JP2008310540A - Non-contact IC tag having IC chip destruction prevention and communication inhibition suppression structure - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a non-contact IC tag label which prevents an IC chip from being broken by receiving an external force and does not inhibit communication even when used for a metal body.
A contactless IC tag label 1 (first form) according to the present invention has a structure in which an IC chip with a storage function capable of reading information in a contactless manner and an antenna coil 2 for transmitting and receiving electromagnetic waves are electrically connected. A non-contact IC tag label having a surface protective sheet 4 on the side opposite to the antenna coil 2 and having an adhesive layer 7 attached to the adherend on the antenna coil 2 surface side. Two strip-shaped structures 10a and 10b made of a magnetic material sheet between the adhesive layer 7 and the inlet base 11 to be worn and made of bendability imparted on both sides of the IC chip 3 are parallel strips. The IC chip 3 is positioned within the width of the belt-like groove so as to form a plurality of grooves.
[Selection] Figure 1

Description

The present invention relates to a contactless IC tag having an IC chip destruction prevention and communication inhibition suppression structure. Specifically, a strip-shaped structure made of a magnetic material sheet that protects the IC chip is inserted into the IC chip layer structure at intervals so as to form a parallel groove on both sides of the IC chip. The present invention relates to a non-contact IC tag in which an IC chip is positioned so that the IC chip is not directly subjected to external force and has an effect of suppressing communication inhibition when arranged on a metal surface.
Such non-contact IC tags can be used as normal IC tags, especially when used in environments where IC tags are subject to external forces, such as transportation and logistics, product manufacturing processes, construction sites, or metal surfaces. Non-contact IC tag that can be suitably used for

Non-contact type IC tags record and hold information and can exchange information by communicating with external devices in a non-contact manner, so that they can be used as recognition media in transportation and logistics, or for various purposes such as product quality control and inventory management. It has come to be used frequently.
However, when a non-contact type IC tag is used as a physical distribution label, inevitable stress is often applied from the outside during physical distribution. In particular, when the IC chip part receives an impact, it is fatally damaged. Therefore, a structure for protecting the IC chip portion has been conventionally considered. However, there is a problem that a non-contact IC tag cannot be manufactured at a low cost because of a complicated structure.
In particular, a non-contact IC tag having a flat surface (planar surface) has been demanded in the past, and the problem of increasing the manufacturing load for realizing this is significant.

  As an inevitable structural problem of the non-contact IC tag, there is a problem that the thickness of the IC chip is much larger than that of the inlet base or the like. Although the IC chip is reduced in size and thinned, recent IC chips also have a planar size within 0.2 mm to 2 mm square and a thickness of 100 μm to 500 μm. Therefore, even if the antenna coil is formed on the inlet base surface, the IC chip is mounted, and the surface protection member is covered and flattened, the IC chip portion becomes bulky when the IC tag labels are stacked. The sheet on which the antenna coil is formed is often called an “inlet” or “inlet base” by being fitted between the front and back layers as an intermediate sheet of an IC card or IC tag. The same is true for an “antenna sheet”.

This stacked state can be considered as a case where the IC chip is damaged. When non-contact IC tag labels are used, several to dozens are often stacked. To make it easier to use, it is normal to align the labels. Inevitably, the IC chip portions will inevitably overlap in the vertical direction. When a heavy object is placed on the label in the stacked state, any one of the IC chips that are in a vertical positional relationship receives an impact, and the IC chip that is a silicon crystal is destroyed. In this case, a defective label is suspected in an unused state. Another cause is that even when an IC tag attached to a hard adherend collides with another hard object, the protruding IC chip portion is susceptible to impact.
The cause of the failure of the IC chip is not only these causes, but it is considered that the thick IC chip 3 is easily damaged when it contacts or collides with a hard structural material such as metal.

For reference, an actual common contactless IC tag embodiment is illustrated in FIG.
In the non-contact IC tag 1, an antenna coil 2 is formed on the surface of the inlet base 11, and an IC chip 3 is attached to both ends 2a and 2b of the antenna coil 2 in the form of a wire coil. In FIG. 11, an antenna coil 2 is formed by photo-etching a metal foil laminated on a transparent inlet base 11, as viewed from the surface side to be attached to an adherend. One end of the antenna coil 2 is connected to the conducting member 17 passing through the back surface of the inlet base by using a caulking tool or the like so as to communicate with both ends 2 a and 2 b of the antenna coil connected to the IC chip 3. The pads of the IC chip 3 are connected to both end portions 2a and 2b by a conductive adhesive or the like. Although not shown, a thickness adjustment pattern may be provided around the IC chip 3, but the metal foil for antenna has a thickness of about 20 μm to 35 μm and does not correspond to the thickness of the IC chip 3.

In general, when the antenna coil of the non-contact IC tag receives a magnetic flux loop from the reader / writer, a magnetic flux loop is generated around the antenna line when there is no metal body in the vicinity.
On the other hand, when there is a metal body in the vicinity of the antenna coil, an eddy current is generated in the metal body, and the demagnetizing field generated by the generated eddy current acts so as to cancel the magnetic flux loop. As a result, it is known that only a small magnetic flux loop remains only in the peripheral portion of the antenna line, and the communication distance is remarkably shortened. Another object of the present invention is to reduce the influence of such a metal body that is received by a non-contact IC tag.

  Patent Documents 1 and 2 are documents related to a non-contact IC card belonging to the same technical field as the non-contact IC tag. In any case, it is an object to realize a uniform thickness of the entire IC card and smooth the surface. Non-contact IC tags have been flattened to achieve the same problem, but the selection of materials and the like is limited in non-contact IC tags that are desired to be low in price. Further, there has been a problem that even if the surface is as flat as possible, the above-mentioned damage to the IC chip cannot be completely prevented. Patent Document 3 relates to a method of manufacturing an IC tag label, but has a problem of realizing a flat (planar) IC tag label. Patent Document 4 is related to a prior application having the same meaning as the present application regarding the IC chip destruction preventing structure, but differs from the present application in that a strip-shaped structure made of a magnetic material sheet is not used. Patent Document 5 relates to a prior patent document that uses a magnetic material sheet for a non-contact IC tag.

