JP2008275967A - Electro-optical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device in which a cell gap around a terminal outside a display region is kept uniform and cell gap unevenness inside the display region is reduced while a pair of substrates is pressurized for the purpose of bonding them to each other, and to provide electronic equipment. <P>SOLUTION: The electro-optical device is provided which has a pair of substrates holding an electro-optic material and has a display region, the electro-optical device is equipped with a spacer member for defining the cell gap between the pair of substrates in the display region, and has an electronic component mounting section 98 in a region where one of the pair of substrates does not overlap with the other. A plurality of terminals 18, a plurality of wires 11, 13 arranged between the plurality of terminals and extending from the display region, and a plurality of insulating cover members 15 to cover the wires arranged between the plurality of terminals are equipped in the electronic component mounting section, and protruding members 3 are equipped at positions where they do not overlap with at least the cover members and the terminals in the above region. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device and an electronic apparatus. In particular, the present invention relates to an electro-optical device having a cover member between terminals of an electronic component mounting portion or a flexible circuit board connecting portion, and an electronic apparatus having such an electro-optical device.

  Conventionally, as one aspect of an electro-optical device, a plurality of pixels are configured with electrodes facing each other, and light that passes through a liquid crystal material of the pixel is selectively turned on and off by applying a voltage applied to each pixel. A liquid crystal device that modulates and displays an image such as an image or a character is often used.

In such a liquid crystal device, a plurality of wirings are formed on the substrate. One end of these wirings is connected to a driving IC which is a semiconductor element mounted on the substrate, and the other end extends to the pixel region and is connected to an electrode. These wirings transmit the drive signal output from the driving IC to each electrode. By selectively outputting the drive signal to each electrode, each wiring is supplied to each pixel. In contrast, a voltage is selectively applied.
Here, in a region where the driving IC is mounted on the substrate, a terminal connected to the output terminal of the driving IC is formed. The terminal on the substrate and the output terminal of the driving IC are connected using an anisotropic conductive film (ACF).

  In recent years, in such a liquid crystal device, there has been a demand for high-definition display simultaneously with downsizing of the device, and an increase in the number of display pixels and miniaturization of pixels have been promoted. In order to meet such demands, it is essential to reduce the size and increase the number of output terminals in the driving IC. Therefore, the output terminals are provided in a plurality of rows on the active surface of the driving IC. A plurality of terminals may be formed at positions corresponding to the output terminals in the mounting area of the driving IC. When configured in this manner, a wiring extending from a terminal in another row is formed between adjacent terminals, so that the distance between the adjacent terminal and the wiring is close.

Therefore, an electro-optical device has been proposed that can perform stable display by accurately covering a thin wiring provided between narrow terminals with a cover material. More specifically, as shown in FIG. 13, a substrate 416b that supports an electro-optic material, a plurality of terminals 445 provided on the substrate 416b, wirings 433 and 435 formed between the terminals 445, and a wiring 433 An electro-optical device having a cover material 455 covering 435 is disclosed.
Japanese Patent Laying-Open No. 2006-58721 (full text, FIG. 5)

By the way, when manufacturing a liquid crystal device, a method of forming a plurality of liquid crystal panels by bonding large substrates having a plurality of substrate regions and then dividing each substrate region is employed. When laminating the large substrates, a sealing material is formed so as to surround the display area of each substrate area, and then pressed while being heated. In the display area, the cell gap is a distance between opposing substrates. The spacers are arranged so as to be kept uniform.
However, since the electro-optical device disclosed in Patent Document 1 is provided with a cover material that covers the wiring arranged between the terminals in the mounting region of the driving IC outside the display region, a pair of substrates is used for bonding with a sealing material. While the pressure is applied, there is a possibility that a difference in the held cell gap occurs between the mounting area of the driving IC and the area around the mounting area. When such a difference in cell gap occurs, it affects even the adjacent display area, and there is a possibility that the display gap is deteriorated due to unevenness of the cell gap in the display area.

In view of this, the inventors of the present invention have made diligent efforts, and in the electro-optical device provided with the cover member that covers the wiring between the terminals, the projection member is provided at least at a position that does not overlap the cover member and the terminal. The present invention has been completed by finding that it is possible to solve various problems.
That is, according to the present invention, an electro-optical device that can uniformly maintain a cell gap around a terminal outside the display area while applying pressure to bond a pair of substrates, and can reduce unevenness of the cell gap in the display area. The purpose is to provide. Another object of the present invention is to provide an electronic apparatus including such an electro-optical device.

According to the present invention, the electro-optical device includes a pair of substrates that sandwich the electro-optical material and has a display region, and includes a spacer member for defining a cell gap between the pair of substrates in the display region. The one of the pair of substrates has an electronic component mounting portion in a region that does not overlap the other substrate, and the electronic component mounting portion includes a plurality of terminals and a display region disposed between the plurality of terminals. A plurality of extending wirings and a plurality of insulating cover members covering the wirings arranged between the plurality of terminals, and a projecting member at a position that does not overlap at least the cover member and the terminals in a region that does not overlap. An electro-optical device characterized by this can be provided, and the above-described problems can be solved.
In other words, in a region where the pair of substrates do not overlap with each other, a cover member is provided between the terminals connected to the terminals of the electronic component, and a protruding member is also provided in a region other than the electronic component mounting portion, thereby providing a pair of substrates in the manufacturing stage. While the pressure is applied, the electronic component mounting portion and the surrounding cell gap are made uniform. Therefore, short-circuiting of terminals and wirings can be prevented, and unevenness of the cell gap in the display area can be reduced, so that deterioration of display quality can be prevented.

