JP2008294086A - Work equipment - Google Patents
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- JP2008294086A JP2008294086A JP2007135828A JP2007135828A JP2008294086A JP 2008294086 A JP2008294086 A JP 2008294086A JP 2007135828 A JP2007135828 A JP 2007135828A JP 2007135828 A JP2007135828 A JP 2007135828A JP 2008294086 A JP2008294086 A JP 2008294086A
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Abstract
【課題】基板に付された位置認識マークを確実に認識できるようにした作業装置を提供する。
【解決手段】プリント基板３の位置決めが終了したら、Ｙ軸駆動モータの駆動によりガイドに沿ってビームがＹ方向に移動すると共に、基板認識カメラ１０及び装着ヘッド１１がＸ軸駆動モータの駆動によりビームに沿ってＸ方向に移動して、プリント基板３に付された各位置認識マークＭを基板認識カメラ１０が撮像してプリント基板３の位置認識処理をする。この場合、一対の搬送シュート１５、１６のプリント基板３寄りの部位に、照明装置１９から照射された照明光の反射光が基板認識カメラ１０に戻らないようにするための傾斜面１５Ａ、１６Ａを形成しているので、位置認識マークＭと搬送シュート１５、１６との境界が明確となって、各位置認識マークＭの位置認識が確実に行えることとなる。
【選択図】図２A work device is provided that can reliably recognize a position recognition mark attached to a substrate.
When positioning of the printed circuit board 3 is completed, the beam is moved in the Y direction along the guide by driving the Y-axis drive motor, and the substrate recognition camera 10 and the mounting head 11 are driven by the X-axis drive motor. The board recognition camera 10 images each position recognition mark M attached to the printed circuit board 3 to perform the position recognition processing of the printed circuit board 3. In this case, the inclined surfaces 15A and 16A for preventing the reflected light of the illumination light emitted from the illumination device 19 from returning to the substrate recognition camera 10 are located near the printed circuit board 3 of the pair of conveyance chutes 15 and 16. Since it is formed, the boundary between the position recognition mark M and the transport chutes 15 and 16 becomes clear, and the position recognition of each position recognition mark M can be performed reliably.
[Selection] Figure 2
Description
本発明は、一対の搬送シュートで搬送される基板を位置決め装置で位置決めし、この位置決めされた状態の前記基板に付された位置認識マークを照明装置で照明光を照射してその反射像を基板認識カメラで撮像して、この基板の位置を認識するようにした作業装置に関する。 In the present invention, a substrate conveyed by a pair of conveyance chutes is positioned by a positioning device, and a position recognition mark attached to the substrate in the positioned state is irradiated with illumination light by an illuminating device, and the reflected image is formed on the substrate. The present invention relates to a working apparatus that takes an image with a recognition camera and recognizes the position of the substrate.
この種の作業装置は、例えば特許文献１等で知られているが、特にプリント基板のサイズの縮小化などに伴い、プリント基板に付される位置認識マークが外端部、即ちプリント基板の縁部に近くなってきている。
このため、一対の搬送シュートからの反射光も基板認識カメラに戻るので、ときに位置認識マークと搬送シュートとの境界が曖昧となって、両者が区別できない事態が発生していた。 For this reason, since the reflected light from the pair of transport chutes also returns to the substrate recognition camera, the boundary between the position recognition mark and the transport chute is sometimes ambiguous, and there is a situation in which the two cannot be distinguished.
そこで本発明は、基板に付された位置認識マークを確実に認識できるようにした作業装置を提供することを目的とする。 Therefore, an object of the present invention is to provide a working device that can reliably recognize a position recognition mark attached to a substrate.
