JP2003289199A - Working system for board - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electronic component mounting system for mounting an electronic component on a printed wiring board, which is capable of mounting the electronic component on the printing board at an optimal mounting height independently of variations in the thickness of the printed wiring board. <P>SOLUTION: The electronic component mounting system 12 is equipped with a distance sensor 252 that is provided above a wiring board holding unit 18 so as to face downward in a vertical direction, the distance sensor 18 detects both the support plane 103 of the wiring board holding unit 18 and the surface 110 of the printed wiring board 60, and a detected value difference between the first detected value obtained by detecting the support plane 103 and the second detected value obtained by detecting the surface 110 can be acquired as the thickness of the printed wiring board 60. The height of the surface 110 is acquired from the thickness of the wiring board 60 and the previously known height of the support plane 103, the wiring board holding unit 18 is corrected for height, and a mounting operation is carried out. Independently of whether the printed wiring board varies in thickness or not, the surface 110 can be accurately set at a proper height, and the electronic component can be brought into contact with the surface 110 of the printed wiring board 60 at a sufficiently decelerated speed at mounting. <P>COPYRIGHT: (C)2004,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a board working system for performing a predetermined work on a circuit board.

[0002]

2. Description of the Related Art In many cases, a work system for a board includes a board holding device for holding a circuit board such as a printed wiring board.
It is configured to include a working device that performs a predetermined work on the circuit board held by the substrate holding device, and a control device that controls the operation of the working device. For example,
In an electric component mounting machine that mounts an electric component (including an electronic component) on a circuit board, a working device includes a mounting head having a component holder, and the mounting head and a substrate holding device that holds the circuit board. And a relative moving device for moving the relative moving device, and the relative moving device is controlled by the control device so that the electric component held by the component holding portion of the mounting head is mounted on the circuit board held by the board holding device. It Usually, the board holding device holds the circuit board substantially horizontally, and the mounting head mounts the electric component on the upper surface of the circuit board.

At this time, since the mounting head and the substrate holding device are caused to make a predetermined relative movement according to a program, when the position of the upper surface of the circuit board is not constant, the mounting operation of the electric components of the mounting head is inappropriate. There is a possibility that For example, when the lower surface of the circuit board is brought into close contact with the upwardly defined surface to position the circuit board in the vertical direction, if the thickness of the circuit board changes, the vertical position of the circuit board upper surface, that is, If the height of the upper surface of the circuit board changes and the electric component mounting operation is performed while ignoring the change, the mounting operation may be inappropriate. For example, even though the mounting head has reached the predetermined position, the electric component does not come into contact with the upper surface of the circuit board or comes into contact with it earlier than planned. It is clear that the former causes electrical component mounting mistakes and increases in mounting position error, but even the latter causes the contact force and contact speed of the electrical components to the circuit board,
It causes damage to electrical parts and increases mounting position error. In addition, even if the thickness of the circuit board is uniform, if there is an upward or downward warp, the height of the mounting point on the upper surface of the circuit board where the electrical components are mounted is not constant, and again the electrical component mounting It will cause mistakes and increase in mounting position error.

Conventionally, the mounting head has a function of absorbing a relative position error with respect to the upper surface of the circuit board, or the board holding device has a structure in which the fluctuation of the position of the upper surface of the circuit board is as small as possible. The efforts have been made to suppress the occurrence of the mounting error and the increase of the mounting position error by suppressing the approach speed between the mounting head and the upper surface of the circuit board to be low. However, in reality, it is difficult to meet the demands by the conventional measures because the demands for the improvement of the electrical component mounting efficiency and the mounting position accuracy are increasing.

The above problem occurs when the height of the upper surface of the circuit board is not constant, but also occurs when the height of the lower surface is not constant. For example, when the circuit board has a relatively large size, is easily bent, or is warped, the lower surface of the circuit board may be supported by a support member such as a support pin. However, if the height of the lower surface of the circuit board is not constant, the height of the upper end of the support member is not appropriate for the height of the lower surface, and the lower surface is not supported or, conversely, the lower surface. This causes inconveniences such as pushing up excessively.

Although the electric component mounting machine has been described above, a plurality of high-viscosity fluid applicators and a plurality of squeegees for ejecting highly viscous fluid such as adhesive or cream solder from the ejection pipe to apply it in spots on the circuit board. Screen printing machine that prints highly viscous fluid by moving it along the screen with through-holes, and inspects the mounting state of electrical components on the circuit board, or the electrical circuit where the electrical components are soldered to the circuit board. A similar problem occurs in an inspection machine or the like for inspecting the electrical characteristics of, and a similar problem also occurs in a work line for a board including a plurality of them. In this specification, the term "to-board working system" means a single to-board working machine,
It is used as a term including both a work line for a board including a plurality of work machines for a board.

[0007]

SUMMARY OF THE INVENTION The present invention has been made in view of the above circumstances, and in the working system for a board, the upper surface of the circuit board caused by a change in the thickness of the circuit board, warpage, or the like, or Even if the position of the lower surface in the vertical direction is not constant, the task is to perform the work on the circuit board without any problem.
INDUSTRIAL APPLICABILITY The present invention provides a working system for a board in each of the following aspects. Similar to the claims, each mode is divided into paragraphs, each paragraph is numbered, and the numbers of other paragraphs are referred to as necessary. This is merely for facilitating the understanding of the present invention, and the technical features and combinations thereof described in the present specification should not be construed as being limited to those described in the following respective sections. . Further, when a plurality of items are described in one section, it is not always necessary to adopt the plurality of items together. It is also possible to select and use only some of the items.

In the following items, (1) corresponds to claim 1, (2) to claim 2, and (3)) to claim 3.
(4) corresponds to claim 4, (5) corresponds to claim 5, (14) corresponds to claim 6, and (16) corresponds to claim 7.

(1) A board holding device for holding a circuit board, a working device for performing a predetermined work on the circuit board held by the board holding device, and a control device for controlling the operation of the working device. A board surface height for obtaining a board surface height which is at least one vertical position of at least one of the upper surface and the lower surface of the circuit board held by the board holding device. An acquisition unit and a substrate surface height reflection unit that reflects the substrate surface height acquired by the substrate surface height acquisition unit in the control of the working device by the control device. Working system. The board surface height of the circuit board held by the board holding device is acquired by the board surface height acquisition unit, and the acquired board surface height is reflected by the control unit of the work device by the board surface height reflection unit. Therefore, even if the substrate surface height is not constant for some reason, the work device appropriately performs the work. The board surface height acquisition unit acquires at least one vertical position of at least one of the upper surface and the lower surface of the circuit board, and the vertical position of either the upper surface or the lower surface is acquired. Whether the vertical position of one point is acquired, the vertical position of a plurality of points is acquired, or the position of the point at which the vertical position is acquired is determined. Where to set it should be determined based on the type of work performed on the circuit board by the work device, the cause of the variation in the board surface height, and the like. Further, the timing of obtaining the substrate surface height by the substrate surface height obtaining unit should be determined based on the type of work, the cause of the variation of the substrate surface height, and the like. For example, when the variation of the board surface height occurs based on the type of the circuit board, the board surface height is acquired before the start of the work on the series of circuit boards, and the variation of the board surface height is When it occurs due to variations in the thickness of the individual circuit boards or warpage of the circuit boards, it is desirable to perform it before or during the work on each circuit board. (2) The working device performs the work on the upper surface of the circuit board held by the board holding device, and the board surface height acquisition unit determines the height of the upper surface of the circuit board. The board-to-board work system according to item (1) to be acquired. Even when the work by the working device is performed on the upper surface of the circuit board, the height of the lower surface of the circuit board can be acquired. For example, when the height of the upper surface changes with the change of the height of the lower surface, the control of the work device by the control device is changed according to the change of the lower surface height. However, in many cases, the control by the control device is easier or more appropriate when the substrate surface height acquisition unit acquires the height of the upper surface itself on which the work is performed. (3) The board-to-board working system according to item (1) or (2), wherein the working device includes a component mounting device that mounts an electrical component on a circuit board held by the substrate holding device. When the work device is a component mounting device, the quality of the component mounting work is particularly susceptible to the variation of the substrate surface height, and thus this aspect is particularly effective. (4) The board working system according to any one of (1) to (3), wherein the board surface height acquisition section includes a board surface height detection section that detects the board surface height. The board surface height acquisition unit corresponds to the board surface height information related to the board surface height from the board surface height storage unit (the information about the board surface height itself and the board surface height in a one-to-one correspondence. It is also possible to use a height-related information reading section for reading information (which can determine the substrate height) or a height-related information receiving section for receiving height-related information supplied from the outside. However, when the board surface height varies from circuit board to circuit board or frequently, it is desirable to provide a board surface height detection unit to detect the board surface height. (5) The substrate holding device includes a height defining surface that is in close contact with either one of the upper surface and the lower surface of the circuit board and defines the height of one of the upper surface and the lower surface. A thickness acquisition unit that acquires the thickness of the circuit board, and a thickness that acquires the other height of the upper surface and the lower surface based on the thickness acquired by the thickness acquisition unit and the height of the specified surface. The board working system according to any one of (1) to (3), including a dependent board surface height acquisition unit. When the specified surface is an upward surface, the thickness-dependent surface height acquisition unit acquires the upper surface height of the circuit board, and when the specified surface is a downward surface, the thickness-dependent surface height acquisition unit acquires the thickness-dependent surface height. The surface height acquisition unit acquires the lower surface height of the circuit board. (6) The working system for a board according to the item (5), wherein the thickness acquisition unit includes a thickness detection unit that detects the thickness of the circuit board. The above description of the substrate surface height detection section also applies to the thickness detection section. (7) The working system for a board according to item (5) or (6), which includes a specified surface height acquisition unit that acquires the height of the specified surface.
The specified surface height acquisition unit may be a specified surface height detection unit that detects the specified surface height, or a specified surface height reading unit that reads out the specified surface height stored in the specified surface height storage unit in advance. can do. The former is suitable when the prescribed surface height often varies, and the latter is suitable when the variation can be ignored.
It is desirable to provide both when the fluctuation of the specified surface height is moderate. The specified surface height read by the specified surface height reading unit is used for control of the work device, and the specified surface height detection unit detects the specified surface height every time a preset condition is satisfied, such as at fixed time intervals. Is detected and the stored contents of the prescribed surface height storage unit are updated. (8) Item (4), wherein the board surface height detection section includes a contact type sensor that contacts the surface of the circuit board on which the board surface height is to be detected and detects the height of the surface. The board-to-board working system described in. (9) The board surface height detection unit includes a non-contact sensor that detects the height of the surface of the circuit board without contacting the surface of the circuit board on which the board surface height is to be detected (4) The board-to-board working system according to item. If you use a non-contact sensor,
It is possible to detect the board surface height while avoiding elastic deformation of the circuit board by the sensor. (10) A relative movement device is included that relatively moves the sensor and the circuit board in at least one of a direction parallel to one of an upper surface and a lower surface of the circuit board and a direction perpendicular to the lower surface (8).
The board-to-board working system according to item (9). By providing the relative movement device, it is possible to widen the types of sensors that can be used to detect the height of the substrate surface and the detectable range in the direction parallel to or perpendicular to the substrate surface. (11) A relative lifting device for moving one of the sensor and the circuit board in a vertical direction perpendicular to one of an upper surface and a lower surface of the circuit board, and the sensor by the relative lifting device. The board-to-board working system according to item (10), further comprising: an ascending / descending position detecting device that detects an ascending / descending position of the circuit board. According to this aspect, as a sensor, for example, a touch sensor (a sensor in which an output signal changes at the moment when the contact portion contacts the detection target surface), the height of the substrate surface is maintained at a constant relative position to the substrate surface. It is possible to use a sensor that detects the height. Further, although it is not necessary that the relative position with respect to the substrate surface is constant, the detectable range can be expanded when the sensor is a non-contact type sensor having a narrow detectable range. (12) The relative movement device includes a relative horizontal movement device that moves at least one of the sensor and the circuit board in a horizontal direction parallel to one of an upper surface and a lower surface of the circuit board. The board-to-board working system according to the item 11). According to this aspect, the substrate surface height detection position by the sensor can be changed. Further, depending on the configuration of the relative horizontal movement device, it is possible to detect the board surface heights of three or more portions of the circuit board, or to detect the board surface heights of arbitrary portions. The relative horizontal moving device moves the sensor to a position corresponding to three or more parts or arbitrary parts of the circuit board. (13) The board-to-board working system according to any one of (8) to (12), which includes a sensor control unit that causes the sensor to detect a plurality of substrate surface heights. By making the sensor detect the board surface height at multiple points, even if there is a warp in the circuit board or there is a partial change in the thickness of the circuit board, those warps and changes in thickness can be detected. Therefore, it is possible to allow the work device to perform the work without any trouble. It is also possible for the sensor to be capable of continuously detecting the board surface height while moving relative to the circuit board in a direction parallel to the upper surface or the lower surface of the circuit board. It is assumed that the substrate surface height of is detectable. (14) The board surface height storage unit stores the board surface height acquisition unit in association with the circuit board type and the board surface height, and the board type acquisition unit acquires information about the circuit board type. And a substrate surface height reading unit that reads out the substrate surface height corresponding to the substrate type acquired by the substrate type reading unit from the substrate surface height storage unit (1) to (13) The board-to-board working system according to any one of the claims. This embodiment is suitable when the thickness of the circuit board varies depending on the type of the circuit board, but the variation in the thickness of each circuit board is small. Even when the circuit board has a warp, the board holding device has a function of correcting the warp, and when the variation in the thickness of each circuit board is small, the board surface height of the present embodiment is reduced. The acquisition unit can be adopted. (15) The board working system according to the item (14), wherein the board type acquisition section includes a code reading section that reads a board code attached to the circuit board. The board type acquisition unit receives the board type information reception from the control computer that controls the board-to-board work system and the host computer that supplies the control computer with the information necessary for the work. It is also possible to use a substrate type information reading unit for reading a unit or information. But,
If a code reading unit for reading the board code is provided, the usability of the work system for a board is improved. For example, even if the order of the circuit boards carried into the board-to-board working system is changed by the operator, the type of the circuit boards can be acquired without any trouble. (16) A board holding device for holding the circuit board, a work device for performing a predetermined work on the circuit board held by the board holding device, and a control device for controlling the operation of the work device. In the board-to-board working system, the board thickness acquisition unit for acquiring the thickness of the circuit board held by the board holding device, and the board thickness acquired by the board thickness acquisition unit are set by the controller by the controller. A board-to-board working system, comprising: a board thickness reflecting section for reflecting the control of the working device. The thickness of the circuit board varies depending on the type of circuit board, but if the variation in the thickness of each circuit board is small, store the board thickness acquisition unit in the board thickness storage unit in association with the type of circuit board. It may be a board thickness related information reading section for reading the board thickness related information or a board thickness related information receiving section for receiving the board thickness related information supplied from the outside. On the other hand, when the variations in the thickness of the individual circuit boards are large, it is desirable that the board thickness acquisition section be a board thickness detection section that detects the actual thickness of the circuit board.

