JP2008250764A - Defective inlet sheet marking method - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a marking method for a defective inlet sheet, which prevents a defective inlet sheet from being erroneously shipped as an IC tag.
A marking method for a defective inlet sheet 1 according to the present invention includes a contactless IC tag inlet in which an IC chip 3 having a transmitting / receiving function, a processing function, and a memory function is mounted on an antenna pattern formed on an inlet base film. In the sheet manufacturing process, after the IC chip 3 is mounted on the antenna pattern 2 or before the mounting, an inspection is performed for each unit inlet of the inlet 1 continuous in a web shape, and a failure is determined. In such a case, each detected inlet sheet of the rejected inlet unit is marked with a conductive material.
[Selection] Figure 1

Description

  The present invention relates to a marking method for defective inlet sheets. More specifically, in the manufacturing process of a non-contact IC tag, the present invention relates to a method for reliably marking a defective inlet sheet so that an inlet in which a defect is once detected is not erroneously processed into an IC tag and shipped as a normal product. . Therefore, the technical field of the present invention relates to the field of manufacture and use of inlet sheets and non-contact IC tags.

Non-contact IC tags record and hold information and can exchange information with external devices in a non-contact manner, so they are often used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It is becoming.
However, when non-contact IC tags are widely used in this way, when a malfunctioning product is mixed in shipped non-contact IC tags, information cannot be written or read. This results in the loss of the reliability of the contactless IC tag using system.

When manufacturing a non-contact IC tag, after manufacturing an inlet sheet by joining a non-contact IC chip and an antenna, processing according to the required final product form is performed. In the processing process after manufacturing this inlet sheet An inlet that has been checked as defective once may recover its function for some reason in a subsequent process. However, an inlet in which a defect is detected once in this way leaves structural defects and often reoccurs in the course of use in the market. The present invention prevents such defective products from being mixed.
In general, the inlet sheet may be referred to as an antenna sheet. In the present invention, not only after the antenna pattern is formed and the non-contact IC chip is mounted, but also the state before the mounting is referred to as an inlet sheet.

  At the inlet sheet stage, the circuit is exposed, so the shape and circuit characteristics can be checked directly by image inspection, continuity test, etc., but after laminating the surface protective material by label processing, the pattern shape is hidden, so communication Only inspection is possible. Since the defective mark once attached is also hidden, there is a problem that it is difficult to detect the inlet whose function has been recovered in the subsequent process. In such a case, once a defective product is determined to be a non-defective product in the final communication inspection, it may be shipped as a normal product.

  If the non-contact IC tag is a single product, it will not cause a problem if it is removed when a defect is detected. However, in the case of a non-contact IC tag manufactured in a continuous web, Each time a non-defective product is detected, if it is cut and removed, there is a problem that the process becomes discontinuous or is interrupted to prevent smooth production. Therefore, the present invention proposes a method for reliably marking a defective inlet by a method that does not interfere with the production process.

As a related prior art document, Patent Document 1 discloses that in a manufacturing process of a semiconductor package, an IC chip is provided at a portion excluding a step of providing a defect identification mark at a defective portion of a circuit board and a portion provided with the defect identification mark. The manufacturing process including the process of mounting is proposed. However, in patent document 1, since the 2nd mark is provided, there exists a problem which takes time.
Further, Patent Document 2 inspects whether or not an IC normally operates when an IC chip is manufactured in an IC card manufacturing method, writes specific data to an IC memory having a normal inspection result, and performs a final process. Reads the contents of the IC chip internal memory and determines whether or not the product is an NG (No Good) product. However, even if it is recorded in the memory, it cannot be immediately discriminated visually, so it may be shipped as a final product or an NG product may be used as a non-defective product.

  Patent Document 3 is a prior application of the applicant, and proposes to punch and remove the IC chip portion or the antenna of the IC tag in which the malfunction is detected. However, in such a case, there is a problem that a hole is formed in the inlet, and the deformation in the hole or breakage due to stress concentration tends to occur due to the tension in the subsequent label processing or the like.

