JP2007121994A - Electro-optical device and electronic equipment - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an electro-optical device capable of simplifying a mounting and assembling process by reducing the number of parts and capable of reducing the luminance irregularities by improving positional precision of a light source. <P>SOLUTION: The electrooptical device 100 is provided with a first substrate 110; a second substrate 120 disposed opposite to the first substrate; an electro-optical substance held between the first substrate and the second substrate; a light guide means 140 disposed to face the surface of the side opposite to the second substrate, of the first substrate; and a light source 132 disposed on the surface of the second substrate side, of the first substrate, wherein the light emitted from the light source is transmitted by the first substrate, is made incident to the light guide means, is propagated through the light guide means, is emitted from the light guide means, again is made incident to the first substrate, and as a result, contributes to the display of the electro-optical panel. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

The present invention relates to an electro-optical device and an electronic apparatus, and more particularly to a configuration of an electro-optical device provided with a light source for enabling display.

In general, various electronic devices are often equipped with a liquid crystal display or other electro-optical device as a display unit. In particular, in portable electronic devices such as mobile phones and portable computers, an electro-optic material is disposed between a pair of substrates, and a predetermined electric field is applied to the electro-optic material to control and display the light modulation state. What realizes is used.

For example, in a liquid crystal display device, in general, a pair of substrates are bonded together with a sealing material, and a liquid crystal panel is formed by sealing liquid crystal between the substrates, and a light source and a light guide are led behind or on the front surface of the liquid crystal panel. A backlight or a front light provided with a light plate is disposed, and a desired display is visually recognized using illumination light emitted from the backlight or the front light. As an illumination device such as the backlight or the front light, an illumination device in which an electroluminescent element such as an organic EL element is disposed on an end face of a light guide plate made of a transparent member is known (for example, Patent Document 1 below). reference).

Further, there is known a device structure in which the thickness of the liquid crystal display device is reduced by configuring such that a part of the functions of the light guide plate is realized by one substrate constituting the liquid crystal panel (for example, The following patent document 2). In this type of liquid crystal display device, a light guide film is stuck on the outer surface of one substrate constituting the liquid crystal panel, and light incident on one substrate is emitted to the other substrate side by the light guide film. It is configured.
Japanese Patent Laid-Open No. 10-50124 JP 2003-330020 A

However, in a conventional liquid crystal display device, a light source such as an LED is mounted on an FPC board,
Constructing an illuminating device arranged at a position adjacent to the light guide plate, and placing this illuminating device behind the liquid crystal panel increases the number of parts and the assembly work, which increases the manufacturing cost. There is. In addition, the relative positional relationship between the light source and the light guide plate and the relative positional relationship between these and the liquid crystal panel are slightly shifted, so that the luminance distribution varies from device to device,
There is also a problem that it is difficult to manufacture a product of stable quality.

In addition, in the liquid crystal display device using the light guide film described above, the use of the light guide film increases the thickness as compared with the liquid crystal panel. Since light loss occurs at the interface with the optical film, etc., there is a problem that the light utilization efficiency is also lowered.

Accordingly, the present invention solves the above-described problems, and an object thereof is to provide an electro-optical device that can simplify the mounting / assembling process by reducing the number of components. Another object is to provide an electro-optical device that can reduce variations in luminance by improving the positional accuracy of the light source.

In view of such circumstances, the electro-optical device of the present invention includes a first substrate, a second substrate facing the first substrate, and an electro-optical material sandwiched between the first substrate and the second substrate. And the first
A light guide means facing a surface of the substrate opposite to the second substrate, and the second substrate of the first substrate.
A light source provided on a surface on the substrate side, and the light emitted from the light source passes through the first substrate and enters the light guide unit, propagates through the light guide unit and transmits the light. Emitted from the light means,
It is incident on the first substrate again and contributes to the display of the electro-optical panel.

According to the present invention, by providing the light source on the surface of the first substrate on the second substrate side, the number of components can be reduced as compared with the conventional structure using an FPC substrate or the like, and the mounting / assembling process can be simplified. Manufacturing cost can be reduced. Moreover, since it becomes possible to improve the positional accuracy of the light source with respect to the first substrate in the apparatus, it is possible to suppress variations in luminance due to variations in the position of the light source.

Another electro-optical device of the present invention includes a first substrate, a second substrate facing the first substrate, an electro-optical material sandwiched between the first substrate and the second substrate, A light source provided on a surface of the first substrate on the second substrate side, and light emitted from the light source is incident on the first substrate and propagates through the first substrate to transmit the first substrate. The light is emitted from a surface of the first substrate on the second substrate side, is incident on the electro-optic material, and contributes to display.

According to this invention, in addition to the above-described effects, the number of parts can be reduced and the thickness can be reduced by using the first substrate as the light guide. Further, the light source emits light toward the first substrate, and the light guide means guides the light incident on the first substrate to the arrangement region, thereby protecting the light emission surface of the light source by the first substrate. Therefore, it is possible to prevent dust from being mixed into the light emission path and contamination.

In the present invention, it is preferable that the light source is provided in a region deviating from a region where the electro-optic material is disposed. According to this, the light source can be configured without affecting the structure in the region where the electro-optical material is disposed by providing the light source in a region outside the region where the electro-optical material is disposed.

In the present invention, it is preferable that the light source is provided in a substrate protruding portion of the first substrate that protrudes outward from the outer shape of the second substrate. According to this, the light source can be easily formed or mounted by providing the light source on the substrate extension portion.

In the present invention, the first substrate includes a switching element configured by a thin film laminated structure, and an electrode connected to the switching element for applying a voltage to the electro-optic material, and the light source Preferably has the same thin film laminated structure as at least a part of the thin film laminated structure of the switching element. According to this, since the same structure as the thin film configuration of at least a part of the switching element can be used for the light source, the manufacturing process can be simplified,
Manufacturing costs can be reduced.