[0010]

BEST MODE FOR CARRYING OUT THE INVENTION Embodiments of the present invention will be described below in detail with reference to the drawings. FIG. 1 shows an electronic component mounting system 12 for mounting an electronic component, which is a type of electric component, on a printed wiring board, which is a type of circuit board. In the figure,
Reference numeral 10 is a base which is a main body of the electronic component mounting system 12. A component supply device 14, a component mounting device 16, and a printed wiring board holding device 18 (hereinafter simply referred to as a wiring board holding device) that is a board holding device are provided on the base 10.

At least one component supply device 14, and in the present embodiment, two component supply tables 30 and 32 are provided.
Is included. Each of these component supply tables 30 and 32 has a feeder support table 34 and a plurality of feeders 36 mounted on the feeder support table 34. Although the feeder 36 is not shown in detail, in the present embodiment, the electronic component 38 (see FIG. 3) is held by a component holding tape to be a taped electronic component. Electronic parts by sending to
8 is positioned one by one in a predetermined component supply unit. The plurality of feeders 36 are detachably mounted on the feeder support table 34 in a state where their component supply units are aligned on a straight line, that is, a horizontal straight line in the illustrated example.

Regarding the entire electronic component mounting system 12,
As will be described later, an XY coordinate plane is set, and movement data of various moving members such as the component supply tables 30 and 32, the wiring board holding device 18, etc. are set on the XY coordinate plane. Each component supply unit of the plurality of feeders 36 is
They are arranged in parallel with each other in the X-axis direction of the Y-coordinate plane (left-right direction in FIG. 1).

A nut 39 is fixed to each feeder support table 34 of the component supply tables 30 and 32, and a ball screw 40, which is a feed screw screwed with the nut 39, is supported by a support table driving motor 42.
By being rotated by, the component supply tables 30 and 32 are guided by the guide device including the guide rails 44 and moved in the X-axis direction, and each component supply unit of the plurality of feeders 36 is selectively moved to the component supply position. Be positioned at. The nut 39, the ball screw 40, the support table driving motor 42, and the like constitute a component supply table moving device 46. Two parts supply table 3
Each of 0 and 32 can be independently moved by the dedicated component supply table moving device 46, and the two component supply table moving devices 46 form the component supplying device moving device 48. The guide rail 44 is shared by the component supply tables 30 and 32. The supply of electronic components by the two component supply tables 30 and 32 is performed by, for example,
It is already known as described in Japanese Examined Patent Publication No. Hei 8-21791, and the description thereof will be omitted. In addition, in FIG. 1, the nut 39 is illustrated in the component supply table 30, and the feeder 36 is not illustrated. The feeder 36 is illustrated in the component supply table 32 and the nut 3 is illustrated.
Illustration of 9 is omitted.

The wiring board holding device 18 includes the printed wiring board 6
0 is held horizontally, and is moved to an arbitrary position on the XY coordinate plane defined by the X axis and the Y axis which are orthogonal to each other by the XY table 64 which is the substrate holding device moving device. The XY table 64 is guided by a guide device including a guide rail 72, and the X-axis slide drive motor 6 is guided.
8 and an X-axis slide 74 which is moved in the X-axis direction by a ball screw 70 as a feed screw, and a Y-axis slide drive motor 76 guided by a guide device including a guide rail 80 on the X-axis slide 74. And a Y-axis slide 82 which is moved in the Y-axis direction by a ball screw 78 as a feed screw.

The Y-axis slide 82 horizontally supports the wiring board holding device 18 from below. The wiring board holding device 18
As shown in FIG. 2, a Z-axis slide 86, which is the main body of the apparatus, and a wiring board supporting device 88 are provided, and the wiring board holding device elevating / lowering device 90 raises and lowers the Y-axis slide 82. The wiring board support device 88 includes a support base 92 and a support base 92.
A support pin 94 serving as a plurality of support members provided on the Z-axis slide 8 by a wiring board support device elevating device 98.
6, the printed wiring board 60 is supported from the back surface side. The support base 92 is provided with a plurality of support pin mounting portions (not shown), and among the support pin mounting portions, the support pin mounting portion corresponding to the supported portion on the back surface of the printed wiring board 60 is a support pin mounting portion. 94 is detachably and positionably attached.

The wiring board holding device elevating / lowering device 90 is constructed by using a Z-axis slide drive motor 91 (see FIG. 5) as a drive source, and the rotation thereof is controlled by a rotation transmission device including a timing pulley 93 and a timing belt 95 so that the Y-axis is driven. Slide 82
Is transmitted to the nut 96 provided on the Z axis slide 86, and is converted into a vertical movement of the Z axis slide 86 by the nut 96 and the screw shaft 97 provided on the Z axis slide 86. Z-axis slide 86
As the wiring board holding device 18 moves up and down, the Z-axis slide 8
Wiring board conveyor 100 provided on 6 has a delivery position for delivering printed wiring board 60 to and from a printed wiring board carry-in conveyor (not shown) and a printed wiring board carry-out conveyor (not shown) and below the delivery position. XY without interfering with the printed wiring board carry-in conveyor and carry-out conveyor
It is moved to an arbitrary position on the coordinate plane and to a work position where the electronic component 38 is mounted on the printed wiring board 60.

The wiring board supporting device elevating / lowering device 98 includes a plurality of air cylinders 50, which are fluid pressure cylinders that are a type of fluid pressure actuator that is a drive source, and a plurality of compression coil springs (hereinafter abbreviated as springs), which is a type of biasing device. 52). When the air chamber of the air cylinder 50 is open to the atmosphere, the lifting table 54 is raised by the urging force of the spring 52, and the support table 92 and the support pin 94 detachably fixed to the lifting table 54 are raised. Air is supplied to the air cylinder 50 and the piston rod 56 is contracted, whereby the elevating table 54 is lowered against the urging force of the spring 52, and the supporting table 9
2 and the support pin 94 are lowered. The ascending end position and the descending end position of the wiring board supporting device 88 are defined by the stroke ends of pistons (not shown) of the air cylinder 50. The ascending end position is a position in which the support pin 94 supports the printed wiring board 60 from below and a clamp member described later clamps the printed wiring board 60.

The wiring board conveyor 100 includes a pair of guide rails 101 and an endless belt 102 which is a winding member provided on each guide rail 101, and the belt 102 is rotated by a belt driving device (not shown). Thus, the printed wiring board 60 is transported. The printed wiring board 60 is provided on each of the pair of guide rails 101.
The positioning surface 104 that defines the position in the width direction by contacting the end surface in the width direction is provided, and the printed wiring board 60 is transported in the state where the position in the width direction is defined by the positioning surface 104. A pair of guide rails 10
One of the 1 is a fixed guide rail provided at a fixed position, and the other is a movable guide rail provided so as to be able to approach and separate from the fixed guide rail.
It is adjusted according to the width of the printed wiring board 60. The movable guide rail is provided so as to straddle the support base 92 in the X-axis direction and in the direction parallel to the transport direction of the printed wiring board 60 (the direction perpendicular to the paper surface in FIG. 2), and the conveyor width is changed. Sometimes it does not interfere with the support base 92. The support base 92 includes a plurality of types of printed wiring boards 60 having different sizes.
Even if the conveyance width of the wiring board conveyor 100 is changed at the time of setup change, the support pin 94 is attached at a position corresponding to the printed wiring board 60.

The printed wiring board 60 carried into the wiring board conveyor 100 from the printed wiring board carry-in conveyor at the delivery position is stopped on the wiring board supporting device 88 by a stop device (not shown), and the wiring board supporting device is moved up and down. Wiring board support device 88 raised by device 98
Is supported from below by the support pins 94 of the pair of guide rails 101, and both edges parallel to the conveying direction are a pair of guide rails 101.
The support surface 103 and the guide rail 1 respectively provided on the
The clamp member 105 is rotatably provided at 01 and is clamped by being sandwiched from both front and back sides. The clamp member 105 is rotated by a clamp member drive device (not shown). The supporting surface 103 and the clamp member 10
The wiring board supporting device 88 and the wiring board supporting device elevating device 98 constitute the wiring board holding device 18.