このため第１の発明は、一対の搬送シュートで搬送される基板を位置決め装置で位置決めし、この位置決めされた状態の前記基板に付された位置認識マークを照明装置で照明光を照射してその反射像を基板認識カメラで撮像して、この基板の位置を認識するようにした作業装置において、少なくとも前記一対の搬送シュートの前記基板寄りの部位に、前記照明装置から照射された照明光の反射光が前記基板認識カメラに戻らないようにするための傾斜面を形成したことを特徴とする。 For this reason, in the first invention, the substrate transported by the pair of transport chutes is positioned by a positioning device, and the position recognition mark attached to the substrate in the positioned state is irradiated with illumination light by the illumination device. In a working apparatus that captures a reflected image with a substrate recognition camera and recognizes the position of the substrate, reflection of illumination light emitted from the illumination device at least on a portion of the pair of transport chutes near the substrate. An inclined surface for preventing light from returning to the substrate recognition camera is formed.
第２の発明は、第１の作業装置に係る発明において、前記傾斜面の下端レベルを前記基板の上面レベル以下としたことを特徴とする。 According to a second invention, in the invention according to the first working device, a lower end level of the inclined surface is set to be equal to or lower than an upper surface level of the substrate.
第３の発明は、一対の搬送シュートで搬送される基板を位置決め装置で位置決めし、この位置決めされた状態の前記基板に付された位置認識マークを照明装置で照明光を照射してその反射像を基板認識カメラで撮像して、この基板の位置を認識するようにした作業装置において、少なくとも前記一対の搬送シュートの前記基板寄りの部位に、前記照明装置から照射された照明光の反射光の前記基板認識カメラに戻る量を減少させるような色彩を施したことを特徴とする。 According to a third aspect of the present invention, a substrate transported by a pair of transport chutes is positioned by a positioning device, and a position recognition mark attached to the substrate in the positioned state is irradiated with illumination light by an illumination device, and a reflection image thereof In the working device in which the position of the substrate is recognized by at least a portion of the pair of transport chutes near the substrate, the reflected light of the illumination light emitted from the illumination device is captured by the substrate recognition camera. Colors that reduce the amount returned to the substrate recognition camera are provided.
本発明は、基板に付された位置認識マークを確実に認識できるようにした作業装置を提供することができる。 The present invention can provide a working apparatus that can reliably recognize a position recognition mark attached to a substrate.
以下、作業装置として、例えばプリント基板上に接着剤を塗布する接着剤塗布装置やプリント基板上にチップ状電子部品を装着する電子部品装着装置等があるが、この電子部品装着装置の実施形態を図1及び図２に基づき詳述する。１は微小なチップ状電子部品（以下、「チップ部品」あるいは「部品」という。）２が装着されるプリント基板３を搬送する搬送装置で、供給コンベア４、位置決め部５及び排出コンベア６から構成される。前記供給コンベア４は上流側装置より受けたプリント基板３を前記位置決め部５に搬送し、位置決め部５で位置決め機構により位置決め固定された該基板３上にチップ部品２が装着された後、排出コンベア６に搬送される。 Hereinafter, as working devices, for example, there are an adhesive application device for applying an adhesive on a printed circuit board, an electronic component mounting device for mounting a chip-shaped electronic component on the printed circuit board, and the like. This will be described in detail with reference to FIGS. Reference numeral 1 denotes a transport device that transports a printed circuit board 3 on which a minute chip-shaped electronic component (hereinafter referred to as “chip component” or “component”) 2 is mounted, and includes a supply conveyor 4, a positioning unit 5, and a discharge conveyor 6. Is done. The supply conveyor 4 conveys the printed circuit board 3 received from the upstream device to the positioning unit 5, and after the chip component 2 is mounted on the substrate 3 positioned and fixed by the positioning mechanism 5 by the positioning unit 5, the discharge conveyor 4 6 is conveyed.
前記供給コンベア４、位置決め部５及び排出コンベア６は、駆動源と、駆動プーリ及び従動プーリと、両プーリに張架された搬送ベルト４Ａ、５Ａ、６Ａとを備えている。 The supply conveyor 4, the positioning unit 5 and the discharge conveyor 6 include a driving source, a driving pulley and a driven pulley, and conveying belts 4A, 5A, and 6A stretched around both pulleys.