In the present invention, the first substrate has a pixel structure including an electrode for electrically controlling the electro-optic material, and the light source has the same component as at least a part of the pixel structure. preferable. According to this, since the light source has the same component as at least a part of the pixel structure, the manufacturing process can be simplified and the manufacturing cost can be suppressed.

In the present invention, the light source can be composed of various light emitting elements such as an electroluminescence element such as an organic electroluminescence element and a light emitting diode element. In particular, by configuring them with a thin film laminated structure, it becomes possible to configure them in a compact manner. For example, a light-emitting element such as an electroluminescent element or a light-emitting diode element can be easily formed by directly laminating one or a plurality of light-emitting layers, a reflective layer, an electrode layer, and the like on the surface portion.

In the present invention, the first substrate is provided with a light deflection inclined surface for deflecting light incident on the first substrate and emitting the light from the surface on the second substrate side on the surface opposite to the second substrate. Is preferred. According to this, light propagating in the first substrate with a simple structure can be reliably deflected to the second substrate side and emitted.

In the present invention, it is preferable that a plurality of pixels are provided, and the light deflection inclined surface is provided at a position corresponding to the pixel. Since the plurality of light deflection inclined surfaces provided on the first substrate are provided at positions corresponding to the pixels, the planar positional relationship between the light deflection inclined surfaces and the pixels can be configured to be constant. It is possible to prevent the occurrence of moire fringes due to illumination unevenness of illumination light based on the deflection slope, and, for example, by matching a high illumination area of illumination light based on the light deflection slope within the pixel. Since the illumination light can be efficiently guided into the pixel, the light use efficiency can be increased.

In addition, it is preferable that a plurality of pixels are periodically arranged, and the plurality of light deflection inclined surfaces are formed in a cycle that coincides with the pixel arrangement cycle. According to this, since the plurality of light deflection slopes are formed at a period that coincides with the arrangement period of the plurality of pixels, it is possible to prevent the occurrence of moire fringes due to the formation period of the light deflection slopes. At the same time, for example, it is possible to efficiently guide the illumination light into the pixel by matching a high illumination area of the illumination light based on the light deflecting slope into the pixel, thereby increasing the light use efficiency. be able to.

In the present invention, it is preferable that an inner surface polarizing layer constituting a polarizer or an analyzer is formed on the surface of the first substrate on the second substrate side. In the case of using an electro-optical material that requires a polarizer or an analyzer such as a TN type liquid crystal or an STN type liquid crystal, by forming an inner surface polarizing layer on the second substrate side surface of the first substrate, It is possible to realize display based on illumination light emitted from the first substrate.

Next, an electronic apparatus according to the invention includes any one of the above electro-optical devices as a display unit. Although it does not specifically limit as an electronic device, It is especially desirable that it is portable electronic devices, such as a mobile telephone, a portable computer, and an electronic timepiece.

[First Embodiment]
Next, embodiments of the present invention will be described in detail with reference to the accompanying drawings. FIG. 1 is a schematic longitudinal sectional view showing an electro-optical device 100 of the present embodiment, FIG. 2 is a schematic plan view of the device 100, and FIG. 3 is a schematic bottom view of the device 100. In the drawings, details such as wiring and element structure are omitted as appropriate.

The electro-optical device 100 includes a first substrate 110 made of a transparent substrate made of glass, plastic, or the like, and a second substrate 120 made of the same transparent substrate, and the first substrate 110 and the second substrate 120 are A liquid crystal panel is formed in which liquid crystal 131 which is an electro-optical material is sealed between both substrates, which are bonded to each other at a predetermined interval of about 3 to 10 μm through a sealing material 130.

Each of the first substrate 110 and the second substrate 120 has a rectangular planar shape, and the first substrate 11
In 0, the substrate overhanging portions 110E and 110F are formed to project outward from the outer shape of the second substrate 120.
Is provided. Although not particularly limited in the present invention, the substrate overhanging portion 110 is used.
E and 110F are provided on both sides of the liquid crystal arrangement region L in which the liquid crystal 131 is arranged.

In the present embodiment, a wiring element structure 112 in which an underlayer 111 made of an insulating film or the like, a wiring, an element, an insulating layer, and the like are appropriately formed on the inner surface of the first substrate 110 (the surface facing the second substrate 120). ,
An insulating layer 113, a first electrode 114, and the like are sequentially formed. A base layer 121 made of an insulating film, a color filter 122, a protective film 123, a second electrode 124, and the like are sequentially formed on the inner surface of the second substrate 120 (the surface facing the first substrate 110). . Note that the above-described structure is not particularly limited, and it is only necessary to have a structure capable of applying a controlled electric field for each pixel to the liquid crystal 131 which is an electro-optical material.

Polarizing plates 117 and 127 are formed on the outer surfaces of the first substrate 110 and the second substrate 120 as necessary.
Is placed. Typically, the polarizing plates 117 and 127 are attached on the outer surface of the substrate. In addition, the board extension 110E is provided with an input terminal (not shown) directly or indirectly connected to the first electrode 114 and the second electrode 124, and is mounted on the board extension 110E. The wiring of the wiring board 135 is conductively connected to the input terminal.

13 and 14 are an enlarged plan layout view and an enlarged vertical sectional view showing a pixel structure of a configuration example in which the above-described configuration of the present embodiment is applied to a reflective transflective liquid crystal display. Here, the same reference numerals are given to portions corresponding to the above-described configuration. The wiring element structure 112 provided on the first substrate 110 includes a semiconductor layer 112a made of polycrystalline silicon or the like, and the semiconductor layer 112.
a gate insulating film 112b formed on a, and the semiconductor layer 11 via the gate insulating film 112b
The switching element (TFT; thin film transistor) provided with the gate electrode 112c opposingly arranged to 2a is included. The semiconductor layer 112a has a channel region disposed opposite to the gate electrode 112c, and a source region and a drain region into which impurities are introduced by self-alignment. The source region is conductively connected to the data line 112d, and the drain The region is conductively connected to a reflective film 115 and a pixel electrode 114, which will be described later, through a connection portion 112e. The gate electrode 112c is conductively connected to the scanning line 112g.