A plurality of mounting points for mounting the electronic components 38 are preset on the front surface 110 or the upper surface of the printed wiring board 60, and the mounting points are sequentially moved by the movement of the wiring board holding device 18, which will be described later. The mounting device 16 is positioned at the mounting position corresponding to the scheduled component mounting position. In addition, the height of the Z-axis slide 86, that is, the vertical position, is adjusted at the mounted position, and the height of the front surface 110 of the printed wiring board 60 during mounting of electronic components is adjusted.

As shown in FIG. 1, the front surface 110 of the printed wiring board 60 is provided with a plurality of, in the present embodiment, two reference marks 112. As the reference mark 112, various shapes such as a circle, a square, a rectangle, a polygon such as a triangle, an ellipse, and a cross can be adopted, but the reference mark 112 is circular in the present embodiment. These two reference marks 112 are, for example, rectangular printed wiring boards 60.
Of the reference mark camera 11 which is a reference mark imaging device and is provided at each of two corners located on a diagonal line of
4 is imaged. The reference mark camera 114 is fixedly provided on a frame (not shown) of the component mounting device 16.

Although not shown in the drawings, the reference mark camera 114 is a CCD camera having a CCD (charge coupled device), which is a type of solid-state image sensor, and a lens system including an imaging lens, although not shown. In addition, it is a surface image pickup device that is a kind of image pickup device that acquires a two-dimensional image of a subject all at once. To do. The CCD has a large number of minute light receiving elements arranged on one plane, and generates an electric signal according to the light receiving state of each light receiving element. An imaging area or an imaging surface is formed by a large number of light receiving elements, and in the present embodiment, the imaging surface is defined by a horizontal XY coordinate plane. This XY coordinate plane is the same as the XY coordinate plane set for the electronic component mounting system 12.
The directions of the axes, the Y-axis, and the positive and negative directions of each axis are the same. A light source is provided together with the lens system to form an illuminating device, which illuminates a subject and its surroundings during imaging.

The component mounting apparatus 16 of this embodiment is the component mounting apparatus described in Japanese Patent Application Laid-Open No. 6-342998 and has not been published yet.
It is configured similarly to the component mounting apparatus described in the specification of No. 4958, and will be briefly described.

The component mounting device 16 is, as shown in FIG.
An intermittent turntable 128 that intermittently rotates about a vertical axis is provided.
On the intermittent rotary disk 128, a plurality of, 16 in the present embodiment, mounting heads 130 are held at equal angular intervals around the rotation axis of the intermittent rotary disk 128. The mounting head 130 is rotatable by an intermittent rotary disk 128 about a rotation axis parallel to the rotation axis of the intermittent rotary disk.
Further, it is held so as to be movable (movable up and down) in a direction parallel to the rotation axis. The intermittent turntable 128 is intermittently rotated by an angle equal to the angle at which the mounting heads 130 are provided, so that the mounting heads 130 respectively have preset component receiving positions, component imaging positions, component posture correction positions, and component positions. It is sequentially stopped at a stop position such as a mounting position.

The mounting head 130, as shown in FIG.
A rotary holder 186 rotatable about a horizontal axis,
The rotary holder 186 is provided with a plurality of nozzle holders 192 (only one is shown in FIG. 3) in the illustrated example at equal angular intervals around the rotation axis of the rotary holder 186. The suction nozzle 190, which is a component holder, is held. 6 suction nozzles 190 by the rotary holder 186
Are held radially at equal angular intervals (in a state of radially extending from the rotation axis of the rotary holder 186), and the rotary holder 186 is held by a holder selecting device (not shown) provided at the holder selecting position. Is rotated about a horizontal axis so that one of the plurality of nozzle holders 192 is selectively moved and positioned in a vertically downward use position or working position, and the suction nozzle 190 is used. Positioned in the working position.

Each of the 16 mounting heads 130 has
A code that is a kind of name that identifies the mounting head 130 is attached, and each of the six nozzle holding portions 192 is also attached with a code that identifies each nozzle holding portion 192. Further, the nozzle holding unit 192 and the types of the suction nozzles 190 held by the nozzle holding unit 192 are stored in association with each other, and are held in the mounting head 130 based on the above two types of code data and suction nozzle data. Then, the type of the suction nozzle 190 positioned at the use position is specified.

Each of the plurality of suction nozzles 190 sucks and holds the electronic component 38 by negative pressure, and has a suction pipe 200 as shown in FIG.
The tip end surface of the suction tube 200 forms a suction surface 201 and sucks the electronic component 38. The suction nozzle 190 is the nozzle holder 1
A non-rotatable and axially movable member 92 is detachably held. A negative pressure is supplied to the suction nozzle 190 positioned at the use position by a vacuum pump (not shown) which is a kind of negative pressure source, and the electronic component 38 is sucked. Further, the suction nozzle 190 is supplied with a positive pressure by an air pump (not shown) which is a kind of positive pressure source to release the electronic component 38 and communicate with the atmosphere. These switching is mechanically performed by a directional switching valve (not shown) which is a control valve.

Although not shown, the mounting head 130 is moved up and down at the component receiving position and the component mounting position, respectively.
A mounting head elevating device (hereinafter referred to as a head elevating device), which is a mounting head moving device that moves the suction nozzle 190 in the operating position in the axial direction to elevate and lower, is provided.
The head lifting device is not directly related to the present invention, and therefore its illustration and description are omitted.

The electronic component mounting system 12 further includes a printed wiring board 60 as shown in FIGS.
A wiring board thickness detecting device 250 for detecting the thickness of the wiring board is provided. The wiring board thickness detecting device 250 includes a visible light type distance sensor 252 which is a non-contact type distance sensor. Similar to the reference mark camera 114, the distance sensor 252 is fixed to a frame (not shown) vertically downward.

The distance sensor 252 is already known, so a detailed description thereof will be omitted. However, a light emitting portion which emits visible light such as LED light toward an object whose distance is to be detected through an optical system, and its light emitting portion. A bright spot-like image formed on the surface of the object by the emitted visible light is provided with an image pickup unit formed on the image pickup surface (may be a line sensor) through an optical system. The change in the distance between the distance sensor 252 and the object is detected based on the change in the formation position of the object. The wiring board thickness detection device 250 will be described in detail later, but the distance sensor 252 is used.
The thickness of the printed wiring board 60 is detected by detecting the difference between the height of the support surface 103 of the wiring board holding device 18 and the height of the surface 110 of the printed wiring board 60. The distance sensor may be of a laser type that uses laser light as the detection light or an ultrasonic type that uses ultrasonic waves.

FIG. 5 shows a control device 300 for controlling the electronic component mounting system 12. The control device 300 is a CP
The main component is a computer 310 having a U 302, a ROM 304, a RAM 306, and a bus 308 connecting them. An input / output interface 312 is further connected to the bus 308. The support table driving motor 42, the X-axis slide driving motor 68, the input / output interface 312, the driving circuit 316,
A Y-axis slide drive motor 76, a Z-axis slide drive motor 91, etc. are connected. An encoder 320 is connected to each drive motor, so that the rotation amount of each drive motor is input to the control device 300. The input / output interface 312 is further connected with a reference mark camera 114, a distance sensor 252 and the like via a control circuit 318, and a display 322 as a display device, a keyboard 324 as an input device, a signal tower 326 as an alerting device, and the like. The operation panel 328 provided is connected.

The operation of the electronic component mounting system 12 configured as above will be described. A general electronic component mounting operation is described in detail in Japanese Patent Application Laid-Open No. 11-145681 or the like, so that it will be briefly described, and a part particularly related to the present invention will be described in detail.

First, a brief description will be given. When the electronic component mounting system 12 is activated, as shown in FIG. 4A, the printed wiring board 60 is not supported by the wiring board holding device 18, and the wiring board holding device 18 is supported by the XY table 64. The surface 103 is positioned at a distance detection position by the distance sensor 252 (in the present embodiment, directly below the distance sensor 252), and the wiring board holding device elevating device 90 causes the wiring board holding device 18 to have a set height, that is, a standard height. It is positioned at the mounting height when the electronic component 38 is mounted on the printed wiring board 60 having a thickness. In this state, the distance sensor 252 detects the height of the support surface 103, which is the height of the support surface 103, and the RAM 3 of the computer 310 is detected.
It is stored in 06. In the present embodiment, the support surface height is acquired as the distance of the distance sensor 252 in the vertical direction with respect to the object. However, since the distance sensor 252 is a comparative length-measuring device and does not detect the absolute value of the distance, the value of the obtained support surface height itself is not particularly significant, and the thickness of the printed wiring board 60 is not significant. Is obtained to detect the

Next, the printed wiring board 60 is carried in by a carry-in device (not shown), held by the wiring board holding device 18, and the reference mark 112 is picked up and the reference mark is picked up. And a surface height detecting operation for detecting The surface height detecting operation is performed by positioning the printed wiring board 60 at a position where a plurality of predetermined surface height detecting points on the surface 110 face the distance sensor 252, and performing the above-described supporting surface height detecting operation. The same is done (see FIG. 4 (b)). The reference mark imaging operation and the surface height detection operation may be performed in any order. For example, the two reference marks 11
After one of the two is imaged, each surface height detection point is moved directly below the distance sensor 252 in a predetermined order so that the total sum of the movement distances becomes shortest, and then the other reference mark 112 is displayed. It may be imaged.

The parallel position error and the rotational position error of the printed wiring board 60 are detected by the reference mark imaging operation.
The mounting of the electronic component 38 on the printed wiring board 60 is controlled based on these positional errors. When each electronic component 38 is mounted on each mounting point, the mounting point coordinates of the mounting program are corrected, so that the mounting point is directly below the reference point (for example, the center point) of the electronic component 38 held by each suction nozzle 190. It is made to be located. The suction nozzle 19
When there is an error in the holding position of the electronic component due to 0, the mounting head 130 is rotated and the mounting point coordinates of the mounting program are corrected so as to eliminate the error.

On the other hand, the thickness of the printed wiring board 60 is detected as the difference between the height of the support surface 103 detected by the support surface height detection operation and the height of the surface 110 detected by the surface height detection operation. It Based on the detected thickness of the printed wiring board 60, the height of the surface 110 by the wiring board holding device elevating device 90 that holds the printed wiring board 60 is corrected, and the electronic component 38 is mounted by the component mounting device 16. Waiting to be done. That is, in the present embodiment, it is assumed that the height of the support surface 103 does not change and the height of the surface 110 of the printed wiring board 60 changes only due to the change in the thickness of the printed wiring board 60. Then, the height of the surface 110 is corrected by the wiring board holding device elevating / lowering device 90.

The mounting head 130 of the component mounting device 16 is
The electronic component 38 is received from the feeder 36 at the component receiving position. The electronic component 38 is imaged by the imaging device at the component imaging position, the rotational position error is corrected at the component attitude correction position, and the component mounting position is reached. At the component mounting position, the suction nozzle 190 is lowered to mount the electronic component 38 on the printed wiring board 60. When the suction nozzle 190 is made to communicate with the positive pressure source to release the electronic component 38 and the suction nozzle 190 is raised, the electronic component 38 is left on the printed wiring board 60. Since a temporary fixing agent such as cream solder or adhesive is applied near the mounting point of the printed wiring board 60, the electronic component 38 does not move.

