected to the gate terminal G and the emitter terminal E of the IGBT elements 11 to 14 of the chopper circuit 3 through electric cables 51 to 54.
またゲート駆動回路30には比較回路45が設けられ、この比較回路45にはしきい値電圧設定値42と、ゲート信号出力端子G−Eとの間に比較器38〜41が接続されている。この比較器38〜41は、ゲート信号出力端子G−E間電圧と、しきい値電圧とを比較してG−E間電圧が高い場合は“1”を出力し、低い場合は“0”を出力するようになっている。更にこの比較器38〜41は、ANDゲート43を介して前記発光器32に接続されている。 Further, the gate drive circuit 30 is provided with a comparison circuit 45, and comparators 38 to 41 are connected between the threshold voltage set value 42 and the gate signal output terminal GE. . The comparators 38 to 41 compare the voltage between the gate signal output terminals GE and the threshold voltage, and output “1” when the voltage between GE is high, and “0” when low. Is output. Further, the comparators 38 to 41 are connected to the light emitter 32 through an AND gate 43.
次に上記構成のチョッパ回路の故障検出装置の動作について説明する。図1におけるループ16は、直列リアクトル2に蓄積された直流電流のエネルギーを保持するモードにおける電流経路を示しており、並列構成のIGBT素子11〜14がオン状態である時には並列素子間で電流が均等にバランスされているものとする。 Next, the operation of the chopper circuit failure detection apparatus configured as described above will be described. A loop 16 in FIG. 1 shows a current path in a mode in which the energy of the direct current accumulated in the series reactor 2 is held. When the parallel-configured IGBT elements 11 to 14 are in the ON state, a current is passed between the parallel elements. It shall be evenly balanced.
ゲート制御部20では、ゲート信号生成回路25でオンゲート信号が生成され、これが発光器21で光信号に変換されて発光し、光伝送ケーブル23を介してゲート駆動回路30の受光器31で再び電気信号に変換される。この信号はゲートパルス増幅回路33により増幅され、ゲート信号出力端子G−Eからチョッパ回路3の各IGBT素子11〜14へ同時にオンゲート電圧が印加される。 In the gate control unit 20, an on-gate signal is generated by the gate signal generation circuit 25, and this is converted into an optical signal by the light emitter 21 to emit light, and is again electrically transmitted by the light receiver 31 of the gate drive circuit 30 through the optical transmission cable 23. Converted to a signal. This signal is amplified by the gate pulse amplifier circuit 33, and an on-gate voltage is simultaneously applied from the gate signal output terminal GE to each IGBT element 11-14 of the chopper circuit 3.
この時、ゲート駆動回路30のゲート信号出力端子G−E間には、IGBT素子11〜14をオンするために必要なしきい値電圧以上のオンゲート電圧が加えられているが、比較器38〜41でG−E間電圧としきい値電圧設定値42からのしきい値電圧とを比較してG−E間電圧が高い場合は、各比較器38〜41はそれぞれ“1”を出力し、これらはANDゲート43に送られ、ANDゲート43からは出力は“1”が出力されて、発光器32を発光させる。この光信号は、光伝送ケーブル24を介してゲート制御部20の受光器22に送られて、ここで電気信号に変換され、フィードバック信号として受信する。 At this time, an on-gate voltage higher than the threshold voltage required to turn on the IGBT elements 11 to 14 is applied between the gate signal output terminals GE of the gate drive circuit 30, but the comparators 38 to 41. When the GE voltage is compared with the threshold voltage from the threshold voltage setting value 42 and the GE voltage is high, each of the comparators 38 to 41 outputs "1". Is sent to the AND gate 43, and the output from the AND gate 43 is “1”, causing the light emitter 32 to emit light. This optical signal is sent to the light receiver 22 of the gate controller 20 via the optical transmission cable 24, where it is converted into an electrical signal and received as a feedback signal.
その結果、ゲート制御部20の第1の故障判別部26では、オンゲート指令信号を与えた結果として各IGBT素子11〜14がオン状態であるフィードバック信号を受信することになり、この状態を正常と判別する。 As a result, the first failure determination unit 26 of the gate control unit 20 receives a feedback signal indicating that each of the IGBT elements 11 to 14 is on as a result of giving the on-gate command signal. Determine.
通常IGBT素子11〜14のゲート−エミッタ間は正常状態の場合、高インピーダンス状態を維持しているが、短絡故障等の故障が発生した状態で、並列素子の各IGBT素子11〜14へ同時にオンゲート指令を与えた場合、ゲート−エミッタ間は短絡あるいは数オーム程度までインピーダンスが低下し、ゲート抵抗34〜37による電圧降下が大きくなり、正常のオンゲート電圧を印加することができなくなる。 Normally, a high impedance state is maintained between the gate and emitter of the IGBT elements 11 to 14 in a normal state, but on-gate to each IGBT element 11 to 14 of the parallel element at the same time in a state where a short circuit failure or the like has occurred. When the command is given, the impedance between the gate and the emitter is short-circuited or lowered to about several ohms, the voltage drop due to the gate resistors 34 to 37 becomes large, and a normal on-gate voltage cannot be applied.