In this configuration example, each pixel P is provided with a reflective display region Pr and a transmissive display region Pt. In the reflective display region Pr, the interlayer insulating film 113 also used for the switching element.
A is formed in a fine uneven shape (discrete in the illustrated example), and an interlayer insulating film 113B is laminated on the interlayer insulating film 113A, whereby the surface of the interlayer insulating film 113B is a lower interlayer insulating film. Reflecting the shape of 113A, the surface is formed into fine irregularities. This interlayer insulating film 11
On 3B, a reflective film 115 is formed of a metal thin film such as aluminum, whereby the reflective film 1
The surface 15 is a scattering reflecting surface having a fine concavo-convex structure. On the other hand, the transparent display area P
At t, the interlayer insulating film 113A and the interlayer insulating film 113B are not formed.

On the reflective film 115, a pixel electrode (the first electrode) 114 is formed of a transparent conductor such as ITO.
Is formed. The pixel electrode 114 is formed in both the reflective display area Pr and the transmissive display area Pt. An alignment film 116 made of polyimide resin or the like is formed on the pixel electrode 114.

On the other hand, on the second substrate, the light shielding film 126 is formed in the boundary region of the pixel P. In the case of the illustrated example, the light shielding film 126 is formed in the same layer as the color filter 122, and includes, for example, a structure in which a plurality of color filter layers are stacked, a black matrix made of black resin, or the like. It is also possible to form the light shielding film 126 with a metal layer such as Cr.

In the present embodiment, the thickness of the liquid crystal 131 in the reflective display region Pr is smaller than the thickness in the transmissive display region Pt (for example, approximately half) due to the steps provided depending on the presence or absence of the interlayer insulating films 113A and 113B. As a result, reflected light (light constituting the reflective display) that passes through the liquid crystal layer twice in the reflective display area Pr and 1 in the transmissive display area Pt.
The difference in retardation of the liquid crystal 131 with respect to transmitted light that passes through the liquid crystal layer only once (light constituting the transmissive display) can be reduced. In the illustrated example, the thickness of the liquid crystal 131 in the reflective display region Pr and the transmissive display region Pt is changed depending on the presence or absence of the interlayer insulating film. However, by changing the thickness of the interlayer insulating film, the thickness of the liquid crystal 131 between the two regions is changed. Or you may change
The thickness of the liquid crystal may be changed depending on the level difference formed on the substrate 120.

Returning to FIG. 1 again, the description will be continued. A light source 132 is provided on the substrate extension 110F of the first substrate 110.
Is fixed. The light source 132 is a light emitting element such as a semiconductor element such as an LED (light emitting diode) or LD (laser diode), or an electroluminescent element such as an organic electroluminescence element (hereinafter simply referred to as “organic EL element”). Can be configured.

In the case of the illustrated example, the light source 132 is formed on the inner surface which is the surface on the liquid crystal 131 side of the first substrate 110. That is, the light source 132 has a thin film laminated structure that is directly attached to the upper surface of the substrate overhanging portion 110F. The light emission surface 132 x of the light source 132 is in close contact with the upper surface of the first substrate 110.

The light source 132 in the illustrated example is an organic EL element, and the lower electrode 132a made of a transparent conductor such as ITO, preferably a bank 132 made of a light shielding material, is provided on the upper surface of the substrate extension 110F.
b, a light emitting structure 132c, preferably a thin film laminated structure formed by sequentially forming an upper electrode 132d and a sealing layer 132e made of a reflective material such as metal. Here, the light emitting structure 132c
In reality, the structure has a structure in which a plurality of layers such as an organic hole transport layer, an organic light emitting film, and an organic electron transport layer are laminated. When a predetermined voltage is applied between the lower electrode 132a and the upper electrode 132d,
When the electric field is applied, the light emitting structure 132c emits light, and light is emitted from the light emitting surface 132x.

When the light source 132 is a light emitting diode, a lower electrode made of a transparent conductor, a semiconductor structure with an np junction structure, and an upper electrode are stacked on the surface of the first substrate 110, and the gap between the lower electrode and the upper electrode is stacked. What is necessary is just to comprise so that light emission by recombination of a hole and an electron may arise by applying a voltage to.

In addition, as a light emitting element which comprises said light source 132, light emitting elements, such as an organic EL element and LED element comprised in the shape of a chip | tip or a package, can also be used, In this case, a light emitting element is used. It is preferable to fix with a sealing resin or the like in a state of being in direct contact with the surface of the first substrate 110. Also in this case, it is preferable that the light emission surface 132x of the light source 132 is directly adhered to the substrate surface.

The light source 132 preferably has a structure (a light shielding structure or a reflective structure) for preventing light leakage from a part other than the light emitting surface 132x in the structure, but if necessary, a reflecting plate 134 as shown in the illustrated example. Can be provided.

FIG. 15 is an enlarged vertical sectional view showing a configuration example of the light source 132. On the first substrate 110, the lower electrode 132a, the bank 132b, the light emitting structure 132c, the upper electrode 132d, and the sealing layer 132e are stacked. The light emitting portion thus provided is provided side by side. On-off control (gray scale control as necessary) is enabled by the operation of the switching element 1322. On the first substrate 110, an underlayer 1 made of an insulating film such as SiO ₂ is used.
The switching element 1322 including the semiconductor layer 1322a, the gate insulating film 1322b, and the gate electrode 1322c is provided thereover. Semiconductor layer 13
22a is provided with a source region and a drain region on both sides of a channel region disposed opposite to the gate electrode 1322c, and a data line 1322d is conductively connected to the source region,
A lower electrode 132a is conductively connected to the drain region via a connection portion 1322e.
Note that the interlayer insulating films 1323A, 1323B, and 1323C are the switching elements 13 respectively.
Insulation between the conductive layers 22 and the EL structure is ensured.