In configuring the electro-optical device of the present invention, it is preferable that the height position of the upper portion of the protrusion member is equal to or higher than the height position of the upper portion of the spacer member in the display area.
With this configuration, when the pair of substrates are bonded together, the electronic component mounting portion and the surrounding cell gap are held at a predetermined level or more, and the cell gap in the display region can be held.

In configuring the electro-optical device of the present invention, it is preferable that the protruding member is disposed on the edge side of the substrate.
With this configuration, it is possible to prevent the cell gap between the adjacent substrate region and the electronic component mounting portion from becoming narrow in the manufacturing stage, and to make the electronic component mounting portion and the surrounding cell gap uniform.

In configuring the electro-optical device according to the present invention, the plurality of cover members include a first cover member arranged along the arrangement direction of the plurality of wirings, and the protruding member is arranged in the arrangement direction of the first cover member. It is preferable that the 1st protrusion member arrange | positioned on an extension line is included.
With this configuration, the electronic component mounting portion and the surrounding cell gap can be maintained in a well-balanced manner in the manufacturing stage.

In configuring the electro-optical device of the present invention, the plurality of cover members include second cover members arranged in a plurality of rows, and the plurality of projecting members are arranged along an extension line in the arrangement direction of the second cover members. It is preferable to include a second protruding member.
With this configuration, even when the cover members are arranged in a plurality of rows, the electronic component mounting portion and the surrounding cell gap can be held in a balanced manner in the manufacturing stage.

In configuring the electro-optical device of the present invention, it is preferable that the upper surface height position of the cover member is equal to the upper surface height position of the protrusion member.
With this configuration, the electronic component mounting portion and the surrounding cell gap can be more uniformly maintained in the manufacturing stage.

In configuring the electro-optical device of the present invention, it is preferable that a region that does not overlap includes a plurality of wiring patterns including wiring, and the protruding member is disposed at a position that does not overlap with the plurality of wiring patterns.
By comprising in this way, a cover member or a protrusion member can be arrange | positioned with sufficient balance around an electronic component mounting part, and the electronic component mounting part and its surrounding cell gap can be hold | maintained uniformly.

Another aspect of the present invention is an electro-optical device that includes a pair of substrates for sandwiching an electro-optical material and has a display region, and a spacer for defining a cell gap between the pair of substrates in the display region. A flexible circuit board connecting portion in a region where one of the pair of substrates does not overlap the other substrate, and the flexible circuit board connecting portion includes a plurality of terminals and a plurality of terminals. A plurality of wirings extending from the arranged display area and a plurality of insulating cover members covering the wirings arranged between the plurality of terminals are provided, and at least do not overlap with the cover members and the terminals in the non-overlapping area. An electro-optical device including a protruding member at a position.
That is, in the flexible circuit board connecting portion in the region where the pair of substrates do not overlap, the cover member is provided between the terminals connected to the electrodes of the flexible circuit substrate, and the protrusion member is provided in the region other than the connection region, While the pair of substrates are being pressurized in the stage, the flexible circuit board connecting portion and the surrounding cell gap are made uniform. Accordingly, unevenness of the cell gap in the display area is reduced, and deterioration of display quality can be prevented.

Still another embodiment of the present invention is an electronic apparatus including any of the electro-optical devices described above.
In other words, the display quality is improved because the electro-optical device is provided with reduced cell gap unevenness within the display area due to the cell gap unevenness in the electronic component mounting portion or the flexible circuit board connecting portion when the substrates are bonded together. It can be set as the electronic device in which

Hereinafter, embodiments of the electro-optical device, the method for manufacturing the electro-optical device, and the electronic apparatus according to the present invention will be specifically described with reference to the drawings. However, this embodiment shows one aspect of the present invention and does not limit the present invention, and can be arbitrarily changed within the scope of the present invention.
In addition, what attached | subjected the same code | symbol in each figure has shown the same member, and while abbreviate | omitting description suitably, the one part member is abbreviate | omitted suitably in each figure.

[First Embodiment]
The first embodiment of the present invention is a liquid crystal device as an electro-optical device that includes a pair of substrates that sandwich an electro-optical material and has a display area.
The liquid crystal device according to the present embodiment includes a spacer member for defining a cell gap between a pair of substrates in a display region, and electronic components are mounted in a region where one of the pair of substrates does not overlap the other substrate. The electronic component mounting portion includes a plurality of terminals, a plurality of wirings extending from a display area disposed between the plurality of terminals, and a plurality of wirings covering the wiring disposed between the plurality of terminals. And an insulating cover member, and a protrusion member is provided at least in a region where the pair of substrates do not overlap with the cover member and the terminal.

1. Overall Configuration First, an overview of the overall configuration of the liquid crystal device 10 according to the first embodiment of the present invention will be described with reference to FIG.
FIG. 1 is a schematic perspective view of a liquid crystal device 10 according to the present embodiment. The liquid crystal device 10 of the present embodiment includes a liquid crystal panel 20 in which two substrates 30 and 60 each having electrodes are bonded together with a sealing material and a liquid crystal material is disposed in a cell region. This cell area has a display area A, and the upper surface in FIG. 1 is an image display surface.
An illumination device (not shown) is disposed on the back side of the image display surface A in the liquid crystal panel 20. The illumination device includes a light source and a light guide plate, and is configured such that light emitted from the light source is guided by the light guide plate and enters the liquid crystal panel.