JP-A-7-266767 JP-A-8-194801 Japanese Patent Laid-Open No. 2003-67708 JP 2006-330967 A JP 2007-102513 A

Although the IC chip destruction prevention function can be achieved by the non-contact IC tag of Patent Document 4, there is a problem that communication inhibition cannot be suppressed when used on a metal surface. On the other hand, the non-contact IC tag label of Patent Document 5 can reduce communication inhibition when used on a metal surface, but has a problem of not having an IC chip destruction prevention function.
Therefore, the present invention has been completed by studying the realization of an IC tag label that has an IC chip destruction prevention function and that does not cause communication inhibition even when used on a metal surface.

  The first of the gist of the present invention that solves the above problems has a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base. In a non-contact IC tag label having a surface protection sheet on the side opposite to the inlet-based antenna coil and having an adhesive layer attached to the adherend on the inlet-base antenna coil surface side The non-contact IC tag label has two strip-like structures made of a magnetic material sheet between the pressure-sensitive adhesive layer to be adhered to the adherend and the inlet base, and bendable on both sides of the IC chip. The body is disposed at intervals so as to form parallel strip-shaped grooves, and the IC chip is positioned within the width of the strip-shaped grooves. Noncontact IC tag label having a communication inhibiting suppressing structure and C chip fracture prevention, in.

  The second of the gist of the present invention for solving the above problems has a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base. A non-contact IC tag label having a surface protective sheet on the side surface of the inlet-based antenna coil and a pressure-sensitive adhesive layer attached to the adherend on the side surface opposite to the inlet-based antenna coil, The non-contact IC tag label has two strip-like structures made of a magnetic material sheet between the pressure-sensitive adhesive layer and the inlet base to be adhered to the adherend, and which has been subjected to bending imparting processing on both sides of the IC chip. Are arranged at intervals so as to form parallel strip-shaped grooves, and the IC chip is positioned within the width of the strip-shaped grooves. Noncontact IC tag label having a communication inhibiting suppressing structure and C chip fracture prevention, in.

  A third aspect of the present invention that solves the above problems has a structure in which an IC chip with a storage function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base. A non-contact IC tag label having a surface protection sheet on the side opposite to the inlet base antenna coil, a rear surface protection sheet on the side of the inlet base antenna coil, and an adherend on the side of the inlet base antenna coil In the non-contact IC tag label further having a pressure-sensitive adhesive layer to be attached, the non-contact IC tag label is between the pressure-sensitive adhesive layer to be attached to the adherend and the back protective sheet, and is provided with flexibility on both sides of the IC chip. The two strip-shaped structures made of the magnetic material sheet are arranged at intervals so as to form parallel strip-shaped grooves, and the IC chip There noncontact IC tag label, in having a communication inhibiting suppressing structure and IC chip fracture prevention, characterized in that it is to be located within the strip groove width.

  A fourth aspect of the present invention that solves the above problems has a structure in which an IC chip with a storage function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base. A non-contact IC tag label having a two-layer surface protection sheet on the side surface of the inlet-based antenna coil and a pressure-sensitive adhesive layer attached to the adherend on the side surface opposite to the inlet-based antenna coil In the contact IC tag label, the non-contact IC tag label is formed of a magnetic material sheet between the pressure-sensitive adhesive layer to be adhered to the adherend and the back protective sheet, and made of a magnetic material sheet in which flexibility is applied to both sides of the IC chip. The strip-shaped structures are arranged at intervals so as to form parallel strip-shaped grooves, and the IC chip is positioned within the width of the strip-shaped grooves. Noncontact IC tag label having a communication inhibiting suppressing structure and IC chip breakdown prevention which, in.

  In the non-contact IC tag label having the IC chip breakage prevention and communication inhibition suppressing structure, the magnetic material sheet subjected to the flexibility imparting process can have a uniform thickness of 50 μm to 250 μm. Can be as perforated.

The non-contact IC tag label (hereinafter also simply referred to as “non-contact IC tag label”) having an IC chip destruction prevention and communication inhibition suppression structure according to the present invention is flexible so as to form parallel grooves on both sides of the IC chip. Since two strip-shaped structures made of magnetic material sheets that have been applied are inserted, the IC chip is located in the groove and is not easily subject to external forces, and handles ordinary non-contact IC tag labels. However, the IC chip is less likely to be damaged like a conventional non-contact IC tag label.
Since the non-contact IC tag label of the present invention has a strip-shaped structure made of a magnetic material sheet between the inlet base and the adherend, even if it is attached to an object made of a metal material or a metal container, Since the magnetic material sheet is located between the antenna coil and the metal body, it is possible to reduce the influence of communication inhibition due to the demagnetizing field caused by the metal.
In addition, since the bendability imparting process is applied to the magnetic material sheet, the non-contact IC tag label has a bendability and can be easily attached to an adherend having a curved surface. Furthermore, the label does not float over time after being applied and does not peel off spontaneously.

  The present invention relates to a contactless IC tag label having an IC chip destruction prevention and communication inhibition suppression structure, which will be described below with reference to the drawings. 1 is a schematic plan view showing an example of a non-contact IC tag label according to the present invention, FIG. 2 is a sectional view of a first embodiment, FIG. 3 is a sectional view of a second embodiment, and FIG. 4 is a sectional view of a third embodiment. FIG. 5, FIG. 5 is a sectional view of the fourth embodiment, FIG. 6 and FIG. 7 are diagrams of a magnetic material sheet that has been subjected to bending imparting processing by a perforation line, and FIG. 8 illustrates a processing method of a non-contact IC tag label FIG. 9 is a diagram for explaining a method for producing a non-contact IC tag label, and FIG. 10 is a diagram for explaining another method for producing a non-contact IC tag label.