また、Ｘ方向に長いビーム８がＹ軸駆動モータの駆動によりガイド９に沿ってＹ方向に移動可能に、基板認識カメラ１０及び装着ヘッド１１が取り付けられた取付体１２がＸ軸駆動モータの駆動により前記ビーム８に沿って移動可能に構成される。 Further, the attachment body 12 to which the substrate recognition camera 10 and the mounting head 11 are attached is driven by the X-axis drive motor so that the beam 8 which is long in the X direction can be moved in the Y direction along the guide 9 by the drive of the Y-axis drive motor. Is configured to be movable along the beam 8.
そして、供給台上にチップ部品２を吸着取出位置に供給する複数の部品供給ユニットが載置されているので、吸着ノズル１３を有する装着ヘッド１１が所望の部品供給ユニット上に移動して当該部品供給ユニットからチップ部品２を吸着して取出し、前記位置決め部５に支持されたプリント基板３上に装着する構成である。 Since a plurality of component supply units that supply the chip component 2 to the suction extraction position are mounted on the supply table, the mounting head 11 having the suction nozzle 13 moves onto the desired component supply unit and the component. The chip component 2 is sucked and taken out from the supply unit and is mounted on the printed circuit board 3 supported by the positioning unit 5.
前記位置決め部５は、プリント基板３を搬送案内する一対の搬送シュート１５、１６と、昇降して前記搬送シュート１５、１６との相対的遠近関係が変更可能なバックアップベース１７と、このバックアップベース１７上にプリント基板３の下面を吸着する複数の真空吸引孔が開設されてこの基板３を支持するバックアップ体であるバックアップブロック１８とを備えている。なお、本実施形態ではバックアップベース１７を昇降させて一対の搬送シュート１５、１６との相対的遠近関係を変更するが、一対の搬送シュート１５、１６を昇降させて前記バックアップベース１７との相対的遠近関係を変更するようにしてもよい。 The positioning unit 5 includes a pair of conveyance chutes 15 and 16 that convey and guide the printed circuit board 3, a backup base 17 that can be raised and lowered to change a relative perspective relationship with the conveyance chutes 15 and 16, and the backup base 17. A plurality of vacuum suction holes for adsorbing the lower surface of the printed circuit board 3 are provided on the upper side, and a backup block 18 as a backup body for supporting the circuit board 3 is provided. In the present embodiment, the backup base 17 is moved up and down to change the relative perspective relationship with the pair of transport chutes 15 and 16. However, the pair of transport chutes 15 and 16 are moved up and down and relative to the backup base 17. The perspective relationship may be changed.
そして、上昇してプリント基板３の下面を吸着してバックアップブロック１８が支持して位置決めした状態で、前記基板３に付された位置認識マークＭを前記取付体１２下面に固定された照明装置１９で照明光を照射してその反射像をレンズを介して基板認識カメラ１０で撮像して、この基板３の位置を認識する。 Then, in a state where the lower surface of the printed circuit board 3 is lifted and the back-up block 18 supports and positions the illuminating device 19, the position recognition mark M attached to the substrate 3 is fixed to the lower surface of the mounting body 12. Then, the illumination light is irradiated and the reflected image is captured by the substrate recognition camera 10 through the lens, and the position of the substrate 3 is recognized.
この場合、特にプリント基板３のサイズの縮小化などに伴い、プリント基板３の対角位置に付される一対の位置認識マークＭが外端部、即ちプリント基板３の縁部に近くなってきており、一対の搬送シュート１５、１６からの反射光も基板認識カメラ１０に戻るので、ときに位置認識マークＭと搬送シュート１５、１６との境界が曖昧となって、両者が区別できない事態が発生していた。そこで、少なくとも前記一対の搬送シュート１５、１６の前記基板３寄りの部位に、前記照明装置１９から照射された照明光の反射光が前記基板認識カメラ１０に戻らないようにするための傾斜面１５Ａ、１６Ａを形成する。これにより位置認識マークＭの撮像及び認識を確実に行うことができる。 In this case, in particular, as the size of the printed circuit board 3 is reduced, the pair of position recognition marks M attached to the diagonal positions of the printed circuit board 3 comes closer to the outer end, that is, the edge of the printed circuit board 3. Since the reflected light from the pair of transport chutes 15 and 16 also returns to the substrate recognition camera 10, the boundary between the position recognition mark M and the transport chutes 15 and 16 sometimes becomes ambiguous, and there is a situation where the two cannot be distinguished from each other. Was. Therefore, the inclined surface 15A for preventing the reflected light of the illumination light emitted from the illuminating device 19 from returning to the substrate recognition camera 10 at least on the portion of the pair of transport chutes 15 and 16 near the substrate 3. , 16A. Thereby, the imaging and recognition of the position recognition mark M can be performed reliably.