The switching element 1322 is on / off controlled by a potential of a control line (not shown) that is conductively connected to the gate electrode 1322c. In the on state, the switching element 1322 supplies the potential supplied to the data line 1322d to the lower electrode 132a. Then, a voltage formed by a difference between the potential and the potential of the upper electrode 132d is applied to the light emitting structure 132c.
2c emits light. Here, the lower electrode 132a is made of a transparent conductor such as ITO, and the upper electrode 13
Since 2d is made of a metal conductor such as aluminum, the light exits downward and enters the first substrate 110.

A light guide plate 140 made of a transparent material such as acrylic resin is disposed behind the liquid crystal panel configured as described above. The light guide plate 140 constitutes the light guide means of the present invention, and is disposed opposite to the main body portion 140D that overlaps the liquid crystal arrangement region L of the liquid crystal panel and the substrate extension portion 110F of the first substrate 110. The main body portion 140D and the extension portion 140F are integrally formed. In the illustrated example, the light guide plate 140 has an integral plate shape in which the main body portion 140D and the extension portion 140F are continuous.

In the light guide plate 140, the light emitted from the light source 132 is the substrate overhanging portion 1 of the first substrate 110.
The light capturing surface 140a configured to enter after passing through 10F has an extension portion 140F.
Also provided are light deflecting means 140x and 140y for deflecting the internally propagating light after entering the light capturing surface 140a. Further, the light deflecting means 140x and 140y are deflected and dispersed by the light deflecting means 140x and 140y. A light emitting surface 140b for emitting the emitted light is provided. In the illustrated example, the light capturing surface 140a and the light emitting surface 140b are formed of the light guide plate 140.
It is composed of a continuous upper surface.

The light deflection means includes a plurality of light deflection inclined surfaces 140x provided on the surface (lower surface) opposite to the light capturing surface 140a in the extension portion 140F, and the light emitting surface 1 in the main body portion 140D.
A plurality of light deflection inclined surfaces 140y provided on the surface (lower surface) opposite to 40b. The light deflection inclined surface 140x deflects and disperses the light incident on the light capturing surface 140a by reflecting the light toward the main body 140D. The light deflection inclined surface 140y deflects and disperses the internal propagation light that has entered from the extension portion 140F by reflecting it toward the light exit surface 140b.
The light deflection inclined surfaces 140x and 140y are surfaces facing to opposite sides. By these light deflection inclined surfaces 140x and 140y, light is emitted from the light emitting surface 140b into the liquid crystal arrangement region L with substantially uniform illuminance.

In addition, behind the main body 140D of the light guide plate 140, a reflective plate 141 made of metal, resin, or the like.
Is preferably arranged. Further, if necessary, a reflection layer or a reflection plate may be arranged on the surface of the light deflection inclined surface 140x or in front of it in order to increase the light reflectance by the light deflection inclined surface 140x.

It is preferable that optical layers 142, 143, and 144 such as a light collecting sheet and a light diffusion sheet are appropriately disposed between the main body 140D of the light guide plate 140 and the first substrate 110 of the liquid crystal panel.
Instead of these optical layers, the lower surface of the extension 110F of the first substrate 110, the light capturing surface 140a, the light emitting surface 140b, etc. may be subjected to prism processing, blast processing, etc. to have a light diffusing action. .

In the present embodiment, the light emitted from the light source 132 passes through the inside of the first substrate 110 and is incident on the light capturing surface 140a of the light guide plate 140, and is deflected by the light deflection inclined surfaces 140x and 140y.
By being dispersed, the light exits from the light exit surface 140b and illuminates the liquid crystal arrangement region L of the liquid crystal panel. This illumination light constitutes a predetermined display that is visible from the outside of the second substrate 120 through the liquid crystal panel.

According to the present embodiment, the light source 132 is fixed to the first substrate 110 that is one substrate constituting the liquid crystal panel, so that the light source is mounted on the wiring substrate as in the conventional structure, or the wiring substrate is fixed. So that the mounting and assembly process can be simplified.
Manufacturing cost can be reduced. In particular, when the light source 132 is configured by a thin film laminated structure formed on the first substrate, the light source 132 can be further reduced in thickness.

Further, in the present embodiment, since the light source 132 is directly fixed to the first substrate 110, the positional accuracy of the light source with respect to the liquid crystal panel is improved, thereby reducing variations in luminance of the device. In particular, by forming the light source 132 having a thin film laminated structure on the first substrate 110, the light source 1 can be obtained with almost the same patterning accuracy as the inner surface structure such as the electrode structure of the first substrate 110.
Since 32 can be positioned, the positional accuracy of the light source can be further increased.

Furthermore, since the light emission surface 132x of the light source 132 is in close contact with the surface of the first substrate 110, the light emission surface 132x can be protected, and dust or the like is interposed in the optical path to prevent the passage of light, The possibility that the light emitting surface 132x is contaminated can be reduced.

The lower electrode 132a, the bank 132b, the upper electrode 132d, the sealing layer 132e, and the like of the light source 132 may be performed simultaneously with the manufacturing process of the first substrate 110. For example, the lower electrode 132a is formed of a transparent conductor such as ITO simultaneously with the first electrode (pixel electrode) 114, or the bank 132
For example, b may be formed simultaneously with the insulating layer on the first substrate 110. In this way, the position accuracy of the light source 132 can be made equal to the patterning accuracy of the first substrate 110, and the number of manufacturing steps can be reduced, so that the manufacturing cost can be reduced. Become.

16 to 26 are schematic process diagrams showing an example of a manufacturing process of the light source 132 (a manufacturing process corresponding to the configuration example of the light source 132 shown in FIG. 15). First, as shown in FIG. 16, the first substrate 11
A base layer 1321 made of an insulator such as SiO ₂ is formed on 0 by a sputtering method or the like. This base layer 1321 can be formed in the same process as the base layer 111 of the configuration example shown in FIGS. Thereafter, a semiconductor layer 1322a formed of polycrystalline silicon or the like over the base layer 1321.
And is patterned by etching or the like as shown in FIG. Here, the semiconductor layer 1322a can be formed in the same step as the semiconductor layer 112a having the structure example shown in FIGS. After that, a gate insulating film 1322b is formed over the semiconductor layer 1322a. This gate insulating film 1322b can be formed in the same process as the gate insulating film 112b of the structural example shown in FIGS.