As shown in FIG. 1, the non-contact IC tag label 1 of the present invention has an antenna coil 2 formed on the surface of an inlet base 11 and has IC chips 3 attached to both ends 2a and 2b thereof.
Since the surface of the non-contact IC tag label 1 is covered with the protective sheet 4, the antenna coil 2, the IC chip 3, and the strip-shaped structures 10a and 10b are not actually visible from the appearance.
Strip-like structures 10a and 10b made of a magnetic material sheet having a uniform thickness are inserted on both sides of the IC chip 3, and strip-like grooves 9 are formed by the strip-like structures 10a and 10b.
As will be described later, the strip-like structures 10a and 10b made of a magnetic material sheet are subjected to flexibility imparting processing. Since the strip-like structures 10a and 10b have a thickness corresponding to the thickness of the IC chip 3 or a thickness that can reduce the protrusion of the IC chip 3, they serve as a protective wall for the IC chip 3, It is possible to mitigate an impact caused by an external force when 3 comes into contact with the IC chip 3 of another non-contact IC tag label or collides with another hard object.

  The width L of the groove 9 is required to accommodate at least the IC chip 3 and is related to the planar size of the IC chip 3, but in the case of an IC chip having a side of less than 1.0 mm, usually 1.0 mm to 5. A width of about 0 mm is sufficient. This is because if the width is too wide, the strip-like structures 10a and 10b do not play a role of a protective wall against a pointed object, and no impact mitigating effect is produced.

Since the non-contact IC tag label 1 of the present invention is in four different embodiments depending on the layer structure, it will be described in order below. FIG. 2 is a cross-sectional view of the first embodiment (claim 1).
In the first embodiment, strip-shaped structures 10a and 10b made of a magnetic material sheet are bonded to the surface of the antenna coil 2 of the inlet base 11, and the adhesive layer 7 is applied to the surfaces of the strip-shaped structures 10a and 10b. The pressure-sensitive adhesive layer 7 is protected by the release paper 8. The surface of the inlet base 11 opposite to the antenna coil 2 is covered with a surface protective sheet 4 via an adhesive layer 6a. In the first form of FIG. 2, even when the non-contact IC tag label 1 is attached to a metal body with the adhesive layer 7, the strip-shaped structures 10 a and 10 b made of a magnetic material sheet are provided between the metal body and the antenna coil 2. Since it is interposed, communication inhibition can be suppressed.

  As the magnetic material sheet 10, a material obtained by dispersing a magnetically permeable material in a polymer, a material obtained by coating a plastic sheet with a permeable magnetic material, or the like is used. However, the material is not particularly limited as long as the magnetic flux loop flowing through the metal body as the adherend is reduced, the effect of suppressing the generation of the demagnetizing field and the flexibility imparting process can be performed. The release paper 8 is a material having a releasable surface and is a material for protecting the pressure-sensitive adhesive layer 7. When adhering to the adherend, the release paper 8 is removed and the adhesive layer 7 is applied. In many cases, the pressure-sensitive adhesive layer 7 is applied to the release paper 8 in advance, and this is adhered to the strip-shaped structures 10 a and 10 b of the IC tag label 1.

  Adhesive layers 6a and 6b are shown between the surface protection sheet 4 and the inlet base 11 and between the strip-like structures 10a and 10b made of the inlet base 11 and the magnetic material sheet, but are not limited to adhesives. It may be a pressure-sensitive adhesive, or may be bonded with molten polyethylene or the like, regardless of the bonding means.

FIG. 3 is a sectional view of the second embodiment (claim 2). In the second embodiment, the surface of the antenna coil 2 of the inlet base 11 is covered with a surface protection sheet 4 via an adhesive layer 6a, and a strip-like structure 10a made of a magnetic material sheet is provided on the side surface opposite to the antenna coil 2. 10b is bonded via the adhesive layer 6b. An adhesive layer 7 is further applied to the surfaces of the strip-shaped structures 10 a and 10 b, and the adhesive layer 7 is protected with a release paper 8.
At first glance, in this structure, it seems that the IC chip 3 is not protected by the strip-shaped structures 10a and 10b, but the vertical dimension is enlarged, and the groove width is actually compared with the thickness of the substrate. Since L becomes sufficiently large and the inlet base 11 is deformed, the IC chip 3 is housed in the groove 9 together with the inlet base 11 and is sufficiently protected. Such a protective structure is the same in the case of FIGS. 4 and 5 below. Since the strip-shaped structures 10a and 10b made of a magnetic material sheet are interposed between the metal body to be deposited and the antenna coil 2 in the second form, communication inhibition can be suppressed.

FIG. 4 is a cross-sectional view of the third embodiment (Claim 3). In the third embodiment, the surface of the antenna coil 2 of the inlet base 11 is covered with the back protective sheet 5 via the adhesive layer 6a, and the opposite side surface of the antenna coil 2 is covered with the surface protective sheet 4 via the adhesive layer 6c. Has been. Further, the strip-shaped structures 10a and 10b are bonded to the surface of the back protective sheet 5, the pressure-sensitive adhesive layer 7 is applied to the surfaces of the strip-shaped structures 10a and 10b, and the pressure-sensitive adhesive layer 7 is attached to the release paper 8 It has a structure to protect with. In this structure, it is considered that the back protective sheet 5 is preferably a plastic film rather than a paper base material because it is necessary to strengthen the structure.
As is apparent from the observation of the configuration of the third form, the upper part S from the back protective sheet 5 has the same structure as a normal non-contact IC tag having no IC chip protection structure (a form having no adhesive layer). It is. Therefore, if the strip-like structures 10a and 10b are bonded to a normal non-contact IC tag and the adhesive layer 7 and the release paper 8 are provided, the non-contact IC tag label 1 having a structure for preventing IC chip destruction and suppressing communication inhibition. Is completed. This form is effective for producing the IC tag label 1 of the present invention urgently using an off-the-shelf IC tag.

