JP2008210648A - Organic electroluminescent display device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a technology advantageous for enhancing effects of preventing deterioration of an organic EL element, in case drying members are arranged in recesses fitted to one of the main faces of a sealing substrate. <P>SOLUTION: The organic EL display device is provided with a support substrate SUB, an organic EL element supported to one of the main faces of the support substrate SUB, a sealing substrate CS facing the organic EL element with a plurality of recesses RC communicated with each other through grooves TC provided at the main face facing the organic EL element, and forming a hollow body together with the support substrate SUB, and a plurality of drying members DS each containing a desiccant and arranged in each recess RC. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to an organic electroluminescence (EL) display device.

  An organic EL element deteriorates rapidly when exposed to an atmosphere containing moisture. Therefore, in the organic EL display device, the organic EL element is sealed in order to prevent the organic EL element from being exposed to an atmosphere containing moisture.

  Sealing substrates are widely used for sealing organic EL elements. In this sealing technique, an airtight hollow body is formed by the support substrate supporting the organic EL element and the sealing substrate, and the space in the hollow body is filled with, for example, a dry gas. Since the organic EL element in the hollow body does not come into contact with the outside air, it is difficult to cause deterioration due to exposure to an atmosphere containing moisture.

  However, the dry gas may contain a slight amount of moisture. In addition, it is inevitable that external moisture enters the hollow body. Therefore, in the sealing technique using a sealing substrate, the moisture in the hollow body is usually removed with a desiccant.

  Incidentally, the organic EL display device is required to be lightweight. Therefore, in order to achieve sufficient mechanical strength and light weight, a plurality of recesses may be provided on the inner surface of the sealing substrate.

  In these recesses, a drying member containing a desiccant can be disposed. If the drying member is disposed in the recess, the thickness of the display panel does not increase due to the use of the desiccant. Moreover, since a large amount of desiccant can be used, it is considered that deterioration of the organic EL element can be prevented over a long period of time. However, the inventors of the present invention have found that when the drying member is disposed in the recess, the effect of preventing the deterioration of the organic EL element is not so large as expected when the present invention is made.

  An object of the present invention is to provide a technique advantageous for increasing the effect of preventing deterioration of an organic EL element when a drying member is disposed in a recess provided on one main surface of a sealing substrate. It is in.

  According to the first aspect of the present invention, a support substrate, an organic EL element supported on one main surface of the support substrate, and a plurality of recesses facing the organic EL element and communicating with each other through a groove A sealing substrate which is provided on a main surface facing the EL element and forms a hollow body together with the support substrate; and a plurality of drying members each containing a desiccant and disposed in the plurality of recesses, respectively. An organic EL display device characterized by the above is provided.

  According to the second aspect of the present invention, a support substrate, an organic EL element supported on one main surface of the support substrate, a main surface facing the organic EL element, and a plurality of recesses facing the organic EL element A sealing substrate formed in a hollow body together with the support substrate, a plurality of drying members each containing a desiccant and disposed in each of the plurality of recesses, and the main surface of the sealing substrate And an organic EL display device comprising a porous cushioning material supported at a position between the plurality of recesses.

  ADVANTAGE OF THE INVENTION According to this invention, when a drying member is arrange | positioned in the recessed part provided in the one main surface of the sealing substrate, the technique advantageous for making the effect which prevents deterioration of an organic EL element larger is provided.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. In addition, in each figure, the same referential mark is attached | subjected to the same or similar component, and the overlapping description is abbreviate | omitted.

  FIG. 1 is a plan view schematically showing an organic EL display device according to the first embodiment of the present invention. FIG. 2 is a plan view schematically showing a display panel included in the organic EL display device shown in FIG. 3 is a cross-sectional view taken along line III-III of the display panel shown in FIG. FIG. 4 is a cross-sectional view schematically showing an array substrate included in the display panel of FIGS. 2 and 3. FIG. 5 is a perspective view schematically showing a sealing substrate included in the display panel of FIGS. 2 and 3.

  The display device shown in FIG. 1 is a bottom emission organic EL display device that employs an active matrix drive method. This organic EL display device includes a display panel DP, a video signal line driver XDR, and a scanning signal line driver YDR.