Next, as shown in FIG. 18, the gate electrode 1322c is preferably formed together with a control line (not shown). This gate electrode 1322c can be formed in the same process as the gate electrode 112c (and the scanning line 112g) of the structural example shown in FIGS. Thereafter, the gate electrode 132
Impurities are implanted into the semiconductor layer 1322a by self-alignment using 2c as a mask by an ion implantation method or the like to form a source region and a drain region. These impurity regions can be formed in the impurity region forming step of the configuration example shown in FIGS.

Next, as shown in FIG. 19, an interlayer insulating film 1323A made of SiO ₂ or the like is formed by a CVD method or the like, and contact holes are formed in the interlayer insulating film 1323A and the gate insulating film 1322b, thereby forming the semiconductor layer 1322a. The source region and the drain region are partially exposed. These processes can be performed in the step of patterning the interlayer insulating film 113A in the configuration example shown in FIGS.

Thereafter, as shown in FIG. 20, the data line 1322d and the connection portion 1322e are formed by vapor deposition of metal or the like, sputtering, and patterning. These processes can be performed in the process of forming the data line 112d and the connecting portion 112e of the configuration example shown in FIGS. Further, an interlayer insulating film 1323B (passivation film) is formed thereon. This interlayer insulating film 1323B can be formed, for example, in the step of forming the interlayer insulating film 113B having the configuration example shown in FIGS.

Next, as shown in FIG. 21, the lower electrode 132a is formed of a transparent conductor such as ITO on the interlayer insulating film 1323B. The lower electrode 132a can be formed in the step of forming the first electrode 114 (the pixel electrode 114 having the configuration example shown in FIGS. 13 and 14).

Thereafter, as shown in FIG. 22, an interlayer insulating film 1323C made of SiO ₂ , SiN or the like is formed by a CVD method or the like, and a predetermined portion of the lower electrode 132a is exposed by patterning. Then, as shown in FIG. 23, a bank 132b made of a resin material or the like is formed on a region excluding the exposed portion of the lower electrode 132a. The bank 132b is preferably formed of a light shielding material and is configured so that light does not leak to the surroundings. The bank 132b can be made of, for example, a polyimide resin.

Thereafter, as shown in FIG. 24, the light emitting structure 132c is formed in the region surrounded by the bank 132b and exposing the lower electrode 132b at the bottom. The light emitting structure 132c includes, for example, a buffer layer (PEDT / PSS) made of a thiophene polymer and a styrene polymer and a light emitting polymer.
It can be composed of a laminated structure made of (LEP), an organic semiconductor layer such as polyparaphenylene vinylene. Each of these layers is formed by, for example, a method in which an uncured droplet containing each constituent material is dropped from the ejection head such as an ink jet head onto the region, and then dried and cured in the bank 132b. can do.

Next, as shown in FIG. 25, an upper electrode 132d is formed of a reflective material such as aluminum on the light emitting structure 132c by vapor deposition or the like. This step can be formed simultaneously with the step of forming the reflective film 115 having the configuration example shown in FIGS. However, when the lower electrode 132a is formed at the same time as the pixel electrode 114 as described above, the upper electrode 132d cannot be formed in the reflective film 115 formation process due to the order of the process. Then, FIG.
As shown in FIG. 6, sealing is performed by applying a sealing agent 132e such as epoxy resin or silicone resin.

As described above, in the present embodiment, the structure of the light source 132 and the structure in the pixel P shown in FIGS. 13 and 14 (particularly the structure of the switching element) are realized in the same process.
The increase in the number of processes can be suppressed and the manufacturing cost can be reduced. The light source 1 as described above
The structure and manufacturing method of 32 can be similarly applied to the other embodiments described below.
In particular, in the present embodiment, since the switching element 1322 for light emission control having the same structure as the switching element provided in the pixel structure is provided in the light source 132, the light source 132 is provided.
Many of the formation processes can be shared with the formation process of the pixel structure.

[Second Embodiment]
Next, an electro-optical device according to a second embodiment of the invention will be described with reference to FIG.
Since this embodiment has basically the same configuration as that of the first embodiment, the same parts are denoted by the same reference numerals, and description thereof is omitted.

In this embodiment, the extended portion 140F ′ of the light guide plate 140 ′ is formed in a wedge shape by polishing or the like, and a light deflection inclined surface 140x ′ for deflecting light incident on the light capturing surface 140a toward the main body portion 140D is formed. is doing. On the outer surface of the light deflection inclined surface 140x ′, there is a reflective layer 140z.
The light incident on the light capturing surface 140a is efficiently guided to the main body 140D by the reflective layer 140z. As a result, the light propagation efficiency at the time of deflection by the light deflection slope 140x ′ and the reflection layer 140z can be increased.

[Third Embodiment]
Next, an electro-optical device according to a third embodiment of the invention will be described with reference to FIG.
Since this embodiment has basically the same configuration as that of the first embodiment, the same parts are denoted by the same reference numerals, and description thereof is omitted.

In the present embodiment, the extended portion 140F ″ of the light guide plate 140 ″ is used as the light emitting surface 14 of the main body portion 140D.
The light capturing surface 140a ″ is formed at a position close to the light source 132 by projecting toward the first substrate 110 with respect to 0b. Thereby, the light emitted from the light source 132 is introduced at an earlier stage in the light guide plate 140 ″. Since the light is incident on the light and propagates through the light, the efficiency of taking light into the light guide plate 140 ″ can be increased.

In this case, it is preferable to appropriately form a reflective layer 140v or the like on the side surface of the protruding portion of the extension 140F ″ to prevent light leakage. Further, between the light capturing surface 140a ″ and the first substrate 110. May be provided with a light diffusion plate 140w or the like.

The reflective layer 140v and the light diffusing plate 140w can also be applied to the first and second embodiments. Further, the reflective layer 140z of the second embodiment may be applied to the light deflection inclined surface 140x of the first embodiment or the light deflection inclined surface 140x of the present embodiment.

