JP2008197376A - Thin display panel disassembling method and device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To separate a glass panel without breaking from an electric conductive plate by preventing the temperature from rising locally and breaking or deforming various materials when separating the glass plate from the electric conductive plate for recycling thin display panel. <P>SOLUTION: A method is provided for disassembling thin display panel containing a glass panel and an electric conductive plate adhered to the glass panel through adhesive layers. The method has a step of positioning the thin display panel to a heating position, and a step of induction heating the conductive plate depending on the supplied power. In this heating step, the electric conductive plate is heated from its sides not through the glass plate. <P>COPYRIGHT: (C)2008,JPO&INPIT

Description

  The present invention relates to a method for disassembling a thin display panel and an apparatus for disassembling a thin display panel.

  As an example of a thin display panel, in a plasma display panel (hereinafter referred to as PDP), a front glass plate and a rear glass plate are bonded together, and an aluminum chassis of a heat radiating plate is bonded to the rear glass plate side through an adhesive sheet. In such a PDP, in order to save resources and preserve the environment, it is desired to collect the used PDP, disassemble each member as it is, and use it for recycling and separate collection. In addition, disassembling of the PDP may be required in order to reuse defective products in the manufacturing process.

As a method for separating the rear glass plate from the front glass plate, Patent Document 1 discloses that the cutting material is inserted into the sealing material between the front glass plate and the rear glass plate, and the sealing material is supplied while vibrating the blade. A method of cutting and separating the back glass plate from the front glass plate is disclosed. Further, as a method of separating the aluminum chassis from the glass plate, Patent Document 2 discloses that a joining member provided between the glass plate and the aluminum chassis is cut with a saw or a wire, and the saw or the wire is slid at the time of the cutting. Thus, a method of separating the glass plate and the aluminum chassis is disclosed. In Patent Documents 3 and 4, the entire plasma display panel is heated to soften the bonding material provided between the front glass plate and the rear glass plate and bonding the two, and the front glass plate and the rear glass. A method for separating the plate is disclosed.
JP 2002-313237 A (paragraph 0009) JP 2004184677 A (paragraph 0016) JP 2000-106087 A (paragraph 0009) JP 2002-367516 A (paragraph 0010)

  In a thin display panel using glass such as a PDP, it is particularly difficult to handle the glass in the disassembly work of the thin display panel for recycling and separate collection. For example, a problem has been known that thermal stress is generated when a sudden temperature change is applied to glass, and damage such as cracking or deformation occurs in the glass. Therefore, when a heating process is employed in the decomposition operation, it is considered good to raise the temperature slowly. There is also a problem that the aluminum chassis is deformed if the entire thin display panel is heated excessively.

  In the thin panel display disassembly device described in Patent Documents 1 and 2, the entire panel does not require heat treatment, but the joining member cannot be cut unless the blade or the like enters the gap between the thin display panels. There are some problems such as the need to adjust the frequency and speed of vibration and slide each time depending on the variation of the adhesive force of the sealing material or the difference in position or arrangement. In addition, the knives or the like may need to be devised. In any case, there is a problem that there are large load fluctuation factors on the blade and the drive system.

  In the apparatus for disassembling a thin display panel described in Patent Documents 3 and 4, since the entire thin display panel is heated, thermal stress is easily applied to the glass. In addition, when a heating furnace is used to heat the entire thin display panel, there is a problem that the glass breaks due to the load on the glass due to the complexity of carrying in and out of the heating furnace. Further, since the entire thin display panel is heated, there is a problem that a necessary amount of heat is increased and a running cost is increased.

  In the method of separating the aluminum chassis from the rear glass plate, the adhesive area is increased because the adhesive sheet is attached to the surface where the rear glass plate and the aluminum chassis overlap. Furthermore, since a pressure-sensitive adhesive sheet tends to have a high adhesive strength, when the pressure-sensitive adhesive sheet is softened by heating, the thin display panel and the chassis are exposed to a higher temperature. Therefore, thermal stress is applied to the glass and the glass may be broken, or the aluminum chassis may be deformed by high temperature.

