JP2008262160A - Electro-optical device and method for manufacturing electro-optical device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device having high durability with respect to impacts or loads and high reliability, and to provide a method for manufacturing the electro-optical device. <P>SOLUTION: The electro-optical device has a structure of a pair of substrates (10, 20) laminated to mutually face each other, wherein a coating film, consisting of a resin coating layer (13, 23) comprising polyurethane or polyester and a silicon-based coating layer (12, 22) as a hard coat layer constituted of a silicon-based material is formed on the surface of the pair of substrates in an opposite side to the surfaces that mutually face. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an electro-optical device configured using a light-transmitting substrate and a method for manufacturing the electro-optical device.

  Conventionally, a display device such as a liquid crystal display device is known as an electro-optical device. For example, a liquid crystal display device is configured by bonding a pair of glass substrates. Display devices such as liquid crystal display devices are widely used by being mounted on portable electronic devices such as mobile phones. In particular, in a display device of a portable electronic device, it is important to protect the display screen. For example, a transparent resin as disclosed in Patent Document 1 is often applied on the display screen.

Japanese Patent No. 2793681

  By the way, in recent years, with the demand for downsizing and thinning of electronic devices in the market, there is a tendency to thin the display device by reducing the thickness of the glass substrate. Thus, when the glass substrate which comprises a display apparatus is made thin, since the intensity | strength of a glass substrate falls dramatically, possibility that a display apparatus will be damaged by the impact by a drop and the bending load by a press becomes high.

  SUMMARY An advantage of some aspects of the invention is that it provides a highly reliable electro-optical device and a method for manufacturing the electro-optical device that have high durability against impacts and loads.

  The electro-optical device according to the present invention is an electro-optical device configured using a light-transmitting substrate, and is formed on at least one surface of the substrate and includes a silicon-based material. It is characterized by comprising a layer.

  The electro-optical device manufacturing method according to the present invention is a method for manufacturing an electro-optical device using a light-transmitting substrate, and includes a silicon-based material on at least one surface of the substrate. And a step of forming a hard coat layer comprising:

  According to such a configuration of the present invention, the hard coating layer is formed on the surface of the substrate, so that an electro-optical device that does not cause scratches as a starting point of cracking of the substrate and is less likely to be damaged by dropping or loading. It becomes possible to provide.

  The substrate is preferably a glass substrate.

  According to such a configuration, it is possible to provide an electro-optical device in which a glass substrate that is likely to be cracked starting from a scratch on the surface is less likely to be damaged by dropping or loading.

  Moreover, it is preferable to provide the resin coat layer interposed between the said hard-coat layer and the said board | substrate.

  In addition, prior to the step of forming the hard coat layer, it is preferable to include a step of forming a resin coat layer on at least one surface of the substrate.

  According to such a configuration, since the resin coat layer disperses, absorbs, or alleviates the impact applied to the electro-optical device from the outside, an electro-optical device having higher durability against impact and load and higher reliability is provided. It becomes possible to do.

  Further, it is preferable that a pair of the substrates is used and liquid crystal molecules are sandwiched between the pair of substrates.

  Further, the hard coat layer is formed on both surfaces of the pair of substrates opposite to the side where the liquid crystal molecules are sandwiched, and a polarizing plate is disposed outside the hard coat layer. Preferably it is.

  According to such a configuration, it is possible to provide an electro-optical device in which liquid crystal molecules are sandwiched between a pair of substrates that are unlikely to be damaged by dropping or loading.

  The substrate is used for a touch panel with an input function, and preferably includes the touch panel.

  According to such a configuration, it is possible to provide an electro-optical device including a touch panel that is less likely to be damaged due to dropping or load.

  The hard coat layer is preferably formed by a dipping method.

  According to such a configuration, it is possible to form hard coat layers on both sides of the electro-optical device at a time, so that it is possible to efficiently manufacture a highly reliable electro-optical device.

  The hard coat layer is preferably formed by a spin coat method.

  According to such a configuration, it is possible to individually control the film thicknesses of the hard coat layers formed on both surfaces of the electro-optical device. Therefore, by adapting the film thickness of the hard coat layer to the usage pattern of the electro-optical device, it is possible to manufacture an electro-optical device with higher durability and higher reliability.

(First embodiment)
Hereinafter, a first embodiment of the present invention will be described with reference to the drawings, taking a transmissive liquid crystal panel as an example of an electro-optical device as an example. FIG. 1 is a perspective view of an electro-optical device. 2 is a cross-sectional view taken along the line II-II in FIG.