しかも、前記傾斜面１５Ａ、１６Ａはプリント基板３に向けて低くなるように形成され、基板位置決めの際のバックアップブロック１８の上昇状態において、前記傾斜面１５Ａ、１６Ａの下端レベルを前記基板３の上面レベル以下となるように形成する。これにより、搬送シュート１５、１６の影がプリント基板３に現れないようにできるので、位置認識マークＭの撮像及び認識が一層確実に行え、またプリント基板３のコーナー（角部）の認識も可能となる。従って、位置認識マークＭを認識処理する場合のほか、プリント基板３のコーナーを認識処理して、プリント基板３の位置認識する場合にも好適である。 In addition, the inclined surfaces 15A and 16A are formed so as to be lowered toward the printed circuit board 3, and the lower end level of the inclined surfaces 15A and 16A is set to the upper surface of the substrate 3 when the backup block 18 is raised when the substrate is positioned. It is formed to be below the level. As a result, the shadows of the conveyance chutes 15 and 16 can be prevented from appearing on the printed circuit board 3, so that the position recognition mark M can be imaged and recognized more reliably, and the corner (corner) of the printed circuit board 3 can be recognized. It becomes. Therefore, it is suitable not only when the position recognition mark M is recognized but also when the corner of the printed circuit board 3 is recognized and the position of the printed circuit board 3 is recognized.
なお、前記傾斜面１５Ａ、１６Ａをプリント基板３に向けて低くなるように形成したが、プリント基板３に向けて高くなるように形成してもよい。 The inclined surfaces 15A and 16A are formed so as to become lower toward the printed board 3, but may be formed so as to become higher toward the printed board 3.
以上の構成により、以下動作について説明する。先ず、プリント基板３が上流側装置（図示せず）より受継がれて供給コンベア４上に存在すると、供給コンベア上のプリント基板３は位置決め部５へ、また位置決め部５上にあるプリント基板３は排出コンベア６へ搬送される。 The operation will be described below with the above configuration. First, when the printed circuit board 3 is inherited from an upstream device (not shown) and exists on the supply conveyor 4, the printed circuit board 3 on the supply conveyor is directed to the positioning unit 5 and the printed circuit board 3 on the positioning unit 5. Is conveyed to the discharge conveyor 6.
そして、位置決め部５において、プリント基板３の位置決め前の状態では、前記バックアップベース１７及びバックアップブロック１８は下降した状態にあって、プリント基板３が図１の右から左に流れて、供給コンベア４から位置決め部５に搬送されて搬送シュート１５、１６の所定位置に到達すると、今度は搬送ベルト５Ａが逆転して左から右に流れる。 In the positioning unit 5, before the printed circuit board 3 is positioned, the backup base 17 and the backup block 18 are in a lowered state, and the printed circuit board 3 flows from the right to the left in FIG. From the left to the right, the conveying belt 5A is reversed and flows from the left to the right.