  In addition, the element substrate 60 constituting the liquid crystal panel 20 has a substrate extending portion 60 </ b> T that protrudes outward from the outer shape of the counter substrate 30. A plurality of terminals (not shown) are formed on the surface of the substrate extension 60T that holds the liquid crystal material, and the semiconductor element 91 and the flexible circuit board 93 are connected to the plurality of terminals. Yes.

2. Liquid crystal panel As the liquid crystal panel 20, an active matrix type liquid crystal panel having a switching element such as a TFT element (Thin Film Transistor) or a TFD element (Thin Film Diode), or a passive matrix type liquid crystal having no switching element. Panels are typical. Among these, a configuration example of an active matrix type liquid crystal panel including a TFT element will be described.

  FIG. 2 is a partial enlarged cross-sectional view of each pixel region of the active matrix type liquid crystal panel 20 having TFT elements. As shown in FIG. 2, the liquid crystal panel 20 includes an element substrate 60 that includes a TFT element as a switching element, and a counter substrate 30 that faces the element substrate 60 and includes a color filter 37. A photo spacer 97 for defining a cell gap between the substrates is disposed between the counter substrate 30 and the element substrate 60. A polarizing plate 50 with a retardation film in which a retardation film 47 and a polarizing plate 49 are laminated is disposed on the outer surface (upper side in FIG. 2) of the counter substrate 30. Similarly, a polarizing plate 90 with a retardation film in which a retardation film 87 and a polarizing plate 89 are laminated is also disposed on the outer surface (lower side in FIG. 2) of the element substrate 60. The above-described lighting device (not shown) is disposed below the element substrate 60.

In the liquid crystal panel 20, the counter substrate 30 includes a color filter 37 composed of a plurality of colored layers 37 r, 37 g, and 37 b having different hues with a substrate 31 such as glass as a base, and a counter substrate 30 formed on the color filter 37. An electrode 33 and an alignment film 45 formed on the counter electrode 33 are provided. A transparent resin layer 41 is provided between the color filter 37 and the counter electrode 33 to optimize the retardation of each of the reflective region and the transmissive region.
Here, the counter electrode 33 is a planar electrode formed on the entire area of the counter substrate 30 with ITO (indium tin oxide) or the like. The color filter 37 includes a plurality of colored layers having hues of R (red), G (green), and B (blue), and pixel regions corresponding to the pixel electrodes 63 on the element substrate 60 facing each other are predetermined. It is provided so as to exhibit light of the hue. A light shielding film 39 is provided corresponding to a region corresponding to the gap between the pixel regions.
The alignment film 85 made of a polyimide-based polymer resin provided on the surface is subjected to a rubbing process as an alignment process.

Further, the element substrate 60 facing the counter substrate 30 is formed on a TFT element 69 as an active element functioning as a switching element, with a substrate 61 such as glass as a base, and a transparent insulating film 81 interposed therebetween. The pixel electrode 63 formed and an alignment film 85 formed on the pixel electrode 63 are provided.
Here, the pixel electrode 63 shown in FIG. 2 is formed as a light reflection film 79 (63a) for performing reflective display in the reflection region, and is formed as a transparent electrode 63b with ITO or the like in the transmission region. ing. The light reflecting film 79 as the pixel electrode 63a is formed of a light reflecting material such as Al (aluminum) or Ag (silver). However, the configuration of the pixel electrode and the light reflection film is not limited to the configuration as shown in FIG. 2, and the entire pixel electrode is formed using ITO or the like, and a reflection film using aluminum or the like as another member. It can also be set as the provided structure.
The alignment film 85 made of a polyimide-based polymer resin provided on the surface is subjected to a rubbing process as an alignment process.

The TFT element 69 includes a gate electrode 71 formed on the element substrate 60, a gate insulating film 72 formed on the entire area of the element substrate 60 on the gate electrode 71, and the gate insulating film 72 interposed therebetween. A semiconductor layer 70 formed above the gate electrode 71, a source electrode 73 formed on one side of the semiconductor layer 70 via a contact electrode 77, and a contact electrode 77 on the other side of the semiconductor layer 70. And a drain electrode 66 formed through the electrode.
The gate electrode 71 extends from the gate bus wiring (not shown), and the source electrode 73 extends from the source bus wiring (not shown). Further, a plurality of gate bus lines extend in the horizontal direction of the element substrate 60 and are formed in parallel in the vertical direction at equal intervals, and the source bus lines cross the gate bus lines with the gate insulating film 72 interposed therebetween. A plurality of lines extending in the vertical direction are formed in parallel in the horizontal direction at equal intervals.
Such a gate bus wiring is connected to a liquid crystal driving IC (not shown) and functions as, for example, a scanning line, while a source bus wiring is connected to another driving IC (not shown), for example, a signal line. Acts as
The pixel electrode 63 is formed in a region excluding a portion corresponding to the TFT element 69 in a rectangular region defined by the gate bus line and the source bus line intersecting each other. An area is configured.

Here, the gate bus wiring and the gate electrode can be formed of chromium, tantalum, or the like, for example. The gate insulating film is formed of, for example, silicon nitride (SiN _x ), silicon oxide (SiO _x ), or the like. Further, the semiconductor layer can be formed of, for example, doped a-Si, polycrystalline silicon, CdSe, or the like. Further, the contact electrode can be formed of, for example, a-Si, and the source electrode and the source bus wiring and the drain electrode integrated therewith can be formed of, for example, titanium, molybdenum, aluminum, or the like.