  The present invention has been made in view of the circumstances as described above, and prevents partial temperature rise of each member and damages such as cracks and deformations associated therewith, and separates the conductive plate from the glass plate without breaking. It is an object of the present invention to provide a method and an apparatus for disassembling a thin display panel that enable the above.

  In order to solve the above-described problems, according to the present invention, there is provided a method for disassembling a thin display panel including a glass plate and a conductive plate bonded to the glass plate via an adhesive layer, the thin display A positioning step for positioning the panel at a heating position, and a heating step for inductively heating the conductive plate by causing a magnetic field change in the thickness direction of the thin display panel in accordance with the supplied electric power. There is provided a method for disassembling a thin display panel, wherein an induction heating action is applied from the side of the conductive plate without using the glass plate.

  The thin display panel disassembling method includes a discharging step of discharging at least one of the glass plate and the conductive plate after the heating step. The discharging step includes a discharging step of discharging the glass plate or the conductive plate through a path above or below the heating position, for example.

  At least one of the heating step or the discharging step has a moving step of moving one of the thin display panel, the glass plate, or the conductive plate along a conveyance path including the heating position.

  In order to solve the above-described problem, according to the present invention, there is provided a decomposition apparatus for a thin display panel including a glass plate and a conductive plate bonded to the glass plate via an adhesive layer, A positioning unit that positions the thin display panel at the heating position, an induction heating unit that generates an induction heating action by causing a magnetic field change in the thickness direction of the thin display panel according to the supplied power, and the induction heating unit A power supply unit that supplies power, and the induction heating unit imparts an induction heating action to the conductive plate from a side surface of the conductive plate that is not bonded to the glass plate. An apparatus for disassembling a thin display panel is provided.

  For example, the induction heating unit is disposed above or below the heating position.

  The thin display panel disassembling apparatus includes a discharge unit that discharges at least one of the glass plate and the conductive plate from the heating position. Moreover, the said discharge part discharges | emits the said glass plate or the said electrically conductive plate through the path | route above or below the said heating position, for example. Furthermore, the said discharge part contains the conveyance part which conveys the said thin display panel, the said glass plate, or the said electrically conductive plate through the conveyance path containing the said heating position, for example.

  According to the present invention, the conductive plate is induction-heated from the side surface that is not bonded to the glass plate, whereby the heat generated on the heated side surface conducts the conductive plate and heats the adhesive layer. Therefore, the thin display panel can be disassembled while preventing cracking due to partial temperature rise of the glass plate.

  Hereinafter, embodiments according to the present invention will be described in detail with reference to the drawings. In addition, the illustration in the following description does not limit this invention.

  FIG. 1 shows a schematic view of an example of a thin display panel disassembling apparatus according to an embodiment of the present invention.

  A thin display panel 10 shown in FIG. 1 includes a glass plate portion 13 on which a front glass plate 11 and a rear glass plate 12 are bonded together, and a heat radiating conductive plate bonded on the rear glass plate 12 side through an adhesive layer 14. 15. The glass plate portion 13 and the conductive plate 15 are substantially rectangular plate-like members, and are bonded together so as to substantially overlap. The adhesive layer 14 is, for example, an adhesive sheet-like adhesive on both sides, and is interposed in a substantially rectangular region in accordance with the overlapping portion of the glass plate portion 13 and the conductive plate 15. For example, the conductive plate 15 may be made of a conductive metal material such as aluminum or iron.

  In addition, the adhesive layer 14 is preferably one in which the adhesive strength is less likely to decrease due to heat radiation from the glass plate portion 13 when the thin display panel 10 is used. Further, the adhesive layer 14 is preferably one having a reduced adhesive strength by being softened or melted by heat generated by induction heating of the conductive plate 14 at the time of separation. For example, a flexible material such as silicone, urethane, acrylic, etc. A certain resin is used.