[Fourth Embodiment]
Next, an electro-optical device according to a third embodiment of the invention will be described with reference to FIGS. 6 is a schematic longitudinal sectional view of the present embodiment, FIG. 7 is a schematic plan view of the present embodiment, and FIG. 8 is a schematic bottom view of the present embodiment. In the present embodiment, the same parts having the same configurations as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

The present embodiment is the same as the previous embodiments in that the light source 132 is incident on the first substrate 110 ′. However, this light is not emitted from the first substrate 110 ′, and the first substrate 110 is used as it is.
'Is deflected and dispersed by the light deflecting means 110x and 110y, and the illumination light is emitted from the inner surface 110b in the liquid crystal arrangement region L of the first substrate 110'.

In the present embodiment, a light deflection inclined surface 110x that serves as a light deflection unit on the outer surface of the first substrate 110 ′.
110y are provided. The light deflection inclined surface 110x is formed on the surface (outer surface) opposite to the light capturing surface 110a, which is the surface portion on which the light source 132 is formed, and deflects and disperses light incident from the light source 132 toward the liquid crystal arrangement region L. Is. The light deflection inclined surface 110y is formed on the outer surface in the liquid crystal arrangement region L of the first substrate 110 ′, and deflects and disperses the internally propagated light to emit light from the inner surface 110b of the first substrate 110 ′. Is. Here, the light deflection inclined surfaces 110x and 110y are inclined in opposite directions.

In the present embodiment, since the first substrate 110 ′ is used as the light guiding means, the structure of the liquid crystal panel is also slightly different from the previous embodiments. For example, on the inner surface of the first substrate 110 ′, a low refractive index layer 111 ′ made of a transparent material having a lower refractive index than that of the first substrate 110 ′, such as magnesium fluoride, is formed. When the low refractive index layer 111 ′ is formed in this way, even if the light incident on the first substrate 110 ′ is light having a slightly large incident angle, it is reflected at the interface between the first substrate 110 ′ and the low refractive index layer 111 ′. The first substrate 110 ′ travels in the first substrate 110 ′.
To improve the illuminance of illumination light emitted from the electro-optic material (liquid crystal) 131 from
It can be made uniform. This low refractive index layer 111 ′ can be formed by vapor deposition or the like.

An internal polarizing layer 117 ′ is formed on the low refractive index layer 111 ′. This inner surface polarizing layer 11
7 'can be composed of a water-soluble lyotropic liquid crystal dye material or a thermotropic polymer liquid crystal material containing a dichroic dye. Also, a wire grid structure can be adopted as the inner polarizing layer 117 ′. This wire grid structure has a large number of parallel conductor lines arranged at a pitch shorter than the wavelength of light. For incident light, the wire grid reflects a polarization component having a polarization plane coinciding with the direction of the parallel conductor lines, and transmits a polarization component having a polarization plane orthogonal to the direction of the parallel conductor lines. In this structure, the width of the parallel conductor wire is set to a
When the pitch is d, a / d is preferably about 0.6. The wavelength of light is λ
Λ / d ≧ 5 is preferable. Furthermore, the lower layer of the conductor wire may be composed of a film having a high reflectance, and the upper layer may be composed of a film having a low reflectance. A film with high reflectivity is A.
Examples thereof include those composed of g, Au, Al, etc., and examples of the film having low reflectivity include those composed of Cr, Ti. From the viewpoint of low cost or from the viewpoint that the film can be formed by sputtering, it is desirable to use Al as a material.

The low refractive index layer 111 ′ is preferably formed not only on the liquid crystal arrangement region L of the first substrate 110 ′ but also on the substrate extension 110 F to which the light source 132 is fixed. In this way, it is possible to obtain a confinement effect in the first substrate 110 ′ even for the light in the substrate overhanging portion 110F ′.

Further, it is preferable that a reinforcing layer 119 is formed on the outer surface of the first substrate 110 ′ so as to fill the concave grooves forming the light deflection inclined surfaces 110x and 110y and to be continuous on the outer surface. . The reinforcing layer 119 compensates for the lack of rigidity of the first substrate 110 ′ due to the formation of the concave grooves. The reinforcing layer 119 is preferably made of a low refractive index material such as magnesium fluoride so as not to disturb the total reflection characteristics of the light deflection inclined surfaces 110x and 110y. The reinforcing film 119 can be formed by a vapor deposition method or the like. Reinforcing membrane 11
It is preferable that the surface 9 is flat as shown in the illustrated example. If it does in this way, the cleaning process of surfaces, such as washing | cleaning and wiping off, will become easy.

On the other hand, in the illustrated example, an inner surface polarizing layer 127 ′ similar to the above is also formed on the inner surface of the second substrate 120. However, with respect to the second substrate 120, a polarizing plate may be disposed on the outer surface of the second substrate 120 instead of providing the inner polarizing layer 127 ′.

Further, a light reflection layer 136 is formed on the end surface of the first substrate 110 '. That is, in the case of the illustrated example, end surfaces are provided on each of the four sides of the first substrate 110 ′ having a rectangular planar shape, and the side on which the light source 132 and the reflecting plate 134 are disposed is located among these end surfaces. The light reflecting layer 136 is formed on all of the remaining three side end surfaces except for the end surface of one side (the end surface on the side where the light capturing surface 110a is provided). Specifically, the light reflecting layer 136 is formed by depositing a reflective material such as aluminum or white resin on the end face portion. In the case where the reflecting plate 134 ′ is not disposed, the light reflecting layer 136 may be formed on the entire end surface (that is, the entire circumference) of the first substrate 110 ′.

In the present embodiment, by using the first substrate 110 ′ as a light guide, it is not necessary to arrange other light guides in an overlapping manner, so that the overall thickness can be significantly reduced. Further, since the light emitted from the light source 132 and directly taken into the first substrate 110 'remains in the panel as it is and is emitted as display light, the light use efficiency can be improved as a whole.