FIG. 5 is a sectional view of the fourth embodiment (claim 4). In the fourth embodiment, the surface of the antenna coil 2 of the inlet base 11 is covered with a surface protective sheet 4 via an adhesive layer 6a, and a strip-shaped structure 10a made of a magnetic material sheet is provided on the side surface opposite to the antenna coil 2. , 10b are bonded via an adhesive layer 6b. An adhesive layer 7 is applied to the surfaces of the strip-shaped structures 10 a and 10 b and the adhesive layer 7 is protected by a release paper 8. The structure so far is the same as the second embodiment, but the fourth embodiment is characterized in that the outer surface of the surface protective sheet 4 is further covered with the second surface protective sheet 4s via the adhesive layer 6c. . In this structure, it is considered that the surface protective sheet 4 is preferably a plastic film rather than a paper base material because it is necessary to strengthen the structure.
The fourth embodiment has a feature that a display or the like can be newly added to the second surface protection sheet 4s for the non-contact IC tag label 1 which has been once completed.

In the above configuration, the strip-like structures 10a and 10b are made of a magnetic material sheet that has been subjected to flexibility imparting processing. The thickness of the strip-shaped structures 10a and 10b is complete as a function of preventing destruction if the thickness is equivalent to that of the IC chip 3, but it is 1/10 of the IC chip 3 even if the thickness is not equivalent to that of the IC chip 3. A sufficient effect can be obtained even when the thickness is about 1/2.
Even when the strip-like structures 10a and 10b made of a magnetic material sheet do not have the same thickness as the IC chip, the surface protection sheet 4 and the inlet base 11 are interposed between the stacked IC tag labels. This is because an impact that directly collides between the IC chips 3 can be alleviated. Therefore, if the thickness of the IC chip 3 is 500 μm, a remarkable IC chip destruction prevention effect can be obtained if it has a thickness of about 50 μm to 250 μm, preferably about 100 μm to 250 μm. However, when the thickness of the IC chip 3 is 500 μm, a significant IC chip destruction preventing effect cannot be obtained with the thickness of the strip-like structures 10 a and 10 b less than 50 μm.

  The magnetic material sheets of the strip-shaped structures 10a and 10b are high magnetic permeability sheet-like magnetic bodies. Usually, ferrite is used, but there are a) one composed of ferrite alone, b) one composed of a composite material of ferrite and plastic, c) one composed of a composite material of ferrite and metal, plastic.

  As the ferrite, ferrite powder or flakes are used. As the plastic, a thermoplastic plastic with good processability can be used, or a thermosetting plastic with good heat resistance can be used. As the metal powder, carbonyl iron powder, atomized powder such as iron-permalloy, reduced iron powder, and the like are used. In addition to molding using plastic, a sintered body or compact of metal powder and ferrite powder may be used. Amorphous magnetic sheets are also known as new materials. The thickness of the magnetic material sheet can also be the same as that of the above paper or plastic film.

The strip-shaped structures 10a and 10b are required to be subjected to flexibility imparting processing. This is because when the IC tag label is attached to the adherend, it is necessary to bend it flexibly along the surface (particularly the curved surface) of the adherend. Although it is considered that the flexibility imparting process can be performed by various methods, in the present invention, the magnetic material sheet is mechanically perforated or perforated.
The 1st form is forming a perforation line or a half cut line in a magnetic material sheet, and performing flexibility imparting processing, and the 2nd form is a needle hole or a half cut hole in a magnetic material sheet. It is to perform a flexibility imparting process by perforating.

  As a method for easily forming perforation lines and half-cut lines, there is a method of incorporating a disk-shaped die blade into a die-cut cylinder. A disc-shaped blade plate made of stainless steel or the like having a constant thickness is used with a sharp tip. Only the cutting edge is incorporated so that it protrudes slightly from the die-cut cylinder. In order to make parallel lines of perforated lines, they are incorporated in a plurality of rows. As the roller (anvil roller) facing the die-cut cylinder, a steel cylinder is often used because of durability requirements. As a simpler method, there is a case in which a perforated blade type is formed in a tape shape on a metal material of a blade plate and adhered to a die-cut cylinder surface for use. However, this method is suitable for soft materials such as paper, and the durability is insufficient with a hard magnetic material sheet.

  There are various methods for mechanically performing drilling and half-cut processing, but a rotary die apparatus is usually used. When making the die die blade the most durable die-cut cylinder, use a strong and wear-resistant material such as carbon steel or special steel for blades (for example, high-speed steel) on the surface. Formed by embossing the mold blade. The mold blade is hardened to the surface or an appropriate depth and polished so as to have an appropriate cutting angle. However, the manufacturing cost of this cylinder is expensive, and it is difficult to remanufacture it every time it is worn out.

6 and 7 are diagrams of a magnetic material sheet that has been subjected to flexibility imparting processing. Both are perforated lines. FIG. 6A shows a long chain line, which is a combination of a short broken line and a long broken line. FIG. 6B shows a two-point long chain line, which is a combination of a short two-dot broken line and a long broken line. FIG. 6C is a dotted line, and short broken lines are continuous. These are examples of broken lines that can be easily processed, and any of them can be used. The long broken line is 2 mm to 5 mm, and the short broken line is 0.2 mm to less than 2 mm. The distance between perforations can be about 2 mm to 20 mm.
7A is an example in which the broken lines are aligned from the edge of the sheet, and FIG. 7B is an example in which the broken lines are staggered at the edge of the sheet. FIG. 7C shows an example in which long broken lines are aligned. Either of them can be used, but it is preferable from the viewpoint of improving the strength of the label that the perforation line does not contact the edge.