  As shown in FIGS. 1 to 3, the display panel DP includes an array substrate AS and a sealing substrate CS. As shown in FIG. 3, the array substrate AS and the sealing substrate CS face each other and form a hollow body. Specifically, the central portion of the sealing substrate CS is separated from the array substrate AS. The peripheral edge of the sealing substrate CS is attached to one main surface of the array substrate AS via a frame-shaped sealing layer (not shown). As the material of the sealing layer, for example, frit glass and an adhesive can be used.

  As shown in FIGS. 1, 3, and 4, the array substrate AS includes an insulating substrate SUB. The insulating substrate SUB is, for example, a light transmissive substrate such as a glass substrate.

On the substrate SUB, as shown in FIG. 4, for example, a SiN _x layer and a SiO _x layer are sequentially stacked as the undercoat layer UC.

  On the undercoat layer UC, a plurality of semiconductor layers SC, for example, polysilicon layers are arranged. A source and a drain are formed in each semiconductor layer SC.

  The undercoat layer UC and the semiconductor layer SC are covered with the gate insulating film GI. The gate insulating film GI can be formed using, for example, TEOS (tetraethyl orthosilicate).

  On the gate insulating film GI, the gates G are arranged. The gate G is made of, for example, MoW.

  The semiconductor layer SC, the gate insulating film GI, and the gate G form a top gate type thin film transistor. In this embodiment, these thin film transistors are p-channel thin film transistors and are used as the drive transistor DR and the switches SWa to SWc included in the pixel PX in FIG.

  On the gate insulating film GI, the lower electrode of the capacitor C shown in FIG. 1 and the scanning signal lines SL1 and SL2 are further arranged. These can be formed in the same process as the gate G.

  As shown in FIG. 1, each of the scanning signal lines SL1 and SL2 extends along the row of the pixels PX, that is, in the X direction, and is arranged in the Y direction along the column direction of the pixels PX. These scanning signal lines SL1 and SL2 are connected to the scanning signal line driver YDR. The Z direction is a direction orthogonal to the X direction and the Y direction.

The gate insulating film GI, the gate G, the scanning signal lines SL1 and SL2, and the lower electrode of the capacitor C are covered with an interlayer insulating film II shown in FIG. The interlayer insulating film II is, for example, a SiO _x film formed by a plasma CVD method or the like. A part of the interlayer insulating film II is used as a dielectric layer of the capacitor C.

  On the interlayer insulating film II, the upper electrode of the capacitor C shown in the drawing, the source electrode SE and the drain electrode DE shown in FIG. 4, and the video signal line DL and the power supply line PSL shown in FIG. 1 are arranged. These can be formed in the same process and have, for example, a three-layer structure of Mo / Al / Mo.

  As shown in FIG. 4, the source electrode SE and the drain electrode DE are electrically connected to the source and drain of the thin film transistor through contact holes provided in the interlayer insulating film II.

As shown in FIG. 1, each video signal line DL extends in the Y direction and is arranged in the X direction. These video signal lines DL are connected to a video signal line driver XDR.
In the present embodiment, each of the power supply lines PSL extends in the Y direction and is arranged in the X direction.

The source electrode SE, the drain electrode DE, the video signal line DL, the power supply line PSL, and the upper electrode of the capacitor C are covered with a passivation film PS shown in FIG. The passivation film PS is made of, for example, SiN _x .

  On the passivation film PS, first electrodes PE which are pixel electrodes are arranged. In this aspect, each first electrode PE is a light-transmissive front electrode. Each first electrode is connected to the drain electrode DE through a through hole provided in the passivation film PS, and the drain electrode DE is connected to the drain of the switch SWa.

  The first electrode PE is an anode in this embodiment. As a material of the first electrode PE, for example, a transparent conductive oxide such as ITO (indium tin oxide) can be used.

  A partition insulating layer PI shown in FIG. 2 is further formed on the passivation film PS. In the partition insulating layer PI, through holes are provided at positions corresponding to the first electrodes PE, or slits are provided at positions corresponding to columns or rows formed by the first electrodes PE. Here, as an example, the partition insulating layer PI is provided with a through hole at a position corresponding to the first electrode PE.

  The partition insulating layer PI is, for example, an organic insulating layer. The partition insulating layer PI can be formed using, for example, a photolithography technique.