  As shown in FIGS. 1 and 2, the electro-optical device 1 according to this embodiment includes a TFT substrate 10 and a counter substrate 20, which are a pair of substrates made of translucent glass, quartz, resin, and the like. A liquid crystal 41 that is an electro-optic material is sandwiched between the two. The electro-optical device 1 is a device that changes the orientation of the liquid crystal 41 based on an image signal input from an external device (not shown) that is electrically connected, and modulates light transmitted through the image display region 1a according to the image signal. It is.

  The TFT substrate 10 and the counter substrate 20 are each a rectangular flat plate in plan view, and are bonded together with a frame-shaped sealing material 40 at a predetermined interval. A liquid crystal 41 is sealed in a region surrounded by both substrates and the sealing material 40.

  In the image display area 1a on the surface of the TFT substrate 10 on the counter substrate 20 side, a plurality of scanning lines and data lines arranged to cross each other, and corresponding to the intersections of the scanning lines and the data lines are provided. A laminated structure 11 such as a pixel electrode and a thin film transistor for switching the pixel electrode is formed. On the other hand, in the image display region 1a on the surface of the counter substrate 20 on the TFT substrate 10 side, a laminated structure 21 such as a color filter provided corresponding to the common electrode or the pixel electrode is formed.

  The TFT substrate 10 is formed larger than the counter substrate 20, and the TFT substrate 10 extends in one direction from the counter substrate 20 in a state where the electro-optical device 1 is viewed from the side of the counter substrate 20. 42.

  A plurality of mounting terminals 32 are formed on the surface of the overhanging portion 42 of the TFT substrate 10 on the counter substrate 20 side. On the mounting terminals 32, a driver IC 30 as a driving circuit and a flexible wiring board (hereinafter referred to as FPC). (Referred to as “Flexible Printed Circuit”) 31 is implemented. The driver IC 30 is electrically connected to an external device via the FPC 31. The driver IC 30 may be mounted on the FPC 31.

  The scanning lines and data lines formed on the TFT substrate 10 are electrically connected to the driver IC 30. The driver IC 30 converts the scanning lines and data lines to the scanning lines and data lines at a predetermined timing in accordance with an image signal supplied from an external device. The electro-optical device 1 is driven by supplying a signal.

  Films 14 and 24 are formed on the surface of the TFT substrate 10 opposite to the counter substrate 20 and on the surface of the counter substrate 20 opposite to the TFT substrate 10, respectively. That is, the electro-optical device 1 of the present embodiment is configured by bonding a TFT substrate 10 as a first substrate and a counter substrate 20 as a second substrate, and has a coating 14 and a coating 14 on the surface thereof. 24 is formed. Further, polarizing plates 15 and 25 are attached to the respective surfaces of the coatings 14 and 24.

  The coatings 14 and 24 both have the same structure consisting of two layers, and the resin coating layers 13 and 23 formed on the side (lower layer side) in contact with the TFT substrate 10 and the counter substrate 20, and the upper layers thereof That is, it is composed of the silicon-based coat layers 12 and 22 formed on the outermost surface.

  The resin coat layers 13 and 23 are transparent thin films made of a resin such as polyester or polyurethane, and have a film thickness of approximately 0.1 μm to 10 μm. In the present embodiment, the resin coat layers 13 and 23 have a film thickness of 1 μm.

On the other hand, the silicon-based coating layers 12 and 22 are so-called hard coating layers made of a silicon-based material, which are transparent and hard thin films in which silica (SiO ₂ ) fine particles are dispersed in a binder. The film thickness of the silicon-based coat layers 12 and 22 is about 0.1 μm to 10 μm, and in this embodiment, 1 μm. The silicon-based coating layers 12 and 22 are formed by applying and baking a liquid containing a silica-based fine particle, a resin, a binder made of an organic silicon compound, a surfactant, and other additives.

  The electro-optical device 1 according to the present embodiment described above has, on its surface, a coating 14 formed of resin coat layers 13 and 23 made of a resin such as polyester and polyurethane, and silicon coat layers 12 and 22 made of a silicon-based material, and 24.

  Here, the resin coat layers 13 and 23 have an effect of dispersing, absorbing or mitigating the impact applied to the electro-optical device 1 from the outside due to its elasticity. Further, since the silicon-based coating layers 12 and 22 are hard coatings, they have an effect of improving the scratch resistance of the surface of the electro-optical device 1.