このような故障状態がIGBT素子11〜14のうち少なくとも1つで発生した場合は、ゲート駆動信号出力端子G−E間電圧がしきい値電圧設定値42に比べて低くなるため、該比較器38〜41の少なくとも1つは“0”を出力し、ANDゲート43からは“0”が出力される。 When such a failure state occurs in at least one of the IGBT elements 11 to 14, the voltage between the gate drive signal output terminals GE becomes lower than the threshold voltage setting value 42. At least one of 38 to 41 outputs “0”, and the AND gate 43 outputs “0”.
その結果、ゲート制御部20の第1の故障判別部26では、オンゲート信号を与えたにも関わらずIGBT素子11〜14の何れか少なくとも1つがオン状態でない出力信号“0”を受信し、IGBT素子11〜14の何れか少なくとも1つが故障と判別することができる。このように故障と判別された場合、全てのIGBT素子11〜14にオフ信号を出して、チョッパ回路を停止させ、直列リアクトル2に蓄積されたエネルギーを抵抗で消費させるなどの適切な保護動作を行う。 As a result, the first failure determination unit 26 of the gate control unit 20 receives the output signal “0” in which at least one of the IGBT elements 11 to 14 is not in the on state even though the on gate signal is given. At least one of the elements 11 to 14 can be determined as a failure. When it is determined that a failure has occurred in this way, an appropriate OFF signal is output to all the IGBT elements 11 to 14 to stop the chopper circuit and perform an appropriate protective operation such as consuming the energy accumulated in the series reactor 2 with a resistor. Do.
このように、直列リアクトル2に蓄積された直流電流のエネルギーを保持するモードにおいて、並列構成のIGBT素子11〜14にオンゲート信号を与えた場合、1つのゲート駆動回路で駆動する並列素子のうち少なくとも1つの素子に故障が発生した時に、そのフィードバック信号を比較して素子の故障を検出し、適切な保護動作を行うことによって、並列素子間の電流バランスが崩れて故障素子あるいは他の健全な素子に過大な電流が流れて、なだれ的に故障が発生し被害が拡大することを防止できる。 As described above, when an on-gate signal is given to the IGBT elements 11 to 14 in parallel configuration in the mode in which the energy of the direct current accumulated in the series reactor 2 is held, at least of the parallel elements driven by one gate driving circuit. When a failure occurs in one element, the feedback signal is compared to detect the failure of the element, and by performing an appropriate protection operation, the current balance between the parallel elements is disrupted and the failed element or other healthy element It is possible to prevent an excessive current from flowing through the avalanche and causing an avalanche to cause damage.
また図1におけるループ17は、直列リアクトル2に蓄積された直流電流のエネルギーを負荷に出力するモードにおける電流経路を示しており、並列構成のIGBT素子11〜14はオンとオフを繰り返すチョッパとして動作するものである。 Further, a loop 17 in FIG. 1 shows a current path in a mode in which the energy of the direct current accumulated in the series reactor 2 is output to the load, and the IGBT elements 11 to 14 configured in parallel operate as a chopper that repeatedly turns on and off. To do.
ゲート制御部20のゲート信号生成回路25でオンゲート信号またはオフゲート信号が生成され、これが発光器21で光信号に変換されて発光し、光伝送ケーブル23を介してゲート駆動回路30の受光器31で再び電気信号に変換される。この信号はゲートパルス増幅回路33により増幅され、ゲート信号出力端子G−Eからチョッパ回路3の各IGBT素子11〜14へ同時にオンゲート電圧またはオフゲート電圧が印加される。 The gate signal generation circuit 25 of the gate control unit 20 generates an on-gate signal or an off-gate signal, which is converted into an optical signal by the light emitter 21 and emits light, and is received by the light receiver 31 of the gate drive circuit 30 via the optical transmission cable 23. It is converted again into an electrical signal. This signal is amplified by the gate pulse amplifier circuit 33, and an on-gate voltage or an off-gate voltage is simultaneously applied from the gate signal output terminal GE to each IGBT element 11-14 of the chopper circuit 3.