JP 2001-338933 A JP 2002-020993 A JP 2007-026239 A

  In conventional defective inlet and IC tag marking methods, there is a situation in which the final inspection result is emphasized, and the inspection result of the intermediate process is not reliably reflected in the shipped product. However, an IC tag in which a defect is detected in an intermediate process often leaves structural defects and is preferably not included in the final product. Therefore, in the present invention, the inlet in which the malfunction is detected in the intermediate inspection of the manufacturing process of the inlet sheet of the non-contact IC tag is marked with a conductive material on the connection part of the IC chip or the antenna coil. By completely deteriorating the communication function and clarifying visually that it is a defective product, it is intended to prevent the defective product from entering the final product and solve the problem. .

  A first aspect of the present invention is a manufacturing process of an inlet sheet for a non-contact IC tag in which an IC chip having a transmission / reception function, a processing function, and a storage function is mounted on an antenna pattern formed on an inlet base film. In the stage after the IC chip is mounted, inspection is performed for each inlet unit of the continuous inlet in a web shape, and if the rejection is determined, the conductivity is determined for each rejected inlet unit for which the determination is made. A marking method for a defective inlet sheet, characterized in that the marking is performed with a conductive material.

  According to a second aspect of the present invention, in the manufacturing process of an inlet sheet for a non-contact IC tag in which an IC chip having a transmission / reception function, a processing function, and a memory function is mounted on an antenna pattern formed on an inlet base film, Inspecting each inlet unit of the continuous inlet in a web shape before the chip is mounted, and if it is determined to be rejected, the conductivity is determined for each rejected inlet unit that has been determined. A marking method for a defective inlet sheet, characterized by marking with a material.

  In the above-described defective inlet sheet marking method, the conductive material is marked by (1) application of conductive carbon ink, or (2) conductive ink or adhesive containing any of silver, copper, or aluminum powder. Or (3) by applying an aluminum foil seal. In addition, the marked part by the conductive material should be any one of (1) the connection part of the IC chip, (2) the antenna pattern part, and (3) the entire non-contact IC tag circuit surface. Can do.

In the defective inlet sheet marking method of the present invention (Claim 1 and Claim 2), since the inlet sheet is marked with a conductive material when an inlet defect is detected, the IC chip connecting portion, Since the short circuit occurs between the antenna pattern lines or the electromagnetic wave is cut off, the function of the inlet is surely in a defective state, so that the inlet or IC tag whose function has been restored afterwards, like marking after normal inspection Can be handled as a normal product by mistake and the reliability of the product can be improved.
In the defective inlet sheet marking method of the present invention (Claim 2), since the inspection is performed before the IC chip is mounted, the waste of mounting the IC chip when the antenna itself is defective can be eliminated.

The marking method for the defective inlet sheet will be described below with reference to the drawings.
FIG. 1 is a diagram showing a marking method for a defective inlet sheet according to the present invention, FIG. 2 is a diagram showing a form of a non-contact IC tag 1 connected, and FIG. 3 is a cross-sectional view of a unit of non-contact IC tag. 4 is a flowchart showing a manufacturing process of the non-contact IC tag.

  For convenience of understanding, a non-contact IC tag will be described first. FIG. 2 is a diagram showing a form of the connected non-contact IC tag 10R. It is the state seen through the surface protection sheet. As shown in FIG. 2, the non-contact IC tag 10 </ b> R is formed by continuously forming the antenna pattern 2 at a constant pitch in one row on the base film 11 that is continuous in a strip shape, and the IC chip 3 is attached to the end of the antenna pattern 2. Wearing. The IC chip 3 is a normal one having a transmission / reception function, a processing function, a storage function, and the like. The bridge 12 is a member that is connected through the back surface of the base film 11 in order to guide one end of the antenna to the IC chip 3.

In FIG. 2, the antenna pattern 2 is a flat coil shape, but it may be a two-pole patch antenna or a half-wave bipole antenna. Usually, it consists of a pattern in which a metal foil laminated on the base film 11 is photo-etched or printed with conductive ink. In the present invention, the sheet before and after mounting the IC chip 3 on the film on which the antenna pattern 2 is formed is referred to as an inlet sheet.
By covering the inlet sheet with a surface protection sheet and processing the adhesive on the back side, the non-contact IC tag 10R is completed. The separation line 13 is provided after lamination of the surface protection sheet or the like, and is not formed at the stage of the inlet sheet.