The organic insulating film 81 is formed over the entire area of the element substrate 60 so as to cover the gate bus lines, the source bus lines, and the TFT elements. However, a contact hole 83 is formed in a portion corresponding to the drain electrode 66 of the organic insulating film 81, and the pixel electrode 63 and the drain electrode 66 of the TFT element 69 are electrically connected at the contact hole 83.
In addition, in the organic insulating film 81, a resin film having a concavo-convex pattern composed of a regular or irregular repetitive pattern of peaks and valleys is formed as a scattering shape in a region corresponding to the reflective region R. Has been. As a result, the light reflection film 79 (63a) laminated on the organic insulating film 81 also has a light reflection pattern composed of an uneven pattern. However, this uneven pattern is not formed in the transmission region T.

In the liquid crystal panel having the above-described structure, external light such as sunlight and indoor illumination light enters the liquid crystal panel 20 from the counter substrate 30 side, and passes through the color filter 37 and the liquid crystal material 21 to reflect light. The film 79 reaches the film 79, is reflected there, passes through the liquid crystal material 21 and the color filter 37 again, and exits from the liquid crystal panel 20 to perform reflection display. On the other hand, the illuminating device is turned on, and light emitted from the illuminating device enters the liquid crystal panel 20, passes through the transparent electrode 63 b, and passes through the color filter 37, the liquid crystal material 21, and the like. Transparent display is performed by exiting 20.
Then, the light emitted from each pixel region is mixed and visually recognized, and various color displays are recognized as a color image as the entire display region.

3. Substrate Overhanging Unit Next, the configuration of the substrate overhanging unit 60T of the element substrate 60 constituting the liquid crystal device 10 of the present embodiment will be described in detail. 3 to 4 show an example of the configuration of the substrate extension 60T. FIG. 3A is a plan view of the substrate overhang portion 60T, and FIG. 3B is an enlarged plan view of the inside of a circle indicated by Y in FIG. 3A. FIG. 4 is a cross-sectional view of the XX cross section of FIG.

As shown in FIGS. 3 and 4, one end side of the gate bus wiring and the source bus wiring in the display area A is extended to the semiconductor element mounting portion 98 of the substrate overhanging portion 60 </ b> T of the element substrate. . These wirings are arranged in a stripe shape as a whole, and terminals 14 are formed near the ends of the wirings. These terminals 14 are electrically connected to output-side bump portions of the semiconductor element so that a drive signal from the semiconductor element is output.
Further, on the side farther from the display area A than the terminal 14, a terminal 18 to which the input-side bump portion of the semiconductor element is electrically connected and an external connection terminal 19 to which the electrode of the flexible circuit board is electrically connected. And are formed. The terminal 18 and the external connection terminal 19 are electrically connected by a connection wiring 67.

  Among these, the terminal 14 formed in the vicinity of the end of the gate bus line and the source bus line is wider than these lines. In the example of this embodiment, since the pitch interval of the wiring is narrowed, the terminals 14 are arranged in two rows in a staggered manner so that the terminals 14 do not contact each other even if the width of the terminals 14 is widened. Is formed. That is, the terminal 14a constitutes the first row L1, the terminal 14b constitutes the second row L2, and the terminals 14a and 14b are shifted so as not to overlap with each other in the wiring extending direction.

Among these, between the terminals 14a adjacent to each other in the first row L1, the wiring 11 corresponding to the terminals 14b in the second row L2 is arranged, while the terminals 14b adjacent to each other in the second row L2 are arranged. In the middle, wirings 13 corresponding to the terminals 14a of the first row L1 are arranged.
Further, the straight line portion 28 in which each wiring extends from the display area A beyond the second row L2 of the terminal 14 is formed in a stripe shape as a whole, and is used as a wiring inspection pad. ing.

  A cover member 15 made of an insulating material is formed between the terminals 14a and between the terminals 14b so as to cover the wirings 11 and 13 arranged between the terminals. In the example of FIG. 3 in which the terminals 14 are arranged in a staggered manner in two rows, the cover members 15 are also arranged in a staggered manner (see FIG. 3B). The cover member 15 is formed by a photolithography method using an insulating photosensitive resin material such as acrylic resin. As described above, the wirings 11 and 13 arranged between the terminals 14 are electrically insulated from the outside by the cover member 15, and when the semiconductor element is mounted using the ACF, the wirings of the terminals 14a and the wirings are formed. 11 and between the terminal 14b and the wiring 13 are prevented from occurring.

  Here, in the configuration example of the substrate extension 60T of the present embodiment shown in FIG. 3, the terminals 14 arranged in a staggered manner in two rows are arranged in a direction intersecting with the extending direction of the wirings 11 and 13. A band-shaped protruding member 1 is disposed on the edge side of the substrate on the extended line in the arrangement direction. The protruding members 1 are arranged with the width of the cover members 15 arranged in a staggered manner in two rows so as not to overlap the wiring pattern on the substrate. The protruding member 1 is formed by a photolithography method using an insulating photosensitive resin material such as an acrylic resin similarly to the cover member 15.