In addition, a needle hole may be perforated, or the perforation may be formed relatively densely in a dotted shape by a sharp punching blade or the like penetrating the sheet. Moreover, you may form a half cut hole. The maximum cutting length of the half-cut hole is suitably about 0.1 mm to 3.0 mm. Half-cut holes are also formed relatively densely in the form of dots. In these cases as well, it is appropriate to use a die-cut roll when processing continuously. The surface on which the half-cut hole is formed may be a surface to which a pressure-sensitive adhesive layer is applied later when used for a non-contact IC tag label, or the opposite surface.
Even if perforations or broken lines are formed, the function as a sheet support is lost if the holes are densely perforated to such an extent that the structure of the magnetic material sheet 10 is destroyed. The standard of the number of perforations is about 0.5 to 20 / cm ² , more preferably about 1 to 10 / cm ² . Further, it is necessary to uniformly and uniformly perforate the entire magnetic material sheet.

Various types of magnetic material sheets are commercially available, and materials that can be processed such as perforation and perforation lines are sheets obtained by dispersing a magnetically permeable material in a polymer, and magnetic material coated sheets.
It is considered that a sintered material such as a ferritic material and a metal is difficult to perforate and does not cause bending even when perforated. As polymer dispersion sheet materials, magnetically permeable materials such as sendust, ferrite, carbonyl iron, iron-permalloy, etc., rubber-based polymers such as nitrile rubber, chloroprene rubber, silicone rubber, polyurethane rubber, cyclized rubber, chlorosulfonated polyethylene, epoxy Many are dispersed in polymers such as resin and chlorinated polyethylene.
Examples of such commercially available magnetic sheets include product series such as “IRL” and “IRJ” manufactured by TDK Corporation, and “RFID magnetic sheet” manufactured by Nitta Corporation.
Further, although not generally used, a material obtained by coating a permeable magnetic material on a polyethylene terephthalate (PET) sheet or the like may be used.

  The thickness of the magnetic material sheet can be in the range of 50 μm to 3000 μm (3 mm). However, it is preferably 50 μm to 1000 μm. This is because a material in this range provides flexibility as a label, flexibility imparting processing and subsequent processing suitability, and good adhesion. When the total thickness of the magnetic material sheet is less than 50 μm, it is considered that the flexibility imparting process is not required. Moreover, when it exceeds 3000 micrometers, it is because the thickness of the non-contact IC tag label 1 will become too thick, and a flexibility provision process will also become difficult.

When a non-contact IC tag label is mounted close to a conductive member such as an object made of a metal material or a metal container, an eddy current is generated in the metal of the object behind by an alternating magnetic field generated by electromagnetic waves for transmitting and receiving the IC tag label. Will occur. This eddy current generates a magnetic flux that repels the transmission / reception magnetic flux, which attenuates the transmission / reception magnetic flux, making transmission and reception often difficult.
When a magnetic material sheet is used for the strip-shaped structures 10a and 10b, the transmission / reception magnetic flux passes through the magnetic material sheet, thereby reducing the passage of the magnetic flux in the metal and suppressing the generation of eddy currents. The magnetic material sheet is used for such an effect.

Generally, in a proximity IC card with an operating range of 70 cm or less, the minimum operating magnetic field strength (H _min ) is 150 mA / m rms, the maximum operating magnetic field strength (H _max ) is 5 A / m rms, and H _min and H _max (JISX6323-2). This standard is considered to be applicable to non-contact IC tags as well.
However, in general, when a magnetic material sheet is used for the non-contact IC tag label 1, the communication distance when it is attached to a non-metal surface does not use a magnetic material even if the communication distance when it is attached to a metal surface is increased. Thus, the minimum operating magnetic field strength (H _min ) is increased.

Therefore, when the adherend is a metal surface, the minimum operating magnetic field strength (H _min ) of the non-contact IC tag label 1 is about 1.0 A / m to 3.5 A / m at a communication frequency of 13.56 MHz. When the adherend is a non-metallic surface, the minimum operating magnetic field strength (H _min ) is in the range of about 0.5 A / m to 3.0 A / m at the same communication frequency. It is recognized that it is preferable to ensure stable communication on both a metal surface and a non-metal surface.

  The metal surface is a very thin metal layer. Since a metal layer deposited on a plastic substrate with a thickness of several nanometers also blocks non-contact communication, a metal surface with a thickness greater than this level is also targeted. On the other hand, the non-metallic surface refers to the surface of a composition made of a material other than metal. Even if there is a metal on the lower surface of the non-metallic body, it is affected, so it is necessary that there is no metal within 10 mm from the surface of the antenna coil 2 when the non-contact IC tag label 1 is attached.

<Embodiments related to other materials>
(1) Inlet base A wide variety of plastic films can be used, and the following single films or composite films thereof can be used.
Polyethylene terephthalate (PET), PET-G (terephthalic acid-cyclohexanedimethanol-ethylene glycol copolymer), polyethylene naphthalate (PEN), polyvinyl chloride, vinyl chloride-vinyl acetate copolymer, polycarbonate, polyamide, polyacetal, Examples thereof include polyimide, cellulose diacetate, cellulose triacetate, polystyrene, ABS, polyacrylate, polypropylene, polyethylene, and polyurethane.

(2) Surface protection sheet, back surface protection sheet A wide variety of plastic films and paper base materials can be used. A simple substance or a composite of the above-mentioned paper base material or inlet base film can be used.