  FIG. 3 is a schematic cross-sectional view of one unit of the non-contact IC tag 10. The surface of the antenna pattern 2 and the IC chip 3 is covered with a surface protection sheet 4 with an adhesive layer 5 interposed therebetween. For the surface protection sheet 4, the same kind of base material as the base film 11, another kind of plastic film, a paper base material, or the like is used. In FIG. 3, the base film 11 and the adhesive layer 5 are illustrated as having a gap, but are actually in close contact. When the non-contact IC tag 10 is used as a label, the adhesive layer 6 is provided on the surface of the base film 11 on the adherend side. The pressure-sensitive adhesive layer 6 is protected by a release paper 7 having a release surface, and is used by removing the release paper 7 during use.

  The present invention relates to a method for marking a defective inlet sheet. Since the inlet sheet is a form prior to manufacturing the non-contact IC tag, it is of course a continuous form for easy processing. The continuous form is a form in which unit inlet sheets are arranged in one or two or more rows and are continuous in a web shape. Although the surface protective sheet 4, the pressure-sensitive adhesive layer 6, and the release paper 7 are in a state before being processed, the planar shape can be considered in the same manner as the connecting body 10R of the non-contact IC tag in FIG.

FIG. 1 is a diagram showing a marking method for a defective inlet sheet according to the present invention.
FIG. 1A shows a mark 8 formed of a conductive ink or a conductive adhesive, for example, a conductive ink containing conductive carbon, a conductive ink containing silver, copper, or aluminum powder, or an adhesive. It is an example applied to the connection part of the IC chip 3 including Although it may be applied only to the connection portion of the IC chip 3, it is applied so as to surely short-circuit the two antenna wire end portions 2a and 2b. In this case, since the two antenna wire end portions 2a and 2b of the IC chip 3 are short-circuited, the function of the antenna is lowered and normal non-contact communication becomes impossible.

FIG. 1B shows an example in which a mark 8 made of conductive ink containing conductive carbon, conductive ink containing silver, copper, or aluminum powder or an adhesive is applied to the antenna pattern portion. The application position may be any position on the antenna pattern 2.
In the case of the illustration, it is applied so as to cover all the lines of the electromagnetic induction type coiled antenna, but it may be applied between some of the lines. As a result, the resonance frequency of the LC circuit of the antenna changes, and normal non-contact communication becomes impossible. In the case of a half-wave dipole antenna, the antenna characteristics change similarly.

  FIG. 1C shows a metal foil seal, in particular, an aluminum foil seal 9 having an adhesive layer (inside of the broken line) attached to the entire contactless IC tag circuit surface of the inlet sheet 1. In this case, since the electromagnetic wave reaching the non-contact IC tag 10 is blocked by the metal (aluminum) foil, the IC tag 10 cannot receive a signal from the reader / writer and cannot obtain power, and therefore does not respond. Since there is usually a non-conductive adhesive layer on the back surface of the aluminum foil, a short circuit of the circuit does not occur. However, if the adhesive layer is made conductive, it can be short-circuited. The non-contact IC tag circuit is a circuit composed of the antenna pattern 2 and the IC chip 3.

In the defective inlet sheet marking method of the present invention, inspection is performed at the stage of the inlet sheet 1, and the detected defective inlet is marked as described above, and the subsequent processing is performed as it is. Therefore, the mark 8 or the aluminum foil seal 9 applied by applying conductive ink or adhesive is applied to a thin layer so as not to hinder subsequent processing, and the metal foil seal is also a thin layer. Like that. Moreover, peeling during processing is prevented. The malfunctioning inlet sheet 1 remains in the IC tag connecting body in a marked state, but is removed when it is cut into a unit IC tag and delivered.
Usually, the ratio of the defective inlet sheet to the non-defective product is extremely small and clear marking is provided, so that it can be removed at the stage of use, and there is no problem even if it is delivered in a wound state.

Next, a method for manufacturing a non-contact IC tag including manufacturing of an inlet sheet will be described.
FIG. 4 is a flowchart showing a manufacturing process of a non-contact IC tag. FIG. 4A shows a case where the first inspection is performed after mounting the IC chip, and FIG. 4B shows a state before mounting the IC chip. The case where the first inspection is performed is shown. Although the process of forming the antenna by photoetching is described, a printing method using conductive ink may be used.