  In addition, in the example of FIG. 3A, in addition to the protrusion member 1 described above, the ends of the respective wirings 11 and 13 and the terminals 18 electrically connected to the input-side bumps of the semiconductor element are provided. A band-shaped projecting member 3 that passes through the region between them and extends in a direction intersecting with the extending direction of the wirings 11 and 13 is disposed. The projecting member 3 is configured such that a part of the region where the wiring pattern 12 and the alignment pattern 5 on the substrate are arranged is deleted and divided.

  In general, when manufacturing a liquid crystal panel, as shown in FIG. 5, two large substrates 30A and 60A each having a plurality of corresponding substrate regions 20a are bonded together with a sealing material 23, and then the primary break line 24 and The substrate region 20 a is divided along the secondary break line 26. When these two large-sized substrates 30A and 60A are bonded, they are heat-bonded, but if the cell gap varies within the display area after bonding, display irregularities are visible. Thus, a spacer member for holding the cell gap is disposed in the display area. Here, as shown in FIG. 3A, when the cover member 15 as described above is arranged on the semiconductor element mounting portion 98 outside the display area A, the cover member 15 attaches the large substrates 30A and 60A. It functions as a spacer for matching. On the other hand, since the cell gap cannot be maintained outside the semiconductor element mounting portion 98 where the cover member 15 is not disposed, the cell gap varies in the substrate extension portion 60T. As a result, the cell gap in the adjacent display area A is also affected, resulting in cell gap unevenness, which tends to cause display defects. However, if a photo spacer is also arranged outside the semiconductor element mounting portion 98 of the substrate overhanging portion 60T, cell gap unevenness in the substrate overhanging portion 60T can be reduced, and display defects can be made difficult to occur.

In the example of the substrate overhanging portion 60T shown in FIG. 3, the protruding members 1 are arranged with the widths of the two rows of the cover members 15 on the extended lines in the arrangement direction of the cover members 15 arranged in a staggered manner in two rows. Therefore, the design of the pattern mask used when forming the protruding member 1 is facilitated, and the pressure balance during thermocompression bonding is made uniform.
Further, since the projecting members 3 other than the projecting members 1 are also arranged, the pressure balance is made uniform in the entire substrate projecting portion 60T, and the cell gap does not vary.

FIG. 6 shows the state of interference fringes when the projecting members 1 and 3 are formed outside the semiconductor element mounting portion 98 in the substrate overhanging portion and when the protruding members 1 and 3 are not formed. FIG. 6A shows an example in which such protruding members are not formed, and FIG. 6B shows an example in which such protruding members 1 and 3 are formed.
In FIG. 6A in which no protruding member is formed, in the substrate overhanging portion 60T of the substrate region 20X, the cell gap is held by the cover member (not shown) in the semiconductor element mounting portion 98, while the semiconductor element Since the cell gap is not maintained outside the mounting part 98, interference fringes are disturbed in a region adjacent to the substrate region 20X in the display region A of the substrate region 20Y.
On the other hand, in FIG. 6B in which the protruding member is formed, the entire cell gap is made uniform by the cover member (not shown) and the photo spacers 1 and 3 in the substrate protruding portion 60T of the substrate region 20X. Therefore, the interference fringes are not disturbed as shown in FIG. 6A in the display area A of the substrate area 20Y.

In providing such a protruding member, it is preferable that the height position of the upper surface 15a of the cover member 15 is equal to the height position of the upper surface 1a of the protruding member 1 as shown in FIG. If configured in this way, the cell gap held by the cover member 15 and the protruding member 1 is made equal, and the variation in the cell gap in the substrate overhanging portion 60T is further reduced. In the example of FIG. 4, the height position of the upper surface 15a of the cover member 15 and the height position of the upper surface 1a of the photospacer 1 are equal and higher than the height position of the upper surface 14aa of the terminal 14a. Is formed.
That is, the color filter substrate facing the element substrate on which the semiconductor element is mounted has a colored layer formed in a region other than the display region in a large substrate state at the liquid crystal panel manufacturing stage, and the substrate surface is relatively It is in a flat state. Even when the colored layer is not provided in a region other than the display region, the substrate surface in the region corresponding to the substrate overhanging portion is in a relatively flat state. Therefore, if the height position of the upper surface 15a of the cover member 15 on the element substrate is equal to the height position of the upper surface 1a of the protruding member 1, the held cell gap is made uniform.

Further, it is preferable that the height positions of the upper surface 15a of the cover member 15 and the upper surface 1a of the photospacer 1 are equal to the height position of the upper surface of the spacer member arranged in the display area. With this configuration, cell gap variations are prevented over the entire large-sized substrate, and display defects due to cell gap variations in the display area are reduced.
Note that the spacer member disposed in the display region is also a photo spacer formed using an insulating photosensitive resin material, so that the cover member and the projecting member of the substrate extension portion, and the display member The spacer member can be formed in the same process.

4). Modifications The liquid crystal device according to the present embodiment can be variously modified in addition to the configuration described so far.
For example, in FIGS. 7A to 7B, the terminals 114 of the semiconductor element mounting portions 98 are not arranged in a staggered manner but are arranged in two rows, and are connected to the terminals 114b in the second row L2, and the first row L1. The wiring 111 arranged between the terminals 114a and the wiring 113 connected to the terminals 114a of the first row L1 and arranged between the terminals 114b of the second row L2 are covered with a single cover member 115, and the cover A configuration in which the protruding member 1 is disposed on the extended line in the arrangement direction of the members 115 with the same width as the cover member 115 is shown.