(3) Adhesive, pressure-sensitive adhesive In the present specification, the term adhesive refers to various types such as a solvent type, a polymerization type, an ultraviolet curable type, an emulsion type, and a heat-melt type. Shall be included. In either case, the purpose can be achieved by bonding the two materials.
Further, in the present specification, the term “adhesive” refers to an adhesive that keeps an intermediate tack state indefinitely without a significant increase in viscosity.
Adhesive and adhesive resin compositions include natural rubber, nitrile rubber, epoxy resin, vinyl acetate emulsion, polyester, acrylic, acrylate copolymer, polyvinyl alcohol, phenolic resin, Various materials such as can be used.

Next, the manufacturing method of the non-contact IC tag label of this invention is demonstrated.
<Flexibility imparting process of magnetic material sheet>
Since the magnetic material sheet is composed of a relatively large elastic sheet material, a cutting blade is mounted on a rotary die for drilling and perforation processing, and the magnetic material sheet is placed between the anvil roller on the opposite side. It is appropriate to insert and insert a pressure between the rotating rollers. In particular, when the magnetic material sheet has a thickness of about 1 mm or more, a considerable strong pressure is required. The blade plate of the cutting blade has a thickness of 1 mm or less, usually 0.8 mm or less.
As described above, in the case of a perforation line or a half-cut line, a large number of mold blades are arranged in a row at a predetermined interval in parallel with the circumferential direction of the roller and used as a parallel line group. In general, since it is difficult to form a horizontal perforation in a direction perpendicular to the rotation direction of the roller, when forming a perforation line perpendicular to the magnetic material sheet 10, the vertical perforation is once put in the column. Usually, the direction of the sheet is rotated 90 degrees and the perforation is made again.
When the cutting blade is easily damaged by the magnetic material, nitriding treatment or carburizing treatment may be performed, and the vicinity of the tip of the cutting blade may be covered with a diamond-like carbon layer.

<Manufacture of non-contact IC tag labels>
First, the antenna coil 2 is manufactured on a base material to be the inlet base 11 by a process such as photoetching or printing. Next, the IC chip 3 is attached to both end portions 2a and 2b of the antenna coil 2 by an anisotropic conductive adhesive sheet or the like to make electrical connection. The inlet base 11 is laminated with a magnetic material sheet that has been subjected to flexibility imparting processing and the surface protection sheet 4. The surface of the inlet base 11 on which the magnetic material sheet is laminated differs depending on the embodiment. The adhesive layer 7 is processed and attached to the release paper 8 on the surfaces of the strip-like structures 10a and 10b made of a magnetic material sheet.

  After the IC chip 3 is mounted on the antenna coil 2 of the inlet base 11 and before the surface protective sheet 4 is laminated, a step of aligning and inserting the strip-like structures 10a and 10b is necessary. Such a process is sufficiently possible even with an existing automated line. Since the process of forming the antenna coil 2 is well known, the process of inserting the strip-shaped structures 10a and 10b, which is a feature of the present invention, will be described.

  FIG. 8 is a diagram for explaining a processing method of a non-contact IC tag label. The strip-shaped structures 10a and 10b are not laminated in two pieces. Instead, as shown in FIG. 8, the magnetic material sheets 10 are arranged on both sides of the IC chip 3 with predetermined widths 9 between them. Then, the IC tag label is cut into a predetermined size from the separation line 12 to obtain the unit IC tag label 1. The magnetic material sheet 10 is used by cutting it into a size shorter than the IC tag label 1 of one unit by the width of the groove 9. As a result, as shown in FIG. 1, strip-like structures 10 a and 10 b are arranged on both sides of the IC chip 3.

FIG. 9 is a diagram for explaining a method for producing a non-contact IC tag label according to the present invention.
To the dispensing unit 20 of the IC tag processing machine, a strip-shaped structure 10R with a continuous adhesive is supplied from the upper right. From the lower left, an IC chip 3 is already attached to the antenna coil 2, and a continuous body 11R of the inlet base 11 cut into one row in which an IC tag circuit is formed is supplied at a constant speed. The continuous pressure-sensitive adhesive structure 10 </ b> R is cut into a strip-shaped structure 10 having a predetermined length by a cutting blade 23 of a rotary cutter 21 that rotates in synchronization with the dispensing unit 20. The cutting length is shorter than the pitch of the non-contact IC tag label 1 by an amount corresponding to the width L of the groove 9. At this time, the surface of the strip structure 10 on the side not in contact with the drum 22a of the dispensing unit 20 is the surface of the adhesive layer 6. The drum 22a of the dispensing unit 20 immediately adsorbs the strip-shaped structure 10 cut by the vacuum suction mechanism, and rotates and conveys the state while maintaining the state.

When the drum 22a of the dispensing unit 20 transports the strip structure 10 to a position where it comes into contact with the inlet base continuum 11R, the strip structure 10 is brought into contact with the inlet base by the pressing force between the drum 22a and the drum 22b. Is attached to the continuous body 11R side.
At this time, at the rotational speed (circumferential speed) of the drums 22a and 22b of the dispensing unit and the transport speed of the inlet base continuum 11R, the transport speed of the inlet base continuum 11R is increased by the width of the groove 9. Has been. That is, the width L of the groove 9 is variable by adjusting the conveyance speed of the continuous body 11R. After the strip-like structure 10 is attached to the antenna coil 2 surface of the inlet base 11 (in the case of the first embodiment), the step of laminating the surface protection sheet 4 on the opposite side surface of the inlet base 1 is performed.

The above manufacturing method is based on the premise that the strip-like structure 10 is attached to the inlet-based continuous body 11R in the state shown in FIG. After the inlet-based continuous body 11R is cut into the non-contact IC tag labels 1 having individual pitches, the strip structure 10 is divided into two strip structures, the structure 10a and the structure 10b. .
Thereafter, the surface protective sheet 4 is further laminated, and the adhesive layer 7 and the release paper 8 are provided on the surface of the strip structure 10, and then cut into individual non-contact IC tag labels or adjacent non-contact IC tag labels. A separation line 12 such as a perforation line between the two is formed to form a continuous body of the non-contact IC tag label 1. Even in the case of cutting, the part of the separation line 12 becomes a cutting line.

