JP2008293394A - Inlet sealing body, and wrist band in which inlet sealing body is enclosed - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an inlet sealing body excellent in heat resistance, in which IC chip or antenna is not damaged even when heat is applied in such cases as the press-vulcanizing of silicon rubber, and a wrist band sealing therein an inlet so that the IC chip or antenna are not broken. <P>SOLUTION: In the inlet sealing body, both surfaces of an inlet 8 on which an antenna 7 and an IC chip 5 are mounted on a PET film 3 are sealed with a PEN film 11 through adhesive layers 13 and 15. The thickness of the PEN film 11A provided on the surface on which the antenna 7 and the IC chip 5 are mounted is larger than the thickness of the PEN film 11B provided on the other surface. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an inlet sealing body and a wristband formed by sealing the inlet sealing body.

2. Description of the Related Art In recent years, a system that attaches an IC tag equipped with an IC chip to an article and performs merchandise distribution management, manufacturing history management, security management, or the like without contact has been attracting attention.
In manufacturing such an IC tag, a small IC chip on which information is recorded and an inlet in which a small antenna that wirelessly transmits information on the IC chip is mounted on a film are used as components.
Such an inlet becomes a durable IC tag by protecting its surface by tag processing such as laminate or mold, and is used for various applications.
As one application of such an IC tag, an inlet is enclosed in a wristband so that it can be worn on a person's wrist, used for managing entry / exit of workers in a factory, various management in sports clubs, etc. May be.
An example of such a wristband is the following RF-ID wristband.

An IC chip for storing data and an antenna for transmitting and receiving the data in a non-contact manner using electromagnetic waves are formed on a circuit board, and are molded with a synthetic resin, an IC tag sealed with a sealing material, The wristband body formed by extending the belt portion from both ends of the IC tag housing portion as a center, and the IC tag housing portion are thicker than both belt portions, and are located close to the surface side. A recess for storing the IC tag is formed, and the recess is formed by cutting a T-shaped cross section from the back side of the IC tag storage portion. Reference 1).
Japanese Patent No. 3888896

In the wristband disclosed in Patent Document 1, in order to store the IC tag in the wristband, the IC tag storage portion is formed by a cut having a T-shaped cross section, and after the IC tag is stored, pottering processing (resin Sheng).
However, such an IC tag storage method requires a separate process for storing the IC tag after the wristband is formed, and the manufacturing process is complicated.

As described above, the conventional wristband in which the IC tag is encapsulated adopts a form in which the IC tag is encapsulated after the wristband is formed, although the manufacturing process is complicated.
This is because when the wristband is molded by press vulcanization of silicon rubber, if the wristband is molded with the IC tag enclosed, there is a risk of damage to the IC chip or antenna due to heat during the press vulcanization. In order to avoid this, it is considered that the IC tag is sealed after the wristband is formed by pottering which can be processed at a relatively low temperature.

  Therefore, if an IC tag (inlet sealing body) in which the inlet is sealed so that the IC chip or the like is not damaged by the heat during the press vulcanization of the wristband can be obtained, the IC tag is sealed when the wristband is molded. The process can be simplified. Such an IC tag excellent in heat resistance is useful not only in the case of enclosing in a wristband but also in various applications.

Therefore, one object of the present invention is to obtain an inlet sealed body excellent in heat resistance that does not damage an IC chip or an antenna even when heat is applied as in the case of silicon rubber press vulcanization. .
Further, even if such an inlet sealing body is sealed in silicon rubber and a wristband is molded, it is necessary to prevent the IC chip and the antenna from being damaged in the usage state of the wristband.
Accordingly, another object of the present invention is to obtain a wristband in which an inlet is sealed in a wristband so that an IC chip and an antenna are not damaged.

(1) The inlet sealing body according to the present invention is characterized in that both sides of an inlet in which an antenna and an IC chip are mounted on a PET film are sealed with a PEN film via an adhesive layer. .

(2) Further, in the above (1), the thickness of the PEN film provided on the surface side on which the antenna and the IC chip are mounted is made larger than the thickness of the PEN film provided on the other surface. Is.