  On the first electrode PE, active layers ACT each including a light emitting layer are arranged. The light emitting layer is, for example, a thin film containing a luminescent organic compound whose emission color is red, green, or blue. In addition to the light emitting layer, the active layer ACT can further include a hole injection layer, a hole transport layer, a hole blocking layer, an electron transport layer, an electron injection layer, and the like.

  The partition insulating layer PI and the active layer ACT are covered with a second electrode CE that is a counter electrode. The second electrode CE is a common electrode shared by all the pixels PX. In this embodiment, the second electrode CE is a light-reflective cathode that is a back electrode. The second electrode CE is, for example, an electrode wiring (not shown) formed on the same layer as the video signal line DL is formed through a contact hole provided in the passivation film PS and the partition insulating layer PI. )). Each organic EL element OLED includes a first electrode PE, an active layer ACT, and a second electrode CE.

  Each pixel PX includes an organic EL element OLED and a pixel circuit. In this embodiment, the pixel circuit includes a drive transistor DR, an output control switch SWa, a selection switch SWb, a diode connection switch SWc, and a capacitor C, as shown in FIG. As described above, in this embodiment, the drive transistor DR and the switches SWa to SWc are p-channel thin film transistors. The switches SWa to SWc constitute a switch group. Further, the pixel PX constitutes the pixel group PXG in FIG.

  As shown in FIG. 1, the drive transistor DR, the output control switch SWa, and the organic EL element OLED are connected in series in this order between the first power supply terminal ND1 and the second power supply terminal ND2. In this aspect, the first power supply terminal ND1 is a high potential power supply terminal, and the second power supply terminal ND2 is a low potential power supply terminal.

  The gate of the output control switch SWa is connected to the scanning signal line SL1. The selection switch SWb is connected between the video signal line DL and the drain of the driving transistor DR, and the gate thereof is connected to the scanning signal line SL2. The diode connection switch SWc is connected between the drain and gate of the drive transistor DR, and the gate is connected to the scanning signal line SL3. The selection switch SWb and the diode connection switch SWc are switched between a first state in which the drain and gate of the driving transistor DR and the video signal line DL are connected to each other and a second state in which they are disconnected from each other. It constitutes a group of possible switches.

  The capacitor C is connected between the constant potential terminal ND1 'and the gate of the driving transistor DR. The constant potential terminal ND1 'is connected to the first power supply terminal ND1, for example.

The sealing substrate CS is, for example, a glass substrate. As shown in FIGS. 2, 3, and 5, the sealing substrate CS includes a flat plate portion FP, an edge portion RM, and a reinforcing rib portion RR.
The flat plate portion FP faces the array substrate AS.

  The edge portion RM has a frame shape and is supported by a main surface facing the array substrate AS of the flat plate portion FP. Typically, the edge RM is positioned at or near the peripheral edge of the main surface of the flat plate portion FP. The edge RM is affixed to one main surface of the array substrate AS via the above-described seal layer. The edge portion RM separates the flat plate portion FP and the reinforcing rib portion RR from the array substrate AS. For example, the edge portion RM may be omitted when the flat plate portion FP and the array substrate AS are attached via a sufficiently thick seal layer.

  The reinforcing rib portion RR has a lattice shape or a net shape, and is supported by the main surface facing the array substrate AS of the flat plate portion FP. The reinforcing rib RR is separated from the array substrate AS.

  The reinforcing rib portion RR has a plurality of recesses RC on the surface of the sealing substrate CS facing the array substrate AS. The main surface of the flat plate portion FP constitutes the bottom surface of these recesses RC. Further, the reinforcing rib RR and the edge portion RM constitute the side wall of the concave portion RC.

  The reinforcement rib RR is provided with a plurality of grooves TC. Adjacent recesses RC communicate with each other via one or more grooves TC. The depth of the groove TC may be equal to the height of the reinforcing rib RR. Alternatively, the groove TC may be shallower than the height of the reinforcing rib RR. When the groove TC is deep, gas movement between the recesses RC is more likely to occur than when the groove TC is shallow. When the groove TC is shallow, it is easy to realize high mechanical strength as compared with the case where the groove TC is deep.

  A drying member DS is disposed in each of the recesses RC. In this embodiment, the drying member DS is a sheet containing a desiccant and is attached to the sealing substrate CS via an adhesive. The drying member DS may not be a sheet. For example, a layer made of a granular desiccant may be formed in the recess RC, and these layers may be fixed in the recess RC.