  Further, in FIG. 8, although the terminals 134 are arranged in two rows in a staggered manner, only the wiring 131 connected to the terminals 134b in the second row L2 further extends toward the side opposite to the display area A. The wiring 131 is disposed only between the terminals 134a of the first row L1. A cover member 135 is disposed so as to cover the wiring 131, and the cover members 135 are arranged in a line. In addition to this, the protruding member 1 is provided on the extended line in the arrangement direction of the cover member 135 with the same width as the cover member 135.

Further, it is not essential that the protruding member has a belt shape, and the protruding member may be divided and disposed as shown in FIG. 9A. Further, as shown in FIG. As long as it is a region that does not overlap the wiring, terminals, cover member, etc. formed in the overhanging portion, it may be arranged at any position.
However, in consideration of the pressure balance when heat-pressing a large-sized substrate, it is preferable that the substrate is arranged in a well-balanced area so as not to overlap the wiring, terminals, and cover member.

[Second Embodiment]
The second embodiment is a liquid crystal device similar to the first embodiment, and includes a spacer member for defining a cell gap between a pair of substrates in a display region, and the second embodiment includes: One substrate has a flexible circuit board connection portion in an area where it does not overlap the other substrate, and the flexible circuit board connection portion has a plurality of terminals and a plurality of wirings extending from a display area arranged between the plurality of terminals. And a plurality of insulating cover members that cover the wirings arranged between the plurality of terminals, and a protrusion member at least in a position that does not overlap the cover member and the terminal in a region that does not overlap. It is a liquid crystal device.
Hereinafter, the description will focus on the points different from the first embodiment, and the description of the points that can be configured in the same manner as the other first embodiments will be omitted.

1. Overall Configuration FIG. 10 is a schematic configuration diagram of a liquid crystal device 110 according to the present embodiment. Unlike the liquid crystal device according to the first embodiment, the liquid crystal device 110 according to the present embodiment has a substrate extension that protrudes outside the outer shape of the counter substrate 130 instead of mounting a semiconductor element on the element substrate 160. A flexible circuit board 193 is connected to the projecting portion 160T, and a semiconductor element 191 is mounted on the flexible circuit board 193.

2. Substrate Overhanging Part FIGS. 11A and 11B show an example of the configuration of the substrate overhanging part 160T of this embodiment. FIG. 11A is a plan view of the substrate overhang portion 160T, and FIG. 11B is an enlarged plan view of the inside of a circle indicated by Y in FIG. 11A.

  One end side of the gate bus wiring and the source bus wiring in the display area A is extended to the flexible circuit board connecting portion 99 of the substrate overhanging portion 160T of the element substrate. These wirings are arranged in a stripe shape as a whole, and terminals 174 are formed at the ends of the wirings. The electrodes of the flexible circuit board are electrically connected to these terminals 174 so that drive signals from the semiconductor elements are transmitted.

  The terminal 174 is wider than the wiring. In the example of this embodiment, since the pitch interval of the wiring is narrowed, the terminals 174 are arranged in two rows in a staggered manner so that the terminals 174 do not contact each other even if the width of the terminals 174 is widened. Is formed. That is, the terminal 174a constitutes the first row L1, the terminal 174b constitutes the second row L2, and the terminals 174a and 174b are shifted so as not to overlap with each other in the wiring extending direction. A wiring 171 corresponding to the terminal 174b of the second column L2 is arranged between the terminals 174a adjacent to each other in the first column L1.

  A cover member 175 is formed between the terminals 174a so as to cover the wiring 171 disposed between the terminals. The cover member 175 is arranged in a straight line, and the wiring 171 arranged between the terminals 174a is electrically insulated from the outside by the cover member 175, and when mounting the semiconductor element using the ACF, A short circuit is prevented from occurring between the terminal 174a and the wiring 171.

Here, in the configuration example of the substrate extension 160T of the present embodiment shown in FIG. 11, the terminals 174 arranged in two rows in a staggered manner are arranged in a direction intersecting with the extending direction of the wiring 171. A band-shaped protruding member 181 is arranged on the edge side of the substrate on the extended line in the arrangement direction. The protruding members 181 are arranged with the same width as the cover members 175 arranged in a straight line so as not to overlap with the wiring pattern on the substrate. Therefore, when a large substrate is bonded, cell gap unevenness in the substrate overhanging portion 160T is reduced, and display defects are less likely to occur.
The detailed configuration other than that described here can be the same as that described in the first embodiment.

[Third Embodiment]
The third embodiment of the present invention is a method for manufacturing the liquid crystal device described in the first embodiment or the second embodiment.
Hereinafter, an example including a step of forming a cover member on the electronic component mounting portion will be described.

1. Formation of counter substrate (color filter substrate) When forming a color filter substrate as a counter substrate, first, a photosensitive resin material is used for each substrate region of a glass substrate as a large substrate including a plurality of substrate regions. A colored layer and a light shielding film are formed by laminating various members by a conventional photolithography method or the like. Next, after laminating a transparent conductive film such as ITO by a sputtering method or the like, a photoetching process is performed to form a counter electrode over the entire display region. Further, an alignment film made of polyimide is formed on the substrate surface on which the counter electrode is formed. In this way, a large color filter substrate on which various resin films and conductive films are formed is formed.