このときの右から左に流れる際には下降した状態にあって、左から右に流れる際には上昇した位置規制部材（図示せず）に当接して、プリント基板３は位置規制された状態で停止する。次いで、図示しない駆動源により前記バックアップベース１７を上昇させ、複数の真空吸引孔を介してプリント基板３の下面をバックアップブロック１８が吸着して水平に支持する。このプリント基板３を水平に支持した位置決め状態（図２参照）では、搬送シュート１５、１６の内側面がプリント基板３の外側面に当接し、傾斜面１５Ａ、１６Ａの下端レベルは前記プリント基板３の上面レベル以下、望ましくは僅か低い状態となる。 At this time, the printed circuit board 3 is in a lowered state when flowing from the right to the left and is in contact with a raised position restricting member (not shown) when flowing from the left to the right, and the printed circuit board 3 is in a position-restricted state. Stop at. Next, the backup base 17 is raised by a drive source (not shown), and the lower surface of the printed circuit board 3 is sucked and supported horizontally through the plurality of vacuum suction holes. In the positioning state in which the printed circuit board 3 is horizontally supported (see FIG. 2), the inner surfaces of the conveyance chutes 15 and 16 abut against the outer surface of the printed circuit board 3, and the lower end levels of the inclined surfaces 15A and 16A are the above described printed circuit board 3. It is below the upper surface level, preferably slightly lower.
そして、このプリント基板３の位置決めが終了したら、Ｙ軸駆動モータの駆動によりガイド９に沿ってビーム８がＹ方向に移動すると共に、基板認識カメラ１０及び装着ヘッド１１がＸ軸駆動モータの駆動により前記ビーム８に沿ってＸ方向に移動して、プリント基板３に付された各位置認識マークＭを基板認識カメラ１０が撮像してプリント基板３の位置認識処理をする。 When the positioning of the printed circuit board 3 is completed, the beam 8 moves in the Y direction along the guide 9 by driving the Y-axis drive motor, and the board recognition camera 10 and the mounting head 11 are driven by the X-axis drive motor. The substrate recognition camera 10 moves in the X direction along the beam 8 and images each position recognition mark M attached to the printed circuit board 3 to perform position recognition processing of the printed circuit board 3.
この場合、前記一対の搬送シュート１５、１６のプリント基板３寄りの部位に、照明装置１９から照射された照明光の反射光が前記基板認識カメラ１０に戻らないようにするための傾斜面１５Ａ、１６Ａを形成しているので、位置認識マークＭと搬送シュート１５、１６との境界が明確となって、両者が区別でき、各位置認識マークＭの位置認識が確実に行えることとなる。 In this case, the inclined surfaces 15A for preventing the reflected light of the illumination light emitted from the illumination device 19 from returning to the substrate recognition camera 10 on the portions of the pair of conveyance chutes 15 and 16 near the printed circuit board 3. Since 16A is formed, the boundary between the position recognition mark M and the transport chutes 15 and 16 becomes clear and can be distinguished from each other, so that the position recognition of each position recognition mark M can be performed reliably.
しかも、前記傾斜面１５Ａ、１６Ａはプリント基板３に向けて低くなるように形成され、バックアップブロック１８の上昇状態において、前記傾斜面１５Ａ、１６Ａの下端レベルを前記基板３の上面レベル以下となるように形成しているので、搬送シュート１５、１６の影がプリント基板３に現れないようにできるので、位置認識マークＭの撮像及び認識が確実に行え、また表面が搬送シュート１５、１６より明るいプリント基板３の縁を搬送シュート１５、１６と確実に区別して認識することも可能となるので、位置認識マークＭを認識処理する場合のほか、プリント基板３の縁を認識してコーナー（搬送シュート１５、１６と平行な辺と搬送シュート１５、１６と交わる辺とが直交する角部）を認識処理して、プリント基板３の位置認識する場合にも好適である。 In addition, the inclined surfaces 15A and 16A are formed so as to become lower toward the printed circuit board 3, and the lower end level of the inclined surfaces 15A and 16A is equal to or lower than the upper surface level of the substrate 3 when the backup block 18 is raised. Therefore, the shadows of the transport chutes 15 and 16 can be prevented from appearing on the printed circuit board 3, so that the position recognition mark M can be reliably imaged and recognized, and the surface is brighter than the transport chutes 15 and 16. Since the edge of the substrate 3 can be surely distinguished from the conveyance chutes 15 and 16 and recognized, the edge of the printed circuit board 3 is recognized in addition to the case where the position recognition mark M is recognized. , 16 and the corners where the sides intersecting the conveying chutes 15 and 16 are recognized) to recognize the position of the printed circuit board 3. It is also suitable in the case that.