The work of detecting the thickness of the printed wiring board 60 will be further described below. In the present embodiment, the surface height detection position is determined by the support surface 10 as shown in FIG.
The heights of 3 are set at a plurality of positions including the position in the horizontal direction where the heights are detected, and the surface height detection points of the distance sensors 2 are set in accordance with a predetermined order.
Positioned just below 52. If the distance in the vertical direction between the surface height detection points and the distance sensor 252 is detected, that and the previously acquired support surface 10 are detected.
3 and the distance in the vertical direction between the distance sensor 252 and the printed wiring board 6 at each surface height detection point.
Obtained as a local thickness that is zero thickness.

When the local thickness is obtained for each of the surface height detection points, the average value of the local thicknesses is obtained as the total thickness of the printed wiring board 60 on which the electronic component 38 is to be mounted this time. Based on this thickness, the vertical relative position between the printed wiring board 60 and the mounting head 130 is corrected. In the present embodiment, the wiring board holding device 18
The vertical relative position is corrected by correcting the height of the printed wiring board 60 by the Z-axis slide 86. In the present embodiment, the printed wiring board 60 is
While the reference mark imaging work and the thickness detection work are performed, the wiring board holding device 18 holds the height at a predetermined setting. The thickness of the printed wiring board 60 is acquired by these operations. Then, the height of the printed wiring board 60 is corrected to the optimum position for the mounting work, and the electronic component mounting work is executed.

The details will be described below with reference to the height correction value acquisition routine shown in FIG. The normal height correction value acquisition routine calculates the correction value of the vertical relative position between the printed wiring board 60 and the mounting head 130 in the control program repeatedly executed by the control device 300 after the electronic component mounting system 12 is activated. Only the part to be acquired is taken out. This height correction value acquisition routine is executed every time the type of the printed wiring board 60 on which the electronic component 38 is mounted changes.

First, it is determined in S1 whether or not the flag F1 is 0. When the program is first executed, the flag F1 is 0. This is because the initial value is set together with other flags and the like in the initial setting executed when the electronic component mounting system 12 is activated. Therefore, the determination in S1 is YES, the wiring board holding device 18 is positioned in S2 such that the surface height of the support surface 103 is detected without supporting the printed wiring board 60, and the support surface 103 is determined in S3. , The vertical distance Z to the distance sensor 252 is detected. The flag F1 is set to 1 in S4, whereby the execution of S1 to S4 is skipped thereafter.

Next, in S5 and S6, it is awaited that the printed wiring board 60 to which the electronic component 38 is to be mounted this time is carried in. When the printed wiring board 60 is loaded and held by the wiring board holding device 18, the determination in S6 is YES.
And the flag F3 is set to 1 in S7, and then S8
At, it is determined whether the flag F2 is 0 or not. Since the flag F2 is 0 here, the determination in S8 is YES.
Then, proceed to S9. Although N surface height detection points are set on the front surface 110 of the printed wiring board 60, it is set so as to be detected as the nth (where n is a natural number of 1 or more and N or less) of them. The wiring board holding device 18 is positioned so that the surface height detection point n faces the distance sensor 252. Proceeding to S10, the height of the surface 110 of the printed wiring board 60 at the surface height detection point n is detected as the distance Xn from the distance sensor 252. Then S
In 11, the value obtained by adding 1 to the number n of the current detection point is set as a new number n, and in S12, it is determined whether or not the number n exceeds the number N of detection points. When the number n is the number N or less, S8 to S1
The execution of 2 is repeated. On the other hand, if the number n becomes larger than the number N, it is determined that detection has been completed for all the surface height detection points, the process proceeds to S13, and the flag F2 is set to 1.

Proceeding to S14, the local thickness tn of the printed wiring board 60 at each surface height detection point is calculated. The local thickness tn is a value obtained by subtracting the distance Xn of the surface height detection point from the distance Z of the support surface 103 from the distance sensor 252. Next, in S15, the average value of the local thickness tn is acquired as the thickness T which is the total thickness of the printed wiring board 60. Proceed to S16, this time printed wiring board 60
Difference ΔT between the thickness T and the standard thickness T0 of the wiring board holding device 18 is calculated, and the value is acquired as the correction amount ΔT of the elevation height of the wiring board holding device 18, and the height of the wiring board holding device 18 should be corrected. Be instructed. Assuming that the height of the supporting surface 103 does not change and the amount of change in the thickness T of the printed wiring board 60 from the standard thickness T0 is the amount of change in the height of the surface 110 of the printed wiring board 60. Surface 11 of printed wiring board 60
Wiring board holding device 18 so that 0 is the normal mounting height
The amount of correction of the height of is determined. After that, S17
At, the values of the flags F1 to F3 and the number n are returned to the initial values, and the one-time execution of this program ends.

As is apparent from the above description, in this embodiment, the thickness detecting device 250 and the control device 30 are used.
In the height correction value acquisition routine of 0, the part that executes S1 to S15 constitutes a “board surface height acquisition part” including the “board surface height detection part”, and the part that executes S2 to S3 is “specified. It constitutes a “specified surface height acquisition section” including a “surface height detection section”. Further, the portion of the control device 300 that executes S16 and the wiring board holding device elevating device 90 that changes the height of the wiring board holding device 18 in accordance with the instruction of S16 constitute a "board surface height reflecting portion", The part that executes S2 to S3 and S8 to S12 constitutes a "sensor control unit".

In this electronic component mounting system 12,
The thickness of the printed wiring board 60 is detected and the mounting head 13
By correcting the relative position in the vertical direction between 0 and the printed wiring board 60, the electronic component 38 is excessively pressed against the printed wiring board 60 when the electronic component 38 is mounted, and the electronic component 38 is printed by the printed wiring. It is possible to avoid releasing the electronic component 38 from the suction nozzle 190 without contacting the plate 60, resulting in defective mounting (misplacement, excessive mounting position error), electronic component 38, and printing. It is possible to favorably avoid damage to the wiring board 60, the suction nozzle 190, and the like. The relative position in the vertical direction between the mounting head 130 and the printed wiring board 60 may be corrected based on the acquired surface height instead of the thickness of the printed wiring board 60.

In the above embodiment, the reference mark 112 and the surface height detection point are set at positions that cannot be detected at the same time, but the reference mark 112 is located directly below the reference mark camera 114. A position facing the distance sensor 252 when the reference mark 112 is imaged may be set as a surface height detection point.

In the above embodiment, the surface heights are detected at a plurality of places, and the average value of the local thicknesses based on the detected heights is obtained as the total thickness of the printed wiring board 60. If it can be considered that the thicknesses of the two are uniform, only one location may be detected. In that case, the time required for the detection work can be reduced.

In the above embodiment, the height of the wiring board holding device 18 is corrected on the assumption that the thickness of the printed wiring board 60 is uniform and the whole is flat. Based on the heights of the surface 110 detected at a plurality of locations, assuming that there is non-uniformity or warpage, the height of each mounting point or area of the surface 110 is estimated by interpolation calculation or the like, and each mounting point is Alternatively, it is also possible to change the height of the wiring board holding device 18 for each mounting point or each area so that the height of each area becomes a regular height. In the above-described embodiment, as described above, the wiring board support device 88 includes the plurality of support pins 94 as a support member, and supports the printed wiring board 60 from the back surface side so as not to bend downward due to its own weight or the like. , The component mounting work was performed well. On the other hand, when the printed wiring board 60 is warped upward, depending on the wiring board supporting device 88, it is difficult to flatten the printed wiring board. Therefore, as described above, the distance sensor 252 detects the heights of a plurality of detection points on the front surface 110, and the height of the wiring board holding device 18 is corrected based on the detection results, so that the mounting head is attached at each mounting point. If the vertical relative position between 130 and the front surface 110 of the printed wiring board 60 is kept constant, the mounting work of the electronic component 38 can be performed properly even when the printed wiring board 60 is warped upward. It can be done. In addition, when the printed wiring board 60 is warped downward, instead of supporting it from the back surface side and flattening it, the front surface 11
Of course, it is also possible to detect and correct the heights of a plurality of zero surface height detection points.

Further, in the above embodiment, the distance sensor 252 is a non-contact type sensor, but it may be a contact type sensor. Specifically, as shown in FIG. 7, an electric micrometer. 350 or the like can be used. Since the electric micrometer 350 is already well known, detailed description thereof will be omitted. However, the electric micrometer 350 includes a detector 352 movable with respect to the sensor main body 354.
Is a displacement sensor that detects the mechanical displacement of the sensor main body 354 by converting it into an electric signal using a differential transformer or the like. Although a lever-shaped detector 352 is shown in the drawing, the detector may be of a plunger type or other forms.

When using the electric micrometer 350 as the contact type distance sensor as described above, the sensor body 35 is used.
4 is attached to the frame so that it can be raised and lowered by an elevator device (not shown). Support surface 103 and printed wiring board 60
When the height of the surface 110 is not detected, it is made to stand by at an ascending end position that does not interfere with the horizontal movement of the printed wiring board 60, and when the height is detected,
It is lowered by the lifting device and is positioned at the lower end position which is the detection position. When brought into contact with the support surface 103 or the surface 110 of the printed wiring board 60, the mechanical displacement of the detector 352 with respect to the sensor main body 354 in that state is converted into an electric signal and detected to obtain the height.

Further, the contact type distance sensor may be in another mode. Specifically, as shown in FIG. 8, a contact-type sensor 360 that is provided so as to be able to move up and down by a lifting device (not shown) and that detects whether or not an object is touched, and a linear counter 362 (which operates in conjunction with the lifting device). (Which is a type of lifting position detecting device). The linear counter 362 detects the vertical position of the contact sensor 360 with respect to a predetermined reference height.
3 (see FIG. 8A) or the printed wiring board 60 (see FIG. 8).
If it is detected that an object such as the surface 110 in (b) is contacted, the height of the contact sensor 360 in that state is measured by the linear counter 362, and the thickness of the printed wiring board 60 is acquired. Of.

Further, in the above embodiment, the electric machine micrometer 350 is provided only above the printed wiring board 60, and the correction is performed mainly based on the height of the surface 110 of the printed wiring board 60. The correction may be performed based on the heights of both the front surface 110 and the lower surface that is the back surface of wiring board 60. Specifically, as shown in FIG. 9, an electric micrometer 372, which is a distance sensor on the back surface side 370, is arranged on the support base 92 of the wiring board holding device 18, and the printed wiring board 60 is arranged from below the printed wiring board 60. The height of the back surface 370 is detected. In this case, it is desirable to provide a plurality of electric micrometers 372, and it is particularly desirable to provide three or more electric micrometers.

In this mode, when the printed wiring board 60 is carried in, the wiring board supporting device 88 is raised by the wiring board supporting device elevating device 98 to support the printed wiring board 60 from the back surface 370 side by the support pins 94. The printed wiring board 60 in the supporting position and in that state
The distance between the rear surface 370 and the electric micrometer 372 is detected. After that, the wiring board holding device 18 detects the position where the surface 110 is detected by the electric machine micrometer 350 provided above the printed wiring board 60 by the XY table 64 (in the present embodiment, the electric micrometer 350 and the electric micrometer 372 are The position of the printed wiring board 60 is obtained by detecting the distance between the electric micrometer 350 and the surface 110 of the printed wiring board 60 in that state. Since the inter-sensor distance, which is the distance between the electric micrometer 350 and each electric micrometer 372, is acquired in advance, the surface 110 is calculated from the inter-sensor distance.
The value obtained by subtracting the height of the printed wiring board 60 from the height of the back surface 370 is acquired as the local thickness of the printed wiring board 60.