IGBT素子11〜14はオン状態とオフ状態を繰り返すが、IGBT素子11〜14にオフゲート信号を与えた場合に、このコレクタ−エミッタ間と並列に接続した電圧検出回路15で、ゲート制御部20よりオフゲート指令を与えたにも関わらず該電圧検出回路15の電圧値がゼロあるいはこれに近い値を示すならば、該IGBT素子のうち少なくとも1つの素子が短絡故障を発生している状態であり、これを第2の故障判別部18でオフ状態にならない故障と判別して、適切な保護動作を行う。 The IGBT elements 11 to 14 are repeatedly turned on and off. When an off-gate signal is given to the IGBT elements 11 to 14, the voltage detection circuit 15 connected in parallel with the collector-emitter is connected by the gate control unit 20. If the voltage value of the voltage detection circuit 15 indicates zero or a value close to this even though an off-gate command is given, at least one of the IGBT elements is in a short-circuit fault state, The second failure determination unit 18 determines this as a failure that does not enter the off state, and performs an appropriate protection operation.
このように、直列リアクトル2に蓄積された直流電流のエネルギーを負荷に出力するモードにおいて、並列構成のIGBT素子11〜14にオフゲート信号を与えた場合、1つのゲート駆動回路で駆動する並列素子のうち少なくとも1つの素子に故障が発生した時に、該IGBT素子11〜14のコレクタ−エミッタ間と並列に接続された電圧検出回路15の電圧値を監視して、素子の故障を検出し、適切な保護動作を行うことによって、故障素子に過大な電流が流れて開放故障あるいは破損に至る恐れを防止して、被害の拡大を防止することができる。 Thus, in the mode in which the energy of the DC current accumulated in the series reactor 2 is output to the load, when an off-gate signal is given to the IGBT elements 11 to 14 in parallel configuration, the parallel element driven by one gate drive circuit When a failure occurs in at least one of the elements, the voltage value of the voltage detection circuit 15 connected in parallel with the collector-emitter of the IGBT elements 11 to 14 is monitored to detect the failure of the element. By performing the protective operation, it is possible to prevent an excessive current from flowing through the failure element, leading to an open failure or breakage, thereby preventing the spread of damage.
1 直流電源
2 直列リアクトル
3 チョッパ回路
4 直流コンデンサ
5 直流負荷
8 ダイオード
11〜14 IGBT素子
15 電圧検出回路
16 電流経路を示すループ
17 電流経路を示すループ
18 第2の故障判別部
20 ゲート制御部
21 発光器
22 受光器
23 光伝送ケーブル
24 光伝送ケーブル
25 ゲート信号生成回路
26 第1の故障判別部
30 ゲート駆動回路
31 受光器
32 発光器
33 ゲートパルス増幅回路
34〜37 ゲート抵抗
38〜41 比較器
42 しきい値電圧設定値
43 ANDゲート
45 比較回路
51〜54 電気ケーブル
1 DC power supply
2 series reactor
3 Chopper circuit
4 DC capacitor
5 DC load
8 Diode
11-14 IGBT element
15 Voltage detection circuit
16 Loop showing current path
17 Loop showing current path
18 Second failure determination unit
20 Gate controller
21 Light emitter
22 Receiver
23 Optical transmission cable
24 Optical transmission cable
25 Gate signal generation circuit
26 First failure determination unit
30 Gate drive circuit
31 Receiver
32 Light emitter
33 Gate pulse amplifier
34-37 Gate resistance
38-41 comparator
42 Threshold voltage setting value
43 AND Gate
45 Comparison circuit
51-54 Electric cable
Claims (3)
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| JP2007168745A JP5268294B2 (en) | 2007-06-27 | 2007-06-27 | Fault detection device for chopper circuit |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2007168745A JP5268294B2 (en) | 2007-06-27 | 2007-06-27 | Fault detection device for chopper circuit |
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| JP2009011043A true JP2009011043A (en) | 2009-01-15 |
| JP5268294B2 JP5268294B2 (en) | 2013-08-21 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012204301A (en) * | 2011-03-28 | 2012-10-22 | Funai Electric Co Ltd | Lighting control circuit and display device |
| CN107181396A (en) * | 2017-05-05 | 2017-09-19 | 北京精密机电控制设备研究所 | A kind of paralleling MOS Guan Junliu and short-circuit protection circuit |
| US10840903B2 (en) | 2018-09-14 | 2020-11-17 | Kabushiki Kaisha Toshiba | Semiconductor module |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104673A (en) * | 1996-06-13 | 1998-01-06 | Mitsubishi Electric Corp | Power converter |
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Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH104673A (en) * | 1996-06-13 | 1998-01-06 | Mitsubishi Electric Corp | Power converter |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012204301A (en) * | 2011-03-28 | 2012-10-22 | Funai Electric Co Ltd | Lighting control circuit and display device |
| CN107181396A (en) * | 2017-05-05 | 2017-09-19 | 北京精密机电控制设备研究所 | A kind of paralleling MOS Guan Junliu and short-circuit protection circuit |
| US10840903B2 (en) | 2018-09-14 | 2020-11-17 | Kabushiki Kaisha Toshiba | Semiconductor module |
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| JP5268294B2 (en) | 2013-08-21 |
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