  Therefore, the electro-optical device 1 according to the present embodiment has the silicon-based coating layers 12 and 22 formed on the surface thereof, so that no scratches are generated as a starting point for cracking of the substrate made of glass or the like. Since the layers 13 and 23 are formed, the impact applied from the outside is relieved, so that the layer has high impact resistance. That is, according to the present embodiment, it is possible to provide an electro-optical device that is less likely to be damaged due to dropping or load.

  Note that the TFT substrate 10 and the counter substrate 20 constituting the electro-optical device 1 made of glass are particularly susceptible to cracking due to the presence of scratches on the surface. Therefore, in the above-described embodiment, a film composed of two layers of the resin coat layer and the silicon-based coat layer is formed on the surface of the electro-optical device 1. However, the scratch resistance of the surface of the electro-optical device 1 is improved. Even when only the silicon-based coating layer is formed, the impact resistance of the electro-optical device 1 is improved.

  In the above-described embodiment, the coatings 14 and 24 are formed on both surfaces of the electro-optical device 1, but the same effect is obtained even when the coating 24 is formed only on one side, for example, the counter substrate 20 side. Is.

  Next, a method for manufacturing the above-described electro-optical device, particularly a method for forming the coatings 14 and 24 will be described below. FIG. 3 is a flowchart illustrating a method for manufacturing the electro-optical device according to the present embodiment. FIG. 4 is a diagram for explaining the bonding of the two mother substrates 51 and 52 constituting the plurality of electro-optical devices 1. Since the manufacturing method of the electro-optical device other than the method of forming the coating films 14 and 24 is well known, the description thereof will be omitted or briefly described.

  In the present embodiment, the electro-optical device is manufactured by so-called multiple chamfering, in which a plurality of electro-optical device substrates are cut out from a single mother substrate. This mother substrate has translucency.

  First, on the mother substrate 51 as shown in FIG. 4, the laminated structure 11 is formed in each of a plurality of TFT substrate forming regions 10a that will later become the TFT substrate 10 (step S1). As described above, the laminated structure 11 includes data lines, scanning lines, TFTs, pixel electrodes, and the like, and is formed by, for example, film formation by CVD or sputtering, patterning by photolithography, heat treatment, or the like.

  On the other hand, on the mother substrate 52, the laminated structure 21 is formed in each of the plurality of counter substrate forming regions 20a that will later become the counter substrate 20 (step S3). The laminated structure 21 includes a common electrode, a color filter, a black matrix, and the like, and is formed by, for example, film formation by CVD or sputtering, patterning by photolithography, heat treatment, or the like.

  Next, a frame-shaped sealing material 40 provided corresponding to the formation regions (10a, 20a) of the individual electro-optical devices on one opposing surface of the mother substrates 51 and 52, and a plurality of electro-optical devices. A frame-like sealing material 53 provided on the outer periphery of the mother substrate is formed so as to surround the formation region and prevent the solution from entering between the mother substrates in the subsequent film forming process (step S2). In the present embodiment, the sealing materials 40 and 53 are formed on the mother substrate 51.

  Then, in a vacuum atmosphere, a predetermined amount of liquid crystal 41 is dropped on the mother substrate 51 and surrounded by the sealing material 40, and the mother substrates 51 and 52 are set in a predetermined manner via the sealing materials 40 and 53. Position and bond together (step S4). As a result, an aggregate in which a plurality of structures that will later become the electro-optical device 1 is formed is created.

  Next, the mother substrates 51 and 52 bonded in step S4 are thinned by a substrate etching process (step S5). The etching process in the substrate etching process is performed by, for example, using an etching solution based on hydrofluoric acid for the mother substrates 51 and 52 using glass and immersing the mother substrates 51 and 52 in the etching solution. The mother substrates 51 and 52 are chemically etched from the outer surface exposed to the etching solution and gradually become thinner. Since the etching amount is determined by the etching time, the thicknesses of the mother substrates 51 and 52 to be obtained by appropriately setting the etching time, in other words, the etching processing amount can be determined.

  As a thinning method, in addition to a chemical method of immersing in an etching solution, a physical method of polishing the substrate surface is well known. Either method may be used to make the mother substrates 51 and 52 thinner, but in this embodiment, a chemical method of immersing in an etching solution is used. According to this method, there is an advantage that the substrate surface is easily flattened as compared with the physical method. Further, by thinning the substrate at this stage, it is possible to remove fine scratches generated up to this stage.