In the present embodiment, it is preferable that the light deflection inclined surface 110x is formed so as to match the arrangement of the pixels along the propagation direction of the light emitted from the light source 132 in the first substrate 110 ′. . In particular, one light deflection slope 110x is necessarily provided for one pixel along the propagation direction.
Are preferably arranged to be arranged. In this way, it is possible to prevent the occurrence of moire fringes caused by the relationship between the illuminance distribution of the illumination light and the pixel arrangement. In addition, when the pixels are arranged in the propagation direction at a constant arrangement period, it is preferable that the light deflection inclined surface 110x is also formed at the same period in the propagation direction.

However, the illuminance distribution of the illumination light by the light deflection inclined surface 110x is generally the first substrate 110 ′.
However, the peak direction of the illuminance distribution is often seen from the light deflection inclined surface 110x because the peak is often in a direction slightly inclined in the propagation direction with respect to the normal direction. It is preferable to set the positional relationship between the light deflection inclined surface 110x and the pixel so that the pixel (the center portion thereof) exists in the pixel. If it does in this way, since it becomes possible to use illumination light so that it may become the light which contributes to a display efficiently, the utilization efficiency of light can be improved.

The light deflection slopes 110x and 110y can be easily formed by providing a mask having an appropriate pattern made of a resist or the like and then performing wet etching or the like containing hydrofluoric acid or the like.

As a manufacturing process, when using a mother substrate (multiple substrate) including a plurality of liquid crystal panels, the individual liquid crystal panels are separated and completed, and then light is etched on the outer surface of the first substrate 110 ′. The deflection slopes 110x and 110y may be formed, or the light deflection slopes 110x and 110y may be formed first on the mother substrate, but the former one is to prevent damage and contamination of the outer surface. Is preferred. As a matter of course, liquid crystal panels can be individually formed without using the mother substrate. In this case as well, the order of the processes is the same as described above.

As for the formation of the light source 132, as in the first embodiment, a part of the thin film of the light source 132, for example, the lower electrode, the bank, the upper electrode, and the sealing layer, in the same process as the inner surface structure of the first substrate. Etc. may be formed.

[Fifth Embodiment]
Next, an electro-optical device according to a second embodiment of the invention will be described with reference to FIG.
Since this embodiment has basically the same configuration as that of the fourth embodiment, the same reference numerals are given to the same portions, and descriptions thereof are omitted.

In the present embodiment, the substrate overhanging portion 110F ″ of the first substrate 110 ″ is formed in a wedge shape, and the light deflection inclined surface 110x ″ for deflecting the internally propagating light incident on the light capturing surface 110a to the liquid crystal arrangement region L side. The reflective layer 110z is disposed on the outer surface of the light deflection inclined surface 110x ″, and the light incident on the light capturing surface 110a is efficiently disposed on the liquid crystal placement region of the first substrate 110 ″ by the reflective layer 110z. It is configured to be guided to a region overlapping with L. By this,
It is possible to increase the light propagation efficiency during the deflection by the light deflection slope 110x ″ and the reflective layer 110z.

[Sixth Embodiment]
Next, a sixth embodiment according to the present invention will be described with reference to FIG. FIG. 10 is a schematic plan view of the electro-optical device according to the present embodiment. The structure of this embodiment can adopt the same configuration in any of the first to fifth embodiments. Here, in the present embodiment, only the structure on the first substrate is different from the above-described embodiment, and therefore only the structure will be described.

In the present embodiment, a liquid crystal, which is an electro-optical material (not shown), is arranged in the liquid crystal arrangement region L between the first substrate 210 and the second substrate 220, and the outside of the liquid crystal arrangement region L, specifically, the first substrate. 2
A light source 232 is fixed on the substrate overhanging portion 210E provided in FIG. A wiring board 235 is also mounted on the board overhanging portion 210E. Wirings (not shown) of the wiring board 235 are conductively connected to the wirings 238 and 239 drawn out on the board overhanging portion 210E.

The wiring 238 formed on the substrate extension 210E is directly or indirectly connected to a first electrode and a second electrode (not shown) formed in the liquid crystal arrangement region L. The light source 232 is conductively connected to the wiring 239 formed on the substrate overhanging portion 210E.
The power is supplied from the wiring board 235 via the wiring.

In the present embodiment, a plurality of light sources 232 are arranged at intervals in the width direction of the substrate extension portion 210E, and the wiring 238 passes through a region where the light sources 232 are not arranged and enters the liquid crystal arrangement region L. It extends to.

[Seventh Embodiment]
Next, a seventh embodiment according to the invention will be described with reference to FIG. FIG. 11 is a schematic plan view of the electro-optical device according to the present embodiment. Regarding the structure of this embodiment, the same configuration can be adopted in any of the first to fifth embodiments. Also in this embodiment, only the structure on the first substrate is different from the above-described embodiment, and therefore only the structure will be described.

In the present embodiment, a liquid crystal, which is an electro-optic material (not shown), is disposed in the liquid crystal arrangement region L between the first substrate 210 ′ and the second substrate 220 ′. The first liquid crystal arrangement region L is formed on the substrate overhanging portion 210E ′ provided on one substrate 210 ′.
A wiring 238 ′ directly or indirectly connected to the electrode and the second electrode is drawn out, and an input terminal 238x ′ is provided at the tip thereof. The first substrate 210 ′ is provided with another substrate overhanging portion 210F ′, and a light source 232 ′ is fixed on the substrate overhanging portion 210F ′. The light source 232 according to the present embodiment is a light source (basically a linear light source) having an extended light emission surface configured to extend over a range corresponding to the width of the liquid crystal arrangement region L. Yes. Such an extended light source can be used in any of the above embodiments.

In addition, an input terminal 239x ′ provided in a wiring 239 ′ connected to the light source 232 ′ is formed at a junction (a corner portion of the first substrate 210) of the substrate overhanging portions 210E ′ and 210F ′.

