JP2008108864A - Fitting structure of parallel jumper to substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To easily position lead lines of a parallel jumper, to easily perform soldering by hand solder and to improve efficiency of soldering when the lead lines of the parallel jumper are fitted to lands which are installed at a rear face of a substrate and on which solder is piled. <P>SOLUTION: A plurality of columns of lands 2 for fixing a plurality of lead lines 6 of the parallel jumper 4 by soldering are arranged in the rear face of the substrate 1. Solder 3 is piled on a plurality of lands. A plurality of lead lines of the parallel jumper are fitted and fixed to the rear face of the substrate with hand solder. The lands are formed in almost U shapes where slits 5 are made in centers. Holes 1b passing through the substrate are formed at the back of the slits. Solder is piled on the lands, and tips 6a of the lead lines of the parallel jumper are previously bent in almost L shapes. The tips of the lead lines of the parallel jumper are inserted into the holes from a rear side of the substrate, and the lead lines of the parallel jumper are arranged in the slits. The lead lines of the parallel jumper are fitted and fixed to the substrate by hand solder. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  In the present invention, a plurality of rows of lands for fixing a plurality of lead wires of parallel jumpers by soldering are provided on the back surface of the substrate, and solder is deposited on the lands of the plurality of examples. This is related to a parallel jumper mounting / fixing structure in which each lead wire is fixedly mounted to the back surface of the substrate by hand soldering.

  As shown in FIGS. 5A and 5B, the conventional parallel jumper mounting structure to the substrate is a substantially rectangular shape for fixing a plurality of lead wires 103 of the parallel jumper 102 to the back surface of the substrate 101 by soldering. A plurality of rows of lands 104 are provided. Since the solder 105 is placed on the land 104 in a dome shape, the lead wire 103 of the parallel jumper 102 is placed on the apex of the solder 105, which makes it difficult to position the lead wire 103 of the parallel jumper 102.

  The first prior art is shown in FIG. As shown in FIG. 6, this conventional large current substrate has a jumper wire 213 disposed on a copper foil pattern portion 211 formed on one surface of the substrate 210 and another jumper wire 213 disposed on the copper foil pattern portion 211. In a large current substrate in which an insertion hole is formed in the copper foil pattern portion 211 so as to be connected to an electric conductor such as a jumper wire, an insertion hole 214 to be connected is formed in the copper foil pattern portion 211 and inserted. The jumper wires were communicated with each other through slits 215 so that the jumper wires did not fall off. (For example, refer to Patent Document 1).

  However, this does not facilitate the positioning of the jumper wire 213.

  The second prior art is shown in FIGS. 7 (a) and 7 (b). As shown in FIGS. 7A and 7B, this conventional jumper wire wiring structure has a thin slit groove 302 formed on the upper surface 305 of the printed circuit board 301, and the jumper wire 306 is fitted into the slit groove 302. Then, both end portions 307 are bent and inserted into terminal holes provided so as to penetrate both ends of the slit groove bottom, and soldered to a conductor pattern formed on the lower surface. (For example, refer to Patent Document 2).

  However, this does not facilitate the positioning of the jumper wire 306.

  A third prior art is shown in FIG. In this conventional printed wiring board, as shown in FIG. 8, a jumper wire 409 conducts between two points on a pattern 404 formed on a substrate 401 sandwiching an easily cut portion. (For example, refer to Patent Document 3).

However, this does not facilitate the positioning of the jumper wire 409.
JP-A-9-153664 JP 2004-31663 A Japanese Utility Model Publication No. 5-31271

  The present invention has been made in view of the above-described conventional problems, and when the lead wire of the parallel jumper is attached to the land provided on the back surface of the substrate and on which the solder is piled up, the lead wire of the parallel jumper is positioned. It is an object of the present invention to provide a structure for fixing and fixing a parallel jumper to a substrate, which can facilitate soldering, facilitate soldering by hand soldering, and increase the efficiency of soldering.