  First, the flowchart of FIG. 4A will be described. S <b> 1 of the manufacturing process is a preparation process of the base film 11. In this step, the base film 11 is prepared by laminating a metal foil as a base material. Various materials described later can be used for the base film 11, but those having a thickness of about 20 μm to 100 μm are preferably used. As the metal foil, a copper foil or aluminum foil having a thickness of about 10 μm to 30 μm (with an adhesive layer) is usually used.

  S <b> 2 of the manufacturing process is a process of forming the antenna pattern 2. In this step, a photosensitive solution is applied to the metal foil surface of the base film 11 and exposed using a photomask to form an antenna resist pattern. Next, the antenna pattern 2 is left by photoetching. Both end portions 2a and 2b of the antenna pattern 2 are formed simultaneously.

  S3 of the manufacturing process is an IC chip 3 mounting process. In this step, the IC chip 3 is mounted on both ends 2a and 2b of the antenna pattern 2 using an anisotropic conductive adhesive or the like. In order to ensure the connection, there is a case in which a bump having a protruding shape is used so as to pierce the antenna end. If this connection is incomplete, malfunctions often occur. A process of guiding one end of the antenna pattern 2 to the IC chip 3 through the bridge 12 on the back surface of the base film 11 is also performed at the same time. Thereby, the inlet sheet 1 is completed.

S4 of the manufacturing process is a first inspection process of the non-contact IC tag. This inspection is performed after the IC chip 3 of the inlet sheet is mounted. The inspection satisfies standards such as JIS and other manufacturing standards, but generally does not fail if it satisfies practical standards. A typical example of failure is when contactless communication is completely impossible.
This is often caused by a case where the IC chip itself is defective and a connection failure between the IC chip 3 and the antenna pattern 2. The case where the antenna pattern 2 itself is disconnected is also included. The disconnection can be inspected by measuring the resistance value between the terminals of the antenna pattern 2. The cause is not clear, but it also includes the case where no response occurs even when a certain standard electromagnetic wave is applied.

Another example of a malfunction is when the contactless communication distance does not meet the criteria. In the proximity type IC card (the same applies to the IC tag) having an operating range of 70 cm or less, the minimum operating magnetic field strength (H _min ) is set to 150 mA / m rms (JISX6323-2, 6.2 operating magnetic field strength). For this test, it is tested that reading and writing can be performed at a distance of 30 cm using a commercially available reader / writer. An inspection reader / writer may be used.
A proximity IC card (operation range of 10 cm or less) is tested for performance at a shorter distance.

Moreover, you may include the operation | movement test after receiving an alternating magnetic field, an alternating electric field, static electricity, and a static magnetic field. This inspection standard is defined in JISX6323-1 (proximity IC card).
If the above inspection does not satisfy the predetermined standard, as described above, as a malfunction, (1) the connection part of the IC chip, (2) the antenna pattern part, and (3) the entire non-contact IC tag circuit surface Mark any part.

  S5 of the manufacturing process is a surface protection sheet laminating process. The surface protection sheet 4 protects the antenna pattern 2 and the IC chip 3 of the non-contact IC tag 1, and various materials described later can be used. Usually, a base material that is equal to or thinner than the base film 11 is laminated and used. Since water resistance is often required, it is preferable to use a plastic film.

  S6 of the manufacturing process is a coating process of the pressure-sensitive adhesive layer 6. In this step, a process of applying the adhesive layer 6 to the lower surface of the base film 11 is performed. Usually, an adhesive is applied to the release paper 7 and integrated with the base film 11. However, there are applications for IC tags that do not require an adhesive, such as a tag.

S7 of the manufacturing process is a shipping inspection as a final product. It also serves as the second inspection. This is because defects may occur even in the process of processing the inlet sheet into a final product. The non-contact IC tag does not receive the high pressure of the hot press like the manufacturing process of the IC card, but it may be bent during the process of press laminating or moving between rollers in the web shape, which may cause problems. .
The inspection is performed for the first inspection item and, if necessary, an item added thereto. The inlet that has been marked in the first inspection is basically a defective product and is not an object of the second inspection. However, no response can be obtained even for the target.
The newly detected unacceptable non-contact IC tag in the second inspection may be punched out by removing a part of the IC chip 3 or a part of the antenna pattern 2. A predetermined unit of cutting or forming of the separation line 13 in the case of forming a group of connected bodies is performed thereafter.