In the case of the present embodiment, the substrate extension 210E ′ is provided along one side of the rectangular first substrate 210 ′, and the substrate extension 210F ′ is along another side adjacent to the one side. Is provided. The input terminals 238x 'and 239x' are conductively connected to a wiring board or the like (not shown) mounted on the board extension 210E '.

[Eighth Embodiment]
Finally, an embodiment of an electronic apparatus in which the electro-optical device 100 of each of the above embodiments is mounted will be described. FIG. 12 shows a mobile phone 300 as an example of the electronic apparatus of the present embodiment. A cellular phone 300 shown here includes an operation unit 301 including a plurality of operation buttons 301a and 301b and a mouthpiece, and a display unit 302 including a display screen 302a and a mouthpiece. The electro-optical device 100 is incorporated inside.

The display image formed by the electro-optical device 100 can be viewed on the display screen 302a of the display unit 302. In this case, a display control circuit that controls the electro-optical device 100 is provided inside the mobile phone 300. The display control circuit sends a video signal and other input data and a predetermined control signal to the electro-optical device 100,
The mode of operation is determined.

Note that the electro-optical device of the present invention is not limited to the above-described illustrated examples, and various modifications can be made without departing from the scope of the present invention. For example, in each of the above embodiments, a liquid crystal device using liquid crystal as an electro-optical device has been described as an example. However, the present invention can also be applied to other electro-optical devices such as an electrophoretic display device. In the above embodiment, the transmissive liquid crystal device has been described in the examples shown in FIGS. 1 to 11 and the transflective liquid crystal device in the examples shown in FIGS. It can be applied to other types of devices.

The schematic longitudinal cross-sectional view of 1st Embodiment. 1 is a schematic plan view of a first embodiment. The schematic bottom view of a 1st embodiment. The schematic longitudinal cross-sectional view of 2nd Embodiment. The schematic longitudinal cross-sectional view of 3rd Embodiment. The schematic longitudinal cross-sectional view of 4th Embodiment. The schematic plan view of 4th Embodiment. The schematic bottom view of 4th Embodiment. The schematic longitudinal cross-sectional view of 5th Embodiment. The schematic longitudinal cross-sectional view of 6th Embodiment. The schematic longitudinal cross-sectional view of 7th Embodiment. The schematic perspective view which shows an example (8th Embodiment) of an electronic device. The enlarged plan view which shows the pixel structure of the other structural example of 1st Embodiment. FIG. 6 is an enlarged longitudinal sectional view showing a pixel structure of another configuration example of the first embodiment. FIG. 3 is an enlarged longitudinal sectional view showing a configuration example of a light source according to the first embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment. The schematic process drawing which shows the manufacturing process of the light source of 1st Embodiment.

Explanation of symbols

DESCRIPTION OF SYMBOLS 100 ... Electro-optical apparatus, 110 ... 1st board | substrate, 122 ... Wiring element structure, 122a ... Semiconductor layer, 122b ... Gate insulating film, 122c ... Gate electrode, 122d ... Data line, 122g ... Scanning line, 123A, 123B ... Interlayer insulation Membrane, 120 ... second substrate, 131 ... liquid crystal, 132 ... light source, 132x ... light emitting surface, 132a ... lower electrode, 132b ... bank, 132c ... light emitting structure,
132d ... Upper electrode, 1322 ... Switching element, 1322a ... Semiconductor layer, 1322b ...
Gate insulating film, 1322c ... gate electrode, 1322d ... data line, 1323A, 1323
B, 1323C ... interlayer insulating film, 140 ... light guide plate, 140a ... light capturing surface, 140b ... light emitting surface, 140x, 140y ... slope for deflecting light

Claims (13)

A first substrate;
A second substrate facing the first substrate;
An electro-optic material sandwiched between the first substrate and the second substrate;
A light guide means facing the surface of the first substrate opposite to the second substrate;
A light source provided on a surface of the first substrate on the second substrate side,
The light emitted from the light source passes through the first substrate and enters the light guide unit, propagates through the light guide unit, exits from the light guide unit, and enters the first substrate again. An electro-optical device that contributes to display of the electro-optical panel. A first substrate;
A second substrate facing the first substrate;
An electro-optic material sandwiched between the first substrate and the second substrate;
A light source provided on a surface of the first substrate on the second substrate side,
Light emitted from the light source is incident on the first substrate, propagates through the first substrate, is emitted from the surface of the first substrate on the second substrate side, is incident on the electro-optic material, and is displayed. An electro-optical device that contributes to the above. 3. The electro-optical device according to claim 1, wherein the light source is provided in a region outside the region where the electro-optical material is disposed. 4. The electro-optical device according to claim 3, wherein the light source is provided in a substrate protruding portion of the first substrate that extends outward from the outer shape of the second substrate. The first substrate has a switching element configured by a thin film laminated structure, and an electrode connected to the switching element and for applying a voltage to the electro-optic material,
5. The electro-optical device according to claim 1, wherein the light source has the same thin film laminated structure as at least a part of the thin film laminated structure of the switching element. The first substrate has a pixel structure including an electrode for electrically controlling the electro-optic material, and the light source has the same component as at least a part of the pixel structure. Item 5. The electro-optical device according to any one of Items 1 to 4. The electro-optical device according to claim 1, wherein the light source is an organic electroluminescence element. The electro-optical device according to claim 1, wherein the light source is a light emitting diode element. The first substrate is provided with a light deflection inclined surface on the surface opposite to the second substrate for deflecting light incident on the first substrate and emitting it from the surface on the second substrate side. Claim 2
The electro-optical device according to 1. With multiple pixels,
The electro-optical device according to claim 9, wherein the light deflection inclined surface is provided at a position corresponding to the pixel. A plurality of pixels are periodically arranged,
The electro-optical device according to claim 9, wherein the plurality of light deflection inclined surfaces are formed with a period that coincides with an array period of the pixels. 12. The electricity according to claim 9, wherein an inner surface polarizing layer constituting a polarizer or an analyzer is formed on a surface of the first substrate on the second substrate side. Optical device. An electronic apparatus comprising the electro-optical device according to claim 1 as a display unit.

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