  The present invention has been proposed in order to solve the above problems, and the invention according to claim 1 is directed to a plurality of rows for fixing a plurality of parallel jumper lead wires to the back surface of the substrate by soldering. Lands are provided, and solder is piled up on the lands of these plural examples, and the parallel jumpers are attached to the substrate by fixing the plurality of lead wires of the parallel jumpers to the back surface of the substrate by manual soldering. In the fixed structure, the land is formed in a substantially U shape with a slit in the center, and a hole that penetrates the substrate is formed in the back of the slit. The land is filled with solder, and the parallel The tip of the lead wire of the jumper is bent in a substantially L shape in advance, and the tip of the lead wire of the parallel jumper is inserted into the hole from the back side of the substrate, and the parallel jumper is inserted into the slit. Is arranged leads, it is characterized in that lead wires of the parallel jumpers is configured to be fixedly attached to the substrate by the hand soldering.

  The invention according to claim 2 is provided with a plurality of rows of lands for fixing the plurality of lead wires of the parallel jumper to the back surface of the substrate by soldering, and solder is piled on the lands of these plurality of examples. In the parallel jumper mounting and fixing structure in which the plurality of lead wires of the parallel jumper are each fixed to the back surface of the substrate by hand soldering, the land is formed in a shape having a slit in the center, A hole passing through the substrate is formed along the slit, the land is filled with solder, and the tip of the lead wire of the parallel jumper is inserted into the hole of the substrate from the back side of the substrate The lead wire of the parallel jumper is disposed in the slit, and the lead wire of the parallel jumper is attached and fixed to the substrate by manual soldering.

  According to a third aspect of the present invention, in the invention of the second aspect, the land of the substrate is provided in parallel so that a slit is formed at the center, and is located in the vicinity of the land away from the land along the slit. The hole is provided.

  According to a fourth aspect of the present invention, in the second or third aspect of the invention, the lead wire end of the parallel jumper inserted into the hole of the substrate is substantially L-shaped so as to be along the surface of the substrate. The lead wire bent and inserted into the hole of the substrate is prevented from coming off.

  According to the first aspect of the present invention, the tip of the lead wire of the parallel jumper is inserted into the hole formed in the back of the slit of the substantially U-shaped land provided on the back surface of the substrate, and the jumper parallel to the slit. Therefore, the lead wires of the parallel jumpers can be easily positioned, and the solder piled up on the lands can be easily soldered by hand soldering, so that the efficiency of soldering can be improved. Moreover, since the tip of the lead wire of the parallel jumper is bent in advance in a substantially L shape, there is an advantage that the tip of the lead wire can be easily inserted into the hole of the substrate.

  According to the second aspect of the present invention, since the land provided on the back surface of the substrate is provided with a slit at the center and a hole is formed through the substrate along the slit, the lead of the parallel jumper is formed. The lead wire can be inserted into the hole of the board and the lead wire can be placed in the slit, and the lead wire of the parallel jumper can be easily positioned, and solder on the land can be easily soldered by hand soldering This can be performed and the efficiency of soldering can be increased.

  According to the invention of claim 3, the land of the substrate is provided in parallel so that a slit is formed in the center, and the hole is formed in the vicinity of the land away from the land along the slit. It is possible to solder the lead wire of the parallel jumper with all of the solder deposited on the land, and to place the solder on the lead wire in a long range, so that the strength of soldering can be increased.

  According to the fourth aspect of the present invention, since the end portion of the lead wire of the parallel jumper inserted into the hole portion of the substrate is bent in a substantially L shape so as to follow the surface of the substrate, the parallel jumper extends from the hole portion. Can be prevented from coming out, and the lead wires of the parallel jumper can be more firmly fixed to the substrate.

  DESCRIPTION OF EMBODIMENTS Hereinafter, embodiments of a structure for fixing a parallel jumper to a substrate according to the present invention will be described with reference to the drawings.

  FIG. 1 shows a state in which solder is deposited on a land on the back surface of a substrate in the structure for fixing a parallel jumper to a substrate according to the first embodiment of the present invention, (a) is a plan view, and (b) is (a) 2 is a cross-sectional view taken along the line AA in FIG. 2, FIG. 2 shows a state in which the parallel jumper lead wires are attached in the parallel jumper mounting structure of the first embodiment, (a) is a plan view, and (b) is ( It is a BB line sectional view in a).