  The thin display panel disassembling apparatus 20 includes a support base 21 as a support member that supports the conductive plate 15 side with the conductive plate 15 of the thin display panel 10 facing upward, and the thin display panel 10 supported by the support base 21. Cooling that cools the surface of the power supply unit 23 that includes the induction heating unit 22 that induction-heats the conductive plate 15 from above, the control device 24 that controls the power supply unit 23, and the surface of the glass plate unit 13 that contacts the adhesive layer 14. Device 25.

  The support base 21 includes a bottom surface portion 21 a, a side surface portion 21 b, and a support portion 21 c that supports the outer peripheral edge of the conductive plate 15. In the thin display panel 10, when the conductive plate 15 side is supported by the support portion 21c, the glass plate portion 13 is opened downward. Accordingly, the thin display panel 10 supported by the support base 21 is positioned at a heating position that can be heated by induction heating from the induction heating unit 22. The support base 21 may have any configuration as long as the thin display panel is not gripped or fixed. For example, the conductive plate 15 may be suspended.

  When induction heating is performed from above, unless the end portion of the conductive plate 15 is gripped or fixed, when the glass plate portion 13 begins to peel off, the conductive plate 15 is deformed such as curved due to its weight. When the conductive plate 15 is deformed, the glass plate portion 13 is further easily peeled off. Further, since the glass plate portion 13 is moved away from the heated conductive plate 15, there is an effect that the breakage due to heat does not occur.

  Further, when induction heating is performed from below, as a method of not holding the glass plate portion 13, for example, the glass plate portion 13 may be hung with a wire or the like.

  In addition, when the glass plate part 13 is peeled off from the conductive plate 15 by induction heating, the support base 21 is provided with an elastic body (not shown) for absorbing an impact caused by the drop of the glass plate part 13. It may be provided below the support position of the plate portion 13.

  The induction heating unit 22 causes a magnetic field change in the thickness direction of the thin display panel 10 in accordance with the electric power from the power supply unit 23, and the eddy current is generated on the surface of the conductive plate 15 due to the magnetic field change. Induction heating. At this time, the induction heating unit 22 has a side surface bonded to the rear glass plate 12 via the adhesive layer 14 of the conductive plate 15 positioned by the support base 21 from the other side surface side (that is, the glass plate unit 13 is connected). Induction heating action is imparted to the conductive plate 15 without intervention. The induction heating unit 22 may induction heat the conductive plate 15 from below depending on the configuration of the support base 21. In such a case, the thin display panel 10 is positioned so that the conductive plate 15 is located below and the glass plate portion 13 is located above.

  As an example of the induction heating unit 22, a rectangular coil may be used in accordance with the rectangular conductive plate 15 as shown in FIG. The configuration of the induction heating unit 22 can efficiently induction-heat the conductive plate 15. In addition, the induction heating part 22 is good also as a structure which heats only a required part by changing not only the conductive plate 15 but the shape of a short coil.

  In addition, as shown in FIG. 2B, the induction heating unit 22 may be configured by arranging a plurality of short coils (22a to 22d). The induction heating unit 22 can select a heating location of the conductive plate 15 by induction heating of the plurality of short coils according to the power supplied from the power supply unit 23 independently. In addition, even when the induction heating unit 22 includes a plurality of short coils, the induction heating unit 22 may be disposed so as to cover the conductive plate 15 by combining the short coils so as to heat only necessary portions.

  Further, as shown in FIG. 2 (c), the induction heating unit 22 is not limited to being arranged in parallel with the conductive plate 15, and is arranged at a predetermined angle with respect to the conductive plate 15. Also good.

  The control device 24 controls the power supply unit 23 so that the glass layer 13 is separated from the conductive plate 15 by the action of gravity by heating the adhesive layer 14 by heat generated by induction heating of the conductive plate 15. . Preferably, the induction plate is controlled so that only the interface between the conductive plate 15 and the adhesive layer 14 is heated, so that the glass plate portion 13 is not heated excessively, and the conductive plate 15 and the adhesive are used. The layer 14 is partially heated to efficiently save energy.