  As the desiccant, a physical adsorption desiccant and a chemical adsorption desiccant can be used alone or in combination. As the physical adsorption desiccant, for example, silica gel, zeolite, and a mixture thereof can be used. As the chemisorption desiccant, for example, barium oxide, phosphorus pentoxide, calcium chloride, and a mixture thereof can be used.

  The array substrate AS, the sealing substrate CS, and the seal layer form an airtight hollow body. The internal space of the hollow body is filled with an inert gas such as nitrogen gas or a rare gas, and has a lower pressure than the external space.

  The video signal line driver XDR and the scanning signal line driver YDR are arranged on the main surface of the array substrate AS on the sealing substrate CS side and exposed from the sealing substrate CS. That is, the video signal line driver XDR and the scanning signal line driver YDR are mounted on COG (chip on glass). The video signal line driver XDR and the scanning signal line driver YDR may be mounted by TCP (tape carrier package) instead of COG mounting.

This organic EL display device is manufactured, for example, by the following method.
First, the array substrate AS and the sealing substrate CS are prepared. Next, the array substrate AS and the sealing substrate CS are bonded to each other through a seal layer in an inert gas atmosphere lower than the atmospheric pressure to obtain the display panel DP. Further, the video signal line driver XDR and the scanning signal line driver YDR are mounted on the display panel DP to obtain an organic EL display device.

This organic EL display device is driven by the following method, for example.
When displaying an image on this organic EL display device, for example, the pixel PX is selected for each row. A writing operation is performed on the selected pixel PX, and a display operation is performed on the non-selected pixel PX.

  Specifically, a writing operation to a certain pixel PX is performed by applying a scanning signal (ON) for closing the switches SWb and SWc from the scanning signal line driver YDR to the scanning signal line SL2 to which the pixel PX is connected. Start by outputting as Note that the switch SWa included in the pixel PX is kept open.

  In this state, the video signal line driver XDR outputs the video signal as a current signal to the video signal line DL to which the previous pixel PX is connected, and the gate-source voltage of the driving transistor DR corresponds to the previous video signal. Set the size to Thereafter, a scanning signal (OFF) for opening the switches SWb and SWc is output as a voltage signal from the scanning signal line driver YDR to the scanning signal line SL2 to which the pixel PX is connected. Thereby, the writing operation is completed.

  The display operation in the previous pixel PX is started by outputting a scanning signal (ON) for closing the switch SWa as a voltage signal to the scanning signal line SL1 to which the pixel PX is connected. While the switch SWa is closed, a drive current having a magnitude corresponding to the gate-source voltage of the drive transistor DR flows through the organic EL element OLED. The organic EL element OLED emits light with a luminance corresponding to the magnitude of the drive current. The display operation ends when a scanning signal (OFF) for opening the switch SWa is output as a voltage signal to the scanning signal line SL1 to which the previous pixel PX is connected.

  In this organic EL display device, as described above, the groove TC is provided in the reinforcing rib portion RR. Therefore, in this organic EL display device, gas movement between the recesses RC is likely to occur as compared with an organic EL display device in which the groove TC is not provided in the reinforcing rib portion RR.

  In the organic EL display device in which the movement of gas between the recesses RC is difficult to occur, for example, when moisture enters the internal space of the hollow body from the external space, in the region near the seal layer in the internal space, Concentration increases locally. Therefore, in the organic EL display device in which the groove TC is not provided in the reinforcing rib portion RR, the organic EL element OLED in the vicinity of the seal layer is easily deteriorated.

  On the other hand, in the organic EL display device in which the groove TC is provided in the reinforcing rib portion RR, when moisture enters the internal space of the hollow body from the external space, the water quickly diffuses throughout the previous internal space. For this reason, this organic EL display device causes deterioration of the organic EL element OLED due to exposure to an atmosphere containing moisture as compared with an organic EL display device in which the groove TC is not provided in the reinforcing rib portion RR. hard.

  Further, when the groove TC is not provided in the reinforcing rib portion RR, the reinforcing rib portion RR may hinder the exhaust from the region between the array substrate AS and the sealing substrate CS at the time of bonding. If the gas does not escape sufficiently from the region between the array substrate AS and the sealing substrate CS, the pressure difference between the external space and the internal space of the hollow body becomes insufficient, and as a result, the sealing strength becomes insufficient. There is.