2. Manufacturing of Element Substrate When forming an element substrate, first, a TFT element, a wiring pattern, and a terminal are simultaneously formed in each substrate region of a glass substrate as a large substrate including a plurality of substrate regions. At this time, in the electronic component mounting portion, as shown in FIG. 3B, the wiring 11 is formed between the terminals 14a adjacent to each other constituting the first row L1. One end of the wiring 11 extends inside the display area A and is connected to the TFT element, the other end is connected to the terminal 14b, and further extends to the inspection pad. Further, the wiring 13 is formed between the terminals 14b adjacent to each other constituting the second row L2. One end of the wiring 13 is connected to the terminal 14a, further extends inward of the display area A and connected to the TFT element, and the other end extends to the inspection pad.

  Next, after laminating a transparent conductive film such as ITO, an etching process or the like is performed to form pixel electrodes in a matrix in the display region. Further, after forming an insulating film, an alignment film made of polyimide is formed.

Next, after laminating an insulating and photosensitive transparent resin material, exposure and development are performed through a pattern mask, so that a photo spacer is formed in the display area, and a substrate overhanging portion outside the display area is covered. A member and a protruding member are formed. As shown in FIG. 3B, the cover member is formed so as to cover the wirings 11 and 13 arranged between the terminals 14a and 14b of the mounting portion 98 of the semiconductor element, and is arranged in a staggered manner as a whole. . Further, the projecting members 1 and 3 are a strip-shaped projecting member 1 arranged with the width of the cover member 15 on the extended line of the cover member 15 arranged in a staggered manner in two rows, and an output side bump of the semiconductor element. A band-shaped projecting member 3 passing through a region between the terminal 14 connected to the terminal and the terminal 18 connected to the input-side bump of the semiconductor element and extending in a direction intersecting with the extending direction of the wirings 11 and 13; Contains.
At this time, for example, the height position of the substrate surface on the counter substrate side is taken into consideration by using a halftone mask having different light transmittance for each region, or by performing multiple exposures by changing the mask pattern. The photo spacers in the display area, the cover members outside the display area, and the protruding members are formed so that the height of the upper surface is maintained so that the cell gap at each position is maintained.

3. Next, after a sealing material is formed so as to surround the display region of each substrate region in at least one of a large counter substrate and a large element substrate, the two substrates are joined and thermocompression bonded. .
In this embodiment, the photo spacers in the display area, the cover members outside the display area, and the projection members maintain each substrate flat across the entire large substrate, and the cell gap in the display area is less likely to vary. ing.

4). Next, the bonded large-sized substrate is cut along a primary break line to form a plurality of strip-shaped substrates including a plurality of cell structures arranged in a line. At this time, the liquid crystal material injection holes in the respective substrate regions are arranged in a row so as to be exposed to the outside. Next, after injecting the liquid crystal material into the cells of each substrate region from the injection port of the liquid crystal material, the liquid crystal material is cut along the secondary break lines to form a plurality of liquid crystal panels.
Note that, in this embodiment, an example of liquid crystal injection by a vacuum injection method is described. However, even in an arrangement method in which a liquid crystal material is dropped on an inner region of a formed sealing material before a large substrate is bonded. I do not care.

5. Assembly Next, after mounting an electronic component such as a semiconductor element or connecting a flexible circuit board, a liquid crystal device can be manufactured by incorporating it into a housing together with a lighting device.
If the liquid crystal device is manufactured as described above, the variation in the cell gap in the display region is reduced, and a liquid crystal device in which the deterioration in display quality is reduced can be obtained.

[Fourth Embodiment]
As a fourth embodiment according to the present invention, an electronic apparatus including the liquid crystal device according to the first embodiment or the second embodiment will be specifically described.

FIG. 12 is a schematic configuration diagram showing the overall configuration of the electronic apparatus of the present embodiment. The electronic apparatus includes a liquid crystal panel 20 provided in the liquid crystal device and a control unit 200 for controlling the liquid crystal panel 20. In FIG. 12, the liquid crystal panel 20 is conceptually divided into a panel structure 20A and a drive circuit 20B composed of a semiconductor element (IC) or the like. The control means 200 preferably includes a display information output source 201, a display processing circuit 202, a power supply circuit 203, and a timing generator 204.
The display information output source 201 includes a memory composed of a ROM (Read Only Memory), a RAM (Random Access Memory), etc., a storage unit composed of a magnetic recording disk, an optical recording disk, etc., and a tuning that outputs a digital image signal in a synchronized manner. It is preferable that the display information is supplied to the display processing circuit 202 in the form of an image signal or the like of a predetermined format based on various clock signals generated by the timing generator 204.

The display processing circuit 202 includes various well-known circuits such as a serial-parallel conversion circuit, an amplification / inversion circuit, a rotation circuit, a gamma correction circuit, and a clamp circuit, and executes processing of input display information to display the image. Information is preferably supplied to the driving circuit 20b together with the clock signal CLK. Furthermore, the drive circuit 20b preferably includes a first electrode drive circuit, a second electrode drive circuit, and an inspection circuit. Further, the power supply circuit 203 has a function of supplying a predetermined voltage to each of the above-described components.
And if it is an electronic device of this embodiment, in order to provide a cover member between the terminals of an electronic component mounting part or a flexible circuit board connection part, and to provide a predetermined projection member in the other area, It is possible to provide an electronic device in which a short circuit with the wiring is prevented and display defects due to uneven cell gap are reduced.