  Next, resin coat layers 13 and 23 are formed on the surface of the aggregate (step S6). Specifically, the aggregate is dipped in a solution containing polyester or polyurethane, and the solution is applied on the surface of the aggregate by pulling up at a predetermined speed, and then dried on the surface of the aggregate. The resin coat layers 13 and 23 having a predetermined film thickness are formed of polyester or polyurethane. At this time, the surface of the mother substrates 51 and 52 that have undergone various manufacturing processes, including scratches that could not be completely eliminated in step S5, have been damaged due to contact with the support base, etc. There is. However, by forming the resin coat layers 13 and 23, it is possible to fill the scratches generated on the surfaces of the mother substrates 51 and 52. Therefore, it is possible to prevent the damage caused by this scratch in the subsequent process.

  Next, silicon-based coat layers 12 and 22 are formed on the resin coat layers 13 and 23 (step S7). Specifically, the silica-based fine particles are dispersed, and the aggregate is immersed in a solution containing a resin, a binder composed of an organosilicon compound, a surfactant, and other additives, and pulled up at a predetermined speed. The solution is applied on the resin coat layers 13 and 23. The silicon coating layers 12 and 22 are formed on the resin coating layers 13 and 23 by baking the solution. When the substrate is divided, which will be described later, the divided glass powder or the like is scattered, and the glass powder may cause scratches on the surfaces of the mother substrates 51 and 52. However, by forming the silicon-based coating layers 12 and 22, the surface of the mother substrates 51 and 52 can be guarded even if glass powder scatters during the subsequent cutting process, thus preventing the occurrence of scratches. can do.

  Next, the electro-optical device 1 formed by bonding the pair of TFT substrates 10 and the counter substrate 20 is cut into individual pieces by cutting the assembly formed by bonding the pair of mother substrates 51 and 52 to each other (step) S8).

  At this time, since the mother substrates 51 and 52 are bonded to each other at the outer peripheral portion by the sealing material 53, the coatings 14 and 24 are not formed on the overhanging portion 42 of the electro-optical device 1. The driver IC 30 and the FPC 31 are mounted on the mounting terminal 32 of the projecting portion 42, and the polarizing plates 15 and 25 are attached to the coating films 14 and 24 formed on the surface of the electro-optical device 1, respectively. The electro-optical device 1 shown in FIG. 4 is completed (step S9).

  In the electro-optical device manufacturing method described above, the coatings 14 and 24 are formed on the surface of the electro-optical device before it is cut out from the mother substrate. For this reason, glass powder is generated, and in the cutting process, which is a process in which the surface is easily damaged by this glass powder, a hard and highly scratch-resistant silicon-based coating layer has already been formed on the surface of the mother substrate. Thus, it is possible to prevent the occurrence of defects that cause scratches on the surface of the electro-optical device 1 in the cutting process.

  In the above-described embodiment, the coatings 14 and 24 are formed by a so-called dipping method. However, the coatings are formed by other known methods such as a spin coating method and a spray coating method. It may be a thing. For example, when a film is formed by a spin coating method, the film thickness can be different between the TFT substrate side and the counter substrate side, and the durability is further optimized in accordance with the use state of the electro-optical device. It is possible.

  In the above-described embodiment, the coatings 14 and 24 are described as being formed on the surface of the TFT substrate 10 opposite to the counter substrate 20 and on the surface of the counter substrate 20 opposite to the TFT substrate 10. However, it is not limited to this. The coatings 14 and 24 are formed on the surface of the TFT substrate 10 on the counter substrate 20 side and on the surface of the counter substrate 20 on the TFT substrate 10 side, or any one of the four surfaces described above. Even the structure formed in the above has the same effect.

(Second Embodiment)
Below, the 2nd Embodiment of this invention is described with reference to FIG.5 and FIG.6. This embodiment differs from the first embodiment only in a part of the method for manufacturing the electro-optical device 1. Therefore, only this difference will be described below, and the same components as those in the first embodiment are denoted by the same reference numerals, and the description thereof will be omitted as appropriate.

  FIG. 5 is a flowchart illustrating a method for manufacturing the electro-optical device according to the present embodiment. As shown in FIG. 5, the manufacturing method of the electro-optical device according to this embodiment is the same as that of the first embodiment until Step S4, that is, to obtain an assembly in which the liquid crystal 41 is sealed.