For example, the printed wiring board 60 is deformed or partially different in thickness from the printed wiring board 60.
The height of the back surface 370 may not be constant. In such a case, by detecting the height of the back surface using the wiring board thickness detection device of this aspect, it is possible to cope with the case where the height of the back surface is different. For example, the support pin can be changed to a suitable height.

Next, another embodiment will be described with reference to FIGS. In each of the above-described embodiments, the mounting head 130 is rotated about the vertical axis by the rotation of the intermittent turntable 128. It is moved to an arbitrary position on the XY coordinate plane defined by the Y axis. This type of electrical component mounting system is already known, for example, in Japanese Patent No. 2824378, and will be briefly described. Regarding elements common to the constituent elements in the above-mentioned embodiment,
Description is omitted by using common reference numerals.

In FIG. 10, reference numeral 400 is a base as a system body of the electronic component mounting system 402. On the base 400, a wiring board conveyor 404 that conveys the printed wiring board 60, which is a type of circuit board, in the X-axis direction (left and right direction in FIG. 10), a wiring board holding device 406 that positions and supports the printed wiring board 60, Printed wiring board 60
A component mounting device 408 for mounting the electronic component 38 (see FIG. 12) and component supply devices 410, 412 for supplying the electronic component 38 to the component mounting device 408 are provided.

Electronic component mounting system 402 of the present embodiment
An XY coordinate plane is set for the whole, and movement data of various moving members such as the mounting head of the component mounting apparatus 408 is set on this XY coordinate plane.

In this embodiment, the printed wiring board 60 is used.
Is conveyed in a horizontal posture by the wiring board conveyor 404 and stopped at a predetermined work position by a stop device (not shown).
It is held by a wiring board supporting device 416 (see FIG. 14) which is a substrate holding device provided in a portion corresponding to the work position of. In the present embodiment, the printed wiring board 60 has a surface 1 that is an upper surface to be mounted on which electronic components are mounted.
10 is supported in a horizontal posture.

The wiring board conveyor 404 is provided with a pair of guide rails 420 and 422 as schematically shown in FIG. The conveyor belt 424, which is an endless winding body, is wound around each of the pair of guide rails 420 and 422.
24, and a pair of these conveyor belts 424
However, the printed wiring board 60 is transported by being synchronously rotated by the belt drive device 428 using the wiring board transport motor 426 as a drive source. The printed wiring board 60 is conveyed while being positioned in the width direction by the positioning surfaces 421 and 423 provided on the pair of guide rails 420 and 422, respectively.

The wiring board supporting device 416 includes a supporting base 440 and a plurality of supporting pins 44, as schematically shown in FIG.
2, the elevating table 444 is moved up and down by the elevating table driving device 446 to contact and support the back surface 370 of the printed wiring board 60. Lift platform drive 446
In the present embodiment, the air cylinder 450, which is a type of fluid pressure cylinder that is a fluid pressure actuator, is used as a drive source, and constitutes a wiring board holding device lifting device. The printed wiring board 60 includes guide rails 420, 4
It is clamped by being sandwiched from both upper and lower sides by an upward supporting surface 452 provided on 22 and a clamp member 454 rotatably provided.

As shown in FIGS. 10 and 11, the component supply devices 410 and 412 are fixed in position on both sides of the wiring board conveyor 404, separated from each other in the Y-axis direction orthogonal to the X-axis direction in the XY coordinate plane. And it is provided stationary. In the illustrated example, the component supply device 410 is a feeder-type component supply device, and the component supply device 412 is a tray-type component supply device.

The feeder type component supply device 410 has a component supply table 464 in which a large number of feeders 460 are arranged on a feeder support table 462 and the respective component supplies are arranged in a line, for example, in a direction parallel to the X-axis direction. Similar to the feeder 36, each feeder 460 holds an electronic component on a component holding tape and supplies it as a taped electronic component.

The tray type component supply device 412 accommodates and supplies the electronic component 38 in the component tray 466 (see FIG. 10). One component tray 466 is supported in each of a number of component tray storage boxes 468 (see FIG. 11) arranged in the vertical direction. These parts tray storage boxes 46
8 are respectively supported by supporting members (not shown) and are sequentially raised to the component supply position by an elevating device provided in the column 470. Above the component supply position, a mounting head described later takes out the electronic component 38. It is necessary to secure space for it. Therefore, the component tray storage box 468 which has finished supplying the electronic components 38 is
At the same time as the next component tray storage box 468 is raised to the component supply position, it is also raised by the above-mentioned space and retracted to the upper retreat area. In this way, the component mounting device 408 is mounted one by one from the component tray 466 in the component tray storage box 468 having a space formed above.
Take out. The tray-type component supply device 412 has the same structure as the component supply device disclosed in Japanese Patent Publication No. 2-57719, and a description thereof will be omitted.

The component mounting apparatus 408 conveys the electronic component 38 by linearly moving the mounting head 490 shown in FIG. Or top surface 1
It is supposed to be attached to 10. Therefore, as shown in FIG. 10, Y of the wiring board conveyor 412 of the base 400 is
Ball screws 494 are X on both sides in the axial direction.
The X-axis slide 49 is provided parallel to the axial direction.
6 is screwed into each of the nuts 498 (only one is shown in FIG. 12) provided in FIG. 6, and these ball screws 494 are respectively rotated by the X-axis slide drive motor 500, so that X Axis slide 496
Is moved to an arbitrary position in the direction parallel to the X axis.

As shown in FIG. 10, the X-axis slide 496 has a length extending from the feeder type component supplying device 410 to the tray type component supplying device 412 beyond the wiring board conveyor 404. A guide rail 502 (see FIG. 12), which is a guide member, is provided below the two ball screws 494 on the base 400. 502 is slidably fitted and guided for movement. Above, nut 498, ball screw 494 and X
The shaft slide driving motor 500 and the like constitute an X-axis slide moving device 506.

On the X-axis slide 496, the ball screw 5
10 (see FIG. 12) is provided in parallel with the Y-axis direction, and the Y-axis slide 512 is screwed into the nut 514. This ball screw 510 is driven by a Y-axis slide drive motor 516 (see FIG. 10) to generate gears 518, 52.
When rotated through 0, the Y-axis slide 5
12 is guided by a pair of guide rails 522, which are guide members, and is moved to an arbitrary position parallel to the Y-axis direction. As described above, the nut 514, the ball screw 510, the Y-axis slide driving motor 516, and the like are the Y-axis slide moving device 524.
And an X-axis robot 526 together with the X-axis slide 496, the X-axis slide moving device 506, and the Y-axis slide 512. The mounting head 490 is moved by the XY robot 526 to an arbitrary position in the horizontal plane and the XY coordinate plane.

Support portion 5 provided on Y-axis slide 512
As shown in FIGS. 12 and 13, a mounting head 490, a head elevating device 534 that is a head axial moving device that elevates and lowers the mounting head 490, and a mounting head 490.
A head rotating device 536 for rotating the shaft around the axis is provided, and these mounting heads 490 and the like constitute a component mounting unit 538. In this embodiment, one set of the component mounting unit 538 is provided,
Multiple sets may be provided. For example, a plurality of component mounting units 538 can be arranged on the Y-axis slide 512 in parallel in the Y-axis direction in a line.

The component mounting unit 538 of this embodiment is
It is configured similarly to the component mounting unit described in Japanese Patent No. 3093339, and will be briefly described. Support part 53
13, a shaft 540 is provided so as to be movable in a direction parallel to the Z-axis direction and rotatable about the axis, and a holder 542 provided at the lower end of the shaft 540 has a suction nozzle as a component holder. 544 is detachably held. It can be considered that the holder 542 constitutes a component holding portion for holding an electronic component via the suction nozzle 544, or that the holder 542 and the suction nozzle 544 jointly constitute a component holding portion. . Also, the component holder together with the shaft 540 is attached to the mounting head 49.
Configures 0. The Z-axis direction is a direction orthogonal to the X-axis and Y-axis directions, and is the vertical direction in this embodiment.

The head lifting device 534 is used for the lifting motor 5
50 as a drive source, and the rotation of the lifting motor 550 causes the gear 5 to rotate.
The rotation transmission device including 52 and 554 transmits to the nut 556, and the nut 556 is rotated,
The shaft 540 screwed into the nut 556 is moved up and down, and the mounting head 490 is moved up and down. Head rotating device 53
6, a rotation motor 560 (see FIG. 16) is used as a drive source, and its rotation is transmitted to the shaft 540 by a rotation transmission device including a gear 562 and a spline member (not shown).
The shaft 540 is rotated about the axis, and the mounting head 4
90 is rotated.

The suction nozzle 544 sucks the electronic component 38 by negative pressure and mounts it on the printed wiring board 60. Therefore, the adsorption nozzle 544 is connected to a negative pressure source, a positive pressure source, and the atmosphere (not shown), and the adsorption pipe 570 causes the negative pressure source
The suction pipe 57 is selectively connected to the positive pressure source and the atmosphere.
The electronic component 38 is adsorbed and released on the adsorption surface 572 which is the lower end surface of 0.

A reference mark camera 580 (see FIGS. 10 and 13), which is an image pickup device for picking up the reference mark 112 provided on the printed wiring board 60, is provided on the Y-axis slide 512 immovably and downward. The imaging screen is horizontal, and the reference mark 112 is imaged from above. In the present embodiment, the reference mark camera 580 is a CCD camera and is also a surface image pickup device. An illuminating device 582 is arranged corresponding to the reference mark camera 580, and illuminates the reference mark 112 and its periphery.

The X-axis slide 496 is located at positions corresponding to the two ball screws 494 for moving the X-axis slide 496, between the feeder type component supply device 410 and the printed wiring board 60, and the tray type component. An image pickup device 590 is immovably attached to a position between the supply device 412 and the printed wiring board 60. The configurations of the image pickup devices 590 are the same, and one image pickup device 590 will be representatively described.

The image pickup device 590, as shown in FIG.
A component camera 592 that captures an image of the electronic component 38 and a light guide device 594 are provided, and the light guide device 594 has reflecting mirrors 596 and 598 as reflecting devices. Reflecting mirror 596,5
98 is an X-axis slide 49 by a bracket (not shown)
6 is fixed to the lower part of the first mirror 6, and one of the reflecting mirrors 596 is located directly below the movement path of the mounting head 490 in the Y-axis direction.
About 45 with respect to the vertical plane including the center line of the suction nozzle 544
It has a reflecting surface 600 which is inclined at an angle and whose end on the side closer to the X-axis slide 496 is located below.

On the other hand, the other reflecting mirror 598 is tilted symmetrically with respect to the surface perpendicular to the reflecting surface 600 of the reflecting mirror 596 on the opposite side of the X-axis slide 496, and the X-axis slide 496.
The end on the side closer to 96 has a reflecting surface 602 located below. A component camera for picking up an image of the electronic component 38 held by the suction nozzle 544 at a position opposite to the side where the mounting head 490 of the X-axis slide 496 is provided and facing the reflecting surface 602 of the reflecting mirror 598. 592 is fixed downward by a holding member 606.