The flowchart of FIG. 4B is different from FIG. 4A in that the “IC chip mounting” step and the “first inspection” step are interchanged. Since the inspection is performed with the IC chip 3 not attached, the non-contact communication function cannot be inspected by the reader / writer.
Mainly, an image inspection is performed on the antenna and the chip mounting portion pattern. Generally, the dimensional accuracy between the reference pattern and the inspection target pattern is inspected. For example, a standard such as ± 50 μm is adopted for the dimensional accuracy of the chip mounting portion, and ± 0.2 mm is adopted for other unimportant portions. A contact test such as a resistance value of the entire antenna pattern may be used in combination.
Other steps in the flowchart in FIG. 4B are the same as those in FIG.

Embodiments relating to materials (1) Base film A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyimide, cellulose diacetate, cellulose triacetate, Polystyrene, ABS, polyacrylate, polypropylene, polyethylene, polyurethane, and the like.

(2) Surface protection sheet A wide variety of plastic films and paper substrates can be used. As the plastic film, those mentioned in the above base film can be used, and as the paper substrate, high-quality paper, coated paper, craft paper, glassine paper, synthetic paper, latex, melamine-impregnated paper, and the like can be used. For printer printing on the surface, fine paper, coated paper, etc. are particularly preferred.

(3) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Various resin compositions such as natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, acrylic, acrylate copolymer, polyvinyl alcohol, phenol resin, etc. Material can be used.

(4) Conductive material for marking In the case of a conductive carbon ink, a conductive carbon ink is used by increasing the filling amount of carbon black. In the case of highly conductive carbon black such as ketjen black, the filling amount can be reduced.
Conductive inks and adhesives containing silver, copper, or aluminum powder can be used. In the case of ink, conductive ink made of silver, copper, or aluminum powder having a particle diameter of about 0.05 to 2 μm is used. Silk screen printing ink for printed circuit boards may be sprayed or brushed, or ink jet ink may be ink jet printed. In the case of an aluminum foil seal, a seal in a state where copper, iron, or aluminum foil having a thickness of about 5 to 6 μm to 20 μm is held on a release paper via an adhesive layer can be used. It is preferable to use a product manufactured in advance to a predetermined inlet size.

Hereinafter, actual embodiments will be described using examples.
As a base film 11 for an inlet sheet, a base material obtained by dry laminating an aluminum foil having a thickness of 18 μm on a transparent biaxially stretched polyethylene terephthalate (PET) film having a thickness of 38 μm was used. The photomask it had was exposed and exposed. After exposure and development, photoetching was performed to complete an inlet sheet 1 having an antenna pattern 2 as shown in FIG. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

  The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was attached to the antenna pattern both ends 2a and 2b of the inlet base film 11 by applying heat pressure in a face-down state. A process of conducting one end of the antenna pattern 2 through the back surface of the base film 11 to the end 2a of the antenna pattern 2 via the bridge 12 was also performed.

  When the inlet sheet 1 was completed, the first function test was performed. For this, a commercially available IC tag reader / writer ("RCT-200-01" manufactured by Weltcat Co., Ltd .; 13.56 MHz) is used, and a response is obtained from the target non-contact IC tag at a distance of 30 cm from the reader / writer. Whether or not it was inspected. Since the inlet sheet was wound up, the surrounding non-contact IC tag was shielded so that a response could be obtained from one of the objects. When no response was obtained, a conductive ink made of carbon black was applied by inkjet and marked.

  Next, a surface protective sheet (PET film) 4 having a thickness of 20 μm was laminated through a polyester hot melt adhesive and laminated by hot pressing. Finally, the back surface of the base film 11 is subjected to an adhesive processing in which a release paper 7 is laminated via an adhesive layer 6 having a thickness of 20 μm, and one unit of a 54 mm × 86 mm non-contact IC tag has 5 units in a row. The non-contact IC tag product 10R with the release paper 7 was completed. The process which provides the parting line 13 between the non-contact IC tags of the unit was also performed.

  After the final product was completed, the second function test was performed under the same conditions (except for the contact test) as the first function test after the inlet sheet was completed. A new malfunctioning non-contact IC tag detected in the subsequent inspection was punched by punching out the IC chip 3 portion.