  In the present embodiment, after the assembly is formed, the electro-optical device is first cut into pieces (step S15). Then, the driver IC 30 and the FPC 31 are mounted on the mounting terminal 32 of the protruding portion 42 of each cut out electro-optical device 1 (step S16).

  Next, resin coat layers 13 and 23 are formed on the surface of each electro-optical device 1 (step S17). Specifically, the electro-optical device 1 is immersed in a solution containing polyester or polyurethane, the solution is applied on the surface of the electro-optical device 1 by pulling it up at a predetermined speed, and the solution is dried to dry the electro-optical device 1. Resin coat layers 13 and 23 made of polyester or polyurethane having a predetermined thickness are formed on the surface of optical device 1. At this time, the terminal portion of the FPC 31 that is not connected to the mounting terminal 32 is not immersed in the solution or masked so that the resin coat layers 13 and 23 are not formed.

  Next, silicon-based coat layers 12 and 22 are formed on the resin coat layers 13 and 23 (step S18). Specifically, the electro-optical device 1 is immersed in a solution containing silica-based fine particles dispersed and containing a resin, a binder made of an organosilicon compound, a surfactant, and other additives, and pulled up at a predetermined speed. Thus, the solution is applied onto the resin coat layers 13 and 23. The silicon coating layers 12 and 22 are formed on the resin coating layers 13 and 23 by baking the solution. Similarly, the terminal portion of the FPC 31 that is not connected to the mounting terminal 32 is not immersed in the solution or masked so that the resin coat layers 13 and 23 are not formed.

  Thus, the coatings 14 and 24 are formed on the surface of the electro-optical device 1, and the electro-optical device 1 is completed.

  According to the present embodiment, as shown in FIG. 6, the coating 24 is formed on the driver IC 30 after being mounted. For this reason, the driver IC 30 is sealed with the coating 24, and a molding for sealing the driver IC 30 is not required.

  In the present embodiment, since a film is also formed on the end surface portion of the electro-optical device 1, it is possible to protect the end surface of the electro-optical device 1 that is easily chipped, and the electro-optical device has higher impact resistance. 1 can be provided.

  In this embodiment, the films 14 and 24 are formed after the driver IC 30 and the FPC 31 are mounted. However, the films 14 and 24 may be formed before the driver IC 30 and the FPC 31 are mounted. In this case, the mounting terminal 32 of the overhang portion 42 is masked with, for example, an epoxy resin or the like prior to the film forming process.

(Third embodiment)
Below, the 3rd Embodiment of this invention is described with reference to FIG.7 and FIG.8. In this embodiment, only differences from the above-described embodiment will be described.

  7 and 8 are explanatory views schematically showing the configuration of a display device with an input function as an electro-optical device to which the present invention is applied. FIG. 7 is a perspective view, and FIG. 8 is an AA view of FIG. It is sectional drawing. In FIG. 8, the first translucent electrode and the pattern and the second translucent electrode of the touch panel, the pixel electrode and the counter electrode of the liquid crystal device, and the like are simplified and shown with solid lines. Further, in the respective drawings shown below, the dimensions and ratios of the respective constituent elements are appropriately changed from the actual ones in order to make the respective constituent elements large enough to be recognized on the drawings.

  7 and 8, the display device 100 with an input function according to the present embodiment is generally disposed so as to overlap with a liquid crystal device 105 as an image generating device and a surface of the liquid crystal device 105 that emits display light. A touch panel 101 (input device).

  The liquid crystal device 105 includes a transmissive active matrix liquid crystal panel (hereinafter simply referred to as a liquid crystal panel 105a). In the case of the transmissive liquid crystal panel 105a, a backlight device ( (Not shown) is arranged. In the liquid crystal device 105, a film 147 is formed on the element substrate 150 on the display light emitting side with respect to the liquid crystal panel 105a, and a film 153 is formed on the opposite substrate 160 on the opposite side. The coatings 147 and 153 both have the same structure consisting of two layers, and the resin coating layers 145 and 151 formed on the side (lower layer side) in contact with the element substrate 150 and the counter substrate 160, and the upper layers thereof The silicon-based coat layers 146 and 152 are formed. Further, a first polarizing plate 181 is disposed on the surface of the coating film 147, and a second polarizing plate 182 is disposed on the surface of the coating film 153 on the opposite side.