  First, the control device 24 starts induction heating by supplying power from the power supply unit 23 to the induction heating unit 22 after the thin display panel 10 is positioned at the heating position by the support base 21. Thereafter, the temperature of the surface of the conductive plate 15 is continuously measured by a temperature sensor (not shown) provided in the vicinity of the conductive plate 15.

  Thereafter, the control device 24 stops the induction heating at the timing when the temperature of the conductive plate 15 reaches a predetermined temperature. The predetermined temperature of the conductive plate 15 at this time is set to such an extent that the adhesive layer 14 is sufficiently heated to separate the conductive plate 15 from the glass plate portion 13 and the adhesive force is lowered. In addition, since there is a time difference until the heat generation on the surface of the heated side surface of the conductive plate 15 is transmitted to the adhesive layer 14, the conductive plate 15 and the glass plate portion 13 reach the above-described predetermined temperature at which they can be separated. Induction heating may be stopped before. In this case, after the induction heating is stopped, the adhesive layer 14 is heated to the above-described predetermined temperature at which the conductive plate 15 and the glass plate portion 13 can be separated by heat transfer from the conductive plate 15 to the adhesive layer 14. By doing so, it becomes unnecessary to perform extra heating, and it becomes possible to prevent the glass plate portion 13 from generating stress due to partial heating.

  Further, after the induction heating by the power supply unit 23 is started, the induction heating may be stopped at the timing when the conductive plate 15 is separated from the glass plate unit 13. Furthermore, by providing a timer or the like (not shown), induction heating may be stopped after a certain time has elapsed.

  As an example of the cooling device 25, the support base 21 is provided with an air inlet 25a provided at one end of the bottom surface portion 21a, and the air inlet 25a penetrates the inside of the bottom surface portion 21a, the side surface portion 21b, and the support portion 21c. Air passage 21b and an air exhaust port 25c that opens toward the surface of the rear glass plate 12 that contacts the adhesive layer 14, and when cooling air is injected from the air injection port 25a, The cooling air is blown from the air exhaust port 25c to the boundary portion between the back glass plate 12 and the adhesive layer 14, and the glass plate portion 13 and the adhesive layer 14 are cooled.

  Since the conductive plate 15 is heated by induction heating and the interface side between the conductive plate 15 and the adhesive layer 14 is heated, the adhesive layer 14 is separated when the glass plate portion 13 and the conductive plate 15 are separated. The glass plate part 13 will fall in the state which adhered most to the glass plate part 13 side. In such a case, the adhesive layer 14 adhered to the glass plate portion 13 side can be easily peeled off from the glass plate portion 13 or removed with a solvent, and the prototypes of the glass plate portion 13 and the conductive plate 15 can be used. It can be separated and recovered as it is.

  As described above, in this embodiment, since only the conductive plate 15 is selectively heated by induction heating, excessive temperature rise and heating of the glass plate portion 13 and the conductive plate 15, and damages such as cracks and deformations associated therewith. Thus, the glass plate portion 13 and the conductive plate 15 can be easily separated.

  Further, in this embodiment, since the glass plate portion 13 falls due to the action of gravity and is separated from the conductive plate 15 at the timing when the adhesive force of the adhesive layer 14 is moderately reduced, The thin display panel 10 can be easily disassembled by efficiently suppressing heating, preventing damage such as cracks and deformations associated therewith.

  In addition, by disposing the thin display panel as a line work by providing a moving mechanism on the support base, such an embodiment will be described with reference to FIG.