このプリント基板３の位置認識マークＭの撮像の後、吸着ノズル１３を有する装着ヘッド１１が所望の部品供給ユニット上方に移動して当該部品供給ユニットからチップ部品２を吸着して取出し、部品認識カメラで吸着ノズル１３に吸着保持されたチップ部品２を撮像して認識処理し、プリント基板３及びチップ部品２の両認識処理結果に基づいて位置ズレを補正して、前記位置決め部５に支持されたプリント基板３上の所定位置に各チップ部品２を装着する。 After the imaging of the position recognition mark M on the printed circuit board 3, the mounting head 11 having the suction nozzle 13 moves above the desired component supply unit to suck and take out the chip component 2 from the component supply unit. The chip component 2 sucked and held by the suction nozzle 13 is imaged and recognized, and the positional deviation is corrected based on the recognition processing results of both the printed circuit board 3 and the chip component 2 and is supported by the positioning unit 5. Each chip component 2 is mounted at a predetermined position on the printed circuit board 3.
そして、プリント基板３への全てのチップ部品２の装着を終えると、駆動源により前記バックアップベース１７を下降させ、搬送シュート１５、１６にあるプリント基板３を排出コンベアへ、また供給コンベア上のプリント基板３を位置決め部５へ移動させる。 When all the chip components 2 have been mounted on the printed circuit board 3, the backup base 17 is lowered by the drive source, and the printed circuit board 3 on the transport chutes 15 and 16 is transferred to the discharge conveyor and printed on the supply conveyor. The substrate 3 is moved to the positioning unit 5.
なお、以上の実施形態では、各位置認識マークＭの位置認識が確実に行えるように、照明装置１９から照射された照明光の反射光が前記基板認識カメラ１０に戻らないようにするための傾斜面１５Ａ、１６Ａを形成したが、これに限らず、傾斜面１５Ａ、１６Ａを形成することなく、前記一対の搬送シュート１５、１６のプリント基板３寄りの部位に前記照明装置１９から照射された照明光の反射光の前記基板認識カメラ１０に戻る量を減少させるような、例えば黒色塗装を施してもよいし、傾斜面１５Ａ、１６Ａを形成してこの傾斜面１５Ａ、１６Ａ上に黒色塗装を施してもよく、このようにすることにより、プリント基板３と搬送シュート１５、１６との境界が明確になり、搬送シュート１５、１６とプリント基板３上の位置認識マークＭとを確実に区別でき、この結果、位置認識マークＭの位置認識を確実に行うことができる。 In the above embodiment, the tilt for preventing the reflected light of the illumination light emitted from the illumination device 19 from returning to the substrate recognition camera 10 so that the position recognition of each position recognition mark M can be reliably performed. Although the surfaces 15A and 16A are formed, the present invention is not limited thereto, and the illumination irradiated from the illumination device 19 to the portions of the pair of transport chutes 15 and 16 near the printed circuit board 3 without forming the inclined surfaces 15A and 16A. For example, black coating may be applied to reduce the amount of reflected light returning to the substrate recognition camera 10, or inclined surfaces 15A and 16A are formed and black coating is applied on the inclined surfaces 15A and 16A. By doing so, the boundary between the printed circuit board 3 and the transport chutes 15 and 16 becomes clear, and the position recognition mark on the transport chutes 15 and 16 and the printed circuit board 3 is clear. Preparative can reliably distinguish this result, it is possible to reliably position recognition of the position recognition mark M.
また、前記傾斜面１５Ａ、１６Ａを一対の搬送シュート１５、１６の長手方向の全域に亘って形成したが、扱うプリント基板３の最長サイズに合わせて部分的に形成してもよい。 The inclined surfaces 15A and 16A are formed over the entire length of the pair of conveying chutes 15 and 16, but may be partially formed according to the longest size of the printed circuit board 3 to be handled.