  The liquid crystal panel 105 a includes a light-transmitting element substrate 150, a light-transmitting counter substrate 160 that is bonded to the element substrate 150 with a sealant 171, a counter substrate 160, and the element substrate 150. And a liquid crystal layer 155 held between them. In the element substrate 150, a driving IC 175 is COG mounted in an overhang region 159 that protrudes from the edge of the counter substrate 160, and a flexible substrate 173 is connected to the overhang region 159. Note that a drive circuit may be formed on the element substrate 150 at the same time as the switching elements on the element substrate 150.

  A touch panel 101 as an input function device is a resistance film type, and includes a translucent first substrate 110 in which a translucent first electrode 115 made of an ITO film (Indium Tin Oxide) is formed on a first surface 111. A sealing material is provided so that the first electrode 111 and 121 are opposed to each other with a predetermined gap between the light-transmitting second substrate 120 having the second electrode 125 made of an ITO film formed on the first surface 121. It is bonded together at 131, and the inside is an air layer. As the first substrate 110 and the second substrate 120, a light-transmitting thin plastic substrate or a thin glass substrate can be used. In this embodiment, both the first substrate 110 and the second substrate 120 are thin glass substrates. Is used. In the first substrate 110, a flexible substrate 133 is connected to an overhang region 119 that projects from the edge of the second substrate 120. A coating 143 is formed on the second surface 112 of the first substrate 110. The coating 143 has a two-layer structure, and includes a resin coat layer 141 formed in contact with the second surface 112 of the first substrate 110 and a silicon-based coat layer 142 formed thereon. Has been. That is, the coating 147 formed on the element substrate 150 and the coating 143 formed on the second surface 112 of the first substrate 110 are provided so as to sandwich the first polarizing plate 181.

  The touch panel 101 configured as described above is arranged so as to overlap the first polarizing plate 181 of the liquid crystal device 105 to constitute the display device 100 with an input function. In the display device with an input function 100, the liquid crystal device 105 can display a moving image or a still image in the image display area 100a, and an instruction for inputting to the display device with an input function 100 via the touch panel 101. Also display images. Accordingly, when the user presses the touch panel 101 with a finger while viewing the instruction image displayed on the liquid crystal device 105, the second substrate 120 is bent, and the first electrode 115 and the second electrode 125 are pressed at the pressed position. Touch. Therefore, if the portion where the first electrode 115 and the second electrode 125 are in contact with each other is detected, the input information can be determined.

  According to the present embodiment, the resin coat layers 141, 145, and 151 have an effect of dispersing, absorbing, or mitigating the impact applied to the display device with an input function 100 from the outside due to its elasticity. Further, since the silicon-based coat layers 142, 146 and 152 are hard coatings, they have an effect of improving the scratch resistance of the surface of the display device with an input function 100.

  Therefore, the display device 100 with an input function according to the present embodiment has the silicon-based coat layers 142, 146, and 152 formed on the surface thereof, so that scratches that are the starting points of the breakage of the substrate made of glass or the like do not occur. Further, since the resin coating layers 141, 145, and 151 are formed, the impact applied from the outside is alleviated, so that the resin coating layers 141, 145, and 151 have high impact resistance. That is, according to the present embodiment, it is possible to provide the display device with an input function 100 that is less likely to be damaged by dropping or loading.

  The first substrate 110, the element substrate 150, and the counter substrate 160 made of glass are particularly susceptible to cracking due to the presence of scratches on the surface. Therefore, in the above-described embodiment, a film composed of two layers of the resin coat layer and the silicon-based coat layer is formed on the surface of each substrate. However, the surfaces of the first substrate 110, the element substrate 150, and the counter substrate 160 are formed. Even when only the silicon-based coating layer that improves the scratch resistance is formed, the impact resistance of the display device 100 with an input function is improved.

Further, in the above-described embodiment, the configuration in which the coatings 147, 153, and 143 are formed on the element substrate 150, the counter substrate 160, and the first substrate 110 has been described. The structure formed on the substrate has the same effect. An example of this will be described with reference to FIG. In this example, the same components as those in FIG.
As shown in FIG. 9, the coating 143 is formed on the second surface 112 of the first substrate 110 of the touch panel 101 as the input function device, but the coating is formed on the element substrate 150 and the counter substrate 160 of the liquid crystal device 105. It has not been. The coating 143 has a two-layer structure, and includes a resin coat layer 141 formed in contact with the second surface 112 of the first substrate 110 and a silicon-based coat layer 142 formed thereon. Has been. According to this configuration, even when only the touch panel 101 as the input function device is used, the same effect is obtained.