FIG. 10 is a diagram for explaining another method for producing the non-contact IC tag label of the present invention.
In the case of FIG. 10, the strip structure 10 is attached to the inlet base continuous body 11 </ b> R by the label applicator 25. In this case, the strip-shaped structure 10 punched into a predetermined size and held in the release film 24 is supplied and attached to the inlet base continuous body 11R. In this case, the adhesive processing is performed on the surface of the release film 24 of the strip structure 10. The strip-shaped structure 10 is attached by the labeling machine 25 by pressing the strip-shaped structure 10 peeled off from the release film 24 at the peeling edge 26 of the labeling machine 25 with rollers 27 and 28, and using an inlet-based structure. It sticks to the continuous body 11R.
At this time, the label is attached in synchronization with the mark provided on the inlet base continuous body 11R. In this case, it is necessary to prepare a label transfer material provided with strip-like structures 10 at predetermined intervals in advance. The release film 24 is removed and wound at the release edge 26 at the same time as the label is attached.

  Even if the method is not as described above, the continuous magnetic material sheet is formed into strip-like structures 10a and 10b having different widths with respect to the inlet base continuous body 11R in which the IC tag circuit is connected on the long side of the IC tag label 1. It is also possible to perform a manufacturing method of laminating and adhering to both sides (or opposite side surfaces) of the IC chip 3 on the antenna coil 2 surface side of the continuum 11R while cutting. In this case, the dispensing unit 20 is not used and a planar line processing apparatus can be used. This is a suitable method for manufacturing a mass. After adhering the strip-shaped structures 10a and 10b, the surface protective sheet 4 is laminated, and then cut into individual non-contact IC tag labels, or a continuous body of non-contact IC tag labels provided with separation lines 12 such as perforations. The same can be done.

Hereinafter, actual embodiments will be described using examples.
<Flexibility imparting process of magnetic material sheet>
A magnetic material sheet (“IRL02” manufactured by TDK Corporation) having a thickness of 0.1 mm was used, and a perforation line penetrating the sheet was placed so as to be in the longitudinal direction of the label, thereby performing flexibility imparting processing. For the bending property imparting process, a rotary die cutter device was used, and disc-shaped cutting blades for perforation lines were incorporated in a column at intervals of 2 mm in the die cut cylinder of the device. The length of the cut portion of the perforation line was 3 mm, and the interval between the cut portions was 2 mm. Perforation was performed only in one direction in the longitudinal direction of the magnetic material sheet.
After the flexibility imparting process, the magnetic material sheet was cut into the same width (54 mm) as the inlet base 11 of the non-contact IC tag label 1.

<Manufacture of non-contact IC tag labels>
As the inlet base 11 of the non-contact IC tag label, a material (a continuous film having a width of 54 mm) obtained by dry laminating a 30 μm thick aluminum foil on a transparent biaxially stretched PET film having a thickness of 38 μm is used. After applying the photosensitive resist, a photomask having an antenna coil was exposed and exposed.
After exposure and development, photoetching was performed to complete an inlet base having the antenna coil 2 as shown in FIG. One antenna coil 2 has an outer shape of approximately 45 mm × 76 mm.

The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was mounted on both ends 2a and 2b of the inlet base 11 with heat pressure applied in a face-down state. Since an anisotropic conductive adhesive sheet was used for mounting, electrical connection was sufficiently ensured.
Next, a strip-like structure 10 made of a magnetic material sheet prepared in advance and coated with a polyester-based hot melt adhesive is used for a long time using a dispensing unit 20 of an IC tag processing machine. While cutting into a length of 82 mm, a process of attaching to the antenna coil surface of the inlet base continuous body 11R on which the non-contact IC tag circuit was formed was performed. The strip-shaped structure 10 was stuck on both sides of the IC chip 3 so as to form parallel grooves 9 having a width L (see FIG. 1) of 4 mm.

Further, a surface protective sheet (coated paper) 4 having a thickness of 40 μm was laminated on the side surface of the inlet base 11 opposite to the antenna coil 2 via a polyester-based hot melt adhesive sheet and hot pressed. Next, the back surface of the strip-shaped structure 10 was subjected to pressure-sensitive adhesive processing in which a release paper 8 was laminated via a pressure-sensitive adhesive layer 7 having a thickness of 32 μm, thereby completing a continuous body of the first contactless IC tag label 1.
Finally, the separation line 12 is provided in the form of a perforation line to form a continuous body of the non-contact IC tag label 1. One unit of the non-contact IC tag label 1 was 54 mm wide × 86 mm long.

<Flexibility imparting process of magnetic material sheet>
Although it was the same material as Example 1, the magnetic material sheet ("IRL02" by TDK Corporation) of thickness 0.5mm was used, and the flexibility provision process was performed on the same conditions.

<Manufacture of non-contact IC tag labels>
Until the formation of the antenna coil 2, the same material as in Example 1 was used, and the inlet base 11 was completed by the same process. One antenna coil 2 has an outer shape of approximately 45 mm × 76 mm. The IC chip 3 having a planar size of 1.0 mm square and a thickness of 150 μm was mounted on both ends 2a and 2b of the inlet base 11 with heat pressure applied in a face-down state. Since an anisotropic conductive adhesive sheet was used for mounting, electrical connection was sufficiently ensured. Next, as the strip-shaped structure 10, the above-described bend-imparted magnetic material sheet having a thickness of 50 μm was subjected to pressure-sensitive adhesive label processing to obtain a label transfer material. One label-like magnetic material sheet was 54 mm wide and 82 mm long.