更には、プリント基板３の下面を複数の真空吸引孔を介して真空吸着してバックアップブロック１８が上面で支持して位置決めして位置認識マークＭを基板認識カメラ１０が撮像するようにしたが、これに限らず、種々の位置決めが考えられる。即ち、バックアップブロック１８を使用しても、その上面の全域でプリント基板３を支持することなく、部分的に、即ちバックアップブロック１８の搬送シュート１５、１６寄り或るいはバックアップブロック１８の全域に亘って複数の吸着パッド付きの支持ピンやマグネット付きの支持ピンを設けて、プリント基板３を吸着支持してもよい。 Furthermore, the lower surface of the printed circuit board 3 is vacuum-sucked through a plurality of vacuum suction holes, and the backup block 18 is supported and positioned by the upper surface so that the substrate recognition camera 10 images the position recognition mark M. Not only this but various positioning is considered. That is, even when the backup block 18 is used, the printed circuit board 3 is not supported over the entire upper surface of the backup block 18, that is, over the entire area of the backup block 18, that is, near the conveyance chutes 15 and 16 of the backup block 18. A plurality of support pins with a suction pad and support pins with a magnet may be provided to support the printed circuit board 3 by suction.
また、バックアップブロック１８を設けることなく、バックアップベース１７の搬送シュート１５、１６寄り或るいはバックアップブロック１８の全域に亘って複数の吸着パッド付きの支持ピンやマグネット付きの支持ピンを設けて、プリント基板３を吸着支持してもよい。 Further, without providing the backup block 18, a plurality of support pins with suction pads or support pins with magnets are provided near the conveyance chutes 15 and 16 of the backup base 17 or the entire area of the backup block 18. The substrate 3 may be supported by suction.
以上のように本発明の実施態様について説明したが、上述の説明に基づいて当業者にとって種々の代替例、修正又は変形が可能であり、本発明はその趣旨を逸脱しない範囲で前述の種々の代替例、修正又は変形を包含するものである。 Although the embodiments of the present invention have been described above, various alternatives, modifications, and variations can be made by those skilled in the art based on the above description, and the present invention is not limited to the various embodiments described above without departing from the spirit of the present invention. It encompasses alternatives, modifications or variations.
１ 搬送装置
３ プリント基板
５ 位置決め部
１０ 基板認識カメラ
１５、１６ 搬送シュート
１５Ａ、１６Ａ 傾斜面
１８ バックアップブロック
Ｍ 位置認識マーク
DESCRIPTION OF SYMBOLS 1 Conveyance apparatus 3 Printed circuit board 5 Positioning part 10 Board | substrate recognition camera 15, 16 Conveyance chute 15A, 16A Inclined surface 18 Backup block M Position recognition mark
Claims (3)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2007135828A JP2008294086A (en) | 2007-05-22 | 2007-05-22 | Work equipment |
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| Application Number | Priority Date | Filing Date | Title |
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| JP2007135828A JP2008294086A (en) | 2007-05-22 | 2007-05-22 | Work equipment |
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| Publication Number | Publication Date |
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| JP2008294086A true JP2008294086A (en) | 2008-12-04 |
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| Application Number | Title | Priority Date | Filing Date |
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| JP2007135828A Pending JP2008294086A (en) | 2007-05-22 | 2007-05-22 | Work equipment |
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| US10424555B2 (en) | 2017-06-29 | 2019-09-24 | Nichia Corporation | Mounting component, semiconductor device using same, and manufacturing method thereof |
| JP2022086030A (en) * | 2020-11-30 | 2022-06-09 | パナソニックＩｐマネジメント株式会社 | Component mounting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| US10424555B2 (en) | 2017-06-29 | 2019-09-24 | Nichia Corporation | Mounting component, semiconductor device using same, and manufacturing method thereof |
| JP2022086030A (en) * | 2020-11-30 | 2022-06-09 | パナソニックＩｐマネジメント株式会社 | Component mounting device |
| JP7580054B2 (en) | 2020-11-30 | 2024-11-11 | パナソニックＩｐマネジメント株式会社 | Parts mounting equipment |
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