  The coating may be formed on the first surface 111 of the first substrate 110 or the surface of the element substrate 150 and the counter substrate 160 on the liquid crystal layer 155 side.

(Fourth embodiment)
Below, the 4th Embodiment of this invention is described with reference to FIG. In this embodiment, only differences from the above-described embodiment will be described. In the drawings shown below, the dimensions and ratios of the components are appropriately different from the actual ones in order to make the components large enough to be recognized on the drawings.

  FIG. 10 is a front sectional view of an organic EL device 201 as an electro-optical device. The organic EL device 201 has a structure in which a light-transmitting glass substrate 210 is used as a base and each component is stacked thereon. A circuit element layer 219 including a TFT (Thin Film Transistor) element and various wirings (not shown) is formed on the glass substrate 210. Further, a coating 223 is formed on the surface of the glass substrate 210 opposite to the surface on which the circuit element layer 219 is formed. The coating 223 has a two-layer structure, and includes a resin coating layer 221 formed in contact with the glass substrate 210 and a silicon-based coating layer 222 formed thereon.

  A light-transmissive pixel electrode 211 made of ITO (Indium Tin Oxide) is formed on the circuit element layer 219 for each light emitting element 205. The light emitting elements 205 are formed at equal intervals so as to form a row along the longitudinal direction of the glass substrate 210. The pixel electrode 211 is connected to a TFT element formed on the circuit element layer 219.

  An inorganic bank 212 made of an inorganic material is formed on the circuit element layer 219. The inorganic bank 212 is disposed so as to surround the pixel electrode 211, and is formed in a state where a part thereof overlaps with the outer edge portion of the pixel electrode 211 when viewed from the normal direction of the glass substrate 210. On the inorganic bank 212, an organic bank 213 made of an organic material having water repellency is provided. The organic bank 213 is formed so as to surround the light emitting element 205.

  On the pixel electrode 211 and the inorganic bank 212, a hole transport layer 214 and a light emitting layer 215 are arranged in this order. A cathode 216 that is a laminate of calcium (Ca) and aluminum (Al) is formed on the light emitting layer 215 so as to cover the light emitting layer 215 and the hole transport layer 214. On the cathode 216, a sealing member 217 made of a resin or the like is laminated to prevent water and oxygen from entering and to prevent the cathode 216 or the organic EL element 203 from being oxidized.

  In addition, the light emitting layer 215 is a layer of an organic light emitting material that exhibits an electroluminescence phenomenon. By applying a voltage between the pixel electrode 211 and the cathode 216, holes are injected from the hole transport layer 214 and electrons are injected from the cathode 216 into the light emitting layer 215. The light emitting layer 215 emits light when they are combined. The emission spectrum from the light emitting layer 215 depends on the light emission characteristics and film thickness of the material. In the present embodiment, the light emitting layer 215 emits red light, and the main emission wavelength, that is, the wavelength at which the emission intensity is maximum in the emission spectrum is about 630 nm.

  The light emitted from the light emitting layer 215 downward in FIG. 10 is transmitted through the glass substrate 210 as it is, and the light emitted upward in FIG. 10 is reflected by the cathode 216 and then travels downward and is also transmitted through the glass substrate 210. To do. The organic EL device 201 having such a configuration is called a bottom emission type.

  When the organic EL device 201 is a top emission type that emits display light toward the side opposite to the glass substrate 210, the cathode 216 includes, for example, a thin calcium layer and an ITO layer to transmit light. Therefore, a light reflecting layer made of an aluminum film or the like is formed on the lower layer side of the pixel electrode 211 so as to overlap with the entire pixel electrode 211.

  According to the present embodiment, the resin coat layer 221 has an effect of dispersing, absorbing or mitigating the impact applied to the organic EL device 201 from the outside due to its elasticity. Further, since the silicon-based coat layer 222 is a hard film, it has an effect of improving the scratch resistance of the surface of the organic EL device 201.

  Therefore, the organic EL device 201 according to the present embodiment has no silicon scratch layer as a starting point of cracking of the substrate made of glass or the like because the silicon-based coating layer 222 is formed on the surface thereof. Moreover, since the impact applied from the outside is relieved by forming the resin coat layer 221, it has high impact resistance. That is, according to the present embodiment, it is possible to provide the organic EL device 201 that is less likely to be damaged due to dropping or load.