  According to the present invention, it is possible to provide an electro-optical device and an electronic apparatus in which a short circuit between a terminal or an electrode and a wiring is prevented and display defects due to cell gap unevenness are reduced. Therefore, for example, mobile phones and personal computers, liquid crystal televisions, viewfinder type / monitor direct-view type video tape recorders, car navigation devices, pagers, electronic notebooks, calculators, word processors, workstations, videophones, POS terminals It can be widely applied to electronic devices equipped with a touch panel.

1 is a schematic perspective view of a liquid crystal device according to a first embodiment. It is a schematic sectional drawing of the pixel area | region part of the liquid crystal device concerning 1st Embodiment. It is a top view which shows the structural example of the board | substrate overhang | projection part in the liquid crystal device of 1st Embodiment. It is sectional drawing which shows the structural example of a board | substrate overhang | projection part. It is a figure for demonstrating the manufacturing method of a liquid crystal panel. It is a figure for demonstrating cell gap nonuniformity. It is a top view which shows the modification of a structure of a board | substrate overhang | projection part. It is a top view which shows another modification of the structure of a board | substrate extension part. It is a top view which shows another modification of the structure of a board | substrate overhang | projection part. It is a schematic perspective view of the liquid crystal device concerning 2nd Embodiment. It is a top view which shows the structural example of the board | substrate extension part in the liquid crystal device of 2nd Embodiment. It is a block diagram which shows schematic structure of the electronic device of 4th Embodiment. It is a figure which shows the structure of the conventional electronic component mounting part.

Explanation of symbols

1: protrusion member (first protrusion member), 1a: upper surface of the protrusion member, 3: protrusion member (second protrusion member), 5: alignment mark, 10: liquid crystal device (electro-optical device), 11 and 13: Wiring, 14: Terminal, 14a: Terminal in the first row, 14b: Terminal in the second row, 15: Cover member, 15a: Upper surface of the cover member, 18: Terminal, 19: Terminal for external connection, 20: Liquid crystal Panel, 20a, 20X, 20Y: substrate region, 21: liquid crystal material, 23: sealing material, 26: semiconductor mounting region, 30: color filter substrate, 30A: large substrate, 31: glass substrate, 33: planar electrode (opposite Electrode), 37: colored layer, 41: resin layer, 45: alignment film, 60: element substrate (substrate for electro-optical device), 60A: large substrate, 60T: substrate overhanging part, 61: glass substrate, 63: pixel Electrode, 65: Gate bus wiring 66: Source bus wiring, 67: Connection wiring, 69: TFT element, 75: Alignment film, 91: Semiconductor element, 93: Flexible circuit board, 97: Photo spacer, 98: Semiconductor element mounting part, 99: Flexible circuit board connection 110, liquid crystal device, 111, 113: wiring, 114: terminal, 114a: first row terminal, 114b: second row terminal, 115: cover member, 130: color filter substrate, 131, 133: Wiring, 134: Terminal, 134a: First row of terminals, 134b: Second row of terminals, 135: Cover member, 160: Element substrate, 160T: Substrate overhanging portion, 171, 173: Wiring, 174: Terminal 174a: first row terminal, 174b: second row terminal, 175: cover member, 181: protrusion member, 191: semiconductor element, 193: flexible Road board

Claims (9)

In an electro-optical device comprising a pair of substrates for sandwiching an electro-optical material and having a display area,
A spacer member for defining a cell gap between the pair of substrates in the display region; and an electronic component mounting portion in a region where one of the pair of substrates does not overlap the other substrate,
The electronic component mounting portion includes a plurality of terminals, a plurality of wirings extending from the display area disposed between the plurality of terminals, and a plurality of insulations covering the wirings disposed between the plurality of terminals. And a cover member of
An electro-optical device comprising: a protrusion member at a position that does not overlap at least the cover member and the terminal in the non-overlapping region.   The electro-optical device according to claim 1, wherein a height position of an upper portion of the projecting member is equal to or higher than a height position of an upper portion of the spacer member in the display area.   The electro-optical device according to claim 1, wherein the protruding member is disposed on an edge side of the substrate.   The plurality of cover members include a first cover member arranged along the arrangement direction of the plurality of wirings, and the protrusion member is arranged on an extension line in the arrangement direction of the first cover member. The electro-optical device according to claim 1, further comprising a protruding member.   The plurality of cover members include second cover members arranged in a plurality of rows, and the projection member includes a plurality of second projection members arranged along an extension line in the arrangement direction of the second cover members. The electro-optical device according to claim 4.   The electro-optical device according to claim 1, wherein an upper surface height position of the cover member is equal to an upper surface height position of the protruding member.   The plurality of wiring patterns including the wiring are provided in the non-overlapping region, and the projecting member is disposed at a position that does not overlap the plurality of wiring patterns. The electro-optical device described. In an electro-optical device comprising a pair of substrates for sandwiching an electro-optical material and having a display area,
A spacer member for defining a cell gap between the pair of substrates in the display region is provided, and a flexible circuit board connecting portion is provided in a region where one of the pair of substrates does not overlap the other substrate. ,
The flexible circuit board connecting portion includes a plurality of terminals, a plurality of wirings extending from the display area disposed between the plurality of terminals, and a plurality of wirings covering the wirings disposed between the plurality of terminals. An insulating cover member, and
An electro-optical device comprising: a protrusion member at a position that does not overlap at least the cover member and the terminal in the non-overlapping region.   An electronic apparatus comprising the electro-optical device according to claim 1.

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