  When the groove TC is provided in the reinforcing rib portion RR, the exhaust from the region between the array substrate AS and the sealing substrate CS is facilitated. Therefore, it is possible to prevent the pressure difference between the external space and the internal space of the hollow body from becoming insufficient, and thus it is possible to prevent the seal strength from becoming insufficient.

Next, the second aspect of the present invention will be described.
FIG. 6 is a cross-sectional view schematically showing a display panel of the organic EL display device according to the second aspect of the present invention. In the display panel DP, the porous cushioning material PC is disposed on the drying member DS. The organic EL display device according to the second embodiment has the same structure as the organic EL display device according to the first embodiment, except that the porous buffer material PC is disposed on the drying member DS.

  The porous cushioning material PC is a soft material having air permeability such as a soft open-cell foam. As the porous buffer material PC, for example, nylon such as methacrylic acid ester, styrene, nylon 12 can be used.

  The porous buffer material PC is supported by the sealing substrate CS. The porous cushioning material PC can be supported on the sealing substrate CS by, for example, fitting into the recess RC and / or adhering to the sealing substrate CS. The porous cushioning material PC may be bonded to the drying member DS instead of bonding to the sealing substrate CS.

  As described above, the porous cushioning material PC has air permeability. Therefore, the effects described in the first aspect are not significantly impaired due to the arrangement of the porous cushioning material PC. That is, also in this aspect, substantially the same effect as described in the first aspect can be obtained.

  The porous cushioning material PC protrudes from the recess RC. That is, the distance from the porous cushioning material PC to the array substrate AS is shorter than the distance from the reinforcing rib portion RR to the array substrate AS. Therefore, when the sealing substrate CS and / or the array substrate AS bends, for example, the porous buffer material PC contacts the array substrate AS before the reinforcing rib portion RR contacts the array substrate AS. Alternatively, when the sealing substrate CS and / or the array substrate AS is bent, the porous cushioning material PC is in contact with the array substrate AS, but the reinforcing rib portion RR is not in contact with the array substrate AS.

  When the porous buffer material PC is omitted, when the sealing substrate CS and / or the array substrate AS is bent, the array substrate AS receives a strong impact due to the reinforcing rib portion RR coming into contact with the array substrate AS. There is. In this case, for example, the electrode CE of the organic EL element OLED may be damaged.

  The porous cushioning material PC softens this impact. Therefore, the organic EL display device hardly causes damage to the organic EL element OLED.

Next, the third aspect of the present invention will be described.
FIG. 7 is a cross-sectional view schematically showing a display panel of an organic EL display device according to the third aspect of the present invention. In this display panel DP, the groove TC is omitted, and the porous cushioning material PC is attached to the reinforcing rib portion RR. The organic EL display device according to the third aspect has the same structure as the organic EL display device according to the first aspect except that the groove TC is omitted and the porous cushioning material PC is attached to the reinforcing rib portion RR. Have.

  The porous cushioning material PC is a soft material having air permeability such as a soft open-cell foam. As the porous buffer material PC, for example, the material exemplified in the second embodiment can be used.

  The porous cushioning material PC is attached to the surface of the reinforcing rib portion RR facing the array substrate AS. The porous cushioning material PC can be supported by the sealing substrate CS, for example, by adhering to the sealing substrate CS.

  Incidentally, the drying member DS usually has a low thickness uniformity. Further, even if the drying member DS has a uniform thickness, when the sheet-like drying member DS is attached to the sealing substrate CS, irregularities may be generated on the surface of the drying member DS. . Therefore, the distance between the drying member DS and the array substrate AS tends to be uneven. Therefore, the drying member DS tends to contact the array substrate AS when the sealing substrate CS and / or the array substrate AS is bent. When the drying member DS comes into contact with the array substrate AS, for example, the organic EL element OLED may be physically and / or chemically damaged.

  In the display panel DP of FIG. 3, if the recess RC in which the drying member DS is disposed is deepened, the contact between the drying member DS and the array substrate AS is less likely to occur. Further, when the concave portion RC is deepened, it is difficult for gas to move between the concave portions RC. However, in the display panel DP of FIG. 3, since the groove TC is provided in the reinforcing rib portion RR, the gas movement between the concave portions RC is performed. Is prone to occur.