  The glass substrate 210 is particularly easily broken due to the presence of scratches on the surface. Therefore, in the above-described embodiment, the coating 223 composed of the two layers of the resin coat layer 221 and the silicon-based coat layer 222 is formed on the surface of the glass substrate 210. However, the scratch resistance on the surface of the glass substrate 210 is improved. Even when only the silicon-based coat layer 222 is formed, the impact resistance of the organic EL device 201 is improved.

  Further, in the present embodiment, the configuration in which the coating 223 is formed on the surface of the glass substrate 210 opposite to the surface on which the circuit element layer 219 is formed has been described. The structure in which the surface in which the layer 219 is formed may be sufficient.

  The electro-optical device of the present invention is not limited to the active matrix liquid crystal display device according to the above-described embodiment (for example, a liquid crystal display panel including a TFT (thin film transistor) or TFD (thin film diode) as a switching element), The present invention can be similarly applied to a passive matrix liquid crystal display device. In addition to liquid crystal display panels, various electro-optical devices such as electroluminescence devices, plasma display devices, electrophoretic display devices, and devices using electroluminescent elements (Field Emission Display, Surface-Conduction Electron-Emission Display, etc.) The present invention can be applied in the same way.

  The present invention is not limited to the above-described embodiments, and can be appropriately changed without departing from the spirit or idea of the invention that can be read from the claims and the entire specification, and an electro-optical device with such a change. In addition, the manufacturing method of the electro-optical device is also included in the technical scope of the present invention.

1 is a perspective view of an electro-optical device. II-II sectional drawing of FIG. 5 is a flowchart showing a method for manufacturing an electro-optical device. The figure for demonstrating bonding of the two mother board | substrates which comprise several electro-optical apparatuses. 9 is a flowchart illustrating a method for manufacturing the electro-optical device according to the second embodiment. FIG. 6 is a cross-sectional view of an electro-optical device according to a second embodiment. FIG. 10 is a perspective view illustrating a configuration of a display device with an input function as an electro-optical device according to a third embodiment. FIG. 8 is a cross-sectional view taken along line AA in FIG. 7 illustrating the configuration of a display device with an input function as an electro-optical device according to a third embodiment. FIG. 8 is a cross-sectional view taken along line AA in FIG. 7 illustrating another example of the display device with an input function as the electro-optical device according to the third embodiment. FIG. 10 is a front sectional view showing an organic EL device as an electro-optical device according to a fourth embodiment.

Explanation of symbols

  DESCRIPTION OF SYMBOLS 1 Electro-optical device, 10 TFT substrate, 12 Silicon system coat layer, 13 Resin coat layer, 14 Film, 20 Opposite substrate, 22 Silicon system coat layer, 23 Resin coat layer, 24 Film, 30 Driver IC, 31 FPC, 32 Mounting Terminal, 40 sealing material, 41 liquid crystal, 42 overhang part.

Claims (10)

An electro-optical device configured using a translucent substrate,
An electro-optical device comprising a hard coat layer formed on at least one surface of the substrate and including a silicon-based material.   The electro-optical device according to claim 1, wherein the substrate is a glass substrate.   The electro-optical device according to claim 1, further comprising a resin coat layer interposed between the hard coat layer and the substrate.   2. The electro-optical device according to claim 1, wherein a pair of the substrates is used, and liquid crystal molecules are sandwiched between the pair of substrates. The hard coat layers are respectively formed on both surfaces of the pair of substrates opposite to the side where the liquid crystal molecules are sandwiched,
The electro-optical device according to claim 4, wherein a polarizing plate is disposed outside the hard coat layer.   The electro-optical device according to claim 1, wherein the substrate is used for a touch panel with an input function, and includes the touch panel. A method of manufacturing an electro-optical device configured using a light-transmitting substrate,
A method for manufacturing an electro-optical device, comprising: forming a hard coat layer including a silicon-based material on at least one surface of the substrate.   8. The method of manufacturing an electro-optical device according to claim 7, further comprising a step of forming a resin coat layer on at least one surface of the substrate prior to the step of forming the hard coat layer.   The method of manufacturing an electro-optical device according to claim 7, wherein the hard coat layer is formed by a dipping method.   The method of manufacturing an electro-optical device according to claim 7, wherein the hard coat layer is formed by a spin coat method.

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