  As shown in FIGS. 1A and 1B, the parallel jumper mounting structure of the first embodiment has a long hole portion 1a provided in the substrate 1, and the substrate 1 in front of the long hole portion 1a. A plurality of substantially U-shaped lands 2 are formed on the back surface of the, and solder 3 is piled on these lands 2 during dipping. Furthermore, holes 1b penetrating the substrate 1 are provided in the back of the substantially U-shaped land 2, respectively. As shown in FIGS. 2 (a) and 2 (b), a parallel jumper 4 connected to a video deck (not shown) installed on the surface of the substrate 1 is passed from the long hole portion 1a of the substrate 1 to the back side, The lead wire 6 of the parallel jumper 4 is disposed in the slit 5 of the substantially U-shaped land 2 on which the solder 3 is stacked, and the tip 6a of the lead wire 6 is inserted into the hole 1b. The tip 6a of the lead wire 6 of the parallel jumper 4 is bent in an L shape in advance as shown in FIG. 2A and 2B, the lead wire 6 of the parallel jumper 4 is soldered and fixed to the back surface of the substrate 1 by hand soldering.

  Therefore, according to the first embodiment, the tip 6a of the lead wire 6 of the parallel jumper 4 is placed in the hole 1b formed in the back of the slit 5 of the substantially U-shaped land 2 provided on the back surface of the substrate 1. Since the lead wire 6 of the parallel jumper 4 is disposed in the slit 5 while being inserted, the lead wire 6 of the parallel jumper 4 is easily positioned, and the solder 3 stacked on the land 2 is easily soldered by hand soldering. And the efficiency of soldering can be increased. Further, since the tip 6a of the lead wire 6 of the parallel jumper 4 is bent in a substantially L shape in advance, there is an advantage that the tip 6a of the lead wire 6 can be easily inserted into the hole 1b of the substrate 1.

  3A and 3B show a structure for mounting and fixing the parallel jumper to the substrate of the second embodiment. FIG. 3A is a plan view of a state in which solder is deposited on the land on the back surface of the substrate, and FIG. 3B is parallel to the back surface of the substrate. It is a top view which shows the state in which a jumper is attached.

  As shown in FIG. 3A, the parallel jumper mounting and fixing structure of the second embodiment has a plurality of lands 2 and 2 with solder 3 on the back surface of the substrate 1, and a slit 5 at the center. Are formed in parallel so that a hole 1b is provided at a position away from the lands 2 and 2. As shown in FIG. 3B, the lead wire 6 of the parallel jumper 4 is disposed in the slit 5, and the tip 6a of the lead wire 6 is inserted into the hole 1b. In this state, the lead wire 6 of the parallel jumper 4 is soldered and fixed to the back surface of the substrate 1 by hand soldering.

  Therefore, according to the second embodiment, the lands 2 and 2 on the back surface of the substrate 1 are provided in parallel so that the slit 5 is formed at the center, and the vicinity away from the lands 2 and 2 along the slit 5. Since the hole 1b is formed at the position, the lead wire 6 of the parallel jumper 4 can be soldered with all of the solder 3 built up on the lands 2 and 2, and the solder 3 is placed on the lead wire 6 in a long range. It can be placed and the strength of soldering can be increased.

  FIG. 4 is a cross-sectional view showing a structure for fixing the parallel jumper to the substrate according to the third embodiment.

  As shown in FIG. 4, the parallel jumper mounting and fixing structure of the third embodiment is such that the end 6 b of the lead wire 6 of the parallel jumper 4 inserted into the hole 1 b of the substrate 1 is the surface of the substrate 1. It is bent in a substantially L shape so as to follow.