Therefore, the mounting head 490 is moved by the XY robot 526, and at the position corresponding to the ball screw 494 in the Y-axis direction, the reflecting mirror 596.
When reaching the position located above, the component camera 592 can capture an image of the electronic component 38. The imaging device 590 is Y
The component camera 592 is arranged at a position where an image of the electronic component 38 can be captured on the movement trajectory of the electronic component 38 when the shaft slide 512 moves with respect to the X-axis slide 496. The imaging target such as 38 is imaged from below. In this embodiment, the component camera 592 is similar to the fiducial mark camera 580 in that
The surface image pickup device is a CCD camera, the image pickup screen is horizontal, and image processing is performed in consideration of the reversal of the position of the image when the image pickup target such as the electronic component 38 is picked up from below. . It is also possible to omit the reflecting mirror 598 and dispose the component camera 592 in a horizontal position at a position facing the reflecting mirror 596.

A strobe 610 as an ultraviolet irradiation device is provided near the reflecting mirror 596, and a suction nozzle 544 is provided.
Ultraviolet rays are radiated toward the light emitting plate 612. The light emitting plate 612 absorbs ultraviolet rays and emits visible rays, and the component camera 592 captures a projected image of the electronic component 38 from below. In the present embodiment, the light emitting plate 612 and the ultraviolet irradiation device form a lighting device.

Further, as compared with the strobe 610, another strobe 614 for irradiating visible light is provided at a position closer to the suction nozzle 544, and the bottom of the electronic component 38 (the mounting surface to be mounted on the printed wiring board 60). ), The component camera 592 captures a front image of the electronic component 38 from below. The image pickup device 590 and the illumination device form a component image pickup system.

At a position upstream of the wiring board conveyor 404 (on the left side in the figure) and where it does not interfere with the movement of the component mounting device 408 in the X-axis direction, a pair of guide rails 42 is provided.
A wiring board thickness detection device 650 for detecting the thickness of the printed wiring board 60 is arranged at the center of the width direction of 0, 422. As shown in FIG. 15, the wiring board thickness detection device 650 includes a pair of distance sensors 652 and 654, and the distance sensors 652 and 654 are fixed by a support member (not shown) in a direction facing each other in the vertical direction. ing.
The distance sensors 652 and 654 are provided at positions that do not interfere with the printed wiring board 60 when the printed wiring board 60 is conveyed by the wiring board conveyor 404, and one of the distance sensors with respect to the movement path of the printed wiring board 60. 652 is provided above, and the other distance sensor 654 is provided below. Hereinafter, when the respective distance sensors are shown, they are referred to as the upper distance sensor 652 and the lower distance sensor 654, and when they are shown, they are referred to as the distance sensors 652 and 654.

The distance sensors 652 and 654 are non-contact type sensors capable of detecting the distance from the sensor body to the object, and are visible light type sensors in this embodiment. The distance sensor includes a light emitting unit and an imaging unit, like the distance sensor 252 described above. In this embodiment,
The printed wiring board 60 has a pair of distance sensors 652, 65.
Surface 11 of the printed wiring board 60 when passing between 4
0 and the upper distance sensor 652, and the distance between the back surface 370 and the lower distance sensor 654 are detected. In the present embodiment, the upper distance sensor 652 and the lower distance sensor 6
Both 54 are fixed to the system main body, and the relationship between the output values of the distance sensors 652 and 654 and the actual distance from the distance sensors 652 and 654 to the distance detection target surface is obtained in advance. Both distance sensors 65
2, 654 can detect the actual distances to the front surface 110 and the back surface 370. In addition, both distance sensors 652, 654
Since the inter-sensor distance, which is the distance in the vertical direction of, is previously measured, the upper distance sensor 65
2 and the distance X between the front surface 110 of the printed wiring board 60 and the distance Y between the lower distance sensor 654 and the back surface 370, a value obtained by subtracting the thickness of the printed wiring board 60 at the detection point. obtained as l. The distance sensor 65
Other non-contact type sensors such as a laser type and an ultrasonic type can be used for 2,654, and a contact type distance sensor can also be used.

This electronic component mounting system 402 is shown in FIG.
It is controlled by the control device 670 shown in FIG. Control device 6
70 is the CPU 30 as in the control device 300 described above.
2, a ROM 304, a RAM 306, and a computer 310 having a bus 308 connecting them. An input / output interface 312 is further connected to the bus 308, and drive motors 426, 500, 516 and the like are connected via a drive circuit 316. Each drive motor is provided with an encoder 320, and the rotation angle of the drive motor detected by the encoder 320 is transmitted to the control device 670. The input / output interface 312 is further connected to a fiducial mark camera 580, a component camera 592, and an operation panel 328 via a control circuit 318.

ROM 304 or RA of controller 670
The M306 stores various programs including a main program for executing the electronic component mounting work. In the present embodiment, the thickness of the printed wiring board 60 is further detected, and based on the thickness, the mounting head 4 is mounted during the electronic component mounting work by the component mounting apparatus 408.
It includes a thickness detection program for correcting the descending distance of 90 so that the mounting is properly performed. The thickness detection program will be described in detail later.

The electronic component mounting system 402 configured as described above is used to mount the electronic components 38 on the printed wiring board 60.
The component mounting work for mounting the will be described. The component mounting work is almost the same as the operation described in Japanese Patent Application No. 2001-172915, and therefore will be briefly described, and only the part particularly related to the present invention will be described in detail. The printed wiring board 60 is conveyed to the component mounting position by the wiring board conveyor 404 and held by the wiring board holding device 406. The component mounting unit 538 is moved in the horizontal direction, receives the electronic component 38 from one of the component supply devices 410 and 412, and moves toward the mounting point on the mounting surface of the printed wiring board 60. At this time, since the electronic component 38 is imaged because it passes over the image pickup device 590, the holding position error (parallel position error and rotational position error) by the mounting head 490 is detected. While the mounting unit 674 moves from the top of the imaging device 590 to the component mounting position, the electronic component 38
The rotational position error is eliminated, and the mounting unit 674 is stopped at a position where the parallel position error of the electronic component 38 is eliminated, and the electronic component 38 is mounted.

In this electronic component mounting system 402, the thickness detecting device 650 is provided while the printed wiring board 60 is conveyed by the wiring board conveyor 404 to the component mounting position.
The thickness of the printed wiring board 60 is detected by, and when the electronic component 38 is mounted, the mounting head 490 is lowered so that the relative position between the printed wiring board 60 and the mounting head 490 in the vertical direction becomes appropriate. Is corrected. Less than,
The thickness detection work will be described.

First, a brief description will be given. In the electronic component mounting system 402, when the printed wiring board 60 is conveyed to the component mounting position by the wiring board conveyor 404, the pair of distance sensors 652, 6 of the thickness detecting device 650.
Pass between 54. Since the output values of the distance sensors 652 and 654 greatly differ between the state where the printed wiring board 60 is present at the position facing the distance sensors 652 and 654 and the state where it is not present, based on the output values of the distance sensors 652 and 654, The printed wiring board 60 is a distance sensor 652.
It is possible to detect whether it exists during 654.
While the printed wiring board 60 exists at the position facing the distance sensors 652 and 654, the surface 11 of the printed wiring board 60 is present.
The distances of 0 and the back surface 370 from the distance sensors 652 and 654 are detected at fixed time intervals Δt, and the detected values are RA.
It is stored in M306. The printed wiring board 60 is conveyed along the X-axis direction, and the detection is performed at every constant minute time Δt during which the printed wiring board 60 is continuously passed between the two fixed distance sensors 652 and 654.

Distance sensor 652 of printed wiring board 60
The passing time T of 654 is acquired, and the distance sensor 65 for each time which is a preset integer fraction of the passing time T is obtained.
The output values of 2,654 are acquired from the output values of the distance sensors 652,654 stored in the RAM 306. In this embodiment, this acquisition is performed by interpolation calculation based on the output values of the distance sensors 652 and 654 stored in the RAM 306. It is also possible to obtain it as the output value of 652,654. The output values of the distance sensors 652 and 654 for each time that is a fraction of the set integer are at the detection points set on the printed wiring board 60 at constant distances, assuming that the conveyance speed of the printed wiring board 60 is constant. It is the distance of the front surface 110 and the back surface 370 from the distance sensors 652 and 654.

Although the printed wiring board 60 is conveyed by the wiring board conveyor 404, the distance sensors 652, 6
The output value of 54 corresponds to the distance sensor 65 of the printed wiring board 60.
The wiring board conveyor 404 is stopped immediately after reaching a value indicating that the positions of 2,654 have been reached, and then the wiring board conveyor 404 is stopped at regular intervals of operation, and the output of the distance sensors 652,654 at each stop. The value may be stored in the RAM 306. Further, the wiring board conveyor 404 is provided with an operation amount detector such as an encoder, or the drive source of the wiring board conveyor 404 is an electric motor capable of accurately controlling a rotation angle such as a servomotor, and the wiring board conveyor 404 is operated at a constant operation amount. The output values of the distance sensors 652 and 654 may be stored in the RAM 306.

As described above, for the plurality of detection points set on the printed wiring board 60, the upper distance sensor 6
If the upper distance that is the distance between 52 and the front surface 110 and the lower distance that is the distance between the lower distance sensor 654 and the back surface 370 are detected, the sum of the upper distance and the lower distance from the predetermined inter-sensor distance is calculated. By pulling, the local thickness which is the thickness of the printed wiring board 60 at the detection point is acquired. When the local thicknesses are acquired at a plurality of points on the printed wiring board 60, the average value of the local thicknesses is calculated as the total thickness.

When the printed wiring board 60 reaches the position held by the wiring board holding device 406 by the wiring board conveyor 404, the printed wiring board 60 is positioned and held by the wiring board holding device 406, and the mounting of the electronic component 38 by the component mounting device 408 waits. Be done. In the present embodiment, the wiring board holding device 40
6 and the support surface 452 of the guide rails 420 and 422, the back surface 37 of the printed wiring board 60.
It is supported so that the height of 0 is constant. This back side 37
The height of the front surface 110 of the printed wiring board 60 can be obtained by adding the previously detected thickness of the printed wiring board 60 to the height of 0. Then, theoretically, the difference between the acquired height of the surface 110 and the preset target height should be the correction value for the amount of lowering of the mounting head 490.
Since the difference between the detected thickness of the printed wiring board 60 and the preset target thickness also has the same value, in the present embodiment, the difference between these thicknesses is acquired as the correction value of the descending amount. Has been This electronic component mounting system 4
02, the amount of lowering of the mounting head 490 is predetermined based on the type and shape of the electronic component 38 to be mounted, but it corresponds to all the electronic components 38 to be mounted on the printed wiring board 60 this time. Wearing head 49
The fall amount of 0 is corrected based on the correction amount.

The mounting unit 538 is the XY robot 526.
When the electronic component 3 is moved horizontally by the electronic component 3 and reaches the component mounting position, the head lifting device 534 lowers the mounting head 490 by the corrected lowering amount.
8 is placed on the printed wiring board 60. Thus, one electronic component mounting work is completed.

The thickness detecting program will be described below with reference to the flowchart shown in FIG. First, S5
In 1 and S52, it is awaited that printed wiring board 60 is conveyed to wiring board conveyor 404 and printed wiring board 60 reaches the position facing distance sensors 652 and 654. If it is recognized that the printed wiring board 60 has reached between the distance sensors 652 and 654 based on the sudden change in the output values of the distance sensors 652 and 654, S52
Is YES, the time t is set to 0 in S53, and time counting is started. Furthermore, until the flag F1 is set to 1 and the execution of this program once is completed, S
The execution of steps 51 to S53 is skipped.