  As a base film 11 for an inlet sheet, a base material obtained by dry laminating an aluminum foil having a thickness of 18 μm on a transparent biaxially stretched polyethylene terephthalate (PET) film having a thickness of 38 μm was used. The photomask it had was exposed and exposed. After exposure and development, photoetching was performed to complete an inlet sheet 1 having an antenna pattern 2 as shown in FIG. A process of conducting one end of the antenna pattern 2 through the back surface of the base film 11 to the end 2a of the antenna pattern 2 via the bridge 12 was also performed. One antenna pattern 2 has an outer shape of approximately 45 mm × 76 mm.

A first inspection was performed when the antenna pattern 2 was formed. This is an image inspection of the chip mounting portion and the antenna shape. The dimensional accuracy of the chip mounting portion is ± 50 μm, the dimensional accuracy of other unimportant portions is ± 0.2 mm, and an aluminum foil seal 9 is pasted on the entire surface of the IC tag circuit on the inlet sheet that deviates from the standard value. .
The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was attached to both non-defective antenna pattern end portions 2 a and 2 b of the inlet base film 11 in a face-down state by applying heat pressure.

  Next, a surface protective sheet (PET film) 4 having a thickness of 20 μm was laminated through a polyester hot melt adhesive and laminated by hot pressing. Finally, the back surface of the base film 11 is subjected to an adhesive processing in which a release paper 7 is laminated via an adhesive layer 6 having a thickness of 20 μm, and one unit of a 54 mm × 86 mm non-contact IC tag has 5 units in a row. The non-contact IC tag product 10R with the release paper 7 was completed. The process which provides the parting line 13 between the non-contact IC tags of the unit was also performed.

  After the final product was completed, a second functional test was performed. For this, a commercially available IC tag reader / writer ("RCT-200-01" manufactured by Weltcat Co., Ltd .; 13.56 MHz) is used, and a response is obtained from the target non-contact IC tag at a distance of 30 cm from the reader / writer. Whether or not it was inspected. An aluminum foil seal 9 was adhered to a new non-contact IC tag having a malfunction that was detected in the subsequent inspection.

It is a figure which shows the marking method of the defective inlet sheet of this invention. It is a figure which shows the general form of a non-contact IC tag. It is sectional drawing of the non-contact IC tag of 1 unit. It is a flowchart which shows the manufacturing process of a non-contact IC tag.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Inlet sheet 2 Antenna pattern 3 IC chip 4 Surface protection sheet 5 Adhesive layer 6 Adhesive layer 7 Release paper 8 Mark by conductive ink or conductive adhesive 9 Aluminum foil seal 10R Non-contact IC tag connecting body 11 Base film 12 Bridge 13 Cut line

Claims (4)

In a manufacturing process of an inlet sheet for a non-contact IC tag in which an IC chip having a transmission / reception function, a processing function, and a memory function is mounted on an antenna pattern formed on an inlet base film, after the IC chip is mounted on the antenna pattern, In the stage, the inspection is performed for each inlet unit of the continuous inlet in a web shape, and when the rejection is determined, the conductive material is marked for each rejected inlet unit for which the determination is made. A method for marking a defective inlet sheet. In a manufacturing process of an inlet sheet for a non-contact IC tag in which an IC chip having a transmission / reception function, a processing function, and a memory function is mounted on an antenna pattern formed on an inlet base film, a stage before mounting the IC chip on the antenna pattern In this case, the inspection is performed for each inlet unit of the continuous inlet in the form of a web, and if the rejection is determined, the conductive material is marked for each rejected inlet unit for which the determination is made. A method of marking a defective inlet sheet characterized by Marking with conductive material is either (1) by applying conductive carbon ink, (2) by applying conductive ink or adhesive containing either silver, copper or aluminum powder, or (3) aluminum 3. The marking method for a defective inlet sheet according to claim 1 or 2, wherein the method is either by sticking a foil seal. The marked portion by the conductive material is any one of (1) a connection portion of an IC chip, (2) an antenna pattern portion, and (3) an entire non-contact IC tag circuit surface. The marking method of the defective inlet sheet of Claim 1 or Claim 2.

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