(3) A wristband according to the present invention is formed by sealing the inlet sealing body according to the above (1) or (2) in silicon rubber.

(4) In the above (3), the wristband is made of ring-shaped silicon rubber, a part of the ring is made of a low hardness part made of low hardness silicon rubber, and the other part of the ring is made high. It consists of a high hardness portion made of silicon rubber having a hardness, and is characterized in that an inlet sealing body is sealed in the high hardness portion.

(5) Further, in the structure described in (4) above, a laminated structure in which an inlet sealing body is sandwiched between two high-hardness unvulcanized silicon rubber strips, and one low-hardness unvulcanized sheet A silicon rubber strip is formed into a ring shape by press vulcanization.

(6) Further, in the above (4) or (5), the thickness of the silicon rubber in the portion enclosing the inlet sealing body is increased.

(7) Moreover, in the thing in any one of said (3)-(6), an inlet sealing body is enclosed with the silicon rubber in the separable state, It is characterized by the above-mentioned.

  In the present invention, since the inlet sealing body is configured by sealing both sides of the inlet mounting the antenna and the IC chip on the PET film with the PEN film via the adhesive layer, in the hot press molding process of silicon rubber However, thermal stress does not act on the inlet, and the IC chip and the antenna are not damaged.

[Embodiment 1]
FIG. 1 is an explanatory view of an inlet sealing body according to an embodiment of the present invention, and shows a plan view of the inlet sealing body. FIG. 2 is an enlarged view showing an AA cross section in FIG.
The inlet sealing body 1 according to the present embodiment is double-sided on both sides of an inlet 8 in which an IC chip 5 and a wireless communication antenna 7 connected to the IC chip 5 are mounted on a PET (polyethylene terephthalate) film 3. A PEN (biaxially stretched polyethylene 2,6-naphthalate) film is stuck through the adhesive layer of the tape 9.

An example of the PEN film 11 is a “Teonex (registered trademark)” film manufactured by Teijin Limited. Table 1 shows the physical property values of the Teonex (registered trademark) film and the physical property values of the PET film 3.

  In the PEN film 11, the thickness of the PEN film 11A on the side facing the IC chip 5 and the antenna 7 is 250 μm, and the thickness of the PEN film 11B on the other side is 100 μm. Thus, by increasing the thickness of the PEN film 11A on the side facing the IC chip 5 and the antenna 7, damage to the IC chip 5 and the antenna 7 can be prevented even when an external force is applied to the inlet sealing body 1. .

As the double-sided tape 9, a commercially available product can be used, and examples of the structure include the following. That is, as an example, there is a three-layer structure in which the low molecular pressure-sensitive adhesive layers 15A and 15B are formed on both surfaces of the polymer pressure-sensitive adhesive layer 13, the thickness is 80 μm, and the heat resistant temperature is 180 ° C.
As another example, an acrylic pressure-sensitive adhesive layer is formed on both sides of a polyester base material, and has a thickness of 100 μm and a heat resistant temperature of 180 ° C.

  In addition, as an example of the double-sided tape 9 used for the inlet sealing body 1, it is not limited to said thing. Moreover, although the example which used the double-sided tape was shown in said example as a means to form the adhesive layer which covers both surfaces of the inlet 8, it is not restricted to this, You may make it apply | coat an adhesive layer directly.

Next, the manufacturing method of the inlet sealing body 1 comprised as mentioned above is demonstrated.
The inlet sealing body 1 is manufactured by the following manufacturing process. The double-sided tape 9 is stuck on the PEN film 11A having a thickness of 250 μm. The inlet 8 is installed in the adhesive layer of the stuck double-sided tape 9. At this time, the surface of the inlet 8 on the IC chip 5 and antenna 7 side is the adhesive layer side. Next, the double-sided tape 9 is further adhered to the upper surface of the installed inlet 8. Then, a PEN film 11B having a thickness of 100 μm is attached on the adhesive layer of the attached double-sided tape 9.