  On the other hand, the display panel DP in FIG. 7 has the porous cushioning material PC attached to the surface of the reinforcing rib portion RR facing the array substrate AS. Compared with the case where it is omitted, the contact between the drying member DS and the array substrate AS is less likely to occur. Further, since the porous cushioning material PC has air permeability, the movement of gas between the recesses RC does not become extremely difficult due to the attachment of the porous cushioning material PC. Therefore, also in this aspect, substantially the same effect as described in the first aspect can be obtained.

  Further, the porous cushioning material PC covers the surface of the reinforcing rib portion RR facing the array substrate AS. Therefore, when the sealing substrate CS and / or the array substrate AS is bent, the porous cushioning material PC is in contact with the array substrate AS, but the reinforcing rib portion RR is not in contact with the array substrate AS. Therefore, the organic EL display device is unlikely to cause damage to the organic EL element OLED, like the organic EL display device according to the second aspect.

  In this organic EL display device, the reinforcing rib portion RR may be provided with the groove TC described in the first aspect. If the groove TC is provided in the reinforcing rib portion RR, gas movement between the concave portions RC is more likely to occur.

  As described above, the organic EL display device adopting the configuration in which the current signal is written to the pixel PX as the video signal has been described. However, other configurations may be adopted for the organic EL display device. For example, the organic EL display device may be configured to write a voltage signal as a video signal to the pixel PX. Further, although the above-described organic EL display device adopts an active matrix driving method, other driving methods such as a passive matrix driving method and a segment driving method can be adopted for the organic EL display device.

1 is a plan view schematically showing an organic EL display device according to a first embodiment of the present invention. FIG. 2 is a plan view schematically showing a display panel included in the organic EL display device shown in FIG. 1. Sectional drawing along the III-III line of the display panel shown in FIG. FIG. 4 is a cross-sectional view schematically showing an array substrate included in the display panel of FIGS. 2 and 3. FIG. 4 is a perspective view schematically showing a sealing substrate included in the display panel of FIGS. 2 and 3. Sectional drawing which shows schematically the display panel of the organic electroluminescence display which concerns on the 2nd aspect of this invention. Sectional drawing which shows schematically the display panel of the organic electroluminescence display which concerns on the 3rd aspect of this invention.

Explanation of symbols

  ACT ... active layer, AS ... array substrate, C ... capacitor, CE ... counter electrode, CS ... sealing substrate, DE ... drain electrode, DL ... video signal line, DP ... display panel, DR ... drive transistor, DS ... drying member FP: flat plate portion, G: gate, GI: gate insulating film, II: interlayer insulating film, ND1 ... power supply terminal, ND1 '... constant potential terminal, ND2 ... power supply terminal, OLED ... organic EL element, PC ... porous buffer Material, PE ... Pixel electrode, PI ... Partition insulating layer, PS ... Passivation film, PSL ... Power supply line, PX ... Pixel, PXG ... Pixel group, RC ... Recess, RM ... Rim, RR ... Reinforcement rib, SC ... Semiconductor Layer, SE ... source electrode, SL1 ... scan signal line, SL2 ... scan signal line, SUB ... insulating substrate, SWa ... output control switch, SWb ... selection switch, SWc ... diode connection switch, T ... groove, UC ... undercoat layer, XDR ... video signal line driver, YDR ... scanning signal line driver.

Claims (3)

A support substrate;
An organic EL element supported on one main surface of the support substrate;
A plurality of recesses facing the organic EL element and communicating with each other through a groove are provided on the main surface facing the organic EL element, and a sealing substrate that forms a hollow body with the support substrate;
An organic EL display device comprising a plurality of drying members each containing a desiccant and disposed in each of the plurality of recesses.   The organic EL display device according to claim 1, further comprising a plurality of porous buffer materials respectively disposed on the plurality of drying members. A support substrate;
An organic EL element supported on one main surface of the support substrate;
Facing the organic EL element, a plurality of recesses are provided on the main surface facing the organic EL element, and a sealing substrate that forms a hollow body with the support substrate;
A plurality of drying members each containing a desiccant and disposed in each of the plurality of recesses;
An organic EL display device comprising a porous cushioning material supported on the main surface of the sealing substrate at a position between the plurality of recesses.

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