The routine proceeds to S54, where it is awaited that the time t has passed an integral multiple of the set time Δt. First is an integer n
Is 1, so if time t exceeds the set time Δt, S
The determination of 54 is YES, the process proceeds to S55, and the upper distance Xn and the lower distance Yn, which are the output values of the distance sensors 652 and 654 at that time, are read. Further, 1 is added to the integer n and stored as a new integer n. Proceeding to S56, the printed wiring board 60 displays the distance sensors 652, 654.
You will be asked whether or not you passed between the two. Distance sensor 652,
The determination in S56 becomes NO and the execution of S54 and S55 is repeated until the output value of 654 suddenly changes and it is detected that the printed wiring board 60 has passed. As a result, the printed wiring board 60 causes the distance sensors 652, 6 to
Within the range of 54, the upper distance X is set every set time Δt.
n and the lower distance Yn are acquired.

The printed wiring board 60 is the distance sensor 652.
If it passes between 654, the process proceeds to S57, and the passage time T required for the printed wiring board 60 to pass is acquired. Proceeding to S58, the passage time T is divided by a preset integer N (where N is a natural number), and in S59, an output value corresponding to each integer N of the passage time T is acquired and The local thickness In at the site is calculated. In the present embodiment, the distance sensors 652, 6 are set every set time Δt that is sufficiently smaller than 1 / N of the passage time T.
The output values Xn, Yn of 54 are acquired, and the passage time T is set in advance by performing an interpolation operation from a plurality of output values Xn, Yn close to 1 / N of the passage time T. The distance sensor 65 for each hour of the set integer
The output values of 2,654 are acquired, and the local thickness ln is acquired. Note that the local thickness ln is the distance between the upper distance sensor 652 and the lower distance sensor 654, and the sum of the upper distance Xn and the lower distance Yn is subtracted from the inter-sensor distance Z stored in advance. It is a value.

Next, in S60, the local thickness l
The average value of n is acquired as the total thickness L that is the thickness of the entire printed wiring board 60, and in S61, the total thickness L of the printed wiring board 60 at this time and the preset thickness L are set.
The difference from 0 is acquired as a correction value ΔL for the amount of lowering of the mounting head 490. In step S62, the number n and the flag F1 are returned to the initial values, and the single execution of this program ends.

As is clear from the above description, in the present embodiment, the supporting surface 452 of the wiring board holding device 406 constitutes the “height defining surface”, and the thickness of the thickness detecting device 650 and the thickness of the controlling device 670 are the same. Of the detection programs, S51 to S6
The part that executes 0 constitutes the "thickness acquisition part", and the part that executes S51 to S56 constitutes the "thickness detection part". Further, the part of the control device 670 that executes S61 constitutes a “thickness-dependent substrate surface height acquisition part”, and the control device 67
The part that executes S51 to S56 of 0 is the "sensor control unit".
Are configured.

In this embodiment, the pair of distance sensors 652 and 654 are provided so as to face each other in the vertical direction. However, only one distance sensor may be provided, and in that case, the distance sensor is provided on the upper side. It is desirable to be provided. In the latter case, the surface height of the front surface 110 of the printed wiring board 60 supported by the wiring board holding device 406 can be acquired.

Further, in the above embodiment, the average value of the local thickness ln at a plurality of locations is obtained as the total thickness L which is the total thickness of the printed wiring board 60. If is not uniform, the set time Δ
Output value X of the distance sensors 652 and 654 acquired every t
Based on n and Yn, the local thickness ln is acquired for each area having a uniform thickness, and the local thickness ln is added to the height of the supporting surface 452 of the wiring board holding device 406 to obtain the printed wiring board. It is also possible to obtain the height of each part of the surface 110 of the surface 60 and obtain the correction value and the like of the descending amount of the mounting head 490 based on these heights. In this case, the local thickness ln of the control device 670 is added to the height of the support surface 452 of the wiring board holding device 406, and the portion for obtaining the height of each part of the front surface 110 of the printed wiring board 60 is “thickness. The base board surface height acquisition unit "will be configured.

Furthermore, the output values Xn, Yn of the distance sensors 652, 654 acquired at each set time Δt, or
The surface 1 of the printed wiring board 60 based on the output value corresponding to every integer N of the transit time T of the printed wiring board 60.
It is also possible to detect the height of each part of 10 and the back surface 370 and use them individually for controlling the electronic component mounting system 402. Then, the control device 67
The portions that acquire the heights of the front surface 110 and the back surface 370 of 0 form the “substrate surface height acquisition portion” in cooperation with the distance sensors 652 and 654.

Another mode will be described. In the present embodiment, instead of detecting the actual thickness of the printed wiring board, the type of the printed wiring board is recognized, and the printing is performed based on the information about the type and the thickness of the printed wiring board stored in advance. Get the thickness of the wiring board. Specifically, a one-dimensional bar code that is bar code information is attached to each printed wiring board as an identifier, and the bar code is read by a laser bar code reader as a reading device to recognize the type of the printed wiring board. The electronic component mounting system 700 according to the present embodiment has almost the same configuration as the electronic component mounting system 12 described above, and is different only in the barcode reader. Therefore, the description will be omitted by using common reference numerals for common components. ,
Only the different elements will be described.

As shown in FIG. 18, in the electronic component mounting system 700, a bar code reader 702 is fixed vertically downward by a frame (not shown). The barcode reader 702 is provided instead of the distance sensor 252 in the above-described embodiment. Further, a sticker-shaped barcode 704 is attached in advance on the surface of the printed wiring board 60. Barcode 70
4 is provided on the surface 110 of the printed wiring board 60 at a position where it does not interfere with the electronic component mounting work.

Since the operation of the electronic component mounting system 700 is almost the same as that of the electronic component mounting system 12 described above, only different parts will be described. In the electronic component mounting system 700, when the printed wiring board 60 is carried in by a carry-in device (not shown), the reference mark 112 is first imaged by being positioned at the reference mark imaging position. Next, the barcode 704 attached to the front surface 110 is positioned at a position where it can be read by the barcode reader 702, that is, a position directly below the barcode reader 702. Bar code 70 by bar code reader 702
When 4 is read, the read result is transmitted to the control device 300, and information regarding the type and thickness of the printed wiring board 60 is acquired. Based on the thickness information, the mounting holding height, which is the holding height of the printed wiring board 60 during the electronic component mounting work of the wiring board holding device 18, is corrected, and the electronic component mounting work is executed well. .

Further description will be given based on the flowchart of the thickness detection routine shown in FIG. First, step S
101, the printed wiring board 60 is a system 700
It is awaited that the two reference marks 112 are carried in and the two reference marks 112 are imaged. Next, in S102, the wiring board holding device 18 is positioned so that the barcode 704 attached to the printed wiring board 60 is located directly below the barcode reader 702, and in S103, the barcode 70 is positioned.
4 is read. Proceeding to S104, the thickness of the printed wiring board 60 supported by the wiring board holding device 18 this time is RO based on the information of the read barcode 704.
It is read from M304 or RAM 306. S10
5, the holding height when the wiring board holding device 18 is mounted is corrected based on the thickness of the printed wiring board 60.

As is clear from the above description, in the present embodiment, a part of the computer 310 constitutes a “board surface height memory”, and the thickness acquisition programs of the bar code reader 702 and the control device 300 are included. The part that executes S103 is a "board type acquisition part" that includes a "code reading part".
And the part that executes S104 constitutes a "reader".

The timing at which the reading work for reading the bar code 704 by the bar code reader 702 is executed until the printed wiring board 60 is supported by the wiring board holding device 18 and the electronic component mounting work is started. It may be performed before the reference mark imaging operation of imaging the reference mark 112 and its surroundings, or after the one reference mark 112 is imaged and the other reference mark 112 is imaged. Wiring board holding device 18 X
While being moved by the Y table 64, the reading operation may be performed while being positioned at the barcode reading position.

Further, it is not essential that the barcode 704 is a one-dimensional barcode, and it may be a two-dimensional barcode, for example. In the latter case, it is possible to capture information by capturing a barcode with a CCD camera instead of the laser barcode reader 702. In that case, the reference mark camera 114 can capture the information. Is desirable.

Although the electronic component mounting system has been described above, the present invention can also be implemented in a working apparatus that performs another work on the printed wiring board 60. For example, it can be applied to a coating system that applies a coating agent such as an adhesive in a spot shape, or a mask printing machine that mask-prints a printing agent such as cream solder. Less than,
A brief description will be given based on the drawings.

An adhesive coating system 710, which is a type of coating system, has not been published yet, but since it has substantially the same configuration as the coating system described in Japanese Patent Application No. 2000-334342 by the present applicant, Briefly explained.

As shown in FIGS. 20 and 21, the adhesive application system 710 includes a wiring board conveyor 404 for conveying the printed wiring board 60 in the X-axis direction, and the printed wiring board 6.
No. 0 surface 110 and an applicator 714 for applying an adhesive. The printed wiring board 60 is a wiring board conveyor 404.
A wiring board holding device 406 provided midway is positioned at a preset application position, and an adhesive, which is a kind of coating agent, that is a high-viscosity fluid is applied.

The coating device 714 will be described. Applicator 71
Reference numeral 4 denotes that the coating unit 720 is translated in a direction having components in the X-axis direction and the Y-axis direction which are orthogonal to each other to apply the adhesive in spots on the surface to be coated of the printed wiring board 60. ing. Therefore, the coating unit 720 has the X-axis slide 496 that is movable in the X-axis direction.
And an XY robot 52 including a Y-axis slide 512 movable on the X-axis slide 496 in the Y-axis direction.
6, the printed wiring board 60 is moved to an arbitrary position within a horizontal plane which is one plane parallel to the surface. The electronic component 38 is subsequently placed on the applied adhesive and is temporarily fixed to the printed wiring board 60 by the adhesive.

On the Y-axis slide 512, a reference mark image pickup device 580 for picking up an image of the reference mark 112 provided on the printed wiring board 60 is held vertically downward.
The reference mark imaging device 580 is provided on the Y-axis slide 512 so as not to move relative to it, and moves in the horizontal direction integrally with the coating unit 720.

The coating unit 720 will be described with reference to FIG. The coating unit 720 is the Y-axis slide 51.
It is moved up and down on the board 2 to approach and separate from the printed wiring board 60. Therefore, the Y-axis slide 512 is provided with a pair of guide members 721, which are guide members, in the vertical direction, and the Z-axis slide 722 is slidably fitted in a guide block (not shown).
It is moved up and down by the Z-axis slide drive device 724. Z
The shaft slide drive device 724 uses a servo motor, which is a type of electric motor, as a drive source, and uses a ball screw 7 that is a feed screw.
By rotating 25, the Z-axis slide 722 can be moved to any position in the vertical direction. The Z-axis slide 722 and the Z-axis slide driving device 724 configure a coating unit elevating device 726 that is a relative moving device that relatively moves the coating unit 720 and the coating target material in a direction perpendicular to the surface. The coating unit lifting device 726 is also a coating nozzle lifting device that lifts and lowers the coating nozzle that is a component of the coating unit 720. In the present embodiment, the Z-axis slide 722 constitutes the main body of the coating device 714, and the XY robot 526.
And the Z-axis slide driving device 724,
22 and the printed wiring board 60 constitute a relative movement device that relatively moves the printed wiring board 60 in a direction parallel to the surface to be coated, which is the surface of the printed wiring board 60, and a direction perpendicular thereto.