The inlet sealing body 1 configured as described above has the following characteristics in processing having a heating step such as when the inlet sealing body 1 is sealed in, for example, silicon rubber.
The inlet 8 is sealed in the PEN film 11 through the adhesive layer, and the inlet 8 and the PEN film 11 are not in a fixed state as in the case where the two are adhered, Joined in a semi-fixed state. For this reason, even if a difference in elongation between the PEN film 11 and the PET film 3 forming the inlet 8 due to the heat during the heat processing causes a difference in elongation between the two, the adhesive layer becomes a cushion. Excessive stress does not act on the inlet 8 to prevent the IC chip 5 and the antenna 7 from being damaged.

Moreover, since the PEN film 11 is excellent in heat resistance, the inlet sealing body 1 covered with such a material is excellent in heat resistance.
Furthermore, in the inlet sealing body 1, before reaching the inlet 8, the PEN film 11 and the three layers of the double-sided tape 9 (low molecular adhesive layer → polymer adhesive layer → low molecular adhesive layer, acrylic adhesive material layer → The presence of a plurality of layers of different materials such as polyester base material → acrylic adhesive material layer) reduces the heat transfer coefficient and reduces heat transfer to the inlet 8 during heat processing. Acts to protect 8.

[Embodiment 2]
FIG. 3 is a view showing the appearance of a wristband in an embodiment of the present invention, and FIG. 4 is a view of the wristband as viewed from the side.
The wristband 17 according to the present embodiment is made of silicon rubber molded in a ring shape, and the inlet sealing body 1 according to the first embodiment is enclosed in the silicon rubber.
The wristband 17 is formed by bonding a high hardness silicon rubber 19 and a low hardness silicon rubber 21 at two locations in the circumferential direction.
The high hardness silicon rubber 19 is thicker than the low hardness silicon rubber 21, and the inlet sealing body 1 is sealed in the high hardness silicon rubber 19.

  Thus, in the present embodiment, the wristband 17 is formed by bonding the low hardness silicon rubber 21 and the high hardness silicon rubber 19 in the circumferential direction, so that the wristband 17 is worn. When the wristband 17 is extended, a large deformation concentrates on the low-hardness portion, so that a large force does not act on the inlet sealing body 1 sealed in the high-hardness portion. Therefore, there is no possibility that the IC substrate or the antenna 7 of the inlet 8 sealed in the inlet sealing body 1 due to the extension of the wristband 17 is damaged.

Next, a method for manufacturing the wristband 17 as described above will be described.
As shown in FIG. 5, the wristband 17 includes two high-hardness unvulcanized silicon rubber strips 23 made of high-hardness unvulcanized silicone rubber, and one low-hardness made of low-hardness unvulcanized silicone rubber. The unvulcanized silicon rubber strip 25 and the inlet sealing body 1 are used as a material, and it is manufactured by press vulcanization of silicon rubber using a hot press machine 27 shown in FIG.
The specification of the unvulcanized silicon rubber strip and the outline of the heat press machine 27 will be described below.

<Unvulcanized silicone rubber strip>
Unvulcanized silicone rubber strips are made by adding a vulcanizing agent, an anti-aging agent, a softening material, a coloring agent, a reinforcing agent, etc. to a silicon polymer, kneading with a roll mill, and passing through one day. Of a kind. The high hardness unvulcanized silicone rubber strips and the low hardness unvulcanized silicone rubber strips are set to the following dimensions, respectively.
High hardness unvulcanized silicone rubber strip (inside): width 10mm, length 80mm, thickness 2.25mm
High hardness unvulcanized silicone rubber strip (outside): 10mm wide, 80mm long, 2.0mm thick
Low hardness unvulcanized silicone rubber strip: width 10mm, length 110mm, thickness 3mm

(High hardness unvulcanized silicone rubber)
High-hardness unvulcanized silicone rubber is obtained by blending half of the silicone polymer for general molded products and parts with high forces.
The physical properties of these silicon polymers are shown by showing the physical property values of silicon rubber obtained by press vulcanization under certain conditions.
An example of silicon rubber obtained by press vulcanizing a silicon polymer for general molded products is a product name: TSE2287U manufactured by GE Toshiba Silicon Corporation.
Moreover, as an example of the silicon rubber formed by press vulcanizing a silicon polymer for a part to which force is applied, there is a product name: TSE261-7U manufactured by GE Toshiba Silicon Co., Ltd. The product specification values of these products are shown in Tables 2 and 3 below.