  Using a label transfer machine 25, the label transfer material made of this magnetic material sheet is opposite to the antenna coil 2 with respect to the inlet base continuous body 11R on which the non-contact IC tag label is formed as shown in FIG. Alignment with the surface was performed so that parallel grooves 9 having a width L (see FIG. 1) of 4 mm were formed on both sides of the IC chip 3. Next, a surface protective sheet (coated paper) 4 having a thickness of 40 μm was adhered onto the surface of the antenna coil 2 via a vinyl acetate emulsion adhesive. Finally, a process of laminating the release paper 8 on the back surface of the strip-shaped structure 10 with the adhesive layer 7 having a thickness of 32 μm was performed. Thereby, the non-contact IC tag label 1 of the 2nd form of width 54mm x length 86mm was completed.

The non-contact IC tag label 1 of Example 1 and Example 2 can be easily attached even when it is attached to the side of a metal container (a tin can with a diameter of 90 mm), and peels off naturally even after one month at room temperature. It never happened.
In the case of deposition on a non-metal surface, the minimum operating magnetic field strength (H _min ) at a frequency of 13.56 MHz is in the range of 0.5 A / m to 3.0 A / m. Is a minimum operating magnetic field strength (H _min ) at a frequency of 13.56 MHz, which is in the range of about 1.0 A / m to 3.5 A / m. The contactless IC tag labels of Examples 1 and 2 are In both cases, it was confirmed that communication with the reader / writer was possible without hindrance.

It is a schematic plan view which shows the example of the non-contact IC tag label of this invention. It is sectional drawing of a 1st form. It is sectional drawing of a 2nd form. It is sectional drawing of a 3rd form. It is sectional drawing of a 4th form. It is a figure of the magnetic material sheet which performed the flexibility provision process by the perforation line. It is a figure of the magnetic material sheet which performed the flexibility provision process by the perforation line. It is a figure explaining the processing method of a non-contact IC tag label. It is a figure explaining the manufacturing method of a non-contact IC tag label. It is a figure explaining other manufacturing methods of a non-contact IC tag label. It is a figure which shows embodiment of a general non-contact IC tag.

Explanation of symbols

1 Non-contact IC tag label
DESCRIPTION OF SYMBOLS 2 Antenna coil 3 IC chip 4 Surface protection sheet 5 Back surface protection sheet 6a, 6b, 6c Adhesive layer 7 Adhesive layer 8 Release paper 9 Groove 10, 10a, 10b Strip-shaped structure 11 Inlet base 12 Separation line, cutting line 17 Conductive member

Claims (6)

A non-contact IC tag label having a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base, wherein the inlet base antenna coil Is a non-contact IC tag label having a surface protective sheet on the opposite side and having an adhesive layer attached to the adherend on the inlet base antenna coil surface side, wherein the non-contact IC tag label is attached to the adherend. The interval between the adhesive layer and the inlet base is such that two strip-shaped structures made of a magnetic material sheet that has been subjected to flexibility imparting processing on both sides of the IC chip form parallel strip-shaped grooves. And an IC chip destruction prevention and communication inhibition suppression structure characterized in that the IC chip is positioned within the belt-like groove width. Non-contact IC tag label that. A non-contact IC tag label having a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on the inlet base, and the side surface of the antenna coil of the inlet base A non-contact IC tag label having a surface protective sheet on the side opposite to the inlet-based antenna coil and having an adhesive layer attached to the adherend, wherein the non-contact IC tag label is attached to the adherend. The gap between the agent layer and the inlet base is set so that two strip-shaped structures made of a magnetic material sheet that has been subjected to bendability are formed on both sides of the IC chip to form parallel strip-shaped grooves. IC chip destruction prevention and communication inhibition suppression structure characterized in that the IC chip is positioned within the belt-like groove width. Non-contact IC tag label that. A non-contact IC tag label having a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on an inlet base, wherein the inlet base antenna coil In a non-contact IC tag label having a surface protective sheet on the opposite side, a back protective sheet on the side of the inlet base antenna coil, and further having an adhesive layer attached to the adherend on the side of the inlet base antenna coil The non-contact IC tag label is between the pressure-sensitive adhesive layer to be adhered to the adherend and the back protective sheet, and is composed of two strip-shaped structures made of a magnetic material sheet that is subjected to bending imparting processing on both sides of the IC chip. The body is arranged so as to form parallel strip-shaped grooves, and the IC chip is positioned within the width of the strip-shaped grooves. Noncontact IC tag label having a communication inhibiting suppressing structure and IC chip fracture prevention, characterized in that there. A non-contact IC tag label having a structure in which an IC chip with a memory function capable of reading information in a non-contact manner and an antenna coil for transmitting and receiving electromagnetic waves are electrically connected on the inlet base, and the side surface of the antenna coil of the inlet base And having a two-layer surface protection sheet,
In the non-contact IC tag label having an adhesive layer attached to the adherend on the side surface opposite to the inlet-based antenna coil, the non-contact IC tag label is formed of the adhesive layer and the back protection sheet attached to the adherend. Two strip-like structures made of a magnetic material sheet that has been subjected to flexibility imparting processing are arranged on both sides of the IC chip at intervals so as to form parallel strip-shaped grooves, A non-contact IC tag label having an IC chip destruction prevention and communication inhibition suppression structure characterized by being positioned within the band-like groove width. 5. The IC chip destruction prevention and communication inhibition suppression according to claim 1, wherein the bendable magnetic material sheet has a uniform thickness of 50 μm to 250 μm. Non-contact IC tag having a structure. The non-contact IC tag having an IC chip destruction prevention and communication inhibition suppressing structure according to any one of claims 1 to 4, wherein the flexibility imparting process is performed by a perforation line.

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