  As shown in FIG. 3, the thin display panel disassembly device 30 is provided with a transport device 33 that transports the thin display panel 10 from the insertion portion 31 to the discharge portion 32. For example, the transport device 33 is a belt conveyor including rollers 33a and a belt 33b. Moreover, the conveying apparatus 33 is not restricted to a belt conveyor, For example, other types of conveyors, such as a roller conveyor, may be sufficient. In addition, an induction heating unit 34 and a power supply unit 35 are provided below the conveyance path of the conveyance device 33 for the thin display panel 10 (that is, below the belt 33b). Details of the positional relationship between the conveyance device 33 and the induction heating unit 34 will be described later. Further, a discharge device 36 for adsorbing the thin display panel 10 which can be decomposed by induction heating from above and discharging the glass plate portion 13 is provided above the discharge portion 32 of the transport device 33. For example, the discharge device 36 may be a chucker that performs suction using a negative pressure attached to the tip of the robot arm. The conveyance device 33, the induction heating unit 34, the power supply unit 35, and the discharge device 36 are controlled by a control device (not shown). The thin display panel 10 is transported from the right side to the left side as indicated by arrows.

  Next, the positional relationship between the conveyance device 33 and the induction heating unit 34 will be described with reference to FIG.

  FIG. 4 is a side view showing an apparatus for disassembling a thin display panel according to an embodiment of the present invention. As shown in FIG. 4, the transport device 33 has two belts 33a on the left and right. The belt 33a is movable by the rotation of a plurality of rollers 33b disposed inside the belt 33a. The thin display panel 10 is supported by two rollers 33b. The induction heating unit 34 is disposed between the two rollers 33b and adjacent to the thin display panel 10 because it is difficult to perform induction heating if the distance from the thin display panel 10 is too large. The power supply unit 35 is disposed further below the induction heating unit 34.

  In addition, the induction heating part 34 and the electric power supply part 35 are not restricted to the said arrangement | positioning, You may provide above the conveying apparatus 33. FIG. When the induction heating unit 34 and the power supply unit 35 are provided above, the insertion direction of the thin display panel 10 is different from the case where the thin display panel 10 is provided below. Details will be described later.

  The thin display panel disassembling apparatus 30 has the above-described configuration, the insertion portion 31 of the thin display panel 10, the heating position where the thin display panel 10 is induction heated by the induction heating portion, and the discharge portion 32 of the thin display panel 10 after disassembly. Can be connected by the transport path of the transport device 33.

  Next, an example of a process until the thin display panel 10 is disassembled by the thin display panel disassembling apparatus 30 will be described. When the thin display panel 10 is inserted into the insertion unit 31, the thin display panel 10 is transported by the transport device 33 to a heating position (that is, a position adjacent to the induction heating unit 34 where induction heating is possible). When the induction heating unit 34 is provided below the heating position (that is, the induction heating unit 34 is provided between the rollers 33a), the thin display panel 10 has the conductive plate 15 positioned below. (That is, the direction in which the conductive plate 15 and the belt 33b are in contact). On the contrary, when the induction heating unit 34 is provided above the heating position (that is, the induction heating unit 34 is provided above the roller 33a), the thin display panel 10 is provided with the conductive plate 15. Is positioned above (that is, the direction in which the conductive plate 15 and the carrying belt 33b do not contact). Therefore, the induction heating unit 34 is arranged from the other side surface side to the side surface bonded to the back glass plate 12 through the adhesive layer 14 of the conductive plate 15 of the thin display panel 10 positioned at the heating position by the transport device 33. An induction heating action is imparted to the conductive plate 15 (ie, without passing through the glass plate portion 13).

  When the thin display panel 10 is transported to the heating position, the transport by the transport device 31 is temporarily stopped, and the induction heating unit 34 changes the magnetic field in the thickness direction of the thin display panel 10 according to the power supplied from the power supply unit 35. As a result, the conductive plate 15 is inductively heated. After a predetermined time has elapsed or the conductive plate 15 has reached a predetermined temperature, induction heating is stopped. The description of the predetermined time and the predetermined temperature is omitted because it is the same as that of the first embodiment. Thereafter, the thin display panel 10 is transported to the discharge unit 32 by the transport device 31.