(Low hardness unvulcanized silicone rubber)
As the low-hardness unvulcanized silicone rubber, a highly durable silicone polymer was used. An example of silicon rubber obtained by press vulcanizing this highly durable silicon polymer is a product name: XE20-523-5U manufactured by GE Toshiba Silicon Corporation. The product specification values of this product are shown in Table 4 below.

<Inlet sealed body>
The inlet sealing body 1 having the structure shown in the first embodiment and having a width of 4 mm, a length of 55 mm, and a thickness of 0.2 mm was used.

<Outline of heat press machine>
FIG. 6 is an explanatory view of a hot press machine 27 that performs press vulcanization of silicon rubber. First, the structure of the heat press machine 27 will be outlined.
The heat press machine 27 includes a lower die 31 having a semicircular recess 29 that is recessed downward, a cylindrical middle die 33 having substantially the same radius as the recess 29 of the lower die 31, and a recess facing upward. An upper die 36 having a semicircular recess 35 and a main body 39 including a hydraulic cylinder 37 that presses the upper die 36 toward the lower die 31.
A semicircular lower groove 41 having a width of 10 mm and a depth of 2.5 mm to 3.3 mm is formed in the recess 29 of the lower mold 31. The depth of the lower groove 41 is 3.3 mm at the center (the portion where the inlet sealing body 1 is disposed), and gradually becomes shallower from both ends to 2.5 mm at both ends.
A vent 43 that communicates from the lower groove 41 to the side surface of the lower mold 31 is formed at the center of the lower groove 41.
In addition, guide pins 45 are provided on the upper surfaces of both sides of the lower mold 31 with the recess 29 interposed therebetween, and can be inserted into guide holes (not shown) of the upper mold 36.
A semicircular upper groove 47 having a width of 10 mm and a depth of 2.5 mm is formed in the recess 35 of the upper mold 36.
In the press vulcanization of silicon rubber, the upper die 36 and the lower die 31 are heated from 160 ° C. to 170 ° C.

<Description of wristband molding method>
An inlet sealing body 1 is sandwiched between two high-hardness unvulcanized silicon rubber strips 23 to form a laminated structure 49 composed of the high-hardness unvulcanized silicon rubber strips 23 and the inlet sealing body 1 (see FIG. 5). This is fitted into the lower groove 41 of the lower die 31 while being bent. In the fitted state, the center of the lower groove 41 is occupied by the laminated structure 49, and both ends of the lower groove 41 are opened by about 10 mm. The laminated structure 49 protrudes upward from the lower groove 41 by about 1 mm in the thickness direction.

  After the laminated structure 49 is installed on the lower mold 31, the middle mold 33 is placed in the lower mold 31 and placed on the laminated structure 49. In this state, since the upper half of the middle mold 33 is exposed from the lower mold 31, the low-hardness unvulcanized silicon rubber strip 25 is placed in accordance with the mark line provided at the center of the exposed surface. In a state where the low-hardness unvulcanized silicone rubber strip 25 is placed on the middle mold 33, the low-hardness unvulcanized silicone rubber strip 25 does not cover all of the half-circle portion of the middle mold 33. At both ends, there is a portion that is not covered by the low-hardness unvulcanized silicon rubber strip 25 of about 5 mm.