  Therefore, according to the third embodiment, the end 6b of the lead wire 6 of the parallel jumper 4 inserted into the hole 1b of the substrate 1 is bent in a substantially L shape so as to follow the surface of the substrate 1. The lead wire 6 of the parallel jumper 4 can be prevented from coming out of the hole 1b, and the lead wire 6 of the parallel jumper 4 can be more firmly fixed to the substrate.

  In the above embodiment, the long hole portion 1a is positioned on the back side of the substrate 1 through the parallel jumper 4 from the front surface of the substrate 1. However, the present invention is not limited to this, and the parallel jumper is provided on the back surface of the substrate 1. Needless to say, the present invention can be applied to the case where 4 is located.

The state where the solder was piled up in the land on the back surface of the board | substrate in the attachment fixing structure to the board | substrate of the parallel jumper of 1st Embodiment of this invention is shown, (a) is the top view, (b) is A in (a). FIG. The state which attaches the lead wire of the parallel jumper in the attachment structure to the board | substrate of the parallel jumper of 1st Embodiment is shown, (a) is the top view, (b) is the BB sectional drawing in (a). 2 shows a structure for fixing and fixing a parallel jumper to a substrate according to a second embodiment, (a) is a plan view of a state in which solder is deposited on the land on the back surface of the substrate, and (b) is a parallel jumper mounted on the back surface of the substrate. FIG. It is sectional drawing which shows the attachment fixing structure to the board | substrate of the parallel jumper of 3rd Embodiment. 1 shows a conventional fixing structure of a parallel jumper to a board, (a) is a plan view showing a state where solder is piled up on a land on the back side of the board, and (b) is a lead wire of the parallel jumper attached to the solder. FIG. It is a partial top view of the conventional high current substrate. The wiring structure of the conventional jumper line is shown, (a) is the top view, (b) is the sectional drawing. It is a top view of the conventional printed wiring board.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 Substrate 1a Long hole 1b Hole 2 Land 3 Solder 4 Parallel jumper 5 Slit 6 Lead wire 6a Tip 6b End

Claims (4)

  Plural rows of lands for fixing a plurality of lead wires of the parallel jumper by soldering are provided on the back surface of the substrate, and solder is deposited on the lands of these plural examples, and the plurality of lead wires of the parallel jumper are arranged In the structure of mounting and fixing parallel jumpers to the substrate, each of which is fixed to the back surface of the substrate by hand soldering, the land is formed in a substantially U-shape with a slit in the center, and the substrate is formed at the back of the slit. A hole is formed through the land, solder is deposited on the land, and the tip of the lead wire of the parallel jumper is bent in a substantially L shape in advance, and the hole is inserted into the hole from the back side of the substrate. The tip of the parallel jumper lead wire is inserted and the parallel jumper lead wire is disposed in the slit, and the parallel jumper lead wire is fixedly attached to the substrate by manual soldering. Mounting structure for fixing to the substrate parallel jumpers, characterized by being configured as.   Plural rows of lands for fixing a plurality of lead wires of the parallel jumper by soldering are provided on the back surface of the substrate, and solder is deposited on the lands of these plural examples, and the plurality of lead wires of the parallel jumper are arranged In the mounting and fixing structure of the parallel jumper to the substrate, each fixed to the back surface of the substrate with hand solder, the land is formed in a shape having a slit in the center, and penetrates the substrate along the slit. A hole is formed, and solder is deposited on the land, and the tip of the lead wire of the parallel jumper is inserted into the hole of the substrate from the back side of the substrate, and the lead of the parallel jumper is inserted into the slit. The parallel jumper is fixedly attached to the board, and the parallel jumper leads are fixedly attached to the board by manual soldering. Structure.   The parallel jumper substrate according to claim 2, wherein the land of the substrate is provided in parallel so that a slit is formed in the center, and the hole is provided in the vicinity of the land away from the land along the slit. Mounting fixing structure.   An end of a lead wire of a parallel jumper inserted into the hole portion of the substrate is bent in a substantially L shape so as to follow the surface of the substrate, and the lead wire inserted into the hole portion of the substrate is prevented from coming off. Item 4. A structure for fixing the parallel jumper according to Item 2 or 3 to the substrate.