  When the thin display panel 10 reaches the discharge unit 32, the conveyance is once again stopped. The discharge device 36 provided above the discharge unit 32 descends and is attracted to the glass plate unit 13 of the thin display panel 10. In the thin display panel 10, since the adhesive force of the adhesive layer 14 is reduced by induction heating, the glass plate portion 13 and the conductive plate 15 are peeled off as the discharge device 36 is raised. The glass plate unit 13 is collected by a collecting unit (not shown) of the glass plate unit 13 through a path above the heating position by the discharge device 36.

  After disassembling the thin display panel 10, the conductive plate 15 remaining on the transport device 36 passes through a path below the heating position by the transport device 36, and collects the conductive plate 15 provided below the transport device 36 ( (Not shown). Depending on the orientation of the inserted thin display panel 10, the glass plate portion 13 is recovered downward and the conductive plate 15 is recovered upward.

  In addition, the disassembling process of the thin display panel 10 can be optimized by adjusting the transport speed of the thin display panel 10 by making the transport continuous or intermittent in the heating position and the discharge unit 32.

  As described above, in this embodiment, the disassembly process of the thin display panel can be efficiently performed by providing the discharge section and the transport section in the first embodiment.

FIG. 3 is a front view illustrating an apparatus for disassembling a thin display panel according to an embodiment of the present invention. It is a perspective view which shows the structure and arrangement | positioning of the induction heating part by the Example of this invention. FIG. 6 is a front view illustrating an apparatus for disassembling a thin display panel according to another embodiment of the present invention. FIG. 6 is a side view showing an apparatus for disassembling a thin display panel according to another embodiment of the present invention.

Explanation of symbols

DESCRIPTION OF SYMBOLS 10 Thin display panel 13 Glass plate part 14 Adhesive layer 15 Conductive plate 20 Thin display panel disassembly apparatus 21 Support base 22 Induction heating part 23 Power supply part 24 Control apparatus 32 Discharge part 33 Conveyance apparatus 36 Discharge apparatus

Claims (10)

A method of disassembling a thin display panel comprising a glass plate and a conductive plate bonded to the glass plate via an adhesive layer,
A positioning step for positioning the thin display panel at a heating position;
A heating step for inductively heating the conductive plate by generating a magnetic field change in the thickness direction of the thin display panel according to the supplied power;
Including
In the heating step, an induction heating action is applied from the side of the conductive plate without using the glass plate, and the thin display panel is disassembled.   2. The thin display panel disassembling method according to claim 1, further comprising a discharging step of discharging at least one of the glass plate and the conductive plate after the heating step.   2. The method of disassembling a thin display panel according to claim 1, further comprising a discharging step of discharging the glass plate or the conductive plate through a path above or below the heating position in the discharging step.   The at least one of the heating step or the discharging step includes a moving step of moving one of the thin display panel, the glass plate, or the conductive plate along a conveyance path including the heating position. 3. A method for disassembling a thin display panel according to 2.   A disassembling method in which heating is performed without fixing and gripping the edge of the thin display panel during heating. An apparatus for disassembling a thin display panel comprising a glass plate and a conductive plate adhered to the glass plate via an adhesive layer,
A positioning part for positioning the thin display panel at a heating position;
An induction heating unit that generates a magnetic field change in the thickness direction of the thin display panel in accordance with the supplied power to generate an induction heating action;
A power supply unit for supplying power to the induction heating unit,
The apparatus for disassembling a thin display panel, wherein the induction heating unit imparts an induction heating action to the conductive plate from a side of the conductive plate that is not bonded to the glass plate.   7. The apparatus for disassembling a thin display panel according to claim 6, wherein the induction heating unit is disposed above or below the heating position.   7. The apparatus for disassembling a thin display panel according to claim 6, further comprising a discharge portion for discharging at least one of the glass plate and the conductive plate from the heating position.   9. The apparatus for disassembling a thin display panel according to claim 8, wherein the discharge section discharges the glass plate or the conductive plate through a path above or below the heating position.   9. The apparatus for disassembling a thin display panel according to claim 8, wherein the discharge unit includes a transport unit that transports the thin display panel, the glass plate, or the conductive plate through a transport path including the heating position.

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