The upper die 36 and the lower die 31 are combined by inserting the guide hole of the upper die 36 into the guide pin 45 erected on the lower die 31 with the low hardness unvulcanized silicon rubber strip 25 installed, and a heat press machine 27, and the upper die 36 is pressed against the lower die 31 with a predetermined pressure (150 kg / cm ² ) by the hydraulic cylinder 37.
In each strip 23, 25, unvulcanized silicone rubber flows by the action of pressure and heating, and the high-hardness unvulcanized silicone rubber strip 23 and the low-hardness unvulcanized silicone rubber strip 25 merge at both end faces. Moreover, the two high-hardness unvulcanized silicon rubber strips 23 having high hardness merge at the joint surface, and excess silicon rubber flows out from the vent 43.
Peroxide vulcanization occurs at the junction of the high-hardness unvulcanized silicone rubber strips 23 and the low-hardness unvulcanized silicone rubber strips 25, and the two adhere. In addition, the upper and lower high-hardness unvulcanized silicon rubber strips 23 are bonded to each other in the region excluding the inlet sealing body 1 on the joining surface of the two high-hardness unvulcanized silicone rubber strips 23. Is arranged approximately in the center in the thickness direction.
When heated in this state for 6 to 7 minutes, the vulcanization reaction is completed.

After completion of the vulcanization reaction, the press is opened, the upper die 36 is removed, and the middle die 33 is further removed. At this time, the wrist band 17 joined into a ring shape can be detached from the lower die 31 while being attached to the middle die 33.
Thereafter, after 1 to 1.5 days have elapsed, secondary vulcanization is performed at 180 ° C. for 1 hour.

For the wristband 17 molded as described above, (1) whether the operation of the inlet 8 is normally performed in the environment in which the wristband 17 is used, (2) the reliability of the IC chip 5 is the wristband 17 A confirmation test was conducted from the two viewpoints of whether or not the deterioration occurred due to the molding process.
Hereinafter, the test method and test results for this confirmation test will be described.

(1) Whether or not the operation of the inlet 8 is normally performed in the usage environment of the wristband 17 In this confirmation test, the wristband 17 is stretched and contracted. For the pulling method in this case, FIG. Two methods shown in FIG. The method shown in FIG. 7 is a method in which two bars are inserted into a different location from the location where the inlet sealing body 1 is sealed, and a tensile test is performed by separating or approaching them. In the method of FIG. 8, one of the two bar members is disposed at a place where the inlet sealing body 1 is enclosed, and the other one bar member is disposed at the opposite portion, and these two bar members are disposed. This is a method in which a tensile test is performed by separating or approaching the bar.
These two methods were performed in consideration of the fact that the influence on the inlet enclosure differs depending on the position of the point of action of the tensile force on the wristband 17.
Hereinafter, a specific test method will be described.

(i) Limit tensile test (test method)
While reading the information from the inlet 8, the wristband 17 is pulled at a constant speed, and the strength until the reading becomes impossible or the wristband 17 breaks is measured.
(Test results)
The above test was performed on three samples, and all samples could be read until breakage occurred.

(ii) Repeated tensile test (acceleration)
(Test method)
Stress is applied by repeatedly extending the wristband 17 by about twice, and the number of times of stress until the wristband 17 is broken or information cannot be read is measured. While reading, constant deformation is repeatedly applied with an automatic counting expansion / contraction device.
(Test results)
The above test was performed on three samples, and all samples could be read until breakage occurred.

(iii) Repeated tensile test (normal operating conditions)
(Test method)
The same level of stress as that when the wristband 17 is worn on the wrist is repeatedly applied, and the number of stresses at which the wristband 17 breaks or becomes unreadable is measured. While reading, constant deformation is repeatedly applied with an automatic counting expansion / contraction device. (4 times x 365 days x 3 years = Targeting about 5000 times or more, conducted up to 100,000 times)
(Test results)
The above test was performed on three samples, and in all the samples, the wristband 17 was not broken and reading was possible.

From the above test results, it was proved that the operation of the inlet 8 is normally performed in the use environment of the wristband 17.
This is because the thickness of the PEN film 11A on the side facing the IC chip 5 and the antenna 7 is increased, so that the IC chip 5 and the antenna 7 can be prevented from being damaged, and the silicon in the place where the inlet sealing body 1 is enclosed. This is presumably due to the effect of reducing the amount of deformation by increasing the thickness of rubber with a high hardness.