The coating unit 720 includes a coating nozzle,
It is provided with a nozzle rotating device, a screw pump, a pump driving device (screw rotating device), an adhesive supply device that is a high-viscosity fluid supply device that is a kind of coating agent supply device, and the like.
Regarding the configuration of these coating nozzles, etc.
Since it is the same as that described in No. 0-334342, illustration and detailed description thereof will be omitted.

In the present coating apparatus as well, similar to the electronic component mounting system 700 described above, a thickness detecting device 650 for detecting the thickness of the printed wiring board is provided on the upstream side in the carrying direction of the wiring board conveyor. This thickness detection device 6
Since 50 is almost the same as that described above, the description thereof is omitted by using common reference numerals.

The coating apparatus configured as described above includes a control device for controlling the operation. Since the control device has substantially the same structure as the above-mentioned control device 300 and the like, illustration and description thereof will be omitted.

The operation of applying the adhesive to the printed wiring board 60 is also the same as that described in Japanese Patent Application No. 2000-334342, and therefore will be briefly described. When the adhesive is applied to the printed wiring board 60, the printed wiring board 60
Is carried in by the wiring board conveyor 404 and stopped at the coating position. During this loading operation, the thickness of the printed wiring board 60 is detected by the thickness detection device 650, as in the electronic component mounting system 402 described above. Then, the coating unit 720 is supported by the wiring board supporting device 406 from below and is clamped by the wiring board clamping device so that the coating unit 720 moves the XY robot 526.
The adhesive is applied to the adhesive application position of the printed wiring board 60. In this embodiment, the adhesive is applied to a plurality of application points on the printed wiring board 60.

In this coating operation, the coating unit 72
With 0, the amount of lowering is corrected according to the thickness of the printed wiring board 60, and the height is lowered to a suitable height regardless of the change in the thickness of the printed wiring board 60. The thickness detection device 650
Can be a surface height detection device that detects the height of at least one of the front surface 110 and the back surface 370 at one or more points on the printed wiring board 60.
This is the same as in the embodiment of FIGS. 10 to 17.

The mask printing machine 712 will be described with reference to FIGS. 22 to 24. This mask printing machine 712
Is almost the same as that described in Japanese Patent Laid-Open No. 2001-116528, and therefore will be briefly described.

As shown in FIG. 22, a mask printing machine 712.
Is a wiring board conveyor 732 and a wiring board conveyor 7 that are conveyance devices that convey the printed wiring board 60 as a material to be printed.
A wiring board holding lifting device 734, which is a target material holding lifting device that is a kind of a target material holding device that holds and lifts the printed wiring board 60 conveyed by 32, and printed wiring when the wiring board is held by the wiring board holding lifting device 734. Wiring board holding device (not shown) for holding the board 60, mask plate 736
A mask positioning and holding device 738 that holds the mask, a printing device 740 that prints a cream-like solder, which is a type of printing material, on the printed wiring board 60, a mask cleaning device 742 that cleans the mask 764 of the mask plate 736, and the like are provided. . Although not shown, the mask printing machine 712 mainly includes a computer and includes a control device that controls the device. Among these, the wiring board conveyor 732 and the wiring board holding / lifting device 734 which are related to the present invention will be briefly described below.

The wiring board conveyor 732 has a pair of rails 748 and 750 as shown in FIG. An endless belt (not shown) as a winding member is attached to each of the rails 748 and 750 along the longitudinal direction, and the printed wiring board 60 is placed on these belts.
The belt is conveyed by being rotated by a belt driving device (not shown). A pair of rails 748,75
The mutual distance of 0 can be adjusted according to the size of the printed wiring board 60. The printed wiring board 60 is stopped at a printing position where cream solder is printed in the transport direction by a stopper device (not shown).

A thickness detecting device 650 is provided on the upstream side of the wiring board conveyor 732, and the thickness is detected every time the printed wiring board 60 is carried in, as in the above-described embodiments. It should be noted that the thickness detection device 650 can be a surface height detection device that detects the height of at least one of the front surface and the back surface at one point or a plurality of points on the printed wiring board 60. 10 to 17 as in the embodiment.

The wiring board holding lifting device 734 is the printing device 7.
A wiring board holding base 760, which is a target material holding base that is provided below the 40 and is vertically movable through a pair of rails 748 and 750, is provided. In the present embodiment, the wiring board holding base 760 adsorbs the printed wiring board 60 by negative pressure and horizontally holds the printed wiring board 60. The printed wiring board 60 is lifted up from the belt of the wiring board conveyor 732 and moved up and down to the rising end position where it contacts the lower surface of the mask 764 of the mask plate 736. In the present embodiment, the elevation height of the elevating device 762 can be accurately controlled, and the printed wiring board thickness detecting device 65 can be controlled.
The rising end position can be corrected according to the thickness of the printed wiring board 60 detected by 0.

The printed wiring board 60 is the wiring board conveyor 7
When it is carried into the mask printing machine 712 by 32, it is positioned and held at the printing position by the wiring board holding lifting device 734. While being conveyed by the wiring board conveyor 732, the thickness is detected by the thickness detecting device 650 similarly to the above-described working devices, and the set value of the ascending end position when the wiring board holding and elevating device 734 raises the value is set. It is corrected and the printing operation is executed.

Also in this embodiment, the printed wiring board 6 is used.
By detecting the thickness of 0, the wiring board holding lifting device 7
Since the printed wiring board 60 is accurately positioned at an appropriate height with respect to the mask 764 by 34, problems such as defective printing and deformation of the mask 764 can be effectively prevented.

Although the individual working devices have been described above, the present invention can also be implemented in a working system in which two or more working devices are combined. In that case, each working device may be provided with a wiring board thickness detection device 650, but the working device located upstream of the system detects the thickness of the printed wiring board and the working device on the downstream side detects the thickness. It is desirable to omit the installation of the wiring board thickness detection device 650 and the execution of the thickness detection work thereby in the downstream work device by transmitting the information regarding

Although some embodiments of the present invention have been described above in detail, these are merely examples, and the present invention is described in the above-mentioned [Problems to be solved by the invention, problem solving means and effects]. Various modifications and improvements can be performed based on the knowledge of those skilled in the art, including the described embodiments.

[Brief description of drawings]

FIG. 1 is a plan view showing an electronic component mounting system according to an embodiment of the present invention.

FIG. 2 is a side view (partial cross section) showing a wiring board holding device in the electronic component mounting system.

FIG. 3 is a side cross-sectional view showing an enlarged main part of the component mounting apparatus.

FIG. 4 is a side view showing a thickness detection device for detecting the thickness of a printed wiring board.

FIG. 5 is a block diagram showing a control device of the electronic component mounting system.

FIG. 6 is a flowchart showing a height correction value acquisition routine executed by the control device.

FIG. 7 is a side view showing another thickness detecting device.

FIG. 8 is a side view showing still another thickness detection device.

FIG. 9 is a side view (partial cross section) showing a wiring board holding device including another thickness detecting device.

FIG. 10 is a plan view showing an electronic component mounting system according to another embodiment of the present invention.

FIG. 11 is a front view showing the electronic component mounting system.

FIG. 12 is a side view (partially sectional view) showing an enlarged main part of the electronic component mounting system.

13 is a front view showing the mounting device of FIG. 12. FIG.

FIG. 14 is a front view showing a wiring board conveyor and a wiring board holding device of the electronic component mounting system.

FIG. 15 is a front sectional view showing another portion of the wiring board conveyor.

FIG. 16 is a block diagram showing a control device of the electronic component mounting system.

FIG. 17 is a flowchart showing a thickness detection routine executed by the control device.

FIG. 18 is a plan view showing an electronic component mounting system which is another embodiment of the present invention.

FIG. 19 is a flow chart for explaining a thickness detection routine executed in the electronic component mounting system.

FIG. 20 is a plan view showing an adhesive applying system according to another embodiment of the present invention.

FIG. 21 is an enlarged front view (partially sectioned) of a main part of the adhesive application system.

FIG. 22 is a front view showing a mask printing machine according to another embodiment of the present invention.

FIG. 23 is a plan view of the mask printing machine.

FIG. 24 is a side view of the mask printing machine.

[Explanation of symbols]

12: Electronic component mounting system 14: Component supply device 16: Component mounting device 18: Wiring board holding device 60: Printed wiring board 64: XY table 74: X-axis slide 74: X-axis slide
86: Z-axis slide 88: Wiring board support device
90: Wiring board holding device elevating device 98: Wiring board supporting device elevating device 100: Wiring board conveyor 110: Surface 112: Reference mark
114: fiducial mark camera 300: control device 302: PU 304: ROM 30
6: RAM 308: Bus 310: Computer 312: Input / Output Interface 350: Electric Micrometer 360: Contact Sensor 362: Linear Counter 370: Back Side
372: Electric Micrometer 402: Electronic Component Mounting System 404: Wiring Board Conveyor 4
06: Wiring board holding device 408: Component mounting device
410, 412: Component supplying device 416: Wiring board supporting device 650: Thickness measuring device
652, 654: Distance sensor 700: Electronic component mounting system 702: Bar code reader
704: Bar code 710: Adhesive application system 712: Mask printing machine

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Yukihiro Fukao             Fuji Machinery, 19 Chasuyama, Yamamachi, Chiryu City, Aichi Prefecture             Manufacturing Co., Ltd. F-term (reference) 5E313 AA01 AA11 EE02 EE03 EE05                       FF11 FF31

Claims (7)

[Claims] 1. A board holding device for holding a circuit board, a working device for performing a predetermined work on the circuit board held by the board holding device, and a control device for controlling the operation of the working device. In a board-to-board work system including: Section and the board surface height acquired by the board surface height acquisition section,
A board-to-board working system, comprising: a board surface height reflecting section for reflecting the control of the working apparatus by the control apparatus. 2. The work device performs the work on an upper surface of a circuit board held by the board holding device, and the board surface height acquisition unit sets a height of the upper surface of the circuit board. The board-to-board working system according to claim 1, which is for acquiring the height. 3. The board working system according to claim 1, wherein the working device includes a component mounting device that mounts an electrical component on the circuit board held by the board holding device. 4. The substrate surface height acquisition unit includes a substrate surface height detection unit that detects the substrate surface height.
The board-to-board working system according to any one of 1. 5. The substrate surface height acquisition unit, wherein the substrate holding device includes a height defining surface that is in close contact with either the upper surface or the lower surface of the circuit board and defines the height of the one surface. Is a thickness acquisition unit that acquires the thickness of the circuit board, and acquires the other height of the upper surface and the lower surface based on the thickness acquired by the thickness acquisition unit and the height of the specified surface. The board-to-board working system according to claim 1, further comprising a thickness-based board surface height acquisition unit. 6. A board surface height memory that stores the board surface height in association with the kind of the circuit board and the board surface height, and a board type that acquires information on the kind of the circuit board. The board-to-board operation according to claim 1, further comprising: an acquisition unit and a reading unit that reads out a board surface height corresponding to the board type acquired by the board type reading unit from the board surface height memory. system. 7. A board holding device for holding a circuit board, a work device for performing a predetermined work on the circuit board held by the board holding device, and a control device for controlling the operation of the work device. In a board-to-board working system including: a board thickness acquisition unit that acquires the thickness of the circuit board held by the board holding device; and a board thickness acquired by the board thickness acquisition unit, And a board thickness reflecting section for reflecting the control of the working apparatus by the above.