In addition, when a state where the inlet sealing body 1 in the wristband 17 after molding was sealed was cut and the state of the inlet sealing body 1 and silicon rubber was observed, the two were not welded and separated. It was possible.
Thus, when the wristband 17 is molded, the inlet sealing body 1 is not welded to the silicon rubber because the PEN film 11 covering the inlet sealing body 1 is excellent in heat resistance. Even when the wristband 17 is extended and deformed, the deformation is not directly transmitted to the inlet sealing body 1, and the effect of preventing damage to the IC chip 5 and the antenna 7 is enhanced.

(2) Regarding whether or not the reliability of the IC chip 5 has deteriorated through the molding process of the wristband 17 The following three test methods were performed <Test method>
(i) High-temperature standing test Leave at 125 ° C and take out every about 200 hours up to 1000 hours to check the readability.
(125 ° C, 1000 hours)
(ii) Constant-temperature and high-humidity test Leave at 85 ° C. and 85% RH, and take out every 200 hours up to 1000 hours to check the reading performance. (85 ° C, 85% RH, 1000 hours)
(iii) Cooling cycle--Repeat exposure to 55-125 ° C and check the reading performance about every 200 cycles up to 1000 cycles. (-55 to 125 ° C, 1000 cycles)
<Test results>
In any of the tests, there was no one that was readable and malfunctioned.
This proved that the inlet 8 did not deteriorate even after the molding process.

It is explanatory drawing of the inlet sealing body which concerns on one Embodiment of this invention. It is arrow AA sectional drawing of FIG. It is a perspective view of a wristband concerning one embodiment of the present invention. It is a side view of the wristband concerning one embodiment of the present invention. It is explanatory drawing of the manufacturing method of the wristband which concerns on one Embodiment to this invention. It is explanatory drawing of the hot press used for the manufacturing method of the wristband which concerns on one Embodiment of this invention. It is explanatory drawing of the test method of the wristband which concerns on one Embodiment of this invention. It is explanatory drawing of the test method of the wristband which concerns on one Embodiment of this invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inlet sealing body 3 PET film 5 IC chip 7 Antenna 8 Inlet 9 Double-sided tape 11 PEN film 11 APEN film 11 BPEN film 13 Polymer adhesive layer 15 A, 15B Low molecular adhesive layer 17 Wristband 19 High hardness silicon Rubber 21 Low hardness silicon rubber 23 High hardness unvulcanized silicone rubber strip 25 Low hardness unvulcanized silicone rubber strip 27 Heat press 29 Recess 31 Lower mold 33 Middle mold 35 Recess 37 Hydraulic cylinder 39 Body 41 Lower groove 43 Vent 45 Guide Pin 47 Upper groove 49 Laminated structure

Claims (7)

An inlet sealing body comprising: a PET film on which both sides of an inlet having an antenna and an IC chip mounted are sealed with a PEN film through an adhesive layer. The inlet sealing body according to claim 1, wherein the thickness of the PEN film provided on the surface side on which the antenna and the IC chip are mounted is made larger than the thickness of the PEN film provided on the other surface. A wristband formed by sealing the inlet sealing body according to claim 1 or 2 in silicon rubber. The wristband is made of ring-shaped silicon rubber, part of the ring is made of a low-hardness part made of low-hardness silicon rubber, and the other part of the ring is made of a high-hardness part made of high-hardness silicon rubber. The wristband according to claim 3, wherein the body is enclosed in the high hardness portion. A laminated structure in which an inlet sealing body is sandwiched between two high-hardness unvulcanized silicone rubber strips and one low-hardness unvulcanized silicone rubber strip is press-vulcanized to form a ring shape. The wristband according to claim 4, wherein 6. The wristband according to claim 4 or 5, wherein the thickness of the silicon rubber in the portion enclosing the inlet sealing body is increased. The wristband according to any one of claims 3 to 6, wherein the inlet sealing body is sealed so as to be separable from silicon rubber.

Images